WO2020215973A1 - Ensemble de puces et terminal mobile - Google Patents

Ensemble de puces et terminal mobile Download PDF

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Publication number
WO2020215973A1
WO2020215973A1 PCT/CN2020/081309 CN2020081309W WO2020215973A1 WO 2020215973 A1 WO2020215973 A1 WO 2020215973A1 CN 2020081309 W CN2020081309 W CN 2020081309W WO 2020215973 A1 WO2020215973 A1 WO 2020215973A1
Authority
WO
WIPO (PCT)
Prior art keywords
plate
main board
chip
chip assembly
board
Prior art date
Application number
PCT/CN2020/081309
Other languages
English (en)
Chinese (zh)
Inventor
杨子东
Original Assignee
维沃移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Publication of WO2020215973A1 publication Critical patent/WO2020215973A1/fr

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/1365—Matching; Classification
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]

Definitions

  • the present disclosure relates to the field of communication technology, and in particular to a chip assembly and a mobile terminal.
  • the fingerprint module mainly includes a fingerprint chip, a fingerprint circuit board, and a reinforcement board.
  • the fingerprint circuit board is arranged between the fingerprint chip and the reinforcement board.
  • the reinforcement board is conductive to the main board shielding cover through conductive foam.
  • the main board shielding cover is arranged on the main board of the mobile terminal to realize the shielding function.
  • the space occupied by the reinforcement plate, the conductive foam and the main board shielding cover is relatively large, which makes the structural design of the mobile terminal difficult.
  • the reinforcing plate is electrically connected to the main board shielding cover through the conductive foam and is grounded, the conductive foam may have a certain blocking effect, resulting in poor grounding of the fingerprint chip.
  • the present disclosure provides a chip assembly and a mobile terminal to solve the problems of difficulty in structural design of the mobile terminal and poor grounding effect of the chip.
  • a chip assembly including:
  • a chip module includes a chip, a circuit board, and a reinforcing shielding board, the chip is arranged on the circuit board, the circuit board is arranged on the reinforcing shielding board, and the reinforcing shield The board is grounded to the main board, and a device installation space is formed between the reinforced shielding board and the main board;
  • a motherboard device the motherboard device is installed in the device installation space.
  • a mobile terminal includes the above chip assembly.
  • the chip module includes a chip, a circuit board, and a reinforced shielding plate.
  • the reinforced shielding plate can realize the reinforcement of the chip and the circuit board on the one hand, and can be grounded with the main board on the other hand, so as
  • the motherboard components installed on the motherboard play a shielding role, so there is no need to additionally provide a shielding cover on the motherboard, and the conductive foam between the reinforcing shielding plate and the shielding cover can also be omitted. It can be seen that the space occupied by the chip module and the motherboard after stacking is small, which makes it easier to arrange other devices in the mobile terminal, thereby reducing the difficulty of structural design of the mobile terminal.
  • the chip is directly grounded through the reinforced shield plate, which has a better grounding effect.
  • FIG. 1 is a cross-sectional view of a chip assembly disclosed in an embodiment of the disclosure
  • FIG. 2 is a cross-sectional view of the chip module in the chip assembly disclosed in the embodiment of the disclosure
  • FIG. 3 is a top view of the chip module in the chip assembly disclosed in the embodiment of the disclosure.
  • FIG. 4 is a cross-sectional view of a chip assembly disclosed in another embodiment of the disclosure.
  • the embodiments of the present disclosure disclose a mobile terminal, which includes a housing (not shown in the figure) and a chip assembly.
  • the chip assembly can be installed in the housing as a whole or partly in the housing. in vivo.
  • the chip assembly may specifically include a motherboard 100, a chip module 200, and a motherboard device 300.
  • the main board 100 and the main board device 300 are both installed in the casing, and the main board device 300 is installed on the main board 100.
  • the main board device 300 can be electrically connected to the main board 100, so that the main board 100 can supply power to the main board device 300 and can also control the working state of the main board device 300.
  • the motherboard device 300 may be a processor, a controller, a sensor, and so on.
  • the chip module 200 may be entirely located in the housing, or part of it may be located in the housing.
  • the chip module 200 may include a chip 210, a circuit board 220, and a reinforcing shield plate 230.
  • the chip 210 is the core device of the entire chip module 200, which is used to perform corresponding functions;
  • the circuit board 220 is used to supply power to the chip 210 and control the working state of the chip 210; the reinforcing shielding board 230 can realize the chip 210
  • the entire chip module 200 has sufficient rigidity to facilitate the installation of the chip module 200. Therefore, the chip 210 is disposed on the circuit board 220, and the circuit board 220 is disposed on the reinforced shielding plate 230.
  • the reinforced shield plate 230 is grounded to the main board 100, that is, the reinforced shield plate 230 is connected to the main board 100, so that the reinforced shield plate 230 is grounded through the main board 100.
  • a device installation space 201 is formed between the reinforcing shield plate 230 and the main board 100, and the main board device 300 is installed in the device installation space 201. That is, the reinforced shielding plate 230 covers the main board device 300, and then plays a role of signal shielding.
  • the reinforced shielding plate 230 may be configured as a steel sheet.
  • the motherboard device 300 located in the device installation space 201 described above may be one or more than one, and is protected by the reinforced shielding plate 230.
  • the specific type and quantity of the main board device 300 to be covered can be flexibly selected according to actual needs.
  • the chip module 200 in the embodiment of the present disclosure may be any kind of functional module including the above-mentioned chip 210, the circuit board 220, and the reinforcing shield plate 230.
  • the chip module 200 may be a fingerprint module, and in the fingerprint module, the circuit board 220 may be a flexible printed circuit (FPC).
