WO2020164687A1 - Dispositif de retenue pour traitement de substrat dans une chambre à vide, système de retenue, système et procédé - Google Patents

Dispositif de retenue pour traitement de substrat dans une chambre à vide, système de retenue, système et procédé Download PDF

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Publication number
WO2020164687A1
WO2020164687A1 PCT/EP2019/053415 EP2019053415W WO2020164687A1 WO 2020164687 A1 WO2020164687 A1 WO 2020164687A1 EP 2019053415 W EP2019053415 W EP 2019053415W WO 2020164687 A1 WO2020164687 A1 WO 2020164687A1
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WO
WIPO (PCT)
Prior art keywords
holder
magnet
substrate
holding assembly
holding
Prior art date
Application number
PCT/EP2019/053415
Other languages
English (en)
Inventor
Matthias HEYMANNS
Sathiyamurthi GOVINDASAMY
Jens GRÖLS
Tommaso Vercesi
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Priority to PCT/EP2019/053415 priority Critical patent/WO2020164687A1/fr
Priority to CN201980091964.2A priority patent/CN113454261A/zh
Publication of WO2020164687A1 publication Critical patent/WO2020164687A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports

Definitions

  • Embodiments of the present disclosure relate to a holder for substrate processing in a vacuum chamber and a holding arrangement for supporting a carrier. Further embodiments relate to a system for processing a substrate in a vacuum chamber and a method for processing a substrate in a vacuum chamber. In particular, some embodiments of the present disclosure relate to a holder or a holding arrangement for a substrate carrier or a mask carrier during a substrate-mask alignment for material deposition, particularly materials including organic materials.
  • the system can be a system for deposition of one or more layers, particularly layers including organic materials, on a substrate.
  • Organic evaporators are a tool for the production of organic light- emitting diodes (OLED).
  • OLEDs are a type of light-emitting diode in which the emissive layer comprises a thin-film of certain organic compounds.
  • Organic light emitting diodes (OLEDs) are used in the manufacture of television screens, computer monitors, mobile phones, other hand-held devices, etc., for displaying information.
  • OLEDs can also be used for general space illumination.
  • the range of colors, brightness, and viewing angles possible with OLED displays is greater than that of traditional LCD displays, because OLED pixels directly emit light and do not involve a back light. Therefore, the energy consumption of OLED displays is considerably less than that of traditional LCD displays.
  • OLEDs can be manufactured onto flexible substrates.
  • a plurality of layers such as layers including organic material, are deposited on a substrate with a pixel mask providing openings having the size of a pixel of the display.
  • the masks are exchanged for maintenance and/or cleaning after depositing a plurality of substrates, for example, 20 to 50 substrates.
  • the mask is supported by a mask carrier.
  • the mask carrier or a mask stage supports the mask during deposition.
  • a mask carrier may further transport the mask within a production system. For example, the mask can be transported from a deposition chamber to a mask cleaning chamber and vice versa.
  • Pixel masks such as fine metal masks (FFM) are typically manufactured in a horizontal position.
  • FAM fine metal masks
  • a substrate processing system having vertical or essentially vertical substrates in the system can reduce the footprint.
  • the change in orientation from a horizontal manufacturing position to a vertical position, in which a mask is supported by a mask carrier may result in a deterioration of the pixel accuracy.
  • a mask carrier transporting the mask beneficially has a design providing a compromise between transporting the masks in the substrate processing system and supporting the mask during deposition.
  • mask alignment and substrate alignment can be very challenging, particularly for vertically oriented large area substrates. Due to a high demand on reliability and handling of sensitive substrates, improvement is beneficial.
  • Substrate processing in a vacuum can include, for example, material deposition, especially on a large area substrate, particularly a vertically oriented large area substrate.
  • a holder for substrate processing in a vacuum chamber includes a holder body with a magnet plate.
  • the magnet plate is configured to be attracted by a magnetic force of a magnet of a holding assembly.
  • the holder has a first surface facing the holding assembly, wherein the first surface has a coating on at least a portion of the first surface or at least a portion of the first surface has been subject to a structuring treatment.
  • the holder can be a part of a substrate carrier, wherein the substrate carrier is adapted to hold a substrate during processing in a vacuum chamber.
