WO2019112401A1 - Dispositif de rayonnement thermique pour élément électronique - Google Patents

Dispositif de rayonnement thermique pour élément électronique Download PDF

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Publication number
WO2019112401A1
WO2019112401A1 PCT/KR2018/015620 KR2018015620W WO2019112401A1 WO 2019112401 A1 WO2019112401 A1 WO 2019112401A1 KR 2018015620 W KR2018015620 W KR 2018015620W WO 2019112401 A1 WO2019112401 A1 WO 2019112401A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
dissipating
additional
heat pipe
housing body
Prior art date
Application number
PCT/KR2018/015620
Other languages
English (en)
Korean (ko)
Inventor
김덕용
양준우
여진수
유창우
박민식
김혜연
Original Assignee
주식회사 케이엠더블유
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 케이엠더블유 filed Critical 주식회사 케이엠더블유
Priority to JP2020530668A priority Critical patent/JP7041746B2/ja
Priority to CN201880079885.5A priority patent/CN112205091B/zh
Priority claimed from KR1020180158228A external-priority patent/KR102329245B1/ko
Publication of WO2019112401A1 publication Critical patent/WO2019112401A1/fr
Priority to US16/894,735 priority patent/US11324106B2/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a heat dissipating device for an electric component, and more particularly, to a heat dissipating device for a heat dissipating device, To a heat dissipation device of an electric element capable of dissipating heat.
  • an electric field element generates heat during operation, and if the heat is not cooled in the space where electric field elements are integrated, the operating performance of the electric field element may deteriorate.
  • the electric field element is soldered to a printed circuit board provided inside the case, and is disposed inside a completely closed space for protection from the outside.
  • a ventilation fan is provided inside the case so that heat can be discharged from an enclosed space from time to time.
  • it is general to protect it with a completely enclosed case in order to prevent the inflow of foreign matter, rainwater, etc. from the inside.
  • the present invention is conceived to solve the above-described technical problems, and it is an object of the present invention to provide an air conditioner having an air conditioner, It is an object of the present invention to provide a heat dissipation device for an electric element.
  • a preferred embodiment of the heat dissipating device of the electric element according to the present invention is a printed circuit board having a plurality of electric elements as a unit heating element on one surface thereof, An additional heat dissipating unit disposed apart from an outer surface of the housing main body to dissipate heat transmitted from the housing main body and one end connected to an outer surface of the housing main body, And a heat transfer unit connected to the additional heat dissipation unit and transferring heat generated from the electric device to the additional heat dissipation unit.
  • the additional heat dissipating unit may include a plurality of second heat dissipating ribs protruding toward the housing body and a plurality of third heat dissipating ribs protruding in a direction opposite to the second heat dissipating rib.
  • the heat transfer part may be provided with a heat pipe filled with a heat transfer fluid therein.
  • One end of the heat pipe may be connected between the plurality of first heat dissipating ribs formed in the housing body and the other end of the heat pipe may be connected to one surface of the additional heat dissipating unit so as to receive a part of the outer circumferential surface.
  • One end of the heat pipe may be inserted into a heat collecting block provided between the plurality of first heat radiating ribs formed in the housing body.
  • the other end of the heat pipe may be inserted into a thermal contact groove formed between the plurality of second heat dissipating ribs formed in the additional heat dissipating unit.
  • One end of the heat pipe and the other end of the heat pipe are parallel to an outer surface of the housing main body and one surface of the additional heat dissipation unit in which the plurality of second heat dissipation ribs are formed,
  • the heat pipe can be bent at one end and the other end of the heat pipe.
  • the middle portion of the heat pipe may be formed with an upward inclination.
  • the plurality of first heat-radiating ribs, the plurality of second heat-radiating ribs, and the plurality of third heat-radiating ribs may be elongated in the vertical direction so that air flows upward from the lower side.
  • One end of the heat pipe is connected to the outer side of the housing main body as a lower end, and the other end of the heat pipe is connected to the additional heat dissipating unit as an upper end, and the heat pipe may be arranged long in the vertical direction.
  • Another embodiment of the heat dissipating device of the electric field element according to the present invention is a heat dissipating device comprising a housing main body having a heat dissipating space provided with a plurality of electric elements and being arranged so as to be parallel to the outer surface of the housing main body, And one end of the additional heat dissipation unit is connected to an outer surface of the plurality of electric devices and the other end of the additional heat dissipation unit is connected to the additional heat dissipation unit, And a heat transfer unit for transferring the heat generated from the additional heat dissipation unit to the additional heat dissipation unit.
