WO2020199862A1 - 封装结构、显示基板、显示装置及显示器件的封装方法 - Google Patents

封装结构、显示基板、显示装置及显示器件的封装方法 Download PDF

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WO2020199862A1
WO2020199862A1 PCT/CN2020/078607 CN2020078607W WO2020199862A1 WO 2020199862 A1 WO2020199862 A1 WO 2020199862A1 CN 2020078607 W CN2020078607 W CN 2020078607W WO 2020199862 A1 WO2020199862 A1 WO 2020199862A1
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WIPO (PCT)
Prior art keywords
pattern
display device
composite film
organic
inorganic
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PCT/CN2020/078607
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English (en)
French (fr)
Inventor
胡友元
栾梦雨
吴新风
刘博文
王欣竹
李菲
李慧慧
Original Assignee
京东方科技集团股份有限公司
合肥鑫晟光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 合肥鑫晟光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US17/256,187 priority Critical patent/US11917851B2/en
Publication of WO2020199862A1 publication Critical patent/WO2020199862A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

Definitions

  • the present disclosure relates to the field of display technology, and in particular to a packaging structure, a display substrate, a display device, and a packaging method of a display device.
  • OLED organic light-emitting diode
  • organic light-emitting diode organic light-emitting diode
  • OLED organic light-emitting diode
  • the multi-layer thin-film packaging layer includes an inorganic packaging layer and an organic packaging layer stacked in a direction away from the OLED device. Among them, the inorganic encapsulation layer is used to isolate water and oxygen, and the organic encapsulation layer is used to buffer external forces.
  • the present disclosure provides a packaging structure, a display substrate, a display device, and a packaging method of the display device.
  • the technical solution is as follows:
  • a packaging structure for packaging a display device, and the packaging structure includes:
  • At least one composite film layer the composite film layer includes an inorganic pattern and an organic pattern, the inorganic pattern includes a plurality of curved structures arranged at intervals, the organic pattern includes a first organic sub-pattern, the first organic sub-pattern is The inorganic patterns are arranged in the same layer and have complementary positions;
  • the orthographic projection of the composite film layer on the display device at least covers the display area of the display device.
  • the packaging structure includes a plurality of composite film layers, and the multiple composite film layers are stacked in a direction away from the display device;
  • the union of the orthographic projection area of the inorganic patterns in the plurality of composite film layers on the display device covers the display area.
  • the plurality of composite film layers include a first composite film layer and a second composite film layer, and the orthographic projection area of the inorganic pattern in the first composite film layer on the display device and the second composite film layer
  • the inorganic patterns in the composite film layer are complementary in positions of the orthographic projection area on the display device.
  • the plurality of composite film layers include a first composite film layer and a second composite film layer
  • the orthographic projection of the inorganic pattern in the first composite film layer on the display device is the same as the second composite film layer.
  • the union of the orthographic projections of the inorganic patterns in the film layer on the display device covers the display area, and the orthographic projections of the inorganic patterns in the first composite film layer on the display device are identical to those of the second
  • the orthographic projection of the inorganic pattern in the composite film layer on the display device has an overlapping area.
  • the plurality of curved structures are arranged at equal intervals.
  • the width of the curved structure is equal to the distance between two adjacent curved structures.
  • the plurality of curved structures include at least one of a folded structure and an arc structure.
  • the folded structure includes at least one of a zigzag structure, a W-shaped structure, a Z-shaped structure, and a V-shaped structure
  • the arc-shaped structure includes a wave-shaped structure, an S-shaped structure, and a U-shaped structure. At least one.
  • the organic pattern further includes a second organic sub-pattern located on a side of the first organic sub-pattern and the inorganic pattern away from the display device.
  • the orthographic projection of the second organic sub-pattern on the display device covers the display area.
  • the plurality of curved structures are arranged at equal intervals, and the width of the curved structure is equal to the distance between two adjacent curved structures;
  • the organic pattern further includes a second organic sub-pattern located on the side of the first organic sub-pattern and the inorganic pattern away from the display device, and the second organic sub-pattern is located at the side of the display device.
  • the orthographic projection on the display device covers the display area.
  • a display substrate in another aspect, includes: a display device and the packaging structure according to any one of the aspects;
  • the display device includes a base substrate and a light emitting device located on the base substrate, the packaging structure is located on a side of the light emitting device away from the base substrate, and the packaging structure is on the display device.
  • the orthographic projection covers at least the display area of the display device.
  • the display device is a flexible display device.
  • the display device is an organic light emitting diode display device or a quantum dot light emitting diode display device.
  • a display device in another aspect, includes the display substrate according to any one of the other aspects.
  • a method for packaging a display device including:
  • a display device comprising a base substrate and a light emitting device located on the base substrate;
  • At least one composite film layer is formed on the side of the light emitting device away from the base substrate, the composite film layer includes an inorganic pattern and an organic pattern, the inorganic pattern includes a plurality of curved structures arranged at intervals, and the organic pattern Comprising a first organic sub-pattern, the first organic sub-pattern and the inorganic pattern are arranged in the same layer and have complementary positions;
  • the orthographic projection of the composite film layer on the display device at least covers the display area of the display device.
  • the forming at least one composite film layer on the side of the light-emitting device away from the base substrate includes:
  • An organic pattern is formed on the light emitting device formed with the inorganic pattern to obtain the composite film layer.
  • the forming an inorganic pattern on the side of the light emitting device away from the base substrate includes:
  • the forming an organic pattern on the light emitting device formed with the inorganic pattern includes:
  • a second mask is used to form the first organic sub-pattern on the light emitting device formed with the inorganic pattern, and the hollow area of the first mask is complementary to the hollow area of the second mask.
  • the forming an inorganic pattern on the side of the light emitting device away from the base substrate includes:
  • the forming an organic pattern on the light emitting device formed with the inorganic pattern includes:
  • the organic pattern is formed on the light-emitting device formed with the inorganic pattern by a coating process, and the organic pattern includes the first organic sub-pattern and the second organic sub-pattern provided in the entire layer.
  • the pattern is located on a side of the first organic sub-pattern and the inorganic pattern away from the light emitting device.
  • the forming at least one composite film layer on the side of the light-emitting device away from the base substrate includes:
  • a plurality of the composite film layers are sequentially formed on the side of the light emitting device away from the base substrate.
  • FIG. 1 is a schematic structural diagram of a flexible display device provided in the related art
  • FIG. 2 is a schematic top view of the flexible display device shown in FIG. 1;
  • FIG. 3 is a schematic structural diagram of a package structure provided by an embodiment of the present disclosure.
  • FIG. 4 is a schematic top view of a package structure provided by an embodiment of the present disclosure.
  • FIG. 5 is a schematic diagram of stress decomposition when the package structure shown in FIG. 4 is bent in a first direction;
  • FIG. 6 is a schematic diagram of stress decomposition when the package structure shown in FIG. 4 is bent in a second direction;
  • FIG. 7 is a schematic diagram of stress decomposition when the package structure shown in FIG. 4 is bent in the third direction;
  • FIG. 8 is a schematic structural diagram of another package structure provided by an embodiment of the present disclosure.
  • FIG. 9 is a schematic structural diagram of yet another packaging structure provided by an embodiment of the present disclosure.