  • the holder can also be part of a mask carrier or a mask stage configured to support a mask in a system for material deposition on a substrate.
  • a holder for substrate processing in a vacuum chamber includes a holder body with a magnet plate, and an elastic element provided at the holder body at or adjacent to the magnet plate.
  • a holder for substrate processing in a vacuum chamber includes a holder body with a magnet plate.
  • the magnet plate is configured to be attracted by a magnetic force of a magnet of a holding assembly.
  • the holder further includes an elastic element configured for absorbing mechanical energy of mechanical contact between the holding assembly and the holder. Particularly, absorbing mechanical energy can be performed by compressing the elastic element.
  • a holding arrangement for supporting a carrier for substrate processing in a vacuum chamber with a magnetic force is suggested.
  • the holding arrangement includes: a magnet element configured to provide a magnetic force; a holder body with a magnet plate configured to couple to a carrier and configured to be attracted by the magnetic force of the magnet element; and at least one of: an elastic element configured for absorbing mechanical energy of mechanical contact between the magnetic element and the holder body, and a friction element configured for providing a mechanical contact between the magnet element and the magnet plate with an increased friction coefficient.
  • a system for processing a substrate in a vacuum chamber is suggested, wherein the system includes a holder or a holding arrangement according to the present disclosure.
  • a method for processing a substrate in a vacuum chamber includes: supporting the substrate with a holder having a holder body with a magnet plate; attracting the magnet plate with a magnetic force of a magnet of a holding assembly; compressing an elastic element when holding the holder.
  • the method can be implemented with a holder, a holding arrangement or a system according to the present disclosure.
  • FIG. 1 shows a schematic view of a vacuum deposition system according to the present disclosure
  • FIG. 2 shows schematic views illustrating a substrate carrier and a mask carrier of a vacuum deposition system as described in FIG. 1;
  • FIG. 3 shows a holding arrangement with a holder and a holding assembly according to embodiments described herein.
  • FIG. 4 shows an embodiment of the holding arrangement of FIG. 3 from a different perspective
  • FIGS. 5 A and 5B show a holder according to an embodiment of the present disclosure
  • FIGS. 6 shows a holder according to another embodiment of the present disclosure
  • FIG. 7 shows a holder according to another embodiment of the present disclosure
  • FIG. 8 shows a holding arrangement according to an embodiment of the present disclosure
  • FIG. 9 shows a flow chart illustrating a method for processing a substrate in a vacuum chamber according to embodiments of the present disclosure.
  • the material deposition apparatus 100 includes a vacuum chamber 102.
  • a material deposition arrangement 120 e.g. a deposition source and a distribution assembly 122 according to any of the embodiments described herein, is arranged in the vacuum chamber 102.
  • a first deposition area and a second deposition area which may be located on opposite sides of the deposition source, are provided in the vacuum chamber 102.
  • a substrate carrier 130 may be arranged in the first deposition area, and a further substrate carrier 130 may be arranged in the second deposition area.
  • a“material deposition arrangement” is to be understood as an arrangement configured for material deposition on a substrate as described herein.
  • a “material deposition arrangement” can be understood as an arrangement configured for deposition of organic materials, e.g. for OLED display manufacturing, on large area substrates.
  • a“large area substrate” can have a main surface with an area of 0.5 m 2 or larger, particularly of 1 m 2 or larger.
  • a large area substrate can be GEN 4.5, which corresponds to about 0.67 m 2 of substrate (0.73x0.92m), GEN 5, which corresponds to about 1.4 m 2 of substrate (1.1 m x 1.3 m), GEN 7.5, which corresponds to about 4.29 m 2 of substrate (1.95 m x 2.2 m), GEN 8.5, which corresponds to about 5.7 m 2 of substrate (2.2 m x 2.5 m), or even GEN 10, which corresponds to about 8.7 m 2 of substrate (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can similarly be implemented.
  • half sizes of the above mentioned substrate generations can be coated by evaporation of an apparatus for evaporating material.
  • the half sizes of the substrate generation may result from some processes running on a full substrate size, and subsequent processes running on half of a substrate previously processed.
  • the substrate may be made of a material selected from the group consisting of glass (for instance soda-lime glass, borosilicate glass etc.), metal, polymer, ceramic, compound materials, carbon fiber materials or any other material or combination of materials which can be coated by a deposition process.
