WO2020173034A1 - 显示器结构 - Google Patents
显示器结构 Download PDFInfo
- Publication number
- WO2020173034A1 WO2020173034A1 PCT/CN2019/095254 CN2019095254W WO2020173034A1 WO 2020173034 A1 WO2020173034 A1 WO 2020173034A1 CN 2019095254 W CN2019095254 W CN 2019095254W WO 2020173034 A1 WO2020173034 A1 WO 2020173034A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- film layer
- thin film
- retaining wall
- light
- emitting area
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 85
- 238000009792 diffusion process Methods 0.000 claims abstract description 47
- 239000010408 film Substances 0.000 claims description 239
- 239000010409 thin film Substances 0.000 claims description 189
- 229910052760 oxygen Inorganic materials 0.000 claims description 37
- 239000001301 oxygen Substances 0.000 claims description 37
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 25
- 238000004806 packaging method and process Methods 0.000 abstract description 16
- 239000010410 layer Substances 0.000 description 326
- 239000011368 organic material Substances 0.000 description 19
- 238000005538 encapsulation Methods 0.000 description 15
- 230000004888 barrier function Effects 0.000 description 11
- 238000000034 method Methods 0.000 description 9
- 239000012044 organic layer Substances 0.000 description 7
- 238000000231 atomic layer deposition Methods 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 229910017107 AlOx Inorganic materials 0.000 description 3
- 229910020286 SiOxNy Inorganic materials 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 229910004205 SiNX Inorganic materials 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
- H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
Definitions
- the present invention relates to a display structure, in particular to a display structure that improves packaging reliability.
- organic light-emitting diodes display devices need to adopt thin film packaging (Thin film encapsulation) in order to insulate their devices from the erosion of water and oxygen and provide device reliability.
- the encapsulation, TFE process encapsulates the device.
- the commonly used thin film encapsulation method is formed by overlapping inorganic/organic/inorganic multilayer film layers.
- the main function of the inorganic layer is to block water and oxygen
- the main function of the organic layer is to cover the particles and particles produced in the previous process. Relieve the stress generated when the film is bent.
- the inorganic layer above cannot completely cover the organic layer and cause the encapsulation failure.
- a barrier (Dam) structure is prepared at the border of the OLED device (that is, the boundary of the organic layer).
- DI barrier
- the design of the retaining wall will increase the thickness of the overall film package, which will affect the bendability of the OLED display.
- the present invention provides a display structure to solve the problem that the organic material of the display film encapsulation in the prior art overflows the encapsulation area, which causes the upper inorganic layer to not completely cover the organic layer, which causes the inability to effectively block water and oxygen and cause the encapsulation to fail. problem.
- the main purpose of the present invention is to provide a display structure, which can improve the problem that the organic material encapsulated by the thin film of the display overflows the encapsulation area, and the inorganic layer above cannot completely cover the organic layer, resulting in the failure of the encapsulation due to the inability to effectively block water and oxygen.
- the secondary objective of the present invention is to provide a display structure, which can reduce the diffusion of the organic thin film layer in the area close to the retaining wall by making the diffusion speed of the organic thin film layer on the first and second inorganic thin film layers different. Speed, thereby reducing the risk of the organic film layer overflowing the retaining wall, thereby improving the packaging reliability of the display structure.
- Another object of the present invention is to provide a display structure, which can quickly spread the organic film layer on the inorganic film layer, so that the organic material of the organic film layer can be easily and quickly leveled, so that the thickness of the organic film layer can be reduced. Thin, thereby reducing the total thickness of the film packaging structure to improve the bending resistance of the film packaging structure.
- the diffusion rate of the organic material on the inorganic film layer at the set boundary of the organic film layer in the peripheral area of the substrate (near the barrier wall area) is slow, thereby slowing the diffusion of the organic material in the area close to the barrier wall Speed, reduce the risk of organic materials overflowing the retaining wall, thereby improving the reliability of OLED display packaging at the border.
- an embodiment of the present invention provides a display structure, including: a substrate; a retaining wall provided on the substrate; a first film layer provided on the substrate and covering The retaining wall; a second film layer disposed on the substrate, the second film layer and the retaining wall have a first gap; and a third film layer, disposed on the substrate, the On the first thin film layer and the second thin film layer, when the third thin film layer is disposed on the first thin film layer and the second thin film layer, wherein at the first gap, the third film layer and The first film layer is in contact, and a material of the first film layer is different from a material of the second film layer.
- the third film layer has a first diffusion rate to the first film layer and the third film layer has a second diffusion rate to the second film layer, wherein The first diffusion speed is lower than the second diffusion speed.
- it further includes: a light emitting area disposed on the substrate, wherein the second film layer is disposed on the first film layer; and the first film layer covers the The light-emitting area continuously extends across the retaining wall, the first film layer forms a stepped portion at the retaining wall, and the first gap exists between a first edge of the stepped portion and the Between a second edge of the second film layer.
- a boundary defined by the second film layer has a distance from a side of the retaining wall close to the second film layer, and the distance is greater than zero.
- it further includes: a light-emitting area disposed on the substrate, wherein the first film layer covers the retaining wall and extends toward the light-emitting area, and the first film layer is A step portion is formed at the retaining wall, and a second gap is formed between the first thin film layer and the light-emitting area; and the second thin film layer covers the light-emitting area and faces the first thin film The layer is extended, and a part of the second film layer is filled in the second gap and extends to cover the first film layer.
- it further includes: a light-emitting area disposed on the substrate, wherein the second film layer covers the light-emitting area and extends toward the retaining wall, and between the retaining walls Forming the first gap; and wherein the first thin film layer covers the retaining wall and extends to the light-emitting area, and a part of the first thin film layer fills the first gap and continues to extend to cover the The second film layer.
- it further comprises: a light-emitting area disposed on the substrate, wherein the first film layer covers the light-emitting area and continuously extends across the retaining wall, and the first film The layer forms a stepped portion at the retaining wall, and the second thin film layer is an oxygen-containing treatment layer after the first thin film layer is treated with an oxygen ion, and the second thin film layer completely covers the Light-emitting area; and the first gap in it exists between a first edge of the stepped portion and a second edge of the second film layer.
- another embodiment of the present invention provides another display structure, including: a substrate; a retaining wall disposed on the substrate; a first film layer disposed on the substrate; and a second film Layer, disposed on the substrate, the second film layer and the retaining wall have a first gap, wherein the first film layer has a first oxygen content; and the second film layer has a first gap The dioxygen content, wherein the second oxygen content is greater than the first oxygen content.
- it further includes: a light emitting area disposed on the substrate, wherein the second film layer is disposed on the first film layer; and the first film layer covers the The light-emitting area continuously extends across the retaining wall, the first film layer forms a stepped portion at the retaining wall, and the first gap exists between a first edge of the stepped portion and the Between a second edge of the second film layer.
- a boundary defined by the second film layer has a distance from a side of the retaining wall close to the second film layer, and the distance is greater than zero.
- it further includes: a light-emitting area disposed on the substrate, wherein the first film layer covers the retaining wall and extends toward the light-emitting area, and the first film layer is A step portion is formed at the retaining wall, and a second gap is formed between the first thin film layer and the light-emitting area; and the second thin film layer covers the light-emitting area and faces the first thin film The layer is extended, and a part of the second film layer is filled in the second gap and extends to cover the first film layer.
