WO2020171246A1

WO2020171246A1 - Electronic device for vr, ar, and mr

Info

Publication number: WO2020171246A1
Application number: PCT/KR2019/001925
Authority: WO
Inventors: 이학림; 한종범; 임상혁
Original assignee: 엘지전자 주식회사
Priority date: 2019-02-18
Filing date: 2019-02-18
Publication date: 2020-08-27

Abstract

An electronic device is disclosed. The electronic device of the present invention comprises: a goggles frame having at least one opening provided on the front surface thereof; a display which is positioned on the front of the goggles frame and which faces the at least one opening; a box, which provides a space formed between the goggles frame and the display, is fixed to the goggles frame, and is coupled to the display; a bottom vent which is mounted on the lower surface of the box and which allows the space and the outside to communicate with each other; and a PCB module positioned on the upper surface of the box and fixed to the box.

Description

Electronic device for VR AR MR

The present invention relates to an electronic device. In more detail, it relates to an electronic device used for VR (virtual reality) AR (augmented reality) MR (mixed reality), and the like.

Virtual Reality (VR) refers to a specific environment or situation, or the technology itself that is similar to reality created by artificial technology using computers, etc., but not real.

Augmented Reality (AR) refers to a technology that synthesizes virtual objects or information in a real environment to make them look like objects existing in the original environment.

Mixed reality (MR) or hybrid reality refers to creating a new environment or new information by combining the virtual world and the real world. In particular, it is referred to as mixed reality when it refers to the real-time interaction between reality and what exists in the virtual.

At this time, the created virtual environment or situation stimulates the user's five senses and allows them to freely enter the boundary between reality and imagination by allowing them to experience spatial and temporal similarities to the real world. In addition, users can not only immerse themselves in this environment, but also interact with things implemented in this environment, such as manipulating or applying commands using an existing device.

Recently, research on gears used in these technical fields has been actively conducted.

Referring to FIG. 1, the electronic device 10 includes a cushion 12 in contact with the user's face, a goggle frame 14 to which the cushion 12 is coupled, and the user's eyeball when the user's face contacts the cushion 12. The display is coupled to the front of the display 16, which provides an image to the front of the display 16, adjacent to the rear of the display 16, and provides an image signal to the display 16, the PCB module 18, and the front of the frame 14. It may be provided with a front cover (20) covering the (16) and the PCB module (18).

In such an electronic device 10, a PCB module 18, a heat dissipation fan, etc. are located between the display 16 and the front cover 20 (distant from the user's face), so that the electronic device 10 is mounted by the user. There may be a problem that the electronic device 10 is moved away from the user's face by increasing the weight of the electronic device 10 when moving while still moving or due to the user's radical movement (rotation, pivoting, etc.).

In addition, due to the structural limitation in which the PCB module 18 is mounted on the electronic device 10, heat generated from the PCB module 18 cannot be sufficiently discharged, and noise is generated by the heat dissipation fan installed for this purpose. have.

It is an object of the present invention to solve the above and other problems. Another object may be to improve heat dissipation of an electronic device.

Another object may be to reduce a feeling of heat generated by a user of an electronic device.

Another object may be to reduce the moment of inertia of the electronic device.

Another object may be to improve the noise of the electronic device.

According to an aspect of the present invention to achieve the above or other objects, a goggle frame having at least one opening in the front; A display located in front of the goggle frame and facing the at least one opening; A box providing a space formed between the goggle frame and the display, fixed to the goggle frame, and coupled to the display; A bottom vent mounted on the lower surface of the box and communicating the space and the outside; It provides an electronic device including a PCB module positioned on the upper surface of the box and fixed to the box.

According to another aspect of the present invention, the PCB module includes: a module frame covering an upper surface of the box; A lower heat sink mounted on the module frame and having a plurality of radiating fins extending from the module frame to the space; It may include a chip positioned above the lower heat sink.

Further, according to another aspect of the present invention, the PCB module includes: an upper heat sink having a plurality of heat dissipation fins located on the upper side of the chip and extending in an upward direction. It may contain more.

According to another (another) aspect of the present invention, the goggle frame, the front cover covering the box and the display; In addition, a top vent mounted on an upper surface of the front cover may be further included, and the upper heat sink may be located below the upper vent.

Further, according to another aspect of the present invention, it may further include a sealing member inserted between the box and the module frame, sealing the upper surface of the box.

According to another aspect of the present invention, the module frame includes at least one through hole formed from the space toward the upper surface of the front cover, and the air in the space is transferred to the front surface through the at least one through hole. It may leak out through the upper vent provided in the cover.

According to another (another) aspect of the present invention, the havent includes: a plurality of holes; In addition, a mesh installed in the plurality of holes may be included.

