WO2020155357A1 - Metal mask device - Google Patents

Metal mask device Download PDF

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Publication number
WO2020155357A1
WO2020155357A1 PCT/CN2019/080193 CN2019080193W WO2020155357A1 WO 2020155357 A1 WO2020155357 A1 WO 2020155357A1 CN 2019080193 W CN2019080193 W CN 2019080193W WO 2020155357 A1 WO2020155357 A1 WO 2020155357A1
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WO
WIPO (PCT)
Prior art keywords
metal mask
mask device
pattern layer
metal pattern
outer frame
Prior art date
Application number
PCT/CN2019/080193
Other languages
French (fr)
Chinese (zh)
Inventor
姜亮
Original Assignee
深圳市华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 深圳市华星光电半导体显示技术有限公司 filed Critical 深圳市华星光电半导体显示技术有限公司
Publication of WO2020155357A1 publication Critical patent/WO2020155357A1/en

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation

Definitions

  • This application relates to the display field, and in particular to a metal mask device.
  • an evaporation process is usually used to form the organic light-emitting layer of the OLED device in the OLED display panel.
  • a mask with a pattern corresponding to the film layer is attached to the side to be vaporized on the substrate of the display panel and placed above the vapor deposition source.
  • the vapor deposition material in the source is heated to form a vapor that is dispersed on the substrate and is deposited on the substrate to form a film on the substrate.
  • the existing mask usually uses a metal mask, and the vapor deposition material is a high-temperature gas. Therefore, in the evaporation process, the mask is affected by the high-temperature gas and thermally expands, causing the opening of the mask to be misaligned with the position of the pixel unit of the target substrate, causing the target display panel to produce color mixing defects and reducing the resolution of the display panel. Rate and yield.
  • the present application provides a metal mask device to solve the technical problem of the color mixing of the target display panel caused by the thermal expansion of the existing metal mask device.
  • This application proposes a metal mask device, which includes:
  • An outer frame including a hollow area
  • the metal mask layer located in the hollow area includes:
  • the metal pattern layer includes at least one first opening, the shape of the first opening is the same as the shape of the pixel unit in the target substrate,
  • the metal pattern layer further includes a first protrusion located in the first opening, and the orthographic projection surface of the first protrusion on the target substrate does not overlap the pixel unit;
  • the metal pattern layer is close to the target substrate, and the heat insulation layer is away from the target substrate.
  • the material of the heat insulation layer is silica.
  • the heat insulation layer further includes a second opening
  • the second opening has the same shape as the first opening.
  • the distance between the outer boundary of the pixel unit and the outer boundary of the first opening on the orthographic projection surface of the target substrate is a, and a is greater than zero.
  • the metal mask device further includes at least two support bars in a slat shape
  • a part of the support bars straddle the hollow area of the outer frame along the first direction;
  • the remaining part of the support bars are arranged across the hollow area of the outer frame along the second direction to form a support net;
  • Both ends of the support bar are respectively connected with the outer frame;
  • the first direction crosses the second direction.
  • the outer frame also includes a first groove on the first surface
  • the support bar is embedded in the first groove and supports the metal pattern layer on the hollow area.
  • the outer frame further includes a second groove on the side of the hollow cavity
  • the metal pattern layer is embedded in the second groove.
  • the metal pattern layer further includes a continuous hollow cavity
  • the hollow cavity is filled with cooling fluid.
  • the metal pattern layer further includes a first inlet and a first outlet
  • the cooling liquid flows into the hollow cavity through the first inlet, and flows out of the hollow cavity through the first outlet, to cool the metal pattern layer.
  • the first inlet and the first outlet are located on the same side or different sides of the metal pattern layer.
  • This application also proposes a metal mask device, which includes:
  • An outer frame including a hollow area
  • the metal mask layer located in the hollow area includes:
  • the metal pattern layer includes at least one first opening, the shape of the first opening is the same as the shape of the pixel unit in the target substrate;
  • the metal pattern layer is close to the target substrate, and the heat insulation layer is away from the target substrate.
  • the material of the heat insulation layer is silica.
  • the heat insulation layer further includes a second opening
  • the second opening has the same shape as the first opening.
  • the distance between the outer boundary of the pixel unit and the outer boundary of the first opening on the orthographic projection surface of the target substrate is a, and a is greater than zero.
  • the metal mask device further includes at least two support bars in a slat shape
  • a part of the support bars straddle the hollow area of the outer frame along the first direction;
  • the remaining part of the support bars are arranged across the hollow area of the outer frame along the second direction to form a support net;
  • Both ends of the support bar are respectively connected with the outer frame;
  • the first direction crosses the second direction.
  • the outer frame also includes a first groove on the first surface
  • the support bar is embedded in the first groove and supports the metal pattern layer on the hollow area.
  • the outer frame further includes a second groove on the side of the hollow cavity
  • the metal pattern layer is embedded in the second groove.
  • the metal pattern layer further includes a continuous hollow cavity
  • the hollow cavity is filled with cooling fluid.
  • the metal pattern layer further includes a first inlet and a first outlet
  • the cooling liquid flows into the hollow cavity through the first inlet, and flows out of the hollow cavity through the first outlet, to cool the metal pattern layer.
  • the first inlet and the first outlet are located on the same side or different sides of the metal pattern layer.
  • a heat insulation layer is provided on the surface of the existing metal mask device to avoid the color mixing of the target display panel due to thermal expansion of the metal mask device.
  • Figure 1 is a structural diagram of the metal mask device of this application.
  • Figure 2 is the first structure diagram of the metal mask layer of this application.
  • FIG. 3 is a second structure diagram of the metal mask layer of this application.
  • FIG. 1 is a structural diagram of a metal mask device of the present application.
  • the metal mask device includes an outer frame 10 and a metal mask layer 20 located in the outer frame 10.
  • the outer frame 10 includes a hollow area 110.
  • the outer frame 10 has a back shape.
  • the outer frame 10 includes a first side wall 101, a second side wall 102, a third side wall 103 and a fourth side wall 104 connected vertically.
  • the metal mask device may also include at least two support bars 30 in the shape of slats.
  • Part of the support bar 30 is arranged across the hollow area 110 of the outer frame 10 in the first direction, and the remaining part of the support bar 30 is arranged across the hollow area 110 of the outer frame 10 in the second direction to form a support network.