  • glass for instance soda-lime glass, borosilicate glass etc.
  • metal for instance soda-lime glass, borosilicate glass etc.
  • polymer for instance polysilicate glass, metal, polymer, ceramic, compound materials, carbon fiber materials or any other material or combination of materials which can be coated by a deposition process.
  • a “vacuum deposition chamber” is to be understood as a chamber configured for vacuum deposition.
  • the term“vacuum”, as used herein, can be understood in the sense of a technical vacuum having a vacuum pressure of less than, for example, 10 mbar.
  • the pressure in a vacuum chamber as described herein may be between 10 -5 mbar and about 10 -8 mbar, more typically between 10 5 mbar and 10 7 mbar, and even more typically between about 10 6 mbar and about 10 7 mbar.
  • the material deposition arrangement 120 may be configured to move sequentially past the first deposition area for coating one substrate carrier 130 and a second deposition area for coating an opposing second substrate carrier 130.
  • the substrates may have an essentially vertical orientation.
  • the substrates may be supported by a substrate carrier in an essentially vertical orientation, wherein the substrate carrier may be configured for carrying the substrate through the vacuum chamber 102.
  • the substrate carrier can be supported by a substrate carrier support in the vacuum chamber, particularly in the vacuum processing system, for example, while the substrate is moved from one material deposition apparatus to another material deposition apparatus and within the material deposition apparatus.
  • the substrate carrier can be transported inside the vacuum chamber with a magnetic levitation system.
  • the carrier or substrate carrier may be configured for supporting the substrate in a non-horizontal orientation, particularly in an essentially vertical orientation or vertical orientation.
  • An“essentially vertical orientation” or“vertical orientation” as used herein may be understood as an orientation wherein an angle between a main surface of substrate carrier and the gravity vector is between +10° and -10°, particularly between 5° and -5°.
  • the orientation of the substrate carrier may not be (exactly) vertical during transport and/or during deposition, but slightly inclined with respect to the vertical axis, e.g. by an inclination angle of between 0° and -5°, particularly of between -1° and -5°.
  • a negative angle refers to an orientation of the substrate carrier wherein the substrate carrier is inclined downward, i.e.
  • the substrate surface to be processed is facing downward.
  • a deviation from the gravity vector of orientations of the mask and the substrate during the deposition may be beneficial and may result in a more stable deposition process, or a down-facing orientation might be suitable for reducing particles on the substrate during deposition.
  • an exact vertical orientation (+/- 1 °) of the mask device during transport and/or during deposition is also possible. Accordingly, a reference in the specification or the claims to a vertical orientation is understood to have an essentially vertical orientation as defined herein (e.g. +- 10° or less). An exact vertical orientation is described by a direction of gravity or by using the term“exact” or the like.
  • a mask carrier 140 may be arranged in front of the substrate carrier 130, i.e. between the substrate carrier 130 and the material deposition arrangement 120, for example, a deposition source, during deposition.
  • the mask carrier 140 may be a fine metal mask with an opening pattern configured for depositing a complementary material pattern on the substrate.
  • the mask may be an edge exclusion mask.
  • material deposition with a pattern mask such as a fine metal mask (FMM) can be provided on large area substrates.
  • a pattern mask e.g. for pixel generation of a display, provides a pattern in the micron range. Positioning tolerance of openings of the pattern mask in the micron range can be challenging over large areas. This is particularly true for vertically or essentially vertically oriented substrates. Even the gravity acting on the pattern mask and/or a respective frame of the pattern mask may cause a deterioration of the positioning accuracy of the pattern mask.
  • an improved mask assembly handling and/or mask alignment according to embodiments of the present disclosure is advantageous, and particularly for vertically or essentially vertically oriented large area substrates.
  • FIG. 1 shows a substrate carrier 130 provided and/or transported on a substrate transportation track 132 and a mask carrier 140 provided and/or transported on a mask transportation track 142.
  • a substrate transportation track 132 and a mask transportation track 142 may be provided on both sides of the material deposition arrangement 120.
  • a mask stage 150 can be provided between the mask transportation track and the material deposition arrangement.
  • the mask stage is stationary within the vacuum chamber 102, i.e. within the material deposition apparatus.
