WO2020179904A1 - 造形装置、液滴移動装置、目的物生産方法、造形方法、液滴移動方法、造形プログラムおよび液滴移動プログラム - Google Patents

造形装置、液滴移動装置、目的物生産方法、造形方法、液滴移動方法、造形プログラムおよび液滴移動プログラム Download PDF

Info

Publication number
WO2020179904A1
WO2020179904A1 PCT/JP2020/009634 JP2020009634W WO2020179904A1 WO 2020179904 A1 WO2020179904 A1 WO 2020179904A1 JP 2020009634 W JP2020009634 W JP 2020009634W WO 2020179904 A1 WO2020179904 A1 WO 2020179904A1
Authority
WO
WIPO (PCT)
Prior art keywords
droplet
modeling
processing unit
moving
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2020/009634
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
昭二 丸尾
穂高 平田
太一 古川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yokohama National University NUC
Original Assignee
Yokohama National University NUC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokohama National University NUC filed Critical Yokohama National University NUC
Priority to JP2021503663A priority Critical patent/JP7313078B2/ja
Priority to US17/436,503 priority patent/US12036725B2/en
Publication of WO2020179904A1 publication Critical patent/WO2020179904A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/227—Driving means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502769—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by multiphase flow arrangements
    • B01L3/502784—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by multiphase flow arrangements specially adapted for droplet or plug flow, e.g. digital microfluidics
    • B01L3/502792—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by multiphase flow arrangements specially adapted for droplet or plug flow, e.g. digital microfluidics for moving individual droplets on a plate, e.g. by locally altering surface tension
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/112—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
    • B29C64/129—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
    • B29C64/135—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask the energy source being concentrated, e.g. scanning lasers or focused light sources
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/188—Processes of additive manufacturing involving additional operations performed on the added layers, e.g. smoothing, grinding or thickness control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/205—Means for applying layers
    • B29C64/209—Heads; Nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/245—Platforms or substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/264—Arrangements for irradiation
    • B29C64/268—Arrangements for irradiation using laser beams; using electron beams [EB]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/264—Arrangements for irradiation
    • B29C64/286—Optical filters, e.g. masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/295—Heating elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • B29C64/35—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • B29C64/386—Data acquisition or data processing for additive manufacturing
    • B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00—Data acquisition or data processing for additive manufacturing
    • B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2400/00—Moving or stopping fluids
    • B01L2400/04—Moving fluids with specific forces or mechanical means
    • B01L2400/0403—Moving fluids with specific forces or mechanical means specific forces
    • B01L2400/0442—Moving fluids with specific forces or mechanical means specific forces thermal energy, e.g. vaporisation, bubble jet
    • B01L2400/0448—Marangoni flow; Thermocapillary effect

