WO2020159184A1 - Film polymère à base de polyimide, substrat pour appareil d'affichage l'utilisant, et appareil optique - Google Patents

Film polymère à base de polyimide, substrat pour appareil d'affichage l'utilisant, et appareil optique Download PDF

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Publication number
WO2020159184A1
WO2020159184A1 PCT/KR2020/001265 KR2020001265W WO2020159184A1 WO 2020159184 A1 WO2020159184 A1 WO 2020159184A1 KR 2020001265 W KR2020001265 W KR 2020001265W WO 2020159184 A1 WO2020159184 A1 WO 2020159184A1
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Prior art keywords
polyimide
functional group
formula
group
resin film
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PCT/KR2020/001265
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English (en)
Korean (ko)
Inventor
김경환
성지연
Original Assignee
주식회사 엘지화학
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Priority claimed from KR1020190121178A external-priority patent/KR102427759B1/ko
Priority claimed from KR1020190121177A external-priority patent/KR102427758B1/ko
Priority claimed from KR1020190161494A external-priority patent/KR102465430B1/ko
Priority claimed from KR1020190161495A external-priority patent/KR102427760B1/ko
Application filed by 주식회사 엘지화학 filed Critical 주식회사 엘지화학
Priority to CN202080003021.2A priority Critical patent/CN112204084B/zh
Priority to US17/059,644 priority patent/US11999823B2/en
Priority to JP2020565931A priority patent/JP7414010B2/ja
Publication of WO2020159184A1 publication Critical patent/WO2020159184A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics

Definitions

  • the present invention relates to a polyimide-based resin film capable of realizing excellent optical properties and dimensional stability, a substrate for a display device using the same, and an optical device.
  • the display device market is rapidly changing with a focus on flat panel displays (FPDs), which are easy to have a large area and can be thin and light.
  • the flat panel display includes a liquid crystal display (LCD), an organic light emitting display (OLED), or an electrophoretic display (EPD).
  • TFT devices are manufactured by depositing a multilayer inorganic film such as a buffer layer, an active layer, and a gate insulator on a cured polyimide.
  • the emission efficiency may be reduced by a difference between the refractive index of the multi-layered upper layer made of the inorganic film and the refractive index of the polyimide layer as described above.
  • the polyimide material included in the polyimide layer (substrate layer) is cured at a high temperature of 400° C. or higher, optical properties may decrease due to deterioration of the polyimide.
  • the present invention relates to a polyimide resin film having high heat resistance and capable of realizing excellent optical properties and dimensional stability.
  • the present invention is to provide a substrate for a display device using the polyimide-based resin film, and an optical device.
  • a polyimide-based resin including a polyimide repeating unit represented by the following formula (1) and a polyimide repeating unit represented by the following formula (5) is included in a section of 100°C or higher and 430°C or lower. It provides a polyimide-based resin film having a thermal expansion coefficient of 20 ppm / °C or less.
  • X 1 is a tetravalent functional group represented by the following Chemical Formula 2
  • Y 1 is an aromatic divalent functional group having 15 or more carbon atoms with at least one substituted electron withdrawing functional group
  • Ar is a polycyclic aromatic divalent functional group
  • X 2 is one of a tetravalent functional group represented by the following Chemical Formula 6, and Y 2 is an aromatic divalent functional group having 15 or more carbon atoms with at least one substituted electron withdrawing functional group,
  • R 1 to R 6 are each independently hydrogen or an alkyl group having 1 to 6 carbon atoms
  • L is a single bond, -O-, -CO-, -COO-, -S-, -SO-,- SO 2 -, -CR 7 R 8 -, -(CH 2 ) t -, -O(CH 2 ) t O-, -COO(CH 2 ) t OCO-, -CONH-, phenylene or combinations thereof Any one selected from the group consisting of, wherein R 7 and R 8 are each independently hydrogen, an alkyl group having 1 to 10 carbon atoms, or a halo alkyl group having 1 to 10 carbon atoms, and t is an integer of 1 to 10.
  • a substrate for a display device comprising the polyimide-based resin film.
  • optical device comprising the polyimide-based resin film.
  • first component may also be referred to as the second component, and similarly, the second component may be referred to as the first component.
  • the (co)polymer means a polymer or a copolymer
  • the polymer means a homopolymer composed of a single repeating unit
  • the copolymer means a composite polymer containing two or more repeating units.
  • substitution means that other functional groups are bonded in place of the hydrogen atom in the compound, and the position to be substituted is not limited to a position where the hydrogen atom is substituted, that is, a position where the substituent is substitutable, and is substituted when two or more are substituted. , 2 or more substituents may be the same or different from each other.