  • the mask stage 150 is configured to support a mask assembly during material deposition on the substrate, or during substrate processing, in general.
  • FIG. 1 further schematically shows a valve system 104 for transport of the substrate or the mask into the vacuum chamber 102 or out of the vacuum chamber 102.
  • Employing a material deposition arrangement 120 according to aspects described herein may be beneficial for high quality display manufacturing, particularly OLED manufacturing.
  • FIG. 2 shows a substrate carrier 130 with a substrate 131.
  • the substrate carrier 130 can be magnetically levitated or transported otherwise to its processing position. At the position, the substrate carrier 130 can be held, for example, by at a stationary unit, with a holder 10 or a holding arrangement 1 according to the present disclosure.
  • a mask carrier 140 with a mask or any other carriers or stages can be magnetically supported with a holder 10 or a holding arrangement 1 according to the present disclosure.
  • FIG. 2 shows a mask carrier 140 and a substrate carrier 130 behind each other in a vertical arrangement.
  • a holder 10 or a holding arrangement 1 as described herein may also be provided for other applications, and particularly for applications for which the holder 10 or the holding arrangement 1 is provided in a vacuum chamber, i.e. for applications wherein the holder 10 is operated under vacuum.
  • Substrate carrier 130 or mask carrier 140 can include, for example, four holders 10 or four holding arrangements 1, especially, one in each comer, as shown in FIG. 2. Eight holders 10 or holding arrangements 1 are shown in the dashed circles. The holders 10 or holding arrangements 1 do not necessarily have to be identical. The holders 10 or holding arrangements 1 can vary as further described below, for example in, size, orientation, elastic element and coating or surface treatments on a side of the holder 10. [0037] In FIG. 2, the mask transportation track 142 and the substrate transportation track 132 are illustrated in the plane of the figure. The substrate carrier 130 and the mask carrier 140 can be transported with a magnetic levitation unit or otherwise along the tracks 132, 142. Deposition of material would be from behind in FIG. 2.
  • FIG. 3 shows a holding arrangement 1 with a holder 10 and a holding assembly 20 according to some embodiments.
  • the holder 10 may be suitable for substrate processing in a vacuum chamber, particularly for a vacuum deposition system as shown in FIG. 1 and for a substrate carrier 130 or a mask carrier 140 as shown in FIG. 2.
  • the holder 10 includes a holder body 11 with a magnet plate 12.
  • the magnet plate 12 is configured to be attracted by a magnetic force of a magnet 21 of a holding assembly 20.
  • the holder 10 has a first surface facing the holding assembly 20.
  • the first surface may have a coating on at least a portion of the first surface or at least a portion of the first surface has been subject to a structuring treatment.
  • Embodiments of the first surface of the holder 10 are shown in FIGS. 5 A to 7 in detail.
  • the first surface of holder 10 can be the surface of the magnet plate 12.
  • the holder 10 and the holding assembly 20 are shown an attached state.
  • the holder 10 and the holding assembly 20 are coupled by a magnetic force, e.g. a force between the magnet plate 12 and the holding assembly 20.
  • the holding assembly 20 includes an electro magnet, especially an electro permanent magnet, and the magnet plate 12 can be attracted by the electro magnet.
  • the magnet plate 12 is configured to be attracted by a magnetic force and can include, according to some embodiments, a metal, especially a ferromagnetic metal like iron, cobalt or nickel.
  • the magnet plate 12 can be an integral part of the holder body 11.
  • the holder body 11 can include a material that can be attracted by a magnetic force and a part of the holder body 11 can be formed as a plate.
  • the magnet plate 12 can be attached to the holder body 11, for example by any suitable means.
  • the holder 10 and the magnetic element 21 can be attached to each other with magnetic force between the magnetic plate 12 and the magnetic element 21.
  • the connection between the holder 10 and the magnetic element 21 is a detachable connection.
  • the holder 10 has a first surface facing the holding assembly 20.
  • the opposite side of the holder 10, shown on the left side of FIG. 3, can be permanently attached to a substrate carrier, a mask carrier or other carriers or components used in vacuum processing.
  • the holding assembly 20 can be attached to or can be a part of a holding system and/or a transport system in a vacuum chamber. Accordingly, a detachable connection between a substrate carrier or mask carrier and a holding system and/or the transport system inside a vacuum chamber is provided.
