CN219696442U - High-density thin small-sized packaging structure of chip - Google Patents
High-density thin small-sized packaging structure of chip Download PDFInfo
- Publication number
- CN219696442U CN219696442U CN202320988466.1U CN202320988466U CN219696442U CN 219696442 U CN219696442 U CN 219696442U CN 202320988466 U CN202320988466 U CN 202320988466U CN 219696442 U CN219696442 U CN 219696442U
- Authority
- CN
- China
- Prior art keywords
- chip
- shell
- clamping
- pressing plate
- density thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 16
- 239000000853 adhesive Substances 0.000 abstract description 19
- 230000001070 adhesive effect Effects 0.000 abstract description 19
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
Abstract
The utility model provides a high-density thin small-sized packaging structure of a chip, which comprises: a lower housing and an upper housing; the placing groove is formed in the top of the lower shell; the clamping groove is formed in the top of the lower shell; the clamping plate is fixedly arranged at the bottom of the upper shell; and the pressing plate is fixedly arranged at the bottom of the upper shell. Preferably, the clamping plate is arranged on the inner side surface of the clamping groove, and the pressing plate is arranged on the inner side surface of the placing groove. The placing grooves are formed in a plurality of mode. According to the high-density thin small packaging structure of the chip, the structures such as the lower shell, the clamping groove, the placing groove, the upper shell, the clamping plate and the pressing plate are matched with each other, so that the connection strength can be increased when the chip is used, and the situation that an adhesive is extruded when the chip is connected to flow into the inner side surfaces of the upper shell and the lower shell can be avoided, so that the normal use of the chip is affected.
Description
Technical Field
The utility model relates to the technical field of chip packaging, in particular to a high-density thin small packaging structure of a chip.
Background
IC packages are referred to as circuit pins on a silicon die that are wired to external connectors for connection to other devices. The package form is a housing for mounting a semiconductor integrated circuit chip, which not only plays a role in mounting, fixing, sealing, protecting the chip and enhancing electric heating performance, but also is connected to pins of the package housing through wires for contacts on the chip, which are connected with other devices through wires on a printed circuit board, thereby realizing connection of an internal chip and an external circuit, because the chip must be isolated from the outside to prevent corrosion of the chip circuit by impurities in the air from causing degradation of the electric performance.
Like the patent application of publication number CN 210805734U among the prior art, its through the chip direction with the inside different sizes of encapsulation shell face each other, make it interconnect through the mode of planting the ball on the pad, the spheroid is the tin ball, and its diameter can be adjusted by oneself according to the demand, has greatly reduced the thickness of encapsulation body like this, makes its miniaturization, compact structure, and the principle is simple, satisfies consumer group's user demand.
When the device is packaged, the upper part and the lower part of the shell are required to be packaged by using the adhesive, and when the upper shell and the lower shell are overlapped when the upper shell and the lower shell are directly coated on one sides of the upper shell and the lower shell to be packaged, the redundant adhesive can be extruded, so that the redundant adhesive flows into the shell, and the normal use of the chip in the shell is affected.
Therefore, there is a need to provide a high-density thin small package structure for chips to solve the above-mentioned problems.
Disclosure of Invention
The utility model provides a high-density thin small packaging structure of a chip, which solves the problem that the normal use of the chip is affected by the fact that an adhesive flows into the inside of a shell easily when the adhesive is used for packaging.
In order to solve the above technical problems, the present utility model provides a high-density thin small-sized package structure of a chip, comprising:
a lower housing and an upper housing;
the placing groove is formed in the top of the lower shell;
the clamping groove is formed in the top of the lower shell;
the clamping plate is fixedly arranged at the bottom of the upper shell;
and the pressing plate is fixedly arranged at the bottom of the upper shell.
Preferably, the clamping plate is arranged on the inner side surface of the clamping groove, and the pressing plate is arranged on the inner side surface of the placing groove.
Preferably, the holding groove has been seted up a plurality of, the joint groove set up respectively in the both sides of holding groove, the clamp plate is provided with a plurality of, the joint board set up respectively in the both sides of clamp plate.
Preferably, a chip is fixedly installed at the bottom of the inner side surface of the lower shell, a plurality of connection pins are fixedly installed at two sides of the top of the chip, the connection pins are arranged on the inner side surface of the placing groove, and the connection pins are arranged at the bottom of the pressing plate.
Preferably, a pin contact block is fixedly arranged at one end of the connecting pin.
Preferably, an upper chip is arranged at the bottom of the upper shell, a connecting part is arranged at the bottom of the upper chip, and the connecting part is arranged at the top of the chip.
Preferably, an L-shaped frame is fixedly arranged on the inner side surface of the lower shell.
Compared with the related art, the high-density thin small packaging structure of the chip has the following beneficial effects:
the utility model provides a high-density thin small packaging structure of a chip, which is matched with structures such as a lower shell, a clamping groove, a placing groove, an upper shell, a clamping plate and a pressing plate, so that the connection strength can be increased when the chip is used, and the phenomenon that an adhesive is extruded when the chip is connected to flow into the inner side surfaces of the upper shell and the lower shell, so that the normal use of the chip is influenced can be avoided.