- it further includes: a light-emitting area disposed on the substrate, wherein the second film layer covers the light-emitting area and extends toward the retaining wall, and between the retaining walls Forming the first gap; and wherein the first thin film layer covers the retaining wall and extends to the light-emitting area, and a part of the first thin film layer fills the first gap and continues to extend to cover the The second film layer.
- it further comprises: a light-emitting area disposed on the substrate, wherein the first film layer covers the light-emitting area and continuously extends across the retaining wall, and the first film The layer forms a stepped portion at the retaining wall, and the second thin film layer is an oxygen-containing treatment layer after the first thin film layer is treated with an oxygen ion, and the second thin film layer completely covers the Light-emitting area; and the first gap in it exists between a first edge of the stepped portion and a second edge of the second film layer.
- another embodiment of the present invention provides another display structure, the display structure includes: a substrate; a retaining wall disposed on the substrate; a first film layer disposed on the substrate and covering The retaining wall; a second film layer disposed on the substrate, the second film layer and the retaining wall have a first gap; and a third film layer, disposed on the substrate, the On the first thin film layer and the second thin film layer, wherein when the third thin film layer is disposed on the first thin film layer and the second thin film layer, the third thin film layer has A first diffusion rate and the third film layer have a second diffusion rate to the second film layer, wherein the first diffusion rate is lower than the second diffusion rate.
- it further includes: a light emitting area disposed on the substrate, wherein the second film layer is disposed on the first film layer; and the first film layer covers the The light-emitting area continuously extends across the retaining wall, the first film layer forms a stepped portion at the retaining wall, and the first gap exists between a first edge of the stepped portion and the Between a second edge of the second film layer.
- a boundary defined by the second film layer has a distance from a side of the retaining wall close to the second film layer, and the distance is greater than zero.
- it further includes: a light-emitting area disposed on the substrate, wherein the first film layer covers the retaining wall and extends toward the light-emitting area, and the first film layer is A step portion is formed at the retaining wall, and a second gap is formed between the first thin film layer and the light-emitting area; and the second thin film layer covers the light-emitting area and faces the first thin film The layer is extended, and a part of the second film layer is filled in the second gap and extends to cover the first film layer.
- it further includes: a light-emitting area disposed on the substrate, wherein the second film layer covers the light-emitting area and extends toward the retaining wall, and between the retaining walls Forming the first gap; and wherein the first thin film layer covers the retaining wall and extends to the light-emitting area, and a part of the first thin film layer fills the first gap and continues to extend to cover the The second film layer.
- it further comprises: a light-emitting area disposed on the substrate, wherein the first film layer covers the light-emitting area and continuously extends across the retaining wall, and the first film The layer forms a stepped portion at the retaining wall, and the second thin film layer is an oxygen-containing treatment layer after the first thin film layer is treated with an oxygen ion, and the second thin film layer completely covers the Light-emitting area; and the first gap in it exists between a first edge of the stepped portion and a second edge of the second film layer.
- the display structure of the present invention can reduce the diffusion speed of the organic thin film layer in the area close to the retaining wall by making the diffusion speed of the organic thin film layer on the first and second inorganic thin film layers different. , Thereby reducing the risk of the organic film layer overflowing the retaining wall, thereby improving the packaging reliability of the display structure. Furthermore, the display structure of the present invention can quickly spread the organic thin film layer on the inorganic film layer, so that the organic material of the organic thin film layer can be easily and quickly leveled, so that the thickness of the organic thin film layer can be reduced, thereby reducing the film thickness. The total thickness of the package structure to improve the bending resistance of the film package structure.
- the diffusion rate of the organic material on the inorganic film layer at the set boundary of the organic film layer in the peripheral area of the substrate is slow, thereby slowing the diffusion of the organic material in the area close to the barrier wall Speed, reduce the risk of organic materials overflowing the retaining wall, thereby improving the reliability of OLED display packaging at the border.
- FIG. 1 is a schematic cross-sectional view of the display structure of the first embodiment of the present invention
- FIG. 2 is a schematic cross-sectional view of the display structure of the second embodiment of the present invention.
- FIG. 3 is a schematic cross-sectional view of the display structure of the third embodiment of the present invention.
- FIG. 4 is a schematic cross-sectional view of the display structure of the fourth embodiment of the present invention.
- an embodiment of the present invention provides a display structure in order to achieve the foregoing objective of the present invention.
- the display structure includes: a substrate 100, a barrier 400, a first film layer 301, a second film layer 302, and a third film layer 303.
- the retaining wall 400 is arranged on the substrate 100.
- the first film layer 301 is disposed on the substrate 100 and covers the retaining wall 400.
- the second film layer 302 is disposed on the substrate 100, and there is a first gap 500 between the second film layer 302 and the retaining wall 400.
- the third film layer 303 is disposed on the substrate 100, the first film layer 301, and the second film layer 302, wherein when the third film layer 303 is disposed on the first film layer 301 And the second film layer 302, the third film layer 303 has a first diffusion rate to the first film layer 301 and the third film layer 303 has a second diffusion rate to the second film layer 302 Speed, wherein the first diffusion speed is lower than the second diffusion speed.
- FIG. 1 will use FIG. 1 to describe in detail the detailed structure, assembly relationship, and operation principle of the above-mentioned components of the first embodiment one by one.
- FIG. 1 shows a schematic cross-sectional view of a display structure according to a first embodiment of the present invention.
- the display structure includes: a substrate 100, a display element layer, a barrier 400, and a multilayer thin film encapsulation layer 300.
- the multi-layer thin film encapsulation layer 300 may be a first thin film layer 301, a second thin film layer 302, a third thin film layer 303, and a fourth thin film layer.
- the substrate 100 may be a flexible substrate, such as a polyimide substrate.
- the substrate 100 may be a rigid substrate, and a flexible film layer is disposed on the rigid substrate.
- the display element layer includes a light-emitting area 200 disposed on the substrate 100, and the light-emitting area 200 has, for example, a plurality of OLED elements.
- the display element layer includes an active area disposed on the substrate 100, and the active area has a plurality of display elements (for example, a plurality of thin film transistors).
- the retaining wall 400 is arranged on the substrate 100.
- the retaining wall 400 is provided on the substrate 100 by ink-jet printing using an ink material.
- the retaining wall 400 is arranged outside the light-emitting area 200 and surrounds the light-emitting area 200.
- the first film layer 301 is disposed on the substrate 100 and covers the retaining wall 400.
- the first thin film layer 301 is a first inorganic thin film layer.
- the first thin film layer 301 completely covers the light-emitting area 200 and continuously extends across the retaining wall 400, and the first thin film layer 301 forms a step 401 at the retaining wall 400.
- the first thin film layer 301 is formed by a process such as chemical vapor deposition (CVD), atomic layer deposition (ALD), etc.
- the material of the first thin film layer 301 is selected from the group consisting of SiNx, SiOxNy and AlOx.
- the second thin film layer 302 is disposed on the substrate 100.
- the second film layer 302 is disposed on the first film layer 301.
- the second film layer 302 completely covers the light-emitting area 200 and does not cover the retaining wall 400.