  • a holder 10 for substrate processing in a vacuum chamber wherein the holder 10 includes a holder body 11 with a magnet plate 12. The holder 10 further includes an elastic element 13 provided at the holder body 11 at or adjacent to the magnet plate 12.
  • a holder 10 for substrate processing in a vacuum chamber which includes a holder body 11 and a magnet plate 12 as described above and an elastic element 13 configured for absorbing mechanical energy of mechanical contact between the holding assembly 20 and the holder 10.
  • holder 10 can include an elastic element 13 provided at the holder body 11 at or adjacent to the magnet plate 12. Particularly, the elastic element 13 is provided on the first surface of the holder 10 facing the holding assembly 20. The elastic element is configured for absorbing mechanical energy of mechanical contact between the holding assembly 20 and the holder 10. The elastic element 13 is configured for damping mechanical contact between the holding assembly 20 and the holder 10. During the attachment process of holder 10 and holding assembly 20, both may bump on each other. The resulting mechanical shock and vibration can provide unwanted particles and/or damage the substrate carrier 130 or the mask carrier 140. Vacuum processes are vulnerable to vibrations and debris particles. Mechanical contact can create vibrations and debris particles which can be reduced by an elastic element 13 configured for absorbing mechanical energy of mechanical contact.
  • elastic element 13 at least partially protrudes above the first surface, which is shown in FIG. 3 and in more detail in the embodiments of FIGS. 5 A / 5B.
  • FIG. 3 shows a holding arrangement 1 for supporting a carrier for substrate processing in a vacuum chamber with a magnetic force, including: a magnet element 21 configured to provide a magnetic force; a holder body 11 with a magnet plate 12 configured to couple to a carrier and configured to be attracted by the magnetic force of the magnet element 21; at least one of: an elastic element 13 configured for absorbing mechanical energy of mechanical contact between the magnetic element 21 and the holder 10, and a friction element configured for providing a mechanical contact between the magnet element 21 and the holder body 11 with an increased friction coefficient.
  • FIG. 4 shows a holder assembly 20 according to an embodiment. A front view of the holding assembly is shown in FIG. 4 which corresponds to the right part of FIG. 3.
  • the holding assembly 20 includes a magnet element 21 which can attract a corresponding part via a magnetic force.
  • the holding assembly can further include a housing 22 in which, for example, the magnetic element 21 is at least partly embedded.
  • magnetic element 21 is an electropermanent magnet.
  • magnet element 21 is switchable between a magnetized state and a non-magnetized state by applying an electrical current.
  • magnet element 21 is an electropermanent magnet element configured to remain in a magnetized state or a non-magnetized state after removal of the electrical current.
  • a substrate carrier with a holder 10 can be held without permanent current flow, thereby increasing safety and reliability.
  • the electropermanent magnet element 21 is switchable between a magnetized state and a non-magnetized state by applying an electrical current.
  • a power supply can be provided for supplying an electrical current to the electropermanent magnet element 21. Applying an electrical current causes the magnetic field of the electropermanent magnet element 21 to be reconfigured, subsequently altering the magnetic force applied to magnet plate 12.
  • the electropermanent magnet element 21 may be integrated into a magnetic support unit.
  • magnet plate 12 of the holder may be embedded in a substrate or mask carrier, and electropermanent magnet element 21 may be embedded in a stationary unit inside the vacuum chamber for holding the substrate or mask carrier and/or accurately fixing a mask in place on a substrate.
  • the stationary unit includes an actuator, especially a piezo actuator, for fine adjustment of the substrate carrier and the mask carrier.
  • magnet element 21 in the holding assembly 20 can vary. As exemplarily shown in the embodiment of FIG 4, which can be combined with any other embodiments described herein, magnet element 21 includes a first magnetic pole 23 and at least a second magnet pole 23 Since a magnet always has at least two magnetic poles, magnet element 21 can have different geometries. For example, magnet elements 21 can have two adjacent magnetic poles 23, 23’ as shown in FIG. 4 or magnet element 21 can have four magnetic poles or magnet element can have a single magnetic pole, wherein the housing 22 of the holding assembly 20 acts as the second magnetic pole.
