WO2020199122A1 - 触控基板、触控屏和电子装置 - Google Patents

触控基板、触控屏和电子装置 Download PDF

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Publication number
WO2020199122A1
WO2020199122A1 PCT/CN2019/081013 CN2019081013W WO2020199122A1 WO 2020199122 A1 WO2020199122 A1 WO 2020199122A1 CN 2019081013 W CN2019081013 W CN 2019081013W WO 2020199122 A1 WO2020199122 A1 WO 2020199122A1
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WO
WIPO (PCT)
Prior art keywords
wiring
touch
substrate
protection part
protection
Prior art date
Application number
PCT/CN2019/081013
Other languages
English (en)
French (fr)
Inventor
吴建君
李泽文
罗鸿强
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/767,882 priority Critical patent/US11237682B2/en
Priority to PCT/CN2019/081013 priority patent/WO2020199122A1/zh
Priority to CN201980000456.9A priority patent/CN110462567B/zh
Publication of WO2020199122A1 publication Critical patent/WO2020199122A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04107—Shielding in digitiser, i.e. guard or shielding arrangements, mostly for capacitive touchscreens, e.g. driven shields, driven grounds
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present disclosure relates to the field of touch technology, and in particular, to a touch substrate, a touch screen and an electronic device including the touch substrate.
  • touch panel Touch Panel
  • Capacitive touch screens have attracted more and more attention due to their precise and sensitive positioning, good touch feel and long service life.
  • the embodiments of the present disclosure provide a touch substrate, a touch screen, and an electronic device, which can ensure a sufficient electrostatic discharge (ESD) protection capability while realizing a narrow frame design.
  • ESD electrostatic discharge
  • a touch substrate including: a base substrate, which includes a first surface and a second surface opposite to each other; and a touch component, which is disposed on the first surface of the base substrate And an electrostatic discharge protection device, which is arranged outside the touch control assembly.
  • the electrostatic discharge protection device includes: a first protection part disposed on the first surface of the base substrate; a second protection part disposed in a different layer from the first protection part; and a connection part , Which connects the first protection part and the second protection part.
  • the second protection part may be provided on the second surface of the base substrate, and the connection part may be connected to the base substrate via a first via hole provided in the base substrate. The first protection part and the second protection part.
  • the first protection part may include a first opening
  • the second protection part may include a second opening
  • both the first protection part and the second protection part may be linear, and the line width of the second protection part may be greater than the line width of the first protection part.
  • the touch control assembly may include a plurality of first electrodes and a plurality of second electrodes that are arranged crosswise.
  • the first electrode may include a plurality of first sub-electrodes
  • the second electrode may include a plurality of second sub-electrodes.
  • a connecting bridge structure may be formed at the intersection of the first electrode and the second electrode.
  • the connecting bridge structure may include: a first connecting portion connecting two adjacent first sub-electrodes; an insulating layer provided on the first connecting portion; and an insulating layer provided on the insulating layer ⁇ second connection part.
  • the second connection part may be connected to two adjacent second sub-electrodes via a second via hole provided in the insulating layer.
  • the touch substrate may further include bonding pads.
  • the first electrode may be connected to the bonding pad via a first wiring provided on the first surface of the base substrate
  • the second electrode may be connected to the bonding pad via a first wiring provided on the first surface of the base substrate.
  • the second wiring on the upper side is connected to the bonding pad.
  • the electrostatic discharge protection device may surround the first wiring and the second wiring, and the electrostatic discharge protection device may be grounded via the bonding pad.
  • the touch substrate may further include a protective wiring, which has a linear shape and is disposed on the first surface of the base substrate to surround the touch component, the first wiring, and the The second wiring is arranged between the touch control assembly, the first wiring and the second wiring and the first protection part of the electrostatic discharge protection device.
  • the protection wiring may be connected to the bonding pad and may include a third opening.
  • the electrostatic discharge protection device may be linear, and the line width of the electrostatic discharge protection device may be two times the line width of at least one of the first wiring and the second wiring. Times or more.
  • the line width of the first wiring and the second wiring may be 4 ⁇ m to 6 ⁇ m.
  • the second protection part may be formed as a grounded metal layer with an opening on the second surface of the base substrate, and the second protection part may be formed on the first surface of the base substrate.
  • the orthographic projection on the surface may cover the gap between the first wiring, the gap between the second wiring, and the gap between the first wiring and the second wiring.
  • the cutting margin for forming the touch substrate may be 100 ⁇ m or less.
  • a touch screen which includes the touch substrate according to the present disclosure.
  • the touch screen may further include a display panel, and the touch substrate may be disposed on the light emitting side of the display panel.
  • the display panel may be an OLED display panel.
  • the OLED display panel may include: a flexible substrate; an OLED device provided on the flexible substrate; and an encapsulation film layer.
  • the touch substrate may be disposed on the packaging film layer.
  • an electronic device including the touch screen according to the present disclosure.
  • Fig. 1 shows a top view of a touch substrate to illustrate the ESD protection system
  • Figure 2 shows a cross-sectional view taken along the line AA' of Figure 1;
  • FIG. 3 shows a cross-sectional view of a touch substrate according to an embodiment of the present disclosure
  • Fig. 4 shows a bottom view of a touch substrate according to an embodiment of the present disclosure
  • FIG. 5 shows a top view of a touch substrate according to an embodiment of the present disclosure
  • Figure 6 shows a cross-sectional view taken along the line BB' of Figure 5;
  • FIG. 7 shows a bottom view of a touch substrate according to an embodiment of the present disclosure.