  • both ends of the support bar 30 are connected to the first side wall 101, the second side wall 102, the third side wall 103, and the first side wall of the outer frame 10, respectively.
  • the four side walls 104 are connected.
  • the first direction crosses the second direction.
  • the first direction is perpendicular to the second direction.
  • the outer frame 10 also includes a first groove 120 on the first surface.
  • the first surface is the side of the outer frame 10 close to the target substrate 40.
  • the first groove 120 is located on the first side wall 101, the second side wall 102, the third side wall 103 and the fourth side wall 104 and is close to the hollow area 110.
  • the metal mask device includes a first support bar 301 arranged along a first direction and a second support bar 302 arranged along a second direction.
  • the first support bar 301 is embedded in the first groove 120 on the first side wall 101 and the third side wall 103.
  • the first direction is parallel to the second side wall 102 and the fourth side wall 104.
  • the second support bar 302 is embedded in the first groove 120 on the second side wall 102 and the fourth side wall 104.
  • the second direction is parallel to the first side wall 101 and the third side wall 103.
  • the depth of the first groove 120 is less than the thickness of the outer frame 10.
  • the metal mask layer 20 is located in the hollow area 110.
  • the metal mask layer 20 is located on the support bar 30.
  • the elastic deformation of the support bar 30 is greater than the elastic deformation of the metal mask layer 20.
  • the supporting net formed by the cross-arrangement of the supporting bars 30 can alleviate the excessive deformation of the metal mask layer 20, which may cause errors in the processing of the target substrate 40.
  • the metal mask layer 20 may be fixedly connected to the outer frame 10 by welding. In this embodiment, the area of the metal mask layer 20 is not larger than the
  • the outer frame 10 further includes a second groove 130 located on the side of the hollow cavity.
  • the metal pattern layer is embedded in the second groove 130.
  • the second groove 130 is located on the support bar 30.
  • the second groove 130 may be provided on any opposite sidewalls, such as the first sidewall 101 and the third sidewall 103, or the second sidewall 102 and the fourth sidewall 104. or
  • the second groove 130 may be provided on the first side wall 101, the second side wall 102, the third side wall 103, and the fourth side wall 104.
  • the depth of the second groove 130 may be designed according to the area size of the metal mask layer 20, which is not described in detail in this application.
  • the support bar 30 can be fixedly connected to the outer frame 10 through the second groove 130 and welding at the same time.
  • the arrangement of the second groove 130 may be determined according to specific conditions.
  • FIG. 2 is a first structure diagram of the metal mask layer 20 of this application.
  • the metal mask layer 20 provided in the present application can be applied to an evaporation device to manufacture a functional film layer in a display panel by an evaporation process, for example, an organic light-emitting layer of an OLED device in an OLED display panel.
  • the metal mask layer 20 includes a metal pattern layer 210.
  • the metal pattern layer 210 includes at least one first opening 211, and the first opening 211 corresponds to the pixel unit of the target substrate 40.
  • the shape of the first opening 211 is the same as the shape of the pixel unit 410 in the target substrate 40.
  • the vapor deposition material is generally a high-temperature gas
  • the metal pattern layer 210 is a metal material, so the metal expands when heated, causing the area of the first opening 211 to shrink.
  • the specific expansion amount of the metal pattern layer 210 is related to the metal material and the heating temperature.
  • the specific expansion amount of the metal pattern layer 210 can be calculated according to numerical simulation software, such as Ansys.
  • the metal pattern layer 210 further includes a first protrusion 212 located in the first opening 211.
  • the orthographic projection surface of the first protrusion 212 on the target substrate 40 does not overlap with the pixel unit 410.
  • the metal pattern layer 210 is processed, the pattern in the first opening 211 cannot be completely removed. Therefore, the first protrusion 212 needs to be considered when performing the vapor deposition process.
  • the metal mask layer 20 further includes a heat insulation layer 220.
  • the heat insulation layer 220 is located on the metal pattern layer 210. That is, the heat insulation layer 220 is located on the side of the metal pattern layer 210 away from the target substrate 40.
  • the heat insulation layer 220 is located between the support bar 30 and the metal pattern layer 210.
  • the metal pattern layer 210 is close to the target substrate 40, and the heat insulation layer 220 is far away from the target substrate 40.
  • the material of the thermal insulation layer 220 may be silica
  • the heat insulation layer 220 further includes at least one second opening 221.
  • the second opening 221 corresponds to the first opening 211.
  • the shape of the second opening 221 may be the same as the shape of the first opening 211.
  • a heat insulation layer 220 is provided on the surface of the metal pattern layer 210 of the present application to prevent the heat of high temperature gas from being transferred to the metal pattern layer 210 to expand, avoid the defects of color mixing during the evaporation process of the target substrate 40, and improve The resolution and yield of the display panel.
  • FIG. 3 is a second structure diagram of the metal mask layer 20 of this application.
  • the metal pattern layer 210 also includes a continuous hollow cavity 230.
  • the hollow cavity 230 is filled with a cooling fluid.
  • the cooling fluid may be cryogenic liquid or cryogenic air.
  • the metal pattern layer 210 further includes a first inlet and a first outlet.
  • the cooling liquid flows into the hollow cavity 230 through the first inlet, and flows out of the hollow cavity 230 through the first outlet, so that the metal pattern layer 210 is cooled.
  • the first inlet and the first outlet may be located on the same side or different sides of the metal pattern layer 210.
  • the cooling liquid can form a circulating cooling system in the hollow cavity 230 to take away the high temperature in the metal pattern layer 210 and keep the metal pattern layer 210 at a certain temperature. No expansion occurs, and the defect of color mixing during the evaporation process of the target substrate 40 is avoided.
  • the distance between the outer boundary of the pixel unit 410 and the outer boundary of the first opening 211 in the metal pattern layer 210 on the orthographic projection surface of the target substrate 40 is a, and a is greater than zero.
  • the present application proposes a metal mask device, including an outer frame, the outer frame includes a hollow area; the metal mask layer in the hollow area includes: a metal pattern layer, including at least one first opening, The shape of the first opening is the same as the shape of the pixel unit in the target substrate; and the heat insulation layer on the metal pattern layer; when the target substrate is processed, the metal pattern layer is close to the target substrate, so The heat insulation layer is far away from the target substrate.
  • a heat insulation layer is provided on the surface of the existing metal mask device to avoid the color mixing of the target display panel due to thermal expansion of the metal mask device.

