WO2020199862A1 - 封装结构、显示基板、显示装置及显示器件的封装方法 - Google Patents
封装结构、显示基板、显示装置及显示器件的封装方法 Download PDFInfo
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- WO2020199862A1 WO2020199862A1 PCT/CN2020/078607 CN2020078607W WO2020199862A1 WO 2020199862 A1 WO2020199862 A1 WO 2020199862A1 CN 2020078607 W CN2020078607 W CN 2020078607W WO 2020199862 A1 WO2020199862 A1 WO 2020199862A1
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- pattern
- display device
- composite film
- organic
- inorganic
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
Definitions
- the present disclosure relates to the field of display technology, and in particular to a packaging structure, a display substrate, a display device, and a packaging method of a display device.
- OLED organic light-emitting diode
- organic light-emitting diode organic light-emitting diode
- OLED organic light-emitting diode
- the multi-layer thin-film packaging layer includes an inorganic packaging layer and an organic packaging layer stacked in a direction away from the OLED device. Among them, the inorganic encapsulation layer is used to isolate water and oxygen, and the organic encapsulation layer is used to buffer external forces.
- the present disclosure provides a packaging structure, a display substrate, a display device, and a packaging method of the display device.
- the technical solution is as follows:
- a packaging structure for packaging a display device, and the packaging structure includes:
- At least one composite film layer the composite film layer includes an inorganic pattern and an organic pattern, the inorganic pattern includes a plurality of curved structures arranged at intervals, the organic pattern includes a first organic sub-pattern, the first organic sub-pattern is The inorganic patterns are arranged in the same layer and have complementary positions;
- the orthographic projection of the composite film layer on the display device at least covers the display area of the display device.
- the packaging structure includes a plurality of composite film layers, and the multiple composite film layers are stacked in a direction away from the display device;
- the union of the orthographic projection area of the inorganic patterns in the plurality of composite film layers on the display device covers the display area.
- the plurality of composite film layers include a first composite film layer and a second composite film layer, and the orthographic projection area of the inorganic pattern in the first composite film layer on the display device and the second composite film layer
- the inorganic patterns in the composite film layer are complementary in positions of the orthographic projection area on the display device.
- the plurality of composite film layers include a first composite film layer and a second composite film layer
- the orthographic projection of the inorganic pattern in the first composite film layer on the display device is the same as the second composite film layer.
- the union of the orthographic projections of the inorganic patterns in the film layer on the display device covers the display area, and the orthographic projections of the inorganic patterns in the first composite film layer on the display device are identical to those of the second
- the orthographic projection of the inorganic pattern in the composite film layer on the display device has an overlapping area.
- the plurality of curved structures are arranged at equal intervals.
- the width of the curved structure is equal to the distance between two adjacent curved structures.
- the plurality of curved structures include at least one of a folded structure and an arc structure.
- the folded structure includes at least one of a zigzag structure, a W-shaped structure, a Z-shaped structure, and a V-shaped structure
- the arc-shaped structure includes a wave-shaped structure, an S-shaped structure, and a U-shaped structure. At least one.
- the organic pattern further includes a second organic sub-pattern located on a side of the first organic sub-pattern and the inorganic pattern away from the display device.
- the orthographic projection of the second organic sub-pattern on the display device covers the display area.
- the plurality of curved structures are arranged at equal intervals, and the width of the curved structure is equal to the distance between two adjacent curved structures;
- the organic pattern further includes a second organic sub-pattern located on the side of the first organic sub-pattern and the inorganic pattern away from the display device, and the second organic sub-pattern is located at the side of the display device.
- the orthographic projection on the display device covers the display area.
- a display substrate in another aspect, includes: a display device and the packaging structure according to any one of the aspects;
- the display device includes a base substrate and a light emitting device located on the base substrate, the packaging structure is located on a side of the light emitting device away from the base substrate, and the packaging structure is on the display device.
- the orthographic projection covers at least the display area of the display device.
- the display device is a flexible display device.
- the display device is an organic light emitting diode display device or a quantum dot light emitting diode display device.
- a display device in another aspect, includes the display substrate according to any one of the other aspects.
- a method for packaging a display device including:
- a display device comprising a base substrate and a light emitting device located on the base substrate;
- At least one composite film layer is formed on the side of the light emitting device away from the base substrate, the composite film layer includes an inorganic pattern and an organic pattern, the inorganic pattern includes a plurality of curved structures arranged at intervals, and the organic pattern Comprising a first organic sub-pattern, the first organic sub-pattern and the inorganic pattern are arranged in the same layer and have complementary positions;
- the orthographic projection of the composite film layer on the display device at least covers the display area of the display device.