  • FIG. 8 shows a cross-sectional view of a touch substrate according to an embodiment of the present disclosure.
  • first, second, etc. may be used herein to describe multiple elements, components, regions, layers and/or parts, these elements, components, regions, layers and/or parts should not be limited by these terms . These terms are only used to distinguish one element, component, region, layer or section from another region, layer or section. Therefore, without departing from the concept of the present invention, the first element, the first component, the first region, the first layer or the first part discussed below may be referred to as the second element, the second component, the second region, and the first part. Second floor or second part, and vice versa.
  • the width of the left and right frames of the display screen is expected to be 0.5 mm or less.
  • the key factor restricting the further reduction of the frame of the touch screen is the cutting margin used to form the touch substrate.
  • the cutting margin of the traditional scheme requires 300 ⁇ m, which includes the ESD safety distance.
  • the cutting margin using laser cutting technology can be reduced to 100 ⁇ m, but the risk of ESD is great, especially for touch substrates with very fine metal traces (for example, 5 ⁇ m line width) and conductive bridge structure , After encountering ESD, it is easy to cause bridge point damage and trace open circuit.
  • the existing display screens with a narrow frame design especially in a three-dimensional display screen, there is a problem of light leakage at the edge of the screen.
  • FIG. 1 shows a top view of the touch substrate for explaining the ESD protection system
  • FIG. 2 shows a cross-sectional view taken along the line AA′ of FIG. 1.
  • the touch substrate includes a base substrate 110, a touch assembly 120, an electrostatic discharge (ESD) protection device 130 and a bonding pad 160.
  • the touch component 120 is disposed on the base substrate 110 and is provided with a first electrode 121 and a second electrode 122.
  • the first electrode 121 may be a driving electrode for receiving a driving signal through the first wiring 151
  • the second electrode 122 may be a sensing electrode for providing a sensing signal through the second wiring 152.
  • the first electrode 121 is connected to the bonding pad 160 via the first wiring 151
  • the second electrode 122 is connected to the bonding pad 160 via the second wiring 152.
  • the first electrode 121 includes a plurality of first sub-electrodes 1210
  • the second electrode 122 includes a plurality of second sub-electrodes 1220.
  • a connecting bridge structure 140 is formed at the intersection of the first electrode 121 and the second electrode 122. As shown in FIG. 2, the connecting bridge structure 140 includes a first connecting portion 141 connecting two adjacent first sub-electrodes, an insulating layer 142 disposed on the first connecting portion 141, and a second connecting portion 142 disposed on the insulating layer 142. ⁇ 143.
  • the second connection portion 143 is connected to two adjacent second sub-electrodes 1220 via a via 142_1 provided in the insulating layer 142.
  • the ESD protection device 130 is disposed on the surface of the base substrate 110 where the touch component 120 is disposed, and surrounds the touch component 120, the first wiring 152, and the second wiring 152.
  • the ESD protection device is grounded via the bonding pad 160, and the ESD protection device 130 includes an opening OP1 to form an ESD discharge channel.
  • the first wiring 151 and the second wiring 152 may be extremely thin metal traces, and the line width of the first wiring 151 and the second wiring 152 may be in the range of 4 ⁇ m to 6 ⁇ m, for example, the first wiring 151 and the second wiring 152
  • the line width can be about 5 ⁇ m.
  • the line width of the ESD protection device 130 may be twice or more the line width of the first wiring 151 and the second wiring 152.
  • a cutting margin D is maintained between the ESD protection device 130 and the edge of the base substrate 110.
  • the cutting margin D is about 300 ⁇ m, which includes the ESD safety distance.
  • the touch substrate shown in FIG. 1 can withstand an ESD impact of about 10KV.
  • the use of laser cutting technology can reduce the cutting margin to about 100 ⁇ m, but will lead to a greater risk of ESD, especially for extremely thin metal traces (for example, the first wiring 151 and the second wiring 152) and conductive bridge structure
  • the touch substrate for example, the connecting bridge structure 140
  • the embodiments of the present disclosure provide a touch substrate, which can ensure the provision of sufficient ESD protection capability while realizing a narrow frame design (ie, reducing the safety distance of ESD).
  • the touch substrate according to the embodiment of the present disclosure is designed for a narrow frame, which can effectively prevent light leakage at the edge of the screen.
  • FIG. 3 shows a cross-sectional view of the touch substrate according to the disclosed embodiment
  • FIG. 4 shows a bottom view of the touch substrate according to the disclosed embodiment.
  • the touch substrate according to the disclosed embodiment includes the ESD protection device 130 ′.
  • the touch substrate includes: a base substrate 110, which includes a first surface 110s1 and a second surface 110s2 opposite to each other; a touch component 120, which is disposed on On the first surface 110s1 of the base substrate 110; and the ESD protection device 130', which is disposed outside the touch component 120.
  • the ESD protection device 130' includes a first protection part 131 disposed on the first surface 110s1 of the base substrate 110, a second protection part 133 disposed on the second surface 110s2 of the base substrate 110, and The via hole 110_1 provided in the base substrate 110 connects the connection portion 132 of the first protection portion 131 and the second protection portion 133.