According to another aspect of the present invention, the at least one opening includes: a first opening formed on the left side of the front surface of the goggle frame; In addition, a second opening formed on a right side of a front surface of the goggle frame may be included, and a plurality of radiating fins of the lower heat sink may be located between the first opening and the second opening.

According to another aspect of the present invention, a plurality of heat dissipation fins of the lower heat sink are extended to different lengths, but the lengths of the plurality of heating fins become longer as the distance from the first opening or the second opening increases. I can.

Further, according to another aspect of the present invention, a plurality of radiating fins of the upper heat sink may extend to different lengths, and the length of the radiating fins located at the front may be smaller than the length of the radiating fins located at the rear.

The effect of the display device according to the present invention will be described as follows.

According to at least one of the embodiments of the present invention, it is possible to improve heat dissipation of the electronic device.

According to at least one of the embodiments of the present invention, it is possible to reduce a feeling of heat generated by the electronic device that the user feels.

According to at least one of the embodiments of the present invention, a moment of inertia of an electronic device may be reduced.

According to at least one of the embodiments of the present invention, noise of an electronic device may be improved.

Further scope of applicability of the present invention will become apparent from the detailed description below. However, since various changes and modifications within the spirit and scope of the present invention can be clearly understood by those skilled in the art, specific embodiments such as the detailed description and preferred embodiments of the present invention should be understood as being given by way of example only.

1 is a diagram showing an example of an electronic device related to the present invention.

2 to 8 are diagrams showing examples of electronic devices according to embodiments of the present invention.

9 to 12 are views showing examples of PCB modules according to embodiments of the present invention.

13 to 19 are views showing examples of a heat dissipation structure according to embodiments of the present invention.

Hereinafter, exemplary embodiments disclosed in the present specification will be described in detail with reference to the accompanying drawings, but identical or similar elements are denoted by the same reference numerals regardless of reference numerals, and redundant descriptions thereof will be omitted. The suffixes "module" and "unit" for components used in the following description are given or used interchangeably in consideration of only the ease of preparation of the specification, and do not have meanings or roles that are distinguished from each other by themselves. In addition, in describing the embodiments disclosed in the present specification, when it is determined that a detailed description of related known technologies may obscure the subject matter of the embodiments disclosed in the present specification, the detailed description thereof will be omitted. In addition, the accompanying drawings are for easy understanding of the embodiments disclosed in the present specification, and the technical idea disclosed in the present specification is not limited by the accompanying drawings, and all modifications included in the spirit and scope of the present invention It should be understood to include equivalents or substitutes.

In addition (see FIG. 2), hereinafter, the first direction (DR1) is a direction parallel to the length direction of the electronic device 100, and the second direction (DR2) is the height direction of the electronic device 100 It can be in a direction parallel to The third direction (DR3) may be a direction perpendicular to the first direction (DR1) and/or the second direction (DR2).

The first direction DR1 and the second direction DR2 may be collectively referred to as a horizontal direction. In addition, the third direction DR3 may be referred to as a vertical direction.

When the electronic device 100 is viewed from the front F, it may face the front side of the electronic device 100. When the electronic device 100 is viewed from the rear R, it may face the rear side of the electronic device 100.

Here, a direction from a left side to a right side of the electronic device 100 or a direction from a right side to a left side may be referred to as a left-right direction (LR). A direction from a top side to a bottom side or a direction from a bottom side to a top side of the electronic device 100 may be referred to as a vertical direction (UD).

2 to 4, the front cover 110 may form an outline of the electronic device 100. The front cover 110 may have a tub shape. The window 120 may be mounted or formed on the front surface of the front cover 110. The window 120 may include a light-transmitting material. The vent 130 may be mounted or formed on the upper surface and/or the lower surface of the front cover 110. The top vent 131 may have a square shape and may be located on the upper surface of the front cover 110. The bottom vent 132 may have an elongated shape and may be located on the lower surface of the front cover 110.

The operation unit 140 may be mounted on the side of the front cover 110. The manipulation unit 140 may be a plurality of buttons. The input/

output units

142 and 143 may be mounted on the side of the front cover 110. For example, the input unit 143 may be a USB terminal, and the output unit 142 may provide audio output.

The facial pad 150 may be coupled to the front cover 110 at the rear of the front cover 110. The face pad 150 may provide a comfortable fit to the user's face and block light. For example, the face pad 150 may have a shape corresponding to the contour of the front of a person's face, and may provide a feeling of cushioning.

5 to 7, the frame 160 may be referred to as a goggle frame 160. The goggle frame 160 may have a tub shape as a whole, and may have

openings

161 and 162 in the front surface. At least one of the

openings

161 and 162 may be formed on the front surface of the goggle frame 160.