Abstract

Disclosed is a metal mask device, comprising an outer frame (10), which outer frame (10) comprises a hollow area (110); and comprising a metal mask layer (20) located in the hollow area (110). The metal mask layer comprises a metal pattern layer (210) and a heat insulation layer (220) located on the metal pattern layer (210), wherein the metal pattern layer comprises at least one first opening (211), and the shape of the first opening (211) is the same as that of pixel units in a target substrate (40).

Description

金属掩膜装置Metal mask device 技术领域Technical field
本申请涉及显示领域,特别涉及一种金属掩膜装置。This application relates to the display field, and in particular to a metal mask device.
背景技术Background technique
在有机发光二极管(Organic Light Emitting Diode,OLED)显示面板的制造过程中,通常采用蒸镀工艺形成OLED显示面板中OLED器件的有机发光层。采用蒸镀工艺制造显示面板中的膜层时,通常将具有对应于膜层图案的掩膜版与显示面板的基板上待蒸镀的一侧贴合,并置于蒸镀源上方,蒸镀源中的蒸镀材料受热形成蒸气散至基板上,并沉积在基板上,以在基板上形成膜层。In the manufacturing process of an Organic Light Emitting Diode (OLED) display panel, an evaporation process is usually used to form the organic light-emitting layer of the OLED device in the OLED display panel. When the film layer in the display panel is manufactured by the vapor deposition process, usually a mask with a pattern corresponding to the film layer is attached to the side to be vaporized on the substrate of the display panel and placed above the vapor deposition source. The vapor deposition material in the source is heated to form a vapor that is dispersed on the substrate and is deposited on the substrate to form a film on the substrate.
现有的掩膜版通常采用金属掩膜版,而蒸镀材料为高温气体。因此在蒸镀工艺中,掩膜版受到高温气体的影响,受热膨胀,使得掩膜版的开口与目标基板像素单元的位置发生错位,导致目标显示面板产生混色的缺陷,降低了显示面板的分辨率及良率。The existing mask usually uses a metal mask, and the vapor deposition material is a high-temperature gas. Therefore, in the evaporation process, the mask is affected by the high-temperature gas and thermally expands, causing the opening of the mask to be misaligned with the position of the pixel unit of the target substrate, causing the target display panel to produce color mixing defects and reducing the resolution of the display panel. Rate and yield.
技术问题technical problem
本申请提供一种金属掩膜装置,以解决现有金属掩膜装置因受热膨胀而导致目标显示面板混色的技术问题。The present application provides a metal mask device to solve the technical problem of the color mixing of the target display panel caused by the thermal expansion of the existing metal mask device.
技术解决方案Technical solutions
本申请提出了一种金属掩膜装置,其包括:This application proposes a metal mask device, which includes:
外框,所述外框包括中空区;An outer frame, the outer frame including a hollow area;
位于所述中空区内的金属掩膜层,包括:The metal mask layer located in the hollow area includes:
金属图案层,包括至少一第一开口,所述第一开口的形状与目标基板中像素单元的形状相同,The metal pattern layer includes at least one first opening, the shape of the first opening is the same as the shape of the pixel unit in the target substrate,
其中,所述金属图案层还包括位于所述第一开口内的第一凸起,所述第一凸起在所述目标基板上的正投影面与所述像素单元不重合;以及Wherein, the metal pattern layer further includes a first protrusion located in the first opening, and the orthographic projection surface of the first protrusion on the target substrate does not overlap the pixel unit; and
位于所述金属图案层上的隔热层;A heat insulation layer on the metal pattern layer;
当对所述目标基板进行加工时,所述金属图案层靠近所述目标基板,所述隔热层远离所述目标基板。When the target substrate is processed, the metal pattern layer is close to the target substrate, and the heat insulation layer is away from the target substrate.
在本申请的金属掩膜装置中,In the metal mask device of the present application,
所述隔热层的材料为二氧化硅。The material of the heat insulation layer is silica.
在本申请的金属掩膜装置中,In the metal mask device of the present application,
所述隔热层还包括第二开口;The heat insulation layer further includes a second opening;
所述第二开口与所述第一开口的形状相同。The second opening has the same shape as the first opening.
在本申请的金属掩膜装置中,In the metal mask device of the present application,
所述像素单元外边界与所述第一开口在所述目标基板的正投影面的外边界的间距为a,a大于0。The distance between the outer boundary of the pixel unit and the outer boundary of the first opening on the orthographic projection surface of the target substrate is a, and a is greater than zero.
在本申请的金属掩膜装置中,In the metal mask device of the present application,
所述金属掩膜装置还包括呈板条状的至少两个支撑条;The metal mask device further includes at least two support bars in a slat shape;
部分所述支撑条沿第一方向跨设于所述外框的中空区;A part of the support bars straddle the hollow area of the outer frame along the first direction;
其余部分所述支撑条沿第二方向跨设于所述外框的中空区,以构成支撑网;The remaining part of the support bars are arranged across the hollow area of the outer frame along the second direction to form a support net;
所述支撑条的两端分别与所述外框连接;Both ends of the support bar are respectively connected with the outer frame;
所述第一方向与所述第二方向交叉。The first direction crosses the second direction.
在本申请的金属掩膜装置中,In the metal mask device of the present application,
所述外框还包括位于第一表面上的第一凹槽;The outer frame also includes a first groove on the first surface;
所述支撑条内嵌于所述第一凹槽内,并将所述金属图案层支撑于所述中空区上。The support bar is embedded in the first groove and supports the metal pattern layer on the hollow area.
在本申请的金属掩膜装置中,In the metal mask device of the present application,
所述外框还包括位于所述中空腔侧面的第二凹槽;The outer frame further includes a second groove on the side of the hollow cavity;
所述金属图案层内嵌于所述第二凹槽内。The metal pattern layer is embedded in the second groove.
在本申请的金属掩膜装置中,In the metal mask device of the present application,
所述金属图案层内还包括连续的中空腔体;The metal pattern layer further includes a continuous hollow cavity;
所述中空腔体内填充有冷却流体。The hollow cavity is filled with cooling fluid.
在本申请的金属掩膜装置中,In the metal mask device of the present application,
所述金属图案层还包括第一进口和第一出口;The metal pattern layer further includes a first inlet and a first outlet;
所述冷却液通过所述第一进口流入所述中空腔体,并通过所述第一出口流出所述中空腔体,对所述金属图案层进行降温处理。The cooling liquid flows into the hollow cavity through the first inlet, and flows out of the hollow cavity through the first outlet, to cool the metal pattern layer.
在本申请的金属掩膜装置中,In the metal mask device of the present application,
所述第一进口及所述第一出口位于所述金属图案层的同一侧或不同侧。The first inlet and the first outlet are located on the same side or different sides of the metal pattern layer.
本申请还提出了一种金属掩膜装置,其包括:This application also proposes a metal mask device, which includes:
