CN108417540A - A kind of fingerprint recognition chip apparatus - Google Patents
A kind of fingerprint recognition chip apparatus Download PDFInfo
- Publication number
- CN108417540A CN108417540A CN201810252872.5A CN201810252872A CN108417540A CN 108417540 A CN108417540 A CN 108417540A CN 201810252872 A CN201810252872 A CN 201810252872A CN 108417540 A CN108417540 A CN 108417540A
- Authority
- CN
- China
- Prior art keywords
- pad
- chip
- fingerprint recognition
- recognition chip
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The present invention provides a kind of fingerprint recognition chip apparatus, the present invention realizes the electrical shielding of closed first chip (sensitive chip) using support cover, and can prevent the load of pair the first chip when pressing the fingerprint recognition chip；The setting of elastomeric layer and rigid material layer further reduces the load of pair the first chip when pressing the fingerprint recognition chip；Support the setting of the annular channel and via of the welding portion of cover that can be substantially prevented from the lateral flow of excess solder or binding resin on substrate；Using supporting role of the protruding portion in groove, when preventing pressing, the disconnection of cover welding portion is supported.
Description
Technical field
The present invention relates to intelligent chip encapsulation fields, and in particular to a kind of fingerprint recognition chip apparatus.
Background technology
Existing fingerprint recognition chip package mostly uses the packaging technology planarized on substrate, with other sensitive cores
In the presence of piece, it is detrimental to the protection to sensitive chip；Even the stacked package that some techniques use utilizes supporter
Fingerprint recognition chip carrying is carried out, but since fingerprint recognition chip needs to be adhered to by binding resin, extra resin
It can trickle to the substrate, to cover the pad on substrate, lead to the undesirable electrical connection of follow-up bonding wire；And it is extra
The solder of supporter welding can also trickle the drawbacks of leading to same bad electrical connection to the substrate.
Invention content
Based on solving the above problems, the present invention provides a kind of fingerprint recognition chip apparatus comprising：
Redistribution substrate is provided with the first pad on the upper surface with opposite upper and lower surface,
The lower surface have the second pad, first pad and the second pad by it is described redistribute substrate in wiring layer and/
Or first through hole electrical connection；
First chip is welded on by the first solder-ball flip on the redistribution substrate, and with the one of first pad
Part is electrically connected；
Support cover, by solder be welded in it is described redistribution substrate the upper surface on, and with the redistribution substrate
Confined space is surrounded, first chip is located in the confined space；
Second chip is fingerprint recognition chip, is fixed on by binding resin on the top surface of the support cover, and pass through weldering
Line is electrically connected with another part of first pad, and another part of first pad is located on the outside of the confined space；
The upper surface and the second chip, support cover and bonding wire in the upper surface is completely covered in sealing resin；
Wherein, the support cover includes integrally formed support plate, supporting walls and welded plate, and the welded plate is in welding surface
It is provided with the groove around the supporting walls on opposite face, and is provided in the groove and multiple to run through the welded plate
Via, the via and the groove are for accommodating the extra solder and/or the binding resin.
According to an embodiment of the invention, cured heat-conducting resin layer and elastic material are filled in the confined space
Layer, the heat-conducting resin layer covered the top surface of first chip, and the elastomeric layer is between the heat-conducting resin layer and institute
It states between support plate.
According to an embodiment of the invention, further include the second soldered ball in the lower surface, second soldered ball is electrically connected institute
State the second pad.
According to an embodiment of the invention, first chip is sensitive chip；
The present invention also provides another fingerprint recognition chip apparatus comprising：
Intermediary substrate is provided with third weldering on the first surface with opposite first surface and second surface
Disk has third soldered ball and an annular channel in the second surface, and the third pad and third solder ball pads are by described
The second through-hole electrical connection in Jie's substrate；
First chip is welded on by the first solder-ball flip on the intermediary substrate, and with one of the third pad
Divide electrical connection；
Support cover, the annular channel of the intermediary substrate is welded in by solder, and surround with the intermediary substrate
Confined space, first chip are located in the confined space；
Second chip is fingerprint recognition chip, is fixed on by binding resin on the top surface of the support cover, and pass through weldering
Line is electrically connected with another part of the third pad, and another part of the third pad is located on the outside of the confined space；
The first surface and the second chip, support cover and weldering in the first surface is completely covered in sealing resin
Line；
Wherein, the support cover includes integrally formed support plate, supporting walls and welded plate, and the welded plate has downward
Protruding portion outstanding, the protruding portion is provided with the groove around the supporting walls on the face opposite with welding surface, described
Multiple vias through the welded plate, the via and the groove are provided in groove for accommodating the extra solder
And/or the binding resin；It is resisted against on the outside of the protruding portion on the side wall of the annular channel, and the protruding portion is extremely
Small part is inserted into the annular channel, and carries out solder joints by the solder in the annular channel.
