WO2020171246A1 - Dispositif électronique pour vr, ar et rm - Google Patents

Dispositif électronique pour vr, ar et rm Download PDF

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Publication number
WO2020171246A1
WO2020171246A1 PCT/KR2019/001925 KR2019001925W WO2020171246A1 WO 2020171246 A1 WO2020171246 A1 WO 2020171246A1 KR 2019001925 W KR2019001925 W KR 2019001925W WO 2020171246 A1 WO2020171246 A1 WO 2020171246A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic device
box
heat sink
opening
frame
Prior art date
Application number
PCT/KR2019/001925
Other languages
English (en)
Korean (ko)
Inventor
이학림
한종범
임상혁
Original Assignee
엘지전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지전자 주식회사 filed Critical 엘지전자 주식회사
Priority to PCT/KR2019/001925 priority Critical patent/WO2020171246A1/fr
Publication of WO2020171246A1 publication Critical patent/WO2020171246A1/fr

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/01—Head-up displays
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to an electronic device.
  • it relates to an electronic device used for VR (virtual reality) AR (augmented reality) MR (mixed reality), and the like.
  • VR virtual reality
  • AR augmented reality
  • MR mixed reality
  • VR Virtual Reality
  • Augmented Reality refers to a technology that synthesizes virtual objects or information in a real environment to make them look like objects existing in the original environment.
  • Mixed reality or hybrid reality refers to creating a new environment or new information by combining the virtual world and the real world.
  • mixed reality when it refers to the real-time interaction between reality and what exists in the virtual.
  • the created virtual environment or situation stimulates the user's five senses and allows them to freely enter the boundary between reality and imagination by allowing them to experience spatial and temporal similarities to the real world.
  • users can not only immerse themselves in this environment, but also interact with things implemented in this environment, such as manipulating or applying commands using an existing device.
  • the electronic device 10 includes a cushion 12 in contact with the user's face, a goggle frame 14 to which the cushion 12 is coupled, and the user's eyeball when the user's face contacts the cushion 12.
  • the display is coupled to the front of the display 16, which provides an image to the front of the display 16, adjacent to the rear of the display 16, and provides an image signal to the display 16, the PCB module 18, and the front of the frame 14. It may be provided with a front cover (20) covering the (16) and the PCB module (18).
  • a PCB module 18, a heat dissipation fan, etc. are located between the display 16 and the front cover 20 (distant from the user's face), so that the electronic device 10 is mounted by the user.
  • the electronic device 10 is moved away from the user's face by increasing the weight of the electronic device 10 when moving while still moving or due to the user's radical movement (rotation, pivoting, etc.).
  • Another object may be to improve heat dissipation of an electronic device.
  • Another object may be to reduce a feeling of heat generated by a user of an electronic device.
  • Another object may be to reduce the moment of inertia of the electronic device.
  • Another object may be to improve the noise of the electronic device.
  • a goggle frame having at least one opening in the front;
  • a display located in front of the goggle frame and facing the at least one opening;
  • a box providing a space formed between the goggle frame and the display, fixed to the goggle frame, and coupled to the display;
  • a bottom vent mounted on the lower surface of the box and communicating the space and the outside; It provides an electronic device including a PCB module positioned on the upper surface of the box and fixed to the box.
  • the PCB module includes: a module frame covering an upper surface of the box; A lower heat sink mounted on the module frame and having a plurality of radiating fins extending from the module frame to the space; It may include a chip positioned above the lower heat sink.
  • the PCB module includes: an upper heat sink having a plurality of heat dissipation fins located on the upper side of the chip and extending in an upward direction. It may contain more.
  • the goggle frame, the front cover covering the box and the display In addition, a top vent mounted on an upper surface of the front cover may be further included, and the upper heat sink may be located below the upper vent.
  • it may further include a sealing member inserted between the box and the module frame, sealing the upper surface of the box.
  • the module frame includes at least one through hole formed from the space toward the upper surface of the front cover, and the air in the space is transferred to the front surface through the at least one through hole. It may leak out through the upper vent provided in the cover.
  • the havent includes: a plurality of holes;
  • a mesh installed in the plurality of holes may be included.
  • the at least one opening includes: a first opening formed on the left side of the front surface of the goggle frame;
  • a second opening formed on a right side of a front surface of the goggle frame may be included, and a plurality of radiating fins of the lower heat sink may be located between the first opening and the second opening.
  • a plurality of heat dissipation fins of the lower heat sink are extended to different lengths, but the lengths of the plurality of heating fins become longer as the distance from the first opening or the second opening increases. I can.
  • a plurality of radiating fins of the upper heat sink may extend to different lengths, and the length of the radiating fins located at the front may be smaller than the length of the radiating fins located at the rear.
  • a moment of inertia of an electronic device may be reduced.
  • noise of an electronic device may be improved.
  • FIG. 1 is a diagram showing an example of an electronic device related to the present invention.
