CN109735801A - Metal mask device - Google Patents
Metal mask device Download PDFInfo
- Publication number
- CN109735801A CN109735801A CN201910099209.0A CN201910099209A CN109735801A CN 109735801 A CN109735801 A CN 109735801A CN 201910099209 A CN201910099209 A CN 201910099209A CN 109735801 A CN109735801 A CN 109735801A
- Authority
- CN
- China
- Prior art keywords
- metal mask
- mask device
- pattern layer
- metal pattern
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Present applicant proposes a kind of metal mask device, including outline border, the outline border includes hollow area；Metal mask layer in the hollow area, comprising: the shape of metal pattern layer, including at least one first opening, first opening is identical as the shape of pixel unit in target base plate；And the thermal insulation layer in the metal pattern layer；When processing to the target base plate, the metal pattern layer is close to the target base plate, and the thermal insulation layer is far from the target base plate.The application avoids metal mask device from leading to target display panel colour mixture because of expanded by heating by the way that a thermal insulation layer is arranged on the surface of existing metal mask device.
Description
Technical field
This application involves display field, in particular to a kind of metal mask device.
Background technique
In the manufacturing process of Organic Light Emitting Diode (Organic Light Emitting Diode, OLED) display panel
In, generally use the organic luminous layer that evaporation process forms OLED device in OLED display panel.It is aobvious using evaporation process manufacture
When showing the film layer in panel, will usually have corresponding to be deposited one on the mask plate of film pattern and the substrate of display panel
Side fitting, is placed in above evaporation source, and the evaporation material in evaporation source is dissipated on substrate by thermosetting steam, and is deposited on substrate
On, to form film layer on substrate.
Existing mask plate generallys use metal mask version, and evaporation material is high-temperature gas.Therefore in evaporation process,
Mask plate is influenced by high-temperature gas, expanded by heating, so that the position of the opening of mask version and target base plate pixel unit is sent out
Raw dislocation, causes target display panel to generate the defect of colour mixture, reduces the resolution ratio and yield of display panel.
Summary of the invention
The application provides a kind of metal mask device, leads to target to solve existing metal mask device because of expanded by heating
The technical issues of display panel colour mixture.
To solve the above problems, technical solution provided by the present application is as follows:
Present applicant proposes a kind of metal mask devices comprising:
Outline border, the outline border include hollow area；
Metal mask layer in the hollow area, comprising:
Metal pattern layer, including at least one first opening, it is described first opening shape and target base plate in pixel unit
Shape it is identical；And
Thermal insulation layer in the metal pattern layer；
When processing to the target base plate, the metal pattern layer is close to the target base plate, the thermal insulation layer
Far from the target base plate.
In the metal mask device of the application,
The material of the thermal insulation layer is silica.
In the metal mask device of the application,
The thermal insulation layer further includes the second opening；
Second opening is identical as the shape of first opening.
In the metal mask device of the application,
The pixel unit outer boundary and first opening are between the outer boundary of the frontal plane of projection of the target base plate
Away from for a, a is greater than 0.
In the metal mask device of the application,
The metal pattern layer further includes the first protrusion in first opening；
Frontal plane of projection of first protrusion in the target base plate is not overlapped with the pixel unit.
In the metal mask device of the application,
The metal mask device further includes at least two support bars in lath-shaped；
The part support bar is located at the hollow area of the outline border along first direction；
Support bar described in rest part is located at the hollow area of the outline border in a second direction, to constitute supporting network；
The both ends of the support bar are connect with the outline border respectively；
The first direction intersects with the second direction.
In the metal mask device of the application,
The outline border further includes the first groove on first surface；
The support bar is embedded in first groove, and the metal pattern layer is supported on the hollow area.
In the metal mask device of the application,
The outline border further includes the second groove positioned at the hollow cavity side；
The metal pattern layer is embedded in second groove.
In the metal mask device of the application,
It further include continuous hollow cavity in the metal pattern layer；
Cooling fluid is filled in the hollow cavity.
