WO2020083462A1 - Appareil de dépôt de matériau, système de dépôt sous vide et procédé de traitement d'un substrat de grande surface - Google Patents

Appareil de dépôt de matériau, système de dépôt sous vide et procédé de traitement d'un substrat de grande surface Download PDF

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Publication number
WO2020083462A1
WO2020083462A1 PCT/EP2018/078874 EP2018078874W WO2020083462A1 WO 2020083462 A1 WO2020083462 A1 WO 2020083462A1 EP 2018078874 W EP2018078874 W EP 2018078874W WO 2020083462 A1 WO2020083462 A1 WO 2020083462A1
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WO
WIPO (PCT)
Prior art keywords
mask
substrate
assembly
alignment
deposition apparatus
Prior art date
Application number
PCT/EP2018/078874
Other languages
English (en)
Inventor
Stefan Bangert
Jürgen Henrich
Andreas Sauer
Matthias HEYMANNS
Sebastian Gunther ZANG
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Priority to KR1020217010602A priority Critical patent/KR20210057117A/ko
Priority to CN201880098048.7A priority patent/CN112771198A/zh
Priority to PCT/EP2018/078874 priority patent/WO2020083462A1/fr
Publication of WO2020083462A1 publication Critical patent/WO2020083462A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Definitions

  • Embodiments of the present disclosure relate to mask alignment for material deposition, particularly materials including organic materials.
  • Embodiments of the present disclosure relate to deposition apparatuses for depositing one or more layers, particularly layers including organic materials, on a substrate.
  • embodiments of the present disclosure relate to material deposition arrangements for depositing evaporated material on a substrate in a vacuum deposition chamber, vacuum deposition systems and methods therefor, particularly for OLED manufacturing. Further, embodiments relate to conditioning of material deposition arrangements.
  • Organic evaporators are a tool for the production of organic light- emitting diodes (OLED).
  • OLEDs are a type of light-emitting diode in which the emissive layer comprises a thin-film of certain organic compounds.
  • Organic light emitting diodes (OLEDs) are used in the manufacture of television screens, computer monitors, mobile phones, other hand-held devices, etc., for displaying information.
  • OLEDs can also be used for general space illumination.
  • the range of colors, brightness, and viewing angles possible with OLED displays is greater than that of traditional LCD displays because OLED pixels directly emit light and do not involve a back light. Therefore, the energy consumption of OLED displays is considerably less than that of traditional LCD displays.
  • OLEDs can be manufactured onto flexible substrates.
  • a plurality of layers such as layers including organic material, are deposited on a substrate with a pixel mask providing openings having the size of a pixel of the display.
  • the masks are exchanged for maintenance and/or cleaning after depositing a plurality of substrates, for example, 20 to 50 substrates.
  • the mask is supported by a mask carrier.
  • the mask carrier supports the mask during deposition and further, transports the mask within a production system. For example, the mask can be transported from a deposition chamber to a mask cleaning chamber and vice versa.
  • Pixel masks such as fine metal masks (FFM) are typically manufactured in a horizontal position.
  • FAM fine metal masks
  • a substrate processing system having vertical or essentially vertical substrates in the system can reduce the footprint.
  • the change in orientation from a horizontal manufacturing position to a vertical position, in which a mask is supported by a mask carrier may result in a deterioration of the pixel accuracy.
  • a mask carrier transporting the mask beneficially has a design providing a compromise between transporting the masks in the substrate processing system and supporting the mask during deposition. Accordingly, mask alignment can be very challenging, particularly for vertically oriented large area substrates. Mask handling, mask support, tolerance chains of mask alignment and/or the like are beneficially improved.
  • a material deposition apparatus a vacuum processing system, and a method for processing a substrate, particularly a vertically oriented large area substrate, are provided.
  • a material deposition apparatus for depositing material on a substrate in a vacuum chamber.
  • the material deposition apparatus includes a mask stage configured to support a mask assembly having a mask frame and a mask; a substrate transportation track having at least a portion of the substrate transportation track provided in the vacuum chamber, the substrate transportation track being configured to support the substrate carrier; a holding device coupled to the mask stage and configured for a transfer of the mask assembly in an essentially vertical orientation onto the mask stage; and an alignment assembly having two or more alignment actuators, the alignment assembly being coupled to the mask stage and configured to couple to the substrate carrier to move the substrate carrier and the mask assembly relative to each other.
  • a material deposition apparatus for depositing material on a substrate in a vacuum chamber.
  • the material deposition apparatus includes a mask stage; a substrate transportation track configured to support a substrate carrier; a holding device coupled to the mask stage; and an alignment assembly having two or more alignment actuators, the alignment assembly being coupled to the mask stage.
  • a vacuum processing system is provided.
  • the vacuum processing system includes a material deposition apparatus according to any of the embodiments described herein; and a further vacuum chamber coupled to the vacuum chamber of the materials deposition apparatus by a first valve provided at a first side of the vacuum chamber.
  • a mask assembly is provided.
  • the mask assembly includes a mask frame; a mask coupled to the mask frame; and a light guiding assembly having at least one of a light guide for the electromagnetic radiation and a reflection unit for the electromagnetic radiation, wherein the light guiding assembly is included or coupled to the mask frame.
  • a method for processing a vertically oriented large area substrate is provided. The method includes transporting, in a vertical orientation, a substrate on a substrate carrier into the vacuum chamber; holding the substrate carrier, in the vertical orientation, with an alignment assembly coupled to the mask stage; and aligning the relative position between the substrate carrier and the mask assembly.
  • devices such as optoelectronic devices, particularly displays, manufactured with a method described herein and/or apparatuses or systems described herein are provided.
  • FIG. 1 shows a schematic view of a vacuum deposition system according to embodiments described herein;
  • FIGS. 2 A and 2B show schematic views illustrating an alignment of a mask assembly having a mask frame and a mask as depicted in FIG. 2B;
  • FIG. 3 shows a flow chart illustrating a method of processing a large area substrate in a vertical orientation, i.e. an essentially vertical orientation, according to embodiments described herein.