The goggle frame 110 may include a body 163 and a box 164. The body 163 has a tub shape, and the face pad 150 may be mounted or fixed to the rear inner side of the body 163. The

openings

161 and 162 may be plural, and may be formed on the front surface of the body 163. The positions of the

openings

161 and 162 may correspond to the position of the user's eyeball. The box 164 may be located in front of the body 163 and may be located around the

openings

161 and 162. The

openings

161 and 162 may be located between the body 163 and the box 164. Box 164 may provide a space (S). The body 163 may also be referred to as a goggle frame 110.

The front side of the box 164 may be open, and the display panel 172 may be positioned on the front side of the box 164 to cover the space S of the box 164. The display module 170 may include the display panel 172 and may be positioned in front of the box 164 to cover the space S of the box 164. For example, the display module 170 may be an LCD module or an OLED module.

The camera module 180 may be mounted or fixed in front of the display module 170. The window 120 may cover the front of the camera module 180. The battery 190 may be positioned between the display module 170 and the camera module 180. The battery 190 may provide power to the electronic device 100. The battery 190 may be a secondary battery.

Referring to FIG. 8, the space S provided by the box 164 may have an upper surface and a lower surface open. The upper surface of the space S may be entirely open, and the lower surface of the space S may be partially open. The PCB module 200 may block the open upper surface of the space S. The module frame 210 may close the space S while covering the upper surface of the space S, and may be fixed to the upper side of the box 164. The sealing member 201 may be located around the lower portion of the module frame 210. The sealing member 201 may be press-fit between the module frame 210 and the box 164. Accordingly, the upper surface of the space S provided by the box 164 may be sealed. The havent 132 may be fixed to the lower part of the box 164 while blocking a part of the open lower surface of the space S. Accordingly, the space S can be ventilated to the outside through the havent 132.

9 and 10, the lower heat sink 220 may be mounted at the center of the module frame 210. The lower heat sink 220 may be referred to as a first heat sink 220. The lower heat sink 220 may include a plate 222, a radiating hole 223, and a radiating fin 221. The lower heat sink 220 may include, for example, aluminum. A plurality of radiating holes 223 may be formed on the plate 222. A plurality of radiating fins 221 may be formed under the plate 222, and the plurality of radiating fins 221 may be elongated in the downward direction of the plate 222. The plurality of radiating fins 221 may extend in different lengths, and the length of the radiating fins 221 located at the center may be greater than the length of the radiating fins 221 located at the outer side. For example, the lengths of the heat dissipation fins 221 may form a normal distribution. Accordingly, heat generated from the chip 230 can be effectively heated. In the embodiments of FIGS. 14 to 17, the radiator 223 may be omitted.

10 and 11, the chip 230 may be mounted on the upper side of the lower heat sink 220. The chip 230 may be an integrated circuit. For example, the chip 230 may include a microprocessor or memory. The chip 230 may generate a lot of heat during operation. The chip 230 may contact the lower heat sink 220. Accordingly, heat generated from the chip 230 can be effectively heated. The area of the chip 230 may be different from the area of the lower heat sink 220. The area of the chip 230 may be smaller than that of the lower heat sink 220.

11 and 12, the upper heat sink 240 may be mounted on the upper side of the chip 230. The upper heat sink 240 may contact the chip 230. The upper heat sink 240 may be referred to as a second heat sink 240. The upper heat sink 240 may include a plate 242, a radiating hole 243, and a radiating fin 241. The upper heat sink 240 may include, for example, aluminum. A plurality of radiating holes 243 may be formed on the plate 242. A plurality of radiating fins 241 may be formed on the upper portion of the plate 242, and the plurality of radiating fins 241 may be elongated in the upward direction of the plate 242. The plurality of radiating fins 241 may extend to different lengths. Accordingly, heat generated from the chip 230 can be effectively heated.

13 to 15, the havent 132 may include a plurality of holes 132h. The mesh 132m may be provided in the plurality of holes 132h. Accordingly, air may flow through the havent 132, but foreign substances such as dust may not pass through the havent 132. Air introduced from the outside may be introduced into the space S provided by the box 164 through the havent 132. Air flowing in the space S may absorb heat provided by the lower heat sink 220. In this case, the radiating fins 221 may further improve heat exchange between air and the lower heat sink 220. Air that has absorbed heat may be discharged to the outside through the havent 132.

The outdoor air introduced through the upper vent 131 may absorb heat provided by the upper heat sink 240. In this case, the heat dissipation fins 241 may further improve heat exchange between air and the upper heat sink 240. Air that has absorbed heat may be discharged to the outside through the upper vent 131.