Definitions

  • the present invention relates to a modeling device, a droplet moving device, an object production method, a modeling method, a droplet moving method, a modeling program, and a droplet moving program.
  • the present application claims priority to Japanese Patent Application No. 2019-042010 filed in Japan on March 7, 2019 and Japanese Patent Application No. 2019-158495 filed in Japan on August 30, 2019, and the contents thereof Is used here.
  • Stereolithography is one of the methods capable of forming a three-dimensional object.
  • a liquid material is irradiated with light such as an ultraviolet laser beam to partially change the material into a solid to form an object.
  • Non-Patent Document 1 discloses a method of shaping a silver microstructure by photoreduction.
  • an aqueous solution containing silver ions is irradiated with laser light to condense silver into a desired shape, and then the aqueous solution is removed.
  • Non-Patent Document 2 shows an experimental example of performing stereolithography by combining a plurality of materials.
  • the acrylic resin and the methacrylic resin are respectively molded by photopolymerization, and then the magnetic material is electroless plated.
  • the acrylic resin and the methacrylic resin only the acrylic resin is selectively plated.
  • a method is used in which an acrylic resin or the like is introduced into a modeling unit using a micro flow channel, the material is switched by a valve, and modeling is performed using a plurality of resin materials.
  • the method of exchanging materials using a microchannel has the advantage that the substrate is not removed, but there are a large number of materials in the microtube and switching valve connected to the modeling part, and they are mixed when they are exchanged. Therefore, there is a problem that the material is wasted too much.
  • a modeling device when a liquid material is changed to a solid to form an object, a modeling device, a droplet moving device, a target product production method, a modeling method, which can reduce the burden of installing the liquid material, Provided are a droplet moving method, a program, a modeling program, and a droplet moving program.
  • the modeling apparatus heats the droplet so that the temperature is higher on the peripheral side in the horizontal direction than on the center side, and the heating portion is moved.
  • a movement processing unit for moving the droplet and a modeling unit for modeling by partially changing the droplet into a solid within a predetermined modeling region are provided.
  • the moving processing unit may heat the droplets using electromagnetic waves.
  • the movement processing unit heats the liquid droplet so that the temperature is higher on the peripheral side in the horizontal direction than on the center side. May be good.
  • the movement processing unit moves the droplet, cools the moved droplet, and then heats the droplet so that the temperature on the peripheral side in the horizontal direction is higher than that on the central side. May be terminated.
  • the movement processing unit may move the droplets on a surface on which pattern processing for changing wettability is performed.
  • the droplet moving device heats the droplet so that the temperature is higher on the peripheral side in the horizontal direction than on the center side, and moves the heated portion. Therefore, a movement processing unit for moving the droplet is provided.
  • the droplet in the modeling method, is heated so that the temperature is higher on the peripheral side in the horizontal direction than on the center side, and the heating point is moved. It includes a step of moving the droplet and a step of performing modeling by partially changing the droplet into a solid within a predetermined modeling region.
  • the droplet in the droplet moving method, the droplet is heated so that the temperature of the peripheral side of the droplet in the horizontal direction is higher than that of the central side, and the heated portion is moved. This includes the step of moving the droplet.
  • the program causes the computer to heat the droplet so that the peripheral side in the horizontal direction of the droplet has a higher temperature than the central side, and moves the heating location.
  • This is a program for executing a step of moving the droplets and a step of performing modeling by partially changing the droplets into solids within a predetermined modeling region.
  • the program causes the computer to heat the droplet so that the temperature of the peripheral side of the droplet becomes higher than that of the center side in the horizontal direction, and moves the heating location.
  • This is a program for executing the step of moving the droplet.
  • the modeling apparatus has a moving processing unit that irradiates a laser to generate a temperature gradient of a predetermined shape and moves droplets based on the temperature gradient, and within a predetermined modeling region. It is provided with a modeling portion that performs modeling by partially changing the droplets into a solid.
  • the movement processing unit may generate a temperature gradient by moving the laser irradiation position.
  • the movement processing unit may generate a temperature gradient by moving the irradiation point of the laser with a galvano mirror.
  • the droplet moving device irradiates a laser and moves the irradiated portion of the laser with a galvanometer mirror to generate a temperature gradient having a predetermined shape, based on the temperature gradient.
  • a movement processing unit for moving droplets is provided.
  • a modeling method includes a step of irradiating a laser to generate a temperature gradient having a predetermined shape, moving the droplet based on the temperature gradient, and the droplet forming method within the predetermined modeling region. Forming by partially changing to a solid.
  • the droplet moving method generates a temperature gradient having a predetermined shape by irradiating a laser and moving the irradiation point of the laser with a galvanometer mirror, and based on the temperature gradient. It has a step of moving the droplet.
  • the modeling program irradiates a computer with a laser to generate a temperature gradient of a predetermined shape, and moves droplets based on the temperature gradient, a moving processing unit, a predetermined modeling area. It functions as a modeling unit that performs modeling by partially changing the liquid droplets inside to solid.
  • the droplet movement program generates a temperature gradient having a predetermined shape by irradiating a computer with a laser and moving the irradiation point of the laser with a galvanometer mirror, and the temperature gradient is generated. Based on the above, it functions as a movement processing unit that moves the droplet.
  • the burden of installing the liquid material can be reduced.
  • FIG. 1 is a schematic block diagram showing the functional configuration of the modeling system according to the first embodiment.
  • the modeling system 1 includes a modeling device 100 and a control device 200.
  • the modeling device 100 includes a modeling unit 110, a moving processing unit 120, and an observation unit 150.
  • the control device 200 includes a display unit 210, an operation input unit 220, a storage unit 280, and a processing unit 290.
  • the modeling system 1 partially changes a liquid material into a solid to generate an object.
  • the modeling apparatus 100 is an apparatus that executes the generation of a target object.
  • the modeling apparatus 100 models a target by partially converting each droplet of one or more materials into a solid.
  • the droplets referred to here are a mass of liquid that is collected by surface tension. Forming here means making something with a shape.
  • the modeling unit 110 performs modeling by partially changing the droplets of the material into solid within the modeling area. Specifically, by irradiating the droplet with a laser beam and focusing the laser beam inside the droplet, the liquid material is changed to a solid at the position of the focal point.
  • the modeling area here is an area in which the modeling unit 110 can change the material into a solid. Specifically, the modeling area is an area in which the modeling unit 110 can focus the laser light.
  • the material is a photocurable resin and the modeling unit 110 cures the photocurable resin from a liquid to a solid by stereolithography will be described as an example.
  • the method in which the modeling unit 110 performs modeling is not limited to a specific method as long as it can partially change the droplets of the material into a solid.
  • the method in which the modeling unit 110 performs modeling may be any one of photopolymerization, photocrosslinking, photoreduction, or a combination thereof.
  • the laser beam used by the modeling unit 110 for modeling is not limited to a laser beam having a specific wavelength as long as it is a laser beam capable of curing a material.
  • the modeling unit 110 may use ultraviolet laser light or blue laser light.
  • the modeling unit 110 may perform modeling by a two-photon modeling method using two-photon absorption using near-infrared femtosecond pulsed laser (Femtosecond-pulse Laser) light.
  • FIG. 2 is a diagram showing an example of a position where the modeling unit 110 focuses a laser beam.
  • the modeling apparatus 100 includes a support base 130 and a drip port 140 in addition to the movement processing unit 120 and the modeling unit 110.
  • a glass plate substrate 810 used as a substrate for forming a target object is placed on the support base 130.
  • the support base 130 supports the substrate 810.
  • the droplet 820 is placed on the substrate 810.
  • the laser beam emitted by the modeling unit 110 is also referred to as a modeling beam B11.
  • FIG. 2 shows an example in which the laser beam emitting portion, the support base 130, the substrate 810, and the droplet 820 of each of the modeling unit 110 and the moving processing unit 120 are viewed from the side (horizontal direction).
  • the droplet 820 shown in FIG. 2 is a droplet of material.
  • the droplet 820 is mounted on the substrate 810.
  • the modeling unit 110 irradiates the droplet 820 that transmits the modeling beam B11 with the modeling beam B11 from below the substrate 810 so as to focus on the droplet 820.
  • the modeling beam B11 irradiated by the modeling unit 110 is focused at the point P11. Therefore, the portion of the droplet 820 at point P11 changes from a liquid to a solid.
  • the laser light emitting portion of the modeling unit 110 can move back and forth and left and right in FIG. Further, the modeling unit 110 can move the focus position of the modeling beam B11 up and down in FIG. Therefore, the modeling unit 110 can three-dimensionally move the focus position of the modeling beam B11 up, down, left, right, and front and back in FIG. The modeling unit 110 moves the focal position of the modeling beam B11 in the droplet 820 along the shape of the target object, so that the material can be processed into the shape of the target object.
  • the modeling unit 110 irradiates the modeling beam B11 from the lower side of the substrate 810, so that the modeling beam B11 reaches the upper surface of the droplet 820 after focusing. Therefore, the position where the modeling beam B11 is focused is not affected by the refraction according to the shape of the droplet 820 due to the surface tension. In this respect, the modeling system 1 can perform highly accurate positioning of the focus of the modeling beam B11. However, the modeling unit 110 may irradiate the modeling beam B11 from above the droplet 820.
  • the droplet 820 is irradiated with the modeling beam B11 to partially irradiate the material. Can be transformed into a solid.
  • the cleaning liquid is dropped into the dropping port 140.
  • the cleaning liquid is a liquid for removing the liquid material adhering to the solid material after processing the liquid material.
  • the drip port 140 cleans the solid material located in the modeling area by dropping the cleaning liquid toward the modeling area. That is, the drip port 140 removes the liquid material attached to the solidified material located in the modeling area.
  • the method of cleaning the solid material by the modeling system 1 is not limited to the method of dropping the cleaning liquid from the dropping port 140.
  • the modeling system 1 may move the cleaning liquid prepared in the form of droplets 820 in advance to immerse the solid material in the cleaning liquid, thereby cleaning the solid material.
  • FIG. 3 is a diagram showing an example of the positional relationship between the laser light emitting portion of the modeling unit 110 and the droplet 820.
  • FIG. 3 shows an example in which the laser beam emitting portion of the modeling portion 110 is viewed from above.
  • the substrate 810 supported by the support 130 is located above the laser beam emitting portion of the modeling unit 110, and two droplets 820 of different materials are placed on the substrate 810.
  • the two droplets 820 are droplets 821-11 of the first material and droplets 821-12 of the second material.
  • the droplets of the material are designated by reference numeral 821.
  • the first material droplets 821-11 are located above the laser beam emitting portion of the modeling unit 110.
  • the modeling unit 110 irradiates the modeling beam B11 to focus on the droplets 821-11 of the first material, the focal portion of the droplets 821-11 changes from a liquid to a solid.
  • the modeling system 1 processes the first material using the droplets 821-11 of the first material, and then processes the second material using the droplets 821-12 of the second material, thereby processing the first material. It is possible to produce an object containing both the second material and the second material. For such processing, the moving processing unit 120 moves the droplet 820.
  • the movement processing unit 120 moves the droplet 820.
  • the movement processing unit 120 moves the droplet 820 by causing a temperature gradient in the droplet 820 using electromagnetic waves.
  • the modeling device 100 including the movement processing unit 120 corresponds to an example of a droplet moving device.
  • the moving processing unit 120 irradiates an electromagnetic wave for heating (for example, infrared laser light) so as to surround the periphery of the droplet 820 in the horizontal direction.
  • the movement processing unit 120 causes a temperature gradient in the horizontal direction of the droplet 820 so that the temperature on the peripheral side is higher than that on the center side.
  • the peripheral side and the central side are the side closer to the boundary between the droplet 820 and the outside of the inside of the droplet 820, and the side farther from the boundary. This temperature gradient can prevent the droplet 820 from spreading in the horizontal direction when the droplet 820 is heated.
  • the description indicating the horizontal direction may be omitted.
  • the circumference of the droplet 820 in the horizontal direction is also simply referred to as the circumference of the droplet 820.
  • the peripheral side of the droplet 820 in the horizontal direction is also simply referred to as the peripheral side of the droplet 820.
  • the central side of the droplet 820 in the horizontal direction is also simply referred to as the central side of the droplet 820.
  • the spread of the droplet 820 in the horizontal direction is also simply referred to as the spread of the droplet 820.
  • the electromagnetic wave emitted by the movement processing unit 120 is also referred to as a heating beam.
  • FIG. 4 is a diagram showing an example of the shape of the heating beam emitted by the movement processing unit 120.
  • the droplet 820 is located on the substrate 810, and the movement processing unit 120 irradiates the droplet 820 with the heating beam B12.
  • the moving processing unit 120 does not directly irradiate the droplet 820 with the heating beam B12, but irradiates the periphery of the droplet 820.
  • a cavity (a portion not irradiated with the heating beam B12) is formed inside the heating beam B12, and the droplet 820 is located in this cavity portion.
  • the cavity of the heating beam B12 is formed by the mask 121 blocking part of the heating beam B12 emitted by the movement processing unit 120. Even when the moving processing unit 120 irradiates the surroundings of the droplet 820 with the heating beam B12 as in the example of FIG. 4, it is described that the moving processing unit 120 irradiates the droplet 820 with the heating beam B12.