  • FIGS. 4A and 4B show schematic views illustrating a portion of a process of substrate support and substrate alignment having an alignment assembly coupled to the mask stage according to embodiments of the present disclosure
  • FIG. 5 shows a schematic view illustrating an alignment of a mask assembly and/or a mask manipulation according to some embodiments of the present disclosure
  • FIG. 6 shows a schematic view of material deposition apparatus having a mask stage, an alignment assembly, a source of electromagnetic radiation, and a detector according to embodiments of the present disclosure
  • FIG. 7 shows a schematic view of a mask stage and a source of electromagnetic radiation coupled to or attached to the mask stage according to embodiments of the present disclosure
  • FIG. 8 shows a schematic view of a mask stage and a source of electromagnetic radiation coupled to or attached to the mask stage according to further embodiments of the present disclosure
  • FIGS. 9 A and 9B show schematic views illustrating a portion of a process of substrate handling and mask handling in a material deposition apparatus according to embodiments of the present disclosure
  • FIGS. 10A and 10B show schematic views illustrating a portion of a material deposition apparatus including one or more mask manipulation actuators according to embodiments of the present disclosure
  • FIG. 11 shows a schematic view of a mask assembly and mask manipulation actuators according to embodiments of the present disclosure.
  • FIG. 12 shows a schematic side view of a material deposition arrangement having a support and a deposition source facing a mask shield and a mask stage according to embodiments described herein.
  • Embodiments of the present disclosure provide a material deposition apparatus, a vacuum processing system, a mask assembly, and methods of processing substrates, particularly large area substrates in a vertical orientation.
  • a mask assembly having a mask supported by a mask frame can be handed over or transferred from a mask carrier to a mask stage at the deposition position.
  • a substrate carrier and a mask assembly are moved relative to each other by an alignment assembly coupled to the mask stage.
  • the mask assembly is supported by the mask stage.
  • the mask stage can be stationary within the material deposition apparatus and may, thus, be heavy, solid, stiff, and/or of low-tolerance.
  • alignment assembly having, for example 2 or more alignment actuators, can be coupled to the mask stage. Mechanical tolerances can be reduced between the heavy, solid, stiff, and/or low tolerance structure of the mask stage and the substrate carrier for mask alignment.
  • a mask carrier which is also designed to be transportable within the vacuum processing system, does not introduce large tolerances for mask alignment.
  • mask alignment units such as one or more sources for electromagnetic radiation, light guides, and/or one or more reflection units for electromagnetic radiation to be coupled to or adjacent to the mask stage. It is further advantageous that a mask carrier may be constructed to be even less heavy and solid as compared to mask carriers supporting a mask assembly during deposition. [0030] Some embodiments described herein provide a material deposition apparatus for depositing material on a substrate in a vacuum chamber.
  • the material deposition apparatus includes a mask stage configured to support a mask assembly having a mask frame and a mask; a substrate transportation track having at least a portion of the substrate transportation track provided in the vacuum chamber, the substrate transportation track being configured to support the substrate carrier; a holding device coupled to the mask stage and configured for a transfer of the mask assembly in an essentially vertical orientation onto the mask stage; and an alignment assembly having two or more alignment actuators, the alignment assembly being coupled to the mask stage and configured to couple to the substrate carrier to move the substrate carrier and the mask assembly relative to each other.
  • FIG. 1 is a schematic top view of a material deposition apparatus 100 for depositing evaporated material onto two or more substrates, e.g. on a substrate 130 on the right hand side in FIG. 1 and on a further substrate 130 on the left hand side in FIG. 1.
  • the material deposition apparatus 100 includes a vacuum chamber 102.
  • a material deposition arrangement 120 e.g. a deposition source according to any of the embodiments described herein, is arranged in the vacuum chamber 102.
  • a first deposition area and a second deposition area which may be located on opposite sides of the deposition source, are provided in the vacuum chamber 102.
  • a substrate 130 may be arranged in the first deposition area, and a further substrate 130 may be arranged in the second deposition area.
  • a“material deposition arrangement” is to be understood as an arrangement configured for material deposition on a substrate as described herein.
  • a “material deposition arrangement” can be understood as an arrangement configured for deposition of organic materials, e.g. for OLED display manufacturing, on large area substrates.
  • a“large area substrate” can have a main surface with an area of 0.5 m 2 or larger, particularly of 1 m 2 or larger.
  • a large area substrate can be GEN 4.5, which corresponds to about 0.67 m 2 of substrate (0.73x0.92m), GEN 5, which corresponds to about 1.4 m 2 of substrate (1.1 m x 1.3 m), GEN 7.5, which corresponds to about 4.29 m 2 of substrate (1.95 m x 2.2 m), GEN 8.5, which corresponds to about 5.7 m 2 of substrate (2.2 m x 2.5 m), or even GEN 10, which corresponds to about 8.7 m 2 of substrate (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can similarly be implemented.
  • half sizes of the above mentioned substrate generations can be coated by evaporation of an apparatus for evaporating material.
  • the half sizes of the substrate generation may result from some processes running on a full substrate size, and subsequent processes running on half of a substrate previously processed.
  • the substrate may be made of a material selected from the group consisting of glass (for instance soda-lime glass, borosilicate glass etc.), metal, polymer, ceramic, compound materials, carbon fiber materials or any other material or combination of materials which can be coated by a deposition process.
  • glass for instance soda-lime glass, borosilicate glass etc.
  • metal for instance soda-lime glass, borosilicate glass etc.
  • polymer for instance polysilicate glass, metal, polymer, ceramic, compound materials, carbon fiber materials or any other material or combination of materials which can be coated by a deposition process.
  • a “vacuum deposition chamber” is to be understood as a chamber configured for vacuum deposition.
  • the term“vacuum”, as used herein, can be understood in the sense of a technical vacuum having a vacuum pressure of less than, for example, 10 mbar.
  • the pressure in a vacuum chamber as described herein may be between 10 -5 mbar and about 10 -8 mbar, more typically between 10 5 mbar and 10 7 mbar, and even more typically between about 10 6 mbar and about 10 7 mbar.
  • the material deposition arrangement 120 may be configured to move sequentially past the first deposition area for coating one substrate 130 and a second deposition area for coating an opposing second substrate 130.
  • the substrates may have an essentially vertical orientation.
  • the substrates may be supported by a substrate carrier in an essentially vertical orientation, wherein the substrate carrier may be configured for carrying the substrate through the vacuum chamber 102.
  • the substrate carrier can be supported by a substrate carrier support in the vacuum chamber, particularly in the vacuum processing system, for example, while the substrate is moved from one material deposition apparatus to another material deposition apparatus and within the material deposition apparatus.
  • the substrate carrier support can be a magnetic levitation system for the substrate carrier.
