WO2020191893A1 - 一种显示面板及其制作方法、显示装置 - Google Patents

一种显示面板及其制作方法、显示装置 Download PDF

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Publication number
WO2020191893A1
WO2020191893A1 PCT/CN2019/086992 CN2019086992W WO2020191893A1 WO 2020191893 A1 WO2020191893 A1 WO 2020191893A1 CN 2019086992 W CN2019086992 W CN 2019086992W WO 2020191893 A1 WO2020191893 A1 WO 2020191893A1
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WIPO (PCT)
Prior art keywords
layer
touch
inorganic layer
line
inorganic
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Application number
PCT/CN2019/086992
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English (en)
French (fr)
Inventor
谢铭
Original Assignee
武汉华星光电半导体显示技术有限公司
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Priority to US16/622,003 priority Critical patent/US11164916B1/en
Publication of WO2020191893A1 publication Critical patent/WO2020191893A1/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H10K50/15—Hole transporting layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • This application relates to the technical field of display panels, and in particular to a display panel, a manufacturing method thereof, and a display device.
  • AMOLED Active-matrix Organic light emitting diode (active matrix organic light emitting diode) flexible display technology
  • Flexible display technology can change the shape of the display device, increase the flexibility and diversity of the display, and is widely used in fields such as full screens, bendable screens, and foldable screens.
  • the present application provides a display panel, a manufacturing method thereof, and a display device, so as to reduce the total thickness of the touch layer and the packaging layer, improve the bending performance of the display panel, and prevent the touch layer and the packaging layer from easily appearing film layers Cracks lead to the problem of failure of the flexible panel.
  • an embodiment of the present application provides a display panel, the display panel includes: a first inorganic layer; a touch circuit layer, the touch circuit layer is disposed on the first inorganic layer, the touch circuit layer includes mutually insulated
  • the first touch line and the second touch line are set, the first touch line extends along a first preset direction, the second touch line extends along a second preset direction, and the second touch line is in contact with the first The intersection of the touch line is disconnected; the second inorganic layer, the second inorganic layer is located on the first inorganic layer provided with the touch circuit layer, and the position on the second inorganic layer corresponding to the disconnection of the second touch line
  • the organic layer is provided with a first via hole; the organic layer is located on the second inorganic layer, and the organic layer is provided with a second via hole at a position corresponding to the first via hole; the bridge line is located in the organic layer Above, the bridge wire is electrically connected to the disconnection through the second via hole and
  • the display panel further includes a third inorganic layer, and the third inorganic layer is located on the organic layer provided with bridge wires.
  • the display panel further includes a substrate and an organic light emitting layer disposed on the substrate, and the first inorganic layer is disposed on the organic light emitting layer.
  • the shape of the touch circuit layer is grid-like.
  • the thickness of the touch circuit layer is smaller than the thickness of the second inorganic layer, and the thickness of the second inorganic layer is smaller than the thickness of the first inorganic layer.
  • the ratio of the total thickness of the first inorganic layer, the touch circuit layer and the second inorganic layer to the thickness of the organic layer is 0.3 to 0.6.
  • an embodiment of the present application also provides a method for manufacturing a display panel.
  • the method for manufacturing the display panel includes: providing a substrate; forming a first inorganic layer on the substrate; and forming a touch circuit on the first inorganic layer Layer, the touch circuit layer includes a first touch line and a second touch line insulated from each other, the first touch line extends along a first preset direction, and the second touch line extends along a second preset direction, and The second touch line is disconnected at the intersection with the first touch line; a second inorganic layer is formed on the first inorganic layer on which the touch line layer is formed; an organic layer is formed on the second inorganic layer; On the second inorganic layer, a first via hole is made at a position corresponding to the disconnection of the second touch line, and a second via hole is made on the organic layer at a position corresponding to the first via hole; in the organic layer A bridge line is formed on the upper side, and the bridge line is electrically
  • the step of forming a touch circuit layer on the first inorganic layer specifically includes: sputtering a metal layer on the first inorganic layer; etching the metal layer to obtain a patterned touch circuit layer.
  • the layer includes a first touch line and a second touch line that are insulated from each other. The first touch line extends along a first preset direction, the second touch line extends along a second preset direction, and the second touch line It is disconnected at the intersection with the first touch line.
  • the step of forming a bridge line on the organic layer specifically includes: filling a conductive material in the first via hole and the second via hole, and depositing a bridge line on the organic layer, the bridge line passing through the second via hole and The first through hole is electrically connected to the disconnection, so as to realize the electrical connection of the second touch wire at the intersection.
  • the method further includes: forming a third inorganic layer on the organic layer on which the bridge line is formed.
  • the shape of the touch circuit layer is grid-like.
  • the thickness of the touch circuit layer is smaller than the thickness of the second inorganic layer, and the thickness of the second inorganic layer is smaller than the thickness of the first inorganic layer.
  • the ratio of the total thickness of the first inorganic layer, the touch circuit layer and the second inorganic layer to the thickness of the organic layer is 0.3 to 0.6.
  • an embodiment of the present application also provides a display device, the display device includes a driving circuit and a display panel, the driving circuit is used to provide a driving voltage to the display panel, wherein the display panel includes: a first inorganic layer; A control circuit layer, the touch circuit layer is disposed on the first inorganic layer, the touch circuit layer includes a first touch line and a second touch line insulated from each other, the first touch line extends along a first predetermined direction, The second touch line extends along the second preset direction, and the second touch line is disconnected at the intersection with the first touch line; the second inorganic layer, the second inorganic layer is located on the first touch line layer On an inorganic layer, the second inorganic layer is provided with a first via hole at a position corresponding to the disconnection of the second touch line; the organic layer is located on the second inorganic layer, and the organic layer is connected to the first A second via is provided at the position corresponding to the via; the bridge line is located on the organic layer,
  • the display panel further includes a third inorganic layer, and the third inorganic layer is located on the organic layer provided with bridge wires.
  • the display panel further includes a substrate and an organic light emitting layer disposed on the substrate, and the first inorganic layer is disposed on the organic light emitting layer.
  • the display panel further includes a polarizer and a flexible cover, the polarizer is located on the third inorganic layer, and the flexible cover is located on the polarizer.
  • the shape of the touch circuit layer is grid-like.
  • the thickness of the touch circuit layer is smaller than the thickness of the second inorganic layer, and the thickness of the second inorganic layer is smaller than the thickness of the first inorganic layer.
  • the ratio of the total thickness of the first inorganic layer, the touch circuit layer and the second inorganic layer to the thickness of the organic layer is 0.3 to 0.6.
