WO2020156476A1 - 一种光模块 - Google Patents

一种光模块 Download PDF

Info

Publication number
WO2020156476A1
WO2020156476A1 PCT/CN2020/073945 CN2020073945W WO2020156476A1 WO 2020156476 A1 WO2020156476 A1 WO 2020156476A1 CN 2020073945 W CN2020073945 W CN 2020073945W WO 2020156476 A1 WO2020156476 A1 WO 2020156476A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser chip
light
notch
module
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2020/073945
Other languages
English (en)
French (fr)
Inventor
慕建伟
王欣南
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hisense Broadband Multimedia Technology Co Ltd
Original Assignee
Hisense Broadband Multimedia Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hisense Broadband Multimedia Technology Co Ltd filed Critical Hisense Broadband Multimedia Technology Co Ltd
Publication of WO2020156476A1 publication Critical patent/WO2020156476A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4245—Mounting of the opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/40—Transceivers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Definitions

  • This application relates to the field of optical fiber communication technology, and in particular to an optical module.
  • Optical module refers to an integrated communication device used for photoelectric conversion, which can convert optical signals into electrical signals and convert electrical signals into optical signals, and plays an important role in the field of optical communications.
  • the optical module includes an upper shell and a lower shell.
  • the upper shell and the lower shell form a cavity with two openings at both ends.
  • the light emitting submodule, the light receiving submodule and the circuit board are wrapped, the light emitting submodule and the light
  • the receiving sub-modules can be collectively referred to as optical sub-modules.
  • the light emission sub-module mainly includes a light emission chip and an optical lens.
  • the common light emitting chip of the optical module is a laser chip, and the laser has become the preferred light source for optical modules and even optical fiber transmission with better single-wavelength characteristics and better wavelength tuning characteristics.
  • the function of the optical lens is to converge the light, and the light emitted from the light emitting chip is in a divergent state. In order to facilitate subsequent optical path design and light coupling into the optical fiber, convergence processing is required.
  • a laser chip is attached to the surface of a CoC (chip on carrier) structure, and is connected to the circuit on the surface of the CoC structure by wire bonding. Since the wire bonding position of the laser chip is far from the circuit on the surface of the CoC structure, the wire bonding distance is longer, and the longer wire bonding distance is not conducive to high-frequency signal transmission and directly affects the high-frequency performance of the optical module.
  • CoC chip on carrier
  • the present application provides an optical module to shorten the wire bonding length between the laser chip and the circuit on the CoC surface, which is beneficial to the transmission of high-frequency signals.
  • An optical module provided by the present application includes a housing and a top substrate, a bottom substrate, a lens, and a laser chip located inside the housing;
  • the top substrate is fixed on the bottom substrate
  • the top substrate is provided with a notch, and the laser chip is located in the notch and fixed on the upper surface of the bottom substrate; the opening of the notch extends in the direction of the lens so that the laser chip emits The light beam passes through the gap and is received by the lens;
  • the upper surface of the top substrate is provided with a circuit, and the laser chip is connected to the circuit by wire bonding.
  • a metal layer is provided on the upper surface of the bottom substrate; the lower surface of the laser chip is connected with the metal layer to be fixed on the upper surface of the bottom substrate.
  • the top substrate is provided with a via hole, and the via hole connects the metal layer and the circuit ground.
  • the monitoring light detector is located in the gap and fixed on the upper surface of the bottom substrate; the monitoring light detector is connected to the circuit by wire.
  • the upper surface of the laser chip is flush with the upper surface of the top substrate.
  • the gap includes a first gap and a second gap; the laser chip is located in the first gap, and the monitoring light detector is located in the second gap; the first gap and the second gap The partition between the gaps is provided with a light-transmitting port.
  • an embodiment of the present application provides an optical module.
  • the optical module includes a housing and a top substrate, a bottom substrate, a lens and a laser chip located inside the housing; the top substrate is fixed on the bottom substrate; The substrate is provided with a gap, and the laser chip is located in the gap and fixed on the surface of the bottom substrate, so that the height of the upper surface of the laser chip relative to the upper surface of the top substrate can be reduced; and because the upper surface of the top substrate is equipped with circuits, the laser chip It is connected to the circuit for wire bonding, so that the wire bonding length between the laser chip and the circuit can be shortened; in addition, the notch opening extends toward the lens, so that the light beam emitted by the laser chip can be received by the lens through the notch, thereby realizing high-frequency signals transmission.
  • the optical module provided in the embodiments of the present application can shorten the wire bonding length of the laser chip and optimize the high-frequency performance of the optical module.
  • FIG. 1 is a schematic diagram of the external structure of an optical module provided by an embodiment of the application
  • Figure 3 is a schematic diagram of the external structure of the optical emission sub-module of the application.
  • Figure 4 is an exploded view of the structure of a light emitting sub-module
  • Figure 5 is a schematic diagram of a partial structure of a laser assembly
  • Fig. 6 is a partial structural diagram of another laser assembly
  • Figure 7 is a schematic plan view of a laser assembly
  • FIG. 8 is a schematic diagram of a partial structure of the optical emission sub-module of the application.
  • FIG. 9 is a schematic diagram of an embodiment of the optical emission sub-module of this application.
  • FIG. 10 is a schematic diagram of another embodiment of the optical emission sub-module of this application.
  • FIG. 11 is another partial cross-sectional schematic diagram of the optical emission sub-module of this application.
  • FIG. 12 is a schematic diagram of an embodiment of the optical emission sub-module of this application.
  • FIG. 13 is a schematic diagram of another embodiment of the optical emission sub-module of this application.
  • the embodiment of the present application provides an optical module.
  • the following first introduces specific embodiments of the optical module of the present application.
  • FIG. 1 is a schematic diagram of the external structure of an optical module provided by an embodiment of this application
  • FIG. 2 is an exploded view of the structure of an optical module provided by an embodiment of this application.
  • the optical module includes an upper housing 11, a lower housing 12 and a handle 13.
  • the upper shell 11 and the lower shell 12 are combined to form a cavity with two openings at both ends.
  • One end of the cavity is opened for connecting with an optical fiber, which is called the optical port 14.