  • the carrier or substrate carrier may be configured for supporting the substrate in a non-horizontal orientation, particularly in an essentially vertical orientation or vertical orientation.
  • An“essentially vertical orientation” or“vertical orientation” as used herein may be understood as an orientation wherein an angle between a main surface of substrate carrier and the gravity vector is between +10° and -10°, particularly between 5° and -5°.
  • the orientation of the substrate carrier may not be (exactly) vertical during transport and/or during deposition, but slightly inclined with respect to the vertical axis, e.g. by an inclination angle of between 0° and -5°, particularly of between -1° and -5°.
  • a negative angle refers to an orientation of the substrate carrier wherein the substrate carrier is inclined downward, i.e.
  • the substrate surface to be processed is facing downward.
  • a deviation from the gravity vector of orientations of the mask and the substrate during the deposition may be beneficial and may result in a more stable deposition process, or a down-facing orientation might be suitable for reducing particles on the substrate during deposition.
  • an exact vertical orientation (+/- 1 °) of the mask device during transport and/or during deposition is also possible. Accordingly, a reference in the specification or the claims to a vertical orientation is understood to have an essentially vertical orientation as defined herein (e.g. +- 10° or less). An exact vertical orientation is described by a direction of gravity or by using the term“exact” or the like.
  • a mask assembly 140 may be arranged in front of the substrate 130, i.e. between the substrate 130 and the material deposition arrangement 120, for example, a deposition source, during deposition.
  • the mask assembly 140 may be a fine metal mask with an opening pattern configured for depositing a complementary material pattern on the substrate.
  • the mask may be an edge exclusion mask.
  • material deposition with a patern mask such as a fine metal mask (FFM) can be provided on large area substrates.
  • the size of the area on which material is to be deposited is e.g. 1.4 m 2 or above.
  • a pattern mask e.g. for pixel generation of a display, provides a pattern in the micron range. Positioning tolerance of openings of the pattern mask in the micron range can be challenging over large areas. This is particularly true for vertically or essentially vertically oriented substrates. Even the gravity acting on the pattern mask and/or a respective frame of the pattern mask may cause a deterioration of the positioning accuracy of the pattern mask.
  • an improved mask assembly handling and/or mask alignment according to embodiments of the present disclosure is advantageous, and particularly for vertical or essentially vertical oriented large area substrates.
  • a second mask assembly 140 may be arranged in front of the further substrate 130, i.e. between the further substrate and the material deposition arrangement 120, for example, a deposition source during deposition on the further substrate.
  • the materials deposition source arrangement may rotate as described with respect to FIG. 7 (see axis 706) to subsequently deposit first substrates in a first deposition area and second substrates in an opposing second deposition area.
  • the material deposition arrangement can be moved along arrow H.
  • the material deposition source may include one or more evaporation crucibles 124, such as three evaporation crucibles, and one or more distribution assemblies 122, such as three distribution pipes, which are in fluid connection with one of the evaporation crucibles 124, respectively.
  • the distribution assemblies or distribution pipes may extend essentially parallel to each other in an essentially vertical direction, for example, parallel to a surface of a substrate.
  • Nozzles may be provided in the distribution pipes along the length directions of the distribution pipes. For example, ten, thirty or more nozzles may be provided in a wall of the two or more distribution pipes.
  • the nozzles of a first distribution pipe, the nozzles of a second distribution pipe and/or the nozzles of a third distribution pipe may be inclined with respect to each other such that the respective plumes of evaporated material meet at the position of the substrate.
  • Employing a material deposition arrangement 120 according to embodiments described herein may be beneficial for high quality display manufacturing, particularly OLED manufacturing.
  • the material deposition arrangement 120 may be provided on a source track, e.g. a linear guide.
  • the source track 170 may be configured for a translational movement of the material deposition arrangement 120, e.g. in a horizontal direction as indicated by arrow H in FIG. 1.
  • the first deposition area may be provided opposite the second deposition area in the vacuum chamber 102.
  • the material deposition source may rotate by an angle of essentially 180° from the first deposition area to the second deposition area.
  • the length of the distribution pipes may correspond to a height of a substrate onto which material is to be deposited.
  • the length of the distribution pipes may be longer than the height of the substrates. Accordingly, a uniform deposition at the upper end of the substrate and/or the lower end of the substrate can be provided.
  • the length of the distribution pipes can be 1.3 m or more, for example 2.5 m or more.
  • the crucible 124 i.e. the evaporation crucible
  • the material e.g. an organic material
  • the evaporated material may enter the distribution pipe at the bottom of the distribution pipe and may be guided essentially sideways through the plurality of nozzles in the distribution pipe, e.g. towards an essentially vertically oriented substrate.
  • a valve 104 for example a gate valve, may be provided which allows for a vacuum seal to an adjacent vacuum chamber 110, e.g. a rotation chamber.
  • the valve 104 can be opened for transport of the substrate or the mask into the vacuum chamber 102 or out of the vacuum chamber 102.
  • the substrate and/or the mask assembly can be rotated around an axis in the vacuum chamber 110.
  • the rotation axis can be a vertical rotation axis.
  • a further valve 104 for example a gate valve, can be provided at an opposing side of the vacuum chamber 102.
  • the further valve can be opened for transport of a mask shield 160 into the vacuum chamber 102 or out of the vacuum chamber 102, for example along transportation track 162.
  • FIG. 1 shows a substrate 130 provided and/or transported on a substrate transportation track 132 and a mask assembly 140 provided and/or transported on a mask transportation track 142.
  • a substrate transportation track 132 and a mask transportation track 142 may be provided on both sides of the material deposition arrangement 120.
  • a mask stage 150 is provided between the mask transportation track and the material deposition arrangement.
  • the mask stage is stationary within the vacuum chamber 102, i.e. within the material deposition apparatus.
  • the mask stage is configured to support a mask assembly during material deposition on the substrate, or during substrate processing, in general.
  • FIG. 1 shows a mask shield 160 provided between the mask stage and the material deposition arrangement 120.
  • the mask transportation track can be provided between the substrate transportation track and the mask stage.
  • one of the tracks of the substrate transportation track and the mask transportation track may be omitted.
  • a substrate carrier and a mask carrier may be transported on one transportation track or transportation track assembly.