  • the beneficial effect of the present application is that, different from the prior art, the display panel provided by the present application can reduce the total amount of the touch layer and the packaging layer by disposing the touch circuit layer between the two inorganic layers of the film packaging structure.
  • the thickness improves the bending performance of the display panel, thereby avoiding the problem that the touch layer and the encapsulation layer are prone to film rupture and cause the flexible panel to fail.
  • FIG. 1 is a schematic structural diagram of a display panel provided by an embodiment of the present application.
  • FIG. 2 is a schematic top view of the structure of a first inorganic layer provided with a touch circuit layer in FIG. 1;
  • FIG. 3 is another schematic top view of the structure of the first inorganic layer provided with the touch circuit layer in FIG. 1;
  • FIG. 4 is another schematic diagram of the structure of the display panel provided by the embodiment of the present application.
  • FIG. 5 is a schematic flowchart of a manufacturing method of a display panel provided by an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of a display device provided by an embodiment of the present application.
  • the technical solution adopted in this application is to provide a display panel to reduce the total thickness of the touch layer and the packaging layer, improve the bending performance of the display panel, and prevent the touch layer and the packaging layer from easily appearing.
  • the film ruptures and causes the problem of failure of the flexible panel.
  • FIG. 1 is a schematic structural diagram of a display panel provided by an embodiment of the present application
  • FIG. 2 is a schematic structural diagram of a first inorganic layer provided with a touch circuit layer in FIG.
  • the display panel 100 includes a first inorganic layer 101, a touch circuit layer 102, a second inorganic layer 103, an organic layer 104 and a bridge 105 that are sequentially stacked and arranged.
  • the touch circuit layer 102 is disposed on the first inorganic layer 101.
  • the touch circuit layer 102 includes a first touch wire 1021 and a second touch wire 1022 that are insulated from each other.
  • the first touch wire 1021 runs along the first predetermined Assuming that the direction extends, the second touch line 1022 extends along the second preset direction, and the second touch line 1022 is broken at the intersection A with the first touch line 1021.
  • the second inorganic layer 103 is located on the first inorganic layer 101 provided with the touch line layer 102, and a first via hole is provided on the second inorganic layer 103 at a position corresponding to the break C of the second touch line 1022 1031.
  • the organic layer 104 is located on the second inorganic layer 103, and a second via hole 1041 is provided on the organic layer 104 at a position corresponding to the first via hole 1031.
  • the bridging wire 105 is located on the organic layer 104, and the bridging wire 105 is electrically connected to the disconnection C through the second via 1041 and the first via 1031, so as to realize the electrical connection of the second touch wire 1022 at the intersection A.
  • the material of the first inorganic layer 101 and the second inorganic layer 103 can be one of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, tantalum nitride, titanium oxide, aluminum oxynitride, silicon oxynitride, or Many kinds.
  • the material of the first touch wire 1021 and the second touch wire 1022 can be metal materials with good bending properties such as titanium alloy, nano silver wire, etc., or can be transparent conductive metal oxides such as indium zinc oxide and indium tin oxide.
  • the material of the organic layer 104 may be one of epoxy resin, acrylic resin, polyimide resin, polyethylene naphthalate, and polyethylene terephthalate.
  • the material of the bridge wire 105 can be the same as the material of the first touch wire 1021 or the second touch wire 1022.
  • the dashed frame in FIG. 2 is only used to illustrate the intersection area A between the second touch line 1022 and the first touch line 1021.
  • the shape of the touch circuit layer 102 may be grid-like.
  • the first touch line 1021 may extend in the vertical direction
  • the second touch line 1022 may be in the horizontal direction. Extend and disconnect the intersection where the first touch line 1021 and the second touch line 1022 are connected, so that the first touch line 1021 and the second touch line 1022 are insulated from each other.
  • the material of the touch circuit layer 102 is generally metal or metal oxide, it will react with the organic matter in the organic encapsulation layer, and after the organic encapsulation layer absorbs water and oxygen, the organic encapsulation layer affects the touch circuit
  • the damage to the structure of the layer 102 is more obvious, and the touch circuit layer 102 is disposed between two inorganic layers. Since the inorganic layer has high water and oxygen barrier capability and chemical stability, the touch circuit layer 102 is disposed between the two inorganic layers of the thin film encapsulation layer to ensure the touch performance of the display panel.
  • disposing the touch circuit layer 102 between the two inorganic layers of the film encapsulation layer can reduce the thickness of the touch screen panel and the optical tape on the film encapsulation layer in the prior art, making the display panel thinner and more conducive to Bend.
  • the touch line layer 102 includes a first touch line 1021 and a second touch line 1022, and the first touch line 1021 and the second touch line 1022 are insulated in the same layer.
  • one of the first touch line 1021 and the second touch line 1022 corresponds to a touch driving electrode, and the other corresponds to a touch sensing electrode.
  • the arrangement of the two in the same layer can reduce the touch resistance, and thus Improve touch signal strength.
  • the second touch wire 1022 is disconnected at the intersection A of the first touch wire 1021, and the electrical connection of the second touch wire 1022 at the intersection A is realized through the bridge wire 105 and the interlayer via hole.
  • the bridging line 105 may be located between the second inorganic layer 103 and the organic layer 104, but the water vapor generated when the organic layer 104 is produced by inkjet printing on the second inorganic layer 103 provided with the bridging line 105 The bridging line 105 causes corrosion and affects the touch performance.
  • the bridging line 105 may be disposed on the second inorganic layer 103 and another inorganic layer may be disposed on the second inorganic layer 103 provided with the bridging line 105, so as to protect the bridge line in the production process of the organic layer 104. 105 corrosion, but this will increase the thickness of the inorganic packaging layer and affect the packaging effect and packaging life of the thin film packaging layer. Therefore, in this embodiment, in order to take into account the touch performance and packaging effect of the display panel, the bridge line 105 is arranged on the organic layer 104, and the bridge line 105 passes through the second via hole 1041 and the second via hole 1041 on the organic layer 104 in sequence. The first via 1031 on the two inorganic layers 103 is connected to the disconnection C of the second touch wire 1022.
  • the manufacturing process of the first via 1031 and the second via 1041 is after the manufacturing process of the organic layer 103.
  • the organic layer 104 and the second inorganic layer 103 need to be dug out after the organic layer 104 is completely dried to avoid the inkjet printing of the organic layer.
  • the water vapor generated by 104 corrodes the touch circuit layer 102, thereby ensuring the touch performance of the display panel.