- the forming at least one composite film layer on the side of the light-emitting device away from the base substrate includes:
- An organic pattern is formed on the light emitting device formed with the inorganic pattern to obtain the composite film layer.
- the forming an inorganic pattern on the side of the light emitting device away from the base substrate includes:
- the forming an organic pattern on the light emitting device formed with the inorganic pattern includes:
- a second mask is used to form the first organic sub-pattern on the light emitting device formed with the inorganic pattern, and the hollow area of the first mask is complementary to the hollow area of the second mask.
- the forming an inorganic pattern on the side of the light emitting device away from the base substrate includes:
- the forming an organic pattern on the light emitting device formed with the inorganic pattern includes:
- the organic pattern is formed on the light-emitting device formed with the inorganic pattern by a coating process, and the organic pattern includes the first organic sub-pattern and the second organic sub-pattern provided in the entire layer.
- the pattern is located on a side of the first organic sub-pattern and the inorganic pattern away from the light emitting device.
- the forming at least one composite film layer on the side of the light-emitting device away from the base substrate includes:
- a plurality of the composite film layers are sequentially formed on the side of the light emitting device away from the base substrate.
- FIG. 1 is a schematic structural diagram of a flexible display device provided in the related art
- FIG. 2 is a schematic top view of the flexible display device shown in FIG. 1;
- FIG. 3 is a schematic structural diagram of a package structure provided by an embodiment of the present disclosure.
- FIG. 4 is a schematic top view of a package structure provided by an embodiment of the present disclosure.
- FIG. 5 is a schematic diagram of stress decomposition when the package structure shown in FIG. 4 is bent in a first direction;
- FIG. 6 is a schematic diagram of stress decomposition when the package structure shown in FIG. 4 is bent in a second direction;
- FIG. 7 is a schematic diagram of stress decomposition when the package structure shown in FIG. 4 is bent in the third direction;
- FIG. 8 is a schematic structural diagram of another package structure provided by an embodiment of the present disclosure.
- FIG. 9 is a schematic structural diagram of yet another packaging structure provided by an embodiment of the present disclosure.
- FIG. 10 is a schematic top view of another package structure provided by an embodiment of the present disclosure.
- FIG. 11 is a schematic structural diagram of a display substrate provided by an embodiment of the present disclosure.
- FIG. 12 is a schematic structural diagram of a display substrate provided by an embodiment of the present disclosure.
- FIG. 13 is a flowchart of a packaging method of a display device according to an embodiment of the present disclosure.
- OLED devices are used as flexible display devices, which can be used to prepare flexible display devices (such as curved screens). Since the flexible display device itself needs to bear a large amount of bending, and the rigidity of the inorganic packaging layer in the traditional packaging structure is relatively large, it is prone to fracture when it is bent, which affects the packaging reliability of the OLED device.
- FIG. 1 is a schematic structural diagram of a flexible display device provided in the related art.
- the flexible display device includes a display device 101 and a packaging structure 102 for packaging the display device 101.
- the packaging structure 102 includes an inorganic pattern 1021 and an organic pattern 1022.
- FIG. 2 is a schematic top view of the flexible display device shown in FIG. 1.
- FIG. 1 is a schematic cross-sectional view of the flexible display device shown in FIG. 2 in the AA' direction.
- the inorganic pattern 1021 includes a plurality of strip-shaped structures arranged at intervals, and an organic pattern 1022 is provided between two adjacent strip-shaped structures.
- the flexible display device can only be bent in a specified direction (the arrangement direction x of a plurality of strip structures), and its bending limitation is relatively high.
- FIG. 3 is a schematic structural diagram of a package structure provided by an embodiment of the present disclosure.
- the packaging structure is used for packaging display devices.
- the packaging structure 20 includes:
- the composite film layer 201 includes an inorganic pattern 201a and an organic pattern 201b.
- the orthographic projection of the composite film layer 201 on the display device at least covers the display area of the display device.
- the orthographic projection of the composite film layer on the display device coincides with the display area of the display device.
- the orthographic projection of the composite film on the display device covers the display area of the display device, and the edge of the composite film is located in the non-display area of the display device, that is, the orthographic projection of the composite film on the display device covers the display device The display area and part or all of the non-display area.