According to an embodiment of the invention, further include redistribution substrate, with opposite upper and lower surface, described
It is provided with the first pad on upper surface, there is the second pad in the lower surface, first pad and the second pad pass through institute
The wiring layer and/or first through hole electrical connection, the third soldered ball stated in redistribution substrate are corresponded with first pad
It is electrically connected.
According to an embodiment of the invention, further include the second soldered ball in the lower surface, second soldered ball is electrically connected institute
State the second pad.
According to an embodiment of the invention, cured heat-conducting resin layer and rigid material are filled in the confined space
Layer, the heat-conducting resin layer covered the top surface of first chip, and the rigid material layer is between the heat-conducting resin layer and institute
State between support plate and be surrounded on the region of first chip top surface face.
According to an embodiment of the invention, include by support plate, heat dissipation resin layer and rigid material layer in the confined space
The pressing chamber surrounded.
According to an embodiment of the invention, the protruding portion is continuous, around the annular prominent of the supporting walls.
According to an embodiment of the invention, the protruding portion is multiple pillars of dispersion.
Advantages of the present invention is as follows：
(1) it realizes the electrical shielding of closed first chip (sensitive chip) using support cover, and can prevent described in pressing
The load of pair the first chip when fingerprint recognition chip；
(2) setting of elastomeric layer and rigid material layer is further reduced when pressing the fingerprint recognition chip pair
The load of first chip；
(3) setting of the annular channel and via of the welding portion of support cover can be substantially prevented from excess solder or bonding
Lateral flow of the resin on substrate；
(4) supporting role of the protruding portion in groove is utilized, when preventing pressing, supports the disconnection of cover welding portion.
Description of the drawings
Fig. 1 is the sectional view of the fingerprint recognition chip apparatus of first embodiment；
Fig. 2 is the sectional view of the support cover of first embodiment；
Fig. 3 is the sectional view of the preferred fingerprint recognition chip apparatus of first embodiment；
Fig. 4 is the sectional view of the fingerprint recognition chip apparatus of second embodiment；
Fig. 5 is the sectional view of the support cover of second embodiment；
Fig. 6 is the sectional view of the preferred fingerprint recognition chip apparatus of second embodiment.
Specific implementation mode
First embodiment
Referring to Fig. 1-2, fingerprint recognition chip apparatus of the invention comprising：
Redistribution substrate 1 is provided with the first pad on the upper surface with opposite upper and lower surface
11, in the lower surface there is the second pad 12, first pad, 11 and second pad 12 to pass through in the redistribution substrate 1
Wiring layer 13 and/or first through hole 14 be electrically connected；
First chip 2, by 21 face-down bonding of the first soldered ball on the redistribution substrate 1, and with first pad
11 part electrical connection；
Support cover 3, by solder 31 be welded in it is described redistribution substrate 1 the upper surface on, and with the redistribution
Substrate 1 surrounds confined space 6, and first chip 2 is located in the confined space 6；
Second chip 4 is fingerprint recognition chip, is fixed on by binding resin 5 on the top surface of the support cover 3, and logical
It crosses bonding wire 41 to be electrically connected with another part of first pad 11, another part of first pad 11 is positioned at described closed
6 outside of space；
The upper surface and the second chip 4, support cover 3 and bonding wire in the upper surface is completely covered in sealing resin 7
41；
Wherein, the support cover 3 includes integrally formed support plate 32, supporting walls 33 and welded plate 34, the welded plate
34 are provided with the groove 36 around supporting walls 33 on the opposite face of welding surface, and are provided in the groove 36 more
A via 35 through the welded plate 34, the via 35 and the groove 36 for accommodate the extra solder 31 and/
Or the binding resin 51.
Referring to Fig. 3, as a preferred mode, cured heat-conducting resin layer 61 is filled in the confined space 6
And elastomeric layer 62, the heat-conducting resin layer 61 covered the top surface of first chip 2, the elastomeric layer 62 between
Between the heat-conducting resin layer 61 and the support plate 32.
Wherein, further include the second soldered ball 15 in the lower surface, second soldered ball 15 is electrically connected second pad
12.First chip 2 is sensitive chip.The support cover 3 is metal cover body
Second embodiment
First embodiment can lead to pressure of the support cover to both sides when giving second chip upper surface with pressure,
It is unfavorable for the fixation of welding ends, and it is generally more soft to redistribute substrate.