In the metal mask device of the application,
The metal pattern layer further includes the first import and first outlet；
The coolant liquid flows into the hollow cavity by first import, and by described in first outlet outflow
Hollow cavity carries out cooling processing to the metal pattern layer.
The utility model has the advantages that the application avoids metal mask by the way that a thermal insulation layer is arranged on the surface of existing metal mask device
Device leads to target display panel colour mixture because of expanded by heating.
Detailed description of the invention
It, below will be to embodiment or the prior art in order to illustrate more clearly of embodiment or technical solution in the prior art
Attached drawing needed in description is briefly described, it should be apparent that, the accompanying drawings in the following description is only some of invention
Embodiment for those of ordinary skill in the art without creative efforts, can also be attached according to these
Figure obtains other attached drawings.
Fig. 1 is the structure chart of the application metal mask device；
Fig. 2 is the first structure chart of the application metal mask layer；
Fig. 3 is second of structure chart of the application metal mask layer.
Specific embodiment
The explanation of following embodiment is referred to the additional illustration, the particular implementation that can be used to implement to illustrate the application
Example.The direction term that the application is previously mentioned, such as [on], [under], [preceding], [rear], [left side], [right side], [interior], [outer], [side]
Deng being only the direction with reference to annexed drawings.Therefore, the direction term used be to illustrate and understand the application, rather than to
Limit the application.The similar unit of structure is with being given the same reference numerals in the figure.
Referring to Fig. 1, Fig. 1 is the structure chart of the application metal mask device.
The metal mask device includes outline border 10 and the metal mask layer 20 in the outline border 10.
Outline border 10, the outline border 10 include hollow area 110.
In one embodiment, the outline border 10 is in Back Word type.The outline border 10 includes the first side wall connected vertically
101, second sidewall 102, third side wall 103 and the 4th side wall 104.
The metal mask device can also include at least two support bars 30 in lath-shaped.
The part support bar 30 is located at the hollow area 110 of the outline border 10 along first direction, props up described in rest part
Stay 30 is located at the hollow area 110 of the outline border 10 in a second direction, to constitute supporting network.
In one embodiment, the both ends of the support bar 30 respectively with the first side wall 101 of the outline border 10, institute
State second sidewall 102, the third side wall 103 and the 4th side wall 104 connection.
In one embodiment, the first direction intersects with the second direction.
In one embodiment, the first direction is vertical with the second direction.
The outline border 10 further includes the first groove 120 on first surface.
The first surface is the outline border 10 close to the side of target base plate 40.
First groove 120 be located at the first side wall 101, the second sidewall 102, the third side wall 103 and
On 4th side wall 104, and close to the hollow area 110.
The metal mask device include along first direction setting the first support bar 301 and in a second direction be arranged the
Two support bars 302.
In one embodiment, first support bar 301 is embedded in the first side wall 101 and the third side wall
In first groove 120 on 103.The first direction is parallel with the second sidewall 102 and the 4th side wall 104.
In one embodiment, second support bar 302 is embedded in the second sidewall 102 and the 4th side wall
In first groove 120 on 104.The second direction is parallel with the first side wall 101 and the third side wall 103.
In one embodiment, the depth of first groove 120 is less than the thickness of the outline border 10.
The metal mask layer 20 is located in the hollow area 110.
In one embodiment, the metal mask layer 20 is located on the support bar 30.The elasticity of the support bar 30
Deformation is greater than the elastic deformation of the metal mask layer 20.The supporting network of the support bar 30 formation arranged in a crossed manner can alleviate institute
Metal mask layer 20 is stated because deformation quantity is excessive, and target base plate 40 is caused to generate error when processing.
In one embodiment, the metal mask layer 20 can be fixedly connected by welding with the outline border 10.It is such
In embodiment, the area of the metal mask layer 20 is no more than described
The outline border 10 further includes the second groove 130 positioned at the hollow cavity side.The metal pattern layer is embedded in
In second groove 130.
In one embodiment, second groove 130 is located on the support bar 30.
Second groove 130 can be set in any opposite side wall, such as the first side wall 101 and third side wall 103,
Or second sidewall 102 and the 4th side wall 104.Or
On the first side wall 101, the second sidewall 102, the third side wall 103 and the 4th side wall 104
Second groove 130 can be set.The depth of second groove 130 can be big according to the area of the metal mask layer 20
Small to be designed, the application does not describe in detail.