- FIG. 4 is a schematic top view of a package structure provided by an embodiment of the present disclosure.
- the package structure shown in FIG. 3 is a schematic cross-sectional view of the package structure shown in FIG. 4 in the BB' direction.
- the inorganic pattern 201a includes a plurality of curved structures a1 arranged at intervals.
- the organic pattern 201b includes a first organic sub-pattern b1. 3 and 4, the first organic sub-pattern b1 and the inorganic pattern 201a are arranged in the same layer and have complementary positions.
- the arrangement of the first organic sub-pattern and the inorganic pattern in the same layer means that the spatial structure of the first organic sub-pattern and the inorganic pattern are located in the same layer, that is, they are located at the same spatial height, and are not used to limit the first organic sub-pattern.
- the pattern and the inorganic pattern are prepared in the same layer.
- the position of the first organic sub-pattern and the inorganic pattern are complementary to each other.
- the first organic sub-pattern is located in the interval of the plurality of curved structures arranged in the inorganic pattern. That is, the first organic sub-pattern is composed of organic material located in the interval of the plurality of curved structures.
- the first organic sub-pattern may completely fill in the intervals of the plurality of curved structures arranged at intervals in the inorganic pattern, or may be partially filled in the intervals of the plurality of curved structures arranged at intervals in the inorganic pattern.
- FIG. 5 is a schematic diagram of stress decomposition when the package structure shown in FIG. 4 is bent in the first direction.
- the stress F can be decomposed into a first component F1 and a second component F2.
- the first force component F1 can extend to the end of the curved structure a1 in the direction of the first force component F1, and is released to the first organic sub-pattern b1 adjacent to the end (that is, at the position A1).
- the second component force F2 can be released from the edge of the curved structure a1 to the first organic sub-pattern b1 adjacent to the curved structure a1 (that is, at the position A2).
- FIG. 6 is a schematic diagram of stress decomposition when the package structure shown in FIG. 4 is bent in the second direction.
- the stress F' can be decomposed into a first force component F1' and a second force component F2'.
- the first force component F1' can extend to the end of the curved structure a1 in the direction where the first force component F1' is located, and is released to the first organic sub-pattern b1 adjacent to the end (that is, at the position B1).
- the second component force F2' can be released from the edge of the curved structure a1 to the first organic sub-pattern b1 adjacent to the curved structure a1 (that is, at the position B2).
- FIG. 7 is a schematic diagram of stress decomposition when the package structure shown in FIG. 4 is bent in the third direction.
- the inside of the inorganic pattern 201a is subjected to a stress F" in the third direction z.
- This stress F" can be decomposed into a first component F1" and a second component.
- Force F2 can be released from the edge of the curved structure a1 to the first organic sub-pattern b1 adjacent to the curved structure a1 (that is, at the position C1).
- the second force component F2" can be released from the curved structure a1
- the edge of is released into the first organic sub-pattern b1 adjacent to the curved structure a1 (that is, at the position C2).
- the inorganic patterns in the packaging structure provided by the embodiments of the present disclosure can be released into the organic patterns along the edges after being subjected to bending stress in any direction. Since the organic pattern has good elasticity and can withstand the stress of bending of the packaging structure, the packaging structure can be bent in any direction.
- the packaging structure provided by the embodiments of the present disclosure includes at least one composite film layer, and the inorganic pattern in the composite film layer includes a plurality of curved structures arranged at intervals. Since the bending stress in any direction received inside the inorganic pattern can be released into the organic pattern along the edge, the package structure can be bent in any direction while ensuring the structural stability of the package structure.
- FIG. 8 is a schematic structural diagram of another packaging structure provided by an embodiment of the present disclosure.
- the packaging structure 20 includes a plurality of composite film layers 201.
- the multiple composite film layers 201 are stacked in a direction away from the display device.
- the orthographic projection area of the inorganic pattern 201a in the plurality of composite film layers 201 on the display device covers the display area.
- the orthographic projection area of the inorganic patterns in the multiple composite film layers on the display device refers to the union of the orthographic projection areas of all the inorganic patterns in the multiple composite film layers on the display device.
- the packaging effect of the packaging structure on the display device can be enhanced.
- the foregoing multiple composite film layers include a first composite film layer and a second composite film layer.