Referring to Fig. 4-5, the present invention also provides another fingerprint recognition chip apparatus comprising：
Intermediary substrate 8 for rigid ceramics, glass or SiC substrate and has opposite first surface and the second table
Face is provided with third pad 81 on the first surface, has third soldered ball 82 and annular channel 84 in the second surface,
The third pad 81 is electrically connected with 82 pad of third soldered ball by the second through-hole 83 in the intermediary substrate 8；
First chip is welded on by the first solder-ball flip on the intermediary substrate, and with one of the third pad
Divide electrical connection；
Support cover 3a, is welded in the annular channel 84 of the intermediary substrate by solder, and with the intermediary substrate
Confined space is surrounded, first chip is located in the confined space；
Second chip is fingerprint recognition chip, is fixed on by binding resin on the top surface of the support cover, and pass through weldering
Line is electrically connected with another part of the third pad, and another part of the third pad is located on the outside of the confined space；
The first surface and the second chip, support cover and weldering in the first surface is completely covered in sealing resin
Line；
Wherein, the support cover includes integrally formed support plate, supporting walls and welded plate, and the welded plate has downward
Protruding portion 37 outstanding, the protruding portion 37 are provided with the groove around the supporting walls on the face opposite with welding surface,
It is provided with multiple vias through the welded plate in the groove, the via and the groove are used to accommodate extra described
Solder and/or the binding resin；The outside of the protruding portion 37 is resisted against on the side wall of the annular channel 84, and described prominent
Go out being at least partially inserted into the annular channel 84 of portion 37, and by the solder in the annular channel 84 connect
It closes.
Further include that redistribution substrate is provided with first on the upper surface with opposite upper and lower surface
Pad in the lower surface there is the second pad, first pad and the second pad to pass through the cloth in the redistribution substrate
Line layer and/or first through hole electrical connection, the third soldered ball are electrically connected with first pad one-to-one correspondence.
Further include the second soldered ball in the lower surface, second soldered ball is electrically connected second pad.
At this point, when applying downward pressure 9 to fingerprint recognition chip, support cover can be by ring-shaped groove to the tension 10 of both sides
It is supported, it is therefore prevented that support cover disconnects.
Referring to Fig. 6, as preferred mode, filled with cured heat-conducting resin layer 61 and just in the confined space
Property material layer 63, the heat-conducting resin layer 61 covered the top surface of first chip, and the rigid material layer 63 is led between described
Between hot resin layer 61 and the support plate and it is surrounded on the region of first chip top surface face.Packet in the confined space
Include the pressing chamber 64 surrounded by support plate, heat dissipation resin layer 61 and rigid material layer 63.
According to an embodiment of the invention, the protruding portion 37 can be continuous, be protruded around the annular of the supporting walls,
Or multiple pillars of dispersion.
Finally it should be noted that：Obviously, the above embodiment is merely an example for clearly illustrating the present invention, and simultaneously
The non-restriction to embodiment.For those of ordinary skill in the art, it can also do on the basis of the above description
Go out other various forms of variations or variation.There is no necessity and possibility to exhaust all the enbodiments.And thus drawn
The obvious changes or variations that Shen goes out are still in the protection scope of this invention.
Claims (10)
1. a kind of fingerprint recognition chip apparatus comprising：
Redistribution substrate is provided with the first pad, described on the upper surface with opposite upper and lower surface
There is the second pad, first pad and the second pad to pass through the wiring layer redistributed in substrate and/or for lower surface
One through-hole is electrically connected；
First chip is welded on by the first solder-ball flip on the redistribution substrate, and with a part for first pad
Electrical connection；
Support cover is welded on the upper surface of the redistribution substrate by solder, and is surrounded with the redistribution substrate
Confined space, first chip are located in the confined space；
Second chip, be fingerprint recognition chip, by binding resin be fixed on it is described support cover top surface on, and by bonding wire with
Another part of first pad is electrically connected, and another part of first pad is located on the outside of the confined space；
The upper surface and the second chip, support cover and bonding wire in the upper surface is completely covered in sealing resin；
It is characterized in that：The support cover includes integrally formed support plate, supporting walls and welded plate, and the welded plate is welding
It is provided with the groove around the supporting walls on the opposite face in face, and is provided in the groove and multiple to run through the welding
The via of plate, the via and the groove are for accommodating the extra solder and/or the binding resin.
2. fingerprint recognition chip apparatus according to claim 1, it is characterised in that：Filled with solid in the confined space
The heat-conducting resin layer and elastomeric layer of change, the heat-conducting resin layer covered the top surface of first chip, the elasticity material
The bed of material is between the heat-conducting resin layer and the support plate.