  • a mask In light of having a mask stage, i.e. a stationary mask stage, in the vacuum chamber, a mask can be transported, e.g. on a carrier, on the transportation track. After transfer of the mask assembly on the mask stage, a substrate carrier can transported on the same track, e.g. after a mask carrier has been removed from the vacuum chamber.
  • the mask stage 150 can be stationary in the vacuum chamber 102 of the material deposition apparatus 100. Accordingly, there are no design limitations with respect to the mask stage being transportable through the vacuum processing system.
  • the mask stage can be a heavy and stiff structure having an opening. Material evaporated from the material deposition arrangement 120 towards a substrate 130 can pass through the opening and through the pattern in the mask to provide a patterned layer on the substrate.
  • the mask stage can be a frame.
  • a surface or plane defined by the frame of the mask stage 150 can have an evenness of 200 pm or below, for example, 50 to 100 pm.
  • the mask frame may include a ceramic material. Ceramic material may be beneficial for a good surface quality.
  • the mask frame may include a metal, such as stainless steel or titanium, or a metal covered with a layer of titanium. The thickness of the mask frame can be 50 mm or below, such as 25 mm or below. Since the mask frame is stationary within the vacuum chamber 102, the design can be optimized for load tolerances when supporting a mask assembly having a mask frame and a mask.
  • a mask carrier transporting the mask assembly 140 along the mask transportation track 142 into the vacuum chamber 102 and out of the vacuum chamber 102 can be a comparably light structure.
  • an alignment assembly having two or more alignment actuators 250 coupled to the mask stage 150 can be provided.
  • the alignment actuators can be coupled to the mask stage by being attached to the mask stage, for example, with a fixing unit.
  • the alignment actuators can be coupled to the mask stage with screws, bolts, and/or other suitable fixing units.
  • the alignment actuators are configured to be coupled to the substrate carrier. Accordingly, the substrate carrier and a mask assembly can be moved relative to each other, i.e., the mask alignment can be provided.
  • the two or more alignment actuators can include electromagnetic holders and/or electro permanent magnetic holders.
  • the holders can be provided as a clamp to clamp a substrate carrier to an alignment actuator.
  • the clamp may include a magnetic element.
  • also mechanical clamps or mechanical holders may be provided.
  • a zero point system may be provided as a mechanical holder.
  • an alignment actuator can be provided between the mask stage 150 and a substrate carrier 230. Providing the alignment actuator between the mask stage and the substrate carrier allows for small mechanical tolerances.
  • Embodiments of the present disclosure avoid a mask carrier having comparably large tolerances, such as tolerances from carrier to carrier, to support the mask during processing of the substrate.
  • a mask stage according to embodiments of the present disclosure can provide an even support for a mask frame resulting in increased pattern quality and/or improved repeatability of the patterning.
  • the use of a mask stage, i.e. a fixed mask stage further allows for an improved alignment with respect to mechanical tolerances of alignment actuators. Alignment actuators can be coupled to the mask stage resulting in a small chain of tolerances.
  • components of a vision system utilized during alignment can be beneficially attached to or near the mask stage.
  • the mask stage 150 being a stiff and more precise structure, a repeatable positioning of the mask frame in the process chamber is possible, also for vertically oriented large area substrates. Accordingly, embodiments having an handover or transfer of the mask frame from a mask carrier to a mask stage in an essentially vertical orientation, i.e. a vertical orientation including a deviation from vertical of +- 10°, reduce potential disadvantages of vertical substrate processing. Further, components utilized for alignment, such as alignment actuators often alignment assembly, mask manipulation actuators, and/or components of vision system can be provided in the beneficial manner as described herein due to the existence of a mask stage.
  • a material deposition arrangement can be provided for depositing a material layer on a substrate wherein a pattern mask, for example, a fine metal mask (FMM), is provided between the material deposition arrangement and the substrate.
  • the pattern mask e.g. FMM can provide for a pixel resolution of a display. Accordingly, openings in the pattern mask can have dimensions of a few microns and are positioned with a tolerance of a few microns.
  • a fixed mask stage can beneficially be utilized for vertical substrate processing, e.g. with vertical line sources.
  • FIGS 2A and 2B show a mask stage 150 and an alignment assembly having two or more alignment actuators 250 coupled to the mask stage 150 can be provided.
  • the alignment actuators are configured to be coupled to the substrate carrier.
  • the mask shield 160 can be provided between the mask stage and the material deposition assembly.
  • the mask shield 160 can be fixed in the vacuum chamber. That is, the mask shield is stationary during normal operation and may be moved out of the vacuum chamber (see 102 in FIG. 1) along transportation track 162, for example, for cleaning of the mask shield.
  • a substrate carrier 230 can be supported by a substrate transportation track 132.
  • the substrate transportation track can be configured to contactlessly transport the substrate carrier.
  • the substrate transportation track 132 may include a substrate support device 232.
  • the substrate support device can be a magnetic levitation system, for example, to contactlessly support the substrate carrier 230 holding the substrate 130.
  • the substrate transportation track may further include a substrate drive device 233.
  • the substrate drive device can be a magnetic drive, for example, to contactlessly drive the substrate.
  • An alignment assembly can include alignment actuators 250, for example, two or more alignment actuators.
  • the alignment actuators are coupled to or atached to the mask stage 150.
  • the alignment actuators may further include a holder or clamp to allow for coupling of the substrate carrier to the alignment assembly.
  • a holder or clamp can include an electro permanent magnet.
  • a movement of the substrate carrier 230 relative to the mask stage 150 can be provided for mask alignment as indicated by arrows 251.
  • FIG. 3 shows a flow chart illustrating a method of handling and aligning a substrate carrier for processing.
  • the substrate can be a vertically oriented large area substrate.
  • a substrate carrier may be aligned, e.g. coarsely aligned, by the substrate support device 232 and the substrate drive device 233.
  • the substrate support device 232 and the substrate drive device 233 may be included in a magnetic levitation system for transport of the substrate carrier.
  • the substrate carrier is clamped to an alignment assembly coupled to the mask stage.
  • a magnetic clamp for example, including an electropermanent magnet, contacts a ferromagnetic portion of the substrate carrier.
  • the ferromagnetic portion may be included in a hinge element.
  • the hinge element may be stiff in one or more dimensions in the plane of the substrate carrier and may provide flexibility in one or more other dimensions in the plane of the substrate carrier. Accordingly, a mechanical over-definition of two or more actuators can be reduced or avoided. This may reduce tensioning of the mask assembly.