  • the handle 13 is set at one end of the optical port 14, and is used to hold the light.
  • the other end of the cavity is used to connect with the upper electromechanical device, called the electrical port 15, and one end of the electrical port 15 needs to be inserted into the host computer.
  • the electrical port 15 is provided with an electrical connector exposed outside the housing for the host computer to insert.
  • the electrical connector may be a gold finger 25 formed at the end of the circuit board 21 as shown in FIG. 2.
  • a circuit board 21, a light emitting sub-module 22 and a light receiving sub-module 23 may be provided in the cavity formed by the upper casing 11 and the lower casing 12.
  • the light emitting sub-module 22 is arranged on one end edge of the length direction of the circuit board 21, and a gold finger for electrical communication with the outside of the optical module is arranged on the other end edge of the length direction of the circuit board 21.
  • the light emission sub-module set inside the optical module also has a shell-type package.
  • the shell of the light emission sub-module is called the shell
  • the shell of the optical module is called the shell (the shell includes the upper shell 11). And the lower shell 12).
  • Figure 2 shows a specific light emitting sub-module and light receiving sub-module packaging, the light emitting sub-module 22 is arranged on the surface of the circuit board 21, the light receiving sub-module 23 is arranged on the surface of the circuit board 21; in another package In the method, the light emitting sub-module 21 is physically separated from the circuit board 21 and electrically connected through a flexible board; in another common packaging method, the light receiving sub-module 23 is physically separated from the circuit board 21, and the electrical connection is achieved through a flexible board .
  • circuit board 21 is electrically connected to the light emitting sub-module 22 and the light receiving sub-module 23, respectively.
  • the circuit board 21 is provided with electronic devices such as chips, capacitors, resistors, etc. for realizing circuit board functions and realizing electrical connections. Electronic devices such as chips can be selected according to product requirements.
  • the chips can include: microprocessor MCU, clock data recovery chip CDR, laser drive chip, transimpedance amplifier TIA chip, limiting amplifier LA chip, power management chip, etc.;
  • the transimpedance amplifier is closely related to the light detection chip, and some products will package the transimpedance amplifier and the light detection chip together, such as in the same TO package or the same housing; the light detection chip and the transimpedance amplifier can also be packaged Separate and sub-assemble, and install the transimpedance amplifier on the circuit board 21.
  • the chip 21 on the circuit board can be an all-in-one chip.
  • the laser driver chip and the MCU chip can be fused into one chip, or the laser driver chip, the limiting amplifier chip and the MCU can be fused into one chip.
  • the chip is the integration of circuits, but the functions of the individual circuits have not disappeared because of the aggregation, but the circuit form is integrated. Therefore, when the circuit board is equipped with three independent chips: MCU, laser drive chip and limiting amplifier chip, which is the same as setting a single chip with three functions in one on the circuit, the technical effect of the solution is equivalent, and the technical effect is the same. I will not explain them in detail here.
  • Fig. 3 is a schematic diagram of the external structure of the optical emission sub-module of the application.
  • the top opening of the housing 221 of the light emitting sub-module 22 is covered and sealed by a cover plate 222.
  • An optical fiber adapter 223 is arranged on one side wall of the housing 221, and the optical fiber is connected to the optical fiber adapter 223, and the light inside the housing is injected into the optical fiber through the optical fiber adapter 223.
  • the housing 221 of the light emitting sub-module 22 is embedded in the circuit board 21.
  • FIG. 4 is an exploded view of the structure of a light emitting sub-module.
  • a laser component 227 and an optical multiplexing component 228 are provided in the sealed cavity formed by the housing 221 and the cover plate 222; the laser component 227 has a laser chip, a collimating lens and other devices.
  • the multiple collimated lights formed in the laser assembly 227 are incident into the optical multiplexing assembly 228, and the optical multiplexing assembly 228 combines the multiple beams into one light, and then enters the optical fiber adapter 223.
  • the fiber optic adapter 223 has an isolator 224 in it to prevent light from being reflected back into the laser chip.
  • One side of the housing 221 has an opening 225 for the circuit board 21 to extend into the housing 221 through the opening 225, and the other side of the housing has a groove 226 for the circuit board 21 to extend into the groove to clamp the housing. .
  • Laser chips are the light emitting chips of optical modules. Lasers have become the preferred light source for optical modules and even optical fiber transmission with better single wavelength characteristics and better wavelength tuning characteristics. Other types of light, such as LED light, are common optical communication systems. Generally not used. Even if this kind of light source is used in a special optical communication system, the characteristics of the light source and chip structure are quite different from the laser, which makes the optical module using laser and the optical module using other light sources have greater technology The difference is that those skilled in the art generally do not think that these two types of optical modules can provide technical inspiration to each other.
  • the function of the optical lens is to converge the light, and the light emitted from the light emitting chip is in a divergent state. In order to facilitate the subsequent optical path design and the coupling of light into the optical fiber, the convergence processing is required. Therefore, convergence is to converge divergent light into parallel light, and converge divergent light and parallel light into convergent light.
  • the light emitting sub-module 22 has a packaging structure to package laser chips, etc.
  • Typical packaging structures include coaxial packaging TO-CAN, silicon optical packaging, chip-on-board lens component packaging COB-LENS, micro-optics XMD packaging, and It is a hermetic package and a non-hermetic package.
  • the packaging structure can provide a stable and reliable working environment for the laser chip on the one hand, and on the other hand, it can form a specific external electrical connection and light output as required.
  • the optical module adopts different packages to make the light emitting sub-module 22. Since the laser chip has a vertical cavity surface to emit light, there are also a variety of light emitting directions, such as edge emitting, so the different light emitting direction of the laser chip will also affect the choice of package form.
  • FIG. 5 is a schematic diagram of the structure of a laser assembly.
  • the laser assembly includes a substrate 51, an electrical connection plate 52, a CoC structure 53, a laser chip 54 and a collimating lens 55.
  • a laser assembly may include multiple laser chips 54 and collimating lenses 55.
  • 4 CoC structures, 4 laser chips, and 4 collimating lenses are shown in FIG. 5.
  • the 4 laser chips emit 4 different wavelengths of light to achieve the superposition of 4 communication rates.
  • the substrate 51 is used to support various components