  • the reinforced shielding plate 230 can realize the reinforcement of the chip 210 and the circuit board 220 on the one hand, and can be grounded to the main board 100 on the other hand, thereby shielding the main board device 300 installed on the main board 100. Therefore, there is no need to additionally provide a shielding cover on the main board 100, and at the same time, the conductive foam between the reinforcing shielding plate 230 and the shielding cover can be omitted. It can be seen that the space occupied by the chip module 200 and the motherboard 100 after stacking is small, making it easier to arrange other devices in the mobile terminal, thereby reducing the difficulty of structural design of the mobile terminal, and reducing the cost of the mobile terminal. At the same time, the chip 210 is directly grounded through the reinforced shielding plate 230, which has a better grounding effect, thereby improving the Electro-Static Discharge (ESD) performance of the mobile terminal.
  • ESD Electro-Static Discharge
  • the reinforced shielding plate 230 may include a top plate 231 and an annular side plate 232, the annular side plate 232 is connected to the edge of the top plate 231, and the annular side plate 232 surrounds the top plate 231, and the top plate 231 is connected to the The main board 100 is connected.
  • the top plate 231 may be configured as a flat plate to better support the chip 210 and the circuit board 220.
  • an almost enclosed device installation space 201 can be formed, so that the shielding effect can be better played.
  • such a reinforced shielding plate 230 can prevent impurities such as liquid and dust in the external environment from entering the device installation space 201, thereby better protecting the motherboard 100 and the motherboard device 300.
  • the reinforced shield plate 230 may be welded to the main board 100.
  • the main board 100 is provided with a plurality of grounding pins, and there is a certain interval between the plurality of grounding pins;
  • the reinforced shielding plate 230 is provided with a plurality of welding parts, and there is a certain interval between the plurality of welding parts. interval.
  • the welding portion here may protrude relative to other parts of the reinforced shield plate 230, or may be flush with other parts of the reinforced shield plate 230, that is, the reinforced shield plate 230 faces the main board 100.
  • One side can be flat or curved.
  • the multiple welding parts are welded to the multiple grounding pins in one-to-one correspondence, and then multiple solder joints are formed between the reinforced shielding plate 230 and the main board 100.
  • the connection strength between the two can be ensured, and on the other hand, The welding area between the two is controlled to prevent the main board 100 and the main board device 300 from being damaged due to high temperature welding.
  • the ring-shaped side plate 232 may be arranged in a columnar structure, and the ring-shaped side plate 232 is vertically connected to the edge of the top plate 231 and surrounds the top plate 231.
  • the side of the board 232 facing the main board 100 is provided with the aforementioned soldering portion.
  • the cross-sectional shape of the annular side plate 232 (that is, the cross-section parallel to the main board 100) can be square, circular, elliptical, triangular, etc. The specific shape can be selected according to requirements, which is not limited herein.
  • Such a ring-shaped side plate 232 occupies a relatively small space on the main board 100, which is more convenient for the arrangement of components on the main board 100.
  • the chip module 200 further includes a fastener (not shown in the figure), the reinforcing shield plate 230 has a fastening hole 233, and the fastener is connected to the fastening hole 233.
  • the fixing hole 233 is matched, and the reinforcing shield plate 230 is detachably connected to the main board 100 through the fastener.
  • the fastener here may be a threaded fastener, and specifically may be a structure such as a screw, a stud, or a screw assembly.
  • the reinforcing shield plate 230 and the main board 100 When the reinforcing shield plate 230 and the main board 100 are detachably connected, the reinforcing shield plate 230 and the main board 100 can be disassembled and assembled multiple times, so this structure facilitates the maintenance of the chip module 200, the main board 100 and the main board device 300.
  • the fastening hole 233 can be opened on the side of the annular side plate 232 facing the main board 100, and one end of the fastener It can pass through the main board 100 and be screwed with the fastening hole 233 to realize the connection between the main board 100 and the reinforced shield plate 230. If this structure is adopted, the fasteners need to penetrate the main board 100, which threatens the structural strength of the main board 100.
  • an extension plate 234 may be provided at the edge of the reinforced shielding plate 230, the extension plate 234 extends in a direction parallel to the main board 100, and the extension plate 234 defines the above-mentioned fastening hole 233.
  • the reinforced shielding plate 230 includes the annular side plate 232 described above, the extension plate 234 here may be formed to extend from the annular side plate 232 toward the main board 100.
  • one end of the fastener passes through the fastening hole 233 and is connected to the main board 100. The fastener does not need to penetrate the main board 100, so the structural strength of the main board 100 can be guaranteed.
  • extension plate 234 may be an annular plate, and the annular plate surrounds the annular side plate 232 at this time; the extension plate 234 may also be a structure extending from a part of the annular side plate 232.
  • the ground connection between the reinforced shield plate 230 and the main board 100 can be realized by an additional structure, for example, can be realized by inserting pins.
  • this solution separates the detachable connection and ground connection of the reinforced shielding plate 230 and the main board 100, resulting in an overly complicated structure of the mobile terminal.
  • the fasteners can be arranged as conductive parts, and the reinforced shield plate 230 is grounded to the main board 100 through the fasteners. That is, the fastener can not only realize the detachable connection between the reinforced shield plate 230 and the main board 100, but also can realize the ground connection between the reinforced shield plate 230 and the main board 100, making the structure of the mobile terminal simpler and more compact.
  • the mobile terminal disclosed in the embodiments of the present disclosure may be a smart phone, a tablet computer, an e-book reader or a wearable device.
  • the mobile terminal may also be other devices, which is not limited in the embodiments of the present disclosure.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Refuge Islands, Traffic Blockers, Or Guard Fence (AREA)