- the orthographic projection area of the inorganic pattern in the first composite film layer on the display device is complementary to the orthographic projection area of the inorganic pattern in the second composite film layer on the display device. That is, the inorganic pattern in the first composite film layer is complementary in shape to the inorganic pattern in the second composite film layer (the orthographic projection of the inorganic pattern in the first composite film layer on the display device is the same as that in the second composite film layer.
- the union of the orthographic projection of the inorganic pattern on the display device covers the display area of the display device), and the orthographic projection area of the inorganic pattern in the first composite film layer on the display device and the inorganic pattern in the second composite film layer are displayed There is no overlap area in the orthographic projection area on the device.
- the union of the orthographic projection of the inorganic pattern in the first composite film layer on the display device and the orthographic projection of the inorganic pattern in the second composite film layer on the display device covers the display area, and the There is an overlap area between the orthographic projection of the inorganic pattern on the display device and the orthographic projection of the inorganic pattern in the second composite film layer on the display device.
- the embodiment of the present disclosure does not limit this.
- the packaging structure may also include three, four or more composite film layers stacked, and the embodiment of the present disclosure does not limit the number of composite film layers in the packaging structure.
- FIG. 9 is a schematic structural diagram of yet another packaging structure provided by an embodiment of the present disclosure.
- the organic pattern 201b further includes a second organic sub-pattern b2.
- the second organic sub-pattern b2 is located on the side of the first organic sub-pattern b1 and the inorganic pattern 201a away from the display device.
- the second organic sub-pattern may completely cover the inorganic pattern and the side of the first organic sub-pattern away from the display device, and the second organic sub-pattern may have a whole layer structure.
- the second organic sub-pattern can also cover the inorganic pattern and the side surface of the film layer where the first organic sub-pattern is located to protect the inorganic pattern.
- the orthographic projection of the second organic sub-pattern b2 on the display device covers the display area of the display device.
- the edge of the orthographic projection area of the second organic sub-pattern on the display device may be located in the non-display area of the display device, that is, the second organic sub-pattern may extend from the display area to the non-display area.
- the second organic sub-pattern can play a role in buffering external forces and protect the display device.
- the above-mentioned plurality of curved structures include at least one of a folded structure and an arc structure.
- the folded structure includes at least one of a sawtooth structure, a W-shaped structure, a Z-shaped structure, and a V-shaped structure.
- the arc-shaped structure includes at least one of a wave-shaped structure, an S-shaped structure, and a U-shaped structure.
- the curved structure a1 in the inorganic pattern 201a is a folded structure, which includes a Z-shaped structure and a V-shaped structure.
- FIG. 4 only shows a partial area of the package structure.
- the multiple curved structures in the inorganic pattern may also include other folded structures such as zigzag structures and/or W-shaped structures.
- the shape of the folded structure is related to the size of the display device where the packaging structure is located, which is not limited in the embodiment of the present disclosure.
- FIG. 10 is a schematic top view of another package structure provided by an embodiment of the present disclosure.
- the curved structure a1 in the inorganic pattern 201a is an arc-shaped structure, which includes an S-shaped structure and a U-shaped structure.
- the stress decomposition of the package structure shown in FIG. 10 when it is bent in various directions can refer to FIGS. 5 to 7, and the details of the embodiment of the present disclosure are not repeated here.
- FIG. 10 only shows a partial area of the package structure.
- the multiple curved structures in the inorganic pattern may also include other arc-shaped structures such as wave-shaped structures.
- the shape of the arc structure is related to the size of the display device where the packaging structure is located, which is not limited in the embodiment of the present disclosure.
- the shapes and contours of the multiple curved structures in the inorganic pattern may be substantially the same.
- all the curved structures a1 in the inorganic pattern 201a are folded structures, including Z-shaped structures and V-shaped structures.
- all the curved structures a1 in the inorganic pattern 201a are arc-shaped structures, including S-shaped structures and U-shaped structures.
- multiple curved structures in the inorganic pattern may be arranged at equal intervals. When the package structure is bent, the bending structures arranged at equal intervals can uniformly release the internal bending stress to the adjacent organic patterns, thereby improving the reliability of the package structure.
- the curved structure may be a structure of equal width, that is, the width of the curved structure is equal everywhere.
- the width of the curved structure and the distance between two adjacent curved structures may be equal.
- the uniformity of the arrangement of the inorganic pattern and the organic pattern can be improved, thereby improving the structural stability of the package structure.