Drawings
Fig. 1 is a schematic structural diagram of a first embodiment of a high-density thin-small package structure of a chip according to the present utility model;
FIG. 2 is a schematic top view of the lower housing of FIG. 1;
FIG. 3 is a schematic top view of the upper housing of FIG. 1;
fig. 4 is a schematic structural diagram of a second embodiment of a high-density thin-small package structure of a chip according to the present utility model;
fig. 5 is a schematic top view of the L-shaped frame shown in fig. 4.
Reference numerals in the drawings: 1. the lower shell, 11, the clamping groove, 12, the placing groove, 2, the upper shell, 21, the clamping plate, 22, the pressing plate, 3, the chip, 31, the connecting part, 32, the upper chip, 33, the connecting pin, 34, the pin contact block and 4, L-shaped frame.
Detailed Description
The utility model will be further described with reference to the drawings and embodiments.
First embodiment
Referring to fig. 1, fig. 2, and fig. 3 in combination, fig. 1 is a schematic structural diagram of a first embodiment of a high-density thin-small package structure of a chip according to the present utility model; FIG. 2 is a schematic top view of the lower housing of FIG. 1; fig. 3 is a schematic top view of the upper housing shown in fig. 1. A high-density thin small package structure of a chip, comprising: a lower case 1 and an upper case 2;
a placement groove 12, wherein the placement groove 12 is arranged at the top of the lower shell 1;
the clamping groove 11 is formed in the top of the lower shell 1;
a clamping plate 21, wherein the clamping plate 21 is fixedly arranged at the bottom of the upper shell 2;
a pressing plate 22, wherein the pressing plate 22 is fixedly arranged at the bottom of the upper shell 2.
The clamping groove 11 and the clamping plate 21 are correspondingly arranged, and the pressing plate 22 and the clamping plate 21 are correspondingly arranged.
The clamping plate 21 is disposed on the inner side surface of the clamping groove 11, and the pressing plate 22 is disposed on the inner side surface of the placement groove 12.
The placing grooves 12 are formed in a plurality, the clamping grooves 11 are respectively formed in two sides of the placing grooves 12, the pressing plates 22 are formed in a plurality, and the clamping plates 21 are respectively arranged on two sides of the pressing plates 22.
The bottom of the inner side of the lower shell 1 is fixedly provided with a chip 3, two sides of the top of the chip 3 are fixedly provided with a plurality of connection pins 34, the connection pins 34 are arranged on the inner side of the placing groove 12, and the connection pins 34 are arranged on the bottom of the pressing plate 22.
One end of the connection pin 33 is fixedly provided with a pin contact block 34.
The bottom of the upper shell 2 is provided with an upper chip 32, the bottom of the upper chip 32 is provided with a connecting part 31, and the connecting part 31 is arranged at the top of the chip 3.
The joint 31 is a solder ball, the solder ball is soldered on the upper surface of the chip 3, and the joint between the chip 3 and the upper chip 32 and the solder ball is coated with flux.
The working principle of the high-density thin small-sized packaging structure of the chip provided by the utility model is as follows:
when in use, a user installs the chip 3 at the bottom of the lower shell 1, places the connecting pins 33 on the inner side surface of the placing groove 12, places the adhesive on the inner side surface of the clamping groove 11, places the upper shell 2 and the upper chip 32 on the top of the lower shell 1 and the top of the chip 3 respectively, clamps the clamping plate 21 on the inner side surface of the clamping groove 11, clamps the pressing plate 22 on the inner side surface of the placing groove 12, presses and fixes the connecting pins 33 by the pressing plate 22, clamps the clamping plate 21 on the inner side surface of the clamping groove 11, extrudes redundant adhesive on the inner side surface of the clamping groove 11, and places the redundant adhesive on the top of the lower shell 1 and the bottom of the upper shell 2, thereby performing sealing connection.
Compared with the related art, the high-density thin small packaging structure of the chip has the following beneficial effects:
through the mutual cooperation of structures such as lower shell 1, joint groove 11, standing groove 12, last shell 2, joint board 21, clamp plate 22, when using, can increase joint strength, also can avoid when connecting, extrude the adhesive, make its medial surface of flowing into upper and lower shell to influence the normal use of chip 3.
Second embodiment
Referring to fig. 4 and fig. 5 in combination, a high-density thin and small package structure of a chip according to a first embodiment of the present utility model is provided. The second embodiment is merely a preferred manner of the first embodiment, and implementation of the second embodiment does not affect the implementation of the first embodiment alone.
Specifically, the second embodiment of the present utility model provides a high-density thin and small package structure of a chip, which is different in that an L-shaped frame 4 is fixedly mounted on an inner side surface of the lower housing 1.
The L-shaped frame 4 is provided at the bottom of one side of the placement groove 12 so as to avoid affecting the assembly of the connection pins 33.