- the second film layer 302 and the retaining wall 400 have a first gap 500.
- the first gap 500 exists between a first edge of the step portion 401 and a second edge of the second film layer 302. Between the edges. In other words, a boundary defined by the second film layer 302 is still a certain distance away from the side of the retaining wall 400 close to the second film layer 302, and the distance is greater than zero.
- the second thin film layer 302 is a second inorganic layer.
- the second thin film layer 302 is formed by processes such as chemical vapor deposition (CVD), atomic layer deposition (ALD), and sputtering.
- the material of the second thin film layer 302 is selected from the group consisting of SiOxNy, SiOx and AlOx.
- the third film layer 303 is disposed on the substrate 100, the first film layer 301, and the second film layer 302, wherein when the third film layer 303 is disposed on the first film layer 301 And the second film layer 302, wherein when the third film layer is disposed on the first film layer and the second film layer, wherein at the first gap, the third film layer and the first film layer
- the layers are in contact, and a material of the first film layer is different from a material of the second film layer.
- the third thin film layer 303 has a first diffusion speed to the first thin film layer 301 and the third thin film layer 303 has a second diffusion speed to the second thin film layer 302, wherein the first diffusion The speed is lower than the second diffusion speed.
- the material of the third thin film layer 303 can quickly diffuse, so that the material of the third thin film layer 303 can be quickly leveled, and thus The thickness of the third thin film layer 303 is reduced.
- the third thin film layer 303 is on the first thin film layer 301, because the material of the third thin film layer 303 diffuses slowly in the first thin film layer 301, it slows down The diffusion rate of the material of the third film layer 303 in the region close to the barrier wall 400 reduces the risk of the material of the third film layer 303 overflowing the barrier wall 400.
- the third thin film layer 303 is disposed on the substrate 100, the first thin film layer 301, and the second thin film layer 302 through an inkjet printing process.
- the third film layer 303 completely covers the second film layer 302 and extends to fill the first gap 500.
- the third film layer 303 is in contact with the first edge of the step portion 401.
- the fourth film layer covers the third film layer 303 and the first film layer 301.
- the fourth film layer completely covers the light-emitting area 200, the retaining wall 400, the third film layer 303, and the first film layer 301.
- the fourth thin film layer is formed by processes such as chemical vapor deposition (CVD), atomic layer deposition (ALD), and sputtering.
- the material of the fourth thin film layer is selected from the group consisting of SiNx, SiOxNy and AlOx.
- FIG. 2 shows a schematic cross-sectional view of the display structure of the second embodiment of the present invention.
- the display structure of the second embodiment of the present invention is substantially the same as the display structure of the first embodiment. The difference is that the first film layer 301 covers the retaining wall 400 and extends toward the light-emitting area 200, and the A thin film layer 301 forms a step 401 at the retaining wall 400, and a second gap 600 is formed between the first thin film layer 301 and the light-emitting area 200; and the second thin film layer 302 covers The light-emitting area 200 extends toward the first thin film layer 301, and a part of the second thin film layer 302 fills the second gap 600 and extends to cover the first thin film layer 301.
- the first thin film layer 301 does not cover the light emitting area 200, so that the first thin film layer 301 exists between the light emitting area 200 and the first thin film layer 301.
- Two gap 600 the second thin film layer 302 covers the light-emitting area 200 and continuously extends to fill the second gap 600, and the extended portion covers the first thin film layer 301. Therefore, when the third thin film layer 303 is on the second thin film layer 302, the material of the third thin film layer 303 can still diffuse rapidly, so that the material of the third thin film layer 303 can be quickly leveled. In turn, the thickness of the third thin film layer 303 is reduced.
- the material of the third film layer 303 is in the first film layer 301.
- the diffusion speed of the thin film layer 301 is slow, thus slowing down the diffusion speed of the material of the third thin film layer 303 in the area close to the retaining wall 400, thereby reducing the risk of the material of the third thin film layer 303 overflowing the retaining wall 400.
- FIG. 3 shows a schematic cross-sectional view of a display structure according to a third embodiment of the present invention.
- the display structure of the third embodiment of the present invention is substantially the same as the display structure of the second embodiment.
- the difference is that the second film layer 302 covers the light-emitting area 200 and extends toward the retaining wall 400, and the The first gap 500 is formed between the retaining walls 400; and the first thin film layer 301 covers the retaining wall 400 and extends toward the light-emitting area 200, and a part of the first thin film layer 301 is filled in The first gap 500 continues to extend and cover the second film layer 302.
- the second thin film layer 302 is formed before the first thin film layer 301, and a part of the first thin film layer 301 covers the second thin film layer. 302 on.
- the first thin film layer 301 has a third gap from the light emitting area 200. Therefore, when the third thin film layer 303 is on the second thin film layer 302, the material of the third thin film layer 303 can still diffuse rapidly, so that the material of the third thin film layer 303 can be quickly leveled. In turn, the thickness of the third thin film layer 303 is reduced.
- the third film layer 303 flows to the first film layer 301 covering the second film layer 302, because the material of the third film layer 303 is in the first film
- the diffusion speed of the layer 301 is relatively slow, thus slowing down the diffusion speed of the material of the third film layer 303 in the area close to the retaining wall 400, thereby reducing the risk of the material of the third film layer 303 overflowing the retaining wall 400.
- FIG. 4 shows a schematic cross-sectional view of a display structure according to a fourth embodiment of the present invention.
- the display structure of the fourth embodiment of the present invention is substantially the same as the display structure of the first embodiment.
- the difference is that the first film layer 301 covers the light-emitting area 200 and continuously extends across the retaining wall 400, so The first thin film layer 301 forms a step portion 401 at the retaining wall 400, and the second thin film layer 302 is an oxygen-containing treatment layer after the first thin film layer 301 is treated with an oxygen ion.
- the second thin film layer 302 completely covers the light-emitting area 200; and the first gap 500 exists between a first edge of the step portion 401 and a second edge of the second thin film layer 302.
- the second thin film layer 302 is formed by treating part of the first thin film layer 301 with the oxygen ion instead of providing an additional layer of inorganic The layer is on the first thin film layer 301.
- another embodiment of the present invention further provides a display structure
- the display structure includes: a substrate; a retaining wall disposed on the substrate; a first film layer disposed on the substrate; and A second thin film layer disposed on the substrate, the second thin film layer and the retaining wall have a first gap, wherein the first thin film layer has a first oxygen content; and the second thin film The layer has a second oxygen content, wherein the second oxygen content is greater than the first oxygen content.
- the display structure further includes: a light-emitting area disposed on the substrate, wherein the second thin film layer is disposed on the first thin film layer; and the first thin film layer covers the The light-emitting area continuously extends across the retaining wall, the first film layer forms a stepped portion at the retaining wall, and the first gap exists between a first edge of the stepped portion and the first edge Between a second edge of the two film layers.
- the display structure further includes: a light-emitting area disposed on the substrate, wherein the first thin film layer covers the retaining wall and extends toward the light-emitting area, and the first thin film layer is on the A step portion is formed at the retaining wall, and a second gap is formed between the first thin film layer and the light-emitting area; and the second thin film layer covers the light-emitting area and extends toward the first thin film layer , And a part of the second film layer is filled into the second gap and extends to cover the first film layer.