  • the present disclosure is not limited to this.
  • the first protection part 131 may be disposed on the first surface 110s1 of the base substrate 110
  • the second protection part 133 may be disposed on a different layer from the first protection part 131.
  • the connection portion 132 only needs to be able to connect the first protection portion 131 and the second protection portion 133.
  • the ESD protection device may include two or more protection parts respectively provided in different layers, and each protection part may be connected via a connection part.
  • two elements "disposed in different layers" means that the two elements are disposed on different sides of the same film layer, or the two elements may be formed by different patterning processes.
  • the first protection part 131 may include a first opening OP1 (see FIG. 1), and the second protection part 133 may include a second opening OP2 (see FIG. 4).
  • the line width of the second protection part 133 may be greater than the line width of the first protection part 131.
  • the line width of the ESD protection device is the smaller one of the line width of the first protection part and the line width of the second protection part.
  • the line width of the ESD protection device 130 ′ is the line width of the first protection portion 131.
  • the line width of the ESD protection device 130' may be twice or more the line width of at least one of the first wiring 151 and the second wiring 152.
  • the first wiring 151 and the second wiring 152 may be extremely thin metal traces, and the line width of the first wiring 151 and the second wiring 152 may be in the range of 4 ⁇ m to 6 ⁇ m, for example, the first wiring 151 and the second wiring 152
  • the line width can be about 5 ⁇ m.
  • the first protection portion 131 and the second protection portion 133 of the ESD protection device 130' may surround the first wiring 151 and the second wiring 152, and the ESD protection device 130' may be connected via bonding pads. 160 is grounded.
  • the present disclosure is not limited to this, and the ESD protection device may not completely surround (or only partially surround) the touch component 120 and the first wiring 151 and the second wiring 152.
  • a cutting margin D1 is maintained between the ESD protection device 130' and the edge of the base substrate 110.
  • the cutting margin D1 may be about 100 ⁇ m.
  • the equivalent conductive area of the ESD protection device is increased without changing the structure of the touch substrate, and the ESD protection capability is greatly improved.
  • a touch substrate with a conductive bridge structure can withstand an ESD impact above 15KV.
  • the cutting margin is reduced and the line width of the ESD protection device can be further reduced, it is beneficial to the need for narrow frame design and does not cause ESD defects.
  • FIG. 5 shows a top view of a touch substrate according to an embodiment of the present disclosure
  • FIG. 6 shows a cross-sectional view taken along the line BB′ of FIG. 5.
  • the touch substrate according to the embodiments shown in FIGS. 5 and 6 may further include a protective wiring 170.
  • the protection wiring 170 may be provided on the first surface 110s1 of the base substrate 110 to surround the touch assembly 120, the first wiring 151, and the second wiring 152, and the protection wiring 170 may be provided on the touch assembly 120. Between the first wiring 151 and the second wiring 152 and the first protection portion 131 of the ESD protection device 130'.
  • the protection wiring 170 may be connected to the bonding pad 160 and may include a third opening OP3.
  • the protection wiring 170 can further improve the ESD protection capability.
  • FIG. 7 shows a bottom view of the touch substrate according to an embodiment of the present disclosure
  • FIG. 8 shows a cross-sectional view of the touch substrate according to the disclosed embodiment.
  • the ESD protection device 130" of the touch substrate includes being disposed on the first surface 110s1 of the base substrate 110
  • the first protection part 131, the second protection part 133' disposed on the second surface 110s2 of the base substrate 110, and the first protection part 131 and the second protection part 131 and the second protection part through the via 110_1 disposed in the base substrate 110
  • the connecting portion 132 of the part 133' is formed on the second surface 110s2 of the base substrate 110 as a full-circle grounded metal layer with openings.
  • the base substrate 110 can be formed by printing, coating, etching, etc.
  • the second protective part 133' is formed on the second surface 110s2 of the base substrate 110, and the process is simple and easy.
  • the orthographic projection of the second protective part 133' on the first surface 110s1 of the base substrate 110 can cover the gap between the first wirings 151 And the gap between the second wiring 152 to prevent the light L reflected by the edge of the display panel and the optical adhesive from being transmitted through the gap between the first wiring 151 and the gap between the second wiring 152, thereby preventing the screen Light leakage at the edge.
  • the touch substrate of the embodiment of the present disclosure without changing its existing structure, by adding a protection device for electrostatic discharge on the back of the base substrate, the ESD protection capability of the touch substrate is increased.
  • the use of the touch substrate according to the disclosed embodiment of the present disclosure is beneficial to the narrow frame design of the touch screen.
  • the touch substrate according to the embodiment of the present disclosure is designed for a narrow frame, which can effectively prevent light leakage at the edge of the screen.
  • the embodiments of the present disclosure also provide a touch screen, which includes the touch substrate according to the embodiments of the present disclosure.
  • the touch screen may further include a display panel, and the touch substrate according to the embodiments of the present disclosure may be arranged on the light-emitting side of the display panel, that is, the structure is formed directly on the substrate on the light-emitting side of the display panel.
  • the first protection part 131 of the ESD protection device is formed on the surface of the substrate on the light-emitting side of the display panel on which the first electrode 121, the second electrode 122, the first wiring 151, and the second wiring 152 are formed.