  • the heat dissipation performance is greatly improved through the additional heat dissipating unit provided in addition to the plurality of first heat dissipating ribs provided on the outer surface of the housing body .
  • FIG. 1 is a perspective view illustrating an embodiment of a heat dissipation device for an electric component according to the present invention
  • Fig. 2 is an exploded perspective view of Fig. 1,
  • FIG. 3 is a cross-sectional view taken along the line A-A in Fig. 1,
  • FIG. 4A and 4B are exploded perspective views illustrating one side and the other side of the heat transfer portion in the configuration of FIG. 1,
  • Fig. 5 is a plan view of Figs. 4A and 4B,
  • FIG. 6 is a cutaway perspective view taken along the line B-B in Fig.
  • Heat dissipation device of electric element 10 Housing body
  • housing cover 71 heat radiating fin portion
  • heating element used in the specification is a kind of electric field element, and it is natural that it is possible to substitute any structure as long as it generates a predetermined heat during operation.
  • FIG. 1 is an exploded perspective view of the heat dissipating device according to the present invention
  • Fig. 2 is an exploded perspective view of Fig. 1
  • Fig. 3 is a cross-sectional view taken along line AA of Fig. 1
  • FIG. 5 is a plan view of FIGS. 4A and 4B
  • FIG. 6 is a cutaway perspective view taken along the line BB of FIG. 5.
  • the embodiment of the heat dissipating device 1 of the electric field element according to the present invention includes a printed circuit board 20 having a plurality of electric field elements 25 provided on one surface thereof as heating elements, A housing main body 10 having the other surface of the printed circuit board 20 closely contacted and a plurality of first heat radiating ribs 11 protruding from the outer surface of the housing main body 10; And the other end portion 33 is connected to the outer surface of the housing main body 10 and the other end portion 33 is connected to the additional heat dissipation portion 40.
  • Further heat dissipating portion 40 is disposed apart from the housing main body 10 to dissipate heat transmitted from the housing main body 10, And a heat transfer unit 30 connected to the heat dissipating unit 40 to transfer the heat applied to the outer surface of the housing main body 10 to the additional heat dissipating unit 40.
  • the plurality of electric elements 25 include all the heat generating elements that generate electric power and generate a predetermined heat.
  • the electric power supply unit 25 and the power supply unit (PSU) Field Programmable Gate Array
  • PSU Field Programmable Gate Array
  • the device structure that can degrade the performance due to heat generation is also considered.
  • the housing main body 10 has a vertical cross-sectional shape having a U-shaped accommodation space so that one surface or the other surface of the printed circuit board 20 is accommodated in a substantially one side or the other side.
  • the upper portion of the housing main body 10 is formed to have the above-described accommodation space, but is opened to the front side, and is connected to the antenna elements (not shown) or the PSU
  • the lower portion of the housing main body 10 is formed to be open to the rear side of the receiving space so that the FPGA elements (not shown) are housed inside the housing space,
  • the electric element 25 may be disposed inside the accommodation space.
  • the upper part of the housing body 10 provided with the communication elements such as the antenna elements or the PSU or the electric field element is coupled to the front side where the radome 100 is opened so that signal transmission or signal reception does not interfere, So that the foreign matter is prevented from flowing.
  • an opening (not shown) of the accommodation space is formed in the lower portion of the housing main body 10 provided with the electric field element 25 such as the FPGA elements so that the printed circuit board 20 is installed
  • a housing cover 70 may be provided on one side of the housing body 10 to shield the opened side of the housing body 10.
  • the additional printed circuit board 20 ' may be mounted on the housing main body 10 (see Fig. 3), if it is necessary to additionally provide electrical elements in addition to the printed circuit board 20 described above in the housing main body 10.
  • the heat generated from the additional printed circuit board 20 ' may be directly discharged to the outside from the outside of the housing cover 70.
  • the heat radiating fin portion 71 may be formed.
  • the radome 100 is coupled to the front surface of the upper portion of the housing main body 10, as described above, and the heat generated from the antenna elements or the electric elements such as the PSU It is preferable to design the heat dissipating unit 40 so as to dissipate heat through the one-way heat dissipating structure formed by the plurality of heat dissipating ribs 11 formed on the upper rear surface of the housing main body 10 .
  • the heat generated in accordance with the operation of the electric elements mounted on the printed circuit board 20 is set to 1
  • a plurality of first heat-radiating ribs 11 may be provided to radiate heat.
  • the plurality of first heat-radiating ribs 11 are arranged such that the heat generated from the electric field elements arranged in the housing space in the lower portion of the housing main body 10 is radiated to the heat-radiating fin portion 71 formed in the housing cover 70,
  • the unit ribs may be formed so as to be long in the vertical direction so as not to interfere with the upward flow when the upward flow is formed after the heat is radiated through the heat exchanger.