  • FIG. 5 is a first diagram showing an example of the temperature gradient generated by the irradiation of the heating beam B12.
  • the upper side of FIG. 5 shows a cross-sectional view of the heating beam B12 irradiated by the moving processing unit 120 cut in the vertical direction along the center (optical axis) thereof.
  • the line L12 indicates the center of the heating beam B12.
  • the upper side of FIG. 5 is referred to as FIG.
  • the mask 121 is provided at the center of the heating beam B12, so that a cavity is formed inside (near the center) of the heating beam B12.
  • the droplet 820 is located in this cavity.
  • the lower side of FIG. 5 shows an example of the temperature gradient generated at the position of the cross section by the irradiation of the heating beam B12 shown on the upper side.
  • the lower side of FIG. 5 is referred to as FIG.
  • the horizontal axis of the graph of FIG. 5B indicates a position (horizontal position in a cross section).
  • the vertical axis shows the temperature.
  • Line L11 shows the temperature distribution of the substrate 810 and the droplet 820 in cross section. That is, the line L11 shows the relationship between the position shown on the horizontal axis and the temperatures of the substrate 810 and the droplet 820.
  • the position of the droplet 820 is shown by illustrating the droplet 820.
  • the movement processing unit 120 irradiates the heating beam B12 around the droplet 820, so that the peripheral side of the droplet 820 is closer to the center side as indicated by a line L11.
  • FIG. 6 is a second diagram showing an example of the temperature gradient generated by the irradiation of the heating beam B12.
  • FIG. 6 is a heat map showing an example of the temperature of the substrate 810 when the heating beam B12 in the example of FIG. 5 is irradiated. The brighter (white) indicates that the temperature is higher, and the darker (black) indicates that the temperature is lower.
  • Line L21 shows the position of the cross section of FIG. 5 on the heat map. Point P21 indicates the position of the center of the heating beam B12.
  • the movement processing unit 120 irradiates the heating beam B12 so as to surround the droplet 820 in a circular shape (donut shape) as in the example of FIG. As a result, the heat map of FIG.
  • FIG. 6 shows a temperature distribution obtained by expanding the temperature distribution indicated by the line L11 of FIG. 5 on a plane. Specifically, in the heat map of FIG. 6, a concentric temperature distribution centering on the point P21 (center of the heating beam B12) is generated. As the distance from the point P21 increases, the temperature rises once, and when the temperature exceeds the peak and further moves away from the point P21, the temperature decreases.
  • the movement processing unit 120 moves the heating beam B12 while surrounding the droplet 820 with the heating beam B12. As a result, the movement processing unit 120 moves the droplet 820 while preventing the droplet 820 from spreading. This point will be described with reference to FIGS. 7 to 9.
  • FIG. 7 shows an example of the relationship between the forces in the droplet 820 when the moving processing unit 120 does not irradiate the droplet 820 with the heating beam B12 and the droplet 820 is at room temperature.
  • ⁇ L represents the surface tension of the droplet 820.
  • ⁇ S indicates the surface tension of the solid (surface tension on the substrate 810).
  • ⁇ LS indicates solid-liquid interfacial tension.
  • ⁇ represents the contact angle of the droplet 820 with respect to the substrate 810.
  • Young's equation is expressed as in equation (1).
  • the forces in the droplet 820 are balanced, and the droplet 820 does not move.
  • the moving processing unit 120 irradiates the heating beam B12 so as to surround the periphery of the droplet 820 to generate a temperature gradient, and does not move the heating beam B12. Also in this case, the forces in the droplet 820 are balanced and the droplet 820 does not move.
  • the irradiation of the heating beam B12 causes the temperature of the peripheral side of the droplet 820 to rise above the temperature of the central side. Therefore, the surface tension on the center side of the droplet 820 becomes larger than the surface tension on the peripheral side, and a force acts on the droplet 820 in the direction of maintaining the droplet shape.
  • the irradiation of the heating beam B12 raises the overall temperature of the droplet 820, so that the surface tension of the droplet 820 ( ⁇ L in FIG. 7) becomes smaller and the droplet 820 comes into contact with the substrate 810.
  • the angle (angle ⁇ ) becomes smaller, and a force acts in the direction in which the droplet 820 spreads.
  • FIG. 8 shows an example of the relationship of forces in the droplet 820 when the moving processing unit 120 moves the heating beam B12 and a temperature difference occurs at the end of the droplet 820.
  • FIG. 8 shows an example in which the movement processing unit 120 moves the heating beam B12 to the right side in FIG. 8, and of the left and right ends of the droplet 820, the left side in FIG. The temperature at the end is higher than at the right end.
  • the force on the side where the temperature is relatively low (right side in FIG. 8) is indicated by a variable name with “′” added to the variable name used in FIG. 7.
  • gamma 'L denotes the surface tension in the droplet 820.
  • gamma 'S indicates the solid surface tension (surface tension at the substrate 810).
  • gamma 'LS shows the solid-liquid interfacial tension.
  • ⁇ ′ represents the contact angle of the droplet 820 with respect to the substrate 810.
  • ⁇ '' L indicates the surface tension of the droplet 820.
  • ⁇ ′′ S represents the surface tension of the solid (the surface tension of the substrate 810).
  • ⁇ '' LS indicates solid-liquid interfacial tension.
  • ⁇ ′′ represents the contact angle of the droplet 820 with respect to the substrate 810.
  • the contact angle and the surface tension on each of the high temperature side and the low temperature side change from when the movement processing unit 120 does not move the heating beam B12.
  • the contact angle ⁇ ′ becomes larger than that when the heating beam B12 is not moved, and the horizontal component of the surface tension ⁇ ′ L between the liquid and the gas is reduced.
  • the force F′ acting on the interface on the low temperature side is expressed by the equation (2) with the direction of the surface tension ⁇ ′ S of the solid being positive.
  • FIG. 9 shows an example of the direction of the force generated in the droplet. As described above, both the direction of the force F'and the direction of the force F'are rightward toward FIG. 9 (direction from the high temperature side end to the low temperature side end of the droplet 820). ..
  • the force F Total which is a combination of the force F'and the force F'', is expressed by Eq. (4).
  • the droplet 820 moves to the right toward FIG. 9 (direction in which the moving processing unit 120 moves the heating beam B12) using the force F Total as a driving force. Specifically, the droplet 820 moves so as to continue to be positioned in the cavity inside the heating beam B12 in response to the movement of the heating beam B12.
  • the conical shape is better than the planar shape, and the conical mask 121 is dropleted. Experimental results have been obtained that it is preferable to install it relatively close to 820.
  • FIG. 10 is a diagram showing a first example of the shape of the mask 121.
  • FIG. 10 shows an example of a flat mask 121.
  • the planar mask 121 is horizontally arranged between the movement processing unit 120 and the droplet 820.
  • FIG. 11 is a diagram showing a second example of the shape of the mask 121.
  • FIG. 11 shows an example of a conical mask 121.
  • the cone-shaped mask 121 is arranged between the movement processing unit 120 and the droplet 820 with the top of the cone facing up and the bottom facing down.
  • FIG. 12 is a diagram showing an example of the relationship between the shape and arrangement of the mask 121 and the resulting temperature gradient.
  • the distance between the moving processing unit 120 and the mask 121 here is the distance between the irradiation port of the heating beam B12 of the moving processing unit 120 and the mask 121.
  • the temperature at the center of the heating beam B12 is relatively low and the temperature becomes maximum and the temperature becomes minimum at the center of the heating beam B12. It shows the temperature gradient between the place and the place.
  • the temperature gradient when the shape of the mask 121 is planar is indicated by a circle
  • the temperature gradient when the shape of the mask 121 is conical is indicated by a triangle.
  • the position of the bottom surface of the cone is used as the position of the mask 121.
  • the shape of the mask 121 is conical, the distance between the moving processing unit 120 and the mask 121 is 20 mm (mm), the distance between the mask 121 and the droplet 820 is 1 mm, and the droplet 820 When the mask 121 is placed nearby, the temperature gradient is the largest at 8 degrees (° C.) / mm.
  • the method of irradiating the heating beam B12 so that the movement processing unit 120 surrounds the droplet 820 is not limited to the method of providing the mask 121.
  • the irradiation opening of the heating beam B12 in the movement processing unit 120 may be formed in a circular shape, and the heating beam B12 having a hollow center may be irradiated.
  • the electromagnetic wave used by the movement processing unit 120 to heat the droplet 820 may be infrared laser light as described above, but may be anything other than one that changes the material of the liquid into a solid, and has a specific frequency. It is not limited to electromagnetic waves and electromagnetic waves of a specific method.
  • the electromagnetic wave used by the movement processing unit 120 to heat the droplet 820 is not limited to the laser.
  • the method of heating the droplet 820 by the movement processing unit 120 is not limited to the method of irradiating electromagnetic waves.
  • the moving processing unit 120 can generate a temperature gradient in which the temperature on the peripheral side of the droplet 820 is higher than that on the central side, and can move the heating position.
  • the method can be used.
  • a movable circular heater may be provided on the substrate 810.
  • FIG. 13 shows an arrangement example of the droplet 820.
  • FIG. 13 shows an example in which the substrate 810 is viewed obliquely from above.
  • the third material droplet 821-21, the fourth material droplet 821-22, the fifth material droplet 821-23, and the cleaning liquid droplet are positioned on the substrate 810. ing.
  • the liquid droplets of the cleaning liquid are denoted by reference numeral 822.
  • the modeling system 1 positions each of the droplets 821-21 of the third material, the droplets 821-22 of the fourth material, and the droplets 821-23 of the fifth material in the modeling region and partially transforms them into solids. As a result, it is possible to generate an object including the third material, the fourth material, and the fifth material.
  • the modeling system 1 is configured such that each time the droplets 821-21 of the third material, the droplets 821-22 of the fourth material, and the droplets 821-23 of the fifth material are partially changed to solid, the cleaning liquid is generated. Droplets 822 of the are moved to the modeling area to wash the solid material. As described above, as a method for cleaning the solid material, a method of dropping the cleaning liquid from the dropping port 140 may be used instead of the method of moving the droplets 822 of the cleaning liquid.
  • the modeling unit 110 irradiates the modeling beam B11 from below the substrate 810.
  • the moving processing unit 120 irradiates the heating beam B12 from above the substrate 810.
  • both the modeling beam B11 and the heating beam B12 are shown for the sake of explanation.
  • the moving processing unit 120 may not irradiate the droplet 820 with the heating beam B12.
  • the moving processing unit 120 irradiates the material located in the modeling area with the heating beam B12 to produce the material as a liquid in the modeling area. Move it outside.
  • the substrate 810 may be provided with a pattern for disposing and moving the droplet 820.
  • FIG. 14 is a diagram showing an example of a configuration for providing a pattern on the substrate 810.
  • a glass substrate is used as the substrate 810.
  • the portion of the substrate 810 other than the portion where the wettability is desired is covered with the mask 912, and the excimer light (VUV light) is irradiated from the excimer lamp light source 911.
  • Excimer light changes atmospheric oxygen into active oxygen such as ozone and breaks bonds on the glass surface.
  • a functional group having a high affinity with the resin such as "-OH” or "-COOH” is imparted, so that the wettability is improved.
  • the method of providing the pattern on the substrate 810 is not limited to the method of irradiating the excimer light.
  • a substrate 810 made of a material having a relatively low wettability may be used, and a coating having a relatively high hydrophilicity may be provided on a portion of the pattern.
  • a substrate 810 made of a material having a relatively high wettability may be used, and a water-repellent coating may be provided on a portion other than the pattern.
  • the path of the droplet 820 may be patterned by applying a fluorine coating pattern to the portion of the surface of the substrate 810 other than the portion through which the droplet 820 passes. Since the droplet 820 moves while avoiding the portion coated with fluorine, the droplet 820 can be moved along a specific path (path not coated with fluorine) by the pattern of fluorine coating. In this way, the movement processing unit 120 may move the droplet 820 on the surface on which the water-repellent material is partially arranged.
  • FIG. 15 is a diagram showing a first example of the pattern of the substrate 810.
  • the substrate 810 is connected to the region A11 which is a modeling region, the region A12 which is a retracting region of the droplet 820 other than the droplet 820 used for modeling, and the region A11 and the region A12.
  • a pattern including the area A13 is provided.
  • the size of the pattern depends on the material of the droplet, but for example, the region A11 and the region A12 may be formed in a circle having a diameter of about 4 mm to 5 mm. If the width of the region A13 is too thin, it becomes difficult to move the droplet 820, and if it is too thick, the droplet 820 may flow back to the region A13 when the droplet 820 is moved to the region A11 or the region A12. ..
  • the width of the region A13 may be, for example, about 2 mm.
  • the length of the area A13 may be, for example, about 10 millimeters.
  • FIG. 16 is a diagram showing a second example of the pattern of the substrate 810.
  • three regions A12 are provided, whereas in the example of FIG. 16, nine regions A12 are provided.
  • the number of regions A12 in the pattern of the substrate 810 is not limited to a specific number and may be any number. By providing a large number of regions A12, it is possible to cope with a large number of types of droplets 820 used for modeling.
  • FIG. 17 is a diagram showing an example of the temperature distribution on the substrate 810 when the moving processing unit 120 finishes irradiating the electromagnetic wave.
  • the horizontal axis of the graph in FIG. 17 indicates the position on the substrate 810.
  • the vertical axis shows the temperature.
  • FIG. 17 shows the temperature distribution in a cross section cut in the vertical direction along the center of the heating beam B12 when the moving processing unit 120 is irradiating the heating beam B12, as in the case of FIG.
  • a position corresponding to the center of the heating beam B12 is set as a reference (0 mm), and a distance from the reference is shown in mm.
  • the movement processing unit 120 ends the irradiation of the heating beam B12 as it is after the movement of the droplet 820 is completed, the temperature gradient higher on the peripheral side of the droplet 820 than on the central side disappears. ..
  • the temperature of the droplet 820 is high, the wettability of the droplet 820 with respect to the substrate 810 is relatively high. At this stage, if the temperature gradient higher on the peripheral side of the droplet 820 than on the central side disappears, the droplet 820 spreads.
  • FIG. 18 is a diagram showing an example of a cooling device included in the moving processing unit 120.