  • holding assembly 20 and especially magnet element 21 is configured accordingly to the corresponding magnet plate 12.
  • the magnet element 21 and magnetic plate 12 are corresponding counter parts.
  • Holding assembly 20 has a surface for mechanically contacting holder 10, especially, magnet element 21 is configured for contacting the magnet plate 12.
  • elastic element 13 of holder 10 is adapted to the form of magnet element 21 for damping of mechanical contact between magnet plate 12 and magnet element 21.
  • FIG. 4 shows a holding assembly 20 and FIGS. 5A/5B show a corresponding holder 10 having elastic elements 13 which are adapted to the form of magnet elements 21 of the holding assembly 20.
  • the holding arrangement 1 includes at least one of: an elastic element 13 configured for absorbing mechanical energy of mechanical contact between the magnetic element 21 and the holder body 11, and a friction element configured for providing a mechanical contact between the magnet element
  • the elastic element 13 is part of the holder 10 and positioned between the holder body 11 and the holding assembly 20. According to some other embodiments, the elastic element 13 can be a part of holding assembly 20.
  • elastic element 13 can be attached to the housing 22 of the holding assembly 20.
  • a friction element can be provided at holder 10 or at holding assembly 20. The friction element is positioned at the mechanical connection of the holder 10 and the holding assembly 20, increasing the friction between the holder 10 and the holding assembly 20.
  • the elastic element 13 and/or the coating and/or a surface treatment improve the clamping process between holder 10 and holding assembly 20 in that the clamping is more robust and reliable.
  • the holding arrangement 1 can include a hard stop configuration 2.
  • the hard stop configuration 2 stops the holder or the holding assembly 20, respectively, in the case of an unwanted slide of the holder 10 with respect to the holding assembly 20.
  • a hard stop configuration 2 abruptly stops a substrate carrier or a mask carrier in a vertical orientation in the case of an unwanted slide.
  • a hard stop configuration 2 can include, for example, a cavity formed in the holder body 11 and a nose extending from the holding assembly 20, wherein the nose gears into the cavity in a holding state of the holding arrangement 1.
  • the hard stop configuration 2 can also include an edge formed in the holder 10 and a corresponding edge formed in the holding assembly 20, wherein the edges or the cavity wall and the nose are separated by a distance in a holding state of the holding arrangement 1 and may, for example, bump into each other in an unwanted sliding state of the holder 10 resulting in an abrupt stop of holder 10.
  • FIGS. 5 A to 7 show some embodiments of a holder 10 or parts of a holding arrangement 1 , respectively.
  • FIGS. 5 A and 5B show a holder 10 from different perspectives.
  • the holder 10 includes an elastic element 13.
  • the elastic element 13 is configured for absorbing mechanical energy of mechanical contact between the magnetic element 21 and the holder body 11 and/or the holding assembly 20 and the holder 10, respectively. Absorption of mechanical energy is especially performed by compressing elastic element 13, resulting in a damping of mechanical contact. Absorption of mechanical energy is advantageous to reduce damage due to mechanical contact, abrasion and particle creation inside the vacuum.
  • elastic element 13 is at least one of an O-ring, a polymer block, and a vulcanized polymer layer.
  • Elastic element 13 particularly consists of one or more materials suitable for a vacuum chamber with a pressure in the vacuum chamber between 10 -5 mbar and about 10 -8 mbar, more typically between 10 5 mbar and 10 7 mbar, and even more typically between about
  • elastic element 13 can at least partially protrude above the holder body 11 or the magnet plate 12, respectively.
  • the distance allows the elastic element 13 to be compressed between the holder 10 and the holding assembly 20.
  • the distance can be in the range of, for example, 0,1 mm to 0,4 mm, particularly, 0,1 mm to 0,2 mm.
  • the distance is influenced by the compressibility of the elastic element 13.
  • elastic element 13 can increase stiction between holder 10 and holding assembly 20.
  • Stiction is the static friction that needs to be overcome to enable relative motion of stationary objects in contact, in this case holder 10 and holding assembly 20.
  • the elastic element 13 can be additionally a friction element.
  • a friction element increases the static friction between holder 10 and holding assembly 20, especially between holder body 11 and magnet element 21.
  • An elastic element 13, especially when compressed in a holding state, can provide enough stiction to ensure holding reliability.