  • the thickness of the touch circuit layer 102 is smaller than the thickness of the second inorganic layer 103, and the thickness of the second inorganic layer 103 is smaller than the thickness of the first inorganic layer 101.
  • the thickness of the touch circuit layer 102 may be 0.5 ⁇ 0.7 ⁇ m
  • the thickness of the first inorganic layer 101 can be 2 ⁇ 4 ⁇ m
  • the thickness of the second inorganic layer 103 can be 0.5 ⁇ 1.5 ⁇ m, so as to prevent the touch circuit layer in the thin film packaging structure from affecting the packaging of the thin film packaging structure effect.
  • the ratio of the total thickness of the first inorganic layer 101, the touch circuit layer 102 and the second inorganic layer 103 to the thickness of the organic layer 104 can be controlled to be 0.3 ⁇ 0.6.
  • the thickness of the first inorganic layer 101 may be 3 ⁇ m
  • the thickness of the touch circuit layer 102 may be 0.7 ⁇ m
  • the thickness of the second inorganic layer 103 may be 1 ⁇ m
  • the thickness of the organic layer 104 may be 10 ⁇ m.
  • the display panel 100 further includes a third inorganic layer 106, and the third inorganic layer 106 is located on the organic layer 104 provided with the bridge 105 to protect the bridge 105 from water. Oxygen corrodes, thereby ensuring the touch performance of the display panel.
  • the display panel 100 may further include a substrate 107 and an organic light-emitting layer 108 disposed on the substrate 107, and the first inorganic layer 101 is disposed on the organic light-emitting layer 108.
  • the first inorganic layer 101, the second inorganic layer 103, the organic layer 104, and the third inorganic layer 105 on the organic light-emitting layer 108 jointly constitute a thin-film encapsulation structure to protect the organic light-emitting layer 108 from being corroded by water and oxygen, thereby improving The stability of the display panel extends the life of the display panel.
  • a multilayer structure in which an inorganic encapsulation layer and an organic encapsulation layer are alternately arranged can be added to more effectively block water. Oxygen invades the organic light emitting layer 108.
  • the encapsulation layer closest to the organic light-emitting layer 108 and the encapsulation layer farthest are both inorganic encapsulation layers.
  • the display panel 100 may further include a polarizer 109 and a flexible cover plate 110, the polarizer 109 is located on the third inorganic layer 106, and the flexible cover plate 110 is located on the polarizer 109.
  • the display panel of this embodiment by disposing the touch circuit layer between the two inorganic layers of the film packaging structure, the total thickness of the touch layer and the packaging layer can be reduced, and the display panel’s performance can be improved.
  • the bending performance can avoid the problem that the touch layer and the encapsulation layer are prone to film rupture and cause the flexible panel to fail.
  • FIG. 5 is a schematic flowchart of a manufacturing method of a display panel provided by an embodiment of the present application.
  • the manufacturing method of the display panel includes the following steps:
  • the substrate is a flexible TFT substrate with a base
  • the material of the base can be one of organic polymers such as polyimide, polycarbonate, polyethylene terephthalate, and polyethersulfone substrate.
  • the material of the first inorganic layer may be one or more of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, tantalum nitride, titanium oxide, aluminum oxynitride, and silicon oxynitride.
  • a silicon nitride layer is deposited on the substrate by atomic layer deposition or chemical vapor deposition process, and the thickness of the silicon nitride layer may be 3 ⁇ m.
  • a touch circuit layer is formed on the first inorganic layer.
  • the touch circuit layer includes a first touch wire and a second touch wire that are insulated from each other.
  • the first touch wire extends along a first preset direction
  • the second The touch line extends along the second preset direction
  • the second touch line is disconnected at the intersection with the first touch line.
  • S53 may include the following sub-steps:
  • Substep A Sputtering a metal layer on the first inorganic layer.
  • the metal layer can be a metal material with good bending properties such as titanium alloy and nano silver wire, or can be a transparent conductive metal oxide such as indium zinc oxide and indium tin oxide.
  • a physical vapor deposition process is used to sputter a Ti/Al/Ti metal layer on the first inorganic layer.
  • the thickness of the Ti/Al/Ti metal layer corresponds to 0.05 ⁇ m/0.6 ⁇ m/0.05 ⁇ m, that is, the thickness of the metal layer is 0.7 ⁇ m.
  • Sub-step B etch the metal layer to obtain a patterned touch circuit layer.
  • the touch circuit layer includes a first touch line and a second touch line insulated from each other.
  • the first touch line runs along the first The predetermined direction extends, the second touch line extends along the second predetermined direction, and the second touch line is disconnected at the intersection with the first touch line.
  • the shape of the touch circuit layer may be grid-like.
  • the first touch line may extend in the vertical direction
  • the second touch line may extend in the horizontal direction
  • the first touch line and the second touch line are preset. The connecting intersection of the two touch wires is disconnected so that the first touch wire and the second touch wire are insulated from each other.
  • the material of the second inorganic layer can be one or more of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, tantalum nitride, titanium oxide, aluminum oxynitride, and silicon oxynitride.
  • a silicon nitride layer is deposited on the first inorganic layer by an atomic layer deposition or chemical vapor deposition process, and the thickness of the silicon nitride layer may be 1 ⁇ m.
  • the material of the touch circuit layer is generally metal or metal oxide, it will react with the organic matter in the organic encapsulation layer, and after the organic encapsulation layer absorbs water and oxygen, the organic encapsulation layer interacts with the touch circuit layer.
  • the touch circuit layer is arranged between two inorganic layers. Since the inorganic layer has high water and oxygen barrier capacity and chemical stability, the touch circuit layer is arranged between the two inorganic layers of the thin film encapsulation layer to ensure the touch performance of the display panel.
  • disposing the touch circuit layer between the two inorganic layers of the thin film packaging layer can reduce the thickness of the touch screen panel and the optical tape provided on the thin film packaging layer in the prior art, making the display panel thinner and more conducive to bending. fold.
  • the touch line layer includes a first touch line and a second touch line, and the first touch line and the second touch line are insulated in the same layer.
  • one of the first touch line and the second touch line corresponds to the touch drive electrode, and the other corresponds to the touch sensing electrode.
  • the arrangement of the two in the same layer can reduce the touch resistance and thereby improve the touch. Control signal strength.
  • S55 An organic layer is formed on the second inorganic layer.
  • the material of the organic layer can be one of epoxy resin, polymethyl methacrylate, acrylic resin, polyimide resin, polyethylene naphthalate, and polyethylene terephthalate .