  • the cooling device 122 includes a fan 123 and a duct 124, and the duct 124 is provided with a blower opening 125.
  • the air blown by the fan 123 is blown diagonally downward from the air outlet 125 via the duct 124.
  • the moving processing unit 120 arranges the cooling device 122 so that the air blown from the air outlet 125 hits the droplet 820, and cools the droplet 820 by blowing the air to the cooling device 122.
  • the moving processing unit 120 ends the irradiation of the heating beam B12 100 seconds after the start of cooling by the cooling device 122, and after the temperature of the droplet 820 has dropped to some extent (for example, 40 ° C. or less), the heating beam B12 The irradiation of is finished.
  • the temperature of the droplet 820 decreases while the temperature gradient on the peripheral side of the droplet 820 is higher than that on the center side.
  • the observation unit 150 captures an image of the target object.
  • FIG. 19 shows a configuration example of the observation unit 150.
  • the observation unit 150 includes an observation light source 151, a beam splitter 152, an observation lens 153, a CCD camera 154, and a display device 155.
  • the observation light source 151 emits illumination light B13 for photographing the target object.
  • the object here may be in the middle of molding.
  • the illumination light B13 irradiates the target object. After a part of the illumination light B13 is reflected or absorbed, the remaining light is incident on the beam splitter 152 via the laser light emitting portion of the modeling unit 110.
  • the observation light source 151 is located above the modeling region, like the dropping port 140 in FIG. While the observation light light source 151 irradiates the illumination light B13, the arrangement position of the dropping port 140 and the arrangement position of the observation light light source 151 may be exchanged. Alternatively, the drop port 140 may be arranged so that the position of the drop port 140 and the position of the observation light light source 151 do not overlap, such as dropping a cleaning liquid or a liquid material from diagonally above the modeling region toward the modeling region.
  • the beam splitter 152 is provided with a half mirror and reflects the illumination light B13.
  • the beam splitter 152 receives not only the incident light B13 but also the incident beam B11 for modeling.
  • the beam splitter 152 passes through the modeling beam B11 and advances toward the laser beam emitting portion of the modeling unit 110. Due to the reflection of the illumination light B13, the beam splitter 152 redirects the illumination light B13, which has passed the same path as the modeling beam B11 in the opposite direction to the modeling beam B11, in a direction different from the direction of the path of the modeling beam B11. ..
  • the observation lens 153 refracts the illumination light B13 so that the illumination light B13 forms an image at the position of the image pickup element of the CCD camera 154.
  • the CCD camera 154 receives the illumination light B13 and photoelectrically converts it to generate image data of the target object.
  • the display device 155 has a display screen such as a liquid crystal panel or an LED panel, and displays an image of an object. Specifically, the display device 155 receives input of the image data of the target object generated by the CCD camera, and displays the image indicated by this image data.
  • the configuration and arrangement of the observation unit 150 are not limited to those shown in FIG.
  • the observation unit 150 may shoot the target object from above, or may shoot from an obliquely upward direction or an obliquely downward direction.
  • the control device 200 controls the modeling device 100 to generate an object. For example, the control device 200 controls the timing at which the modeling unit 110 irradiates the modeling beam B11 and the focus position of the modeling beam B11. Further, the control device 200 controls the timing and the irradiation position at which the movement processing unit 120 irradiates the heating beam B12. Further, the control device 200 controls the timing at which the dropping port 140 drops the cleaning liquid. Further, the control device 200 functions as a user interface of the modeling system 1.
  • the control device 200 is configured using a computer such as a personal computer (PC) or a workstation (workstation), for example.
  • the display unit 210 has a display screen such as a liquid crystal panel or an LED panel, and displays various images. In particular, the display unit 210 presents information about the modeling system 1 to the user.
  • the display unit 210 may be configured using the display device 155, or may be configured separately from the display device 155.
  • the operation input unit 220 includes an input device such as a keyboard and a mouse, and receives a user operation. In particular, the operation input unit 220 receives a user operation for setting the modeling system 1.
  • the storage unit 280 stores various data.
  • the storage unit 280 is configured by using the storage device included in the control device 200.
  • the processing unit 290 controls each unit of the control device 200 to execute various processes.
  • the processing unit 290 is configured by a CPU (Central Processing Unit, central processing unit) included in the control device 200 reading a program from the storage unit 280 and executing the program.
  • the control device 200 may automatically control the modeling device 100 based on a preset program or the like. Alternatively, the user may input an instruction to the control device 200 online, and the control device 200 may control the modeling device 100 according to the user's instruction.
  • FIG. 20 shows a first example of material placement.
  • FIG. 20 shows an example of the arrangement of materials at the start of the process in which the modeling system 1 produces an object.
  • a droplet 821-41 of a seventh material and a droplet 821-42 of an eighth material different from the seventh material are placed on the substrate 810.
  • the area A21 indicates a modeling area.
  • the modeling unit 110 irradiates the modeling beam B11 on the droplets 821-41 of the seventh material located in the modeling region (region A21), and one of the droplets 821-41 of the seventh material. Change the part from liquid to solid.
  • FIG. 21 shows a second example of material placement.
  • the positions of the substrate 810, the droplet 821-41 of the seventh material, the droplet 821-42 of the eighth material, and the region A21 are the same as in the case of FIG.
  • the example of FIG. 21 is different from the case of FIG. 20 in that the solid material 840 is inside the droplets 821-41 of the seventh material.
  • the solid material 840 in FIG. 21 is the solid material 840-41 of the seventh material, and corresponds to an example of the target product in the process of being produced. Specifically, from the state of FIG.
  • the modeling unit 110 irradiates the droplets 821-41 of the seventh material with the modeling beam B11 to make a part of the droplets 821-41 of the seventh material from liquid to solid.
  • 21 is the solid material 840-41 of the seventh material in FIG.
  • FIG. 22 shows a third example of material placement.
  • the positions of the substrate 810, the droplet 821-42 of the eighth material, the solid material 840-41 of the seventh material, and the area A21 are the same as those in the case of FIG.
  • the example of FIG. 22 is different from the case of FIG. 21 in that the droplet 821-41 of the seventh material moves from the inside to the outside of the area A21.
  • FIG. 21 shows an example of a state in which the processing of the droplets 821-41 of the seventh material by the modeling unit 110 has been completed.
  • the movement processing unit 120 moves the liquid droplets 821-41 of the seventh material after use to the outside from the inside of the area A21, and the state shown in FIG. 22 is obtained.
  • the movement processing unit 120 moves the droplets, but does not move the solid material. Also in the example of FIG. 22, the droplet 821-41 of the seventh material is moving from the inside to the outside of the region A21, while the solid matter 840-41 of the seventh material remains in the region A21.
  • FIG. 23 shows a fourth example of material placement.
  • the positions of the substrate 810, the droplets 821-41 of the seventh material, the droplets 821-42 of the eighth material, the solid matter 840-41 of the seventh material, and the region A21 are the same as in FIG. Is.
  • FIG. 23 differs from the case of FIG. 22 in that the cleaning liquid droplets 822 are present in the area A21.
  • the dropping port 140 drops the cleaning liquid into the modeling region (region A21) to reach the state of FIG. 23. In the state of FIG.
  • the dropping port 140 drops the cleaning liquid into the region A21 and immerses the solid substance 840-41 of the seventh material in the cleaning liquid.
  • the modeling system 1 cleans the surface of the solid material 840-41 of the seventh material. Specifically, the modeling system 1 removes the liquid seventh material adhering to the surfaces of the seventh material solids 840-41.
  • FIG. 24 shows a fifth example of material placement.
  • the positions of the substrate 810, the droplet 821-41 of the seventh material, the droplet 821-42 of the eighth material, the solid matter 840-41 of the seventh material, and the region A21 are the same as in FIG. 23. Is.
  • FIG. 24 differs from the case of FIG. 23 in that the cleaning liquid droplets 822 are removed from the substrate 810.
  • the movement processing unit 120 moves the cleaning liquid droplets 822 from inside the area A21 to outside the upper surface of the substrate 810, so that the cleaning liquid droplets 822 are removed from the substrate 810, and the cleaning liquid droplets 822 are removed. It becomes the state of.
  • FIG. 25 shows a sixth example of material placement.
  • the positions of the substrate 810, the droplet 821-41 of the seventh material, the solid substance 840-41 of the seventh material, and the region A21 are the same as those in the case of FIG.
  • FIG. 25 differs from the case of FIG. 24 in that the droplets 821-42 of the eighth material move from the outside to the inside of the area A21. From the state of FIG. 24, the movement processing unit 120 moves the droplets 821-42 of the eighth material into the region A21, and the state of FIG. 25 is obtained.
  • FIG. 26 shows a seventh example of material placement.
  • the positions of the substrate 810, the droplets 821-41 of the seventh material, the droplets 821-42 of the eighth material, the solid matter 840-41 of the seventh material, and the region A21 are the same as in FIG. Is.
  • FIG. 26 is different from the case of FIG. 25 in that the solid matter 840-42 of the eighth material is present in addition to the solid matter 840-41 of the seventh material in the droplet 821-42 of the eighth material.
  • the solid matter 840-41 of the seventh material and the solid matter 840-42 of the eighth material constitute the solid matter 840. From the state of FIG.
  • the modeling unit 110 irradiates the droplets 821-42 of the eighth material with the modeling beam B11 to change a part of the droplets 821-42 of the eighth material from liquid to solid. , 840-42 of the eighth material solid of FIG. 26.
  • FIG. 27 shows an eighth example of material placement.
  • the positions of the substrate 810, the droplet 821-41 of the seventh material, the solid matter 840-41 of the seventh material, the solid matter 840-42 of the eighth material, and the region A21 are the same as in the case of FIG. 26. Is.
  • FIG. 27 differs from the case of FIG. 26 in that the droplets 821-42 of the eighth material move from the inside to the outside of the area A21.
  • FIG. 26 shows an example of a state in which the modeling unit 110 has finished processing the droplets 821-42 of the eighth material.
  • the movement processing unit 120 moves the liquid droplets 821-42 of the eighth material after use to the outside from the inside of the area A21, and the state shown in FIG. 27 is obtained. As described above, the moving processing unit 120 moves the droplets, but does not move the solid material. In the example of FIG. 27, the droplet 821-42 of the eighth material is moving from the inside to the outside of the region A21, while the solid matter 840-42 of the eighth material remains in the region A21.
  • FIG. 28 shows a ninth example of material arrangement.
  • the substrate 810 the droplet 821-41 of the seventh material, the droplet 821-42 of the eighth material, the solid matter 840-41 of the seventh material, the solid matter 840-42 of the eighth material, and the region A21.
  • the position of is the same as in the case of FIG.
  • FIG. 28 differs from the case of FIG. 27 in that the cleaning liquid droplets 822 are present in the area A21.
  • the dropping port 140 drops the cleaning liquid into the modeling region (region A21) to reach the state of FIG. 28. In the state of FIG.
  • the dropping port 140 drips the cleaning liquid into the area A21 to immerse the solid material 840 in the cleaning liquid.
  • the modeling system 1 cleans the surface of the solid material 840. Specifically, the modeling system 1 removes the liquid eighth material adhering to the surface of the seventh material solid 840-41 and the surface of the eighth material solid 840-42.
  • FIG. 29 shows a tenth example of material placement.
  • the substrate 810 the droplet 821-41 of the seventh material, the droplet 821-42 of the eighth material, the solid matter 840-41 of the seventh material, the solid matter 840-42 of the eighth material, and the region A21.
  • the position of is the same as in the case of FIG. 28.
  • FIG. 29 differs from the case of FIG. 28 in that the cleaning liquid droplets 822 are removed from the substrate 810.
  • the movement processing unit 120 moves the cleaning liquid droplets 822 from inside the region A21 to outside the upper surface of the substrate 810, so that the cleaning liquid droplets 822 are removed from the substrate 810, and FIG. It becomes the state of.
  • the solid material 840 in FIG. 29 corresponds to an example of the completed target object.
  • the modeling system 1 produces a multi-material target product using a plurality of materials such as the seventh material and the eighth material.
  • FIG. 30 is a flowchart showing an example of a processing procedure in which the control device 200 controls the modeling device 100 to generate a target object.
  • the control device 200 controls the modeling unit 110 to perform the modeling process (step S101).
  • the modeling unit 110 irradiates the material droplet 821 in the modeling area with the modeling beam B11 under the control of the control device 200 to focus the modeling beam B11 in the material droplet 821.
  • the material changes from liquid to solid at the focal point.
  • control device 200 controls the movement processing unit 120 to retract the material droplet 821 to the outside of the modeling area (retraction area) (step S102).
  • the movement processing unit 120 moves the material droplet 821 in the modeling area to the outside of the modeling area under the control of the control device 200.
  • control device 200 controls the dropping port 140 to drop the cleaning liquid (step S103).
  • the dripping port 140 drips the cleaning liquid into the modeling area under the control of the control device 200. By this dropping, the solid material in the modeling area is washed.
  • control device 200 controls the movement processing unit 120 to remove the droplet 822 of the cleaning liquid (step S104).
  • the movement processing unit 120 moves the droplets 822 of the cleaning liquid in the modeling region to the outside of the substrate 810 under the control of the control device 200. By this movement, the movement processing unit 120 removes the cleaning liquid droplets 822 from the top of the substrate 810.
  • the control device 200 determines whether or not the target object is completed (step S105). When it is determined that the target object is completed (step S105: YES), the control device 200 ends the process of FIG.
  • step S105: NO the control device 200 controls the movement processing unit 120 to move the droplet 821 of the material to be used next to the modeling region (step S105: NO).
  • step S106 The movement processing unit 120 moves the liquid droplet 821 of the material to be used next under the control of the control device 200 from outside the modeling area to inside the modeling area. After step S106, the process returns to step S101.
  • FIG. 31 is a diagram showing an example of a modeled object obtained by using the modeling apparatus 100.