  • FIGS. 2 to 8 are diagrams showing examples of electronic devices according to embodiments of the present invention.
  • FIG 9 to 12 are views showing examples of PCB modules according to embodiments of the present invention.
  • FIG. 13 to 19 are views showing examples of a heat dissipation structure according to embodiments of the present invention.
  • the first direction (DR1) is a direction parallel to the length direction of the electronic device 100
  • the second direction (DR2) is the height direction of the electronic device 100 It can be in a direction parallel to
  • the third direction (DR3) may be a direction perpendicular to the first direction (DR1) and/or the second direction (DR2).
  • the first direction DR1 and the second direction DR2 may be collectively referred to as a horizontal direction.
  • the third direction DR3 may be referred to as a vertical direction.
  • the electronic device 100 When the electronic device 100 is viewed from the front F, it may face the front side of the electronic device 100. When the electronic device 100 is viewed from the rear R, it may face the rear side of the electronic device 100.
  • a direction from a left side to a right side of the electronic device 100 or a direction from a right side to a left side may be referred to as a left-right direction (LR).
  • a direction from a top side to a bottom side or a direction from a bottom side to a top side of the electronic device 100 may be referred to as a vertical direction (UD).
  • the front cover 110 may form an outline of the electronic device 100.
  • the front cover 110 may have a tub shape.
  • the window 120 may be mounted or formed on the front surface of the front cover 110.
  • the window 120 may include a light-transmitting material.
  • the vent 130 may be mounted or formed on the upper surface and/or the lower surface of the front cover 110.
  • the top vent 131 may have a square shape and may be located on the upper surface of the front cover 110.
  • the bottom vent 132 may have an elongated shape and may be located on the lower surface of the front cover 110.
  • the operation unit 140 may be mounted on the side of the front cover 110.
  • the manipulation unit 140 may be a plurality of buttons.
  • the input/output units 142 and 143 may be mounted on the side of the front cover 110.
  • the input unit 143 may be a USB terminal, and the output unit 142 may provide audio output.
  • the facial pad 150 may be coupled to the front cover 110 at the rear of the front cover 110.
  • the face pad 150 may provide a comfortable fit to the user's face and block light.
  • the face pad 150 may have a shape corresponding to the contour of the front of a person's face, and may provide a feeling of cushioning.
  • the frame 160 may be referred to as a goggle frame 160.
  • the goggle frame 160 may have a tub shape as a whole, and may have openings 161 and 162 in the front surface. At least one of the openings 161 and 162 may be formed on the front surface of the goggle frame 160.
  • the goggle frame 110 may include a body 163 and a box 164.
  • the body 163 has a tub shape, and the face pad 150 may be mounted or fixed to the rear inner side of the body 163.
  • the openings 161 and 162 may be plural, and may be formed on the front surface of the body 163.
  • the positions of the openings 161 and 162 may correspond to the position of the user's eyeball.
  • the box 164 may be located in front of the body 163 and may be located around the openings 161 and 162.
  • the openings 161 and 162 may be located between the body 163 and the box 164. Box 164 may provide a space (S).
  • the body 163 may also be referred to as a goggle frame 110.
  • the front side of the box 164 may be open, and the display panel 172 may be positioned on the front side of the box 164 to cover the space S of the box 164.
  • the display module 170 may include the display panel 172 and may be positioned in front of the box 164 to cover the space S of the box 164.
  • the display module 170 may be an LCD module or an OLED module.
  • the camera module 180 may be mounted or fixed in front of the display module 170.
  • the window 120 may cover the front of the camera module 180.
  • the battery 190 may be positioned between the display module 170 and the camera module 180.
  • the battery 190 may provide power to the electronic device 100.
  • the battery 190 may be a secondary battery.
  • the space S provided by the box 164 may have an upper surface and a lower surface open.
  • the upper surface of the space S may be entirely open, and the lower surface of the space S may be partially open.
  • the PCB module 200 may block the open upper surface of the space S.
  • the module frame 210 may close the space S while covering the upper surface of the space S, and may be fixed to the upper side of the box 164.
  • the sealing member 201 may be located around the lower portion of the module frame 210.
  • the sealing member 201 may be press-fit between the module frame 210 and the box 164. Accordingly, the upper surface of the space S provided by the box 164 may be sealed.
  • the havent 132 may be fixed to the lower part of the box 164 while blocking a part of the open lower surface of the space S. Accordingly, the space S can be ventilated to the outside through the havent 132.
  • the lower heat sink 220 may be mounted at the center of the module frame 210.
  • the lower heat sink 220 may be referred to as a first heat sink 220.
  • the lower heat sink 220 may include a plate 222, a radiating hole 223, and a radiating fin 221.
  • the lower heat sink 220 may include, for example, aluminum.
  • a plurality of radiating holes 223 may be formed on the plate 222.
  • a plurality of radiating fins 221 may be formed under the plate 222, and the plurality of radiating fins 221 may be elongated in the downward direction of the plate 222.
  • the plurality of radiating fins 221 may extend in different lengths, and the length of the radiating fins 221 located at the center may be greater than the length of the radiating fins 221 located at the outer side.