  • FIG. 10 is a schematic top view of another package structure provided by an embodiment of the present disclosure.
  • FIG. 11 is a schematic structural diagram of a display substrate provided by an embodiment of the present disclosure.
  • FIG. 12 is a schematic structural diagram of a display substrate provided by an embodiment of the present disclosure.
  • FIG. 13 is a flowchart of a packaging method of a display device according to an embodiment of the present disclosure.
  • OLED devices are used as flexible display devices, which can be used to prepare flexible display devices (such as curved screens). Since the flexible display device itself needs to bear a large amount of bending, and the rigidity of the inorganic packaging layer in the traditional packaging structure is relatively large, it is prone to fracture when it is bent, which affects the packaging reliability of the OLED device.
  • FIG. 1 is a schematic structural diagram of a flexible display device provided in the related art.
  • the flexible display device includes a display device 101 and a packaging structure 102 for packaging the display device 101.
  • the packaging structure 102 includes an inorganic pattern 1021 and an organic pattern 1022.
  • FIG. 2 is a schematic top view of the flexible display device shown in FIG. 1.
  • FIG. 1 is a schematic cross-sectional view of the flexible display device shown in FIG. 2 in the AA' direction.
  • the inorganic pattern 1021 includes a plurality of strip-shaped structures arranged at intervals, and an organic pattern 1022 is provided between two adjacent strip-shaped structures.
  • the flexible display device can only be bent in a specified direction (the arrangement direction x of a plurality of strip structures), and its bending limitation is relatively high.
  • FIG. 3 is a schematic structural diagram of a package structure provided by an embodiment of the present disclosure.
  • the packaging structure is used for packaging display devices.
  • the packaging structure 20 includes:
  • the composite film layer 201 includes an inorganic pattern 201a and an organic pattern 201b.
  • the orthographic projection of the composite film layer 201 on the display device at least covers the display area of the display device.
  • the orthographic projection of the composite film layer on the display device coincides with the display area of the display device.
  • the orthographic projection of the composite film on the display device covers the display area of the display device, and the edge of the composite film is located in the non-display area of the display device, that is, the orthographic projection of the composite film on the display device covers the display device The display area and part or all of the non-display area.
  • FIG. 4 is a schematic top view of a package structure provided by an embodiment of the present disclosure.
  • the package structure shown in FIG. 3 is a schematic cross-sectional view of the package structure shown in FIG. 4 in the BB' direction.
  • the inorganic pattern 201a includes a plurality of curved structures a1 arranged at intervals.
  • the organic pattern 201b includes a first organic sub-pattern b1. 3 and 4, the first organic sub-pattern b1 and the inorganic pattern 201a are arranged in the same layer and have complementary positions.
  • the arrangement of the first organic sub-pattern and the inorganic pattern in the same layer means that the spatial structure of the first organic sub-pattern and the inorganic pattern are located in the same layer, that is, they are located at the same spatial height, and are not used to limit the first organic sub-pattern.
  • the pattern and the inorganic pattern are prepared in the same layer.
  • the position of the first organic sub-pattern and the inorganic pattern are complementary to each other.
  • the first organic sub-pattern is located in the interval of the plurality of curved structures arranged in the inorganic pattern. That is, the first organic sub-pattern is composed of organic material located in the interval of the plurality of curved structures.
  • the first organic sub-pattern may completely fill in the intervals of the plurality of curved structures arranged at intervals in the inorganic pattern, or may be partially filled in the intervals of the plurality of curved structures arranged at intervals in the inorganic pattern.
  • FIG. 5 is a schematic diagram of stress decomposition when the package structure shown in FIG. 4 is bent in the first direction.
  • the stress F can be decomposed into a first component F1 and a second component F2.
  • the first force component F1 can extend to the end of the curved structure a1 in the direction of the first force component F1, and is released to the first organic sub-pattern b1 adjacent to the end (that is, at the position A1).
  • the second component force F2 can be released from the edge of the curved structure a1 to the first organic sub-pattern b1 adjacent to the curved structure a1 (that is, at the position A2).
  • FIG. 6 is a schematic diagram of stress decomposition when the package structure shown in FIG. 4 is bent in the second direction.
  • the stress F' can be decomposed into a first force component F1' and a second force component F2'.
  • the first force component F1' can extend to the end of the curved structure a1 in the direction where the first force component F1' is located, and is released to the first organic sub-pattern b1 adjacent to the end (that is, at the position B1).
  • the second component force F2' can be released from the edge of the curved structure a1 to the first organic sub-pattern b1 adjacent to the curved structure a1 (that is, at the position B2).
  • FIG. 7 is a schematic diagram of stress decomposition when the package structure shown in FIG. 4 is bent in the third direction.
  • the inside of the inorganic pattern 201a is subjected to a stress F" in the third direction z.
  • This stress F" can be decomposed into a first component F1" and a second component.
  • Force F2 can be released from the edge of the curved structure a1 to the first organic sub-pattern b1 adjacent to the curved structure a1 (that is, at the position C1).
  • the second force component F2" can be released from the curved structure a1
  • the edge of is released into the first organic sub-pattern b1 adjacent to the curved structure a1 (that is, at the position C2).
  • the inorganic patterns in the packaging structure provided by the embodiments of the present disclosure can be released into the organic patterns along the edges after being subjected to bending stress in any direction. Since the organic pattern has good elasticity and can withstand the stress of bending of the packaging structure, the packaging structure can be bent in any direction.
  • the packaging structure provided by the embodiments of the present disclosure includes at least one composite film layer, and the inorganic pattern in the composite film layer includes a plurality of curved structures arranged at intervals. Since the bending stress in any direction received inside the inorganic pattern can be released into the organic pattern along the edge, the package structure can be bent in any direction while ensuring the structural stability of the package structure.
  • FIG. 8 is a schematic structural diagram of another packaging structure provided by an embodiment of the present disclosure.
  • the packaging structure 20 includes a plurality of composite film layers 201.
  • the multiple composite film layers 201 are stacked in a direction away from the display device.
  • the orthographic projection area of the inorganic pattern 201a in the plurality of composite film layers 201 on the display device covers the display area.
  • the orthographic projection area of the inorganic patterns in the multiple composite film layers on the display device refers to the union of the orthographic projection areas of all the inorganic patterns in the multiple composite film layers on the display device.
  • the packaging effect of the packaging structure on the display device can be enhanced.
  • the foregoing multiple composite film layers include a first composite film layer and a second composite film layer.
  • the orthographic projection area of the inorganic pattern in the first composite film layer on the display device is complementary to the orthographic projection area of the inorganic pattern in the second composite film layer on the display device. That is, the inorganic pattern in the first composite film layer is complementary in shape to the inorganic pattern in the second composite film layer (the orthographic projection of the inorganic pattern in the first composite film layer on the display device is the same as that in the second composite film layer.
  • the union of the orthographic projection of the inorganic pattern on the display device covers the display area of the display device), and the orthographic projection area of the inorganic pattern in the first composite film layer on the display device and the inorganic pattern in the second composite film layer are displayed There is no overlap area in the orthographic projection area on the device.