  • the model 900 shown in FIG. 31 is configured to contain three types of resins, SR499 + SR368, SR348, and SR499 + SR348.
  • FIG. 32 is a diagram for explaining the configuration of the model 900.
  • the model 900 has a three-layer pyramid shape with a side length of 135 microns ( ⁇ m), and has SR499 + SR368 (reference numeral 901), SR348 (reference numeral 902), and SR499 + SR348 (reference numeral 409). It is composed of three types of resins as described in 903). In this way, a fine object can be modeled using the modeling device 100.
  • SR499 + SR368 is an acrylate-based resin
  • SR348 is a methacrylate-based resin
  • SR499 + SR348 is an acrylate-based + methacrylate-based resin.
  • SR499+SR368 which is an acrylate resin can be plated with copper. Therefore, copper plating can be selectively performed on the modeled object 900.
  • the moving processing unit 120 heats the droplet 820 so that the temperature of the peripheral side of the droplet 820 in the horizontal direction is higher than that of the central side, and moves the heated portion to move the droplet 820.
  • the modeling unit 110 performs modeling by partially changing the droplet 820 into a solid within a predetermined modeling region. In this way, the moving processing unit 120 heats the droplet 820 so as to generate a temperature gradient in which the temperature on the peripheral side in the horizontal direction is higher than that on the central side, and moves the heated portion to move the droplet 820. It moves without spreading according to the movement of the heating part.
  • the movement of the droplet 820 can be controlled with high accuracy in that the droplet 820 can be moved by the amount of the movement of the heated portion and the droplet 820 does not spread. it can.
  • the moving processing unit 120 heats the droplet 820 using electromagnetic waves.
  • the droplet 820 can be heated by a relatively simple method of irradiating the periphery of the droplet 820 with an electromagnetic wave.
  • the moving processing unit 120 blocks a part of the electromagnetic wave with the conical mask 121 so that the temperature of the peripheral side of the droplet 820 in the horizontal direction is higher than that of the central side of the droplet 820.
  • the droplet 820 can be heated by a relatively simple method of irradiating the droplet 820 with an electromagnetic wave and blocking a part of the electromagnetic wave with a mask.
  • the conical mask 121 for the movement processing unit 120 it is possible to generate a larger temperature gradient in the droplet 820, as compared with the case of using the planar mask 121, for example.
  • the moving processing unit 120 moves the droplet 820, cools the moved droplet 820, and then causes the temperature of the peripheral side of the droplet 820 in the horizontal direction to be higher than that of the central side. End the heating. According to the movement processing unit 120, it is possible to prevent the temperature gradient in which the temperature of the droplet 820 is higher on the peripheral side in the horizontal direction than on the center side while the temperature of the droplet 820 is high. As a result, according to the movement processing unit 120, it is possible to prevent or reduce the spread of the droplet 820.
  • the moving processing unit 120 moves the droplet 820 on the surface subjected to the pattern processing that changes the wettability.
  • the movement processing unit 120 moves the portion of the droplet 820 that has a relatively high wettability on the surface (for example, on the substrate 810), so that the movement processing unit 120 moves the droplet 820 relatively easily. You can In addition, on the surface, the wettability around the portion where the droplet 820 is located is relatively low, so that the spreading of the droplet 820 can be prevented or reduced.
  • the method of changing the position where the modeling beam B11 focuses is not limited to the method of changing the position of the laser beam emitting portion of the modeling unit 110.
  • the support base 130 may be moved instead of the laser light emitting portion of the modeling unit 110.
  • the angle at which the laser beam emitting portion of the modeling unit 110 emits the modeling beam B11 may be changed.
  • FIG. 33 shows an example of the relationship between the angle of the modeling beam B11 and the position of the focal point.
  • the laser beam emitting portion of the modeling unit 110 functions as an objective lens and refracts the modeling beam incident from the side opposite to the droplet 820 (lower side of FIG. 33) to the side of the droplet 820 (the lower side of FIG. 33). (Upper side of FIG. 33) is irradiated.
  • the incident angle of the modeling beam B11 on the laser beam emitting portion of the modeling section 110 is indicated by ⁇ I.
  • the emission angle of the modeling beam B11 from the laser beam emitting portion of the modeling section 110 is indicated by ⁇ O.
  • the exit angle ⁇ O changes according to the incident angle ⁇ I.
  • the modeling unit 110 changes the incident angle ⁇ I of the modeling beam B11 to the laser beam emitting portion to change the position of the laser beam emitting portion and the position of the substrate 810 without changing the modeling beam.
  • the position where B11 focuses can be changed.
  • a method of changing the incident angle ⁇ I for example, a method of providing a mirror between the light source of the modeling beam B11 and the laser beam emitting portion of the modeling unit 110 and changing the direction of the mirror can be used.
  • FIG. 34 is a diagram showing a modeling system 21 according to the second embodiment.
  • the modeling system 21 includes a modeling device 2100 and a control device 2200.
  • the modeling apparatus 2100 includes a modeling unit 2110, a movement processing unit 2120, and an observation unit 2150.
  • the control device 2200 includes a display unit 2210, an operation input unit 2220, a storage unit 2280, and a processing unit 2290.
  • the modeling system 21 partially changes a liquid material into a solid to generate a target object.
  • the modeling apparatus 2100 is an apparatus that executes generation of a target object.
  • the modeling device 2100 models the target by partially converting the droplets of each of the one or more materials into a solid.
  • a droplet referred to here is a mass of liquid that is collected by surface tension. Forming here means making something with a shape.
  • the modeling unit 2110 performs modeling by partially changing the droplets of the material into a solid in the modeling region. Specifically, by irradiating the droplet with a laser beam and focusing the laser beam inside the droplet, the liquid material is changed to a solid at the position of the focal point.
  • the modeling region here is a region in which the modeling unit 2110 can change the material into a solid. Specifically, the modeling region is an region in which the modeling unit 2110 can focus the laser beam. Laser light is also simply referred to as a laser.
  • the material is a photo-curable resin and the modeling unit 2110 cures the photo-curable resin from a liquid to a solid by photo-molding
  • the method by which the modeling unit 2110 performs modeling is not limited to a particular method as long as it can partially change the droplets of the material into solid.
  • the method in which the modeling unit 2110 performs modeling may be any of photopolymerization, photocrosslinking, photoreduction, or a combination thereof.
  • the laser light used by the modeling unit 2110 for modeling may be any laser light capable of curing the material, and is not limited to the laser light having a specific wavelength.
  • the modeling unit 2110 may use an ultraviolet laser beam or a blue laser beam.
  • the modeling unit 2110 may perform modeling by a two-photon modeling method using two-photon absorption using a near-infrared femtosecond pulsed laser beam.
  • FIG. 35 is a diagram showing an example of a position where the modeling unit 2110 focuses the laser beam.
  • the modeling apparatus 2100 also includes a support base 2130 and a drip port 2140 in addition to the movement processing unit 2120 and the modeling unit 2110.
  • a glass plate substrate 2810 used as a substrate for object formation is placed on the support base 2130.
  • the support base 2130 supports the substrate 2810. Further, a droplet 2820 is placed on the substrate 2810.
  • the laser beam emitted by the modeling unit 2110 is also referred to as a modeling beam B11-2.
  • FIG. 35 shows an example in which the laser light emitting portions of the modeling unit 2110 and the movement processing unit 2120, the support base 2130, the substrate 2810, and the droplet 2820 are viewed from the side (horizontal direction).
  • the droplet 2820 illustrated in FIG. 35 is a droplet of material.
  • the droplet 2820 is mounted on the substrate 2810.
  • the modeling unit 2110 irradiates the droplet 2820 passing through the modeling beam B11-2 with the modeling beam B11-2 from below the substrate 2810 so as to focus on the inside of the droplet 2820.
  • the modeling beam B11-2 emitted by the modeling section 2110 is focused at a point P11-2. Therefore, the portion of the droplet 2820 at the point P11-2 changes from liquid to solid.
  • the laser light emitting portion of the modeling unit 2110 can be moved back and forth and left and right in FIG. Further, the modeling unit 2110 can move the focus position of the modeling beam B11-2 up and down in FIG. Therefore, the modeling unit 2110 can three-dimensionally move the focus position of the modeling beam B11-2 up, down, left, right, and front and back in FIG.
  • the shaping unit 2110 moves the focal position of the shaping beam B11-2 in the droplet 2820 along the shape of the target object, so that the material can be processed into the shape of the target object.
  • the focus position of the modeling beam B11-2 may be changed by using a galvano mirror without moving the modeling unit 2110. Further, the focal position of the modeling beam B11-2 on the substrate 2810 is changed by moving the substrate 2810 or moving the lens that collects the laser light in the optical axis direction without moving the modeling unit 2110. You may let me.
  • the modeling unit 2110 irradiates the modeling beam B11-2 from the lower side of the substrate 2810, so that the modeling beam B11-2 is focused on the upper surface of the droplet 2820. To reach. Therefore, the position where the modeling beam B11-2 is focused is not affected by refraction according to the shape of the droplet 2820 due to surface tension. In this respect, the modeling system 21 can perform highly accurate positioning of the focus of the modeling beam B11-2. However, the modeling unit 2110 may irradiate the modeling beam B11-2 from above the droplet 2820.
  • the droplet 2820 is irradiated with the modeling beam B11-2.
  • the material can be partially transformed into a solid.
  • the cleaning liquid is dropped into the dropping port 2140.
  • the cleaning liquid is a liquid for removing the liquid material adhering to the solid material after processing the liquid material.
  • the dropping port 2140 cleans the solid material located in the modeling region by dropping the cleaning liquid toward the modeling region. That is, the drip port 2140 removes the liquid material adhering to the solidified material located in the modeling area.
  • the method in which the modeling system 21 cleans the solid material is not limited to the method in which the cleaning liquid is dropped from the dropping port 2140.
  • the modeling system 21 may move the cleaning liquid prepared in the form of the droplet 2820 in advance to immerse the solid material in the cleaning liquid, thereby cleaning the solid material.
  • FIG. 36 is a diagram showing an example of the positional relationship between the laser beam emitting portion of the modeling portion 2110 and the droplet 2820.
  • FIG. 36 shows an example in which the laser beam emitting portion of the modeling portion 2110 is viewed from above.
  • the substrate 2810 supported by the support base 2130 is located above the laser beam emitting portion of the shaping unit 2110, and two droplets 2820 of different materials are placed on the substrate 2810.
  • the two droplets 2820 are a first material droplet 2821-11 and a second material droplet 2821-12.
  • the droplets of the material are designated by reference numeral 2821.
  • the first material droplet 2821-11 is located above the laser beam emitting portion of the modeling portion 2110.
  • the modeling unit 2110 irradiates the modeling beam B11-2 to focus on the droplet 2821-11 of the first material, the focal portion of the droplet 2821-11 changes from a liquid to a solid.
  • the modeling system 21 processes the first material using the droplets 2821-11 of the first material, and then processes the second material using the droplets 2821-12 of the second material, thereby processing the first material.
  • An object can be produced that includes both and the second material.
  • the movement processing unit 2120 moves the droplet 2820.
  • the movement processing unit 2120 moves the droplet 2820.
  • the movement processing unit 2120 irradiates the laser C-2 (see FIG. 37) to generate a temperature gradient having a predetermined shape, and moves the droplet based on the temperature gradient.
  • the modeling apparatus 2100 including the movement processing unit 2120 corresponds to an example of a droplet moving apparatus.
  • the movement processing unit 2120 causes the temperature gradient by moving the irradiation point of the laser C-2 with the Galvano Mirror 21030 (see FIG. 37).
  • the moving processing unit 2120 moves the irradiation portion of the laser C-2 at high speed and repeatedly heats the same portion to obtain a steady temperature gradient (particularly, a temperature gradient that is so small that the temperature pulsation can be ignored). Give rise to.
  • FIG. 37 shows how the movement processing unit 2120 irradiates the substrate 2810 with the laser C-2.
  • the movement processing unit 2120 includes a laser irradiation device 21010, a galvanometer mirror rotation device 21020, a galvanometer mirror 21030, and a condenser lens 21040.
  • the Galvano mirror rotating devices 21020A and 21020B are shown as the Galvano mirror rotating device 21020.
  • galvano mirror 21030 galvano mirrors 21030A and 21030B are shown.
  • the laser irradiation device 21010 is a device that irradiates the laser C-2.
  • An example of the laser C-2 that the laser irradiation device 21010 irradiates is an infrared ray that heats an irradiated irradiation portion.
  • the galvano mirror rotating device 21020A and the galvano mirror rotating device 21020B rotate the galvano mirror 21030A and the galvano mirror 21030B by rotating in the E-2 direction and the F-2 direction, respectively.
  • the rotation angles of the galvano mirror rotating device 21020A and the galvano mirror rotating device 21020B are angles at which the laser C-2 can be irradiated to an arbitrary position in a predetermined area set on the substrate 2810 as a region for moving droplets. All you need is.
  • the galvano mirror rotating device 21020A and the galvano mirror rotating device 21020B may be provided so as to be rotatable 360 degrees, respectively, but the present invention is not limited to this.
  • the galvanometer mirror rotating device 21020A and the galvanometer mirror rotating device 21020B are provided so as to be perpendicular to each other.
  • the Galvano mirror rotating device 21020A is arranged so that its rotation axis is oriented in the vertical direction (direction orthogonal to the substrate 2810).
  • the Galvano mirror rotating device 21020A is arranged such that the rotation axis thereof is oriented in the horizontal direction (direction parallel to the substrate 2810).
  • the galvano mirror rotating device 21020A and the galvano mirror rotating device 21020B may be provided so that their rotating shafts intersect, or may be provided so that their rotating shafts are in a twisted position.
  • the galvanometer mirror 21030A reflects the laser C-2 irradiated from the laser irradiation device 21010.
  • the laser C-2 reflected by the galvano mirror 21030A is applied to the galvano mirror 21030B.
  • the galvano mirror 21030B reflects the laser C-2 emitted by the galvano mirror 21030A.
  • the laser C-2 reflected by the galvanometer mirror 21030B irradiates the condenser lens 21040.
  • the condenser lens 21040 collects the laser C-2 irradiated by the galvano mirror 21030B and incident on the condenser lens 21040.
  • the laser C-2 focused by the condenser lens 21040 irradiates the substrate 2810.