- the curved structure can also have a gradual width, which is not limited in the embodiment of the present application.
- the inorganic pattern can be prepared from a metal material, such as metal aluminum or copper.
- the organic pattern can be prepared from an organic resin material, such as polyimide (PI) material or polyester material.
- PI polyimide
- the embodiments of the present disclosure do not limit the preparation materials of the inorganic pattern and the organic pattern.
- the packaging structure provided by the embodiments of the present disclosure includes at least one composite film layer, and the inorganic pattern in the composite film layer includes a plurality of curved structures arranged at intervals. Since the bending stress in any direction received inside the inorganic pattern can be released into the organic pattern along the edge, the package structure can be bent in any direction while ensuring the structural stability of the package structure.
- An embodiment of the present disclosure provides a display substrate, which includes a display device and a packaging structure as shown in any one of FIGS. 3 to 10.
- FIG. 11 is a schematic structural diagram of a display substrate provided by an embodiment of the present disclosure.
- the display substrate includes a packaging structure 20 as shown in FIG.
- the display device 30 includes a base substrate 301 and a light emitting device 302 located on the base substrate 301.
- the packaging structure 20 is located on the side of the light emitting device 302 away from the base substrate 301.
- the orthographic projection of the packaging structure 20 on the display device 30 covers at least the display area of the display device 30.
- the packaging structure 20 includes at least one composite film layer 201. Referring to FIG. 11, the orthographic projection of the composite film layer 201 on the display device 30 at least covers the display area AA of the display device 30.
- FIG. 12 is a schematic structural diagram of another display substrate provided by an embodiment of the present disclosure.
- the display substrate includes a packaging structure 20 as shown in FIG.
- the multiple composite film layers 201 in the package structure 20 include a first composite film layer and a second composite film layer.
- the orthographic projection area aa of the inorganic pattern 201a in the first composite film layer on the display device 30 is complementary to the orthographic projection area aa' of the inorganic pattern 201a in the second composite film layer on the display device 30.
- the union of the orthographic projection area aa of the inorganic pattern 201a in the first composite film layer on the display device 30 and the orthographic projection area aa' of the inorganic pattern 201a in the second composite film layer on the display device 30 covers the display of the display device Area AA.
- the display device is a flexible display device.
- the display device may be an OLED display device or a quantum dot light emitting diode (QLED) display device, etc., which is not limited in the embodiment of the present disclosure.
- QLED quantum dot light emitting diode
- the packaging structure in the display substrate includes at least one composite film layer, and the inorganic pattern in the composite film layer includes a plurality of curved structures arranged at intervals. Since the bending stress in any direction received inside the inorganic pattern can be released into the organic pattern along the edge, the package structure can be bent in any direction while ensuring the structural stability of the package structure. In addition, the packaging structure can ensure the packaging reliability of the display device and realize the bending of the display substrate in any direction.
- An embodiment of the present disclosure provides a display device, which may include a display substrate as shown in FIG. 11 or FIG. 12.
- the display device may be a flexible display device.
- the display device may be an OLED display device or a QLED display device.
- it can be electronic paper, mobile phones, tablet computers, televisions, monitors, notebook computers, digital photo frames, and navigators.
- the packaging structure in the display device includes at least one composite film layer, and the inorganic pattern in the composite film layer includes a plurality of curved structures arranged at intervals. Since the bending stress in any direction received inside the inorganic pattern can be released into the organic pattern along the edge, the package structure can be bent in any direction while ensuring the structural stability of the package structure. In addition, the packaging structure can ensure the packaging reliability of the display device, and realize the bending of the display device in any direction. Therefore, the display device provided by the embodiment of the present disclosure reduces the bending limitation compared with the flexible display device in the related art.
- FIG. 13 is a flowchart of a packaging method of a display device according to an embodiment of the present disclosure. As shown in Figure 13, the method includes:
- Step 401 Provide a display device.
- the display device includes a base substrate and a light-emitting device on the base substrate.
- the light-emitting device may be a self-luminous device, such as an OLED device or a QLED device.
- the base substrate may be a flexible base substrate.
- the base substrate can be made of flexible PI material.
- Step 402 At least one composite film layer is formed on the side of the light emitting device away from the base substrate, the composite film layer includes an inorganic pattern and an organic pattern, the inorganic pattern includes a plurality of curved structures arranged at intervals, and the organic pattern includes a first organic sub-pattern , The first organic sub-pattern and the inorganic pattern are arranged in the same layer and have complementary positions.