  • a polymethyl methacrylate film layer is formed on the second inorganic layer, and the thickness of the polymethyl methacrylate film layer may be 10 ⁇ m.
  • the thickness of the touch circuit layer is smaller than the thickness of the second inorganic layer, and the thickness of the second inorganic layer is smaller than the thickness of the first inorganic layer.
  • the thickness of the touch circuit layer may be 0.5 to 0.7 ⁇ m.
  • the thickness of one inorganic layer may be 2 to 4 ⁇ m, and the thickness of the second inorganic layer may be 0.5 to 1.5 ⁇ m, so as to avoid that the touch circuit layer provided in the thin film packaging structure will affect the packaging effect of the thin film packaging structure.
  • the ratio of the total thickness of the first inorganic layer, the touch circuit layer, and the second inorganic layer to the thickness of the organic layer can be controlled to be 0.3 to 0.6.
  • S56 is executed to prevent the water vapor generated by the ink-jet printing process from corroding the touch circuit layer, thereby ensuring the touch performance of the display panel.
  • laser etching can be used to make a first via hole on the second inorganic layer at a position corresponding to the disconnection of the second touch line, and on the organic layer A second via hole is made at a position corresponding to the first via hole.
  • the exposed edge width of the second touch line may be 5 ⁇ m.
  • S57 may specifically include: filling the first via hole and the second via hole with a conductive material, and depositing a bridge line on the organic layer, and the bridge line is disconnected through the second via hole and the first via hole. Electrical connection at the intersection to achieve electrical connection of the second touch line at the intersection.
  • the conductive material can be indium tin oxide, aluminum, copper, silver and other materials with low resistivity.
  • the material of the bridge wire can be a metal material with good bending properties such as titanium alloy and nano silver wire, or it can be an oxide. Transparent conductive metal oxides such as indium zinc and indium tin oxide.
  • a third inorganic layer is formed on the organic layer on which the bridge wires are formed.
  • the material of the third inorganic layer may be one or more of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, tantalum nitride, titanium oxide, aluminum oxynitride, and silicon oxynitride.
  • a silicon nitride layer is deposited on the organic layer formed with the bridge wires by atomic layer deposition or chemical vapor deposition process, and the thickness of the silicon nitride layer may be 1 ⁇ m.
  • the third inorganic layer covers the wire bridge, which can protect the wire from being corroded by water and oxygen, thereby ensuring the touch performance of the display panel.
  • the third inorganic layer and the above-mentioned first inorganic layer, second inorganic layer and organic layer jointly constitute the thin film encapsulation structure of the display panel to protect the organic light-emitting material in the display panel from being corroded by water and oxygen, thereby improving the stability of the display panel. It can extend the life of the display panel.