  • the second protection part 133 of the ESD protection device is formed on the opposite surface, and a via is formed in the substrate to form a connection part 132 connecting the first protection part 131 and the second protection part 133.
  • the display panel may be an Organic Light-Emitting Diode (OLED) display panel.
  • OLED Organic Light-Emitting Diode
  • the present disclosure is not limited to this, and the display panel may also be a liquid crystal display (LCD) panel, a Quantum Dot Light-Emitting Diode (QLED) panel, etc.
  • LCD liquid crystal display
  • QLED Quantum Dot Light-Emitting Diode
  • the array substrate in the OLED display panel may include a thin film transistor (TFT), an anode electrically connected to the drain of the TFT, and a cathode and an organic material functional layer.
  • the organic material functional layer includes at least a light-emitting layer, and may further include an electron transport layer and a hole transport layer.
  • it can also include an electron injection layer disposed between the cathode and the electron transport layer, and a hole injection layer disposed between the anode and the hole transport layer .
  • the OLED display panel may also include an encapsulation layer, which may be a thin film encapsulation or a substrate encapsulation.
  • an OLED display panel may include a flexible substrate, an OLED device disposed on the flexible substrate, and an encapsulation film layer.
  • the touch substrate according to various embodiments of the present disclosure may be disposed on the packaging film layer, that is, the first electrode 121, the second electrode 122, the first wiring 151, and the second wiring that constitute the touch substrate are directly formed on the packaging film layer. 152.
  • the first protection portion 131 of the ESD protection device is formed on the surface of the packaging film layer on which the first electrode 121, the second electrode 122, the first wiring 151, and the second wiring 152 are formed, and on the surface opposite to the surface
  • the second protection part 133 of the ESD protection device is formed, and a via is formed in the packaging film layer to form a connection part 132 connecting the first protection part 131 and the second protection part 133. Therefore, the touch screen may be a flexible touch screen.
  • the substrate (or film layer) for forming the touch substrate of the touch screen is added for electrostatic discharge.
  • the protection device increases the ESD protection capability of the touch substrate.
  • the use of the touch screen according to the embodiment of the present disclosure facilitates a narrow frame design.