  • substituted or unsubstituted in this specification is deuterium; Halogen group; Cyano group; Nitro group; Hydroxy group; Carbonyl group; Ester groups; Imide group; Amide group; Primary amino group; Carboxy group; Sulfonic acid group; Sulfonamide groups; Phosphine oxide group; Alkoxy groups; Aryloxy group; Alkyl thioxy group; Arylthioxy group; Alkyl sulfoxy group; Aryl sulfoxyl group; Silyl group; Boron group; Alkyl groups; Cycloalkyl group; Alkenyl group; Aryl group; Aralkyl group; An alkenyl group; Alkyl aryl groups; Alkoxysilylalkyl groups; Arylphosphine group; Or substituted or unsubstituted with one or more substituents selected from the group consisting of heterocyclic groups containing one or more of N, O and S atoms, or substituted or unsubstituted
  • aromatic is a property that satisfies the Huckels Rule (Huckels Rule), it can be defined as a case that satisfies all three conditions according to the Huckel rule.
  • the alkyl group is a monovalent functional group derived from alkane, and may be a straight chain or a branched chain, and the carbon number of the straight chain alkyl group is not particularly limited, but is preferably 1 to 20. Further, the number of carbon atoms in the branched chain alkyl group is 3 to 20.
  • alkyl group examples include methyl, ethyl, propyl, n-propyl, isopropyl, butyl, n-butyl, isobutyl, tert-butyl, sec-butyl, 1-methyl-butyl, 1-ethyl-butyl, pentyl, n -Pentyl, isopentyl, neopentyl, tert-pentyl, hexyl, n-hexyl, 1-methylpentyl, 2-methylpentyl, 4-methyl-2-pentyl, 3,3-dimethylbutyl, 2-ethylbutyl, heptyl , n-heptyl, 1-methylhexyl, octyl, n-octyl, tert-octyl, 1-methylheptyl, 2-ethylhexyl, 2-propylpentyl, n-non
  • the halo alkyl group means a functional group in which the halogen group is substituted with the aforementioned alkyl group, and examples of the halogen group include fluorine, chlorine, bromine or iodine.
  • the haloalkyl group may be substituted or unsubstituted, and when substituted, examples of the substituent are as described above.
  • a multivalent functional group is a residue in which a plurality of hydrogen atoms bound to an arbitrary compound are removed, for example, a divalent functional group, a trivalent functional group, and a tetravalent functional group.
  • a tetravalent functional group derived from cyclobutane refers to a residue in which any 4 hydrogen atoms attached to cyclobutane are removed.
  • the electron withdrawing group may include one or more selected from the group consisting of haloalkyl groups, halogen groups, cyano groups, nitro groups, sulfonic acid groups, carbonyl groups and sulfonyl groups, preferably It may be a haloalkyl group such as trifluoromethyl group (-CF 3 ).
  • a direct bond or a single bond means that there is no atom or atomic group at the corresponding position, and is connected by a bond line. Specifically, it means that a separate atom is not present in a portion represented by L 1 and L 2 in the chemical formula.
  • the weight average molecular weight means the weight average molecular weight of polystyrene conversion measured by GPC method.
  • detectors and analytical columns such as a commonly known analytical device and a differential index detector, can be used, and the temperature is usually applied.
  • Conditions, solvents and flow rates can be applied.
  • the evaluation temperature is 160°C, and 1,2,4-trichlorobenzene is used as a solvent.
  • the flow rate was 1 mL/min
  • the sample was prepared at a concentration of 10 mg/10 mL, and then supplied in an amount of 200 ⁇ L, and the value of Mw can be obtained by using an assay curve formed using a polystyrene standard.
  • the molecular weight of the polystyrene standard was 2,000 / 10,000 / 30,000 / 70,000 / 200,000 / 700,000 / 2,000,000 / 4,000,000 / 10,000,000.
  • a polyimide-based resin comprising a polyimide repeating unit represented by Chemical Formula 1 and a polyimide repeating unit represented by Chemical Formula 5, and a coefficient of thermal expansion in a section of 100°C or higher and 430°C or lower
  • a polyimide-based resin film having a content of 20 ppm/°C or less may be provided.
  • the present inventors have at least one tetravalent functional group and electron withdrawing functional group derived from tetracarboxylic dianhydride having a specific structure such as Chemical Formula 2 and Chemical Formula 6 in the polyimide repeat unit structure, such as the polyimide resin film of the above embodiment.