  • the manufacturing method of the display panel in this embodiment can reduce the total thickness of the touch layer and the encapsulation layer by arranging the touch circuit layer between the two inorganic layers of the film encapsulation structure, and improve The bending performance of the display panel further avoids the problem that the touch layer and the encapsulation layer are prone to film rupture and cause the flexible panel to fail.
  • an embodiment of the present application also provides a display device.
  • the display device 60 includes a driving circuit and any one of the above-mentioned display panels 61, wherein the driving circuit is used to provide a driving voltage to the display panel 61.
  • the display panel 61 includes a first inorganic layer, a touch circuit layer, a second inorganic layer, an organic layer, and bridge wires that are sequentially stacked.
  • the touch circuit layer is disposed on the first inorganic layer.
  • the touch circuit layer includes a first touch wire and a second touch wire that are insulated from each other.
  • the first touch wire extends along a first predetermined direction
  • the second touch wire The touch line extends along the second preset direction, and the second touch line is disconnected at the intersection with the first touch line.
  • the second inorganic layer is located on the first inorganic layer provided with the touch circuit layer, and a first via hole is provided on the second inorganic layer at a position corresponding to the disconnection of the second touch line.
  • the organic layer is located on the second inorganic layer, and a second via hole is provided on the organic layer at a position corresponding to the first via hole.
  • the bridging wire is located on the organic layer, and the bridging wire is electrically connected to the disconnection through the second via hole and the first via hole, so as to realize the electrical connection of the second touch wire at the intersection.
  • the display device of this embodiment by disposing the touch circuit layer between the two inorganic layers of the film packaging structure, the total thickness of the touch layer and the packaging layer can be reduced, and the display panel's performance can be improved.
  • the bending performance can avoid the problem that the touch layer and the encapsulation layer are prone to film rupture and cause the flexible panel to fail.

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Abstract

本申请涉及一种显示面板，包括依次层叠设置的第一无机层、触控线路层、第二无机层、有机层和搭桥线，触控线路层包括第一和第二触控线，且第二触控线在与第一触控线的交叉处断开，第二无机层上设有第一导通孔，有机层上设有第二导通孔，搭桥线经第二导通孔和第一导通孔与断开处电连接，以实现第二触控线在交叉处的电连接。

Description

一种显示面板及其制作方法、显示装置 技术领域
本申请涉及显示面板技术领域，具体涉及一种显示面板及其制作方法、显示装置。
 背景技术
近几年，AMOLED（Active-matrix organic light emitting diode，有源矩阵有机发光二极体）柔性显示技术引起了人们的极大关注。柔性显示技术可以改变显示器件的形状，能够增加显示的灵活性和多样性，被广泛应用于全面屏、可弯折屏、以及可折叠屏等领域。
但是，可弯曲或可折叠的柔性面板在进行多次连续弯折后，由于位于OLED器件上的触控层和封装层的总厚度较大，在触控层和封装层易出现膜层破裂进而导致柔性面板失效的问题。
 技术问题
本申请提供了一种显示面板及其制作方法、以及显示装置，以减小触控层和封装层的总厚度，提高显示面板的弯折性能，进而避免触控层和封装层易出现膜层破裂进而导致柔性面板失效的问题。
 技术解决方案
为了解决上述问题，本申请实施例提供了一种显示面板，该显示面板包括：第一无机层；触控线路层，触控线路层设置于第一无机层上，触控线路层包括互相绝缘设置的第一触控线和第二触控线，第一触控线沿第一预设方向延伸，第二触控线沿第二预设方向延伸，且第二触控线在与第一触控线的交叉处断开；第二无机层，第二无机层位于设置有触控线路层的第一无机层上，第二无机层上与第二触控线的断开处对应的位置处设有第一导通孔；有机层，有机层位于第二无机层上，有机层上与第一导通孔对应的位置处设有第二导通孔；搭桥线，搭桥线位于有机层上，搭桥线经第二导通孔和第一导通孔与断开处电连接，以实现第二触控线在交叉处的电连接。
其中，显示面板还包括第三无机层，第三无机层位于设置有搭桥线的有机层上。
其中，显示面板还包括基板、以及设置于基板上的有机发光层，第一无机层设置于有机发光层上。
其中，触控线路层的形状为网格状。