- the display structure further includes: a light-emitting area disposed on the substrate, wherein the second film layer covers the light-emitting area and extends toward the retaining wall, and a light-emitting area is formed between the retaining walls.
- the first gap; and the first film layer covers the retaining wall and extends to the light-emitting area, and a part of the first film layer fills the first gap and continues to extend to cover the first Two film layers.
- the display structure further includes: a light-emitting area disposed on the substrate, wherein the first film layer covers the light-emitting area and continuously extends across the retaining wall, and the first film layer A step portion is formed at the retaining wall, and the second thin film layer is an oxygen-containing treatment layer after the first thin film layer is processed by an oxygen ion, and the second thin film layer completely covers the light-emitting area ; And the first gap exists between a first edge of the stepped portion and a second edge of the second film layer.
- the organic material overflows the encapsulation area, and the upper inorganic layer cannot completely cover the organic layer, which causes the problem that the encapsulation fails because of the inability to effectively block water and oxygen.
- the diffusion speed of the organic thin film layer on the first and second inorganic thin film layers is different, so as to slow down the diffusion speed of the organic thin film layer in the area close to the retaining wall, thereby reducing the organic thin film layer overflowing the retaining wall Therefore, the packaging reliability of the display structure is improved.
- the display structure of the present invention quickly diffuses the organic thin film layer on the inorganic film layer, so that the organic material of the organic thin film layer is easy to quickly level, so that the thickness of the organic thin film layer can be reduced, thereby reducing the total thickness of the thin film packaging structure , In order to improve the bending resistance of the film packaging structure.
- the diffusion rate of the organic material on the inorganic film layer at the set boundary of the organic film layer in the peripheral area of the substrate is slow, thereby slowing the diffusion of the organic material in the area close to the barrier wall Speed, reduce the risk of organic materials overflowing the retaining wall, thereby improving the reliability of OLED display packaging at the border.
- the first inorganic thin film layer has a first oxygen content; and the second inorganic thin film layer has a second oxygen content, wherein the second oxygen content is greater than the first oxygen content. Content, thereby reducing the risk of the organic film layer overflowing the retaining wall, thereby improving the packaging reliability of the display structure.
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Abstract