  • the union of the orthographic projection of the inorganic pattern in the first composite film layer on the display device and the orthographic projection of the inorganic pattern in the second composite film layer on the display device covers the display area, and the There is an overlap area between the orthographic projection of the inorganic pattern on the display device and the orthographic projection of the inorganic pattern in the second composite film layer on the display device.
  • the embodiment of the present disclosure does not limit this.
  • the packaging structure may also include three, four or more composite film layers stacked, and the embodiment of the present disclosure does not limit the number of composite film layers in the packaging structure.
  • FIG. 9 is a schematic structural diagram of yet another packaging structure provided by an embodiment of the present disclosure.
  • the organic pattern 201b further includes a second organic sub-pattern b2.
  • the second organic sub-pattern b2 is located on the side of the first organic sub-pattern b1 and the inorganic pattern 201a away from the display device.
  • the second organic sub-pattern may completely cover the inorganic pattern and the side of the first organic sub-pattern away from the display device, and the second organic sub-pattern may have a whole layer structure.
  • the second organic sub-pattern can also cover the inorganic pattern and the side surface of the film layer where the first organic sub-pattern is located to protect the inorganic pattern.
  • the orthographic projection of the second organic sub-pattern b2 on the display device covers the display area of the display device.
  • the edge of the orthographic projection area of the second organic sub-pattern on the display device may be located in the non-display area of the display device, that is, the second organic sub-pattern may extend from the display area to the non-display area.
  • the second organic sub-pattern can play a role in buffering external forces and protect the display device.
  • the above-mentioned plurality of curved structures include at least one of a folded structure and an arc structure.
  • the folded structure includes at least one of a sawtooth structure, a W-shaped structure, a Z-shaped structure, and a V-shaped structure.
  • the arc-shaped structure includes at least one of a wave-shaped structure, an S-shaped structure, and a U-shaped structure.
  • the curved structure a1 in the inorganic pattern 201a is a folded structure, which includes a Z-shaped structure and a V-shaped structure.
  • FIG. 4 only shows a partial area of the package structure.
  • the multiple curved structures in the inorganic pattern may also include other folded structures such as zigzag structures and/or W-shaped structures.
  • the shape of the folded structure is related to the size of the display device where the packaging structure is located, which is not limited in the embodiment of the present disclosure.
  • FIG. 10 is a schematic top view of another package structure provided by an embodiment of the present disclosure.
  • the curved structure a1 in the inorganic pattern 201a is an arc-shaped structure, which includes an S-shaped structure and a U-shaped structure.
  • the stress decomposition of the package structure shown in FIG. 10 when it is bent in various directions can refer to FIGS. 5 to 7, and the details of the embodiment of the present disclosure are not repeated here.
  • FIG. 10 only shows a partial area of the package structure.
  • the multiple curved structures in the inorganic pattern may also include other arc-shaped structures such as wave-shaped structures.
  • the shape of the arc structure is related to the size of the display device where the packaging structure is located, which is not limited in the embodiment of the present disclosure.
  • the shapes and contours of the multiple curved structures in the inorganic pattern may be substantially the same.
  • all the curved structures a1 in the inorganic pattern 201a are folded structures, including Z-shaped structures and V-shaped structures.
  • all the curved structures a1 in the inorganic pattern 201a are arc-shaped structures, including S-shaped structures and U-shaped structures.
  • multiple curved structures in the inorganic pattern may be arranged at equal intervals. When the package structure is bent, the bending structures arranged at equal intervals can uniformly release the internal bending stress to the adjacent organic patterns, thereby improving the reliability of the package structure.
  • the curved structure may be a structure of equal width, that is, the width of the curved structure is equal everywhere.
  • the width of the curved structure and the distance between two adjacent curved structures may be equal.
  • the uniformity of the arrangement of the inorganic pattern and the organic pattern can be improved, thereby improving the structural stability of the package structure.
  • the curved structure can also have a gradual width, which is not limited in the embodiment of the present application.
  • the inorganic pattern can be prepared from a metal material, such as metal aluminum or copper.
  • the organic pattern can be prepared from an organic resin material, such as polyimide (PI) material or polyester material.
  • PI polyimide
  • the embodiments of the present disclosure do not limit the preparation materials of the inorganic pattern and the organic pattern.
  • the packaging structure provided by the embodiments of the present disclosure includes at least one composite film layer, and the inorganic pattern in the composite film layer includes a plurality of curved structures arranged at intervals. Since the bending stress in any direction received inside the inorganic pattern can be released into the organic pattern along the edge, the package structure can be bent in any direction while ensuring the structural stability of the package structure.
  • An embodiment of the present disclosure provides a display substrate, which includes a display device and a packaging structure as shown in any one of FIGS. 3 to 10.
  • FIG. 11 is a schematic structural diagram of a display substrate provided by an embodiment of the present disclosure.
  • the display substrate includes a packaging structure 20 as shown in FIG.
  • the display device 30 includes a base substrate 301 and a light emitting device 302 located on the base substrate 301.
  • the packaging structure 20 is located on the side of the light emitting device 302 away from the base substrate 301.
  • the orthographic projection of the packaging structure 20 on the display device 30 covers at least the display area of the display device 30.
  • the packaging structure 20 includes at least one composite film layer 201. Referring to FIG. 11, the orthographic projection of the composite film layer 201 on the display device 30 at least covers the display area AA of the display device 30.
  • FIG. 12 is a schematic structural diagram of another display substrate provided by an embodiment of the present disclosure.
  • the display substrate includes a packaging structure 20 as shown in FIG.
  • the multiple composite film layers 201 in the package structure 20 include a first composite film layer and a second composite film layer.
  • the orthographic projection area aa of the inorganic pattern 201a in the first composite film layer on the display device 30 is complementary to the orthographic projection area aa' of the inorganic pattern 201a in the second composite film layer on the display device 30.
  • the union of the orthographic projection area aa of the inorganic pattern 201a in the first composite film layer on the display device 30 and the orthographic projection area aa' of the inorganic pattern 201a in the second composite film layer on the display device 30 covers the display of the display device Area AA.
  • the display device is a flexible display device.
  • the display device may be an OLED display device or a quantum dot light emitting diode (QLED) display device, etc., which is not limited in the embodiment of the present disclosure.
  • QLED quantum dot light emitting diode
  • the packaging structure in the display substrate includes at least one composite film layer, and the inorganic pattern in the composite film layer includes a plurality of curved structures arranged at intervals. Since the bending stress in any direction received inside the inorganic pattern can be released into the organic pattern along the edge, the package structure can be bent in any direction while ensuring the structural stability of the package structure. In addition, the packaging structure can ensure the packaging reliability of the display device and realize the bending of the display substrate in any direction.
  • An embodiment of the present disclosure provides a display device, which may include a display substrate as shown in FIG. 11 or FIG. 12.
  • the display device may be a flexible display device.
  • the display device may be an OLED display device or a QLED display device.
  • it can be electronic paper, mobile phones, tablet computers, televisions, monitors, notebook computers, digital photo frames, and navigators.
  • the packaging structure in the display device includes at least one composite film layer, and the inorganic pattern in the composite film layer includes a plurality of curved structures arranged at intervals. Since the bending stress in any direction received inside the inorganic pattern can be released into the organic pattern along the edge, the package structure can be bent in any direction while ensuring the structural stability of the package structure. In addition, the packaging structure can ensure the packaging reliability of the display device, and realize the bending of the display device in any direction. Therefore, the display device provided by the embodiment of the present disclosure reduces the bending limitation compared with the flexible display device in the related art.