- the orthographic projection of the composite film layer on the display device at least covers the display area of the display device.
- multiple composite film layers may be sequentially formed on the side of the light emitting device away from the base substrate.
- the package structure shown in FIG. 8 can be obtained.
- the packaging structure includes at least one composite film layer, and the inorganic pattern in the composite film layer includes a plurality of curved structures arranged at intervals. Since the bending stress in any direction received inside the inorganic pattern can be released into the organic pattern along the edge, the package structure can be bent in any direction while ensuring the structural stability of the package structure. In addition, the packaging structure can ensure the packaging reliability of the display device.
- the implementation process of the foregoing step 402 includes: forming an inorganic pattern on the side of the light emitting device away from the base substrate.
- An organic pattern is formed on the light-emitting device formed with an inorganic pattern to obtain a composite film layer.
- a metal material is used to form an inorganic pattern on the side of the light emitting device away from the base substrate.
- An organic resin material is used to form an organic pattern on a light-emitting device formed with an inorganic pattern.
- the method of forming the inorganic pattern on the side of the light-emitting device away from the base substrate includes: forming the inorganic pattern on the side of the light-emitting device away from the base substrate by using a first mask.
- the method of forming an organic pattern on a light-emitting device with an inorganic pattern includes: forming the first organic sub-pattern on the light-emitting device with the inorganic pattern by using a second mask, the first mask and the second mask.
- the diaphragm shapes are complementary.
- the inorganic pattern can be prepared through an evaporation process or a patterning process using the first mask.
- the organic pattern can be prepared by using a second mask through an evaporation process or a patterning process.
- the patterning process includes: photoresist coating, exposure, development, etching and photoresist stripping.
- the structure of the composite film layer formed by the above method can refer to the composite film layer 201 in the package structure shown in FIG. 3 or FIG. 8.
- the method of forming the inorganic pattern on the side of the light-emitting device away from the base substrate includes: forming the inorganic pattern on the side of the light-emitting device away from the base substrate by using a first mask.
- the method of forming an organic pattern on a light-emitting device formed with an inorganic pattern includes: forming an organic pattern on the light-emitting device formed with an inorganic pattern by a coating process, and the organic pattern includes a first organic sub-pattern and a second organic The second organic sub-pattern is located on the side of the first organic sub-pattern and the inorganic pattern away from the light-emitting device.
- the inorganic pattern can be prepared through an evaporation process or a patterning process using the first mask.
- the structure of the composite film layer formed by the above method can refer to the composite film layer 201 in the package structure shown in FIG. 9.
- the display device packaging method uses at least one composite film layer to package the display device, and the inorganic pattern in the composite film layer includes a plurality of curved structures arranged at intervals. Since the bending stress in any direction received inside the inorganic pattern can be released into the organic pattern along the edge, the package structure can be bent in any direction while ensuring the structural stability of the package structure. Further, the packaging structure can ensure the packaging reliability of the display device, and realize the bending of the packaged display device in any direction. Compared with the flexible display device in the related art, the bending limitation is reduced.
- first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance.
- plurality refers to two or more, unless specifically defined otherwise.