  • the narrow frame design can effectively prevent the problem of light leakage at the edge of the screen.
  • the embodiments of the present disclosure also provide an electronic device including the touch screen according to the embodiments of the present disclosure.
  • Electronic devices may include (but are not limited to): personal computers (PCs), notebook computers, netbooks, personal digital assistants (PDAs), smart phones, wireless phones, mobile phones, wearable smart devices, e-books, portable multimedia players ( PMP), portable game consoles, navigation devices, televisions, digital audio recorders, digital audio players, digital picture recorders, digital picture players, digital video recorders, digital video players, etc.
  • PCs personal computers
  • PDAs personal digital assistants
  • PMP portable multimedia players
  • navigation devices televisions, digital audio recorders, digital audio players, digital picture recorders, digital picture players, digital video recorders, digital video players, etc.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Elimination Of Static Electricity (AREA)
  • Position Input By Displaying (AREA)

Abstract

本公开提供了一种触控基板，包括：衬底基板，其包括彼此相对的第一表面和第二表面；触控组件，其设置在所述衬底基板的第一表面上；以及静电释放保护装置，其设置在所述触控组件外侧。所述静电释放保护装置包括：第一保护部，其设置在所述衬底基板的第一表面上；第二保护部，其与所述第一保护部设置在不同的层中；以及连接部，其连接所述第一保护部和所述第二保护部。本公开还提供了一种触控屏和一种电子装置。

Description

触控基板、触控屏和电子装置 技术领域
本公开涉及触控技术领域，具体地，涉及一种触控基板以及包括触控基板的触控屏和电子装置。
背景技术
随着显示技术的发展，触控屏(Touch Panel)技术进入快速发展的时期。由于电容式触控屏具有定位精确灵敏、触摸手感好以及使用寿命长等特点，因此越来越多的受到关注。
发明内容
本公开的实施例提供一种触控基板、触控屏和电子装置，在实现窄边框设计的同时，确保提供足够的静电释放(Electro-Static Discharge，ESD)防护能力。
根据本公开的一个方面，提供一种触控基板，包括：衬底基板，其包括彼此相对的第一表面和第二表面；触控组件，其设置在所述衬底基板的第一表面上；以及静电释放保护装置，其设置在所述触控组件外侧。所述静电释放保护装置包括：第一保护部，其设置在所述衬底基板的第一表面上；第二保护部，其与所述第一保护部设置在不同的层中；以及连接部，其连接所述第一保护部和所述第二保护部。
根据本公开的实施例，所述第二保护部可以设置在所述衬底基板的第二表面上，并且所述连接部可以经由设置在所述衬底基板中的第一过孔连接所述第一保护部和所述第二保护部。
根据本公开的实施例，所述第一保护部可以包括第一开口，并且所述第二保护部可以包括第二开口。
根据本公开的实施例，所述第一保护部和所述第二保护部均可为线形，并且所述第二保护部的线宽可以大于所述第一保护部的线宽。
根据本公开的实施例，所述触控组件可以包括交叉设置的多个第一电极和多个第二电极。
根据本公开的实施例，所述第一电极可以包括多个第一子电极，并且所述第二电极可以包括多个第二子电极。在所述第一电极与所述第二电极的交叉位置处可以形成连接桥结构。
根据本公开的实施例，所述连接桥结构可以包括：连接相邻两个第一子电极的第一连接部；设置在所述第一连接部上的绝缘层；以及设置在所述绝缘层上的第二连接部。所述第二连接部可以经由设置在所述绝缘层中的第二过孔连接至相邻两个第二子电极。
根据本公开的实施例，所述触控基板还可以包括接合焊盘。所述第一电极可以经由设置在所述衬底基板的第一表面上的第一布线连接至所述接合焊盘，并且所述第二电极可以经由设置在所述衬底基板的第一表面上的第二布线连接至所述接合焊盘。
根据本公开的实施例，所述静电释放保护装置可以围绕所述第一布线和所述第二布线，并且所述静电释放保护装置可以经由所述接合焊盘接地。
根据本公开的实施例，所述触控基板还可以包括保护布线，其具有线形并且设置在所述衬底基板的第一表面上以围绕所述触控组件、所述第一布线和所述第二布线，并且设置在所述触控组件、所述第一布线和所述第二布线与所述静电释放保护装置的所述第一保护部之间。
根据本公开的实施例，所述保护布线可以连接至所述接合焊盘并且可以包括第三开口。
根据本公开的实施例，所述静电释放保护装置可以为线形，并且所述静电释放保护装置的线宽可以为所述第一布线和所述第二布线中的至少一者的线宽的两倍或更多。
根据本公开的实施例，所述第一布线和所述第二布线的线宽可以为4μm至6μm。