  • FIG. 13 is a flowchart of a packaging method of a display device according to an embodiment of the present disclosure. As shown in Figure 13, the method includes:
  • Step 401 Provide a display device.
  • the display device includes a base substrate and a light-emitting device on the base substrate.
  • the light-emitting device may be a self-luminous device, such as an OLED device or a QLED device.
  • the base substrate may be a flexible base substrate.
  • the base substrate can be made of flexible PI material.
  • Step 402 At least one composite film layer is formed on the side of the light emitting device away from the base substrate, the composite film layer includes an inorganic pattern and an organic pattern, the inorganic pattern includes a plurality of curved structures arranged at intervals, and the organic pattern includes a first organic sub-pattern , The first organic sub-pattern and the inorganic pattern are arranged in the same layer and have complementary positions.
  • the orthographic projection of the composite film layer on the display device at least covers the display area of the display device.
  • multiple composite film layers may be sequentially formed on the side of the light emitting device away from the base substrate.
  • the package structure shown in FIG. 8 can be obtained.
  • the packaging structure includes at least one composite film layer, and the inorganic pattern in the composite film layer includes a plurality of curved structures arranged at intervals. Since the bending stress in any direction received inside the inorganic pattern can be released into the organic pattern along the edge, the package structure can be bent in any direction while ensuring the structural stability of the package structure. In addition, the packaging structure can ensure the packaging reliability of the display device.
  • the implementation process of the foregoing step 402 includes: forming an inorganic pattern on the side of the light emitting device away from the base substrate.
  • An organic pattern is formed on the light-emitting device formed with an inorganic pattern to obtain a composite film layer.
  • a metal material is used to form an inorganic pattern on the side of the light emitting device away from the base substrate.
  • An organic resin material is used to form an organic pattern on a light-emitting device formed with an inorganic pattern.
  • the method of forming the inorganic pattern on the side of the light-emitting device away from the base substrate includes: forming the inorganic pattern on the side of the light-emitting device away from the base substrate by using a first mask.
  • the method of forming an organic pattern on a light-emitting device with an inorganic pattern includes: forming the first organic sub-pattern on the light-emitting device with the inorganic pattern by using a second mask, the first mask and the second mask.
  • the diaphragm shapes are complementary.
  • the inorganic pattern can be prepared through an evaporation process or a patterning process using the first mask.
  • the organic pattern can be prepared by using a second mask through an evaporation process or a patterning process.
  • the patterning process includes: photoresist coating, exposure, development, etching and photoresist stripping.
  • the structure of the composite film layer formed by the above method can refer to the composite film layer 201 in the package structure shown in FIG. 3 or FIG. 8.