The working principle of the high-density thin small-sized packaging structure of the chip provided by the utility model is as follows:
when the adhesive is used for bonding the upper shell 2 and the lower shell 1, a user puts the adhesive into the inner side surface of the clamping groove 11, then presses the upper shell 2 on the top of the lower shell 1, and clamps the clamping plate 21 into the inner side surface of the clamping groove 11, so that the adhesive is fixed, and when the adhesive flows out of the inner side surface of the clamping groove 11 to flow into the inner side surface of the lower shell 1, the adhesive can be located on the inner side surface of the L-shaped frame 4 through the blocking of the L-shaped frame 4, so that the adhesive is prevented from directly flowing into the lower shell 1.
Compared with the related art, the high-density thin small packaging structure of the chip has the following beneficial effects:
when the L-shaped frame 4 is used, the L-shaped frame 4 is arranged on the inner side surface of the lower shell 1, so that the adhesive flowing into the inner side surface of the lower shell 1 can be blocked, and the adhesive is prevented from flowing into the upper surface of the chip 3, so that the chip 3 is prevented from being damaged.
The foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present utility model.
Claims (7)
1. A high-density thin small package structure of a chip, comprising:
a lower housing and an upper housing;
the placing groove is formed in the top of the lower shell;
the clamping groove is formed in the top of the lower shell;
the clamping plate is fixedly arranged at the bottom of the upper shell;
and the pressing plate is fixedly arranged at the bottom of the upper shell.
2. The high-density thin and small package structure of claim 1, wherein the clamping plate is disposed on an inner side of the clamping groove, and the pressing plate is disposed on an inner side of the placement groove.
3. The high-density thin and small-sized packaging structure of a chip according to claim 2, wherein the placing grooves are formed in a plurality, the clamping grooves are respectively formed in two sides of the placing grooves, the pressing plate is provided with a plurality, and the clamping plates are respectively arranged on two sides of the pressing plate.
4. The high-density thin and small-sized packaging structure of a chip according to claim 3, wherein the chip is fixedly mounted at the bottom of the inner side surface of the lower housing, a plurality of connection pins are fixedly mounted at two sides of the top of the chip, the connection pins are arranged on the inner side surface of the placement groove, and the connection pins are arranged at the bottom of the pressing plate.
5. The high-density, thin and small package structure of chip as claimed in claim 4, wherein said connection pins have pin pads fixedly mounted on one end thereof.
6. The high-density thin and small package structure of chip as claimed in claim 5, wherein the bottom of said upper case is provided with an upper chip, the bottom of said upper chip is provided with a connection part, and said connection part is disposed at the top of said chip.
7. The high-density, thin and small package structure of chip as claimed in claim 6, wherein said lower case has an L-shaped frame fixedly mounted on an inner side thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320988466.1U CN219696442U (en) | 2023-04-27 | 2023-04-27 | High-density thin small-sized packaging structure of chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320988466.1U CN219696442U (en) | 2023-04-27 | 2023-04-27 | High-density thin small-sized packaging structure of chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219696442U true CN219696442U (en) | 2023-09-15 |
Family
ID=87965192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320988466.1U Active CN219696442U (en) | 2023-04-27 | 2023-04-27 | High-density thin small-sized packaging structure of chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219696442U (en) |
-
2023
- 2023-04-27 CN CN202320988466.1U patent/CN219696442U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7554185B2 (en) | Flip chip and wire bond semiconductor package | |
| KR20040062764A (en) | Chip scale stack package | |
| JP2006522478A (en) | Semiconductor multi-package module including processor and memory package assembly | |
| KR20030017676A (en) | Dual die package | |
| TW447059B (en) | Multi-chip module integrated circuit package | |
| US20090127687A1 (en) | POP (package-on-package) semiconductor device | |
| US6682954B1 (en) | Method for employing piggyback multiple die #3 | |
| CN219696442U (en) | High-density thin small-sized packaging structure of chip | |
| JP2003318360A5 (en) | ||
| US20020153600A1 (en) | Double sided chip package | |
| KR100230189B1 (en) | Ball grid array semiconductor package | |
| US8097952B2 (en) | Electronic package structure having conductive strip and method | |
| KR20020085102A (en) | Chip Stacked Semiconductor Package | |
| TW201330220A (en) | Package structure with cavity and manufacturing method thereof | |
| KR20080067891A (en) | Multi chip package | |
| TWI395319B (en) | Semiconductor assembly to avoid break of solder joints of pop stack | |
| JP3082507U (en) | Double side chip package | |
| CN210200698U (en) | Fan-out type packaging structure | |
| CN210805734U (en) | Ultra-thin small volume packaging structure of chip | |
| CN201417764Y (en) | Package structure of array type flat pin-free chip | |
| TWI234862B (en) | Chip scale package structure | |
| TWI223879B (en) | Package stack module with vertical conductive wires inside molding compound | |
| KR100352112B1 (en) | Structure of chip-sized semiconductor package and fabricating method thereof | |
| TW478127B (en) | Dual chip package structure and the manufacturing method thereof | |
| US20100264540A1 (en) | IC Package Reducing Wiring Layers on Substrate and Its Carrier |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |