WO2020199518A1 - Panneau d'affichage et son procédé de fabrication - Google Patents

Panneau d'affichage et son procédé de fabrication Download PDF

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Publication number
WO2020199518A1
WO2020199518A1 PCT/CN2019/106377 CN2019106377W WO2020199518A1 WO 2020199518 A1 WO2020199518 A1 WO 2020199518A1 CN 2019106377 W CN2019106377 W CN 2019106377W WO 2020199518 A1 WO2020199518 A1 WO 2020199518A1
Authority
WO
WIPO (PCT)
Prior art keywords
area
display panel
array substrate
frame area
flexible film
Prior art date
Application number
PCT/CN2019/106377
Other languages
English (en)
Chinese (zh)
Inventor
程薇
Original Assignee
武汉华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电技术有限公司 filed Critical 武汉华星光电技术有限公司
Publication of WO2020199518A1 publication Critical patent/WO2020199518A1/fr

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00

Definitions

  • This application relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof.
  • LCD Liquid Crystal Display
  • AMOLED Active Matrix Light Emitting Display
  • the side bonding technology binds the flip chip film 40 to the side surfaces of the array substrate 10 and the color film substrate 20, and the output pins on the flip chip film 40 are connected to the metal wires on the array substrate 10.
  • 12 Contacting in the direction of the thickness of the metal wire 12 (about 3000 angstroms) to reduce the lower frame is an effective way to achieve a narrow frame.
  • the traditional side bonding technology is due to the low-temperature polysilicon (Low Temperature Poly Silicon (LTPS) requires high resolution, fine line width, and high precision. When side bonding is used, there is a risk of poor contact and bonding failure.
  • LTPS Low Temperature Poly Silicon
  • the purpose of the present application is to provide a display panel and a manufacturing method thereof.
  • the display panel has no frame and has a high binding yield between the flexible film and the display panel.
  • a display panel comprising:
  • An array substrate the array substrate has a display area and a frame area surrounding the periphery of the display area, the frame area is provided with a binding area, the array substrate has a gap, and the gap is provided in the frame area , The gap and the binding area are arranged side by side along the length direction of the same side of the frame area;
  • a flexible film the flexible film being bound to the binding area and passing through the gap to be bent to a side of the array substrate away from the display area.
  • the first plane of the notch close to the binding area is an arc-shaped surface.
  • the flexible film includes an input portion and a main body connected to the input portion, and the input portion is bound to the binding area and passes through the gap so that the main body is located in the The side of the array substrate away from the display area.
  • the length of the notch along the width direction of the frame area is greater than the length of the input portion of the flexible film bound on the array substrate along the width direction of the frame area.
  • the display panel further includes a sealant and a color filter substrate, the color filter substrate is disposed opposite to the array substrate, and the sealant is located in the frame area and located at all sides of the binding area.
  • the sealant connects the color filter substrate and the array substrate.
  • the ratio of the length of the notch along the width direction of the frame area to the width of the frame area ranges from 1/6 to 1/5.
  • the flexible film is a chip on film or a flexible printed circuit board.
  • the notch is a rectangular notch.
  • a manufacturing method of a display panel includes the following steps:
  • the array substrate having a display area and a frame area surrounding the periphery of the display area, and a binding area is provided in the frame area;
  • the gap is disposed in the frame area, and the gap and the binding area are arranged side by side along the length direction of the same side of the frame area;
  • the flexible film is bound to the binding area and passes through the gap to be bent to a side of the array substrate away from the display area.
  • the first plane of the notch close to the binding area is an arc-shaped surface.
  • the binding the flexible film to the binding area and passing through the gap to bend to the side of the array substrate away from the display area includes the following steps:
  • the input portion is bound to the binding area and passes through the gap so that the main body portion is located on the side of the array substrate away from the display area, and the flexible film includes the input portion and the input portion The main part of the connection.
  • the length of the notch in the width direction of the frame area is greater than the length of the input portion of the flexible film bound on the array substrate in the width direction of the frame area.
  • the manufacturing method further includes the following steps:
  • the color filter substrate is placed on the sealant so that the color filter substrate is opposite to the array substrate.
  • the ratio of the length of the notch along the width direction of the frame area to the width of the frame area ranges from 1/6 to 1/5.
  • the flexible film is a chip on film or a flexible printed circuit board.
  • the notch is a rectangular notch.
  • the present application provides a display panel and a manufacturing method thereof.
  • the gap and the binding area are arranged side by side along the length direction of the same side of the frame area, and the flexible film is bound to the binding area And through the gap to bend to the back of the display panel, the display panel is frameless, and the bonding yield of the flexible film and the array substrate is improved.
  • FIG. 1 is a schematic diagram of the flip chip film being bound to the side of the display panel in the conventional technology
  • FIG. 2 is a schematic diagram of a first structure of a display panel according to an embodiment of the application.
  • FIG. 3 is a top view of the array substrate of the display panel shown in FIG. 2;
  • FIG. 4 is a schematic diagram of a flexible film on the array substrate shown in FIG. 3;
  • FIG. 5 is a schematic diagram of a second structure of a display panel according to an embodiment of the application.
  • FIG. 6 is a flowchart of a manufacturing method of a display panel according to an embodiment of the application.
  • FIG. 2 is a schematic diagram of the first structure of the display panel according to the embodiment of the application.
  • FIG. 3 is a top view of the array substrate of the display panel shown in FIG. 2, and
  • FIG. 4 is the array shown in FIG. Schematic diagram of the flexible film on the substrate.
  • the display panel includes an array substrate 10, a color filter substrate 20, a sealant 30 and a flexible film 40.
  • the array substrate 10 has a display area 100b and a frame area 100a surrounding the periphery of the display area 100b.
  • the display area 100b is provided with scan lines and data lines, and a pixel unit is provided in an area where two adjacent scan lines and two adjacent data lines intersect vertically, and the pixel unit includes a thin film transistor.