13, 16, and 17, the havent 132 may include a plurality of holes 132h. The mesh 132m may be provided in the plurality of holes 132h. Accordingly, air may flow through the havent 132, but foreign substances such as dust may not pass through the havent 132. Air introduced from the outside may be introduced into the space S provided by the box 164 through the havent 132. Air flowing in the space S may absorb heat provided by the lower heat sink 220. In this case, the radiating fins 221 may further improve heat exchange between air and the lower heat sink 220.

The module frame 210 may have a through hole (200V). There may be a plurality of through holes (200V). The plurality of through holes 200V may be formed on the left and right sides of the module frame 210 around the upper heat sink 240 and/or the lower heat sink 220. The plurality of through holes 200V may communicate the space S with the outside.

Air absorbing heat from the lower heat sink 220 may move to the upper side of the module frame 210 through the plurality of through holes 200V. Air passing through the plurality of through holes 200V may absorb heat from the upper heat sink 240 or may be discharged to the outside through the upper vent 131. The heat dissipation effect of the electronic device may be further improved by the upper heat sink 240 and/or the lower heat sink 220 radiating heat through air naturally convective from the lower part of the space S to the upper part.

13, 18, and 19, the havent 132 may include a plurality of holes 132h. The mesh 132m may be provided in the plurality of holes 132h. Accordingly, air may flow through the havent 132, but foreign substances such as dust may not pass through the havent 132. Air introduced from the outside may be introduced into the space S provided by the box 164 through the havent 132. Air flowing in the space S may absorb heat provided by the lower heat sink 220. In this case, the radiating fins 221 may further improve heat exchange between air and the lower heat sink 220.

Air absorbing heat from the lower heat sink 220 is transferred to the upper side of the module frame 210 through the

heat sinks

223 and 243 of the lower heat sink 220 and/or the upper heat sink 240 (refer to FIGS. 10 to 12). You can move. The air passing through the

heating elements

223 and 243 may absorb heat from the upper heat sink 240 or may be discharged to the outside through the upper vent 131. The heat dissipation effect of the electronic device can be further improved by the chip 230 and/or the upper heat sink 240 and/or the lower heat sink 220 radiating heat through air naturally convective from the lower part of the space S to the upper part. I can.

Certain or other embodiments of the present invention described above are not mutually exclusive or distinct. Certain or other embodiments of the present invention described above may have their respective configurations or functions used in combination or combination.

The above detailed description should not be construed as restrictive in all respects and should be considered as illustrative. The scope of the present invention should be determined by reasonable interpretation of the appended claims, and all changes within the equivalent scope of the present invention are included in the scope of the present invention.

Claims

A goggle frame having at least one opening on the front surface;

A display located in front of the goggle frame and facing the at least one opening;

A box providing a space formed between the goggle frame and the display, fixed to the goggle frame, and coupled to the display;

A bottom vent mounted on the lower surface of the box and communicating the space and the outside;

Electronic device comprising a PCB module positioned on the upper surface of the box and fixed to the box.
The method of claim 1,

The PCB module is:

A module frame covering the upper surface of the box;

A lower heat sink mounted on the module frame and having a plurality of radiating fins extending from the module frame to the space;

An electronic device including a chip positioned above the lower heat sink.
The method of claim 2,

The PCB module is:

The electronic device further comprises an upper heat sink disposed above the chip and having a plurality of heat dissipating fins extending in an upward direction.
The method of claim 3,

A front cover covering the goggle frame, box, and display; And,

Further comprising a top vent mounted on the upper surface of the front cover,

The upper heat sink is an electronic device located under the upper vent.
The method of claim 2,

The electronic device further comprises a sealing member inserted between the box and the module frame and sealing an upper surface of the box.
The method of claim 5,

The module frame has at least one through hole formed from the space toward the upper surface of the front cover,

The air in the space is discharged to the outside through an upper vent provided in the front cover through the at least one through hole.
The method of claim 6,

The havent is:

A plurality of holes; And,

An electronic device including a mesh installed in the plurality of holes.
The method of claim 2,

The at least one opening is:

A first opening formed on the left side of the front of the goggle frame; And,

It includes a second opening formed on the right side of the front of the goggle frame,

An electronic device wherein a plurality of heat dissipation fins of the lower heat sink are positioned between the first opening and the second opening.
The method of claim 8,

The plurality of radiating fins of the lower heat sink are extended to different lengths,

The length of the plurality of heating pins increases as the distance from the first opening or the second opening increases.
The method of claim 3,

A plurality of radiating fins of the upper heat sink are extended to different lengths,

An electronic device in which the length of the radiating fin located in the front is smaller than the length of the radiating fin located in the rear.