  • the aromatic divalent group having a substituted carbon number of 15 or more contained a functional group it was confirmed through experiments that an excellent optical property and dimensional stability can be realized even in a polyimide resin film cured at a high temperature of 400° C. or higher through an experiment and completed the invention.
  • the polyimide-based resin has at least 15 carbon atoms substituted with at least one or more tetracarboxylic dianhydride containing the structure represented by Formula 2 and tetracarboxylic dianhydride containing the structure represented by Formula 6 and an electron withdrawing functional group. It appears that high heat resistance, excellent optical properties, and dimensional stability are achieved by physical and chemical actions according to the novel structures of the acid anhydride monomer and the aromatic diamine monomer, including the reaction product obtained through the imidization reaction of the aromatic diamine.
  • the polyimide-based resin synthesized from an aromatic diamine monomer having 15 or more carbon atoms substituted with at least one electron withdrawing functional group improves ordering and orientation characteristics between molecules to ensure sufficient heat resistance even in a polyimide film obtained by high temperature curing.
  • the plastic substrate When used as a plastic substrate, it is possible to prevent the plastic substrate from being damaged by heat when heat-treating the metal layer formed on the plastic substrate, and also to suppress the occurrence of warpage in the metal thin film formed on the plastic substrate.
  • the polyimide film according to the present invention can increase the refractive index, and is used as a substrate layer in a flexible display device, thereby reducing the difference in refractive index with each layer constituting the device. By reducing the amount of extinguished light, it is possible to effectively increase the emission efficiency of the light (bottom emission).
  • the polyimide film according to the present invention is characterized by deterioration in optical properties upon curing at a high temperature of 400°C or higher and reduction in high numerical strain (thermal expansion coefficient).
  • the polyimide-based resin means that polyimide and polyamic acid and polyamic acid ester, which are precursor polymers thereof, are all included. That is, the polyimide-based polymer may include at least one selected from the group consisting of a polyamic acid repeating unit, a polyamic acid ester repeating unit, and a polyimide repeating unit. That is, the polyimide-based polymer may include a polyamic acid repeating unit, one polyamic acid ester repeating unit, one polyimide repeating unit, or a copolymer of two or more repeating units thereof.
  • One or more repeating units selected from the group consisting of the polyamic acid repeating unit, polyamic acid ester repeating unit, and polyimide repeating unit may form a main chain of the polyimide-based polymer.
  • the polyimide-based resin may include a polyimide repeating unit represented by Chemical Formula 1 and a polyimide repeating unit represented by Chemical Formula 5.
  • X 1 is a tetravalent functional group represented by Chemical Formula 2
  • X 1 is a functional group derived from a tetracarboxylic acid dianhydride compound used in the synthesis of polyimide resins.
  • Ar is a polycyclic aromatic divalent functional group.
  • the polycyclic aromatic divalent functional group may be a polycyclic aromatic hydrocarbon compound or a divalent functional group derived from a derivative compound thereof, and may include a fluorenylene group.
  • the derivative compound includes all compounds in which one or more substituents are introduced or carbon atoms are replaced by heteroatoms.
  • the polycyclic aromatic divalent functional group may include a conjugated cyclic divalent functional group containing at least two or more aromatic ring compounds. That is, the polycyclic aromatic divalent functional group may contain at least two or more aromatic ring compounds in the functional group structure, as well as the functional group may have a fused ring structure.
  • the aromatic ring compound may include an arene compound containing at least one benzene ring, or a hetero arene compound in which carbon atoms in the arene compound are replaced by heteroatoms.
  • the aromatic ring compound may contain at least two or more in the polycyclic aromatic divalent functional group, and each of the two or more aromatic ring compounds may form a direct fused ring or a fused ring through a different ring structure.
  • each of the two or more aromatic ring compounds may form a direct fused ring or a fused ring through a different ring structure.
  • two benzene rings are respectively bonded to a cycloalkyl ring structure, it can be defined that two benzene rings each form a cycloalkyl ring.
  • the conjugated cyclic divalent functional group containing at least two or more aromatic cyclic compounds is a divalent functional group derived from a conjugated cyclic compound containing at least two or more aromatic cyclic compounds or a derivative compound thereof, wherein the derivative compound has one or more substituents introduced Or a compound in which the carbon atom has been replaced with a heteroatom.
  • Examples of the polycyclic aromatic divalent functional group are not particularly limited, and examples thereof include a fluorenylene group.
  • the tetravalent functional group represented by Chemical Formula 2 may be a functional group represented by Chemical Formula 2-1.
  • Y 1 is an aromatic divalent functional group having 15 or more carbon atoms substituted with at least one electron withdrawing group, and Y 1 is an action derived from a diamine compound used in the synthesis of polyamic acid, polyamic acid ester, or polyimide. It can be a flag.