  • the electrical connection board 52 is used to realize circuit connection
  • the laser chip 54 is located on the surface of the CoC structure 53
  • the CoC structure 53 provides power supply connection for the laser chip 54
  • the collimating lens 55 is located on the laser chip 54 In the light emitting direction, it is used to converge the divergent light emitted by the laser chip 54 into parallel light.
  • Fig. 6 is a schematic partial structure diagram of another laser assembly
  • Fig. 7 is a schematic plan view of the corresponding structure.
  • the upper surface of each CoC structure 53 is provided with optoelectronic devices such as a circuit 56 and a laser chip 54.
  • the circuit 56 is formed by connecting conductive sheets of different shapes, and each conductive sheet serves as a branch of the circuit 56 to form a plurality of conductive paths. It can be seen from FIG. 5 or 7 that the light beam emitted by the laser chip 54 when it is working is directed to the lens 55 and is converged or collimated by the lens to complete the coupling.
  • the physical thickness of the laser chip 54 makes the wire bonding longer, and the wire bonding position is higher than the upper surface of the CoC structure by a certain distance. Because wire bonding can be equivalent to a component with both resistance and inductance characteristics in high frequency characteristics, the longer the wire bonding, the greater the parasitic inductance. At the same time, there are more uncontrollable factors in the wire length and radian in the production, leading to the device It is difficult to accurately estimate the actual equivalent resistance and inductance effect of the wire bonding during packaging, making the device performance uncontrollable. In addition, the introduction of resistance and inductance will affect the high-frequency characteristics of the device, which is not conducive to high-frequency transmission. Therefore, in the packaging of high-speed devices, it is desirable that the wire length be as short as possible and the arc height as low as possible to reduce parasitic parameters and improve the performance of high-speed devices.
  • this application provides a light emission sub-module.
  • the following provides specific embodiments of the light emission sub-module and the optical module including the light emission sub-module for this application with reference to FIGS. 1-5 and 8-13. Make an introduction.
  • the light emission sub-module provided by the embodiment of the present application includes a housing as shown in FIG. 3 or 4, specifically a housing 221 and a cover plate 222.
  • the top opening of the housing 221 can be covered and sealed by the cover plate 222.
  • the light emission sub-module provided by the present application further includes: a top substrate 81, a bottom substrate 82, a lens and a laser chip 54;
  • the top substrate 81, the bottom substrate 82, the lens and the laser chip 54 are all located in the cavity formed by the housing 221.
  • the top substrate 81 is fixed on the bottom substrate 82;
  • the top substrate 81 is provided with a notch 811; the laser chip 54 is located in the notch 811 and is fixed on the surface of the bottom substrate 82; the opening of the notch 811 extends to the edge of the side where the lens 55 is located, and the light beam emitted by the laser chip 54 is passed through the notch 811.
  • the lens 55 receives;
  • the upper surface 812 of the top substrate 81 is provided with a circuit 56, and the laser chip 54 is wired and connected to the circuit 56.
  • the CoC structure includes stacked two-layer substrates, namely, a top substrate 81 and a bottom substrate 82, and a gap 811 is opened from the top substrate 81, the laser chip 54 is placed in the gap 811, and the laser chip 54 The lower surface is attached to the surface of the base substrate 82.
  • the laser chip 54 has a cathode on the lower surface and an anode on the upper surface.
  • the circuit 56 may specifically include a first branch 561 for wire connection with the optoelectronic device on the CoC surface, the first branch 561 is used for supplying power to the optoelectronic device, and a second branch 562 for ground connection.
  • the anode on the upper surface of the laser chip 54 is connected to the first branch 561 by wire bonding.
  • the depth of the notch 811 can be used to offset the thickness of the laser chip 54, thereby reducing the height of the upper surface of the laser chip 54 relative to the upper surface of the top substrate 81, so that the anode of the laser chip 54 and the first When the branch circuit 561 is wired and connected, the wiring length between the laser chip 54 and the circuit 56 can be shortened.
  • the opening of the notch 811 extends on the top substrate 81 along the edge of the side where the lens 55 is located in the light emission direction of the laser chip 54 so that the notch 811 provides The light exit path allows the light beam emitted by the laser chip 54 to be directed toward the lens through the light exit path provided by the notch 811, and is finally received by the lens 55 to facilitate the transmission of high-frequency signals.
  • the top substrate 81 and the bottom substrate 82 can be two layers of metalized ceramic plates with different thicknesses, for example, two layers of aluminum nitride (ALN) plates with different thicknesses.
  • the two layers of metalized ceramic plates provide for the packaging of optoelectronic devices.
  • the underlying substrate 82 can increase the deformation space of the overall CoC structure and improve the stability of the CoC structure.
  • the length of the gold wire 83 connecting the laser chip 54 and the circuit 56 is significantly shorter, and the height of the wire arc is significantly reduced. It can be seen that the optical emission sub-module of this application is beneficial to signal transmission and optimizes the high-frequency performance of the optical module.
  • FIG. 9 is a schematic diagram of another embodiment of the optical emission sub-module of this application. Different from the embodiment shown in FIG. 8, the light emission sub-module shown in FIG. 9 further includes a monitoring light detector 84; the monitoring light detector 84 is located in the gap 811 together with the laser chip 54 and is wired to the circuit 56.
  • the monitoring light detector 84 is used to receive the light beam emitted by the laser chip 54 to realize the optical power monitoring function.
  • the edge-emitting laser chip 54 will emit two light beams with opposite transmission directions; the monitoring light detector 84 and the lens 55 are respectively arranged in the two light emitting directions of the laser chip 54, and then One of the lights emitted by the laser chip 54 passes through the gap 811 and is directed toward the lens 55, and the other light is directed toward the monitoring light detector 84 located in the gap 811.
  • the gap 811 of the top substrate 81 provides installation space for the monitoring light detector 84, so that the optical emission sub-module provided in this embodiment has the optical power monitoring function without increasing the wire length and the height of the arc.
  • FIG. 10 is a schematic diagram of another embodiment of the optical emission sub-module of this application.
  • a metal layer 85 is provided between the top substrate 81 and the bottom substrate 82; the metal layer 85 is attached to the upper surface of the bottom substrate 82.
  • the top substrate 81 has a via 86 through which the second branch 562 of the circuit 56 passes The via 86 is connected to the metal layer 85.
  • the metal layer 85 By arranging the metal layer 85 between the top substrate 81 and the bottom substrate 82, on the one hand, it can provide a reference layer for signal transmission for the top substrate 81 and the optoelectronic devices on its upper surface, so as to improve the quality of signal transmission.