  • the frame area 100 a is a rectangular ring-shaped area, and the frame area 100 a is used for coating the sealant 30 to connect the array substrate 10 and the color filter substrate 20.
  • the border area 100a is provided with a bonding area 100a', the data line and peripheral wiring extend to the bonding area 100a', and the bonding area 100a' is provided with an input pin 11, and the gate control signal is output to Peripheral wiring, the peripheral wiring transmits it to the scan driving circuit (not shown), the scan driving circuit outputs a scan signal to control the turn-on of the thin film transistor; the data signal is input through the input pin 11 and is transmitted to the data line, and the data line passes through the film The transistor writes the data signal into the pixel unit.
  • the array substrate 10 has a notch 100c.
  • the notch 100c is disposed in the frame area 100a.
  • the notch 100c and the binding area 100a' are arranged side by side along the length direction of the same side of the frame area 100a (including the length direction of the long side and the length direction of the short side of the frame area). .
  • the notch 100c and the binding area 100a' are both arranged side by side along the same side with the short length of the frame area 100a. It can be understood that the notch 100c and the binding area 100a' can both be arranged side by side along the same side of the frame area 100a.
  • the ratio of the length d1 of the notch 100c along the width direction of the frame area 100a to the width d2 of the frame area 100a ranges from 1/6 to 1/5.
  • the notch 100c is a rectangular notch, and the ratio of the length d1 of the notch 100c in the width direction of the border area 100a to the width d2 of the border area 100a is 1/5, so that the peripheral wiring extends to the inclined section of the binding area 100a' and the data line extends to the binding
  • the fan-shaped traces in the fixed area have enough wiring space in the width direction of the frame area 100a.
  • the flexible film 40 may be a chip on film or a flexible printed circuit board.
  • the flexible film 40 includes an input part 41 and a main body 42 connected to the input part 41.
  • the input part 41 is bound to the binding area 100a' and passes through the gap 100c so that the main body 42 is located on the side of the array substrate 10 away from the display area 100b .
  • the side of the input portion 41 away from the display area 100b is located in the binding area 100a', or flush with the edge of the array substrate 10, that is, the side of the input portion 41 away from the display 100b The edge will not be located outside the edge of the array substrate 10.
  • the main body 42 After the main body 42 is bent to the back of the array substrate 10, the main body 42 will not extend beyond the edge of the array substrate 10, so that the display panel is frameless. Specifically, the length of the notch 100c in the width direction of the frame area 100a is greater than the length of the input portion 41 of the flexible film 40 bound on the array substrate 10 in the width direction of the frame area 100a.
  • the flexible film 40 further includes a driving chip 43 which is disposed on the main body 42.
  • the sealant 30 is located in the frame area 100a and on the flexible film 40 in the binding area 100a'.
  • the sealant 30 is connected to the color filter substrate 20 and the array substrate 10.
  • the sealant 30 is an insulating gel.
  • FIG. 5 is a schematic diagram of the second structure of the display panel according to the embodiment of the application, which is basically similar to the display panel shown in FIG. 2, except that the first plane 101 where the notch 100c is close to the binding area 100a' is Curved surface, so that the bending radian of the input portion 41 is slowly changed during the bending process, so as to prevent the circuit on the input portion 41 from being broken due to bending.
  • the display panel of the embodiment of the present application provides a binding area and a gap in the frame area of the array substrate.
  • the binding area and the gap are arranged side by side along the length direction of the same side of the frame area.
  • the flexible film is bound to the binding area and passes through the gap to bend. Folding to the back of the display panel makes the display panel frameless and improves the bonding yield of the flexible film and the array substrate.
  • FIG. 6 is a flowchart of a manufacturing method of a display panel according to an embodiment of the application.
  • the manufacturing method of the display panel includes the following steps:
  • S10 Provide an array substrate and a flexible film.
  • the array substrate has a display area and a frame area surrounding the periphery of the display area, and a binding area is arranged in the frame area.
  • the flexible film includes an input part and a main body connected to the input part.
  • a gap is formed in the frame area of the array substrate.
  • a notch is formed by cutting and digging a hole on the array substrate, the notch is arranged in the frame area, and the notch and the binding area are arranged side by side along the length direction of the same side of the frame area.
  • S12 bind the flexible film to the binding area and pass through the gap to be bent to the side of the array substrate away from the display.
  • the input part is bound to the binding area and passes through the gap so that the main body part is located on the side of the array substrate away from the display area.
  • the first plane of the notch close to the binding area is an arc-shaped surface so that the bending curvature of the input part is slowly changed during the bending process, so as to avoid the circuit on the input part from being broken due to bending.
  • the manufacturing method further includes the following steps: forming sealant on the frame area and the flexible film in the frame area, and disposing the color filter substrate on the rubber frame so that the color filter substrate and the array substrate are disposed oppositely. After the color film substrate and the array substrate are assembled, the assembly of the flexible film is completed, including the installation of a driver chip and other devices on the main body of the flexible film.
  • the ratio of the length of the gap in the width direction of the frame to the width of the frame ranges from 1/6 to 1/5, so that the peripheral wiring extends to the inclined section of the binding area 100a' and the data line extends to the binding area
  • the fan-shaped traces have sufficient wiring space in the width direction of the frame area 100a.
  • the manufacturing method of the display panel of the embodiment of the present application provides a binding area and a gap in the frame area of the array substrate.
  • the gap and the binding area are arranged side by side along the length direction of the same side of the frame area.
  • the flexible film is bound to the binding area and passes through the gap.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)