  • the aromatic divalent functional group having 15 or more carbon atoms in Y 1 may include three or more aromatic cyclic compounds.
  • the polyimide-based resin has improved ordering and orientation characteristics between molecules, so that sufficient heat resistance can be secured even in a polyimide film obtained by high temperature curing.
  • the aromatic divalent functional group having 15 or more carbon atoms may include at least one selected from the group consisting of a triphenylene group, a quaterphenylene group, and a pentaphenylene group.
  • the electron withdrawing functional group may include at least one selected from the group consisting of haloalkyl groups, halogen groups, cyano groups, nitro groups, sulfonic acid groups, carbonyl groups and sulfonyl groups.
  • CTC charge transfer complex
  • the aromatic divalent functional group having 15 or more carbon atoms substituted with at least one electron withdrawing functional group of Y 1 may include a functional group represented by the following Chemical Formula 3.
  • T 1 to T 3 are the same or different from each other, each independently an electron withdrawing group, m1 to m3 are the same or different from each other, and at least one of m1 to m3 is an integer of 1 to 4, the rest Is an integer from 0 to 4, and n is an integer from 1 to 10.
  • An aromatic divalent functional group having 15 or more carbon atoms substituted with at least one electron withdrawing functional group of Y 1 may include a functional group represented by the following Chemical Formula 3-1.
  • the polyimide-based resin may include a combination of tetracarboxylic acid dianhydride represented by the following Chemical Formula 4 and aromatic diamine having 15 or more carbon atoms substituted with at least one electron withdrawing functional group.
  • Ar' is a polycyclic aromatic divalent functional group.
  • the polycyclic aromatic divalent functional group is a divalent functional group derived from a polycyclic aromatic hydrocarbon compound, and may include a fluorenylene group as a divalent functional group derived from a fluorenylene group or a derivative compound thereof.
  • the derivative compound includes all compounds in which one or more substituents are introduced or carbon atoms are replaced by heteroatoms.
  • a specific example of the tetracarboxylic acid dianhydride represented by Chemical Formula 4 is 9,9-bis(3,4-dicarboxyphenyl)fluorene dianhydride (9,9-Bis(3,4-dicarboxyphenyl)fluorene Dianhydride, BPAF). Can be lifted.
  • the aromatic diamine having 15 or more carbon atoms in which the electron withdrawing functional group is substituted by at least 1 is a compound in which an amino group (-NH 2 ) is bonded to the sock end of the aromatic di2 having 15 or more carbon atoms in which the electron withdrawing functional group is substituted by at least 1,
  • the description of the aromatic divalent functional group having 15 or more carbon atoms in which the electron withdrawing functional group is substituted by at least one is as described above.
  • aromatic diamine having 15 or more carbon atoms in which the electron withdrawing functional group is substituted with at least one or more include diamine represented by the following formula (a).
  • the polyimide-based resin has a terminal anhydride group (-OC-O-CO-) of tetracarboxylic acid dianhydride represented by Chemical Formula 4 and an aromatic diamine having at least 15 carbon atoms substituted with at least one electron withdrawing group.
  • the reaction between the amino group (-NH 2 ) may form a bond between the nitrogen atom of the amino group and the carbon atom of the anhydride group.
  • polyimide-based resin may further include a polyimide repeating unit represented by Formula 5 below.
  • X 2 is one of a tetravalent functional group represented by the following Chemical Formula 6, and Y 2 is an aromatic divalent functional group having 15 or more carbon atoms with at least one substituted electron withdrawing functional group,
  • R 1 to R 6 are each independently hydrogen or an alkyl group having 1 to 6 carbon atoms
  • L is a single bond, -O-, -CO-, -COO-, -S-, -SO-,- SO 2 -, -CR 7 R 8 -, -(CH 2 ) t -, -O(CH 2 ) t O-, -COO(CH 2 ) t OCO-, -CONH-, phenylene or combinations thereof Any one selected from the group consisting of, wherein R 7 and R 8 are each independently hydrogen, an alkyl group having 1 to 10 carbon atoms, or a halo alkyl group having 1 to 10 carbon atoms, and t is an integer of 1 to 10.
  • the polyimide-based polymer exhibits excellent optical properties, and these optical properties improve YI and improve transmittance.
  • a functional group represented by Chemical Formula 6-1 or a functional group represented by Chemical Formula 6-2 is included, the polyimide-based polymer exhibits excellent optical properties, and these optical properties improve YI and improve transmittance.