  • a manipulation of the mask may optionally be provided.
  • One or more mask manipulation actuators can be provided.
  • a mask manipulation actuator may be attached to or may be integrated in the mask stage.
  • a mask manipulation actuator can be attached to the mask frame.
  • mask manipulation may be provided after exchange of the mask assembly.
  • mask manipulation is optional in a sense that mask manipulation may be skipped between several substrates, e.g. substrates processed with the same mask assembly, i.e. when no mask exchange is provided.
  • a mask alignment can be provided. Movement of the two or more alignment actuators of the alignment assembly allows for a relative positioning between the mask assembly and the substrate carrier. Accordingly, the mask and the substrate are moved relative to each other for alignment of the mask pattern relative to the substrate. According to some embodiments, particularly including a fixed mask stage, the substrate carrier is moved relative to the mask assembly.
  • Mask alignment can be provided in two directions in the plane of the substrate.
  • the plane of the substrate may define an x-y- plane, wherein a z-direction is perpendicular to the substrate surface.
  • An alignment can be provided in x-direction and y-direction.
  • a rotation in the substrate plane q-alignment
  • alignment actuator can be at least one of electromechanical, pneumatic, and piezo ceramic (i.e. a piezo actuator).
  • the mask can be attached to the substrate as indicated by box 308.
  • a movement of the mask assembly and the substrate carrier relative to each other can be provided.
  • the last millimeters in z-direction can be provided with alignment actuators of the alignment assembly.
  • a magnetic attraction force acting on the mask may be provided by a magnetic plate or an electro permanent magnet. The magnetic force may chuck the mask to the substrate for material deposition.
  • a movement in z-direction of the two or more alignment actuators can be provided independently.
  • a mask frame, a mask or a mask assembly can be positioned to be parallel or planar relative to the substrate. This may be provided before an alignment and/or before chucking of a mask to the substrate. Particularly, an adjustment before alignment may improve the alignment quality.
  • FIGS. 4 A and 4B show a process of substrate handling and mask handling in a material deposition apparatus according to embodiments of the present disclosure. Further, respective elements of a material deposition apparatus and a substrate processing system are shown. These elements are provided in a vacuum chamber 102 (see FIG. 1), which is not shown in FIG. 4A.
  • FIG. 4A shows a substrate transportation track 132.
  • the substrate transportation track may include a substrate support device 232.
  • the substrate support device can be a magnetic levitation system, for example, to contactlessly support the substrate carrier 230 holding the substrate 130.
  • the substrate transportation track may further include a substrate drive device 233.
  • the substrate drive device can be a magnetic drive, for example, to contactlessly drive the substrate.
  • the substrate can be moved along the x-direction shown in FIG. 4A.
  • FIG. 4A shows the substrate transportation track with the substrate support device above the substrate carrier and the substrate drive device below the substrate carrier. According to alternative embodiments, both the substrate support device and the substrate drive device can be above the substrate carrier 230.
  • the substrate carrier 230 can be an electrostatic chuck or a magnetic chuck.
  • an electrostatic chuck may include electrodes that can be biased to generate an electrostatic force, clamping the substrate 130 to the substrate carrier 230.
  • a substrate transportation track 132 may further include one or more side guiding devices 235.
  • the side guiding device may include a permanent magnet.
  • a side guiding device 235 of a substrate transportation track 132 can be provided at one side of the substrate carrier position. The one side can be the side opposing a deposition source. In other words, the one or more side guiding devices 235 can be positioned such that a substrate carrier 230 is provided between a side guiding device and a deposition source.
  • the mask transportation track 142 can include a mask support device 245 and a mask drive device 243.
  • the mask support device and the mask drive device may be provided with similar features as described with respect to the substrate transportation track 132 above.
  • a distance, particularly a distance in the y-direction as shown in FIG. 4A, between a mask support device 245 and a mask drive device 243 may be equal to or larger than the corresponding distance between the substrate support device and the substrate drive device.
  • a substrate carrier 230 can be moved in a z-direction towards the mask stage 150, i.e. the fixed mask stage.
  • FIG. 4A shows a mask carrier 244.
  • the mask carrier 244 can be a comparably light structure. This is beneficial for transportation of the mask on the mask transportation track 142, particularly for transportation in a levitated state.
  • the mask carrier may have one or more portions covering pixels of the mask 242. Accordingly, a full deposition of the substrate 130 through the mask carrier may be blocked by the one or more portions covering pixels of the mask. Such portions may beneficially be provided for an increased stability of the mask carrier 244 while a comparable structure is provided.
  • the mask carrier can be removed for the substrate processing, the one or more portions covering pixels of the mask and/or potentially blocking evaporated material, do not negatively influence the coating of the substrate 130. Further, since the mask carrier can be removed for the substrate processing, actuators of an alignment assembly, which are coupled to the mask stage, may directly couple to the substrate carrier. A short distance between the mask stage, which is, for example, stationary in the vacuum chamber, and the substrate carrier reduces tolerances in the chain of tolerances.
  • a mask transportation track 142 may further include one or more side guiding devices 247.
  • the side guiding device may include a permanent magnet.
  • a side guiding device 247 of a mask transportation track 142 can be provided at one side of the mask carrier position. The one side can be the side facing a deposition source.
  • the one or more side guiding devices 247 of the mask transportation track can be positioned such that the one or more side guides are provided between the mask transportation track and a deposition source.
  • FIG. 4A the scenario is shown in which a mask carrier 244 supports a mask assembly 140 at an x-position corresponding to the substrate processing situation.
  • a mask assembly 140 has been moved into the vacuum chamber (see reference numeral 102 in FIG. 1) of the material deposition apparatus.
  • the mask assembly includes a mask frame 240 supporting a mask 242.
  • the mask 242 can typically be a fine metal mask, for example, for pixel generation of an OLED (RGB) display.
  • the mask frame 240 can have a curved cross-section, as shown in FIG. 4A.
  • the curved cross-section can provide a concave shape when seen from the deposition source or a convex shape when seen from a substrate.
  • the curved cross-section provides the masks 242 closer to the substrate 130 as compared to one or more portions of the mask frame 240. This is advantageous for bringing the mask 242 close to the substrate 130 or even in contact with the substrate 130 during material deposition on the substrate.
  • the mask stage 150 includes an opening 152 for evaporated material passing through the opening towards the substrate. The opening is configured to prevent the mask being blocked by deposition material, i.e. for substrate processing.