外框,所述外框包括中空区;An outer frame, the outer frame including a hollow area;
位于所述中空区内的金属掩膜层,包括:The metal mask layer located in the hollow area includes:
金属图案层,包括至少一第一开口,所述第一开口的形状与目标基板中像素单元的形状相同;以及The metal pattern layer includes at least one first opening, the shape of the first opening is the same as the shape of the pixel unit in the target substrate; and
位于所述金属图案层上的隔热层;A heat insulation layer on the metal pattern layer;
当对所述目标基板进行加工时,所述金属图案层靠近所述目标基板,所述隔热层远离所述目标基板。When the target substrate is processed, the metal pattern layer is close to the target substrate, and the heat insulation layer is away from the target substrate.
在本申请的金属掩膜装置中,In the metal mask device of the present application,
所述隔热层的材料为二氧化硅。The material of the heat insulation layer is silica.
在本申请的金属掩膜装置中,In the metal mask device of the present application,
所述隔热层还包括第二开口;The heat insulation layer further includes a second opening;
所述第二开口与所述第一开口的形状相同。The second opening has the same shape as the first opening.
在本申请的金属掩膜装置中,In the metal mask device of the present application,
所述像素单元外边界与所述第一开口在所述目标基板的正投影面的外边界的间距为a,a大于0。The distance between the outer boundary of the pixel unit and the outer boundary of the first opening on the orthographic projection surface of the target substrate is a, and a is greater than zero.
在本申请的金属掩膜装置中,In the metal mask device of the present application,
所述金属掩膜装置还包括呈板条状的至少两个支撑条;The metal mask device further includes at least two support bars in a slat shape;
部分所述支撑条沿第一方向跨设于所述外框的中空区;A part of the support bars straddle the hollow area of the outer frame along the first direction;
其余部分所述支撑条沿第二方向跨设于所述外框的中空区,以构成支撑网;The remaining part of the support bars are arranged across the hollow area of the outer frame along the second direction to form a support net;
所述支撑条的两端分别与所述外框连接;Both ends of the support bar are respectively connected with the outer frame;
所述第一方向与所述第二方向交叉。The first direction crosses the second direction.
在本申请的金属掩膜装置中,In the metal mask device of the present application,
所述外框还包括位于第一表面上的第一凹槽;The outer frame also includes a first groove on the first surface;
所述支撑条内嵌于所述第一凹槽内,并将所述金属图案层支撑于所述中空区上。The support bar is embedded in the first groove and supports the metal pattern layer on the hollow area.
在本申请的金属掩膜装置中,In the metal mask device of the present application,
所述外框还包括位于所述中空腔侧面的第二凹槽;The outer frame further includes a second groove on the side of the hollow cavity;
所述金属图案层内嵌于所述第二凹槽内。The metal pattern layer is embedded in the second groove.
在本申请的金属掩膜装置中,In the metal mask device of the present application,
所述金属图案层内还包括连续的中空腔体;The metal pattern layer further includes a continuous hollow cavity;
所述中空腔体内填充有冷却流体。The hollow cavity is filled with cooling fluid.
在本申请的金属掩膜装置中,In the metal mask device of the present application,
所述金属图案层还包括第一进口和第一出口;The metal pattern layer further includes a first inlet and a first outlet;
所述冷却液通过所述第一进口流入所述中空腔体,并通过所述第一出口流出所述中空腔体,对所述金属图案层进行降温处理。The cooling liquid flows into the hollow cavity through the first inlet, and flows out of the hollow cavity through the first outlet, to cool the metal pattern layer.
在本申请的金属掩膜装置中,In the metal mask device of the present application,
所述第一进口及所述第一出口位于所述金属图案层的同一侧或不同侧。The first inlet and the first outlet are located on the same side or different sides of the metal pattern layer.
有益效果Beneficial effect
本申请通过在现有金属掩膜装置的表面设置一隔热层,避免金属掩膜装置因受热膨胀而导致目标显示面板混色。In this application, a heat insulation layer is provided on the surface of the existing metal mask device to avoid the color mixing of the target display panel due to thermal expansion of the metal mask device.
附图说明Description of the drawings
为了更清楚地说明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单介绍,显而易见地,下面描述中的附图仅仅是发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to explain the embodiments or the technical solutions in the prior art more clearly, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are merely inventions For some embodiments, those of ordinary skill in the art can obtain other drawings based on these drawings without creative work.
图1为本申请金属掩膜装置的结构图;Figure 1 is a structural diagram of the metal mask device of this application;
图2为本申请金属掩膜层第一种结构图;Figure 2 is the first structure diagram of the metal mask layer of this application;
图3为本申请金属掩膜层第二种结构图。FIG. 3 is a second structure diagram of the metal mask layer of this application.
本发明的实施方式Embodiments of the invention
以下各实施例的说明是参考附加的图示,用以例示本申请可用以实施的特定实施例。本申请所提到的方向用语,例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等,仅是参考附加图式的方向。因此,使用的方向用语是用以说明及理解本申请,而非用以限制本申请。在图中,结构相似的单元是用以相同标号表示。The description of the following embodiments refers to the attached drawings to illustrate specific embodiments that can be implemented in this application. The directional terms mentioned in this application, such as [Top], [Bottom], [Front], [Back], [Left], [Right], [Inner], [Outer], [Side], etc., are for reference only The direction of the additional schema. Therefore, the directional terms used are used to illustrate and understand the application, rather than to limit the application. In the figure, units with similar structures are indicated by the same reference numerals.
请参阅图1,图1为本申请金属掩膜装置的结构图。Please refer to FIG. 1. FIG. 1 is a structural diagram of a metal mask device of the present application.
所述金属掩膜装置包括外框10和位于所述外框10内的金属掩膜层20。The metal mask device includes an outer frame 10 and a metal mask layer 20 located in the outer frame 10.
外框10,所述外框10包括中空区110。The outer frame 10 includes a hollow area 110.
在一种实施例中,所述外框10呈回字型。所述外框10包括垂直连接的第一侧壁101、第二侧壁102、第三侧壁103及第四侧壁104。In an embodiment, the outer frame 10 has a back shape. The outer frame 10 includes a first side wall 101, a second side wall 102, a third side wall 103 and a fourth side wall 104 connected vertically.
所述金属掩膜装置还可以包括呈板条状的至少两个支撑条30。The metal mask device may also include at least two support bars 30 in the shape of slats.
部分所述支撑条30沿第一方向跨设于所述外框10的中空区110,其余部分所述支撑条30沿第二方向跨设于所述外框10的中空区110,以构成支撑网。Part of the support bar 30 is arranged across the hollow area 110 of the outer frame 10 in the first direction, and the remaining part of the support bar 30 is arranged across the hollow area 110 of the outer frame 10 in the second direction to form a support network.