  • a plurality of first heat radiating ribs 11 formed on the outer surface of the housing main body 10 and a plurality of heat radiating fin portions 71 formed on the housing cover 70 are formed on the outer surfaces of the housing main body 10 and the housing cover 70 (Hereinafter, referred to as a 'heat generating space') formed in the inner space.
  • the plurality of first heat-radiating ribs 11 are formed so as to have the same distance from each other.
  • the plurality of first heat-radiating ribs 11 are formed so that the heat-
  • the installation trench 15 may be formed at a plurality of locations.
  • the additional heat dissipating unit 40 includes a plurality of second heat dissipating ribs 41 formed on one surface and protruding toward the housing body 10, and a plurality of second heat dissipating ribs 41 formed on the other surface of the second heat dissipating ribs 41 And a plurality of third heat radiating ribs 43 protruding in a direction opposite to the first heat radiating ribs 43.
  • the additional heat dissipating unit 40 is disposed outside the housing main body 10 such that the additional heat dissipating unit 40 is separated from the front end of the plurality of first heat dissipating ribs 11 formed on the housing main body 10 through the heat transfer unit 30 .
  • the plurality of second heat radiating ribs 41 and the plurality of third heat radiating ribs 43 are formed so as to have the same left and right spacing as the plurality of first heat radiating ribs 11 of the housing body 10 described above And can be arranged long in the vertical direction.
  • a second installation where a part of the plurality of second heat-radiating ribs 41 is not formed is provided on the inner surface of the additional heat-radiating portion 40 provided with the plurality of second heat-radiating ribs 41 so that the heat- The groove 45 may be formed at a plurality of locations.
  • the heat transfer part 30 directly collects heat from a plurality of electric elements 25 provided in the heat generating space formed by the housing body 10 and the housing cover 70 and induces the heat to the outside, (That is, by electric field element) independent heat radiation route.
  • the number of heat transfer portions 30 is provided corresponding to the number of the electric elements 25 and the total number of the electric elements 25 Heat is radiated to the outside through the independent heat radiation route formed by the respective heat transfer parts 30.
  • the heat transfer unit 30 may include a plurality of heat pipes filled with a heat transfer fluid.
  • the heat transfer fluid filled inside the heat pipe is vaporized when it is supplied from one side, and is heated upward to transfer heat to the upper end of the heat pipe, and then liquefied and returned to its original position by gravity. It is possible to perform a function of moving the heat pipe from one end to the other end.
  • One end portion 31 of the heat pipe 30 is connected to the first installation groove portion 15 provided between the plurality of first heat radiation ribs 11 formed in the housing main body 10, 30 may be connected to the second installation groove 45 formed on the inner surface of the additional heat dissipation unit 40.
  • one end 31 of the unit heat pipe 30 is connected to an electric element (not shown) provided on the heat generating space of the housing main body 10,
  • the other end portion 33 of the unit heat pipe 30 is connected to one side of the printed circuit board 20 via a one-side heat collecting block 90 which will be described later,
  • the other heat collecting block 95 may be disposed in parallel with the inner surface of the additional heat dissipating unit 40 so as to be in contact with the inner surface of the additional heat dissipating unit 40.
  • a one-side heat collecting block 90 for mediating collective installation of one end of the heat pipe group 30 'having a plurality of unit heat pipes 30 is provided, (45) may be provided with a second heat collecting block (95) for mediating dispersion of the other end of the heat pipe group (30 ') having a plurality of unit heat pipes (30).
  • the one end portion 31 of the heat pipe group 30 ' is provided so that a plurality of electric elements 25 are exposed to the outside on the heat generating space of the housing main body 10 Can be inserted into one heat transfer groove (92), which will be described later, of one heat collecting block (90) which is in contact through the first installation recess (15).
  • One heat collecting block 90 may be installed such that one end of the plurality of heat pipes 30 is closely packed so that heat generated from one electric element 25 can be intensively collected.
  • the space through which the heat is radiated by the block radiating ribs 91 is a space formed between the housing main body 10 and the additional heat dissipating unit 40 and is a space which is radiated by the plurality of first heat dissipating ribs 11 same.
  • the other end 33 of the heat pipe group 30 ' is formed on the inner side surface of the additional heat radiating portion 40 provided with the second installation groove portion 45, Receiving grooves 49 formed in the other heat-collecting block 95 and inserted into the holes formed in the other heat-transfer grooves 93 formed in the heat-collecting block 95 on the other side.
  • the other heat collecting block 90 is installed such that a plurality of heat pipes 30 are dispersed on the inner surface of the additional heat dissipating unit 40 so that the heat transmitted by the heat pipe group 30 ' .