  • the mask stage is the fixed mask stage and can, thus, be optimized for support of the mask frame 240 and the mask assembly 140, respectively.
  • the above-described improved support of the mask frame results in improved pixel accuracy for RGB material deposition.
  • the mask frame may, according to some optional embodiments, further support a mask shield 160.
  • the mask shield 160 can have a first portion, for example, a sheet-metal portion parallel to the mask assembly 140. The first portion may cover the mask stage and reduce accumulation of evaporated material on the mask stage.
  • the mask shield 160 may further include a second portion protruding from the first portion, for example, extending at least partially in the z-direction.
  • the second portion of the mask shield 160 can reduce accumulation of evaporated material on a side of the mask stage, i.e. an inner side of the opening 152 of the mask stage 150. Additionally or alternatively, the second portion of the mask shield may reduce accumulation of evaporated material on the mask frame.
  • a process of processing one or more substrates with, for example, one or more mask assemblies in a vacuum chamber is described.
  • the process description includes substrate handling, mask handling, and mask alignment in a material deposition apparatus according to embodiments of the present disclosure.
  • a mask assembly 140 and the substrate 130 have been moved into the vacuum chamber of the material deposition apparatus.
  • the substrate 130 can be supported by substrate carrier 230, for example, an electrostatic chuck.
  • the mask assembly and the substrate are positioned at an x-position corresponding to the opening 152 of the mask stage 150.
  • the mask assembly can be been moved along the z-direction towards the mask stage 150.
  • the mask assembly can be moved by a side guiding device 247 and/or another actuator.
  • a transfer of the mask frame, and thus the mask assembly, between the mask carrier 244 and the mask stage 150 is provided.
  • a holding device for the mask assembly coupled to the mask stage includes at least one of: an electromagnet and an electro permanent magnet.
  • the holding force can be switched on and off Providing a current to an electro permanent magnet allows to switch between the holding state and a release state. In the holding state, the holding force is switched on. In the release state, the holding force is switched off. Without providing a current, the electro permanent magnet remains in the present state. Accordingly, the mask frame can be securely supported by a holding device including an electro permanent magnet, for example, without having a power supply connected to the holding device.
  • the mask assembly 140 is supported by the mask stage and/or remains at the z-position of the mask stage.
  • a process of processing one or more substrates with, for example, one or more mask assemblies in a vacuum chamber can be provided.
  • a mask carrier has been moved out of the vacuum chamber, for example, along the x-direction, i.e. along the mask transportation track.
  • the substrate carrier 230 supporting the substrate has been moved towards the mask assembly, i.e. along the z-direction in FIG. 4B.
  • the substrate carrier can be moved in the z- direction such that the substrate 130 is at a small distance from the mask of the mask assembly. In this position, an alignment actuator can align the substrate and the mask relative to each other.
  • material is deposited by the material deposition arrangement 120. The evaporated material passes the opening 152 of the mask stage 150 and the openings of the mask of the mask assembly to be coated on the substrate 130.
  • an alignment actuator can be provided between the mask stage 150 and the substrate carrier 230, as for example shown in FIG. 2B.
  • an alignment actuator 550 may also be provided at the holding device 352 coupled to the mask stage 150 and configured to clamp the mask frame of the mask assembly. This is exemplarily shown in FIG. 5.
  • an actuator as shown in fig. 5 may also be utilized as a mask manipulation actuator, particularly in combination with an alignment actuator 250 shown in FIGS. 2 A and 2B.
  • FIG. 6 shows a portion of a vacuum chamber 102 of a material deposition apparatus.
  • the vacuum chamber has a chamber wall 602.
  • the vision system can be provided for alignment.
  • the vision system may detect by electromagnetic radiation, for example light, whether the mask and the substrate are aligned.
  • the fiducial marks can be provided through which electromagnetic radiation 600 is guided.
  • Fiducial marks on the mask assembly and/or the substrate carrier (or the substrate) Fiducial marks can, for example, be provided at edges or comers of the mask and the substrate. Additionally or alternatively, fiducial may be provided on the mask and the substrate outside of a deposition area can be observed by a camera 610.
  • the camera can be provided outside of the vacuum chamber 102.
  • the camera can be attached to the chamber wall 602.
  • the camera may take images during an alignment process with the alignment assembly, for example, while alignment actuators 250 move the substrate carrier and the mask assembly relative to each other. Having a mask stage 150 in the vacuum chamber 102 allows for easier guiding of electromagnetic radiation.
  • FIG. 6 shows a light guide 612 provided at the mask frame.
  • FIG. 7 further shows a source 614 for electromagnetic radiation attached to the mask stage 150.
  • the source 614 can be embedded or integrated in the mask stage 150.
  • the electromagnetic radiation may exit the source 614 at an angle with respect to a plane of the substrate.
  • the angle can be between 20° and 70°.
  • the reflection unit 616 for example, a mirror, can reflect the electromagnetic radiation 600 to pass through the mask carrier towards the detector shown in FIG. 6.
  • FIG. 8 shows another exemplary embodiment, wherein the source 614 for electromagnetic radiation is attached to the mask stage 150.
  • the electromagnetic radiation can for example be light, for example, in the visible range or the IR range.
  • the electromagnetic radiation for example, light
  • a light guide 612 is provided in the mask frame of the mask assembly. Further, additionally or alternatively, a light guide can be attached to the mask stage. Even though the light is shown to pass through an alignment actuator in FIG. 8 (see reference numeral 812), the light may pass in front of or behind the alignment actuator in FIG. 8, i.e. in a plane different than the paper plane, wherein the figure is only a schematic illustration.
  • Having a mask stage that is stationary in the vacuum chamber allows for attaching components of a vision system to the mask stage. This reduces, in addition to the advantages described herein, the length of light guides and may result in avoiding optical fibers to provide electromagnetic radiation into the vacuum chamber. At least, the length of optical fibers may be reduced. Further, the number of reflection elements, such as mirrors, may be reduced. This may be beneficial for an OFED manufacturing process since the materials may chemically interact and deteriorate in the presence of materials that may be used for light guiding.
  • a vision system may include a measurement system for measuring a distance between the substrate carried and the mask or the mask stage. The distance can be measured along z-direction.
  • the one or more measurement devices of the measurement system can be confocal sensors.
  • a “confocal sensor” can be understood as a sensor which is configured for measuring a displacement by employing light.