在一种实施例中,所述支撑条30的两端分别与所述外框10的所述第一侧壁101、所述第二侧壁102、所述第三侧壁103及所述第四侧壁104连接。In an embodiment, both ends of the support bar 30 are connected to the first side wall 101, the second side wall 102, the third side wall 103, and the first side wall of the outer frame 10, respectively. The four side walls 104 are connected.
在一种实施例中,所述第一方向与所述第二方向交叉。In an embodiment, the first direction crosses the second direction.
在一种实施例中,所述第一方向与所述第二方向垂直。In an embodiment, the first direction is perpendicular to the second direction.
所述外框10还包括位于第一表面上的第一凹槽120。The outer frame 10 also includes a first groove 120 on the first surface.
所述第一表面为所述外框10靠近目标基板40的一侧。The first surface is the side of the outer frame 10 close to the target substrate 40.
所述第一凹槽120位于所述第一侧壁101、所述第二侧壁102、所述第三侧壁103及所述第四侧壁104上,且靠近所述中空区110。The first groove 120 is located on the first side wall 101, the second side wall 102, the third side wall 103 and the fourth side wall 104 and is close to the hollow area 110.
所述金属掩膜装置包括沿第一方向设置的第一支撑条301及沿第二方向设置的第二支撑条302。The metal mask device includes a first support bar 301 arranged along a first direction and a second support bar 302 arranged along a second direction.
在一种实施例中,所述第一支撑条301内嵌于所述第一侧壁101及所述第三侧壁103上的所述第一凹槽120内。所述第一方向与所述第二侧壁102及所述第四侧壁104平行。In one embodiment, the first support bar 301 is embedded in the first groove 120 on the first side wall 101 and the third side wall 103. The first direction is parallel to the second side wall 102 and the fourth side wall 104.
在一种实施例中,所述第二支撑条302内嵌于所述第二侧壁102及所述第四侧壁104上的所述第一凹槽120内。所述第二方向与所述第一侧壁101及所述第三侧壁103平行。In one embodiment, the second support bar 302 is embedded in the first groove 120 on the second side wall 102 and the fourth side wall 104. The second direction is parallel to the first side wall 101 and the third side wall 103.
在一种实施例中,所述第一凹槽120的深度小于所述外框10的厚度。In an embodiment, the depth of the first groove 120 is less than the thickness of the outer frame 10.
所述金属掩膜层20位于所述中空区110内。The metal mask layer 20 is located in the hollow area 110.
在一种实施例中,所述金属掩膜层20位于所述支撑条30上。所述支撑条30的弹性形变大于所述金属掩膜层20的弹性形变。所述支撑条30交叉设置形成的支撑网可以缓解所述金属掩膜层20因形变量过大,而导致目标基板40加工时产生误差。In an embodiment, the metal mask layer 20 is located on the support bar 30. The elastic deformation of the support bar 30 is greater than the elastic deformation of the metal mask layer 20. The supporting net formed by the cross-arrangement of the supporting bars 30 can alleviate the excessive deformation of the metal mask layer 20, which may cause errors in the processing of the target substrate 40.
在一种实施例中,所述金属掩膜层20可以通过焊接与所述外框10固定连接。此种实施例中,所述金属掩膜层20的面积不大于所述In an embodiment, the metal mask layer 20 may be fixedly connected to the outer frame 10 by welding. In this embodiment, the area of the metal mask layer 20 is not larger than the
所述外框10还包括位于所述中空腔侧面的第二凹槽130。所述金属图案层内嵌于所述第二凹槽130内。The outer frame 10 further includes a second groove 130 located on the side of the hollow cavity. The metal pattern layer is embedded in the second groove 130.
在一种实施例中,所述第二凹槽130位于所述支撑条30上。In an embodiment, the second groove 130 is located on the support bar 30.
所述第二凹槽130可以设置于任意相对的侧壁,例如第一侧壁101和第三侧壁103,或者第二侧壁102和第四侧壁104。或者The second groove 130 may be provided on any opposite sidewalls, such as the first sidewall 101 and the third sidewall 103, or the second sidewall 102 and the fourth sidewall 104. or
所述第一侧壁101、所述第二侧壁102、所述第三侧壁103及所述第四侧壁104上均可以设置所述第二凹槽130。所述第二凹槽130的深度可以根据所述金属掩膜层20的面积大小进行设计,本申请不作详细介绍。The second groove 130 may be provided on the first side wall 101, the second side wall 102, the third side wall 103, and the fourth side wall 104. The depth of the second groove 130 may be designed according to the area size of the metal mask layer 20, which is not described in detail in this application.
在一种实施例中,所述支撑条30可以同时通过所述第二凹槽130及焊接的方式与所述外框10固定连接。In an embodiment, the support bar 30 can be fixedly connected to the outer frame 10 through the second groove 130 and welding at the same time.
在本申请中,所述第二凹槽130的设置可以视具体情况而定。In this application, the arrangement of the second groove 130 may be determined according to specific conditions.
请参阅图2,图2为本申请金属掩膜层20第一种结构图。Please refer to FIG. 2, which is a first structure diagram of the metal mask layer 20 of this application.
本申请提供的金属掩膜层20可以应用于蒸镀设备中,以采用蒸镀工艺制造显示面板中的功能膜层,例如制造OLED显示面板中OLED器件的有机发光层。The metal mask layer 20 provided in the present application can be applied to an evaporation device to manufacture a functional film layer in a display panel by an evaporation process, for example, an organic light-emitting layer of an OLED device in an OLED display panel.
所述金属掩膜层20包括金属图案层210。The metal mask layer 20 includes a metal pattern layer 210.
所述金属图案层210包括至少一第一开口211,所述第一开口211对应目标基板40的像素单元。The metal pattern layer 210 includes at least one first opening 211, and the first opening 211 corresponds to the pixel unit of the target substrate 40.
在一种实施例中,所述第一开口211的形状与目标基板40中像素单元410的形状相同。In an embodiment, the shape of the first opening 211 is the same as the shape of the pixel unit 410 in the target substrate 40.
在蒸镀工艺,蒸镀材料一般为高温气体,而所述金属图案层210为金属材料,因此金属受热发生膨胀,导致所述第一开口211的面积会缩小。在对所述第一开口211进行设计时,往往需要考虑所述金属图案层210的膨胀量。所述金属图案层210具体的膨胀量与金属材料、受热温度有关。所述金属图案层210具体的膨胀量,可以根据数值仿真软件进行计算,例如Ansys等。In the vapor deposition process, the vapor deposition material is generally a high-temperature gas, and the metal pattern layer 210 is a metal material, so the metal expands when heated, causing the area of the first opening 211 to shrink. When designing the first opening 211, it is often necessary to consider the expansion amount of the metal pattern layer 210. The specific expansion amount of the metal pattern layer 210 is related to the metal material and the heating temperature. The specific expansion amount of the metal pattern layer 210 can be calculated according to numerical simulation software, such as Ansys.
所述金属图案层210还包括位于所述第一开口211内的第一凸起212。The metal pattern layer 210 further includes a first protrusion 212 located in the first opening 211.
在一种实施例中,所述第一凸起212在所述目标基板40上的正投影面与所述像素单元410不重合。In an embodiment, the orthographic projection surface of the first protrusion 212 on the target substrate 40 does not overlap with the pixel unit 410.