其中，触控线路层的厚度小于第二无机层的厚度，第二无机层的厚度小于第一无机层的厚度。
其中，第一无机层、触控线路层和第二无机层的总厚度与有机层的厚度之比为0.3~0.6。
为了解决上述问题，本申请实施例还提供了一种显示面板的制作方法，该显示面板的制作方法包括：提供基体；在基板上形成第一无机层；在第一无机层上形成触控线路层，触控线路层包括互相绝缘设置的第一触控线和第二触控线，第一触控线沿第一预设方向延伸，第二触控线沿第二预设方向延伸，且第二触控线在与第一触控线的交叉区处断开；在形成有触控线路层的第一无机层上形成第二无机层；在第二无机层上形成有机层；在第二无机层上与第二触控线的断开处对应的位置处制作第一导通孔，并在有机层上与第一导通孔对应的位置处制作第二导通孔；在有机层上形成搭桥线，搭桥线经第二导通孔和第一导通孔与断开处电连接，以实现第二触控线在交叉处的电连接。
其中，在第一无机层上形成触控线路层的步骤，具体包括：在第一无机层上溅射金属层；对金属层进行刻蚀，以得到图形化的触控线路层，触控线路层包括互相绝缘设置的第一触控线和第二触控线，第一触控线沿第一预设方向延伸，第二触控线沿第二预设方向延伸，且第二触控线在与第一触控线的交叉区处断开。
其中，在有机层上形成搭桥线的步骤，具体包括：在第一导通孔和第二导通孔内填充导电材料，并在有机层上沉积搭桥线，搭桥线经第二导通孔和第一导通孔与断开处电连接，以实现第二触控线在交叉处的电连接。
其中，在有机层上形成搭桥线的步骤之后，还包括：在形成有搭桥线的有机层上形成第三无机层。
其中，触控线路层的形状为网格状。
其中，触控线路层的厚度小于第二无机层的厚度，第二无机层的厚度小于第一无机层的厚度。
其中，第一无机层、触控线路层和第二无机层的总厚度与有机层的厚度之比为0.3~0.6。
为了解决上述问题，本申请实施例还提供了一种显示装置，该显示装置包括驱动电路和显示面板，驱动电路用于向显示面板提供驱动电压，其中，显示面板包括：第一无机层；触控线路层，触控线路层设置于第一无机层上，触控线路层包括互相绝缘设置的第一触控线和第二触控线，第一触控线沿第一预设方向延伸，第二触控线沿第二预设方向延伸，且第二触控线在与第一触控线的交叉处断开；第二无机层，第二无机层位于设置有触控线路层的第一无机层上，第二无机层上与第二触控线的断开处对应的位置处设有第一导通孔；有机层，有机层位于第二无机层上，有机层上与第一导通孔对应的位置处设有第二导通孔；搭桥线，搭桥线位于有机层上，搭桥线经第二导通孔和第一导通孔与断开处电连接，以实现第二触控线在交叉处的电连接。
其中，显示面板还包括第三无机层，第三无机层位于设置有搭桥线的有机层上。
其中，显示面板还包括基板、以及设置于基板上的有机发光层，第一无机层设置于有机发光层上。
其中，显示面板还包括偏光片和柔性盖板，偏光片位于第三无机层上，柔性盖板位于偏光片上。
其中，触控线路层的形状为网格状。
其中，触控线路层的厚度小于第二无机层的厚度，第二无机层的厚度小于第一无机层的厚度。
其中，第一无机层、触控线路层和第二无机层的总厚度与有机层的厚度之比为0.3~0.6。
 有益效果
本申请的有益效果是：区别于现有技术，本申请提供的显示面板，通过将触控线路层设置在薄膜封装结构的两层无机层之间，能够减小触控层和封装层的总厚度，提高显示面板的弯折性能，进而避免触控层和封装层易出现膜层破裂进而导致柔性面板失效的问题。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例提供的显示面板的结构示意图；
图2是图1中设置有触控线路层的第一无机层的俯视结构示意图；
图3是图1中设置有触控线路层的第一无机层的另一俯视结构示意图；
图4是本申请实施例提供的显示面板的另一结构示意图；
图5是本申请实施例提供的显示面板的制作方法的流程示意图；
图6是本申请实施例提供的显示装置的结构示意图。
 本发明的实施方式
下面结合附图和实施例，对本申请作进一步地详细描述。特别指出的是，以下实施例仅用于说明本申请，但不对本申请的范围进行限定。同样的，以下实施例仅为本申请的部分实施例而非全部实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其它实施例，都属于本申请保护的范围。
目前，可弯曲或可折叠的柔性面板在进行多次连续弯折后，由于位于OLED器件上的触控层和封装层的总厚度较大，在触控层和封装层易出现膜层破裂进而导致柔性面板失效的问题。为了解决上述技术问题，本申请采用的技术方案是提供一种显示面板，以减小触控层和封装层的总厚度，提高显示面板的弯折性能，进而避免触控层和封装层易出现膜层破裂进而导致柔性面板失效的问题。
请参阅图1和图2，图1是本申请实施例提供的显示面板的结构示意图，图2是图1中设置有触控线路层的第一无机层的结构示意图。如图1和图2所示，该显示面板100包括依次层叠设置的第一无机层101、触控线路层102、第二无机层103、有机层104和搭桥线105。
其中，触控线路层102设置于第一无机层101上，触控线路层102包括互相绝缘设置的第一触控线1021和第二触控线1022，第一触控线1021沿第一预设方向延伸，第二触控线1022沿第二预设方向延伸，且第二触控线1022在与第一触控线1021的交叉处A断开。第二无机层103位于设置有触控线路层102的第一无机层101上，第二无机层103上与第二触控线1022的断开处C对应的位置处设有第一导通孔1031。有机层104位于第二无机层103上，有机层104上与第一导通孔1031对应的位置处设有第二导通孔1041。搭桥线105位于有机层104上，搭桥线105经第二导通孔1041和第一导通孔1031与断开处C电连接，以实现第二触控线1022在交叉处A的电连接。
第一无机层101和第二无机层103的材质可以为氮化硅、氮化铝、氮化锆、氮化钛、氮化钽、氧化钛、氮氧化铝、氮氧化硅中的一种或多种。第一触控线1021和第二触控线1022的材质可以为钛合金、纳米银线等具有良好弯折性能的金属材料，也可以为氧化铟锌、氧化铟锡等透明导电金属氧化物。有机层104的材质可以为环氧树脂、丙烯醛基树脂、聚酰亚胺树脂、聚萘二甲酸乙二醇酯、聚对苯二甲酸乙二醇酯中的一种。搭桥线105的材质可以与第一触控线1021或第二触控线1022的材质相同。
值得注意的是，图2中的虚线框仅用于说明第二触控线1022与第一触控线1021的交叉区A。在一个实施例中，如图3所示，触控线路层102的形状可以为网格状，例如，第一触控线1021可以沿竖直方向延伸，第二触控线1022可以沿水平方向延伸，并将预设第一触控线1021和第二触控线1022连接的交叉处断开以使第一触控线1021和第二触控线1022相互绝缘设置。
在本实施例中，考虑到触控线路层102的材质一般为金属或金属氧化物，会与有机封装层中的有机物发生反应，且在有机封装层吸收水氧后有机封装层对触控线路层102结构的破坏更加明显，而将触控线路层102设置在两个无机层之间。由于无机层具有高水氧阻隔能力和化学稳定性，将触控线路层102设置在薄膜封装层的两个无机层之间，能够保证显示面板的触控性能。并且，将触控线路层102设置在薄膜封装层的两个无机层之间，能够减少现有技术中在薄膜封装层上设置触控屏面板和光学胶带的厚度，使得显示面板更薄更利于弯折。
在本实施例中，触控线路层102包括第一触控线1021和第二触控线1022，且第一触控线1021和第二触控线1022同层绝缘设置。在实际使用时，第一触控线1021和第二触控线1022中的一个对应为触控驱动电极，另一个则对应为触控感应电极，二者同层设置能够降低触控阻抗，进而提高触控信号强度。