  • the polyimide-based polymer includes: a first repeating unit containing a repeating unit represented by Formula 1, wherein a repeating unit derived from tetracarboxylic acid dianhydride is a functional group represented by Formula 2; And a second repeating unit containing a repeating unit represented by Formula 5, wherein the repeating unit derived from tetracarboxylic dianhydride is a functional group represented by Formula 6 above.
  • the first repeating unit and the second repeating unit are randomly arranged in the polyimide-based polymer to form a random copolymer, or a block between the first repeating unit and a block between the second repeating units to form a block copolymer.
  • the polyimide-based polymer including the repeating unit represented by Chemical Formula 1 and the repeating unit represented by Chemical Formula 5 may be prepared by reacting two or more different tetracarboxylic acid dianhydride compounds with diamine compounds. Tetracarboxylic acid dianhydride may be added simultaneously to synthesize a random copolymer, or sequentially added to synthesize a block copolymer.
  • the polyimide repeating unit represented by Chemical Formula 5 may contain 1 mol% or more and 99 mol% or less of all the repeating units contained in the polyimide resin.
  • the polyimide repeating unit represented by Formula 1 and the polyimide repeating unit represented by Formula 5 are 70 mol% or more, or 80 mol% or more, or 90 mol% or more, compared to the total repeating units contained in the polyimide-based resin, or 70 mol% or more, 100 mol% or less, 80 mol% or more, 100 mol% or less, 70 mol% or more, 90 mol% or less, 70 mol% or more, 99 mol% or less, 80 mol% or more, 99 mol% or less, 90 mol% or more, 99 or more 99 It may contain less than mol%.
  • the polyimide-based resin is composed of only the polyimide repeating unit represented by Formula 1 and the polyimide repeating unit represented by Formula 5, or most of the polyimide repeating unit represented by Formula 1 and Formula 5 It may be made of polyimide repeat units.
  • other diamines other than diamines capable of inducing aromatic divalent functional groups having 15 or more carbon atoms substituted with at least one electron withdrawing functional group are not mixed, or may be mixed in an extremely small amount of less than 1 mol%. have.
  • X 3 is a tetravalent functional group represented by Chemical Formula 6-1
  • Y 3 is an aromatic divalent functional group having 15 or more carbon atoms with at least one substituted electron withdrawing functional group
  • X 4 is a tetravalent functional group represented by Chemical Formula 6-2
  • Y 4 is an aromatic divalent functional group having 15 or more carbon atoms with at least one substituted electron withdrawing functional group.
  • the weight average molecular weight (measured by GPC) of the polyimide-based resin is not particularly limited, but may be, for example, 1000 g/mol or more and 200000 g/mol or less, or 10000 g/mol or more and 200000 g/mol or less.
  • the polyimide-based resin according to the present invention can exhibit excellent colorless and transparent characteristics while maintaining characteristics such as heat resistance, mechanical strength, etc. due to a rigid structure, an element substrate, a display substrate for a display, and an optical film , IC (integrated circuit) package, electrodeposition film (adhesive film), multi-layer flexible printed circuit (FRC), tape, touch panel, protective film for optical disk, etc. can be used in various fields, especially suitable for display cover board have.
  • the polyimide-based resin film of the embodiment may include a cured product in which the polyimide-based resin is cured at a temperature of 400° C. or higher.
  • the cured product means a material obtained through a curing process of a resin composition containing the polyimide-based resin, and the curing process may be performed at a temperature of 400°C or higher, or 400°C or higher and 500°C or lower.
  • an example of a method for synthesizing the polyimide-based resin film is not particularly limited, and for example, forming a coating film by applying a resin composition containing the polyimide-based resin to a substrate (step 1); Drying the coating film (step 2); A method of manufacturing the film may be used, including the step of curing the dried coating film by heat treatment (step 3).
  • Step 1 is a step of forming a coating film by applying a resin composition containing the above-described polyimide resin to a substrate.
  • the method of applying the resin composition containing the polyimide-based resin to the substrate is not particularly limited, and for example, methods such as screen printing, offset printing, flexo printing, inkjet, and the like can be used.
  • the resin composition containing the polyimide resin may be dissolved or dispersed in an organic solvent.
  • the solution may be the reaction solution itself obtained, and the reaction solution may be diluted with another solvent.
  • a polyimide resin when a polyimide resin is obtained as a powder, it may be dissolved in an organic solvent to form a solution.