  • the method of forming the inorganic pattern on the side of the light-emitting device away from the base substrate includes: forming the inorganic pattern on the side of the light-emitting device away from the base substrate by using a first mask.
  • the method of forming an organic pattern on a light-emitting device formed with an inorganic pattern includes: forming an organic pattern on the light-emitting device formed with an inorganic pattern by a coating process, and the organic pattern includes a first organic sub-pattern and a second organic The second organic sub-pattern is located on the side of the first organic sub-pattern and the inorganic pattern away from the light-emitting device.
  • the inorganic pattern can be prepared through an evaporation process or a patterning process using the first mask.
  • the structure of the composite film layer formed by the above method can refer to the composite film layer 201 in the package structure shown in FIG. 9.
  • the display device packaging method uses at least one composite film layer to package the display device, and the inorganic pattern in the composite film layer includes a plurality of curved structures arranged at intervals. Since the bending stress in any direction received inside the inorganic pattern can be released into the organic pattern along the edge, the package structure can be bent in any direction while ensuring the structural stability of the package structure. Further, the packaging structure can ensure the packaging reliability of the display device, and realize the bending of the packaged display device in any direction. Compared with the flexible display device in the related art, the bending limitation is reduced.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance.
  • plurality refers to two or more, unless specifically defined otherwise.

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Abstract

一种封装结构（102）、显示基板、显示装置及显示器件（101）的封装方法，属于显示技术领域。用于封装显示器件（101）的封装结构（102）包括：至少一个复合膜层（201）。该复合膜层（201）包括无机图案（201a）和有机图案（201b）。无机图案（201a）包括间隔设置的多个弯曲结构（a1）。有机图案（201b）包括第一有机子图案（b1）。第一有机子图案（b1）与无机图案（201a）同层设置且位置互补。其中，复合膜层（201）在显示器件（101）上的正投影至少覆盖显示器件（101）的显示区域（AA）。由于封装结构（102）的无机图案（201a）包括间隔设置的多个弯曲结构（a1），因此在保证封装结构（102）的结构稳定性的同时，可以实现封装结构（102）在任意方向的弯曲。

Description

封装结构、显示基板、显示装置及显示器件的封装方法
本公开要求于2019年03月29日提交的申请号为201910250271.5、发明名称为“封装结构、显示基板、显示装置及显示器件的封装方法”的中国专利申请的优先权，其全部内容通过引用结合在本公开中。
技术领域
本公开涉及显示技术领域，特别涉及一种封装结构、显示基板、显示装置及显示器件的封装方法。
背景技术
由于有机发光二极管(organic light-emitting diode，OLED)器件中的有机发光材料与水氧接触后，会影响有机发光材料的发光效果，进而影响OLED器件的质量和使用寿命，因此对OLED器件的封装至关重要。目前通常采用多层薄膜封装层作为封装结构对OLED器件进行封装，该多层薄膜封装层包括沿远离OLED器件的方向层叠设置的无机封装层和有机封装层。其中，无机封装层用于隔绝水氧，有机封装层用于缓冲外力。
发明内容
本公开提供了一种封装结构、显示基板、显示装置及显示器件的封装方法。所述技术方案如下：
一方面，提供了一种封装结构，用于封装显示器件，所述封装结构包括：
至少一个复合膜层，所述复合膜层包括无机图案和有机图案，所述无机图案包括间隔设置的多个弯曲结构，所述有机图案包括第一有机子图案，所述第一有机子图案与所述无机图案同层设置且位置互补；
其中，所述复合膜层在所述显示器件上的正投影至少覆盖所述显示器件的显示区域。
可选地，所述封装结构包括多个复合膜层，所述多个复合膜层沿远离所述显示器件的方向层叠设置；
所述多个复合膜层中的无机图案在所述显示器件上的正投影区域的并集覆 盖所述显示区域。
可选地，所述多个复合膜层包括第一复合膜层和第二复合膜层，所述第一复合膜层中的无机图案在所述显示器件上的正投影区域与所述第二复合膜层中的无机图案在所述显示器件上的正投影区域位置互补。
可选地，所述多个复合膜层包括第一复合膜层和第二复合膜层，所述第一复合膜层中的无机图案在所述显示器件上的正投影与所述第二复合膜层中的无机图案在所述显示器件上的正投影的并集覆盖所述显示区域，且所述第一复合膜层中的无机图案在所述显示器件上的正投影与所述第二复合膜层中的无机图案在所述显示器件上的正投影存在重合区域。
可选地，所述多个弯曲结构等间距设置。
可选地，所述弯曲结构的宽度与相邻两个所述弯曲结构的间距相等。
可选地，所述多个弯曲结构包括折形结构和弧形结构中的至少一种。
可选地，所述折形结构包括锯齿形结构、W形结构、Z形结构和V形结构中的至少一种，所述弧形结构包括波浪形结构、S形结构和U形结构中的至少一种。
可选地，所述有机图案还包括第二有机子图案，所述第二有机子图案位于所述第一有机子图案和所述无机图案远离所述显示器件的一侧。
可选地，所述第二有机子图案在所述显示器件上的正投影覆盖所述显示区域。
可选地，所述多个弯曲结构等间距设置，且所述弯曲结构的宽度与相邻两个所述弯曲结构的间距相等；
所述有机图案还包括第二有机子图案，所述第二有机子图案位于所述第一有机子图案和所述无机图案远离所述显示器件的一侧，所述第二有机子图案在所述显示器件上的正投影覆盖所述显示区域。
另一方面，提供了一种显示基板，所述显示基板包括：显示器件以及如一方面任一所述的封装结构；
所述显示器件包括衬底基板以及位于所述衬底基板上的发光器件，所述封装结构位于所述发光器件远离所述衬底基板的一侧，所述封装结构在所述显示器件上的正投影至少覆盖所述显示器件的显示区域。
可选地，所述显示器件为柔性显示器件。