  • the confocal sensor is based on the measuring principle that separates emitted light into different colors and then uses a detector to identify the reflected color signal. Accordingly, beneficially the distance can be measured in a contactless way.
  • employing confocal sensors has the advantage that displacement measurements can be carried out at very high accuracy, e.g. in the micro meter range or even in the sub-micro meter range.
  • FIG. 9A the processed substrate is shown after the substrate carrier has been moved back to the substrate transportation track, i.e. along the z-direction in the figures.
  • the processed substrate can be moved out of the vacuum chamber, i.e. along the x-direction in the figures.
  • a subsequent substrate which is to be processed next, is moved into the vacuum chamber, i.e. along the x-direction of the figures.
  • a material layer is coated with the material deposition arrangement 120 on the subsequent substrate after the substrate has been moved towards the mask assembly, i.e. in the z-direction.
  • FIG. 9B shows a yet further status of the processing sequence, for which a subsequent substrate has been moved back to the substrate transportation track and a mask carrier has entered the vacuum chamber to receive the mask assembly from the mask stage.
  • a plurality of substrates for example, 10 or more substrates, such as 20 substrates to 70 substrates, can be processed with one mask assembly.
  • Material accumulation on the mask assembly, and particularly at the openings of a fine metal mask, during deposition of the plurality of substrates results in cleaning and maintenance cycles for the mask assembly after the plurality of substrates have been processed.
  • the mask carrier may receive the mask assembly from the mask stage by a transfer process.
  • the processed substrate and the used up mask assembly shown in FIG. 9B can be removed from the vacuum chamber.
  • they may be removed simultaneously to reduce the cycle time of the vacuum processing system.
  • a further subsequent substrate and a fresh mask can enter the vacuum chamber and the process may continue at a status shown in FIG. 4A.
  • a method for processing a vertically oriented large area substrate includes transporting, in a vertical orientation, a mask assembly on a mask carrier in a vacuum chamber of a material deposition apparatus, the mask assembly including a mask frame and a mask; transferring the mask assembly, in the vertical orientation, from the mask carrier to a mask stage; transporting, in a vertical orientation, a substrate on a substrate carrier into the vacuum chamber; holding the substrate carrier, in the vertical orientation, with an alignment assembly coupled to the mask stage; aligning the relative position between the substrate carrier and the mask assembly.
  • FIGS. 10A and 10B, as well as FIG. 11, show further aspects, details and features that may be combined with other embodiments described herein.
  • One or more mask manipulation actuators 910 can be coupled to the mask stage 150.
  • the one or mask mutilation actuators can be arranged to couple to the mask frame 240 of the mask assembly.
  • mask Revelation actuators can be provided at various positions at the mask frame.
  • four mask manipulation actuators, six mask manipulation actuators (as shown in fig. 11), or eight mask manipulation actuators can be provided.
  • four mask manipulation actuators can be provided adjacent to comers of the mask frame.
  • Further mask manipulation actuators can be provided at mask frame portions connecting the comers of the mask frame.
  • the mask manipulation actuators allow for a movement in the plane parallel to the mask frame (e.g. x-direction and y-direction).
  • the mask manipulation actuators can be configured to move in different directions. For example, one mask manipulation actuator moves in at least a first direction and a second mask manipulation actuator moves in at least a second direction different from the first direction.
  • One or more alignment actuator may also be configured to move in two or more directions. Accordingly, the mask frame is bended or deformed.
  • Eigen tension material pre-defamation
  • the mask manipulation actuators may be used for mask-substrate alignment as described above. However, keeping the mask stationary after an initial actuation of the mask manipulation actuators is beneficial as the system stability is improved.
  • the alignment of the mask and the substrate can beneficially be provided by the alignment actuators coupled to the substrate carrier.
  • an alignment assembly of a material deposition apparatus or the material deposition apparatus can include one or more mask manipulation actuators configured to couple to the mask frame and to compensate mask assembly distortions or mask distortions.
  • a holding device for the mask frame may include the one or more mask manipulation actuators.
  • FIG. 12 shows a material deposition arrangement 120.
  • the material deposition arrangement includes two or more deposition sources.
  • Each of the deposition sources can include a crucible 124, distribution assembly 122 and respective openings 722, for example nozzles.
  • Material evaporated in the crucible 124 is guided with the distribution assembly 122 through the openings 722 into a vacuum chamber (e.g. vacuum chamber 102 shown in FIG. 1).
  • the evaporated material can be guided towards a substrate 130.
  • the evaporation direction can be horizontal or slightly inclined upwards, as shown in FIG. 12, relative to a horizontal orientation.
  • the evaporation direction can be inclined from 0° to 10°.
  • the two or more evaporation sources can be mounted to an evaporator control housing 705, for example an atmospheric box.
  • the evaporator control housing can be connected to an outside of the vacuum chamber, in which the material deposition arrangement is operated.
  • the two or more evaporation sources can be supported by a support 710 for the material deposition arrangement.
  • the support can be configured for translational movement of the material deposition arrangement (see arrow H in FIG. 1).
  • the support can provide a housing for active and/or passive magnetic elements.
  • the active and/or passive magnetic elements can provide for a magnetic levitation and/or a magnetic drive of the material deposition arrangement.
  • the translational movement of the material deposition arrangement can be perpendicular to the paper plane of FIG. 12.
  • FIG. 12 shows a shaper shield device 724.
  • a “material deposition source” can be understood as a device or assembly configured for providing a source of material to be deposited on a substrate.
  • a“material deposition source” may be understood as a device or assembly having a crucible configured to evaporate the material to be deposited and a distribution assembly configured for providing the evaporated material to the substrate.
  • the expression “a distribution assembly configured for providing the evaporated material to the substrate” may be understood in that the distribution assembly is configured for guiding gaseous source material in a deposition direction. Accordingly, the gaseous source material, for example a material for depositing a thin film of an OLED device, is guided within the distribution assembly and exits the distribution assembly through one or more outlets or openings 722.
  • the one or more outlets of the distribution assembly can be nozzles extending along an evaporation direction.
  • the evaporation direction is essentially horizontal, e.g. the horizontal direction may correspond to the z-direction indicated in FIG. 4A.
  • a“crucible” can be understood as a device having a reservoir for the material to be evaporated by heating the crucible.
  • a“crucible” can be understood as a source material reservoir which can be heated to vaporize the source material into a gas by at least one of evaporation and sublimation of the source material.