Abstract

Des modes de réalisation de la présente invention concernent un ensemble de puces et un terminal mobile, l'ensemble de puces comprenant : une carte mère; un module de puce, qui comprend une puce, une carte de circuit imprimé et une plaque de blindage de renforcement, la puce étant disposée sur la carte de circuit imprimé, la carte de circuit imprimé est disposée sur la plaque de blindage de renforcement, la plaque de blindage de renforcement est fixée sur la carte mère, et un espace d'installation de dispositif est formé entre la plaque de blindage de renforcement et la carte mère ; et un dispositif de carte mère, qui est installé dans l'espace d'installation de dispositif.
PCT/CN2020/081309 2019-04-24 2020-03-26 Ensemble de puces et terminal mobile WO2020215973A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910335070.5A CN110087445A (zh) 2019-04-24 2019-04-24 芯片组件及移动终端
CN201910335070.5 2019-04-24

Publications (1)

Publication Number Publication Date
WO2020215973A1 true WO2020215973A1 (fr) 2020-10-29

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PCT/CN2020/081309 WO2020215973A1 (fr) 2019-04-24 2020-03-26 Ensemble de puces et terminal mobile

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CN (1) CN110087445A (fr)
WO (1) WO2020215973A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110087445A (zh) * 2019-04-24 2019-08-02 维沃移动通信有限公司 芯片组件及移动终端
CN110636701B (zh) * 2019-10-29 2021-01-08 维沃移动通信有限公司 电路板装置及电子设备
CN111010853B (zh) * 2019-12-26 2021-11-16 惠州Tcl移动通信有限公司 防干扰散热结构及移动终端
CN112153845B (zh) * 2020-10-26 2022-04-29 维沃移动通信有限公司 电子设备及其电路模组

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130016484A1 (en) * 2011-07-13 2013-01-17 Yoo Mansung Mobile terminal
CN107360710A (zh) * 2017-08-23 2017-11-17 华勤通讯技术有限公司 一种屏蔽结构及终端
CN107948348A (zh) * 2017-10-25 2018-04-20 广东欧珀移动通信有限公司 移动终端及其电路板组件、屏蔽罩
CN108417540A (zh) * 2018-03-26 2018-08-17 李春林 一种指纹识别芯片装置
CN109862739A (zh) * 2019-03-27 2019-06-07 维沃移动通信有限公司 一种终端
CN110087445A (zh) * 2019-04-24 2019-08-02 维沃移动通信有限公司 芯片组件及移动终端

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980032665U (ko) * 1996-12-04 1998-09-05 김영환 접지 장치
KR20090023870A (ko) * 2007-09-03 2009-03-06 엘지이노텍 주식회사 튜너의 쉴드 플레이트
CN204291167U (zh) * 2014-11-26 2015-04-22 乐视致新电子科技（天津）有限公司 一种终端
CN205812640U (zh) * 2016-05-26 2016-12-14 上海与德通讯技术有限公司 移动终端主板结构

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130016484A1 (en) * 2011-07-13 2013-01-17 Yoo Mansung Mobile terminal
CN107360710A (zh) * 2017-08-23 2017-11-17 华勤通讯技术有限公司 一种屏蔽结构及终端
CN107948348A (zh) * 2017-10-25 2018-04-20 广东欧珀移动通信有限公司 移动终端及其电路板组件、屏蔽罩
CN108417540A (zh) * 2018-03-26 2018-08-17 李春林 一种指纹识别芯片装置
CN109862739A (zh) * 2019-03-27 2019-06-07 维沃移动通信有限公司 一种终端
CN110087445A (zh) * 2019-04-24 2019-08-02 维沃移动通信有限公司 芯片组件及移动终端

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