一种显示器结构，包含：一基板（100）、一挡墙（400）、一第一薄膜层（301）、一第二薄膜层（302）及一第三薄膜层（303），其中所述第三薄膜层（303）对所述第一薄膜层（301）具有一第一扩散速度及所述第三薄膜层（303）对所述第二薄膜层（302）具有一第二扩散速度，其中所述第一扩散速度低于所述第二扩散速度。通过使第三薄膜层（303）在第一、第二薄膜层上的扩散速度不同，以达到减缓第三薄膜层（303）在靠近挡墙区域的扩散速度，进而降低第三薄膜层（303）溢出挡墙（400）的风险，从而提高显示器结构的封装可靠性。
Description
本发明是有关于一种显示器结构，特别是有关于一种提高封装可靠性的显示器结构。
近年来，有机发光二极管（organic light-emitting diodes, OLEDs）显示装置为了隔绝水氧对其器件的侵蚀，提供器件的可靠性，需要采用薄膜封装(Thin film
encapsulation, TFE)工艺对器件进行封装。而目前常用的薄膜封装方式为无机/有机/无机多层膜层交叠而成，其中无机层的主要作用是阻隔水氧，而有机层的主要作用是包覆前段制程过程中产生的粒子及缓解膜层弯曲时产生的应力。为防止有机层的有机材料溢出封装区域导致上方的无机层无法完全覆盖有机层从而造成封装失效，一般会在OLED器件边框处（即有机层设定边界处）制备挡墙（Dam）结构，用于防止有机材料在边框处溢出。但此种挡墙设计方式中有机材料仍有溢出的风险，从而造成封装可靠性降低。再者，挡墙的设计将使得整体薄膜封装的厚度增加，对于OLED显示器的可弯折性造成影响。
故，有必要提供一种显示器结构，以解决现有技术所存在的问题。
现有技术中挡墙设计方式中有机材料仍有溢出的风险，从而造成封装可靠性降低。再者，挡墙的设计将使得整体薄膜封装的厚度增加，对于OLED显示器的可弯折性造成影响。
有鉴于此，本发明提供一种显示器结构，以解决现有技术所存在的显示器薄膜封装的有机材料溢出封装区域导致上方的无机层无法完全覆盖有机层从而造成无法有效阻隔水氧导致封装失效的问题。
本发明的主要目的在于提供一种显示器结构，其可以改善显示器薄膜封装的有机材料溢出封装区域导致上方的无机层无法完全覆盖有机层从而造成无法有效阻隔水氧导致封装失效的问题。
本发明的次要目的在于提供一种显示器结构，其可以通过使有机薄膜层在第一、第二无机薄膜层上的扩散速度不同，以达到减缓所述有机薄膜层在靠近挡墙区域的扩散速度，进而降低有机薄膜层溢出挡墙的风险，从而提高显示器结构的封装可靠性。
本发明的另一目的在于提供一种显示器结构，其可以通过使有机薄膜层在无机膜层上快速扩散，使得所述有机薄膜层的有机材料易于快速流平，从而可以使有机薄膜层厚度减薄，进而降低薄膜封装结构的总厚度，以提高薄膜封装结构的耐弯折性能。另外，在基板外围区域的所述有机薄膜层的设定边界（靠近挡墙区域）处所述有机材料在所述无机膜层上扩散速度较慢，从而减缓有机材料在靠近挡墙区域的扩散速度，降低有机材料溢出挡墙的风险，从而提高OLED显示器在边界处封装可靠性。
为达成本发明的前述目的，本发明的一个实施例提供一种显示器结构，包含：一基板；一挡墙，设置于所述基板上；一第一薄膜层，设置于所述基板上并覆盖所述挡墙；一第二薄膜层，设置于所述基板上，所述第二薄膜层与所述挡墙具有一第一间隙；及一第三薄膜层，设置于所述基板、所述第一薄膜层及所述第二薄膜层上，其中当所述第三薄膜层设置于所述第一薄膜层及第二薄膜层时，其中在第一间隙处，所述第三膜层与所述第一膜层相接触，及所述第一膜层的一材料与所述第二膜层的一材料不同。
在本发明的一个实施例中，所述第三薄膜层对所述第一薄膜层具有一第一扩散速度及所述第三薄膜层对所述第二薄膜层具有一第二扩散速度，其中所述第一扩散速度低于所述第二扩散速度。
在本发明的一个实施例中，更包含：一发光区，设置于所述基板上，其中所述第二薄膜层设置于所述第一薄膜层上；及其中所述第一薄膜层覆盖所述发光区并连续延伸跨过所述挡墙，所述第一薄膜层于所述挡墙处形成一阶梯部，及所述第一间隙存在于所述阶梯部的一第一边缘与所述第二薄膜层的一第二边缘之间。
在本发明的一个实施例中，所述第二薄膜层所定义的一边界处距离所述挡墙靠近所述第二薄膜层的一侧具有一距离，所述距离大于0。
在本发明的一个实施例中，更包含：一发光区，设置于所述基板上，其中所述第一薄膜层覆盖所述挡墙并向所述发光区延伸，所述第一薄膜层于所述挡墙处形成一阶梯部，及所述第一薄膜层与所述发光区之间具有一第二间隙；及其中所述第二薄膜层覆盖所述发光区并向所述第一薄膜层延伸，及一部分的所述第二薄膜层填入所述第二间隙中，并延伸覆盖在所述第一薄膜层上。
在本发明的一个实施例中，更包含：一发光区，设置于所述基板上，其中所述第二薄膜层覆盖所述发光区并向所述挡墙延伸，并所述挡墙之间形成所述第一间隙；及其中所述第一薄膜层覆盖所述挡墙并向所述发光区延伸，及一部分的所述第一薄膜层填入所述第一间隙并继续延伸覆盖在所述第二薄膜层上。
在本发明的一个实施例中，更包含：一发光区，设置于所述基板上，其中所述第一薄膜层覆盖所述发光区并连续延伸跨过所述挡墙，所述第一薄膜层于所述挡墙处形成一阶梯部，及其中所述第二薄膜层为所述第一薄膜层通过一氧离子处理后的一含氧处理层，所述第二薄膜层完全覆盖所述发光区；及其中所述第一间隙存在于所述阶梯部的一第一边缘与所述第二薄膜层的一第二边缘之间。
再者，本发明另一实施例另提供一种显示器结构，包含：一基板；一挡墙，设置于所述基板上；一第一薄膜层，设置于所述基板上；及一第二薄膜层，设置于所述基板上，所述第二薄膜层与所述挡墙具有一第一间隙，其中所述第一薄膜层具有一第一氧含量；及所述第二薄膜层具有一第二氧含量，其中所述第二氧含量大于所述第一氧含量。
在本发明的一个实施例中，更包含：一发光区，设置于所述基板上，其中所述第二薄膜层设置于所述第一薄膜层上；及其中所述第一薄膜层覆盖所述发光区并连续延伸跨过所述挡墙，所述第一薄膜层于所述挡墙处形成一阶梯部，及所述第一间隙存在于所述阶梯部的一第一边缘与所述第二薄膜层的一第二边缘之间。
在本发明的一个实施例中，所述第二薄膜层所定义的一边界处距离所述挡墙靠近所述第二薄膜层的一侧具有一距离，所述距离大于0。
在本发明的一个实施例中，更包含：一发光区，设置于所述基板上，其中所述第一薄膜层覆盖所述挡墙并向所述发光区延伸，所述第一薄膜层于所述挡墙处形成一阶梯部，及所述第一薄膜层与所述发光区之间具有一第二间隙；及其中所述第二薄膜层覆盖所述发光区并向所述第一薄膜层延伸，及一部分的所述第二薄膜层填入所述第二间隙中，并延伸覆盖在所述第一薄膜层上。
在本发明的一个实施例中，更包含：一发光区，设置于所述基板上，其中所述第二薄膜层覆盖所述发光区并向所述挡墙延伸，并所述挡墙之间形成所述第一间隙；及其中所述第一薄膜层覆盖所述挡墙并向所述发光区延伸，及一部分的所述第一薄膜层填入所述第一间隙并继续延伸覆盖在所述第二薄膜层上。
在本发明的一个实施例中，更包含：一发光区，设置于所述基板上，其中所述第一薄膜层覆盖所述发光区并连续延伸跨过所述挡墙，所述第一薄膜层于所述挡墙处形成一阶梯部，及其中所述第二薄膜层为所述第一薄膜层通过一氧离子处理后的一含氧处理层，所述第二薄膜层完全覆盖所述发光区；及其中所述第一间隙存在于所述阶梯部的一第一边缘与所述第二薄膜层的一第二边缘之间。