  • the crucible includes a heater to vaporize the source material in the crucible into a gaseous source material.
  • the material to be evaporated can be in the form of a powder.
  • the reservoir can have an inner volume for receiving the source material to be evaporated, e.g. an organic material.
  • a“distribution assembly” can be understood as an assembly configured for providing evaporated material, particularly a plume of evaporated material, from the distribution assembly to the substrate.
  • the distribution assembly may include a distribution pipe which can have an elongated shape.
  • a distribution pipe as described herein may provide a line source with a plurality of openings and/or nozzles which are arranged in at least one line along the length of the distribution pipe.
  • the distribution assembly can be a linear distribution showerhead, for example, having a plurality of openings (or an elongated slit) disposed therein.
  • a showerhead as understood herein can have an enclosure, hollow space, or pipe, in which the evaporated material can be provided or guided, for example from the evaporation crucible to the substrate.
  • a showerhead can provide a higher pressure, e.g. by one order of magnitude or more, inside the hollow space as compared to outside the space.
  • the length of the distribution pipe may correspond at least to the height of the substrate to be deposited.
  • the length of the distribution pipe may be longer than the height of the substrate to be deposited, at least by 10% or even 20%.
  • the length of the distribution pipe can be 1.3 m or above, for example 2.5 m or above. Accordingly, a uniform deposition at the upper end of the substrate and/or the lower end of the substrate can be provided.
  • the distribution assembly may include one or more point sources which can be arranged along a vertical axis.
  • the substrate is provided to be deposited by the material deposition arrangement 120.
  • a mask assembly 140, a mask stage, such as a fixed mask stage, and a mask shield 160 can be provided between the substrate 130 and the material deposition arrangement 120.

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Abstract

L'invention concerne un appareil de dépôt de matériau pour déposer un matériau sur un substrat dans une chambre sous vide. L'appareil de dépôt de matériau comprend un étage de masque conçu de façon à soutenir un ensemble masque présentant un cadre de masque et un masque ; une piste de transport de substrat, au moins une partie de la piste de transport de substrat étant disposée dans la chambre sous vide, la piste de transport de substrat étant conçue de façon à soutenir le support de substrat ; un dispositif de maintien accouplé à l'étage de masque et conçu pour un transfert de l'ensemble masque dans une orientation sensiblement verticale sur l'étage de masque ; et un ensemble d'alignement présentant au moins deux actionneurs d'alignement, l'ensemble d'alignement étant accouplé à l'étage de masque et conçu de façon à s'accoupler au support de substrat de façon à déplacer le support de substrat et l'ensemble masque l'un par rapport à l'autre.
PCT/EP2018/078874 2018-10-22 2018-10-22 Appareil de dépôt de matériau, système de dépôt sous vide et procédé de traitement d'un substrat de grande surface WO2020083462A1 (fr)

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KR1020217010602A KR20210057117A (ko) 2018-10-22 2018-10-22 재료 증착 장치, 진공 증착 시스템, 및 대면적 기판을 프로세싱하는 방법
CN201880098048.7A CN112771198A (zh) 2018-10-22 2018-10-22 处理大面积基板的材料沉积设备、真空沉积系统和方法
PCT/EP2018/078874 WO2020083462A1 (fr) 2018-10-22 2018-10-22 Appareil de dépôt de matériau, système de dépôt sous vide et procédé de traitement d'un substrat de grande surface

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022002385A1 (fr) * 2020-07-01 2022-01-06 Applied Materials, Inc. Appareil permettant de déplacer un substrat, appareil de dépôt et système de traitement

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130047601A (ko) * 2011-10-28 2013-05-08 가부시키가이샤 히다치 하이테크놀로지즈 마스크 얼라인먼트 광학 시스템
JP2013093279A (ja) * 2011-10-27 2013-05-16 Hitachi High-Technologies Corp 有機ｅｌデバイス製造装置
US20180030596A1 (en) * 2015-01-12 2018-02-01 Tommaso VERCESI Holding arrangement for supporting a substrate carrier and a mask carrier during layer deposition in a processing chamber, apparatus for depositing a layer on a substrate, and method for aligning a substrate carrier supporting a substrate and a mask carrier
WO2018153480A1 (fr) * 2017-02-24 2018-08-30 Applied Materials, Inc. Agencement de positionnement pour un support de substrat et un support de masque, système de transport pour un support de substrat et un support de masque, et procédés associés

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018166636A1 (fr) * 2017-03-17 2018-09-20 Applied Materials, Inc. Appareil de traitement sous vide d'un substrat, système de traitement sous vide d'un substrat, et procédé de transport d'un support de substrat et d'un support de masque dans une chambre à vide

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013093279A (ja) * 2011-10-27 2013-05-16 Hitachi High-Technologies Corp 有機ｅｌデバイス製造装置
KR20130047601A (ko) * 2011-10-28 2013-05-08 가부시키가이샤 히다치 하이테크놀로지즈 마스크 얼라인먼트 광학 시스템
US20180030596A1 (en) * 2015-01-12 2018-02-01 Tommaso VERCESI Holding arrangement for supporting a substrate carrier and a mask carrier during layer deposition in a processing chamber, apparatus for depositing a layer on a substrate, and method for aligning a substrate carrier supporting a substrate and a mask carrier
WO2018153480A1 (fr) * 2017-02-24 2018-08-30 Applied Materials, Inc. Agencement de positionnement pour un support de substrat et un support de masque, système de transport pour un support de substrat et un support de masque, et procédés associés

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
SCHREIL M ET AL: "50.1: OLED Devices Manufactured using a Vertical In-Line Concept", 2004 SID INTERNATIONAL SYMPOSIUM. SEATTLE, WA, MAY 25 - 27, 20; [SID INTERNATIONAL SYMPOSIUM], SAN JOSE, CA : SID, US, vol. XXXV, 25 May 2004 (2004-05-25), pages 1376 - 1379, XP007011975 *

Cited By (2)

* Cited by examiner, † Cited by third party
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WO2022002385A1 (fr) * 2020-07-01 2022-01-06 Applied Materials, Inc. Appareil permettant de déplacer un substrat, appareil de dépôt et système de traitement
CN115443346A (zh) * 2020-07-01 2022-12-06 应用材料公司 用于移动基板的设备、沉积设备和处理系统

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