  • organic solvent examples include toluene, N,N-dimethylformamide, N,N-dimethylacetamide, N-methyl-2-pyrrolidone, N-methylcaprolactam, 2-pyrrolidone, N-ethyl Pyrrolidone, N-vinylpyrrolidone, dimethylsulfoxide, tetramethylurea, pyridine, dimethylsulfone, hexamethylsulfoxide, gamma-butyrolactone, 3-methoxy-N,N-dimethylpropanamide, 3- Ethoxy-N,N-dimethylpropanamide, 3-butoxy-N,N-dimethylpropanamide, 1,3-dimethyl-imidazolidinone, ethyl amyl ketone, methylnonyl ketone, methyl ethyl ketone, methyl isoa Milk ketone, methyl isopropyl ketone, cyclohexanone,
  • the resin composition containing the polyimide-based resin may contain solid content in an amount to have an appropriate viscosity in consideration of processability such as coatability during the film forming process.
  • the content of the composition may be adjusted such that the total resin content is 5% to 25% by weight, or 5% to 20% by weight, or 5% to 15% by weight. .
  • the resin composition containing the polyimide-based resin may further include other components in addition to the organic solvent.
  • the resin composition containing the polyimide-based resin when applied, it improves the uniformity or surface smoothness of the film thickness, or improves the adhesion to the substrate, or changes the dielectric constant or conductivity.
  • additives that can increase the density may be further included. Examples of such additives include surfactants, silane-based compounds, dielectric or cross-linkable compounds, and the like.
  • the step 2 is a step of drying the coating film formed by applying the resin composition containing the polyimide resin to the substrate.
  • the drying step of the coating film may be performed by heating means such as a hot plate, a hot air circulation path, an infrared furnace, and may be performed at a temperature of 50°C or more and 150°C or less, or 50°C or more and 100°C or less.
  • heating means such as a hot plate, a hot air circulation path, an infrared furnace, and may be performed at a temperature of 50°C or more and 150°C or less, or 50°C or more and 100°C or less.
  • Step 3 is a step of curing the dried coating film by heat treatment.
  • the heat treatment may be performed by heating means such as a hot plate, a hot air circulation path, an infrared furnace, and may be performed at a temperature of 400°C or higher, or 400°C or higher and 500°C or lower.
  • the thickness of the polyimide-based resin film is not particularly limited, for example, it can be freely adjusted within a range of 0.01 ⁇ m or more and 1000 ⁇ m or less. When the thickness of the polyimide-based resin film increases or decreases by a specific value, physical properties measured in the polyimide-based resin film may also change by a certain value.
  • the polyimide resin film may have a thermal expansion coefficient of 20 ppm/°C or less, or 0.1 ppm/°C or more and 20 ppm/°C or less, or 1 ppm/°C or more and 20 ppm/°C or less in a section of 100°C or more and 430°C or less. have.
  • the section of 100°C or more and 430°C or less may mean a temperature range of 100°C or more and 430°C or less.
  • the thermal expansion coefficient of the polyimide-based resin film sample, the pulling force of the film is set to 0.01N or more and 0.1N or less, or 0.01N or more and 0.05N or less, and 100°C or more and 430°C or less at a temperature range of 1°C/min or more After performing the primary heating process at a heating rate of 10° C./min or less, or 4° C./min or more and 6° C./min or less, in the temperature range of 430° C. to 100° C., 1° C./min to 10° C./min, Alternatively, the change in thermal expansion when cooled at a cooling rate of 3°C/min or more and 5°C/min or less is measured by TMA (Q400 manufactured by TA).
  • the coefficient of thermal expansion can be measured from the polyimide film sample having a thickness of 10 ⁇ 2 ⁇ m.
  • the thickness of the polyimide film increases or decreases by a specific value, physical properties measured in the polyimide film may also change by a certain value.
  • the polyimide-based resin film satisfies a thermal expansion coefficient of 20 ppm/°C or less in a section of 100° C. or more and 430° C. or less, even when a polyimide film obtained by high temperature curing secures sufficient heat resistance and uses it as a plastic substrate, plastic When heat-treating the metal layer formed on the substrate, it is possible to prevent the plastic substrate from being damaged by heat, and also to suppress the occurrence of warpage in the metal thin film formed on the plastic substrate.
  • the haze value of the polyimide-based resin film may be 2% or less, or 0.1% or more and 2% or less.
  • the polyimide-based resin film may have a yellow index value of 15 or less, or 1 or more and 15 or less.
  • the haze may be measured from the polyimide film sample having a thickness of 10 ⁇ 2 ⁇ m.
  • the thickness of the polyimide film increases or decreases by a specific value, physical properties measured in the polyimide film may also change by a certain value.
  • the polyimide-based resin film may have an average transmittance of 60% or more, or 60% or more and 99% or less in a wavelength range of 380 nm to 780 nm. In addition, the polyimide-based resin film may have a transmittance of 80% or more, or 80% or more and 99% or less at a wavelength of 550 nm.