  • the second branch 562 is connected to the via 86 of the metal layer 85, so that the circuit 56 can be grounded.
  • the depth of the notch 811 may be equal to the thickness of the top substrate 81.
  • the metal layer 85 located on the upper surface of the bottom substrate 82 at the position corresponding to the notch 811 is exposed.
  • the lower surface of the laser chip 54 can be directly attached to the metal layer 85, and the cathode, or ground electrode, on the lower surface is connected to the exposed metal layer to realize the ground connection of the laser chip 54.
  • the depth of the notch 811 may also be equal to the thickness of the laser chip 54 so that the upper surface of the laser chip 54 is flush with the upper surface of the top substrate 82. At this time, the theoretical wire length between the laser chip 54 and the circuit 56 is the smallest.
  • the depth of the notch 811 needs to be greater than the thickness of the top substrate 81. At this time, the notch 811 extends to the bottom substrate 82 in the longitudinal direction.
  • the structure can be as shown in FIG. Show, not repeat them here.
  • a conductive sheet 813 can be arranged on the inner surface of the bottom of the notch 811, and the lower surface of the laser chip 54 is attached to the conductive sheet 813 to realize the ground connection of the laser chip 54.
  • the notch 811 involved in the embodiment of the present application can have different shapes and forms.
  • it can be a special-shaped space area that is integrally formed to accommodate the laser chip 54 alone or simultaneously accommodates the laser chip 54 and the monitoring light detector 84. It may also include two independent space areas for accommodating the laser chip 54 and the monitoring light detector 84 respectively.
  • Figure 12 is a possible implementation of the optical emission sub-module of this application.
  • the notch 811 is divided into two areas, which are a first accommodating area 8111 and a second accommodating area 8112, respectively, where the laser chip 54 is arranged in the first accommodating area 8111, and monitoring light detection
  • the device 84 is arranged in the second accommodating area 8112.
  • the monitoring light detector 84 also needs to receive the light emitted by the laser chip 54 in order to realize the optical power monitoring function, therefore, the first accommodating area 8111 and the second accommodating area 8112 are connected, so that the light emitted by the laser chip 54 can be It is directed to the monitoring light detector 84 through the connected area.
  • the notch 811 provides an integrally formed accommodating space, and the accommodating space includes two areas, namely the first accommodating area 8111 and the second accommodating area 8112.
  • the laser chip 54 and the monitoring light detector 84 are located in the integrated space at the same time, and are located in the aforementioned two areas respectively.
  • the first accommodating area 8111 and the second accommodating area 8112 are naturally connected, and this connected area is exactly equivalent to a light transmission port, so that the light beam emitted by the laser chip 54 can pass through the light transmission The port is received by the monitoring light detector 84.
  • the shape of the notch 811 is simple, and there are no extra side walls, which not only provides more usable space for device packaging, but also reduces the weight of the top substrate 81 to a certain extent. And if the depth of the notch 811 is greater than the thickness of the top substrate 81, the weight of the bottom substrate 82 can be reduced, which is beneficial to the weight reduction of the CoC structure. In addition, the simple notch shape makes the processing of the product easier.
  • FIG. 13 is another possible implementation manner of the optical emission sub-module of this application.
  • the gap 811 may include a first gap 8113 and a second gap 8114; the laser chip 54 is disposed in the first gap 8113, and the monitoring light detector 84 is disposed in the second gap 8114.
  • a light-transmitting port 8115 is physically provided between the first notch 8113 and the second notch 8114 so that the monitoring light detector 84 receives the light emitted by the laser chip 54.
  • the gap 811 provides two mutually independent accommodation spaces, that is, the first gap 8113 and the second gap 8114 described above.
  • the laser chip 54 and the monitoring light detector 84 are respectively located in corresponding accommodation spaces. Since there is a partition formed by the entity of the top substrate 81 between the first notch 8113 and the second notch 8114, a light-transmitting opening 81115 needs to be opened on the partition, and the light-transmitting opening 8115 may be a through hole Therefore, the light beam emitted by the laser chip 54 is directed to the monitoring light detector 84 through the light transmitting port 8115, and is received by the monitoring light detector 84, thereby realizing the optical power monitoring function.
  • the cross-sections of the first notch 8113 and the second notch 8114 may have the same shapes as the cross-sections of the laser chip 54 and the monitoring light detector 84, respectively.
  • the first notch 8113 and the second notch 8114 provide The space may be slightly larger than the volume of the laser chip 54 and the monitoring light detector 84, so that the sidewall of the notch 811 can achieve clearance fit with the laser chip 54 and the monitoring light detector 84.
  • the two independent accommodation spaces provided by the gap 811 are fully utilized.
  • the sidewalls of the gap 811 are matched with the gap between the laser chip 54 and the monitoring light detector 84, which can improve the laser chip 54. And monitor the package stability of the photodetector 84.
  • the notch 811 occupies a smaller space on the top substrate 81, this more compact structure design is beneficial to reduce the volume of the CoC structure.
  • the optical emission sub-module may include multiple laser chips 54. After the optical signals of multiple wavelengths emitted by the multiple laser chips 54 are combined into one light, the optical module is transmitted through the optical fiber and enters the external communication optical fiber. According to the transmission design and the characteristics of the laser chip 54, the optical emission sub-module may also include an electronic device for adjusting the temperature, such as a semiconductor cooler TEC, which is used to change the temperature of the laser chip 54.
  • the light emission sub-module may also include a temperature sensor for temperature detection; the light emission sub-module may also include a substrate for providing an attachment platform with a CoC structure, and the substrate can be made into different shapes and structures according to actual needs.
  • the optical module includes a housing 221 and a top substrate 81, a bottom substrate 82, a lens 55 and a laser chip 54 located inside the housing 221; the top substrate 81 is fixed On the base substrate 82. Since the top substrate 81 is provided with a notch 811, the laser chip 54 is located in the notch 811 and fixed on the upper surface of the bottom substrate 82, so the height of the upper surface of the laser chip 54 relative to the upper surface of the top substrate 81 can be reduced.
  • the optical module provided by the embodiments of the present application can shorten the wire bonding length of the laser chip 54 and optimize the high-frequency performance of the optical module.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Semiconductor Lasers (AREA)