根据本公开的实施例，所述第二保护部在所述衬底基板的第二表面上可以形成为具有开口的接地金属层，并且所述第二保护部在所述衬底基板的第一表面上的正投影可以覆盖所述第一布线之间的间隙、所述第二布线之间的间隙以及所述第一布线和所述第二布线之间 的间隙。
根据本公开的实施例，用于形成所述触控基板的切割裕量可以为100μm或更小。
根据本公开的另一方面，提供一种触控屏，其包括根据本公开的触控基板。
根据本公开的实施例，所述触控屏还可以包括显示面板，并且所述触控基板可以设置在所述显示面板的出光侧。
根据本公开的实施例，所述显示面板可以为OLED显示面板。
根据本公开的实施例，所述OLED显示面板可以包括：柔性衬底；设置在所述柔性衬底上的OLED器件；以及封装膜层。所述触控基板可以设置在所述封装膜层上。
根据本公开的另一方面，提供一种电子装置，其包括根据本公开的触控屏。
附图说明
为了更清楚地说明本公开的实施例，下面将结合附图对本公开的实施例进行详细的描述。应当认识到，所描述的附图仅用于说明本公开的实施例，而非限制本公开的范围。在附图中：
图1示出了触控基板的俯视图，用于说明ESD防护系统；
图2示出了沿着图1的A-A'线截取的剖面图；
图3示出了根据本公开的实施例的触控基板的剖视图；
图4示出了根据本公开的实施例的触控基板的底视图；
图5示出了根据本公开的实施例的触控基板的俯视图；
图6示出了沿着图5的B-B'线截取的剖面图；
图7示出了根据本公开的实施例的触控基板的底视图；以及
图8示出了根据本公开的实施例的触控基板的剖视图。
具体实施方式
下文中，将参照附图更完全地描述本公开的各种示例实施例。然而，本公开可按照许多不同形式实现，并且不应被理解为限于本文 阐述的实施例。相反，提供这些实施例以使得本说明将是彻底和完整的，并且将把本公开的范围完全传达给本领域技术人员。在图中，为了清楚起见，可夸大层和区的大小和相对大小。
应该理解，当元件或层被称作“位于”另一元件或层“上方”、“位于”另一元件或层“之上”、“位于”另一元件或层“上”、“连接至”或“结合至”另一元件或层时，其可直接位于另一元件或层上方、直接位于另一元件或层之上、直接位于另一元件或层上、直接连接至或直接结合至另一元件或层，或者可存在中间元件或层。相反，当元件被称作“直接位于”另一元件或层“上方”、“直接位于”另一元件或层“之上”、“直接位于”另一元件或层“上”、“直接连接至”或“直接结合至”另一元件或层时，不存在中间元件或层。相同标号始终指代相同元件。如本文所用，术语“和/或”包括相关所列项之一或多个的任何和所有组合。
应该理解，虽然本文中可使用术语第一、第二等来描述多个元件、组件、区、层和/或部分，但是这些元件、组件、区、层和/或部分不应被这些术语限制。这些术语仅用于将一个元件、组件、区、层或部分与另一区、层或部分区分开。因此，在不脱离本发明构思的情况下，下面讨论的第一元件、第一组件、第一区、第一层或第一部分可被称作第二元件、第二组件、第二区、第二层或第二部分，反之亦然。
为了进一步提高屏占比实现全面屏，对显示屏的边框宽度提出了更加严苛的要求，例如，期望显示屏左右边框的宽度为0.5mm或更小。制约触控屏的边框进一步减小的关键因素就是用于形成触控基板的切割裕量(Cutting Margin)。
传统方案的切割裕量需要300μm，其中包括了ESD的安全距离。另一方面，采用激光切割技术方案的切割裕量可以减少至100μm，但ESD的风险极大，特别是对于具有极细金属迹线(例如，5μm线宽)和导电桥结构触控基板而言，遭遇ESD后极易造成桥点破坏及迹线开路。此外，在现有的窄边框设计的显示屏中，特别是在三维显示屏中，存在屏幕边缘的漏光问题。
图1示出了触控基板的俯视图，用于说明ESD防护系统，图2示出了沿着图1的A-A'线截取的剖面图。
参见图1和图2，触控基板包括衬底基板110、触控组件120、静电释放(ESD)保护装置130和接合焊盘160。触控组件120设置在衬底基板110上，并且设置有第一电极121和第二电极122。例如，第一电极121可以是用于通过第一布线151接收驱动信号的驱动电极，第二电极122可以是通过第二布线152提供感应信号的感应电极。第一电极121经由第一布线151连接至接合焊盘160，并且第二电极122经由第二布线152连接至接合焊盘160。
第一电极121包括多个第一子电极1210，并且第二电极122包括多个第二子电极1220。在第一电极121和第二电极122的交叉位置处形成连接桥结构140。如图2所示，连接桥结构140包括连接相邻两个第一子电极的第一连接部141，设置在第一连接部141上的绝缘层142和设置在绝缘层142上的第二连接部143。第二连接部143经由设置在绝缘层142中的过孔142_1连接至相邻两个第二子电极1220。
ESD保护装置130设置在衬底基板110的设置有触控组件120的表面上，并且围绕触控组件120、第一布线152和第二布线152。ESD保护装置经由接合焊盘160接地，并且ESD保护装置130包括开口OP1，以形成ESD泄放通道。第一布线151和第二布线152可以为极细的金属迹线，第一布线151和第二布线152的线宽可以在4μm至6μm的范围内，例如，第一布线151和第二布线152的线宽可以约为5μm。ESD保护装置130的线宽可以为第一布线151和第二布线152的线宽的两倍或更多。
ESD保护装置130与衬底基板110的边缘之间保持有切割裕量D。在相关技术中，切割裕量D约为300μm，其中包括了ESD的安全距离。图1所示的触控基板能够承受约10KV的ESD冲击。采用激光切割技术方案可以将切割裕量减少至约100μm，但会导致较大的ESD风险，特别是对于具有极细金属迹线(例如，第一布线151和第二布线152)和导电桥结构(例如，连接桥结构140)的触控基板而言， 遭遇ESD后极易造成桥点破坏及迹线开路。
此外，参见图2，对于窄边框的触控基板而言，由显示面板及光学粘合剂边缘反射的光L会从金属迹线之间的缝隙Ch中透射，造成屏幕边缘漏光。这种现象在三维显示屏中尤为严重。
本公开的实施例提供一种触控基板，在实现窄边框设计(即，ESD的安全距离减小)的同时，确保提供足够的ESD防护能力。此外，根据本公开的实施例的触控基板，针对窄边框设计，可以有效防止屏幕边缘的漏光问题。