  • the one-side heat collecting block 90 has a pair of heat pipes 30 'that are collectively installed so as to collect the heat radiated to the outer surface of each of the electric elements 25 provided on the heat generating space of the housing main body 10
  • the other heat collecting block 95 serves to transmit the heat transmitted through the heat pipe group 30 'to the inner surface of the additional heat dissipating unit 40 evenly. It is preferable that the one heat collecting block 90 and the other heat collecting block 95 are arranged corresponding to the number of the heat pipe groups 30 '.
  • the heat collecting block 90 and the heat collecting block 95 are provided with one heat transfer groove and the other heat transfer groove to which the one end 31 and the other end 33 of the heat pipe group 30 ' Grooves 92 and 93 may be formed.
  • One end 31 and the other end 33 of the heat pipe 30 are connected to one surface of the additional heat dissipating unit 40 having the outer surface of the housing main body 10 and the plurality of second heat dissipating ribs 41, And an intermediate portion 35 between the one end portion 31 and the other end portion 33 of the heat pipe 30 is disposed parallel to the one end portion 31 and the other end portion 33 of the heat pipe 30 As shown in Fig.
  • the middle portion 35 of the heat pipe 30 may be formed to have an upward inclination with the one end 31 as a lower end and the other end 33 as an upper end. That is, when a plurality of first heat-radiating ribs 11, a plurality of second heat-radiating ribs 41, and a plurality of third heat-radiating ribs 43 are formed long in the vertical direction so as to flow air upward from below, One end portion 31 of the pipe 30 is connected to the outside of the housing main body 10 as a lower end portion and the other end portion 33 of the heat pipe 30 is connected to the additional heat dissipating portion 40 as an upper end portion, The middle portion 35 of the second housing 30 is arranged to be long in the vertical direction and upwardly inclined.
  • the heat dissipation process by the heat dissipation device 1 of the electrical component according to the present invention will be briefly described below.
  • the heat generated by the operation of the electric element 25 provided on the inner surface of the housing main body 10 is transmitted to the outer surface of the housing main body 10 so that the heat collecting block 90 collects the heat .
  • the one heat collecting block 90 is exposed to the outside together with the first heat radiating ribs 11, so that a part of heat transmitted from the electric element 25 directly radiates heat through the block radiating ribs 91.
  • the remaining heat that has not been collected by the heat collecting block 90 may be radiated through the plurality of first heat dissipating ribs 11 formed on the outer surface of the housing main body 10.
  • the heat collected in the one heat collecting block 90 is transferred to the heat pipe group 30 'in a state where the one end portion 31 of the plurality of unit heat pipes 30 are concentrated, Is transferred to the other end (33) side of the heat pipe group (30 ') by the action of evaporation of the heat transfer fluid in the heat pipe group (30).
  • the heat transferred to the other end 33 of the unit heat pipe 30 flows through the second heat collecting block 95 to the plurality of second heat radiating ribs 41 and the plural heat radiating ribs 41 provided in the additional heat radiating portion 40, Heat can be radiated through the third heat dissipating ribs 43 through the second heat dissipating ribs 43.
  • the embodiment of the heat dissipating device 1 according to the present invention is not limited to the heat transfer portion 30 and the additional heat dissipating portion 40 described above even if the electric element 25 integrated on the printed circuit board 20 increases,
  • the heat dissipation performance can be expanded by the additional heat dissipation structure of FIG.
  • Embodiments of the heat dissipation device of the electric field element according to the present invention can be used particularly in an antenna device having an electric field element with high heat generation.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un dispositif de rayonnement thermique pour élément électronique. En particulier, le dispositif de rayonnement thermique comprend : une carte de circuit imprimé, sur une surface de laquelle plusieurs éléments électroniques sont disposés comme éléments unitaires de génération de chaleur et de rayonnement thermique; un corps de boîtier dans lequel l'autre surface de la carte de circuit imprimé est logée et en contact étroit avec le corps de boîtier, plusieurs premières nervures de rayonnement thermique saillant de la surface extérieure du corps de boîtier; un module de rayonnement thermique supplémentaire agencé à distance de la surface extérieure du corps de boîtier et rayonnant de la chaleur transférée du corps de boîtier; et un module de transfert de chaleur dont une extrémité est reliée à la surface extérieure du corps de boîtier et l'autre extrémité au module de rayonnement thermique supplémentaire, de façon à transférer la chaleur générée de l'élément électronique au module de rayonnement thermique supplémentaire. Ainsi, le dispositif de rayonnement thermique de l'invention présente des performances de rayonnement thermique améliorées.
PCT/KR2018/015620 2017-12-08 2018-12-10 Dispositif de rayonnement thermique pour élément électronique WO2019112401A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2020530668A JP7041746B2 (ja) 2017-12-08 2018-12-10 電子素子の放熱装置
CN201880079885.5A CN112205091B (zh) 2017-12-08 2018-12-10 电子元件的散热装置
US16/894,735 US11324106B2 (en) 2017-12-08 2020-06-05 Cooling apparatus for electronic element