Abstract

本申请公开了光模块，包括壳体以及位于所述壳体内部的顶层基板、底层基板、透镜和激光芯片；顶层基板固定在底层基板上；由于顶层基板设有缺口，激光芯片位于该缺口中，并固定在底层基板的上表面上，因此能够降低激光芯片上表面相对于顶层基板上表面的高度；又由于顶层基板的上表面设有电路，激光芯片与该电路打线连接，因此能够缩短激光芯片与电路的打线长度。此外，所述缺口向透镜一侧的边缘延伸，使得激光芯片发出的光束可以通过所述缺口被透镜接收，进而实现高频信号传输。综上所述，本申请实施例提供的光模块，缩短了激光芯片的打线长度，优化了光模块的高频性能。

Description

一种光模块
本申请要求在2019年2月1日提交中国专利局、申请号为201910104934.2、发明名称为“一种光模块”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及光纤通信技术领域，尤其涉及一种光模块。
背景技术
光模块是指用于光电转换的一种集成通信器件，可以将光信号转换为电信号，以及将电信号转换为光信号，在光通信领域发挥着重要作用。光模块包括上壳体与下壳体，上壳体及下壳体形成两端开口的腔体，在腔体中包裹光发射次模块、光接收次模块以及电路板，光发射次模块及光接收次模块可以统称为光学次模块。
光发射次模块中主要包括光发射芯片及光学透镜。光模块常见的光发射芯片为激光芯片，激光以较好的单波长特性及较佳的波长调谐特性成为光模块乃至光纤传输的首选光源。光学透镜的作用是汇聚光，从光发射芯片发出的光呈发散状态，为了便于后续的光路设计及光耦合进光纤，都需要进行汇聚处理。
通常，激光芯片附着在一CoC(chip on carrier)结构的表面上，并通过打线的方式与CoC结构表面上的电路连接。由于激光芯片的打线位置距离CoC结构表面的电路较远，导致打线距离较长，而较长的打线距离则会不利于高频信号传输，直接影响到光模块的高频性能。
发明内容
本申请提供一种光模块，以缩短激光芯片与CoC表面的电路的打线长度，有利于高频信号的传输。
本申请提供的一种光模块，包括壳体以及位于所述壳体内部的顶层基板、底层基板、透镜和激光芯片；
所述顶层基板固定在所述底层基板上；
所述顶层基板设有缺口，所述激光芯片位于所述缺口中，并固定在所述底层基板的上表面上；所述缺口的开口向所述透镜方向延伸，以使所述激光芯片发出的光束穿过所述缺口被所述透镜接收；
所述顶层基板的上表面设有电路，所述激光芯片与所述电路打线连接。
可选的，所述底层基板的上表面设有金属层；所述激光芯片的下表面与所述金属层连接，以固定在所述底层基板上表面。
可选的，所述顶层基板设置有过孔，所述过孔连接所述金属层与所述电路的地。
可选的，还包括监控光探测器；所述监控光探测器位于所述缺口中，并固定在所述底层基板的上表面；所述监控光探测器与所述电路打线连接。
可选的，所述激光芯片的上表面与所述顶层基板的上表面相平齐。
可选的，所述缺口包括第一缺口和第二缺口；所述激光芯片位于所述第一缺口中，所述监控光探测器位于所述第二缺口中；所述第一缺口与第二缺口之间的隔板上设有透光口。
由以上技术方案可知，本申请实施例提供一种光模块，光模块包括壳体以及位于所述壳体内部的顶层基板、底层基板、透镜和激光芯片；顶层基板固定在底层基板上；由于顶层基板设有缺口，激光芯片位于该缺口中，并固定在底层基板的表面上，因此能够降低激光芯片上表面相对于顶层基板上表面的高度；又由于顶层基板的上表面设有电路，激光芯片与该电路打线连接，因此能够缩短激光芯片与电路的打线长度；此外，所述缺口开口向透镜方向延伸，使得激光芯片发出的光束可以通过所述缺口被透镜接收，进而实现高频信号传输。综上所述，本申请实施例提供的光模块，可缩短激光芯片的打线长度，优化光模块的高频性能。
附图说明
为了更清楚地说明本申请的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，对于本领域普通技术人员而言，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的光模块的外部结构示意图；
图2为本申请实施例光模块的结构爆炸图；
图3为本申请光发射次模块外部结构示意图；
图4为一种光发射次模块的结构爆炸图；
图5为一种激光组件的局部结构示意图；
图6为另一种激光组件的局部结构示意图；
图7为一种激光组件的平面示意图；
图8为本申请光发射次模块的局部结构示意图；
图9为本申请光发射次模块的一个实施例示意图；
图10为本申请光发射次模块的另一个实施例示意图；
图11为本申请光发射次模块的另一个局部剖面示意图；
图12为本申请光发射次模块的一个实施例示意图；
图13为本申请光发射次模块的另一个实施例示意图。
具体实施方式
为了使本技术领域的人员更好地理解本发明中的技术方案，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都应当属于本发明保护的范围。
本申请实施例提供一种光模块。下面首先介绍本申请光模块的具体实施例。
图1为本申请实施例提供的光模块的外部结构示意图，图2为本申请实施例提供的光模块的结构爆炸图。如图1、2所示，该光模块包括上壳体11、下壳体12及手柄13。上壳体11与下壳体12结合成具有两端开口的腔体，该腔体的一端开口用于与光纤连接，称为光口14，手柄13设置在光口14一端，用于手持光模块，以方便在手持状态下将光模块 插入上位机；该腔体的另一端开口用于与上位机电连接，称为电口15，电口15一端需要插入上位机中。电口15处设有裸露在壳体外的电连接器，以供上位机插入，电连接器可以为如图2中电路板21末端形成的金手指25。
如图2所示，在上壳体11和下壳体12形成的腔体中，可以设置有电路板21、光发射次模块22以及光接收次模块23。具体地，光发射次模块22设置在电路板21长度方向的一端边缘，在电路板21长度方向的另一端边缘设置有用于与光模块外部进行电通信的金手指。与光模块类似，设置在光模块内部的光发射次模块同样具有壳式封装，为了便于区分，光发射次模块的壳称为壳体，光模块的壳称为外壳(外壳包括上壳体11及下壳体12)。
图2示出一种具体的光发射次模块及光接收次模块的封装方式，光发射次模块22设置在电路板21表面，光接收次模块23设置在电路板21表面；在另一种封装方式中，光发射次模块21与电路板21物理分离，通过柔性板实现电连接；在另一种常见的封装方式中，光接收次模块23与电路板21物理分离，通过柔性板实现电连接。
需要说明的是，电路板21分别与光发射次模块22及光接收次模块23电连接，电路板21上设置有用于实现电路板功能及实现电连接的芯片、电容、电阻等电子器件。芯片等电子器件可以根据产品的需求选择，例如所述芯片可以包括：微处理器MCU、时钟数据恢复芯片CDR、激光驱动芯片、跨阻放大器TIA芯片、限幅放大器LA芯片、电源管理芯片等；其中跨阻放大器与光探测芯片紧密关联，部分产品会将跨阻放大器与光探测芯片封装在一起，如封装在同一TO管壳中或同一壳体中；也可以将光探测芯片与跨阻放大器分开分装，将跨阻放大器设置在电路板21上。