可选地，所述显示器件为有机发光二极管显示器件或量子点发光二极管显 示器件。
又一方面，提供了一种显示装置，所述显示装置包括：如另一方面任一所述的显示基板。
再一方面，提供了一种显示器件的封装方法，所述方法包括：
提供显示器件，所述显示器件包括衬底基板以及位于所述衬底基板上的发光器件；
在所述发光器件远离所述衬底基板的一侧形成至少一个复合膜层，所述复合膜层包括无机图案和有机图案，所述无机图案包括间隔设置的多个弯曲结构，所述有机图案包括第一有机子图案，所述第一有机子图案与所述无机图案同层设置且位置互补；
其中，所述复合膜层在所述显示器件上的正投影至少覆盖所述显示器件的显示区域。
可选地，所述在所述发光器件远离所述衬底基板的一侧形成至少一个复合膜层，包括：
在所述发光器件远离所述衬底基板的一侧形成无机图案；
在形成有所述无机图案的发光器件上形成有机图案，得到一个所述复合膜层。
可选地，所述在所述发光器件远离所述衬底基板的一侧形成无机图案，包括：
采用第一掩膜板在所述发光器件远离所述衬底基板的一侧形成所述无机图案；
所述在形成有所述无机图案的发光器件上形成有机图案，包括：
采用第二掩膜板在形成有所述无机图案的发光器件上形成所述第一有机子图案，所述第一掩膜板的镂空区域与所述第二掩膜板的镂空区域形状互补。
可选地，所述在所述发光器件远离所述衬底基板的一侧形成无机图案，包括：
采用第一掩膜板在所述发光器件远离所述衬底基板的一侧形成所述无机图案；
所述在形成有所述无机图案的发光器件上形成有机图案，包括：
通过涂覆工艺在形成有所述无机图案的发光器件上形成所述有机图案，所述有机图案包括所述第一有机子图案和整层设置的第二有机子图案，所述第二 有机子图案位于所述第一有机子图案和所述无机图案远离所述发光器件的一侧。
可选地，所述在所述发光器件远离所述衬底基板的一侧形成至少一个复合膜层，包括：
在所述发光器件远离所述衬底基板的一侧依次形成多个所述复合膜层。
附图说明
图1是相关技术中提供的一种柔性显示装置的结构示意图；
图2是图1所示的柔性显示装置的俯视示意图；
图3是本公开实施例提供的一种封装结构的结构示意图；
图4是本公开实施例提供的一种封装结构的俯视示意图；
图5是如图4所示的封装结构在第一方向上弯曲时的应力分解示意图；
图6是如图4所示的封装结构在第二方向上弯曲时的应力分解示意图；
图7是如图4所示的封装结构在第三方向上弯曲时的应力分解示意图；
图8是本公开实施例提供的另一种封装结构的结构示意图；
图9是本公开实施例提供的又一种封装结构的结构示意图；
图10是本公开实施例提供的另一种封装结构的俯视示意图；
图11是本公开实施例提供的一种显示基板的结构示意图；
图12是本公开实施例提供的一种显示基板的结构示意图；
图13是本公开实施例提供的一种显示器件的封装方法的流程图。
具体实施方式
为使本公开的目的、技术方案和优点更加清楚，下面将结合附图对本公开实施方式作进一步地详细描述。
OLED器件作为柔性显示器件，其可用于制备柔性显示装置(例如曲面屏)。由于柔性显示装置本身需承接较大的弯曲量，而传统的封装结构中的无机封装层的刚性强度较大，其弯曲时易发生断裂，影响OLED器件的封装可靠性。
图1是相关技术中提供的一种柔性显示装置的结构示意图。如图1所示，该柔性显示装置包括显示器件101和用于封装该显示器件101的封装结构102。封装结构102包括无机图案1021和有机图案1022。图2是图1所示的柔性显示装置的俯视示意图。图1是图2所示的柔性显示装置在AA’方向上的截面示意图。 如图2所示，无机图案1021包括间隔设置的多个条形结构，且相邻的两个条形结构之间设置有有机图案1022。当柔性显示装置在该多个条形结构的排布方向x弯曲时，条形结构所受到的弯曲应力能够释放至与该条形结构接触的有机材料中，从而避免条形结构损坏而影响封装效果。
但是，受封装结构中无机图案的限制，该柔性显示装置仅可在指定方向(多个条形结构的排布方向x)弯曲，其弯曲局限性较高。
图3是本公开实施例提供的一种封装结构的结构示意图。该封装结构用于封装显示器件。如图3所示，该封装结构20包括：
至少一个复合膜层201，复合膜层201包括无机图案201a和有机图案201b。其中，复合膜层201在显示器件上的正投影至少覆盖显示器件的显示区域。可选地，复合膜层在显示器件上的正投影与显示器件的显示区域重合。或者，复合膜层在显示器件上的正投影覆盖显示器件的显示区域，且复合膜层的边缘位于显示器件的非显示区域，也即是，复合膜层在显示器件上的正投影覆盖显示器件的显示区域以及部分或全部非显示区域。
可选地，图4是本公开实施例提供的一种封装结构的俯视示意图。图3所示的封装结构是图4所示的封装结构在BB’方向上的截面示意图。如图4所示，无机图案201a包括间隔设置的多个弯曲结构a1。有机图案201b包括第一有机子图案b1。参见图3和图4，第一有机子图案b1与无机图案201a同层设置且位置互补。在本公开实施例中，第一有机子图案与无机图案同层设置指，第一有机子图案与无机图案的空间结构位于同层，即其位于同一空间高度，并不用于限定第一有机子图案与无机图案同层制备得到。第一有机子图案与无机图案位置互补指，第一有机子图案位于无机图案中间隔设置的多个弯曲结构的间隔内，即第一有机子图案由位于多个弯曲结构的间隔内的有机材料构成，第一有机子图案可以完全填满无机图案中间隔设置的多个弯曲结构的间隔内，也可以部分填充在无机图案中间隔设置的多个弯曲结构的间隔内。
示例地，图5是如图4所示的封装结构在第一方向上弯曲时的应力分解示意图。如图5所示，当封装结构在第一方向x上弯曲时，无机图案201a内部受到第一方向x上的应力F。该应力F可以分解为第一分力F1和第二分力F2。其中，第一分力F1可以延伸至弯曲结构a1在第一分力F1所在方向的末端，并释放至与该末端相邻的第一有机子图案b1中(即位置A1处)。第二分力F2可以 从弯曲结构a1的边缘释放至与该弯曲结构a1相邻的第一有机子图案b1中(即位置A2处)。
又示例地，图6是如图4所示的封装结构在第二方向上弯曲时的应力分解示意图。如图6所示，当封装结构在第二方向y上弯曲时，无机图案201a内部受到第二方向y上的应力F’。该应力F’可以分解为第一分力F1’和第二分力F2’。其中，第一分力F1’可以延伸至弯曲结构a1在第一分力F1’所在方向的末端，并释放至与该末端相邻的第一有机子图案b1中(即位置B1处)。第二分力F2’可以从弯曲结构a1的边缘释放至与该弯曲结构a1相邻的第一有机子图案b1中(即位置B2处)。
再示例地，图7是如图4所示的封装结构在第三方向上弯曲时的应力分解示意图。如图7所示，当封装结构在第三方向z上弯曲时，无机图案201a内部受到第三方向z上的应力F”。该应力F”可以分解为第一分力F1”和第二分力F2”。其中，第一分力F1”可以从弯曲结构a1的边缘释放至与该弯曲结构a1相邻的第一有机子图案b1中(即位置C1处)。第二分力F2”可以从弯曲结构a1的边缘释放至与该弯曲结构a1相邻的第一有机子图案b1中(即位置C2处)。
需要说明的是，参见图5至图7，本公开实施例提供的封装结构中的无机图案内部受到任意方向上的弯曲应力后，均可沿边缘释放至有机图案中。由于有机图案的弹性较好，可以承受封装结构弯曲受到的应力，因此该封装结构可以实现任意方向上的弯曲。
综上所述，本公开实施例提供的封装结构，该封装结构包括至少一个复合膜层，该复合膜层中的无机图案包括间隔设置的多个弯曲结构。由于无机图案内部受到的任意方向上的弯曲应力，均可沿边缘释放至有机图案中，因此在保证封装结构的结构稳定性的同时，可以实现封装结构在任意方向的弯曲。
可选地，图8是本公开实施例提供的另一种封装结构的结构示意图。如图8所示，封装结构20中包括多个复合膜层201。该多个复合膜层201沿远离显示器件的方向层叠设置。多个复合膜层201中的无机图案201a在显示器件上的正投影区域覆盖显示区域。其中，多个复合膜层中的无机图案在显示器件上的正投影区域指多个复合膜层中所有无机图案在显示器件上的正投影区域的并集。
需要说明的是，通过在封装结构中设置多个复合膜层，使得多个复合膜层中的无机图案在显示器件上的正投影区域覆盖显示区域，可以强化封装结构对显示器件的封装效果。