  • elastic element 13 can include one or more O-rings.
  • FIG. 5B shows an embodiment in which the holder 10 includes three O-rings.
  • the O-rings are configured for contacting holding assembly 20.
  • the large outer O-ring is configured to contact the housing 22 of holding assembly 20 and the smaller inner o-rings are configured to contact the magnetic elements 21, 2G of holding assembly 20.
  • elastic elements 13 can include, for example, polymer blocks or a polymer layer. A polymer layer can cover at least a portion of the first surface.
  • the holder 10 has a first surface facing the holding assembly 20, wherein the first surface has a coating 14 on at least a portion of the first surface as shown in the embodiments of FIGS. 6 and 7.
  • a coating 14 provides an improved friction between holder 10 and holding assembly 20.
  • Holder 10 and holding assembly 20 pressing against each other (but not sliding) will require some threshold of force parallel to the surface of contact in order to overcome static cohesion. Stiction or static friction (friction) is a threshold, not a continuous force.
  • the system is a vertically oriented system in which a substrate carrier is levitated to a processing position and supported at the processing position with a holding arrangement 1 in a vertical position
  • strong friction between holder 10 and holding assembly is beneficial for the reliability of the system.
  • stiction would be a threshold force which has to be overcome for vertical sliding between the holder 10 and holding assembly 20.
  • the first surface of holder 10 can be the surface of the holder body 11 and/or of the magnet plate 12 facing the holding assembly 20.
  • the coating 14 can be described as a surface with micro teeth that grab into the surface of the holding assembly 20.
  • coating 14 comprises a hard material compared to a soft material in the holding assembly 20 at the surface for contacting the holder 10.
  • coating 14 includes a hard material,“teeth”, which grab or“bite” into the surface of the holding assembly 20 including a soft material.
  • Such an effect can be achieved, for example, by a tungsten carbide coating or a coating including a soft matrix and hard particles like diamond particles in a nickel matrix.
  • the coating 14 can be a friction element.
  • holder 10 can include a thin plate or areas on the first surface improving the friction between holder 10 and holding assembly 20.
  • elastic element 13 can also improve the friction between holder 10 and holding assembly 20 and may be a friction element.
  • the first surface of the holder 10 has a first friction coefficient and the coating 14 has a second friction coefficient larger than the first friction coefficient.
  • the first friction coefficient corresponds to a situation in which no coating 14 is provided on the first surface, for example prior to a coating process or on areas which are not coated.
  • the friction coefficients are static friction coefficients.
  • a coating 14 can cover the first surface as shown in FIG. 6. In yet other embodiments, coating 14 can cover the first surface partially as shown in FIG. 7.
  • holder 10 includes both, a coating 14 and an elastic element 13 as shown in FIG. 7.
  • the coating 14 can be configured to contact the magnetic element 21 of holding assembly 20 and the elastic element can be configured to contact the housing 22 of holding assembly 20.
  • the elastic element can at least partially surround coating 14 as shown in FIG. 7.
  • a coating 14 can be selected from the group consisting of: tungsten carbide, nickel-diamond, and Nimonic® 90-coating.
  • Nimonic® 90 is also known as Superimphy 90, Pyromet 90 or Udimet 90.
  • Nimonic® 90 comprises Cr: 18.00 to 21.00%, Fe: 0 to 1.50%, Ti: 2.00 to 3.00%, Mn: 0 to 1.0%, Si: 0 to 1.0%, C: 0 to 0.13%, Al: 1.00 to 2.00%, Co: 15.00 to 21.00%, S: 0 to 0.015%, Cu: 0 to 0.20%, B: 0 to 0.02%, Pb: 0 to 0.002%, Zr: 0 to 0.15%, Ag: 0 to 0.0005%, Bi: 0 to 0.0001% and balance Ni.
  • the holding assembly 20 has a coating analogously to the embodiments previously disclosed.
  • the coating of the holding assembly 20 is facing holder 10 and is configured to increase the friction between holding assembly 20 and holder 10.
  • FIG. 8 shows an extract of a transition from the holder body 11 or the coating 14 to the magnet element 21.
  • the rough surface of the coating 14 or the treated surface of the holder body 11 increases the friction.