图3示出了根据公开实施例的触控基板的剖视图，并且图4示出了根据公开实施例的触控基板的底视图。
在不改变触控基板结构的前提下，根据公开实施例的触控基板包括ESD保护装置130'。
参见图1、图3和图4，根据本公开的实施例的触控基板包括：衬底基板110，其包括彼此相对的第一表面110s1和第二表面110s2；触控组件120，其设置在衬底基板110的第一表面110s1上；以及ESD保护装置130'，其设置在触控组件120外侧。
参见图3，ESD保护装置130'包括设置在衬底基板110的第一表面110s1上的第一保护部131，设置在衬底基板110的第二表面110s2上的第二保护部133，以及经由设置在衬底基板110中的过孔110_1连接第一保护部131和第二保护部133的连接部132。然而本公开不限于此，根据本公开的实施例，第一保护部131可以设置在衬底基板110的第一表面110s1上，第二保护部133可以与第一保护部131设置在不同的层中，并且连接部132只要能够连接第一保护部131和第二保护部133即可。根据本公开的实施例，ESD保护装置可以包括分别设置在不同层的两个或更多个保护部，并且各保护部之间可以经由连接部连接。在本公开的上下文中，两个元件“设置在不同的层中”是指该两个元件设置在同一膜层的不同侧，或者该两个元件可以通过不同构图工艺形成。
根据本公开的实施例，第一保护部131可以包括第一开口OP1(参见图1)，并且第二保护部133可以包括第二开口OP2(参见图 4)。
根据本公开的实施例，第二保护部133的线宽可以大于第一保护部131的线宽。在本公开的上下文中，“ESD保护装置的线宽”为第一保护部的线宽和第二保护部的线宽两者中较小的一个。例如，如图3所示，ESD保护装置130'的线宽为第一保护部131的线宽。根据本公开的实施例，ESD保护装置130'的线宽可以为第一布线151和第二布线152中的至少一者的线宽的两倍或更多。第一布线151和第二布线152可以为极细的金属迹线，第一布线151和第二布线152的线宽可以在4μm至6μm的范围内，例如，第一布线151和第二布线152的线宽可以约为5μm。
类似于图1所示的技术方案，ESD保护装置130'的第一保护部131和第二保护部133可以围绕第一布线151和第二布线152，并且ESD保护装置130'可以经由接合焊盘160接地。然而本公开不限于此，ESD保护装置可以不完全围绕(或仅部分围绕)触控组件120以及第一布线151和第二布线152。
ESD保护装置130'与衬底基板110的边缘之间保持有切割裕量D1。根据本公的开实施例，切割裕量D1可以约为100μm。
根据本公开的实施例，在不改变触控基板结构的前提下，增加了ESD保护装置的等效导电面积，极大地提升了ESD防护能力。根据本公开的实施例，具有导电桥结构的触控基板能够承受15KV以上的ESD冲击。此外，由于减小了切割裕量，并且还可以进一步减小ESD保护装置的线宽，因而有利于窄边框设计的需要，并且不会造成ESD不良。
图5示出了根据本公开的实施例的触控基板的俯视图，并且图6示出了沿着图5的B-B'线截取的剖面图。
与参照图1、图3和图4描述的本公开的实施例相比，根据图5和图6所示实施例的触控基板还可以包括保护布线170。
参见图5和图6，保护布线170可以设置在衬底基板110的第一表面110s1上以围绕触控组件120、第一布线151和第二布线152，并且保护布线170可以设置在触控组件120、第一布线151和第二布 线152与ESD保护装置130'的第一保护部131之间。
根据本公开的实施例，保护布线170可以连接至接合焊盘160并且可以包括第三开口OP3。保护布线170可以进一步提高ESD防护能力。
图7示出了根据本公开的实施例的触控基板的底视图，并且图8示出了根据公开实施例的触控基板的剖视图。
与参考图5和图6描述的本公开的实施例相比，根据图7和图8所示实施例的触控基板的ESD保护装置130"包括设置在衬底基板110的第一表面110s1上的第一保护部131，设置在衬底基板110的第二表面110s2上的第二保护部133'，以及经由设置在衬底基板110中的过孔110_1连接第一保护部131和第二保护部133'的连接部132。第二保护部133'在衬底基板110的第二表面110s2上形成为具有开口的一整圈接地金属层。可以通过印刷、镀膜蚀刻等方式在衬底基板110的第二表面110s2上形成第二保护部133'，在工艺上简单易行。第二保护部133'在衬底基板110的第一表面110s1上的正投影可以覆盖第一布线151之间的间隙，以及第二布线152之间的间隙，以防止由显示面板及光学粘合剂边缘反射的光L通过第一布线151之间的间隙和第二布线152之间的间隙透射，从而防止屏幕边缘的漏光。
根据本公开的实施例的触控基板，在不改变其现有结构的前提下，通过在衬底基板背面增加用于静电释放的保护装置，增加了触控基板的ESD防护能力。此外，采用根据本公的开实施例的触控基板，有利于触控屏的窄边框设计。此外，根据本公开的实施例的触控基板，针对窄边框设计，可以有效防止屏幕边缘的漏光问题。
本公开的实施例还提供一种触控屏，其包括根据本公开各实施例的触控基板。
根据本公开的实施例，触控屏还可以包括显示面板，并且根据本公开各实施例的触控基板可以设置在显示面板的出光侧，即，直接在显示面板出光侧的衬底上形成构成触控基板的第一电极121、第二电极122、第一布线151和第二布线152。此外，在显示面板出光侧的衬底的形成有第一电极121、第二电极122、第一布线151和第二 布线152的表面上形成ESD保护装置的第一保护部131，在与该表面相对的表面上形成ESD保护装置的第二保护部133，并且在该衬底中形成过孔，以形成连接第一保护部131和第二保护部133的连接部132。
根据本公开的实施例，显示面板可以为有机电致发光二极管(Organic Light-Emitting Diode，OLED)显示面板。然而本公开不限于此，显示面板还可以是液晶显示(LCD)面板、量子点发光二极管(Quantum Dot Light-Emitting Diode，QLED)面板等。