还需说明的是，电路板上21的芯片可以是多合一芯片，比如将激光驱动芯片与MCU芯片融合为一个芯片，也可以将激光驱动芯片、限幅放大器芯片及MCU融合为一个芯片，芯片是电路的集成，但各个电路的功能并没有因为集合而消失，只是电路形态发生整合。所以，当电路板上设置有MCU、激光驱动芯片及限幅放大器芯片三个独立芯片，这与电路上设置一个三功能合一的单个芯片，方案的技术效果是等同的，技术效果相同的方案在此就不再一一详细说明。
图3为本申请光发射次模块的外部结构示意图。如图3所示，光发射次模块22的壳体221的顶部开口由盖板222盖合密封。在壳体221的一侧壁上设置有光纤适配器223，光纤接入光纤适配器223中，壳体内部的光通过光纤适配器223射入光纤中。光发射次模块22的壳体221嵌入电路板21中。
图4为一种光发射次模块的结构爆炸图。如图4所示，在壳体221与盖板222形成的密封腔体中，设置有激光组件227和光复用组件228；激光组件227中具有激光芯片、准直透镜等器件。激光组件227中形成的多束准直光射入光复用组件228中，再由光复用组件228将多束光合并为一束光，射入光纤适配器223中。光纤适配器223中具有隔离器224，用于防止光反射回激光芯片中。壳体221的一侧具有开口225，便于电路板21通过该开口225伸入壳体221中，壳体侧边另一侧具有凹槽226，便于电路板21伸入凹槽以夹住壳体。
激光芯片是光模块的光发射芯片，激光以较好的单波长特性及较佳的波长调谐特性成为光模块乃至光纤传输的首选光源，而其他类型的光如LED光等，常见的光通信系统一般不会采用，即使特殊的光通信系统中采用这种光源，其光源的特性及芯片结构与激光存在 较大的差别，使得采用激光的光模块与采用其他光源的光模块存在较大的技术差别，本领域技术人员一般不会认为这两种类型的光模块可以相互给与以技术启示。光学透镜的作用是汇聚光，从光发射芯片发出的光呈发散状态，为了便于后续的光路设计及光耦合进光纤，都需要对进行汇聚处理。因此，汇聚是将发散光汇聚为平行光，将发散光、平行光汇聚为汇聚光。
光发射次模块22具有封装结构，以将激光芯片等封装起来，典型的封装结构包括同轴封装TO-CAN、硅光封装、板上芯片透镜组件封装COB-LENS、微光学XMD封装，还分为气密性封装及非气密性封装。采用封装结构，一方面可以为激光芯片提供稳定、可靠的工作环境，另一方面可以根据需要形成特定的对外的电连接及光输出。根据产品设计及工艺，光模块会采用不同的封装以制作光发射次模块22。由于激光芯片有垂直腔面出光，也有边发光等多种出光方向，因此，激光芯片出光方向的不同也会影响对封装形态的选择。
图5为一种激光组件结构示意图。如图5所示，激光组件包括衬底51、电连接板52、CoC结构53、激光芯片54及准直透镜55。一个激光组件中可以包括多个激光芯片54和准直透镜55。例如，图5中示出的4个CoC结构、4个激光芯片及4个准直透镜。4个激光芯片发出4种不同波长的光，实现4路通信速率的叠加。其中，衬底51用于支撑各部件，电连接板52用于实现电路连接，激光芯片54位于CoC结构53的表面，CoC结构53为激光芯片54提供供电连接，准直透镜55位于激光芯片54出光方向上，用于将激光芯片54发出的发散光汇聚为平行光。
图6为另一种激光组件的局部结构示意图，图7则为相应结构的平面示意图。如图6、7所示，每个CoC结构53的上表面设置有电路56和激光芯片54等光电器件。电路56由不同形状的导电片连接组成，各导电片作为电路56的支路，形成多条导电路径。由图5或7可知，激光芯片54在工作时发出的光束射向透镜55，通过透镜汇聚或准直以完成耦合。
由图6可以看出，激光芯片54的实体厚度使其打线较长，且打线的位置高出CoC结构的上表面一定的距离。由于打线在高频特性上可以等效一个同时具有电阻和电感特性的元件，而打线越长，寄生电感越大，同时在生产中打线长度以及弧度的不可控因素较多，导致器件封装时难以准确预估打线实际等效的电阻电感效应，使器件性能不可控。另外电阻和电感的引入会对器件的高频特性造成影响，不利于高频传输。因此，在高速器件的封装中，希望打线的长度尽量短、线弧高度尽量低，以减少寄生参数，提高高速器件的性能。
为缓解上述技术问题，本申请提供一种光发射次模块下面结合附图1-5以及附图8-13对本申请提供光发射次模块以及包括所述光发射次模块的光模块的具体实施例进行介绍。
本申请实施例提供的光发射次模块，包括如图3或4所示的壳体，具体为壳体221及盖板222，壳体221的顶部开口可由盖板222盖合密封。
参阅图8，本申请提供的光发射次模块还包括：顶层基板81、底层基板82、透镜和激光芯片54；
其中，顶层基板81、底层基板82、透镜和激光芯片54均位于上述壳体221所形成的腔体中。
顶层基板81固定在底层基板82上；
顶层基板81设有缺口811；激光芯片54位于缺口811中，并固定在底层基板82的表 面上；缺口811的开口向透镜55所在的一侧边缘延伸，激光芯片54发出的光束通过缺口811被透镜55接收；
顶层基板81的上表面812设有电路56，激光芯片54与电路56打线连接。
上述实施例中，CoC结构包括堆叠设置的双层基板，即顶层基板81和底层基板82，并自顶层基板81开设一个缺口811，将激光芯片54设置在缺口811中，并使激光芯片54的下表面贴附在底层基板82的表面。
激光芯片54的下表面具有阴极，上表面具有阳极。电路56具体可以包括用于与CoC表面的光电器件打线连接的第一支路561，所述第一支路561用于为光电器件供电；和，用于接地连接的第二支路562。本实施例中，激光芯片54上表面的阳极与第一支路561打线连接。
由于激光芯片54位于缺口811中，因此可以利用缺口811的深度抵消激光芯片54的厚度，进而降低激光芯片54上表面相对于顶层基板81上表面的高度，以在激光芯片54的阳极与第一支路561打线连接时，能够缩短激光芯片54与电路56的打线长度。
另外，由于激光芯片54发出的光束需要通过透镜55进行汇聚或准直，因此缺口811的开口在顶层基板81上沿激光芯片54的出光方向透镜55所在一侧的边缘延伸，以使缺口811提供出光光路，使激光芯片54发出的光束可以通过缺口811提供的出光光路射向透镜，最终被透镜55接收，以利于高频信号的传输。
需要说明的是，顶层基板81和底层基板82可以为两层厚度不同的金属化陶瓷板，例如两层厚度不同的氮化铝(ALN)板，两层金属化陶瓷板为光电器件的封装提供多个焊接面，如本申请技术方案涉及的顶层基板81的上表面。另外，底层基板82可以增大CoC整体结构的形变空间，提高CoC结构的稳定性。
参阅图8可知，与图6所示的激光组件相比，连接激光芯片54和电路56的金线83长度明显缩短，线弧高度明显降低。可见，本申请光发射次模块有利于信号传输，优化光模块的高频性能。
图9为本申请光发射次模块的另一个实施例示意图。与图8所示实施例不同的是，图9所示光发射次模块还包括监控光探测器84；监控光探测器84与激光芯片54一同位于缺口811中，并与电路56打线连接。