  • the lengths of the heat dissipation fins 221 may form a normal distribution. Accordingly, heat generated from the chip 230 can be effectively heated.
  • the radiator 223 may be omitted.
  • the chip 230 may be mounted on the upper side of the lower heat sink 220.
  • the chip 230 may be an integrated circuit.
  • the chip 230 may include a microprocessor or memory.
  • the chip 230 may generate a lot of heat during operation.
  • the chip 230 may contact the lower heat sink 220. Accordingly, heat generated from the chip 230 can be effectively heated.
  • the area of the chip 230 may be different from the area of the lower heat sink 220.
  • the area of the chip 230 may be smaller than that of the lower heat sink 220.
  • the upper heat sink 240 may be mounted on the upper side of the chip 230.
  • the upper heat sink 240 may contact the chip 230.
  • the upper heat sink 240 may be referred to as a second heat sink 240.
  • the upper heat sink 240 may include a plate 242, a radiating hole 243, and a radiating fin 241.
  • the upper heat sink 240 may include, for example, aluminum.
  • a plurality of radiating holes 243 may be formed on the plate 242.
  • a plurality of radiating fins 241 may be formed on the upper portion of the plate 242, and the plurality of radiating fins 241 may be elongated in the upward direction of the plate 242.
  • the plurality of radiating fins 241 may extend to different lengths. Accordingly, heat generated from the chip 230 can be effectively heated.
  • the havent 132 may include a plurality of holes 132h.
  • the mesh 132m may be provided in the plurality of holes 132h. Accordingly, air may flow through the havent 132, but foreign substances such as dust may not pass through the havent 132.
  • Air introduced from the outside may be introduced into the space S provided by the box 164 through the havent 132. Air flowing in the space S may absorb heat provided by the lower heat sink 220. In this case, the radiating fins 221 may further improve heat exchange between air and the lower heat sink 220. Air that has absorbed heat may be discharged to the outside through the havent 132.
  • the outdoor air introduced through the upper vent 131 may absorb heat provided by the upper heat sink 240.
  • the heat dissipation fins 241 may further improve heat exchange between air and the upper heat sink 240. Air that has absorbed heat may be discharged to the outside through the upper vent 131.
  • the havent 132 may include a plurality of holes 132h.
  • the mesh 132m may be provided in the plurality of holes 132h. Accordingly, air may flow through the havent 132, but foreign substances such as dust may not pass through the havent 132.
  • Air introduced from the outside may be introduced into the space S provided by the box 164 through the havent 132. Air flowing in the space S may absorb heat provided by the lower heat sink 220. In this case, the radiating fins 221 may further improve heat exchange between air and the lower heat sink 220.
  • the module frame 210 may have a through hole (200V). There may be a plurality of through holes (200V). The plurality of through holes 200V may be formed on the left and right sides of the module frame 210 around the upper heat sink 240 and/or the lower heat sink 220. The plurality of through holes 200V may communicate the space S with the outside.
  • Air absorbing heat from the lower heat sink 220 may move to the upper side of the module frame 210 through the plurality of through holes 200V. Air passing through the plurality of through holes 200V may absorb heat from the upper heat sink 240 or may be discharged to the outside through the upper vent 131. The heat dissipation effect of the electronic device may be further improved by the upper heat sink 240 and/or the lower heat sink 220 radiating heat through air naturally convective from the lower part of the space S to the upper part.
  • the havent 132 may include a plurality of holes 132h.
  • the mesh 132m may be provided in the plurality of holes 132h. Accordingly, air may flow through the havent 132, but foreign substances such as dust may not pass through the havent 132.
  • Air introduced from the outside may be introduced into the space S provided by the box 164 through the havent 132. Air flowing in the space S may absorb heat provided by the lower heat sink 220. In this case, the radiating fins 221 may further improve heat exchange between air and the lower heat sink 220.
  • Air absorbing heat from the lower heat sink 220 is transferred to the upper side of the module frame 210 through the heat sinks 223 and 243 of the lower heat sink 220 and/or the upper heat sink 240 (refer to FIGS. 10 to 12). You can move.
  • the air passing through the heating elements 223 and 243 may absorb heat from the upper heat sink 240 or may be discharged to the outside through the upper vent 131.
  • the heat dissipation effect of the electronic device can be further improved by the chip 230 and/or the upper heat sink 240 and/or the lower heat sink 220 radiating heat through air naturally convective from the lower part of the space S to the upper part. I can.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention concerne un dispositif électronique. Le dispositif électronique de la présente invention comprend : une monture de lunettes ayant au moins une ouverture disposée sur sa surface avant ; un affichage qui est positionné sur l'avant de la monture de lunettes et qui fait face à l'ou aux ouverture(s) ; une boîte, qui fournit un espace formé entre la monture de lunettes et l'affichage, est fixé à la monture de lunettes, et est couplé à l'affichage ; un évent inférieur qui est monté sur la surface inférieure de la boîte et qui permet à l'espace et à l'extérieur de communiquer l'un avec l'autre ; et un module de PCB positionné sur la surface supérieure de la boîte et fixé à la boîte.
PCT/KR2019/001925 2019-02-18 2019-02-18 Dispositif électronique pour vr, ar et rm WO2020171246A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/KR2019/001925 WO2020171246A1 (fr) 2019-02-18 2019-02-18 Dispositif électronique pour vr, ar et rm