可选地，参见图8，上述多个复合膜层包括第一复合膜层和第二复合膜层。第一复合膜层中的无机图案在显示器件上的正投影区域与第二复合膜层中的无机图案在显示器件上的正投影区域位置互补。也即是，第一复合膜层中的无机图案与第二复合膜层中的无机图案形状互补(第一复合膜层中的无机图案在显示器件上的正投影与第二复合膜层中的无机图案在显示器件上的正投影的并集覆盖显示器件的显示区域)，且第一复合膜层中的无机图案在显示器件上的正投影区域与第二复合膜层中的无机图案在显示器件上的正投影区域不存在重合区域。或者，第一复合膜层中的无机图案在显示器件上的正投影与第二复合膜层中的无机图案在显示器件上的正投影的并集覆盖显示区域，且第一复合膜层中的无机图案在显示器件上的正投影与第二复合膜层中的无机图案在显示器件上的正投影存在重合区域。本公开实施例对此不做限定。
可选地，封装结构中还可以包括层叠设置的三个、四个或更多的复合膜层，本公开实施例对封装结构中复合膜层的个数不做限定。
可选地，图9是本公开实施例提供的又一种封装结构的结构示意图。如图9所示，有机图案201b还包括第二有机子图案b2。第二有机子图案b2位于第一有机子图案b1和无机图案201a远离显示器件的一侧。本申请实施例中，第二有机子图案可以完全覆盖无机图案和第一有机子图案远离显示器件的一侧，第二有机子图案可以为整层结构。第二有机子图案还可以包覆无机图案和第一有机子图案所在膜层的侧面，以保护无机图案。
可选地，第二有机子图案b2在显示器件上的正投影覆盖显示器件的显示区域。第二有机子图案在显示器件上的正投影区域的边缘可以位于显示器件的非显示区域内，也即是，第二有机子图案可以从显示区域内延伸至非显示区域。
需要说明的是，第二有机子图案可以起到缓冲外力的作用，保护显示器件。
在本公开实施例中，上述多个弯曲结构包括折形结构和弧形结构中的至少一种。其中，折形结构包括锯齿形结构、W形结构、Z形结构和V形结构中的至少一种。弧形结构包括波浪形结构、S形结构和U形结构中的至少一种。
示例地，参见图4，无机图案201a中的弯曲结构a1为折形结构，其中包括Z形结构和V形结构。
需要说明的是，图4仅示出了封装结构的部分区域。，无机图案中的多个弯曲结构还可以包括锯齿形结构和/或W形结构等其它折形结构。折形结构的形状与封装结构所在的显示装置的尺寸相关，本公开实施例对此不做限定。
又示例地，图10是本公开实施例提供的另一种封装结构的俯视示意图。如图10所示，无机图案201a中的弯曲结构a1为弧形结构，其中包括S形结构和U形结构。如图10所示的封装结构在各个方向上弯折时的应力分解可参考图5至图7，本公开实施例在此不做赘述。
需要说明的是，图10仅示出了封装结构的部分区域。无机图案中的多个弯曲结构还可以包括波浪形结构等其它弧形结构。弧形结构的形状与封装结构所在的显示装置的尺寸相关，本公开实施例对此不做限定。
本申请实施例中，无机图案中的多个弯曲结构的形状和轮廓可以大致相同。例如参见图4，无机图案201a中的所有弯曲结构a1均为折形结构，其中包括Z形结构和V形结构。又例如参见图10，无机图案201a中的所有弯曲结构a1为弧形结构，其中包括S形结构和U形结构。可选地，无机图案中的多个弯曲结构可以等间距设置。在封装结构弯曲时，等间距设置的弯曲结构可以将内部的弯曲应力均匀地释放至相邻的有机图案中，提高封装结构的可靠性。
本申请实施例中，弯曲结构可以是等宽结构，也即是弯曲结构各处的宽度均相等。可选地，弯曲结构的宽度与相邻两个弯曲结构的间距可以相等。可以提高无机图案和有机图案的设置均匀性，进而提高封装结构的结构稳定性。当然，弯曲结构也可以宽度渐变，本申请实施例对此不做限定。
可选地，无机图案可以由金属材料制备得到，例如金属铝或铜等。有机图案可以由有机树脂材料制备得到，例如聚酰亚胺(Polyimide，PI)材料或聚酯材料等。本公开实施例对无机图案和有机图案的制备材料不做限定。
综上所述，本公开实施例提供的封装结构，该封装结构包括至少一个复合膜层，该复合膜层中的无机图案包括间隔设置的多个弯曲结构。由于无机图案内部受到的任意方向上的弯曲应力，均可沿边缘释放至有机图案中，因此在保证封装结构的结构稳定性的同时，可以实现封装结构在任意方向的弯曲。
本公开实施例提供了一种显示基板，该显示基板包括：显示器件和如图3至图10任一所示的封装结构。
示例地，图11是本公开实施例提供的一种显示基板的结构示意图。如图11所示，该显示基板包括如图3所示的封装结构20。其中，显示器件30包括衬底基板301以及位于衬底基板301上的发光器件302。封装结构20位于发光器件302远离衬底基板301的一侧。封装结构20在显示器件30上的正投影至少覆盖 显示器件30的显示区域。封装结构20包括至少一个复合膜层201。参见图11，复合膜层201在显示器件30上的正投影至少覆盖显示器件30的显示区域AA。
又示例地，图12是本公开实施例提供的另一种显示基板的结构示意图。如图12所示，该显示基板包括如图8所示的封装结构20。参见图12，封装结构20中的多个复合膜层201包括第一复合膜层和第二复合膜层。第一复合膜层中的无机图案201a在显示器件30上的正投影区域aa与第二复合膜层中的无机图案201a在显示器件30上的正投影区域aa’位置互补。第一复合膜层中的无机图案201a在显示器件30上的正投影区域aa与第二复合膜层中的无机图案201a在显示器件30上的正投影区域aa’的并集覆盖显示器件的显示区域AA。
可选地，显示器件为柔性显示器件。例如该显示器件可以为OLED显示器件或量子点发光二极管(quantum dot light emitting diodes，QLED)显示器件等，本公开实施例对此不做限定。
综上所述，本公开实施例提供的显示基板，该显示基板中的封装结构包括至少一个复合膜层，该复合膜层中的无机图案包括间隔设置的多个弯曲结构。由于无机图案内部受到的任意方向上的弯曲应力，均可沿边缘释放至有机图案中，因此在保证封装结构的结构稳定性的同时，可以实现封装结构在任意方向的弯曲。另外，该封装结构可以保证对显示器件的封装可靠性，并实现显示基板在任意方向上的弯曲。
本公开实施例提供了一种显示装置，该显示装置可以包括如图11或图12所示的显示基板。
可选地，该显示装置可以为柔性显示装置。例如该显示装置可以是OLED显示装置或QLED显示装置等。其具体可以为电子纸、手机、平板电脑、电视机、显示器、笔记本电脑、数码相框和导航仪等。
综上所述，本公开实施例提供的显示装置，该显示装置中的封装结构包括至少一个复合膜层，该复合膜层中的无机图案包括间隔设置的多个弯曲结构。由于无机图案内部受到的任意方向上的弯曲应力，均可沿边缘释放至有机图案中，因此在保证封装结构的结构稳定性的同时，可以实现封装结构在任意方向的弯曲。另外，该封装结构可以保证对显示器件的封装可靠性，并实现显示装置在任意方向上的弯曲。因此本公开实施例提供的显示装置，与相关技术中的柔性显示装置相比，降低了弯曲局限性。
图13是本公开实施例提供的一种显示器件的封装方法的流程图。如图13所示，该方法包括：
步骤401、提供显示器件，该显示器件包括衬底基板以及位于衬底基板上的发光器件。
可选地，发光器件可以为自发光器件，例如OLED器件或QLED器件等。衬底基板可以为柔性衬底基板。例如该衬底基板可以由柔性PI材料制备得到。
步骤402、在发光器件远离衬底基板的一侧形成至少一个复合膜层，该复合膜层包括无机图案和有机图案，无机图案包括间隔设置的多个弯曲结构，有机图案包括第一有机子图案，第一有机子图案与无机图案同层设置且位置互补。
其中，复合膜层在显示器件上的正投影至少覆盖显示器件的显示区域。
可选地，可以在发光器件远离衬底基板的一侧依次形成多个复合膜层。例如可以得到如图8所示的封装结构。
综上所述，本公开实施例提供的显示器件的封装方法，封装结构包括至少一个复合膜层，该复合膜层中的无机图案包括间隔设置的多个弯曲结构。由于无机图案内部受到的任意方向上的弯曲应力，均可沿边缘释放至有机图案中，因此在保证封装结构的结构稳定性的同时，可以实现封装结构在任意方向的弯曲。另外，该封装结构可以保证对显示器件的封装可靠性。
可选地，上述步骤402的实现过程，包括：在发光器件远离衬底基板的一侧形成无机图案。在形成有无机图案的发光器件上形成有机图案，得到一个复合膜层。例如，采用金属材料在发光器件远离衬底基板的一侧形成无机图案。采用有机树脂材料在形成有无机图案的发光器件上形成有机图案。
在本公开的一个可选实施例中，在发光器件远离衬底基板的一侧形成无机图案的方式，包括：采用第一掩膜板在发光器件远离衬底基板的一侧形成无机图案。在形成有无机图案的发光器件上形成有机图案的方式，包括：采用第二掩膜板在形成有无机图案的发光器件上形成所述第一有机子图案，第一掩膜板和第二掩膜板形状互补。
可选地，无机图案可采用第一掩膜板通过蒸镀工艺或构图工艺制备得到。有机图案可采用第二掩膜板通过蒸镀工艺或构图工艺制备得到。其中，构图工艺包括：光刻胶涂覆、曝光、显影、刻蚀和光刻胶剥离。