由于工艺的限制,在对所述金属图案层210进行加工时,无法所述第一开口211内的图案完全去除,因此在进行蒸镀工艺时,需要对所述第一凸起212进行考虑。Due to process limitations, when the metal pattern layer 210 is processed, the pattern in the first opening 211 cannot be completely removed. Therefore, the first protrusion 212 needs to be considered when performing the vapor deposition process.
所述金属掩膜层20还包括隔热层220。The metal mask layer 20 further includes a heat insulation layer 220.
所述隔热层220位于所述金属图案层210上。即所述隔热层220位于所述金属图案层210远离所述目标基板40的一侧。The heat insulation layer 220 is located on the metal pattern layer 210. That is, the heat insulation layer 220 is located on the side of the metal pattern layer 210 away from the target substrate 40.
在一种实施例中,所述隔热层220位于所述支撑条30与所述金属图案层210之间。In an embodiment, the heat insulation layer 220 is located between the support bar 30 and the metal pattern layer 210.
请参阅图2,当对所述目标基板40进行加工时,所述金属图案层210靠近所述目标基板40,所述隔热层220远离所述目标基板40。Please refer to FIG. 2, when the target substrate 40 is processed, the metal pattern layer 210 is close to the target substrate 40, and the heat insulation layer 220 is far away from the target substrate 40.
在一种实施例中,所述隔热层220的材料可以为二氧化硅In an embodiment, the material of the thermal insulation layer 220 may be silica
在本申请的所述隔热层220中,所述隔热层220还包括至少一第二开口221。所述第二开口221与所述第一开口211对应。In the heat insulation layer 220 of the present application, the heat insulation layer 220 further includes at least one second opening 221. The second opening 221 corresponds to the first opening 211.
在一种实施例中,所述第二开口221的形状可以与所述第一开口211的形状相同。In an embodiment, the shape of the second opening 221 may be the same as the shape of the first opening 211.
在蒸镀工艺中,较高温度的蒸镀材料将导致所述金属图案层210膨胀,所述第一开口211的面积变小,导致目标基板40产生混色的风险。本申请所述金属图案层210表面设置一隔热层220,避免高温气体的热量传递至所述金属图案层210发生膨胀,避免了所述目标基板40蒸镀工艺中产生混色的缺陷,提高了显示面板的分辨率及良率。In the vapor deposition process, the vapor deposition material at a higher temperature will cause the metal pattern layer 210 to expand, and the area of the first opening 211 becomes smaller, leading to the risk of color mixing on the target substrate 40. A heat insulation layer 220 is provided on the surface of the metal pattern layer 210 of the present application to prevent the heat of high temperature gas from being transferred to the metal pattern layer 210 to expand, avoid the defects of color mixing during the evaporation process of the target substrate 40, and improve The resolution and yield of the display panel.
请参阅图3,图3为本申请金属掩膜层20第二种结构图。Please refer to FIG. 3, which is a second structure diagram of the metal mask layer 20 of this application.
所述金属图案层210内还包括连续的中空腔体230。The metal pattern layer 210 also includes a continuous hollow cavity 230.
在一种实施例中,所述中空腔体230内填充有冷却流体。In an embodiment, the hollow cavity 230 is filled with a cooling fluid.
在一种实施例中,所述冷却流体可以为低温液体或低温空气。In an embodiment, the cooling fluid may be cryogenic liquid or cryogenic air.
所述金属图案层210还包括第一进口和第一出口。The metal pattern layer 210 further includes a first inlet and a first outlet.
所述冷却液通过所述第一进口流入所述中空腔体230,并通过所述第一出口流出所述中空腔体230,对所述金属图案层210进行降温处理。The cooling liquid flows into the hollow cavity 230 through the first inlet, and flows out of the hollow cavity 230 through the first outlet, so that the metal pattern layer 210 is cooled.
在一种实施例中,所述第一进口及所述第一出口可以位于所述金属图案层210的同一侧或不同侧。In an embodiment, the first inlet and the first outlet may be located on the same side or different sides of the metal pattern layer 210.
在蒸镀工艺中,所述冷却液可以在所述中空腔体230内形成一循环冷却系统,将所述金属图案层210中的高温带走,使所述金属图案层210保持一定的温度,不发生膨胀,避免了所述目标基板40蒸镀工艺中产生混色的缺陷。In the evaporation process, the cooling liquid can form a circulating cooling system in the hollow cavity 230 to take away the high temperature in the metal pattern layer 210 and keep the metal pattern layer 210 at a certain temperature. No expansion occurs, and the defect of color mixing during the evaporation process of the target substrate 40 is avoided.
在一种实施例中,所述像素单元410外边界与所述金属图案层210中的第一开口211在所述目标基板40的正投影面的外边界的间距为a,a大于0。In an embodiment, the distance between the outer boundary of the pixel unit 410 and the outer boundary of the first opening 211 in the metal pattern layer 210 on the orthographic projection surface of the target substrate 40 is a, and a is greater than zero.
本申请隔热层及冷却液的设置虽然一定程度上降低了所述金属图案层的温度,但工艺上同样存在一定误差,因此在对所述第一开口设计时需要留有一定余量。Although the installation of the heat insulation layer and the cooling liquid in the present application reduces the temperature of the metal pattern layer to a certain extent, there are also certain errors in the process, so a certain margin should be left when designing the first opening.
本申请提出了一种金属掩膜装置,包括外框,所述外框包括中空区;位于所述中空区内的金属掩膜层,包括:金属图案层,包括至少一第一开口,所述第一开口的形状与目标基板中像素单元的形状相同;以及位于所述金属图案层上的隔热层;当对所述目标基板进行加工时,所述金属图案层靠近所述目标基板,所述隔热层远离所述目标基板。本申请通过在现有金属掩膜装置的表面设置一隔热层,避免金属掩膜装置因受热膨胀而导致目标显示面板混色。The present application proposes a metal mask device, including an outer frame, the outer frame includes a hollow area; the metal mask layer in the hollow area includes: a metal pattern layer, including at least one first opening, The shape of the first opening is the same as the shape of the pixel unit in the target substrate; and the heat insulation layer on the metal pattern layer; when the target substrate is processed, the metal pattern layer is close to the target substrate, so The heat insulation layer is far away from the target substrate. In this application, a heat insulation layer is provided on the surface of the existing metal mask device to avoid the color mixing of the target display panel due to thermal expansion of the metal mask device.
综上所述,虽然本申请已以优选实施例揭露如上,但上述优选实施例并非用以限制本申请,本领域的普通技术人员,在不脱离本申请的精神和范围内,均可作各种更动与润饰,因此本申请的保护范围以权利要求界定的范围为准。In summary, although the application has been disclosed as above in preferred embodiments, the above-mentioned preferred embodiments are not intended to limit the application, and those of ordinary skill in the art can make various decisions without departing from the spirit and scope of the application. Such changes and modifications, so the protection scope of this application is subject to the scope defined by the claims.