具体地，第二触控线1022在于第一触控线1021的交叉处A断开，且通过搭桥线105和层间导通孔实现第二触控线1022在交叉处A的电连接。在一些实施例中，搭桥线105可以位于第二无机层103和有机层104之间，但在设置有搭桥线105的第二无机层103上喷墨打印制作有机层104时产生的水汽会对搭桥线105造成腐蚀，影响触控性能。在另一些实施例中，可以将搭桥线105设置于第二无机层103上并在设置有搭桥线105的第二无机层103上设置另一无机层，以保护有机层104制作工序对搭桥线105的腐蚀，但这会增加无机封装层的厚度，影响薄膜封装层的封装效果和封装寿命。因此，在本实施例中，为了兼顾显示面板的触控性能和封装效果，将搭桥线105设置在有机层104上，且搭桥线105依次经有机层104上的第二导通孔1041和第二无机层103上的第一导通孔1031连接于第二触控线1022的断开处C。
值得注意的是，第一导通孔1031和第二导通孔1041的制作工序在有机层103的制作工序之后。具体地，在第二无机层103上喷墨打印形成有机层104后，需待有机层104完全干燥后再在有机层104和第二无机层103上挖孔，以避免喷墨打印制作有机层104产生的水汽腐蚀触控线路层102，进而保证显示面板的触控性能。
在一个实施例中，触控线路层102的厚度小于第二无机层103的厚度，第二无机层103的厚度小于第一无机层101的厚度，例如，触控线路层102的厚度可以为0.5~0.7μm，第一无机层101的厚度可以为2~4μm，第二无机层103的厚度可以为0.5~1.5μm，以避免在薄膜封装结构内设置触控线路层会影响薄膜封装结构的封装效果。
进一步地，为了兼顾薄膜封装结构的水氧阻隔能力和弯曲性能，可以控制第一无机层101、触控线路层102和第二无机层103的总厚度与有机层104的厚度之比为0.3~0.6。例如，第一无机层101的厚度可以为3μm，触控线路层102的厚度可以为0.7μm，第二无机层103的厚度可以为1μm，有机层104的厚度可以为10μm。
在一个具体实施例中，如图4所述，显示面板100还包括第三无机层106，第三无机层106位于设置有搭桥线105的有机层104上，以保护搭线桥105不被水氧侵蚀，进而保证显示面板的触控性能。
具体地，请继续参阅图4，显示面板100还可以包括基板107、以及设置于基板107上的有机发光层108，第一无机层101设置于有机发光层108上。其中，位于有机发光层108上的第一无机层101、第二无机层103、有机层104、第三无机层105共同构成薄膜封装结构，以保护有机发光层108不被水氧侵蚀，进而提高显示面板的稳定性，延长显示面板的寿命。
在一些实施例中，在有机发光层108和第一无机层11之间或在第三无机层106上，还可以增加无机封装层和有机封装层交替设置的多层结构，以更加有效地阻隔水氧侵入有机发光层108。并且，具体实施时，距离有机发光层108最近的封装层和最远的封装层均为无机封装层。
继续参阅图4，显示面板100还可以包括偏光片109和柔性盖板110，偏光片109位于第三无机层106上，柔性盖板110位于偏光片109上。
区别于现有技术，本实施例中的显示面板，通过将触控线路层设置在薄膜封装结构的两层无机层之间，能够减小触控层和封装层的总厚度，提高显示面板的弯折性能，进而避免触控层和封装层易出现膜层破裂进而导致柔性面板失效的问题。
请参阅图5，图5是本申请实施例提供的显示面板的制作方法的流程示意图。该显示面板的制作方法包括以下步骤：
S51：提供基板。
基板为带有基底的柔性TFT基板，基底的材质可以为聚酰亚胺、聚碳酸酯、聚对苯二甲酸乙二醇酯、聚醚砜基板等有机聚合物中的一种。
S52：在基板上形成第一无机层。
第一无机层的材质可以为氮化硅、氮化铝、氮化锆、氮化钛、氮化钽、氧化钛、氮氧化铝、氮氧化硅中的一种或多种。
例如，通过原子层沉积或者化学气相沉积工艺，在基板上沉积一氮化硅层，该氮化硅层的厚度可以为3μm。
S53：在第一无机层上形成触控线路层，触控线路层包括互相绝缘设置的第一触控线和第二触控线，第一触控线沿第一预设方向延伸，第二触控线沿第二预设方向延伸，且第二触控线在与第一触控线的交叉区处断开。
具体地，S53可以包括以下子步骤：
子步骤A：在第一无机层上溅射金属层。
金属层可以为钛合金、纳米银线等具有良好弯折性能的金属材料，也可以为氧化铟锌、氧化铟锡等透明导电金属氧化物。
例如，利用物理气相沉积工艺，在第一无机层上溅射Ti/Al/Ti金属层。其中，Ti/Al/Ti金属层的厚度对应为0.05μm/0.6μm/0.05μm，也即金属层的厚度为0.7μm。
子步骤B：对金属层进行刻蚀，以得到图形化的触控线路层，触控线路层包括互相绝缘设置的第一触控线和第二触控线，第一触控线沿第一预设方向延伸，第二触控线沿第二预设方向延伸，且第二触控线在与第一触控线的交叉区处断开。
其中，触控线路层的形状可以为网格状，例如，第一触控线可以沿竖直方向延伸，第二触控线可以沿水平方向延伸，并将预设第一触控线和第二触控线连接的交叉处断开以使第一触控线和第二触控线相互绝缘设置。
S54：在形成有触控线路层的第一无机层上形成第二无机层。
第二无机层的材质可以为氮化硅、氮化铝、氮化锆、氮化钛、氮化钽、氧化钛、氮氧化铝、氮氧化硅中的一种或多种。
例如，通过原子层沉积或者化学气相沉积工艺，在第一无机层上沉积一氮化硅层，该氮化硅层的厚度可以为1μm。
在本实施例中，考虑到触控线路层的材质一般为金属或金属氧化物，会与有机封装层中的有机物发生反应，且在有机封装层吸收水氧后有机封装层对触控线路层结构的破坏更加明显，而将触控线路层设置在两个无机层之间。由于无机层具有高水氧阻隔能力和化学稳定性，将触控线路层设置在薄膜封装层的两个无机层之间，能够保证显示面板的触控性能。并且，将触控线路层设置在薄膜封装层的两个无机层之间，能够减少现有技术中在薄膜封装层上设置触控屏面板和光学胶带的厚度，使得显示面板更薄更利于弯折。
在本实施例中，触控线路层包括第一触控线和第二触控线，且第一触控线和第二触控线同层绝缘设置。在实际使用时，第一触控线和第二触控线中的一个对应为触控驱动电极，另一个则对应为触控感应电极，二者同层设置能够降低触控阻抗，进而提高触控信号强度。
S55：在第二无机层上形成有机层。
有机层的材质可以为环氧树脂、聚甲基丙烯酸甲酯、丙烯醛基树脂、聚酰亚胺树脂、聚萘二甲酸乙二醇酯、聚对苯二甲酸乙二醇酯中的一种。
例如，通过喷墨打印的方式，在第二无机层上制作一聚甲基丙烯酸甲酯膜层，该聚甲基丙烯酸甲酯膜层的厚度可以为10μm。
在一个实施例中，触控线路层的厚度小于第二无机层的厚度，第二无机层的厚度小于第一无机层的厚度，例如，触控线路层的厚度可以为0.5~0.7μm，第一无机层的厚度可以为2~4μm，第二无机层的厚度可以为0.5~1.5μm，以避免在薄膜封装结构内设置触控线路层会影响薄膜封装结构的封装效果。
进一步地，为了兼顾薄膜封装结构的水氧阻隔能力和弯曲性能，可以控制第一无机层、触控线路层和第二无机层的总厚度与有机层的厚度之比为0.3~0.6。
S56：在第二无机层上与第二触控线的断开处对应的位置处制作第一导通孔，并在有机层上与第一导通孔对应的位置处制作第二导通孔。
具体地，需待有机层完全干燥后，再执行S56，以避免喷墨打印制作有机层产生的水汽腐蚀触控线路层，进而保证显示面板的触控性能。
例如，待有机层完全干燥后，可以通过激光刻蚀的方式，在第二无机层上与第二触控线的断开处对应的位置处制作第一导通孔，并在有机层上与第一导通孔对应的位置处制作第二导通孔。其中，在形成第一导通孔后，第二触控线暴露出的边缘宽度可以为5μm。
S57：在有机层上形成搭桥线，搭桥线经第二导通孔和第一导通孔与断开处电连接，以实现第二触控线在交叉处的电连接。
例如，S57可以具体包括：在第一导通孔和第二导通孔内填充导电材料，并在有机层上沉积搭桥线，搭桥线经第二导通孔和第一导通孔与断开处电连接，以实现第二触控线在交叉处的电连接。其中，导电材料可以为铟锡氧化物、铝、铜、银等具有低电阻率的材料，搭桥线的材质可以为钛合金、纳米银线等具有良好弯折性能的金属材料，也可以为氧化铟锌、氧化铟锡等透明导电金属氧化物。
在一个具体实施例中，在S57之后，还可以包括：
在形成有搭桥线的有机层上形成第三无机层。