  • a portion of the substrate 2810 that is irradiated with the laser C-2 is referred to as an irradiation portion D2.
  • the galvano mirror 21030A and the galvano mirror 21030B are provided so as to be perpendicular to each other, and are rotated by the galvano mirror rotating device 21020A and the galvano mirror rotating device 21020B, respectively.
  • the galvanometer mirror 21030A rotates about the rotation axis of the galvanometer mirror rotation device 21020A.
  • the galvano mirror 21030B rotates about the rotation axis of the galvano mirror rotation device 21020B as a rotation axis.
  • the user of the modeling system 21 can irradiate the laser C-2 while changing the position of the irradiation point D2 by rotating the galvano mirror 21030A and the galvano mirror 21030B.
  • FIG. 38 is a diagram showing the irradiation location D2 and the liquid droplet 2820 when the movement processing unit 2120 irradiates the substrate 2810 with the laser C-2.
  • the movement processing unit 2120 irradiates the irradiation spot D2-1, the irradiation spot D2-2, and the irradiation spot D2-3 on the substrate 2810.
  • the movement processing unit 2120 moves the irradiation point D2 of the laser C-2 to the irradiation point D2-1, the irradiation point D2-2, and the irradiation point D2-3 at high speed. That is, the irradiation portion D2 of the laser C-2 of the movement processing unit 2120 is moved at a high speed within the locus G-2.
  • the movement processing unit 2120 may continuously irradiate the laser C-2 and irradiate the entire trajectory G-2 with the laser C-2. Alternatively, the movement processing unit 2120 causes the laser C-2 to blink so that only a part of the locus G-2, such as the irradiation spot D2-1, the irradiation spot D2-2, and the irradiation spot D2-3, has the laser C-2. You may irradiate.
  • the irradiation point D2 of the laser C-2 of the moving processing unit 2120 is not in contact with the droplet 2820, but the irradiation point D2 may be in contact with the droplet 2820.
  • the moving processing unit 2120 may irradiate the substrate 2810 with the laser C-2, or may irradiate the droplet 2820 with the laser C-2. Alternatively, the movement processing unit 2120 may irradiate both the substrate 2810 and the droplet 2820 with the laser C-2.
  • FIG. 39 is a diagram showing an example of a temperature gradient generated by the irradiation of the laser C-2.
  • FIG. 39 shows the temperature gradient at the position of the line H2 on the surface (upper surface) of the substrate 2810 of FIG.
  • the horizontal axis of the graph in FIG. 39 indicates the position on the line H2.
  • the vertical axis shows the temperature.
  • the line L2-1 indicates the temperature at each position indicated by the horizontal axis of the graph.
  • the position of the droplet 2820 is shown by showing the droplet 2820.
  • FIG. 39 shows the temperature gradient at the position of the line H2 on the surface (upper surface) of the substrate 2810 of FIG.
  • the horizontal axis of the graph in FIG. 39 indicates the position on the line H2.
  • the vertical axis shows the temperature.
  • the line L2-1 indicates the temperature at each position indicated by the horizontal axis of the graph.
  • the position of the droplet 2820 is shown by showing the droplet 2820.
  • FIG. 39 shows the temperature gradient
  • the temperature gradient (line L2-1) shows the maximum temperature at the position corresponding to the position of the irradiation point D2-2, and the temperature becomes lower as the distance from the irradiation point D2-2 increases. Has become a slope.
  • the temperature gradient generated by the irradiation of the laser C-2 in the example of FIG. 38 reaches the maximum temperature at the position corresponding to the locus G-2 of the irradiation point D2, and the temperature becomes low as the distance from the locus G-2 increases. It is a temperature gradient of the shape.
  • the movement processing unit 2120 moves the droplet 2820 by moving the irradiation point D2 of the laser C-2 while irradiating the laser C-2 around the droplet 2820. This point will be described with reference to FIGS. 40 to 42.
  • FIG. 40 shows an example of the relationship between the forces of the droplet 2820 when the moving processing unit 2120 does not irradiate the droplet 2820 with the laser C-2 and the droplet 2820 is at room temperature.
  • ⁇ L represents the surface tension of the droplet 2820.
  • ⁇ S represents the surface tension of the solid (surface tension on the substrate 2810).
  • ⁇ LS indicates solid-liquid interfacial tension.
  • ⁇ represents a contact angle of the droplet 2820 with respect to the substrate 2810.
  • Young's equation is expressed as in equation (5).
  • FIG. 41 shows an example of the relationship of forces on the droplet 2820 when the movement processing unit 2120 irradiates the laser C-2 and a temperature gradient L2-1 occurs as shown in FIG. 39.
  • the temperature on the left side facing FIG. 41 is higher than that on the right side.
  • the force on the relatively low temperature side (right side in FIG. 41) is indicated by the variable name used in FIG. 40 with “′” added.
  • gamma 'L denotes the surface tension in the droplet 2820.
  • ⁇ ′ S indicates the surface tension of the solid (the surface tension of the substrate 2810).
  • gamma 'LS shows the solid-liquid interfacial tension.
  • ⁇ ′ represents the contact angle of the droplet 2820 with the substrate 2810.
  • ⁇ '' L indicates the surface tension of the droplet 2820.
  • ⁇ '' S indicates the surface tension of the solid (surface tension on the substrate 2810).
  • ⁇ ′′ LS indicates solid-liquid interfacial tension.
  • ⁇ ′′ represents the contact angle of the droplet 2820 with respect to the substrate 2810.
  • FIG. 42 shows an example of the direction of the force generated in the droplet 2820. As described above, both the direction of the force F'and the direction of the force F'are rightward toward FIG. 42 (direction from the high temperature side to the low temperature side of the droplet 2820).
  • the force F Total which is a combination of the force F′ and the force F′′, is expressed by Expression (8).
  • the droplet 2820 moves due to the temperature gradient.
  • the droplet 2820 can be continuously moved.
  • FIG. 43 shows an arrangement example of the droplets 2820.
  • FIG. 43 shows an example of the substrate 2810 viewed from diagonally above.
  • the third material droplets 2821-21, the fourth material droplets 2821-22, the fifth material droplets 2821-23, and the cleaning liquid droplets are located on the substrate 2810. ing.
  • the cleaning liquid droplets are denoted by reference numeral 2822.
  • the modeling system 21 positions each of the droplets 2821-21 of the third material, the droplets 2821-22 of the fourth material, and the droplets 2821-23 of the fifth material in the modeling region and partially transforms them into solids. As a result, it is possible to generate an object including the third material, the fourth material, and the fifth material.
  • the modeling system 21 partially changes each of the droplets 2821-21 of the third material, the droplets 2821-22 of the fourth material, and the droplets 2821-23 of the fifth material into solids, and each time the cleaning liquid is changed. Droplets 2822 of the are moved to the modeling area to wash the solid material. As described above, as a method for cleaning the solid material, a method of dropping the cleaning liquid from the dropping port 2140 may be used instead of the method of moving the droplets 2822 of the cleaning liquid.
  • the modeling unit 2110 irradiates the modeling beam B11-2 from below the substrate 2810.
  • the moving processing unit 2120 irradiates the laser C-2 from above the substrate 2810.
  • both the shaping beam B11-2 and the laser C-2 are shown for the sake of explanation.
  • the moving processing unit 2120 may not irradiate the droplet 2820 with the laser C-2.
  • the movement processing unit 2120 irradiates the material located in this modeling region with the laser C-2 to change the material in the liquid state to the modeling region. Move it out.
  • FIG. 44 is a diagram showing an example of a configuration for providing a pattern on the substrate 2810.
  • a glass substrate is used as the substrate 2810.
  • the portion of the substrate 2810 other than the portion where the wettability is desired is covered with the mask 2912, and the excimer light (VUV light) is irradiated from the excimer lamp light source 2911.
  • Excimer light changes atmospheric oxygen into active oxygen such as ozone and breaks bonds on the glass surface.
  • a functional group having a high affinity with the resin such as "-OH” or "-COOH” is imparted, so that the wettability is improved.
  • the method of providing the pattern on the substrate 2810 is not limited to the method of irradiating the excimer light.
  • a substrate 2810 made of a material having a relatively low wettability may be used, and a coating having a relatively high hydrophilicity may be provided on a portion of the pattern.
  • a substrate 2810 made of a material having a relatively high wettability may be used, and a water-repellent coating may be provided on a portion other than the pattern.
  • the path of the droplet 2820 may be patterned by applying a fluorine coating pattern to the portion of the surface of the substrate 2810 other than the portion through which the droplet 2820 passes. Since the droplet 2820 moves while avoiding the portion coated with fluorine, the droplet 2820 can be moved along a specific path (path not coated with fluorine) by the pattern of fluorine coating. In this way, the movement processing unit 2120 may move the droplet 2820 on the surface on which the water-repellent material is partially arranged.
  • FIG. 45 is a diagram showing a first example of the pattern of the substrate 2810.
  • the substrate 2810 has a modeling region A11-2, a region A12-2 which is a retracting region of the droplet 2820 other than the droplet 2820 used for modeling, and a region A11-2.
  • a pattern including the area A13-2 connecting the area A12-2 is provided.
  • the size of the pattern depends on the material of the droplet 2820, but for example, the region A11-2 and the region A12-2 may be formed in a circle having a diameter of about 4 mm to 5 mm. If the width of the region A13-2 is too thin, it becomes difficult to move the droplet 2820, and if it is too thick, the droplet 2820 becomes the region A13- when the droplet 2820 is moved to the region A11-2 or the region A12-2. There is a possibility of backflow to 2.
  • the width of the region A13-2 may be, for example, about 2 mm.
  • the length of the area A13-2 may be, for example, about 10 millimeters.
  • FIG. 46 is a diagram showing a second example of the pattern of the substrate 2810.
  • three regions A12-2 are provided, whereas in the example of FIG. 46, nine regions A12-2 are provided.
  • the number of the regions A12-2 in the pattern of the substrate 2810 is not limited to a specific number and may be any number. By providing a large number of regions A12-2, it is possible to cope with the case where there are many types of droplets 2820 used for modeling.
  • the observation unit 2150 captures an image of the target object.
  • FIG. 47 shows a configuration example of the observation unit 2150.
  • the observation unit 2150 includes an observation light source 2151, a beam splitter 2152, an observation lens 2153, a CCD camera 2154, and a display device 2155.
  • the observation light source 2151 emits illumination light B13-2 for photographing the target object.
  • the object here may be in the process of being modeled.
  • the illumination light B13-2 is applied to the target object. After a part of the illumination light B13-2 is reflected or absorbed, the remaining light is incident on the beam splitter 2152 via the laser beam emitting portion of the modeling portion 2110.
  • the observation light source 2151 is located above the modeling region, similarly to the dropping port 2140 in FIG. 35. While the observation light light source 2151 irradiates the illumination light B13-2, the arrangement position of the dropping port 2140 and the arrangement position of the observation light light source 2151 may be exchanged. Alternatively, the drop port 2140 may be arranged so that the position of the drop port 2140 and the position of the observation light light source 2151 do not overlap, such as dropping a cleaning liquid or a liquid material from diagonally above the modeling region toward the modeling region.
  • the beam splitter 2152 is provided with a half mirror and reflects the illumination light B13-2.
  • the beam splitter 2152 receives not only the incident light B13-2 but also the incident beam B11-2 for modeling.
  • the beam splitter 2152 passes through the modeling beam B11-2 and advances toward the laser beam emitting portion of the modeling unit 2110. Due to the reflection of the illumination light B13, the beam splitter 2152 passes the illumination light B13-2, which has passed the same path as the modeling beam B11-2 in the opposite direction to the modeling beam B11-2, through the path of the modeling beam B11-2. Change to a different direction from.
  • the observation lens 2153 refracts the illumination light B13-2 so that the illumination light B13-2 forms an image at the position of the image sensor of the CCD camera 2154.
  • the CCD camera 2154 receives the illumination light B13-2 and performs photoelectric conversion to generate image data of the target object.
  • the display device 2155 has a display screen such as a liquid crystal panel or an LED panel, and displays an image of a target object. Specifically, the display device 2155 receives the image data of the target object generated by the CCD camera, and displays the image indicated by this image data.
  • the configuration and arrangement of the observation unit 2150 is not limited to that shown in FIG. 47.
  • the observation unit 2150 may shoot the target object from above, or may shoot from an obliquely upward direction or an obliquely downward direction.
  • the control device 2200 controls the modeling device 2100 to generate an object. For example, the control device 2200 controls the timing at which the modeling unit 2110 irradiates the modeling beam B11-2 and the focus position of the modeling beam B11-2. Further, the control device 2200 controls the timing at which the moving processing unit 2120 irradiates the laser C-2 and the position of the irradiation point D. Further, the control device 2200 stores the locus G-2 of the irradiation location D2, and moves the laser C-2 at high speed based on the locus G-2.
  • control device 2200 controls the timing at which the dropping port 2140 drops the cleaning liquid. Further, the control device 2200 functions as a user interface of the modeling system 21.
  • the control device 2200 is configured by using a computer such as a personal computer or a workstation.
  • the display unit 2210 has a display screen such as a liquid crystal panel or an LED panel, and displays various images. In particular, the display unit 2210 presents information about the modeling system 21 to the user.
  • the display unit 2210 may be configured by using the display device 2155, or may be configured separately from the display device 2155.
  • the operation input unit 2220 is provided with an input device such as a keyboard and a mouse, and receives user operations. In particular, the operation input unit 2220 receives a user operation for setting the modeling system 21.
  • the storage unit 2280 stores various data.
  • the storage unit 2280 is configured by using the storage device included in the control device 2200.
  • the processing unit 2290 controls each unit of the control device 2200 to execute various processes.
  • the processing unit 2290 is configured by a CPU included in the control device 2200 reading a program from the storage unit 2280 and executing the program.
  • the control device 2200 may automatically control the modeling device 2100 based on a preset program or the like. Alternatively, the user may input an instruction to the control device 2200 online, and the control device 2200 may control the modeling apparatus 2100 according to the instruction of the user.
  • FIG. 48 shows a first example of material arrangement.
  • FIG. 48 shows an example of the arrangement of materials at the start of the process in which the modeling system 21 generates a target object.
  • a droplet 2821-41 of the sixth material and a droplet 2821-42 of the seventh material different from the sixth material are placed on the substrate 2810.
  • a region A21-2 indicates a modeling region.