再者，本发明又一实施例另提供一种显示器结构，所述显示器结构包含：一基板；一挡墙，设置于所述基板上；一第一薄膜层，设置于所述基板上并覆盖所述挡墙；一第二薄膜层，设置于所述基板上，所述第二薄膜层与所述挡墙具有一第一间隙；及一第三薄膜层，设置于所述基板、所述第一薄膜层及所述第二薄膜层上，其中当所述第三薄膜层设置于所述第一薄膜层及第二薄膜层时，所述第三薄膜层对所述第一薄膜层具有一第一扩散速度及所述第三薄膜层对所述第二薄膜层具有一第二扩散速度，其中所述第一扩散速度低于所述第二扩散速度。
在本发明的一个实施例中，更包含：一发光区，设置于所述基板上，其中所述第二薄膜层设置于所述第一薄膜层上；及其中所述第一薄膜层覆盖所述发光区并连续延伸跨过所述挡墙，所述第一薄膜层于所述挡墙处形成一阶梯部，及所述第一间隙存在于所述阶梯部的一第一边缘与所述第二薄膜层的一第二边缘之间。
在本发明的一个实施例中，所述第二薄膜层所定义的一边界处距离所述挡墙靠近所述第二薄膜层的一侧具有一距离，所述距离大于0。
在本发明的一个实施例中，更包含：一发光区，设置于所述基板上，其中所述第一薄膜层覆盖所述挡墙并向所述发光区延伸，所述第一薄膜层于所述挡墙处形成一阶梯部，及所述第一薄膜层与所述发光区之间具有一第二间隙；及其中所述第二薄膜层覆盖所述发光区并向所述第一薄膜层延伸，及一部分的所述第二薄膜层填入所述第二间隙中，并延伸覆盖在所述第一薄膜层上。
在本发明的一个实施例中，更包含：一发光区，设置于所述基板上，其中所述第二薄膜层覆盖所述发光区并向所述挡墙延伸，并所述挡墙之间形成所述第一间隙；及其中所述第一薄膜层覆盖所述挡墙并向所述发光区延伸，及一部分的所述第一薄膜层填入所述第一间隙并继续延伸覆盖在所述第二薄膜层上。
在本发明的一个实施例中，更包含：一发光区，设置于所述基板上，其中所述第一薄膜层覆盖所述发光区并连续延伸跨过所述挡墙，所述第一薄膜层于所述挡墙处形成一阶梯部，及其中所述第二薄膜层为所述第一薄膜层通过一氧离子处理后的一含氧处理层，所述第二薄膜层完全覆盖所述发光区；及其中所述第一间隙存在于所述阶梯部的一第一边缘与所述第二薄膜层的一第二边缘之间。
与现有技术相比较，本发明的显示器结构，可以通过使有机薄膜层在第一、第二无机薄膜层上的扩散速度不同，以达到减缓所述有机薄膜层在靠近挡墙区域的扩散速度，进而降低有机薄膜层溢出挡墙的风险，从而提高显示器结构的封装可靠性。再者，本发明的显示器结构，可以通过使有机薄膜层在无机膜层上快速扩散，使得所述有机薄膜层的有机材料易于快速流平，从而可以使有机薄膜层厚度减薄，进而降低薄膜封装结构的总厚度，以提高薄膜封装结构的耐弯折性能。另外，在基板外围区域的所述有机薄膜层的设定边界（靠近挡墙区域）处所述有机材料在所述无机膜层上扩散速度较慢，从而减缓有机材料在靠近挡墙区域的扩散速度，降低有机材料溢出挡墙的风险，从而提高OLED显示器在边界处封装可靠性。
为让本发明的上述内容能更明显易懂，下文特举优选实施例，并配合所附图式，作详细说明如下：
图1是本发明第一实施例的显示器结构示意剖面图；
图2是本发明第二实施例的显示器结构示意剖面图；
图3是本发明第三实施例的显示器结构示意剖面图；
图4是本发明第四实施例的显示器结构示意剖面图。
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。再者，本发明所提到的方向用语，例如上、下、顶、底、前、后、左、右、内、外、侧面、周围、中央、水平、横向、垂直、纵向、轴向、径向、最上层或最下层等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
请参照图1所示，本发明实施例为达成本发明的前述目的，提供一种显示器结构。所述显示器结构包含：一基板100、一挡墙400、一第一薄膜层301、一第二薄膜层302及一第三薄膜层303。所述挡墙400，设置于所述基板100上。所述第一薄膜层301，设置于所述基板100上并覆盖所述挡墙400。所述第二薄膜层302，设置于所述基板100上，所述第二薄膜层302与所述挡墙400具有一第一间隙500。所述第三薄膜层303，设置于所述基板100、所述第一薄膜层301及所述第二薄膜层302上，其中当所述第三薄膜层303设置于所述第一薄膜层301及第二薄膜层302时，所述第三薄膜层303对所述第一薄膜层301具有一第一扩散速度及所述第三薄膜层303对所述第二薄膜层302具有一第二扩散速度，其中所述第一扩散速度低于所述第二扩散速度。
本发明将于下文利用图1逐一详细说明第一实施例上述各元件的细部构造、组装关系及其运作原理。
请参照图1，示出了本发明第一实施例的显示器结构示意剖面图。所述显示器结构包含：一基板100、一显示器元件层、一挡墙400及多层薄膜封装层300。可选地，所述多层薄膜封装层300可以为一第一薄膜层301、一第二薄膜层302、一第三薄膜层303及一第四薄膜层。所述基板100可以为一柔性基板，例如一聚酰亚胺基板。替代地，所述基板100可以为一刚性基板，所述刚性基板上设置有一柔性薄膜层。例如，一玻璃基板，所述玻璃基板上设置有一聚酰亚胺薄膜层。所述显示器元件层包含一发光区200设置于所述基板100上，所述发光区200例如具有多个OLED元件。替代地，所述显示器元件层包含一有源区设置于所述基板100上，所述有源区具有多个显示元件（例如多个薄膜晶体管）。所述挡墙400，设置于所述基板100上。可选地，所述挡墙400通过一油墨材料，通过喷墨打印的方式设置于基板100上。优选地，所述挡墙400设置在所述发光区200之外并围绕所述发光区200。所述第一薄膜层301，设置于所述基板100上并覆盖所述挡墙400。优选地，所述第一薄膜层301为一第一无机薄膜层。优选地，所述第一薄膜层301完全覆盖所述发光区200，并连续延伸跨过所述挡墙400，所述第一薄膜层301于所述挡墙400处形成一阶梯部401。可选地，所述第一薄膜层301通过化学气相沉积（CVD）、原子层沉积（ALD）等工艺形成。可选地，所述第一薄膜层301的材料选自由以下组成的群组：SiNx、SiOxNy及AlOx。所述第二薄膜层302，设置于所述基板100上。优选地，所述第二薄膜层302设置于所述第一薄膜层301上。优选地，所述第二薄膜层302完全覆盖所述发光区200且不覆盖所述挡墙400。所述第二薄膜层302与所述挡墙400具有一第一间隙500，所述第一间隙500存在于所述阶梯部401的一第一边缘与所述第二薄膜层302的一第二边缘之间。换句话说，所述第二薄膜层302所定义的一边界处距离所述挡墙400靠近所述第二薄膜层302的一侧仍存在一定距离，所述距离大于0。优选地，所述第二薄膜层302为一第二无机层。可选地，所述第二薄膜层302通过化学气相沉积（CVD）、原子层沉积（ALD）及溅镀等工艺形成。可选地，所述第二薄膜层302的材料选自由以下组成的群组：SiOxNy、SiOx及AlOx。所述第三薄膜层303，设置于所述基板100、所述第一薄膜层301及所述第二薄膜层302上，其中当所述第三薄膜层303设置于所述第一薄膜层301及第二薄膜层302时，其中当所述第三薄膜层设置于所述第一薄膜层及第二薄膜层时，其中在第一间隙处，所述第三膜层与所述第一膜层相接触，及所述第一膜层的一材料与所述第二膜层的一材料不同。所述第三薄膜层303对所述第一薄膜层301具有一第一扩散速度及所述第三薄膜层303对所述第二薄膜层302具有一第二扩散速度，其中所述第一扩散速度低于所述第二扩散速度。