其中，第三无机层的材质可以为氮化硅、氮化铝、氮化锆、氮化钛、氮化钽、氧化钛、氮氧化铝、氮氧化硅中的一种或多种。
例如，通过原子层沉积或者化学气相沉积工艺，在形成有搭桥线的有机层上沉积一氮化硅层，该氮化硅层的厚度可以为1μm。
具体地，第三无机层覆盖搭线桥，能够保护搭桥线不被水氧侵蚀，进而保证显示面板的触控性能。并且，第三无机层与上述第一无机层、第二无机层和有机层共同构成显示面板的薄膜封装结构，以保护显示面板中的有机发光材料不被水氧侵蚀，进而提高显示面板的稳定性，延长显示面板的寿命。
区别于现有技术，本实施例中的显示面板的制作方法，通过将触控线路层设置在薄膜封装结构的两层无机层之间，能够减小触控层和封装层的总厚度，提高显示面板的弯折性能，进而避免触控层和封装层易出现膜层破裂进而导致柔性面板失效的问题。
请参阅图6，本申请实施例还提供了一种显示装置，该显示装置60包括驱动电路和上述任一项显示面板61，其中，驱动电路用于向显示面板61提供驱动电压。
显示面板61包括依次层叠设置的第一无机层、触控线路层、第二无机层、有机层和搭桥线。其中，触控线路层设置于第一无机层上，触控线路层包括互相绝缘设置的第一触控线和第二触控线，第一触控线沿第一预设方向延伸，第二触控线沿第二预设方向延伸，且第二触控线在与第一触控线的交叉处断开。第二无机层位于设置有触控线路层的第一无机层上，第二无机层上与第二触控线的断开处对应的位置处设有第一导通孔。有机层位于第二无机层上，有机层上与第一导通孔对应的位置处设有第二导通孔。搭桥线位于有机层上，搭桥线经第二导通孔和第一导通孔与断开处电连接，以实现第二触控线在交叉处的电连接。
区别于现有技术，本实施例中的显示装置，通过将触控线路层设置在薄膜封装结构的两层无机层之间，能够减小触控层和封装层的总厚度，提高显示面板的弯折性能，进而避免触控层和封装层易出现膜层破裂进而导致柔性面板失效的问题。
以上所述仅为本申请的较佳实施例而已，并不用以限制本申请，凡在本申请的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本申请的保护范围之内。

Claims (20)

  1. 一种显示面板，其包括：
    第一无机层；
    触控线路层，所述触控线路层设置于所述第一无机层上，所述触控线路层包括互相绝缘设置的第一触控线和第二触控线，所述第一触控线沿第一预设方向延伸，所述第二触控线沿第二预设方向延伸，且所述第二触控线在与所述第一触控线的交叉处断开；
    第二无机层，所述第二无机层位于设置有所述触控线路层的所述第一无机层上，所述第二无机层上与所述第二触控线的断开处对应的位置处设有第一导通孔；
    有机层，所述有机层位于所述第二无机层上，所述有机层上与所述第一导通孔对应的位置处设有第二导通孔；
    搭桥线，所述搭桥线位于所述有机层上，所述搭桥线经所述第二导通孔和所述第一导通孔与所述断开处电连接，以实现所述第二触控线在所述交叉处的电连接。
  2. 根据权利要求1所述的显示面板，其中，所述显示面板还包括第三无机层，所述第三无机层位于设置有所述搭桥线的所述有机层上。
  3. 根据权利要求2所述的显示面板，其中，所述显示面板还包括基板、以及设置于所述基板上的有机发光层，所述第一无机层设置于所述有机发光层上。
  4. 根据权利要求1所述的显示面板，其中，所述触控线路层的形状为网格状。
  5. 根据权利要求1所述的显示面板，其中，所述触控线路层的厚度小于所述第二无机层的厚度，所述第二无机层的厚度小于所述第一无机层的厚度。
  6. 根据权利要求1所述的显示面板，其中，所述第一无机层、所述触控线路层和所述第二无机层的总厚度与所述有机层的厚度之比为0.3~0.6。
  7. 一种显示面板的制作方法，其包括：
    提供基体；
    在所述基板上形成第一无机层；
    在所述第一无机层上形成触控线路层，所述触控线路层包括互相绝缘设置的第一触控线和第二触控线，所述第一触控线沿第一预设方向延伸，所述第二触控线沿第二预设方向延伸，且所述第二触控线在与所述第一触控线的交叉区处断开；
    在形成有所述触控线路层的所述第一无机层上形成第二无机层；
    在所述第二无机层上形成有机层；
    在所述第二无机层上与所述第二触控线的断开处对应的位置处制作第一导通孔，并在所述有机层上与所述第一导通孔对应的位置处制作第二导通孔；
    在所述有机层上形成搭桥线，所述搭桥线经所述第二导通孔和所述第一导通孔与所述断开处电连接，以实现所述第二触控线在所述交叉处的电连接。
  8. 根据权利要求7所述的制作方法，其中，所述在所述第一无机层上形成触控线路层的步骤，具体包括：
    在所述第一无机层上溅射金属层；
    对所述金属层进行刻蚀，以得到图形化的触控线路层，所述触控线路层包括互相绝缘设置的第一触控线和第二触控线，所述第一触控线沿第一预设方向延伸，所述第二触控线沿第二预设方向延伸，且所述第二触控线在与所述第一触控线的交叉区处断开。
  9. 根据权利要求7所述的制作方法，其中，所述在所述有机层上形成搭桥线的步骤，具体包括：
    在所述第一导通孔和所述第二导通孔内填充导电材料，并在所述有机层上沉积搭桥线，所述搭桥线经所述第二导通孔和所述第一导通孔与所述断开处电连接，以实现所述第二触控线在所述交叉处的电连接。
  10. 根据权利要求7所述的制作方法，其中，在所述有机层上形成搭桥线的步骤之后，还包括：
    在形成有所述搭桥线的所述有机层上形成第三无机层。
  11. 根据权利要求7所述的制作方法，其中，所述触控线路层的形状为网格状。
  12. 根据权利要求7所述的制作方法，其中，所述触控线路层的厚度小于所述第二无机层的厚度，所述第二无机层的厚度小于所述第一无机层的厚度。
  13. 根据权利要求7所述的制作方法，其中，所述第一无机层、所述触控线路层和所述第二无机层的总厚度与所述有机层的厚度之比为0.3~0.6。
  14. 一种显示装置，其包括驱动电路和显示面板，所述驱动电路用于向所述显示面板提供驱动电压，
    其中，所述显示面板包括：
    第一无机层；
    触控线路层，所述触控线路层设置于所述第一无机层上，所述触控线路层包括互相绝缘设置的第一触控线和第二触控线，所述第一触控线沿第一预设方向延伸，所述第二触控线沿第二预设方向延伸，且所述第二触控线在与所述第一触控线的交叉处断开；
    第二无机层，所述第二无机层位于设置有所述触控线路层的所述第一无机层上，所述第二无机层上与所述第二触控线的断开处对应的位置处设有第一导通孔；
    有机层，所述有机层位于所述第二无机层上，所述有机层上与所述第一导通孔对应的位置处设有第二导通孔；
    搭桥线，所述搭桥线位于所述有机层上，所述搭桥线经所述第二导通孔和所述第一导通孔与所述断开处电连接，以实现所述第二触控线在所述交叉处的电连接。
  15. 根据权利要求14所述的显示装置，其中，所述显示面板还包括第三无机层，所述第三无机层位于设置有所述搭桥线的所述有机层上。
  16. 根据权利要求15所述的显示装置，其中，所述显示面板还包括基板、以及设置于所述基板上的有机发光层，所述第一无机层设置于所述有机发光层上。
  17. 根据权利要求15所述的显示装置，其中，所述显示面板还包括偏光片和柔性盖板，所述偏光片位于所述第三无机层上，所述柔性盖板位于所述偏光片上。
  18. 根据权利要求14所述的显示装置，其中，所述触控线路层的形状为网格状。
  19. 根据权利要求14所述的显示装置，其中，所述触控线路层的厚度小于所述第二无机层的厚度，所述第二无机层的厚度小于所述第一无机层的厚度。
  20. 根据权利要求14所述的显示装置，其中，所述第一无机层、所述触控线路层和所述第二无机层的总厚度与所述有机层的厚度之比为0.3~0.6。
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