  • the modeling unit 2110 irradiates the droplet 2821-41 of the sixth material located in the modeling area (area A21-2) with the modeling beam B11-2 to drop the droplet 2821 of the sixth material. Change part of -41 from liquid to solid.
  • FIG. 49 shows a second example of material placement.
  • the positions of the substrate 2810, the droplet 2821-41 of the sixth material, the droplet 2821-42 of the seventh material, and the region A21-2 are the same as in the case of FIG. 49.
  • the example of FIG. 49 is different from the case of FIG. 48 in that the solid matter 2840 is contained in the droplets 2821-41 of the sixth material.
  • the solid matter 2840 in FIG. 49 is the solid matter 2840-41 of the sixth material, and corresponds to an example of the target product in the process of being produced. Specifically, from the state of FIG.
  • the modeling unit 2110 irradiates the droplets 2821-41 of the sixth material with the modeling beam B11-2 to liquidate a part of the droplets 2821-41 of the sixth material.
  • the solid material 2840-41 of the sixth material in FIG. 49 is changed from the solid material to the solid material.
  • FIG. 50 shows a third example of material placement.
  • the positions of the substrate 2810, the droplet 2821-42 of the seventh material, the solid matter 2840-41 of the sixth material, and the region A21-2 are the same as in the case of FIG. 49.
  • the example of FIG. 50 is different from the case of FIG. 49 in that the droplet 2821-41 of the sixth material moves from the inside to the outside of the region A21-2.
  • FIG. 49 shows an example of a state in which the modeling unit 2110 has completed processing of the sixth material droplets 2821-41.
  • the movement processing unit 2120 moves the droplet 2821-41 of the sixth material after the end of use from the inside to the outside of the region A21-2, so that the state shown in FIG.
  • the movement processing unit 2120 moves the liquid droplets, but does not move the solid material. Also in the example of FIG. 50, the droplet 2821-41 of the sixth material is moving from the inside to the outside of the region A21-2, while the solid matter 2840-41 of the sixth material remains in the region A21-2. There is.
  • FIG. 51 shows a fourth example of material arrangement.
  • the positions of the substrate 2810, the droplet 2821-41 of the sixth material, the droplet 2821-42 of the seventh material, the solid matter 2840-41 of the sixth material, and the region A21-2 are in the case of FIG. Is similar to.
  • FIG. 51 is different from the case of FIG. 50 in that the cleaning liquid droplets 2822 are located in the region A21-2.
  • the dropping port 2140 drops the cleaning liquid into the modeling region (region A21-2) to reach the state of FIG. 51. In the state of FIG.
  • the dropping port 2140 drops the cleaning liquid into the region A21-2 and immerses the solid substance 2840-41 of the sixth material in the cleaning liquid.
  • the modeling system 21 cleans the surface of the solid material 2840-41 of the sixth material. Specifically, the modeling system 21 removes the liquid sixth material adhering to the surface of the solid material 2840-41 of the sixth material.
  • FIG. 52 shows a fifth example of material placement.
  • the positions of the substrate 2810, the sixth material droplet 2821-41, the seventh material droplet 2821-42, the sixth material solid matter 2840-41, and the region A21 are the same as those in FIG. Is.
  • FIG. 52 differs from the case of FIG. 51 in that droplets 2822 of the cleaning liquid are removed from the substrate 2810.
  • the movement processing unit 2120 moves the cleaning liquid droplet 2822 from inside the area A 21-2 to outside the upper surface of the substrate 2810, so that the cleaning liquid droplet 2822 is removed from the substrate 2810.
  • the state shown in FIG. 52 is obtained.
  • FIG. 53 shows a sixth example of material arrangement.
  • the positions of the substrate 2810, the droplet 2821-41 of the sixth material, the solid matter 2840-41 of the sixth material, and the region A21-2 are the same as in the case of FIG. 52.
  • FIG. 53 is different from the case of FIG. 52 in that the droplet 2821-42 of the seventh material moves from the outside to the inside of the region A21-2. From the state of FIG. 52, the movement processing unit 2120 moves the droplet 2821-42 of the seventh material into the region A21-2, so that the state of FIG. 53 is obtained.
  • FIG. 54 shows a sixth example of material arrangement.
  • the positions of the substrate 2810, the sixth material droplet 2821-41, the seventh material droplet 2821-42, the sixth material solid matter 2840-41, and the area A21-2 are as shown in FIG. Is similar to.
  • FIG. 54 is different from the case of FIG. 53 in that the solid matter 2840-42 of the seventh material is contained in the droplet 2821-42 of the seventh material in addition to the solid matter 2840-41 of the sixth material.
  • the solid material 2840-41 of the sixth material and the solid material 2840-42 of the seventh material constitute the solid material 2840. From the state of FIG.
  • the modeling unit 2110 irradiates the droplet 2821-42 of the seventh material with the modeling beam B11-2 to change a part of the droplet 2821-42 of the seventh material from liquid to solid. This is the solid 2840-42 of the seventh material in FIG. 54.
  • FIG. 55 shows an eighth example of material placement.
  • the positions of the substrate 2810, the droplet 2821-41 of the sixth material, the solid material 2840-41 of the sixth material, the solid material 2840-42 of the seventh material, and the area A21-2 are the same as those in FIG. Is similar to.
  • FIG. 55 is different from the case of FIG. 54 in that the droplet 2821-42 of the seventh material moves from the inside to the outside of the region A21-2.
  • FIG. 54 shows an example in which the modeling unit 2110 has finished processing the droplet 2821-42 of the seventh material.
  • the movement processing unit 2120 moves the droplet 2821-42 of the seventh material after the end of use from the inside to the outside of the region A21-2, so that the state shown in FIG. 55 is obtained. As described above, the movement processing unit 2120 moves the droplet, but does not move the solid material. Also in the example of FIG. 55, the droplet 2821-42 of the seventh material is moving from the inside to the outside of the region A21-2, while the solid matter 2840-42 of the seventh material remains in the region A21-2. There is.
  • FIG. 56 shows a ninth example of material arrangement.
  • the position of -2 is the same as in the case of FIG. 55.
  • FIG. 56 is different from the case of FIG. 55 in that the cleaning liquid droplets 2822 are located in the region A21-2.
  • the dropping port 2140 drops the cleaning liquid into the modeling region (region A21-2) to reach the state of FIG. 56. In the state of FIG.
  • the dropping port 2140 drops the cleaning liquid into the region A21-2 and immerses the solid substance 2840 in the cleaning liquid.
  • the modeling system 21 cleans the surface of the solid object 2840. Specifically, the modeling system 21 removes the liquid seventh material adhering to the surface of the sixth material solid 2840-41 and the surface of the seventh material solid 2840-42.
  • FIG. 57 shows a tenth example of material arrangement.
  • the position of -2 is the same as in the case of FIG. 56.
  • FIG. 57 is different from the case of FIG. 56 in that droplets 2822 of the cleaning liquid are removed from the substrate 2810.
  • the movement processing unit 2120 moves the cleaning liquid droplet 2822 from inside the area A 21-2 to outside the upper surface of the substrate 2810, whereby the cleaning liquid droplet 2822 is removed from the substrate 2810.
  • the state shown in FIG. 57 is obtained.
  • the solid substance 2840 in FIG. 57 corresponds to an example of the completed target object.
  • the modeling system 21 generates a multi-material target object using a plurality of materials such as the sixth material and the seventh material.
  • FIG. 58 is a flowchart showing an example of a processing procedure in which the control device 2200 controls the modeling device 2100 to generate an object.
  • the control device 2200 controls the modeling unit 2110 to perform the modeling process (step S2101).
  • the modeling unit 2110 irradiates the material droplet 2821 in the modeling area with the modeling beam B11-2 under the control of the control device 2200 to focus the modeling beam B11-2 within the material droplet 2821.
  • the material changes from liquid to solid at the focal point.
  • control device 2200 controls the movement processing unit 2120 to retract the material droplets 2821 out of the modeling region (evacuation region) (step S2102).
  • the movement processing unit 2120 moves the droplet 2821 of the material in the modeling region to the outside of the modeling region under the control of the control device 2200.
  • control device 2200 controls the dropping port 2140 to drop the cleaning liquid (step S2103).
  • the drip port 2140 drips the cleaning liquid into the modeling area under the control of the control device 2200. This dripping cleans the solid material within the build area.
  • control device 2200 controls the movement processing unit 2120 to remove the droplets 2822 of the cleaning liquid (step S2104).
  • the movement processing unit 2120 moves the droplets 2822 of the cleaning liquid in the modeling region to the outside of the substrate 2810 under the control of the control device 2200. By this movement, the movement processing unit 2120 removes the cleaning liquid droplets 2822 from the substrate 2810.
  • the control device 2200 determines whether or not the target object is completed (step S2105). When it is determined that the target object is completed (step S2105: YES), the control device 2200 ends the process of FIG. 58.
  • step S2105: NO the control device 2200 controls the movement processing unit 2120 to move the droplet 2821 of the material to be used next to the modeling region (step S2105: NO).
  • Step S2106 The movement processing unit 2120 moves the droplet 2821 of the material to be used next from the outside of the modeling region to the inside of the modeling region under the control of the control device 2200. After step S2106, the process returns to step S2101.
  • the modeling apparatus 2100 irradiates the laser C-2 to generate a temperature gradient having a predetermined shape, and the movement processing unit 2120 that moves the droplet 2820 based on the temperature gradient, and a predetermined modeling area.
  • the modeling unit 2110 that performs modeling by partially changing the droplet 2820 into a solid is provided.
  • the moving processing unit 2120 may generate a temperature gradient by moving the irradiation point D2 of the laser C-2. As a result, temperature gradients of various shapes can be generated, so that the droplets 2820 related to various shapes can be moved, and the burden of installing the liquid material can be reduced.
  • the moving processing unit 2120 may generate a temperature gradient by moving the irradiation point D2 of the laser C-2 with the galvano mirror 21030.
  • the galvanometer mirror 21030 can be used to move the irradiation point D2 of the laser C-2 at high speed, and the burden of installing the liquid material can be reduced.
  • the droplet moving device includes a moving processing unit 2120 that irradiates the laser C-2 to generate a temperature gradient having a predetermined shape and moves the droplet 2820 based on the temperature gradient. Accordingly, by moving the droplet 2820 with a temperature gradient having a predetermined shape, it is possible to reduce the burden of installing the liquid.
  • the shape of the droplet 2820 in the above-mentioned modeling device 2100 and the droplet moving device may be various shapes such as an ellipse.
  • the locus G-2 of the irradiation location D2 of the laser C-2 may be generated in a shape such as an arc according to the various shapes such as an ellipse.
  • the substrate 2810 may have different transmissivity depending on the wavelength of the laser C-2.
  • the substrate 2810 may be composed of materials such as borosilicate glass and soda coal glass.
  • the wavelength of the laser C-2 may be changed according to the absorption spectrum of the material forming the substrate 2810.
  • the aspect of the droplet 2820 may be deformed by the locus G-2 of the laser C-2 in the modeling apparatus 2100 and the droplet moving apparatus.
  • Examples of the above deformation include deformation of the shape and pattern of the droplet 2820, deformation of the droplet 2820 divided, and deformation of different droplets 2820 combined.
  • the movement processing unit 2120 may move a plurality of droplets 2820 at the same time. For example, as shown in FIG. 59, the moving processing unit 2120 irradiates each of the droplet 2820A and the droplet 2820B with the laser C-2 as in the locus G1-2 and the locus G2-2 by the time division processing. By doing so, a plurality of droplets 2820 may be moved at the same time. As a result, the movement processing unit 2120 can move a plurality of droplets 2820 simultaneously with one laser C-2 (thus, without having to provide a plurality of laser irradiation devices 21010).
  • the method of changing the position where the modeling beam B11-2 is focused is not limited to the method of changing the position of the laser beam emitting portion of the modeling unit 2110.
  • the support base 2130 may be moved instead of the laser beam emitting portion of the modeling unit 2110.
  • the angle at which the laser beam emitting portion of the modeling unit 2110 emits the modeling beam B11-2 may be changed.
  • FIG. 60 shows an example of the relationship between the angle of the modeling beam B11-2 and the focus position.
  • the laser beam emitting portion of the modeling unit 2110 functions as an objective lens and refracts the modeling beam incident from the side opposite to the droplet 2820 (lower side of FIG. 60) to the side of the droplet 2820 (the lower side of FIG. 60). (Upper side of FIG. 60) is irradiated.
  • the angle of incidence of the modeling beam B11-2 on the laser beam emitting portion of the modeling unit 2110 is indicated by ⁇ I.
  • the emission angle of the modeling beam B11-2 from the laser beam emitting portion of the modeling unit 2110 is indicated by ⁇ O.
  • the exit angle ⁇ O changes according to the incident angle ⁇ I.
  • the modeling unit 2110 changes the incident angle ⁇ I of the modeling beam B11-2 to the laser light emitting portion without changing the position of the laser light emitting portion or the position of the substrate 2810.
  • the position where the modeling beam B11-2 is focused can be changed.
  • a method of changing the incident angle ⁇ I for example, a method in which a mirror is provided between the light source of the modeling beam B11-2 and the laser beam emitting portion of the modeling section 2110 and the orientation of the mirror can be changed can be used.
  • a program for realizing all or part of the functions of the processes performed by the control device 200 and the control device 2200 is recorded on a computer-readable recording medium, and the program recorded on the recording medium is read into the computer system. You may process each part by executing it.
  • the “computer system” mentioned here includes an OS and hardware such as peripheral devices. Further, the “computer system” also includes a homepage providing environment (or display environment) if a WWW system is used. Further, the "computer-readable recording medium” refers to a portable medium such as a flexible disk, a magneto-optical disk, a ROM, or a CD-ROM, or a storage device such as a hard disk built in a computer system. Further, the program may be one for realizing some of the functions described above, or may be one that can realize the functions described above in combination with a program already recorded in the computer system.
  • the burden of installing the liquid material can be reduced.
  • Modeling system 100 Modeling device 110 Modeling unit 120 Moving processing unit 121 Mask 122 Cooling device 123 Fan 124 Duct 125 Blower port 130 Support stand 140 Drop port 200 Control device 210 Display unit 220 Operation input unit 280 Storage unit 290 Processing unit 810 Board 820 Droplet 21 Modeling system 2100 Modeling device 2110 Modeling unit 2120 Moving processing unit 2130 Support stand 2140 Drop port 2150 Observation unit 2151 Observation light light source 2152 Beam splitter 2153 Observation lens 2154 CCD camera 2155 Display device 2200 Control device 2210 Display unit 2220 Operation input Part 2280 Storage part 2290 Processing part 2810 Substrate 2820 Droplet 2840 Solid matter 21010 Laser irradiation device 21020 Galvano mirror rotating device 21030 Galvano mirror 21040 Condenser lens