当显示面板为OLED显示面板时，OLED显示面板中的阵列基板可以包括薄膜晶体管(Thin Film Transistor，TFT)、与TFT的漏极电连接的阳极以及包括阴极和有机材料功能层。有机材料功能层至少包括发光层，进一步还可以包括电子传输层和空穴传输层。在此基础上为了能够提高电子和空穴注入发光层的效率，还可以包括设置在阴极与电子传输层之间的电子注入层，以及设置在阳极与空穴传输层之间的空穴注入层。OLED显示面板还可以包括封装层，封装层可以是薄膜封装也可以是基板封装。
根据本公开的实施例，OLED显示面板可以包括柔性衬底、设置在柔性衬底上的OLED器件以及封装膜层。根据本公开各实施例的触控基板可以设置在封装膜层上，即，直接在封装薄膜层上形成构成触控基板的第一电极121、第二电极122、第一布线151和第二布线152。此外，在封装薄膜层的形成有第一电极121、第二电极122、第一布线151和第二布线152的表面上形成ESD保护装置的第一保护部131，在与该表面相对的表面上形成ESD保护装置的第二保护部133，并且在封装薄膜层中形成过孔，以形成连接第一保护部131和第二保护部133的连接部132。因此，触控屏可以为柔性触控屏。
根据本公开的实施例的触控屏，在不改变触控基板现有结构的前提下，通过在触控屏的用于形成触控基板的衬底(或膜层)背面增加用于静电释放的保护装置，增加了触控基板的ESD防护能力。此外，采用根据本公开的实施例的触控屏，有利于窄边框设计。此外，根据本公开的触控屏，针对窄边框设计，可以有效防止屏幕边缘的漏光问 题。
本公开的实施例还提供一种电子装置，其包括根据本公开各实施例的触控屏。电子装置可以包括(但不限于)：个人计算机(PC)、笔记本计算机、上网本、个人数字助理(PDA)、智能电话、无线电话、移动电话、可穿戴智能设备、电子书、便携式多媒体播放器(PMP)、便携式游戏机、导航装置、电视机、数字音频记录仪、数字音频播放器、数字图片记录仪、数字图片播放器、数字视频记录仪、数字视频播放器等。
虽然已经示出并描述了本公开的各实施例，但是本领域技术人员应当清楚的是，在不脱离本公开的精神和范围的情况下，可作出各种修改和改变。本公开的保护范围旨在涵盖所有这些修改和改变。

Claims (20)

  1. 一种触控基板，包括：
    衬底基板，其包括彼此相对的第一表面和第二表面；
    触控组件，其设置在所述衬底基板的第一表面上；以及
    静电释放保护装置，其设置在所述触控组件外侧，
    其中，所述静电释放保护装置包括：
    第一保护部，其设置在所述衬底基板的第一表面上；
    第二保护部，其与所述第一保护部设置在不同的层中；以及
    连接部，其连接所述第一保护部和所述第二保护部。
  2. 根据权利要求1所述的触控基板，其中，所述第二保护部设置在所述衬底基板的第二表面上，并且
    所述连接部经由设置在所述衬底基板中的第一过孔连接所述第一保护部和所述第二保护部。
  3. 根据权利要求1所述的触控基板，其中，所述第一保护部包括第一开口，并且所述第二保护部包括第二开口。
  4. 根据权利要求1所述的触控基板，其中，所述第一保护部和所述第二保护部均为线形，并且所述第二保护部的线宽大于所述第一保护部的线宽。
  5. 根据权利要求1所述的触控基板，其中，所述触控组件包括交叉设置的多个第一电极和多个第二电极。
  6. 根据权利要求5所述的触控基板，其中，所述第一电极包括多个第一子电极，并且所述第二电极包括多个第二子电极，并且
    其中，在所述第一电极与所述第二电极的交叉位置处形成连接 桥结构。
  7. 根据权利要求6所述的触控基板，其中，所述连接桥结构包括：
    连接相邻两个第一子电极的第一连接部；
    设置在所述第一连接部上的绝缘层；以及
    设置在所述绝缘层上的第二连接部，
    其中，所述第二连接部经由设置在所述绝缘层中的第二过孔连接至相邻两个第二子电极。
  8. 根据权利要求5所述的触控基板，还包括接合焊盘，
    其中，所述第一电极经由设置在所述衬底基板的第一表面上的第一布线连接至所述接合焊盘，并且所述第二电极经由设置在所述衬底基板的第一表面上的第二布线连接至所述接合焊盘。
  9. 根据权利要求8所述的触控基板，其中，所述静电释放保护装置围绕所述第一布线和所述第二布线，并且所述静电释放保护装置经由所述接合焊盘接地。
  10. 根据权利要求8所述的触控基板，还包括保护布线，其具有线形并且设置在所述衬底基板的第一表面上以围绕所述触控组件、所述第一布线和所述第二布线，并且设置在所述触控组件、所述第一布线和所述第二布线与所述静电释放保护装置的所述第一保护部之间。
  11. 根据权利要求10所述的触控基板，其中，所述保护布线连接至所述接合焊盘并且包括第三开口。
  12. 根据权利要求8所述的触控基板，其中，所述静电释放保护装置为线形，并且所述静电释放保护装置的线宽为所述第一布线和 所述第二布线中的至少一者的线宽的两倍或更多。
  13. 根据权利要求8所述的触控基板，其中，所述第一布线和所述第二布线的线宽为4μm至6μm。
  14. 根据权利要求8所述的触控基板，其中，所述第二保护部在所述衬底基板的第二表面上形成为具有开口的接地金属层，并且所述第二保护部在所述衬底基板的第一表面上的正投影覆盖所述第一布线之间的间隙、所述第二布线之间的间隙以及所述第一布线和所述第二布线之间的间隙。
  15. 根据权利要求1所述的触控基板，其中，用于形成所述触控基板的切割裕量为100μm或更小。
  16. 一种触控屏，包括根据权利要求1至15中任一项所述的触控基板。
  17. 根据权利要求16所述的触控屏，还包括显示面板，并且所述触控基板设置在所述显示面板的出光侧。
  18. 根据权利要求17所述的触控屏，其中，所述显示面板为OLED显示面板。
  19. 根据权利要求18所述的触控屏，其中，所述OLED显示面板包括：
    柔性衬底；
    设置在所述柔性衬底上的OLED器件；以及
    封装膜层，
    其中，所述触控基板设置在所述封装膜层上。
  20. 一种电子装置，包括根据权利要求16至19中任一项所述的触控屏。
PCT/CN2019/081013 2019-04-02 2019-04-02 触控基板、触控屏和电子装置 WO2020199122A1 (zh)

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