Claims (20)

  1. 一种金属掩膜装置,其包括:A metal mask device, which includes:
    外框,所述外框包括中空区;An outer frame, the outer frame including a hollow area;
    位于所述中空区内的金属掩膜层,包括:The metal mask layer located in the hollow area includes:
    金属图案层,包括至少一第一开口,所述第一开口的形状与目标基板中像素单元的形状相同,The metal pattern layer includes at least one first opening, the shape of the first opening is the same as the shape of the pixel unit in the target substrate,
    其中,所述金属图案层还包括位于所述第一开口内的第一凸起,所述第一凸起在所述目标基板上的正投影面与所述像素单元不重合;以及Wherein, the metal pattern layer further includes a first protrusion located in the first opening, and the orthographic projection surface of the first protrusion on the target substrate does not overlap the pixel unit; and
    位于所述金属图案层上的隔热层;A heat insulation layer on the metal pattern layer;
    当对所述目标基板进行加工时,所述金属图案层靠近所述目标基板,所述隔热层远离所述目标基板。When the target substrate is processed, the metal pattern layer is close to the target substrate, and the heat insulation layer is away from the target substrate.
  2. 根据权利要求1所述的金属掩膜装置,其中,The metal mask device according to claim 1, wherein:
    所述隔热层的材料为二氧化硅。The material of the heat insulation layer is silica.
  3. 根据权利要求1所述的金属掩膜装置,其中,The metal mask device according to claim 1, wherein:
    所述隔热层还包括第二开口;The heat insulation layer further includes a second opening;
    所述第二开口与所述第一开口的形状相同。The second opening has the same shape as the first opening.
  4. 根据权利要求1所述的金属掩膜装置,其中,The metal mask device according to claim 1, wherein:
    所述像素单元外边界与所述第一开口在所述目标基板的正投影面的外边界的间距为a,a大于0。The distance between the outer boundary of the pixel unit and the outer boundary of the first opening on the orthographic projection surface of the target substrate is a, and a is greater than zero.
  5. 根据权利要求1所述的金属掩膜装置,其中,The metal mask device according to claim 1, wherein:
    所述金属掩膜装置还包括呈板条状的至少两个支撑条;The metal mask device further includes at least two support bars in a slat shape;
    部分所述支撑条沿第一方向跨设于所述外框的中空区;A part of the support bars straddle the hollow area of the outer frame along the first direction;
    其余部分所述支撑条沿第二方向跨设于所述外框的中空区,以构成支撑网;The remaining part of the support bars are arranged across the hollow area of the outer frame along the second direction to form a support net;
    所述支撑条的两端分别与所述外框连接;Both ends of the support bar are respectively connected with the outer frame;
    所述第一方向与所述第二方向交叉。The first direction crosses the second direction.
  6. 根据权利要求5所述的金属掩膜装置,其中,The metal mask device according to claim 5, wherein:
    所述外框还包括位于第一表面上的第一凹槽;The outer frame also includes a first groove on the first surface;
    所述支撑条内嵌于所述第一凹槽内,并将所述金属图案层支撑于所述中空区上。The support bar is embedded in the first groove and supports the metal pattern layer on the hollow area.
  7. 根据权利要求1所述的金属掩膜装置,其中,The metal mask device according to claim 1, wherein:
    所述外框还包括位于所述中空腔侧面的第二凹槽;The outer frame further includes a second groove on the side of the hollow cavity;
    所述金属图案层内嵌于所述第二凹槽内。The metal pattern layer is embedded in the second groove.
  8. 根据权利要求7所述的金属掩膜装置,其中,The metal mask device according to claim 7, wherein:
    所述金属图案层内还包括连续的中空腔体;The metal pattern layer further includes a continuous hollow cavity;
    所述中空腔体内填充有冷却流体。The hollow cavity is filled with cooling fluid.
  9. 根据权利要求8所述的金属掩膜装置,其中,The metal mask device according to claim 8, wherein:
    所述金属图案层还包括第一进口和第一出口;The metal pattern layer further includes a first inlet and a first outlet;
    所述冷却液通过所述第一进口流入所述中空腔体,并通过所述第一出口流出所述中空腔体,对所述金属图案层进行降温处理。The cooling liquid flows into the hollow cavity through the first inlet, and flows out of the hollow cavity through the first outlet, to cool the metal pattern layer.
  10. 根据权利要求9所述的金属掩膜装置,其中,The metal mask device according to claim 9, wherein:
    所述第一进口及所述第一出口位于所述金属图案层的同一侧或不同侧。The first inlet and the first outlet are located on the same side or different sides of the metal pattern layer.
  11. 一种金属掩膜装置,其包括:A metal mask device, which includes:
    外框,所述外框包括中空区;An outer frame, the outer frame including a hollow area;
    位于所述中空区内的金属掩膜层,包括:The metal mask layer located in the hollow area includes:
    金属图案层,包括至少一第一开口,所述第一开口的形状与目标基板中像素单元的形状相同;以及The metal pattern layer includes at least one first opening, the shape of the first opening is the same as the shape of the pixel unit in the target substrate; and
    位于所述金属图案层上的隔热层;A heat insulation layer on the metal pattern layer;
    当对所述目标基板进行加工时,所述金属图案层靠近所述目标基板,所述隔热层远离所述目标基板。When the target substrate is processed, the metal pattern layer is close to the target substrate, and the heat insulation layer is away from the target substrate.
  12. 根据权利要求11所述的金属掩膜装置,其中,The metal mask device according to claim 11, wherein:
    所述隔热层的材料为二氧化硅。The material of the heat insulation layer is silica.
  13. 根据权利要求11所述的金属掩膜装置,其中,The metal mask device according to claim 11, wherein:
    所述隔热层还包括第二开口;The heat insulation layer further includes a second opening;
    所述第二开口与所述第一开口的形状相同。The second opening has the same shape as the first opening.
  14. 根据权利要求11所述的金属掩膜装置,其中,The metal mask device according to claim 11, wherein:
    所述像素单元外边界与所述第一开口在所述目标基板的正投影面的外边界的间距为a,a大于0。The distance between the outer boundary of the pixel unit and the outer boundary of the first opening on the orthographic projection surface of the target substrate is a, and a is greater than zero.
  15. 根据权利要求11所述的金属掩膜装置,其中,The metal mask device according to claim 11, wherein:
    所述金属掩膜装置还包括呈板条状的至少两个支撑条;The metal mask device further includes at least two support bars in a slat shape;
    部分所述支撑条沿第一方向跨设于所述外框的中空区;A part of the support bars straddle the hollow area of the outer frame along the first direction;
    其余部分所述支撑条沿第二方向跨设于所述外框的中空区,以构成支撑网;The remaining part of the support bars are arranged across the hollow area of the outer frame along the second direction to form a support net;
    所述支撑条的两端分别与所述外框连接;Both ends of the support bar are respectively connected with the outer frame;
    所述第一方向与所述第二方向交叉。The first direction crosses the second direction.
  16. 根据权利要求15所述的金属掩膜装置,其中,The metal mask device according to claim 15, wherein:
    所述外框还包括位于第一表面上的第一凹槽;The outer frame also includes a first groove on the first surface;
    所述支撑条内嵌于所述第一凹槽内,并将所述金属图案层支撑于所述中空区上。The support bar is embedded in the first groove and supports the metal pattern layer on the hollow area.
  17. 根据权利要求11所述的金属掩膜装置,其中,The metal mask device according to claim 11, wherein:
    所述外框还包括位于所述中空腔侧面的第二凹槽;The outer frame further includes a second groove on the side of the hollow cavity;
    所述金属图案层内嵌于所述第二凹槽内。The metal pattern layer is embedded in the second groove.
  18. 根据权利要求17所述的金属掩膜装置,其中,The metal mask device according to claim 17, wherein:
    所述金属图案层内还包括连续的中空腔体;The metal pattern layer further includes a continuous hollow cavity;
    所述中空腔体内填充有冷却流体。The hollow cavity is filled with cooling fluid.
  19. 根据权利要求18所述的金属掩膜装置,其中,The metal mask device according to claim 18, wherein:
    所述金属图案层还包括第一进口和第一出口;The metal pattern layer further includes a first inlet and a first outlet;
    所述冷却液通过所述第一进口流入所述中空腔体,并通过所述第一出口流出所述中空腔体,对所述金属图案层进行降温处理。The cooling liquid flows into the hollow cavity through the first inlet, and flows out of the hollow cavity through the first outlet, to cool the metal pattern layer.
  20. 根据权利要求19所述的金属掩膜装置,其中,The metal mask device according to claim 19, wherein:
    所述第一进口及所述第一出口位于所述金属图案层的同一侧或不同侧。The first inlet and the first outlet are located on the same side or different sides of the metal pattern layer.
PCT/CN2019/080193 2019-01-31 2019-03-28 Metal mask device WO2020155357A1 (en)