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/KR2019/001925 WO2020171246A1 (fr) 2019-02-18 2019-02-18 Dispositif électronique pour vr, ar et rm

Publications (1)

Publication Number Publication Date
WO2020171246A1 true WO2020171246A1 (fr) 2020-08-27

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PCT/KR2019/001925 WO2020171246A1 (fr) 2019-02-18 2019-02-18 Dispositif électronique pour vr, ar et rm

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220163809A1 (en) * 2020-11-23 2022-05-26 Samsung Electronics Co., Ltd. Electronic device including heat radiating member
WO2022108423A1 (fr) * 2020-11-23 2022-05-27 삼성전자 주식회사 Appareil électronique comprenant un élément de dissipation de chaleur
WO2022139554A1 (fr) * 2020-12-24 2022-06-30 삼성전자 주식회사 Dispositif électronique comprenant structure de dissipation de chaleur
WO2022169161A1 (fr) * 2021-02-03 2022-08-11 삼성전자 주식회사 Dispositif électronique pouvant être porté ayant une structure de dissipation de chaleur
US11864364B2 (en) 2021-02-03 2024-01-02 Samsung Electronics Co., Ltd. Wearable electronic device including heat dissipation structure

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012028575A (ja) * 2010-07-23 2012-02-09 Mitsubishi Electric Corp 電子機器
JP2013054076A (ja) * 2011-08-31 2013-03-21 Brother Ind Ltd 撮像装置及びヘッドマウントディスプレイ
US20170184863A1 (en) * 2015-12-24 2017-06-29 Sulon Technologies Inc. Cooling system for head mounted device
KR101850619B1 (ko) * 2016-10-14 2018-04-26 (주)네오인터넷 휴대폰 고정 케이스를 구비한 헤드마운트 디스플레이
US20180196485A1 (en) * 2017-01-12 2018-07-12 Acer Incorporated Head mounted display

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012028575A (ja) * 2010-07-23 2012-02-09 Mitsubishi Electric Corp 電子機器
JP2013054076A (ja) * 2011-08-31 2013-03-21 Brother Ind Ltd 撮像装置及びヘッドマウントディスプレイ
US20170184863A1 (en) * 2015-12-24 2017-06-29 Sulon Technologies Inc. Cooling system for head mounted device
KR101850619B1 (ko) * 2016-10-14 2018-04-26 (주)네오인터넷 휴대폰 고정 케이스를 구비한 헤드마운트 디스플레이
US20180196485A1 (en) * 2017-01-12 2018-07-12 Acer Incorporated Head mounted display

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220163809A1 (en) * 2020-11-23 2022-05-26 Samsung Electronics Co., Ltd. Electronic device including heat radiating member
WO2022108423A1 (fr) * 2020-11-23 2022-05-27 삼성전자 주식회사 Appareil électronique comprenant un élément de dissipation de chaleur
US11874471B2 (en) 2020-11-23 2024-01-16 Samsung Electronics Co., Ltd. Electronic device including heat radiating member
WO2022139554A1 (fr) * 2020-12-24 2022-06-30 삼성전자 주식회사 Dispositif électronique comprenant structure de dissipation de chaleur
WO2022169161A1 (fr) * 2021-02-03 2022-08-11 삼성전자 주식회사 Dispositif électronique pouvant être porté ayant une structure de dissipation de chaleur
US11864364B2 (en) 2021-02-03 2024-01-02 Samsung Electronics Co., Ltd. Wearable electronic device including heat dissipation structure

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