示例地，采用上述方法形成的复合膜层的结构可参考如图3或图8所示的 封装结构中的复合膜层201。
在本公开的另一个可选实施例中，在发光器件远离衬底基板的一侧形成无机图案的方式，包括：采用第一掩膜板在发光器件远离衬底基板的一侧形成无机图案。在形成有无机图案的发光器件上形成有机图案的方式，包括：通过涂覆工艺在形成有无机图案的发光器件上形成有机图案，有机图案包括第一有机子图案和整层设置的第二有机子图案，第二有机子图案位于第一有机子图案和无机图案远离发光器件的一侧。
可选地，无机图案可采用第一掩膜板通过蒸镀工艺或构图工艺制备得到。
示例地，采用上述方法形成的复合膜层的结构可参考如图9所示的封装结构中的复合膜层201。
需要说明的是，本公开实施例提供的显示器件的封装方法的步骤先后顺序可以进行适当调整，步骤也可以根据情况进行相应增减，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，可轻易想到变化的方法，都应涵盖在本公开的保护范围之内，因此不再赘述。
综上所述，本公开实施例提供的显示器件的封装方法，采用至少一个复合膜层对显示器件进行封装，该复合膜层中的无机图案包括间隔设置的多个弯曲结构。由于无机图案内部受到的任意方向上的弯曲应力，均可沿边缘释放至有机图案中，因此在保证封装结构的结构稳定性的同时，可以实现封装结构在任意方向的弯曲。进一步的，该封装结构可以保证对显示器件的封装可靠性，并实现封装后的显示器件在任意方向上的弯曲。与相关技术中的柔性显示装置相比，降低了弯曲局限性。
关于上述方法实施例中涉及的结构，已经在显示装置相关的实施例中进行了详细描述，此处将不做详细阐述说明。
需要指出的是，在附图中，为了图示的清晰可能夸大了层和区域的尺寸。而且可以理解，当元件或层被称为在另一元件或层“上”时，它可以直接在其他元件上，或者可以存在中间的层。另外，可以理解，当元件或层被称为在另一元件或层“下”时，它可以直接在其他元件下，或者可以存在一个以上的中间的层或元件。另外，还可以理解，当层或元件被称为在两层或两个元件“之间”时，它可以为两层或两个元件之间惟一的层，或还可以存在一个以上的中间层或元件。通篇相似的参考标记指示相似的元件。
在本公开实施例中，术语“第一”和“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性。术语“多个”指两个或两个以上，除非另有明确的限定。
本公开实施例中的术语“和/或”，仅仅是一种描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。另外，本文中字符“/”，一般表示前后关联对象是一种“或”的关系。
以上所述仅为本公开的可选实施例，并不用以限制本公开，凡在本公开的构思和原则之内，所作的任何修改、等同替换、改进等，均应包含在本公开的保护范围之内。

Claims (20)

  1. 一种封装结构，用于封装显示器件，所述封装结构包括：
    至少一个复合膜层(201)，所述复合膜层(201)包括无机图案和有机图案，所述无机图案包括间隔设置的多个弯曲结构，所述有机图案包括第一有机子图案，所述第一有机子图案与所述无机图案同层设置且位置互补；
    其中，所述复合膜层(201)在所述显示器件上的正投影至少覆盖所述显示器件的显示区域。
  2. 根据权利要求1所述的封装结构，所述封装结构包括多个复合膜层(201)，所述多个复合膜层(201)沿远离所述显示器件的方向层叠设置；
    所述多个复合膜层(201)中的无机图案在所述显示器件上的正投影区域的并集覆盖所述显示区域。
  3. 根据权利要求2所述的封装结构，所述多个复合膜层(201)包括第一复合膜层和第二复合膜层，所述第一复合膜层中的无机图案在所述显示器件上的正投影区域与所述第二复合膜层中的无机图案在所述显示器件上的正投影区域位置互补。
  4. 根据权利要求2所述的封装结构，所述多个复合膜层(201)包括第一复合膜层和第二复合膜层，所述第一复合膜层中的无机图案在所述显示器件上的正投影与所述第二复合膜层中的无机图案在所述显示器件上的正投影的并集覆盖所述显示区域，且所述第一复合膜层中的无机图案在所述显示器件上的正投影与所述第二复合膜层中的无机图案在所述显示器件上的正投影存在重合区域。
  5. 根据权利要求1至4任一所述的封装结构，所述多个弯曲结构等间距设置。
  6. 根据权利要求5所述的封装结构，所述弯曲结构的宽度与相邻两个所述弯曲结构的间距相等。
  7. 根据权利要求1至6任一所述的封装结构，所述多个弯曲结构包括折形结构和弧形结构中的至少一种。
  8. 根据权利要求7所述的封装结构，所述折形结构包括锯齿形结构、W形结构、Z形结构和V形结构中的至少一种，所述弧形结构包括波浪形结构、S形结构和U形结构中的至少一种。
  9. 根据权利要求1至8任一所述的封装结构，所述有机图案还包括第二有机子图案，所述第二有机子图案位于所述第一有机子图案和所述无机图案远离所述显示器件的一侧。
  10. 根据权利要求9所述的封装结构，所述第二有机子图案在所述显示器件上的正投影覆盖所述显示区域。
  11. 根据权利要求3或4所述的封装结构，所述多个弯曲结构等间距设置，且所述弯曲结构的宽度与相邻两个所述弯曲结构的间距相等；
    所述有机图案还包括第二有机子图案，所述第二有机子图案位于所述第一有机子图案和所述无机图案远离所述显示器件的一侧，所述第二有机子图案在所述显示器件上的正投影覆盖所述显示区域。
  12. 一种显示基板，所述显示基板包括：显示器件(30)以及如权利要求1至11任一所述的封装结构(20)；
    所述显示器件(30)包括衬底基板(301)以及位于所述衬底基板(301)上的发光器件(302)，所述封装结构(20)位于所述发光器件(302)远离所述衬底基板(301)的一侧，所述封装结构(20)在所述显示器件(30)上的正投影至少覆盖所述显示器件(30)的显示区域。
  13. 根据权利要求12所述的显示基板，所述显示器件(30)为柔性显示器件。
  14. 根据权利要求13所述的显示基板，所述显示器件为有机发光二极管显示器件或量子点发光二极管显示器件。
  15. 一种显示装置，所述显示装置包括：如权利要求12至14任一所述的显示基板。
  16. 一种显示器件的封装方法，所述方法包括：
    提供显示器件，所述显示器件包括衬底基板以及位于所述衬底基板上的发光器件；
    在所述发光器件远离所述衬底基板的一侧形成至少一个复合膜层，所述复合膜层包括无机图案和有机图案，所述无机图案包括间隔设置的多个弯曲结构，所述有机图案包括第一有机子图案，所述第一有机子图案与所述无机图案同层设置且位置互补；
    其中，所述复合膜层在所述显示器件上的正投影至少覆盖所述显示器件的显示区域。
  17. 根据权利要求16所述的方法，所述在所述发光器件远离所述衬底基板的一侧形成至少一个复合膜层，包括：
    在所述发光器件远离所述衬底基板的一侧形成无机图案；
    在形成有所述无机图案的发光器件上形成有机图案，得到一个所述复合膜层。
  18. 根据权利要求17所述的方法，所述在所述发光器件远离所述衬底基板的一侧形成无机图案，包括：
    采用第一掩膜板在所述发光器件远离所述衬底基板的一侧形成所述无机图案；
    所述在形成有所述无机图案的发光器件上形成有机图案，包括：
    采用第二掩膜板在形成有所述无机图案的发光器件上形成所述第一有机子图案，所述第一掩膜板的镂空区域与所述第二掩膜板的镂空区域形状互补。
  19. 根据权利要求17所述的方法，所述在所述发光器件远离所述衬底基板的一侧形成无机图案，包括：
    采用第一掩膜板在所述发光器件远离所述衬底基板的一侧形成所述无机图案；
    所述在形成有所述无机图案的发光器件上形成有机图案，包括：
    通过涂覆工艺在形成有所述无机图案的发光器件上形成所述有机图案，所述有机图案包括所述第一有机子图案和整层设置的第二有机子图案，所述第二有机子图案位于所述第一有机子图案和所述无机图案远离所述发光器件的一侧。
  20. 根据权利要求16至19任一所述的方法，所述在所述发光器件远离所述衬底基板的一侧形成至少一个复合膜层，包括：
    在所述发光器件远离所述衬底基板的一侧依次形成多个所述复合膜层。
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