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CN201910099209.0 2019-01-31

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JP2004269968A (en) * 2003-03-10 2004-09-30 Sony Corp Mask for vapor deposition
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CN103572245A (en) * 2012-08-07 2014-02-12 联胜(中国)科技有限公司 Mask module and organic vapor deposition device and thermal evaporation device using mask module
CN108149192A (en) * 2018-02-08 2018-06-12 京东方科技集团股份有限公司 A kind of metal mask version and its manufacturing method

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CN106893982A (en) * 2017-03-30 2017-06-27 京东方科技集团股份有限公司 A kind of coldplate and evaporation coating device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5511185A (en) * 1978-07-11 1980-01-25 Mitsubishi Electric Corp Mask jig
JPH11222664A (en) * 1998-02-04 1999-08-17 Matsushita Electric Ind Co Ltd Metal mask, formation of resistor by using this metal mask and production of resistor using this metal mask
JP2004269968A (en) * 2003-03-10 2004-09-30 Sony Corp Mask for vapor deposition
JP2011117028A (en) * 2009-12-02 2011-06-16 Seiko Epson Corp Mask for vapor deposition
US20140020628A1 (en) * 2012-07-17 2014-01-23 Wintek Corporation Shadow mask module and organic vapor deposition apparatus and thermal evaporation apparatus using the same
CN103572245A (en) * 2012-08-07 2014-02-12 联胜(中国)科技有限公司 Mask module and organic vapor deposition device and thermal evaporation device using mask module
CN108149192A (en) * 2018-02-08 2018-06-12 京东方科技集团股份有限公司 A kind of metal mask version and its manufacturing method

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