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Plasma & Fusion (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Clinical Laboratory Science (AREA)
  • Hematology (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Laser Beam Processing (AREA)
PCT/JP2020/009634 2019-03-07 2020-03-06 造形装置、液滴移動装置、目的物生産方法、造形方法、液滴移動方法、造形プログラムおよび液滴移動プログラム Ceased WO2020179904A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021503663A JP7313078B2 (ja) 2019-03-07 2020-03-06 造形装置、液滴移動装置、目的物生産方法、造形方法、液滴移動方法、造形プログラムおよび液滴移動プログラム
US17/436,503 US12036725B2 (en) 2019-03-07 2020-03-06 Shaping apparatus, droplet moving device, object production method, shaping method, droplet moving method, shaping program, and droplet moving program

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019042010 2019-03-07
JP2019-042010 2019-03-07
JP2019158495 2019-08-30
JP2019-158495 2019-08-30

Publications (1)

Publication Number Publication Date
WO2020179904A1 true WO2020179904A1 (ja) 2020-09-10

Family

ID=72338120

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2020/009634 Ceased WO2020179904A1 (ja) 2019-03-07 2020-03-06 造形装置、液滴移動装置、目的物生産方法、造形方法、液滴移動方法、造形プログラムおよび液滴移動プログラム

Country Status (3)

Country Link
US (1) US12036725B2 (enExample)
JP (1) JP7313078B2 (enExample)
WO (1) WO2020179904A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022091137A (ja) * 2020-12-08 2022-06-20 パロ アルト リサーチ センター インコーポレイテッド 付加製造システム及びその方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012032258A (ja) * 2010-07-30 2012-02-16 Osaka City Univ 液滴移動装置および液滴移動方法
JP2017533851A (ja) * 2014-11-06 2017-11-16 ワッカー ケミー アクチエンゲゼルシャフトＷａｃｋｅｒ Ｃｈｅｍｉｅ ＡＧ シリコーンエラストマー部品の製造方法
WO2019156170A1 (ja) * 2018-02-07 2019-08-15 国立大学法人横浜国立大学 造形装置、液滴移動装置、目的物生産方法、液滴移動方法及びプログラム

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6079821A (en) * 1997-10-17 2000-06-27 Eastman Kodak Company Continuous ink jet printer with asymmetric heating drop deflection
JP2005144217A (ja) 2003-11-11 2005-06-09 Seiko Epson Corp 薄膜形成方法、デバイスの製造方法、電気光学装置の製造方法、電子機器
US7582858B2 (en) * 2004-01-23 2009-09-01 Sri International Apparatus and method of moving micro-droplets using laser-induced thermal gradients
JP2005254263A (ja) 2004-03-10 2005-09-22 Matsushita Electric Ind Co Ltd 光加熱装置とその制御方法
US7670560B2 (en) * 2005-04-29 2010-03-02 Georgia Tech Research Corporation Droplet transport system and methods
US20110232524A1 (en) * 2009-05-25 2011-09-29 Korea Institute Of Ceramic Engineering And Technology Ceramic ink for manufacturing ceramic thick film by inkjet printing
EP2654412B1 (en) * 2010-12-21 2019-10-16 Stratasys Ltd. Method and system for reuse of materials in additive manufacturing systems
WO2012167221A1 (en) * 2011-06-03 2012-12-06 Wayne State University Optofluidic tweezers
JP6321446B2 (ja) 2014-05-09 2018-05-09 学校法人大同学園 強化繊維基材の切断方法および繊維強化樹脂の製造方法
JP6462559B2 (ja) 2015-05-15 2019-01-30 東京エレクトロン株式会社 基板処理装置
JP6594680B2 (ja) 2015-07-07 2019-10-23 日立オートモティブシステムズ株式会社 中空複合磁性部材の製造方法及び製造装置並びに燃料噴射弁
US10372110B2 (en) * 2016-06-17 2019-08-06 Hamilton Sundstrand Corporation Controlled thin wall thickness of heat exchangers through modeling of additive manufacturing process

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012032258A (ja) * 2010-07-30 2012-02-16 Osaka City Univ 液滴移動装置および液滴移動方法
JP2017533851A (ja) * 2014-11-06 2017-11-16 ワッカー ケミー アクチエンゲゼルシャフトＷａｃｋｅｒ Ｃｈｅｍｉｅ ＡＧ シリコーンエラストマー部品の製造方法
WO2019156170A1 (ja) * 2018-02-07 2019-08-15 国立大学法人横浜国立大学 造形装置、液滴移動装置、目的物生産方法、液滴移動方法及びプログラム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022091137A (ja) * 2020-12-08 2022-06-20 パロ アルト リサーチ センター インコーポレイテッド 付加製造システム及びその方法

Also Published As

Publication number Publication date
JPWO2020179904A1 (enExample) 2020-09-10
US20220193979A1 (en) 2022-06-23
US12036725B2 (en) 2024-07-16
JP7313078B2 (ja) 2023-07-24

Similar Documents

Publication Publication Date Title
CN104155851B (zh) 一种飞秒激光双光子聚合微纳加工系统及方法
JP6306856B2 (ja) 微小体制御装置
US11981079B2 (en) Multi-axis additive manufacturing system
Vidler et al. Ultra-resolution scalable microprinting
Li et al. Micro-scale feature fabrication using immersed surface accumulation
JPWO2016151740A1 (ja) レーザ加熱制御機構、レーザ加熱制御方法、レーザ加熱制御プログラムおよび３次元造形装置
JP2006068762A (ja) レーザー加工方法およびレーザー加工装置
WO2012172770A1 (ja) 構造物及びその製造方法
CN110554448A (zh) 一种大眼曲率可调的人工复眼、制备方法及应用
WO2020179904A1 (ja) 造形装置、液滴移動装置、目的物生産方法、造形方法、液滴移動方法、造形プログラムおよび液滴移動プログラム
JP7039057B2 (ja) 造形装置、液滴移動装置、目的物生産方法、液滴移動方法及びプログラム
Jamil et al. Design and Fabrication of Multi-Functional Optical Microbots
Pan et al. Dynamic resolution control in a laser projection-based stereolithography system
CN103273196A (zh) 有机玻璃的co2激光选区辐照扫描加工微透镜阵列的方法
JP7504479B2 (ja) 造形装置、液柱移動装置、造形方法、液柱移動方法およびプログラム
CN116811233A (zh) 一种双分辨率投影式光固化3d打印方法
CN117995451A (zh) 基于光热气泡的微纳粒子三维操纵系统
CN203509349U (zh) 激光打点装置
TWI325066B (enExample)
Shan Vat Photopolymerization-Based Additive Manufacturing of Optical Lenses
Kafashi et al. Development of experimental facilities for investigations of microscopic mapping of fluid velocities
JP2024145633A (ja) 樹脂製マイクロニードルの形成方法
CN116811235A (zh) 投影式光固化3d打印系统
Hohnholz et al. Model-based curing depth control of aerosol jet stereolithography
Gu et al. Shear flow at openings and hydrophobic sliding at gaps: A method for fabricating deformable microlenses by extracting cavities from a liquid bath

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20766220

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2021503663

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20766220

Country of ref document: EP

Kind code of ref document: A1