3. fingerprint recognition chip apparatus according to claim 2, it is characterised in that：Further include the second of the lower surface
Soldered ball, second soldered ball are electrically connected second pad.
4. a kind of fingerprint recognition chip apparatus comprising：
Intermediary substrate is provided with third pad on the first surface with opposite first surface and second surface,
There is the second surface third soldered ball and annular channel, the third pad to pass through the intermediary substrate with third solder ball pads
Interior the second through-hole electrical connection；
First chip is welded on by the first solder-ball flip on the intermediary substrate, and with a part of electricity of the third pad
Connection；
Support cover, the annular channel of the intermediary substrate is welded in by solder, and is surrounded with the intermediary substrate closed
Space, first chip are located in the confined space；
Second chip, be fingerprint recognition chip, by binding resin be fixed on it is described support cover top surface on, and by bonding wire with
Another part of the third pad is electrically connected, and another part of the third pad is located on the outside of the confined space；
The first surface and the second chip, support cover and bonding wire in the first surface is completely covered in sealing resin；
It is characterized in that：Support cover includes integrally formed support plate, supporting walls and welded plate, the welded plate with to
Under protruding portion outstanding, the protruding portion is provided with the groove around the supporting walls on the face opposite with welding surface, in institute
It states and is provided with multiple vias through the welded plate in groove, the via and the groove are for accommodating the extra weldering
Material and/or the binding resin；It is resisted against on the outside of the protruding portion on the side wall of the annular channel, and the protruding portion
It is at least partially inserted into the annular channel, and solder joints is carried out by the solder in the annular channel.
5. fingerprint recognition chip apparatus according to claim 4, it is characterised in that：Further include redistribution substrate, has
Opposite upper and lower surface is provided with the first pad on the upper surface, has the second pad, institute in the lower surface
It states the first pad to be electrically connected by the wiring layer redistributed in substrate and/or first through hole with the second pad, the third
Soldered ball is electrically connected with first pad one-to-one correspondence.
6. fingerprint recognition chip apparatus according to claim 5, it is characterised in that：Further include the second of the lower surface
Soldered ball, second soldered ball are electrically connected second pad.
7. fingerprint recognition chip apparatus according to claim 4, it is characterised in that：Filled with solid in the confined space
The heat-conducting resin layer and rigid material layer of change, the heat-conducting resin layer covered the top surface of first chip, the rigidity material
The bed of material is between the heat-conducting resin layer and the support plate and is surrounded on the region of first chip top surface face.
8. fingerprint recognition chip apparatus according to claim 4, it is characterised in that：Include by supporting in the confined space
The pressing chamber that plate, heat dissipation resin layer and rigid material layer surround.
9. fingerprint recognition chip apparatus according to claim 4, it is characterised in that：The protruding portion is continuous, circular
The annular of the supporting walls is prominent.
10. fingerprint recognition chip apparatus according to claim 4, it is characterised in that：The protruding portion is the multiple of dispersion
Pillar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810252872.5A CN108417540B (en) | 2018-03-26 | 2018-03-26 | Fingerprint identification chip device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810252872.5A CN108417540B (en) | 2018-03-26 | 2018-03-26 | Fingerprint identification chip device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108417540A true CN108417540A (en) | 2018-08-17 |
| CN108417540B CN108417540B (en) | 2020-10-16 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810252872.5A Active CN108417540B (en) | 2018-03-26 | 2018-03-26 | Fingerprint identification chip device |
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| Country | Link |
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| CN (1) | CN108417540B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110087445A (en) * | 2019-04-24 | 2019-08-02 | 维沃移动通信有限公司 | Chip assembly and mobile terminal |
| CN111050534A (en) * | 2019-12-19 | 2020-04-21 | Oppo广东移动通信有限公司 | Substrate assembly and network device |
| CN111354685A (en) * | 2020-03-17 | 2020-06-30 | 山东傲晟智能科技有限公司 | Fingerprint identification device and manufacturing method thereof |
| CN111477611A (en) * | 2020-06-28 | 2020-07-31 | 甬矽电子(宁波)股份有限公司 | Electromagnetic shielding structure and manufacturing method thereof |
| WO2021114289A1 (en) * | 2019-12-13 | 2021-06-17 | 南昌欧菲生物识别技术有限公司 | Fingerprint module and electronic device |
| CN117500155A (en) * | 2023-12-26 | 2024-02-02 | 荣耀终端有限公司 | Frame plate, circuit board assembly, terminal device and manufacturing method of frame plate |
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| Publication number | Publication date |
|---|---|
| CN108417540B (en) | 2020-10-16 |
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