  • the transmittance can be measured from the polyimide film sample having a thickness of 10 ⁇ 2 ⁇ m.
  • the thickness of the polyimide film increases or decreases by a specific value, physical properties measured in the polyimide film may also change by a certain value.
  • a substrate for a display device including the polyimide-based resin film of the other embodiment may be provided.
  • the contents of the polyimide-based resin film may include all of the contents described above in one embodiment.
  • the display device including the substrate is a liquid crystal display device (LCD), an organic light emitting diode (OLED), a flexible display (Flexible Display), or a rollable display device (rollable display or foldable display) ) And the like, but is not limited thereto.
  • LCD liquid crystal display device
  • OLED organic light emitting diode
  • flexible display Flexible Display
  • rollable display device rollable display or foldable display
  • the display device may have various structures depending on the application field and the specific shape, for example, a structure including a cover plastic window, a touch panel, a polarizing plate, a barrier film, a light emitting device (such as an OLED device), and a transparent substrate. have.
  • the polyimide-based resin film of the other embodiments described above may be used for various purposes such as a substrate, an external protective film, or a cover window in these various display devices, and more specifically, may be applied as a substrate.
  • the substrate for a display device may have a structure in which a device protection layer, a transparent electrode layer, a silicon oxide layer, a polyimide resin film, a silicon oxide layer, and a hard coating layer are sequentially stacked.
  • the transparent polyimide substrate may include a silicon oxide layer formed between the transparent polyimide-based resin film and the cured layer in terms of further improving solvent resistance, moisture permeability, and optical properties, and the silicon oxide layer is poly It may be produced by curing silazane.
  • the silicon oxide layer is formed by curing the coated polysilazane after coating and drying a solution containing polysilazane before the step of forming a coating layer on at least one surface of the transparent polyimide resin film.
  • the substrate for a display device can provide a transparent polyimide cover substrate having solvent resistance, optical properties, moisture permeability, and scratch resistance, while having excellent bending properties and impact resistance by including the above-described device protection layer. have.
  • an optical device including the polyimide-based resin film of the other embodiment may be provided.
  • the contents of the polyimide-based resin film may include all of the contents described above in one embodiment.
  • the optical device may include all of various devices using properties realized by light, for example, a display device.
  • a display device include a liquid crystal display device (LCD), an organic light emitting diode (OLED), a flexible display, or a rollable display or foldable display And the like, but is not limited thereto.
  • LCD liquid crystal display device
  • OLED organic light emitting diode
  • flexible display or a rollable display or foldable display And the like, but is not limited thereto.
  • the optical device may have various structures according to application fields and specific shapes, and may be, for example, a structure including a cover plastic window, a touch panel, a polarizing plate, a barrier film, a light emitting device (such as an OLED device), and a transparent substrate. have.
  • the polyimide-based resin film of the other embodiments described above may be used in various applications such as a substrate, an external protective film, or a cover window in these various optical devices, and more specifically, may be applied to a substrate.
  • the discoloration property is low, so it can exhibit excellent light transmittance when applied as a liquid crystal alignment film, and a polyimide resin film capable of realizing improved alignment properties and electrical properties and a substrate for a display device using the same, and optical The device can be provided.
  • the polyimide precursor composition was spin coated on a glass substrate.
  • the glass substrate on which the polyimide precursor composition was applied was placed in an oven and heated at a rate of 5°C/min, and the curing process was performed by maintaining 30 minutes at 80°C and 30 minutes at 450°C, and a polyimide film having a thickness of 10 ⁇ m Was prepared.
  • BPDA 4'-biphenyltetracarboxylic dianhydride
  • the polyimide precursor composition was spin coated on a glass substrate.
  • the glass substrate coated with the polyimide precursor composition was placed in an oven, heated at a rate of 5°C/min, and maintained at 30°C for 30 minutes and for 30 minutes at 450°C to cure the polyimide film having a thickness of 10 ⁇ m.
  • pyromellitic dianhydride (PMDA) was used instead of 3,3',4,4'-biphenyltetracarboxylic dianhydride (3,3',4,4'-Biphenyltetracarboxylic dianhydride (BPDA)).
  • BPDA 3,3',4,4'-biphenyltetracarboxylic dianhydride
  • a polyimide film was manufactured in the same manner as in Example 1, except that.
  • the sample was loaded using an accessory.
  • the actual measured film length was set to 16 mm.
  • the temperature range of 4°C/min to 430°C to 100°C The change in thermal expansion when cooled at a cooling rate was measured by TMA (Q400 manufactured by TA), and evaluated under the following criteria.