如此，当所述第三薄膜层303在所述第二薄膜层302上时，所述第三薄膜层303的材料可以快速扩散，使得所述第三薄膜层303的材料可以快速流平，进而降低所述第三薄膜层303的厚度。另一方面，当所述第三薄膜层303在所述第一薄膜层301上时，因所述第三薄膜层303的材料在所述第一薄膜层301的扩散速度较慢，因而减缓所述第三薄膜层303的材料在靠近挡墙400区域的扩散速度，从而降低所述第三薄膜层303的材料溢出挡墙400的风险。优选地，所述第三薄膜层303通过喷墨打印工艺设置在所述基板100、所述第一薄膜层301及所述第二薄膜层302上。可选地，所述第三薄膜层303完全覆盖所述第二薄膜层302，并延伸填入所述第一间隙500中。可选地，所述第三薄膜层303与所述阶梯部401的所述第一边缘相接触。可选地，所述第四薄膜层覆盖所述第三薄膜层303及所述第一薄膜层301。优选地，所述第四薄膜层完全覆盖所述发光区200、所述挡墙400、所述第三薄膜层303及所述第一薄膜层301。可选地，所述第四薄膜层通过化学气相沉积（CVD）、原子层沉积（ALD）及溅镀等工艺形成。可选地，所述第四薄膜层的材料选自由以下组成的群组：SiNx、SiOxNy及AlOx。
接着，请参照图2所示，示出了本发明第二实施例的显示器结构示意剖面图。本发明第二实施例的显示器结构与第一实施例的显示器结构大致相同，其差异点在于：所述第一薄膜层301覆盖所述挡墙400并向所述发光区200延伸，所述第一薄膜层301于所述挡墙400处形成一阶梯部401，及所述第一薄膜层301与所述发光区200之间具有一第二间隙600；及其中所述第二薄膜层302覆盖所述发光区200并向所述第一薄膜层301延伸，及一部分的所述第二薄膜层302填入所述第二间隙600中，并延伸覆盖在所述第一薄膜层301上。换句话说，本发明第二实施例的显示器结构中，所述第一薄膜层301不覆盖所述发光区200，使得所述发光区200与所述第一薄膜层301之间存在所述第二间隙600。接着，所述第二薄膜层302覆盖所述发光区200并连续延伸填入所述第二间隙600中，并延伸部分覆盖在所述第一薄膜层301上。因此，当所述第三薄膜层303在所述第二薄膜层302上时，所述第三薄膜层303的材料仍然可以快速扩散，使得所述第三薄膜层303的材料可以快速流平，进而降低所述第三薄膜层303的厚度。另一方面，当所述第三薄膜层303流过所述第二薄膜层302后，流至所述第一薄膜层301处时，因所述第三薄膜层303的材料在所述第一薄膜层301的扩散速度较慢，因而减缓所述第三薄膜层303的材料在靠近挡墙400区域的扩散速度，从而降低所述第三薄膜层303的材料溢出挡墙400的风险。
请参照图3所示，示出了本发明第三实施例的显示器结构示意剖面图。本发明第三实施例的显示器结构与第二实施例的显示器结构大致相同，其差异点在于：所述第二薄膜层302覆盖所述发光区200并向所述挡墙400延伸，并所述挡墙400之间形成所述第一间隙500；及其中所述第一薄膜层301覆盖所述挡墙400并向所述发光区200延伸，及一部分的所述第一薄膜层301填入所述第一间隙500并继续延伸覆盖在所述第二薄膜层302上。换句话说，本发明第三实施例的显示器结构中，所述第二薄膜层302形成在所述第一薄膜层301之前，部分的所述第一薄膜层301覆盖在所述第二薄膜层302上。所述第一薄膜层301距离所述发光区200具有一第三间隙。因此，当所述第三薄膜层303在所述第二薄膜层302上时，所述第三薄膜层303的材料仍然可以快速扩散，使得所述第三薄膜层303的材料可以快速流平，进而降低所述第三薄膜层303的厚度。另一方面，当所述第三薄膜层303流至覆盖在所述第二薄膜层302的所述第一薄膜层301处时，因所述第三薄膜层303的材料在所述第一薄膜层301的扩散速度较慢，因而减缓所述第三薄膜层303的材料在靠近挡墙400区域的扩散速度，从而降低所述第三薄膜层303的材料溢出挡墙400的风险。
请参照图4所示，示出了本发明第四实施例的显示器结构示意剖面图。本发明第四实施例的显示器结构与第一实施例的显示器结构大致相同，其差异点在于：所述第一薄膜层301覆盖所述发光区200并连续延伸跨过所述挡墙400，所述第一薄膜层301于所述挡墙400处形成一阶梯部401，及其中所述第二薄膜层302为所述第一薄膜层301通过一氧离子处理后的一含氧处理层，所述第二薄膜层302完全覆盖所述发光区200；及其中所述第一间隙500存在于所述阶梯部401的一第一边缘与所述第二薄膜层302的一第二边缘之间。换句话说，本发明第四实施例的显示器结构中，所述第二薄膜层302为通过对部分的所述第一薄膜层301通过所述氧离子处理后形成，而不是另外设置一层无机层在所述第一薄膜层301上。
再者，本发明另一实施例另提供一种显示器结构，所述显示器结构包含：一基板；一挡墙，设置于所述基板上；一第一薄膜层，设置于所述基板上；及一第二薄膜层，设置于所述基板上，所述第二薄膜层与所述挡墙具有一第一间隙，其中所述第一薄膜层具有一第一氧含量；及所述第二薄膜层具有一第二氧含量，其中所述第二氧含量大于所述第一氧含量。
可选地，所述显示器结构更包含：一发光区，设置于所述基板上，其中所述第二薄膜层设置于所述第一薄膜层上；及其中所述第一薄膜层覆盖所述发光区并连续延伸跨过所述挡墙，所述第一薄膜层于所述挡墙处形成一阶梯部，及所述第一间隙存在于所述阶梯部的一第一边缘与所述第二薄膜层的一第二边缘之间。
替代地，所述显示器结构更包含：一发光区，设置于所述基板上，其中所述第一薄膜层覆盖所述挡墙并向所述发光区延伸，所述第一薄膜层于所述挡墙处形成一阶梯部，及所述第一薄膜层与所述发光区之间具有一第二间隙；及其中所述第二薄膜层覆盖所述发光区并向所述第一薄膜层延伸，及一部分的所述第二薄膜层填入所述第二间隙中，并延伸覆盖在所述第一薄膜层上。
替代地，所述显示器结构更包含：一发光区，设置于所述基板上，其中所述第二薄膜层覆盖所述发光区并向所述挡墙延伸，并所述挡墙之间形成所述第一间隙；及其中所述第一薄膜层覆盖所述挡墙并向所述发光区延伸，及一部分的所述第一薄膜层填入所述第一间隙并继续延伸覆盖在所述第二薄膜层上。
替代地，所述显示器结构更包含：一发光区，设置于所述基板上，其中所述第一薄膜层覆盖所述发光区并连续延伸跨过所述挡墙，所述第一薄膜层于所述挡墙处形成一阶梯部，及其中所述第二薄膜层为所述第一薄膜层通过一氧离子处理后的一含氧处理层，所述第二薄膜层完全覆盖所述发光区；及其中所述第一间隙存在于所述阶梯部的一第一边缘与所述第二薄膜层的一第二边缘之间。
如上所述，相较于现有显示器薄膜封装的有机材料溢出封装区域导致上方的无机层无法完全覆盖有机层从而造成无法有效阻隔水氧导致封装失效的问题。本发明的显示器结构通过使有机薄膜层在第一、第二无机薄膜层上的扩散速度不同，以达到减缓所述有机薄膜层在靠近挡墙区域的扩散速度，进而降低有机薄膜层溢出挡墙的风险，从而提高显示器结构的封装可靠性。本发明的显示器结构通过使有机薄膜层在无机膜层上快速扩散，使得所述有机薄膜层的有机材料易于快速流平，从而可以使有机薄膜层厚度减薄，进而降低薄膜封装结构的总厚度，以提高薄膜封装结构的耐弯折性能。另外，在基板外围区域的所述有机薄膜层的设定边界（靠近挡墙区域）处所述有机材料在所述无机膜层上扩散速度较慢，从而减缓有机材料在靠近挡墙区域的扩散速度，降低有机材料溢出挡墙的风险，从而提高OLED显示器在边界处封装可靠性。本发明的显示器结构另通过使所述第一无机薄膜层具有一第一氧含量；及所述第二无机薄膜层具有一第二氧含量，其中所述第二氧含量大于所述第一氧含量，进而降低有机薄膜层溢出挡墙的风险，从而提高显示器结构的封装可靠性。