监控光探测器84用于接收激光芯片54发出的光束，以实现光功率监控功能。例如，针对采用边发光激光芯片54的方案，边发光激光芯片54会发出两束传输方向相反的光束；将监控光探测器84和透镜55分别设置在激光芯片54的两个出光方向上，进而使激光芯片54发出的其中一束光穿过缺口811射向透镜55，另一束光则射向位于缺口811中的监控光探测器84。通过顶层基板81的缺口811为监控光探测器84提供安装空间，从而在不增加打线长度和线弧高度的前提下，使本实施例提供的光发射次模块具有光功率监控功能。
图10为本申请光发射次模块的另一个实施例示意图。如图10所示，顶层基板81与底层基板82之间设有金属层85；金属层85附着在底层基板82的上表面，顶层基板81具有过孔86，电路56的第二支路562通过过孔86与该金属层85连接。
通过在顶层基板81和底层基板82之间设置金属层85，一方面可以起到为顶层基板81及其上表面的光电器件提供一个可用于信号传输的参考层，以提高信号传输的质量，另一方面，第二支路562与该金属层85的过孔86连接，可以使电路56实现接地。
在图10所示实施例的基础上，缺口811的深度可以与顶层基板81的厚度相等，此时，位于底层基板82上表面的、缺口811对应位置处的金属层85便裸露出来。激光芯片54的下表面可直接贴附在金属层85上，其下表面的阴极，或称接地极，便与裸露在外的金属层连接起来，进而实现激光芯片54的接地连接。
一种可行的技术方案中，缺口811的深度还可以与激光芯片54的厚度相等，以使激光芯片54的上表面与顶层基板82上表面相平齐。此时，激光芯片54与电路56之间的理论打线长度最小。
如果激光芯片54的厚度大于顶层基板81的厚度，则需要使缺口811的深度大于顶层基板81的厚度，此时，缺口811在纵向方向上会延伸至底层基板82，其结构可以如图11所示，此处不再赘述。
由于金属层85并未裸露出来，因此在缺口811的底部内表面可以设置导电片813，并将激光芯片54的下表面贴附在该导电片813上，以实现激光芯片54的接地连接。
需要说明的是，本申请实施例涉及的缺口811可以具有不同的形状和形式，例如，可以是一体成型的、单独容纳激光芯片54或者同时容纳激光芯片54及监控光探测器84的异形空间区域，也可以是包括分别用于容纳激光芯片54和监控光探测器84的两个独立的空间区域。
图12为本申请光发射次模块一种可能的实现方式。如图12所示，缺口811分为两个区域，分别为相连通的第一容置区8111和第二容置区8112，其中，激光芯片54设置在第一容置区8111，监控光探测器84设置在第二容置区8112。
由于监控光探测器84也需要接收激光芯片54发出的光，以便实现光功率监控功能，因此，第一容置区8111和第二容置区8112相连通，以使激光芯片54发出的光可以直接经过连通的区域射向监控光探测器84。
即，在图12所示的实现方式中，缺口811提供一个一体成型的容纳空间，该容纳空间包括两个区域，即上述第一容置区8111和第二容置区8112。激光芯片54和监控光探测器84同时位于该一体空间中，且分别位于前述的两个区域。在本实施例中，第一容置区8111和第二容置区8112是自然连通的，这一连通的区域恰好相当于一个透光口，使激光芯片54发出的光束可以穿过该透光口以被监控光探测器84接收。
图12所示的实现方式中，缺口811形状简单，不存在多余侧壁，不仅为器件的封装提供更多的可利用空间，而且在一定程度上减轻顶层基板81的重量。并且如果缺口811的深度大于顶层基板81的厚度，还能减轻底层基板82的重量，有利于CoC结构的质轻化。另外，简单的缺口形状，也更加便于产品的加工。
图13为本申请光发射次模块的另一种可能的实现方式。如图13所示，缺口811可以包括第一缺口8113和第二缺口8114；激光芯片54设置在第一缺口8113中，监控光探测器84设置在第二缺口8114中。
第一缺口8113和第二缺口8114之间实体上设有透光口8115，以使监控光探测器84接收到激光芯片54发出的光。
在图13所示的实现方式中，缺口811提供两个相互独立的容纳空间，即上述第一缺口8113和第二缺口8114。激光芯片54和监控光探测器84分别位于相应的容纳空间中。由于第一缺口8113和第二缺口8114之间存在一个由顶层基板81的实体所形成的隔板， 因此，需要在该隔板上开设透光口81115，该透光口8115可以为一个通孔，从而使激光芯片54发出的光束经透光口8115射向监控光探测器84，被监控光探测器84接收，进而实现光功率监控功能。
在本实现方式中，第一缺口8113和第二缺口8114的横截面可以分别具有与激光芯片54和监控光探测器84的横截面相同的形状，第一缺口8113和第二缺口8114所提供的空间可以略大于激光芯片54和监控光探测器84的体积，以使缺口811的侧壁可以与激光芯片54和监控光探测器84实现间隙配合。
在图13所示的实现方式中，缺口811所提供的两个相互独立的容纳空间被充分利用，缺口811的侧壁与激光芯片54和监控光探测器84的间隙配合，可以提高激光芯片54和监控光探测器84的封装稳定性。并且，由于缺口811占用较小的顶层基板81的空间，这种更为紧凑的结构设计，有利于减小CoC结构的体积。
另外，光发射次模块中可以包括多个激光芯片54，多个激光芯片54发射的多个波长的光信号合并成一路光后，通过光纤传出光模块进入外部通信光纤中。根据传输设计以及激光芯片54的特性，光发射次模块中还可以包括用于调节温度的电子器件，例如半导体制冷器TEC，该电子器件用于改变激光芯片54的温度。光发射次模块中还可以包括用于温度检测温度传感器；光发射次模块中还可以包括用于提供CoC结构的附着平台的衬底，衬底可以根据实际需要制作成不同的形状结构。
由以上技术方案可知，本申请实施例提供一种光模块，光模块包括壳体221以及位于所述壳体221内部的顶层基板81、底层基板82、透镜55和激光芯片54；顶层基板81固定在底层基板82上。由于顶层基板81设有缺口811，激光芯片54位于该缺口811中，并固定在底层基板82的上表面，因此能够降低激光芯片54上表面相对于顶层基板81上表面的高度。又由于顶层基板81的上表面设有电路56，激光芯片54与该电路56打线连接，因此能够缩短激光芯片54与电路56的打线长度。此外，由于所述缺口811向透镜55一侧的边缘延伸，使得激光芯片54发出的光束可以通过所述缺口811被透镜55接收，因而实还可以现高频信号传输。综上所述，本申请实施例提供的光模块，可以缩短激光芯片54的打线长度，优化光模块的高频性能。
本说明书中实施例之间相同相似的部分互相参见即可。需要说明的是，在本文中，诸如“第一”和“第二”等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。
本领域技术人员在考虑说明书及实践这里公开的申请后，将容易想到本申请的其它实施方案。本申请旨在涵盖本申请的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本申请的一般性原理并包括本申请未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本申请的真正范围和精神由下面的权利要求指出。
应当理解的是，本申请并不局限于上面已经描述并在附图中示出的精确结构，并且可以在不脱离其范围进行各种修改和改变。本申请的范围仅由所附的权利要求来限制。