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Abstract
Description
Claims (20)
- 一种封装结构,用于封装显示器件,所述封装结构包括:至少一个复合膜层(201),所述复合膜层(201)包括无机图案和有机图案,所述无机图案包括间隔设置的多个弯曲结构,所述有机图案包括第一有机子图案,所述第一有机子图案与所述无机图案同层设置且位置互补;其中,所述复合膜层(201)在所述显示器件上的正投影至少覆盖所述显示器件的显示区域。
- 根据权利要求1所述的封装结构,所述封装结构包括多个复合膜层(201),所述多个复合膜层(201)沿远离所述显示器件的方向层叠设置;所述多个复合膜层(201)中的无机图案在所述显示器件上的正投影区域的并集覆盖所述显示区域。
- 根据权利要求2所述的封装结构,所述多个复合膜层(201)包括第一复合膜层和第二复合膜层,所述第一复合膜层中的无机图案在所述显示器件上的正投影区域与所述第二复合膜层中的无机图案在所述显示器件上的正投影区域位置互补。
- 根据权利要求2所述的封装结构,所述多个复合膜层(201)包括第一复合膜层和第二复合膜层,所述第一复合膜层中的无机图案在所述显示器件上的正投影与所述第二复合膜层中的无机图案在所述显示器件上的正投影的并集覆盖所述显示区域,且所述第一复合膜层中的无机图案在所述显示器件上的正投影与所述第二复合膜层中的无机图案在所述显示器件上的正投影存在重合区域。
- 根据权利要求1至4任一所述的封装结构,所述多个弯曲结构等间距设置。
- 根据权利要求5所述的封装结构,所述弯曲结构的宽度与相邻两个所述弯曲结构的间距相等。
- 根据权利要求1至6任一所述的封装结构,所述多个弯曲结构包括折形结构和弧形结构中的至少一种。
- 根据权利要求7所述的封装结构,所述折形结构包括锯齿形结构、W形结构、Z形结构和V形结构中的至少一种,所述弧形结构包括波浪形结构、S形结构和U形结构中的至少一种。
- 根据权利要求1至8任一所述的封装结构,所述有机图案还包括第二有机子图案,所述第二有机子图案位于所述第一有机子图案和所述无机图案远离所述显示器件的一侧。
- 根据权利要求9所述的封装结构,所述第二有机子图案在所述显示器件上的正投影覆盖所述显示区域。
- 根据权利要求3或4所述的封装结构,所述多个弯曲结构等间距设置,且所述弯曲结构的宽度与相邻两个所述弯曲结构的间距相等;所述有机图案还包括第二有机子图案,所述第二有机子图案位于所述第一有机子图案和所述无机图案远离所述显示器件的一侧,所述第二有机子图案在所述显示器件上的正投影覆盖所述显示区域。
- 一种显示基板,所述显示基板包括:显示器件(30)以及如权利要求1至11任一所述的封装结构(20);所述显示器件(30)包括衬底基板(301)以及位于所述衬底基板(301)上的发光器件(302),所述封装结构(20)位于所述发光器件(302)远离所述衬底基板(301)的一侧,所述封装结构(20)在所述显示器件(30)上的正投影至少覆盖所述显示器件(30)的显示区域。
- 根据权利要求12所述的显示基板,所述显示器件(30)为柔性显示器件。
- 根据权利要求13所述的显示基板,所述显示器件为有机发光二极管显示器件或量子点发光二极管显示器件。
- 一种显示装置,所述显示装置包括:如权利要求12至14任一所述的显示基板。
- 一种显示器件的封装方法,所述方法包括:提供显示器件,所述显示器件包括衬底基板以及位于所述衬底基板上的发光器件;在所述发光器件远离所述衬底基板的一侧形成至少一个复合膜层,所述复合膜层包括无机图案和有机图案,所述无机图案包括间隔设置的多个弯曲结构,所述有机图案包括第一有机子图案,所述第一有机子图案与所述无机图案同层设置且位置互补;其中,所述复合膜层在所述显示器件上的正投影至少覆盖所述显示器件的显示区域。
- 根据权利要求16所述的方法,所述在所述发光器件远离所述衬底基板的一侧形成至少一个复合膜层,包括:在所述发光器件远离所述衬底基板的一侧形成无机图案;在形成有所述无机图案的发光器件上形成有机图案,得到一个所述复合膜层。
- 根据权利要求17所述的方法,所述在所述发光器件远离所述衬底基板的一侧形成无机图案,包括:采用第一掩膜板在所述发光器件远离所述衬底基板的一侧形成所述无机图案;所述在形成有所述无机图案的发光器件上形成有机图案,包括:采用第二掩膜板在形成有所述无机图案的发光器件上形成所述第一有机子图案,所述第一掩膜板的镂空区域与所述第二掩膜板的镂空区域形状互补。
- 根据权利要求17所述的方法,所述在所述发光器件远离所述衬底基板的一侧形成无机图案,包括:采用第一掩膜板在所述发光器件远离所述衬底基板的一侧形成所述无机图案;所述在形成有所述无机图案的发光器件上形成有机图案,包括:通过涂覆工艺在形成有所述无机图案的发光器件上形成所述有机图案,所述有机图案包括所述第一有机子图案和整层设置的第二有机子图案,所述第二有机子图案位于所述第一有机子图案和所述无机图案远离所述发光器件的一侧。
- 根据权利要求16至19任一所述的方法,所述在所述发光器件远离所述衬底基板的一侧形成至少一个复合膜层,包括:在所述发光器件远离所述衬底基板的一侧依次形成多个所述复合膜层。
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