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2017-0168699 2017-12-08
KR20170168699 2017-12-08
KR1020180158228A KR102329245B1 (ko) 2017-12-08 2018-12-10 전장소자의 방열 장치
KR10-2018-0158228 2018-12-10

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US16/894,735 Continuation US11324106B2 (en) 2017-12-08 2020-06-05 Cooling apparatus for electronic element

Publications (1)

Publication Number Publication Date
WO2019112401A1 true WO2019112401A1 (fr) 2019-06-13

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PCT/KR2018/015620 WO2019112401A1 (fr) 2017-12-08 2018-12-10 Dispositif de rayonnement thermique pour élément électronique

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4210444A4 (fr) * 2020-10-23 2024-03-06 ZTE Corporation Procédé de dissipation de chaleur de dispositif et dispositif de dissipation de chaleur

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6144556A (en) * 1999-03-30 2000-11-07 Lanclos; Kenneth W. Heat dissipating housing for electronic components
US20090154102A1 (en) * 2007-12-12 2009-06-18 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20120287578A1 (en) * 2011-05-13 2012-11-15 Askey Computer Corp. Heat-dissipating casing for communication apparatus
US20130294030A1 (en) * 2012-05-04 2013-11-07 Inventec Corporation Electronic device and heat dissipation module thereof
US20160295679A1 (en) * 2015-04-03 2016-10-06 Motorola Solutions, Inc. Electronic device including an externally-mounted heat pipe

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6144556A (en) * 1999-03-30 2000-11-07 Lanclos; Kenneth W. Heat dissipating housing for electronic components
US20090154102A1 (en) * 2007-12-12 2009-06-18 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20120287578A1 (en) * 2011-05-13 2012-11-15 Askey Computer Corp. Heat-dissipating casing for communication apparatus
US20130294030A1 (en) * 2012-05-04 2013-11-07 Inventec Corporation Electronic device and heat dissipation module thereof
US20160295679A1 (en) * 2015-04-03 2016-10-06 Motorola Solutions, Inc. Electronic device including an externally-mounted heat pipe

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4210444A4 (fr) * 2020-10-23 2024-03-06 ZTE Corporation Procédé de dissipation de chaleur de dispositif et dispositif de dissipation de chaleur

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