本发明已由上述相关实施例加以描述，然而上述实施例仅为实施本发明的范例。必需指出的是，已公开的实施例并未限制本发明的范围。相反地，包含于权利要求书的精神及范围的修改及均等设置均包括于本发明的范围内。
Claims (19)
- 一种显示器结构，包含：一基板；一挡墙，设置于所述基板上；一第一薄膜层，设置于所述基板上并覆盖所述挡墙；一第二薄膜层，设置于所述基板上，所述第二薄膜层与所述挡墙具有一第一间隙；及一第三薄膜层，设置于所述基板、所述第一薄膜层及所述第二薄膜层上，其中当所述第三薄膜层设置于所述第一薄膜层及第二薄膜层时，其中在第一间隙处，所述第三膜层与所述第一膜层相接触，及所述第一膜层的一材料与所述第二膜层的一材料不同。
- 如权利要求1所述的显示器结构，其中所述第三薄膜层对所述第一薄膜层具有一第一扩散速度及所述第三薄膜层对所述第二薄膜层具有一第二扩散速度，其中所述第一扩散速度低于所述第二扩散速度。
- 如权利要求1所述的显示器结构，更包含：一发光区，设置于所述基板上，其中所述第二薄膜层设置于所述第一薄膜层上；及其中所述第一薄膜层覆盖所述发光区并连续延伸跨过所述挡墙，所述第一薄膜层于所述挡墙处形成一阶梯部，及所述第一间隙存在于所述阶梯部的一第一边缘与所述第二薄膜层的一第二边缘之间。
- 如权利要求3所述的显示器结构，所述第二薄膜层所定义的一边界处距离所述挡墙靠近所述第二薄膜层的一侧具有一距离，所述距离大于0。
- 如权利要求1所述的显示器结构，更包含：一发光区，设置于所述基板上，其中所述第一薄膜层覆盖所述挡墙并向所述发光区延伸，所述第一薄膜层于所述挡墙处形成一阶梯部，及所述第一薄膜层与所述发光区之间具有一第二间隙；及其中所述第二薄膜层覆盖所述发光区并向所述第一薄膜层延伸，及一部分的所述第二薄膜层填入所述第二间隙中，并延伸覆盖在所述第一薄膜层上。
- 如权利要求1所述的显示器结构，更包含：一发光区，设置于所述基板上，其中所述第二薄膜层覆盖所述发光区并向所述挡墙延伸，并所述挡墙之间形成所述第一间隙；及其中所述第一薄膜层覆盖所述挡墙并向所述发光区延伸，及一部分的所述第一薄膜层填入所述第一间隙并继续延伸覆盖在所述第二薄膜层上。
- 如权利要求1所述的显示器结构，更包含：一发光区，设置于所述基板上，其中所述第一薄膜层覆盖所述发光区并连续延伸跨过所述挡墙，所述第一薄膜层于所述挡墙处形成一阶梯部，及其中所述第二薄膜层为所述第一薄膜层通过一氧离子处理后的一含氧处理层，所述第二薄膜层完全覆盖所述发光区；及其中所述第一间隙存在于所述阶梯部的一第一边缘与所述第二薄膜层的一第二边缘之间。
- 一种显示器结构，包含：一基板；一挡墙，设置于所述基板上；一第一薄膜层，设置于所述基板上；及一第二薄膜层，设置于所述基板上，所述第二薄膜层与所述挡墙具有一第一间隙，其中所述第一薄膜层具有一第一氧含量；及所述第二薄膜层具有一第二氧含量，其中所述第二氧含量大于所述第一氧含量。
- 如权利要求8所述的显示器结构，更包含：一发光区，设置于所述基板上，其中所述第二薄膜层设置于所述第一薄膜层上；及其中所述第一薄膜层覆盖所述发光区并连续延伸跨过所述挡墙，所述第一薄膜层于所述挡墙处形成一阶梯部，及所述第一间隙存在于所述阶梯部的一第一边缘与所述第二薄膜层的一第二边缘之间。
- 如权利要求9所述的显示器结构，所述第二薄膜层所定义的一边界处距离所述挡墙靠近所述第二薄膜层的一侧具有一距离，所述距离大于0。
- 如权利要求8所述的显示器结构，更包含：一发光区，设置于所述基板上，其中所述第一薄膜层覆盖所述挡墙并向所述发光区延伸，所述第一薄膜层于所述挡墙处形成一阶梯部，及所述第一薄膜层与所述发光区之间具有一第二间隙；及其中所述第二薄膜层覆盖所述发光区并向所述第一薄膜层延伸，及一部分的所述第二薄膜层填入所述第二间隙中，并延伸覆盖在所述第一薄膜层上。
- 如权利要求8所述的显示器结构，更包含：一发光区，设置于所述基板上，其中所述第二薄膜层覆盖所述发光区并向所述挡墙延伸，并所述挡墙之间形成所述第一间隙；及其中所述第一薄膜层覆盖所述挡墙并向所述发光区延伸，及一部分的所述第一薄膜层填入所述第一间隙并继续延伸覆盖在所述第二薄膜层上。
- 如权利要求8所述的显示器结构，更包含：一发光区，设置于所述基板上，其中所述第一薄膜层覆盖所述发光区并连续延伸跨过所述挡墙，所述第一薄膜层于所述挡墙处形成一阶梯部，及其中所述第二薄膜层为所述第一薄膜层通过一氧离子处理后的一含氧处理层，所述第二薄膜层完全覆盖所述发光区；及其中所述第一间隙存在于所述阶梯部的一第一边缘与所述第二薄膜层的一第二边缘之间。
- 一种显示器结构，所述显示器结构包含：一基板；一挡墙，设置于所述基板上；一第一薄膜层，设置于所述基板上并覆盖所述挡墙；一第二薄膜层，设置于所述基板上，所述第二薄膜层与所述挡墙具有一第一间隙；及一第三薄膜层，设置于所述基板、所述第一薄膜层及所述第二薄膜层上，其中当所述第三薄膜层设置于所述第一薄膜层及第二薄膜层时，所述第三薄膜层对所述第一薄膜层具有一第一扩散速度及所述第三薄膜层对所述第二薄膜层具有一第二扩散速度，其中所述第一扩散速度低于所述第二扩散速度。
- 如权利要求14所述的显示器结构，更包含：一发光区，设置于所述基板上，其中所述第二薄膜层设置于所述第一薄膜层上；及其中所述第一薄膜层覆盖所述发光区并连续延伸跨过所述挡墙，所述第一薄膜层于所述挡墙处形成一阶梯部，及所述第一间隙存在于所述阶梯部的一第一边缘与所述第二薄膜层的一第二边缘之间。
- 如权利要求15所述的显示器结构，所述第二薄膜层所定义的一边界处距离所述挡墙靠近所述第二薄膜层的一侧具有一距离，所述距离大于0。
- 如权利要求14所述的显示器结构，更包含：一发光区，设置于所述基板上，其中所述第一薄膜层覆盖所述挡墙并向所述发光区延伸，所述第一薄膜层于所述挡墙处形成一阶梯部，及所述第一薄膜层与所述发光区之间具有一第二间隙；及其中所述第二薄膜层覆盖所述发光区并向所述第一薄膜层延伸，及一部分的所述第二薄膜层填入所述第二间隙中，并延伸覆盖在所述第一薄膜层上。
- 如权利要求14所述的显示器结构，更包含：一发光区，设置于所述基板上，其中所述第二薄膜层覆盖所述发光区并向所述挡墙延伸，并所述挡墙之间形成所述第一间隙；及其中所述第一薄膜层覆盖所述挡墙并向所述发光区延伸，及一部分的所述第一薄膜层填入所述第一间隙并继续延伸覆盖在所述第二薄膜层上。
- 如权利要求14所述的显示器结构，更包含：一发光区，设置于所述基板上，其中所述第一薄膜层覆盖所述发光区并连续延伸跨过所述挡墙，所述第一薄膜层于所述挡墙处形成一阶梯部，及其中所述第二薄膜层为所述第一薄膜层通过一氧离子处理后的一含氧处理层，所述第二薄膜层完全覆盖所述发光区；及其中所述第一间隙存在于所述阶梯部的一第一边缘与所述第二薄膜层的一第二边缘之间。
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