  • ⁇ more than 20 ppm/°C and less than 30 ppm/°C
  • the yellow index of the polyimide film was measured using a color meter (Color-Eye 7000A from GRETAGMACBETH) and evaluated under the following criteria.
  • the haze value of the polyimide film was measured using a Hazemeter (NDH-5000) and evaluated under the following criteria.
  • the average transmittance in a wavelength range of 380 nm or more and 780 nm or less was measured with a transmission meter (model name HR-100, manufactured by Murakami Color Research Laboratory), and evaluated under the following criteria.
  • the transmittance to 550 nm wavelength was measured with a transmittance meter (model name HR-100, manufactured by Murakami Color Research Laboratory) and evaluated under the following criteria.
  • ⁇ more than 60% and less than 80%
  • the polyimide film obtained in the Example has a CTE value of 20 ppm/°C or less, and is lower than that of Comparative Examples 1 and 2, which is 30 ppm/°C or higher, as well as having excellent heat resistance and haze value. It was confirmed that it can have excellent optical properties with improved transparency, which is lower than that of Comparative Examples 1 and 2 having a value of more than 2%.
  • the polyimide film obtained in the example has a yellow index (YI) of 15 or less, and is not only lower than Comparative Example 3, which is less than 15 and less than 25, but also has a higher value than Comparative Example 3 in terms of transmittance properties and has excellent optical properties. It was confirmed that can have.
  • YI yellow index

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  • General Physics & Mathematics (AREA)
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Abstract

La présente invention concerne un film polymère à base de polyimide synthétisé par une réaction entre un composé anhydride d'acide particulièrement structuré et un composé diamine, un substrat utilisant le film polymère pour un appareil d'affichage, et un appareil optique.
PCT/KR2020/001265 2019-02-01 2020-01-28 Film polymère à base de polyimide, substrat pour appareil d'affichage l'utilisant, et appareil optique WO2020159184A1 (fr)

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CN202080003021.2A CN112204084B (zh) 2019-02-01 2020-01-28 基于聚酰亚胺的聚合物膜、使用其的显示装置用基底和光学装置
US17/059,644 US11999823B2 (en) 2019-02-01 2020-01-28 Polyimide-based polymer film, substrate for display device, and optical device using the same
JP2020565931A JP7414010B2 (ja) 2019-02-01 2020-01-28 ポリイミド系樹脂フィルム、およびこれを利用したディスプレイ装置用基板ならびに光学装置

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KR20190013486 2019-02-01
KR10-2019-0013486 2019-02-01
KR1020190121178A KR102427759B1 (ko) 2019-09-30 2019-09-30 폴리이미드계 수지 필름 및 이를 이용한 디스플레이 장치용 기판, 및 광학 장치
KR10-2019-0121178 2019-09-30
KR10-2019-0121176 2019-09-30
KR1020190121177A KR102427758B1 (ko) 2019-09-30 2019-09-30 폴리이미드계 수지 필름 및 이를 이용한 디스플레이 장치용 기판, 및 광학 장치
KR20190121176 2019-09-30
KR10-2019-0121177 2019-09-30
KR1020190161494A KR102465430B1 (ko) 2019-02-01 2019-12-06 폴리이미드 전구체 조성물 및 이로부터 제조된 폴리이미드 필름, 디스플레이 장치용 기판, 및 광학 장치
KR10-2019-0161494 2019-12-06
KR1020190161495A KR102427760B1 (ko) 2019-09-30 2019-12-06 폴리이미드계 수지 필름 및 이를 이용한 디스플레이 장치용 기판, 및 광학 장치
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PCT/KR2020/001265 WO2020159184A1 (fr) 2019-02-01 2020-01-28 Film polymère à base de polyimide, substrat pour appareil d'affichage l'utilisant, et appareil optique
PCT/KR2020/001250 WO2020159174A1 (fr) 2019-02-01 2020-01-28 Film polymère à base de polyimide et substrat pour dispositif d'affichage et dispositif optique, chacun utilisant celui-ci
PCT/KR2020/001291 WO2020159193A1 (fr) 2019-02-01 2020-01-28 Composition de précurseur de polyimide et film de polyimide, substrat pour dispositif d'affichage, et dispositif optique, chacun fabriqué à partir de celle-ci

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PCT/KR2020/001291 WO2020159193A1 (fr) 2019-02-01 2020-01-28 Composition de précurseur de polyimide et film de polyimide, substrat pour dispositif d'affichage, et dispositif optique, chacun fabriqué à partir de celle-ci

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