Claims (6)

  1. 一种光模块，其特征在于，包括壳体以及位于所述壳体内部的顶层基板、底层基板、透镜和激光芯片；
    所述顶层基板固定在所述底层基板上；
    所述顶层基板设有缺口；所述激光芯片位于所述缺口中，并固定在所述底层基板的上表面上；所述缺口的开口向所述透镜方向延伸，以使所述激光芯片发出的光束通过所述缺口被所述透镜接收；
    所述顶层基板的上表面设有电路，所述激光芯片与所述电路打线连接。
  2. 根据权利要求1所述的光模块，其特征在于，所述底层基板的上表面设有金属层；所述激光芯片的下表面与所述金属层连接，以固定在所述底层基板上表面。
  3. 根据权利要求2所述的光模块，其特征在于，所述顶层基板设置有过孔，所述过孔连接所述金属层与所述电路的地。
  4. 根据权利要求1-3任一项所述的光模块，其特征在于，还包括监控光探测器；所述监控光探测器位于所述缺口中，并固定在所述底层基板的上表面；所述监控光探测器与所述电路打线连接。
  5. 根据权利要求1-3任一项所述的光模块，其特征在于，所述激光芯片的上表面与所述顶层基板的上表面相平齐。
  6. 根据权利要求4所述的光模块，其特征在于，所述缺口包括第一缺口和第二缺口；所述激光芯片位于所述第一缺口中，所述监控光探测器位于所述第二缺口中；所述第一缺口与第二缺口之间的隔板上设有透光口。
PCT/CN2020/073945 2019-02-01 2020-01-23 一种光模块 Ceased WO2020156476A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910104934.2A CN111522102A (zh) 2019-02-01 2019-02-01 一种光模块
CN201910104934.2 2019-02-01

Publications (1)

Publication Number Publication Date
WO2020156476A1 true WO2020156476A1 (zh) 2020-08-06

Family

ID=71840878

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/CN2019/128491 Ceased WO2020155965A1 (zh) 2019-02-01 2019-12-26 一种光模块
PCT/CN2020/073945 Ceased WO2020156476A1 (zh) 2019-02-01 2020-01-23 一种光模块

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/128491 Ceased WO2020155965A1 (zh) 2019-02-01 2019-12-26 一种光模块

Country Status (2)

Country Link
CN (1) CN111522102A (zh)
WO (2) WO2020155965A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114488420A (zh) * 2020-10-23 2022-05-13 青岛海信宽带多媒体技术有限公司 一种光模块
CN114637079B (zh) * 2020-12-16 2023-07-14 青岛海信宽带多媒体技术有限公司 一种光模块
CN114791652A (zh) * 2021-01-26 2022-07-26 青岛海信宽带多媒体技术有限公司 一种光模块
CN112965190A (zh) * 2021-04-12 2021-06-15 青岛海信宽带多媒体技术有限公司 一种光模块
WO2022242309A1 (zh) * 2021-05-17 2022-11-24 青岛海信宽带多媒体技术有限公司 光模块
CN113376768A (zh) * 2021-05-28 2021-09-10 武汉英飞光创科技有限公司 具有带尾纤适配器的光模块及其组装方法
WO2022247947A1 (zh) * 2021-05-28 2022-12-01 青岛海信宽带多媒体技术有限公司 一种光模块
CN113359248B (zh) * 2021-06-02 2022-11-15 青岛海信宽带多媒体技术有限公司 一种光模块
WO2022262551A1 (zh) * 2021-06-17 2022-12-22 青岛海信宽带多媒体技术有限公司 一种光模块
CN113703104B (zh) * 2021-08-19 2023-02-14 武汉昱升光电股份有限公司 一种蝶形soa器件及生产耦合方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6227723B1 (en) * 1999-06-30 2001-05-08 Kyocera Corporation Substrate for mounting an optical component and optical module provided with the same
CN103135182A (zh) * 2011-12-02 2013-06-05 鸿富锦精密工业（深圳）有限公司 光学元件封装结构及其封装方法
CN104836619A (zh) * 2015-03-30 2015-08-12 青岛海信宽带多媒体技术有限公司 一种光器件
CN108761668A (zh) * 2018-05-14 2018-11-06 青岛海信宽带多媒体技术有限公司 一种光模块

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05308107A (ja) * 1991-07-01 1993-11-19 Sumitomo Electric Ind Ltd 半導体装置及びその製作方法
DE19840935B4 (de) * 1998-09-08 2004-06-03 Hell Gravure Systems Gmbh Abschlußstück für Lichtleitfasern
CN100543982C (zh) * 2006-11-01 2009-09-23 南茂科技股份有限公司 具有非对称式导线架的多芯片堆叠封装结构
CN102629599B (zh) * 2012-04-06 2014-09-03 天水华天科技股份有限公司 四边扁平无引脚封装件及其生产方法
CN103984062B (zh) * 2013-02-08 2015-10-14 源杰科技股份有限公司 光电模块及光电模块的封装工艺
CN103337483B (zh) * 2013-05-14 2016-07-06 天水华天科技股份有限公司 一种超薄型vsop封装件及其生产方法
TWI521248B (zh) * 2014-08-07 2016-02-11 光興國際股份有限公司 光學收發器
CN106373925B (zh) * 2016-11-30 2018-07-20 济南市半导体元件实验所 一种抗大电流冲击高可靠表面贴装的二极管及其制备方法
CN109155292B (zh) * 2018-08-16 2022-06-21 深圳市汇顶科技股份有限公司 光学传感模组及其制作方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6227723B1 (en) * 1999-06-30 2001-05-08 Kyocera Corporation Substrate for mounting an optical component and optical module provided with the same
CN103135182A (zh) * 2011-12-02 2013-06-05 鸿富锦精密工业（深圳）有限公司 光学元件封装结构及其封装方法
CN104836619A (zh) * 2015-03-30 2015-08-12 青岛海信宽带多媒体技术有限公司 一种光器件
CN108761668A (zh) * 2018-05-14 2018-11-06 青岛海信宽带多媒体技术有限公司 一种光模块

Also Published As

Publication number Publication date
CN111522102A (zh) 2020-08-11
WO2020155965A1 (zh) 2020-08-06

Similar Documents

Publication Publication Date Title
WO2020155965A1 (zh) 一种光模块
CN100521887C (zh) 具有陶瓷馈通头部组件的发射器光学子组件中的激光监视和控制
US6869231B2 (en) Transmitters, receivers, and transceivers including an optical bench
CN211603627U (zh) 一种光模块
CN112838897B (zh) 一种光模块
US12468102B2 (en) Optical module
US11994726B2 (en) Optical module
CN219039427U (zh) 多通道光收发组件及光模块
CN212031793U (zh) 一种光模块
WO2020187149A1 (zh) 光模块
CN114647038B (zh) 一种光模块
CN116243437A (zh) 多速率多通道的收发一体式封装光器件
CN114200596A (zh) 一种光模块
CN115016074B (zh) 一种光模块
CN112929092B (zh) 一种光模块
CN114200603B (zh) 一种光模块
CN116560013A (zh) 多通道光器件及光模块
CN114167554B (zh) 一种光模块
WO2022262551A1 (zh) 一种光模块
WO2025148409A1 (zh) 光模块
CN121986279A (zh) 光模块
CN220085123U (zh) 光模块
WO2024199417A1 (zh) 一种光收发组件、光模块和通信设备
CN115016073B (zh) 一种光模块
CN118732184A (zh) 一种光模块

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20749440

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20749440

Country of ref document: EP

Kind code of ref document: A1