Abstract

La présente invention concerne un panneau d'affichage et son procédé de fabrication. Une zone de cadre (100a) d'un substrat de matrice (10) est pourvue d'une zone de liaison (100a') et d'une encoche (100c), l'encoche (100c) et la zone de liaison (100a') sont disposées côte à côte dans la direction de la longueur du même côté de la zone de cadre (100a) et un film mince flexible (40) est lié à la zone de liaison (100a') et passe à travers l'encoche (100c) de façon à être courbé vers une face arrière d'un panneau d'affichage, de telle sorte que le rendement de liaison entre le film mince flexible (40) et le substrat de réseau (10) est amélioré tandis que le panneau d'affichage est exempt de cadre.
PCT/CN2019/106377 2019-03-29 2019-09-18 Panneau d'affichage et son procédé de fabrication WO2020199518A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910249194.1 2019-03-29
CN201910249194.1A CN110109297B (zh) 2019-03-29 2019-03-29 显示面板及其制造方法

Publications (1)

Publication Number Publication Date
WO2020199518A1 true WO2020199518A1 (fr) 2020-10-08

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WO (1) WO2020199518A1 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110109297B (zh) * 2019-03-29 2021-06-22 武汉华星光电技术有限公司 显示面板及其制造方法
CN110673409B (zh) * 2019-09-11 2020-11-24 深圳市华星光电技术有限公司 液晶显示模组
WO2021227031A1 (fr) * 2020-05-15 2021-11-18 京东方科技集团股份有限公司 Panneau d'affichage, son procédé de commande, et dispositif d'affichage
CN111584518B (zh) * 2020-05-15 2022-07-12 武汉华星光电技术有限公司 阵列基板和其制作方法，显示面板
CN111591549A (zh) * 2020-05-25 2020-08-28 惠州市华星光电技术有限公司 显示面板的包装箱
CN113257143A (zh) * 2021-03-29 2021-08-13 北海惠科光电技术有限公司 一种显示面板、显示装置和显示面板的制造方法
CN113534516A (zh) * 2021-06-16 2021-10-22 北海惠科光电技术有限公司 阵列基板、显示装置及显示装置的制作方法

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