  • holder 10 has a first surface facing the holding assembly 20 and has a hard material, especially a hard coating 14, and holding assembly 20 has a contact surface facing the holder 10 and has a soft material.
  • the first surface can be the surface of the holder body 11, especially the surface of the magnet plate 12.
  • holding arrangement 1 can include a magnet 30 for collecting particles, especially particles that are produced by mechanical contact between holder 10 and holding assembly 20.
  • Magnet 30 can be attached adjacent, near or to holder 10 or near or to holding assembly 20.
  • Magnet 30 is particularly a permanent magnet.
  • the first surface of the holder 10 has been subject to a structuring treatment.
  • the structuring treatment can have the same effect as a coating 14 and increase the friction coefficient of the first surface.
  • the surface treatment can be selected from a group consisting of: surface roughening, laser structuring and combinations thereof.
  • the combinations of structuring treatment, coating and elastic elements are possible on one of the holder 10 or the holding assembly 20 or both.
  • Holder 10 and holding assembly 20 each can include an elastic element and/or a coating and/or a surface treatment in various combinations.
  • a method for processing a substrate in a vacuum chamber is provided.
  • the method 200 is shown in a flow chart in FIG. 9.
  • the method includes: providing the substrate attached to a holder having a holder body with a magnet plate 202; attracting the magnet plate with a magnetic force of a magnet of a holding assembly 203; and compressing an elastic element when holding the holder 204.
  • the method can further include: transporting the substrate with a magnetic levitation unit to a processing position
  • a system for processing a substrate in a vacuum chamber is suggested.
  • the system includes: a holder 10 or a holding arrangement 1 as described above.
  • the system can further include a vacuum chamber; a processing tool for processing the substrate, particularly for depositing material on the substrate; and a carrier transport arrangement, particularly having a magnetic levitation unit.
  • the holder 10 or the holding arrangement 1 can hold carrier having a substrate or a mask at the processing position.
  • the processing position is particularly a position in which material is deposited on the substrate.
  • the system can be a system according to the example shown in FIG. 1.
  • the substrate is held in a vertical position, for example, in a vacuum deposition system as shown in Fig. 1 and as disclosed above.
  • the method can be combined with any holder 10 and/or holding arrangement 1 disclosed herein.
  • the method 200 can further include: evacuating the vacuum chamber 201, especially to a pressure between 10 -5 mbar and about 10 -8 mbar, more typically between 10 5 mbar and 10 7 mbar, and even more typically between about 10 6 mbar and about 10 7 mbar.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

La présente invention concerne un agencement de retenue destiné à supporter un support pour traitement de substrat dans une chambre à vide avec une force magnétique, comprenant : un élément magnétique conçu pour fournir une force magnétique ; un corps de dispositif de retenue avec une plaque magnétique conçu pour être couplé à un support et conçu pour être attiré par la force magnétique de l'élément magnétique ; et au moins un élément parmi : un élément élastique conçu pour absorber l'énergie mécanique de contact mécanique entre l'élément magnétique et le corps de dispositif de retenue, et un élément de frottement conçu pour fournir un contact mécanique entre l'élément magnétique et la plaque magnétique avec un coefficient de frottement accru.
PCT/EP2019/053415 2019-02-12 2019-02-12 Dispositif de retenue pour traitement de substrat dans une chambre à vide, système de retenue, système et procédé WO2020164687A1 (fr)

Priority Applications (2)

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PCT/EP2019/053415 WO2020164687A1 (fr) 2019-02-12 2019-02-12 Dispositif de retenue pour traitement de substrat dans une chambre à vide, système de retenue, système et procédé
CN201980091964.2A CN113454261A (zh) 2019-02-12 2019-02-12 用于在真空腔室中的基板处理的支架、固持布置、系统和方法

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PCT/EP2019/053415 WO2020164687A1 (fr) 2019-02-12 2019-02-12 Dispositif de retenue pour traitement de substrat dans une chambre à vide, système de retenue, système et procédé

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KR20150069104A (ko) * 2013-12-13 2015-06-23 주식회사 에스에프에이 박막 증착 장치
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WO2022089746A1 (fr) * 2020-10-29 2022-05-05 Applied Materials, Inc. Appareil magnétique, ensemble support de substrat et procédé de fixation de cadre de support de bord à un cadre de table

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