In one embodiment, the support bar 30 can simultaneously second groove 130 and welding by way of with
The outline border 10 is fixedly connected.
In this application, the setting of second groove 130 can be depending on the circumstances.
Referring to Fig. 2, Fig. 2 is the first structure chart of the application metal mask layer 20.
Metal mask layer 20 provided by the present application can be applied in evaporated device, to manufacture display surface using evaporation process
The organic luminous layer of OLED device in functional film layer in plate, such as manufacture OLED display panel.
The metal mask layer 20 includes metal pattern layer 210.
The metal pattern layer 210 includes at least one first opening 211, the corresponding target base plate 40 of first opening 211
Pixel unit.
In one embodiment, the shape and the shape phase of pixel unit 410 in target base plate 40 of first opening 211
Together.
In evaporation process, evaporation material is generally high-temperature gas, and the metal pattern layer 210 is metal material, therefore
It is metal heated to expand, cause the area of first opening 211 that can reduce.It is designed to first opening 211
When, generally require the swell increment for considering the metal pattern layer 210.The specific swell increment of the metal pattern layer 210 and metal
Material, heating temperature are related.The specific swell increment of the metal pattern layer 210, can be calculated according to numerical simulation software,
Such as Ansys etc..
The metal pattern layer 210 further includes the first protrusion 212 in first opening 211.
In one embodiment, frontal plane of projection of first protrusion 212 in the target base plate 40 and the pixel
Unit 410 is not overlapped.
Due to the limitation of technique, when being processed to the metal pattern layer 210, can not it is described first opening 211 in
Pattern completely remove, therefore when carrying out evaporation process, need to account for first protrusion 212.
The metal mask layer 20 further includes thermal insulation layer 220.
The thermal insulation layer 220 is located in the metal pattern layer 210.The i.e. described thermal insulation layer 220 is located at the metal pattern
210 side far from the target base plate 40 of layer.
In one embodiment, the thermal insulation layer 220 is between the support bar 30 and the metal pattern layer 210.
Referring to Fig. 2, the metal pattern layer 210 is close to the target when processing to the target base plate 40
Substrate 40, the thermal insulation layer 220 is far from the target base plate 40.
In one embodiment, the material of the thermal insulation layer 220 can be silica
In the thermal insulation layer 220 of the application, the thermal insulation layer 220 further includes at least one second opening 221.Described
Two openings 221 are corresponding with first opening 211.
In one embodiment, the shape of second opening 221 can be identical as the shape of first opening 211.
In evaporation process, the evaporation material of higher temperature will lead to the metal pattern layer 210 and expand, and described first opens
The area of mouth 211 becomes smaller, and target base plate 40 is caused to generate the risk of colour mixture.Herein described 210 surface of metal pattern layer setting
One thermal insulation layer 220 avoids the heat transfer of high-temperature gas to the metal pattern layer 210 from expanding, avoids the target
The defect that colour mixture is generated in 40 evaporation process of substrate, improves the resolution ratio and yield of display panel.
Referring to Fig. 3, Fig. 3 is second of the structure chart of the application metal mask layer 20.
It further include continuous hollow cavity 230 in the metal pattern layer 210.
In one embodiment, cooling fluid is filled in the hollow cavity 230.
In one embodiment, the cooling fluid can be cryogenic liquid or Cryogenic air.
The metal pattern layer 210 further includes the first import and first outlet.
The coolant liquid flows into the hollow cavity 230 by first import, and is flowed out by the first outlet
The hollow cavity 230 carries out cooling processing to the metal pattern layer 210.
In one embodiment, first import and the first outlet can be located at the metal pattern layer 210
The same side is not ipsilateral.
In evaporation process, the coolant liquid can form a circulating cooling system in the hollow cavity 230, by institute
The high temperature stated in metal pattern layer 210 is taken away, and so that the metal pattern layer 210 is kept certain temperature, does not expand, avoid
The defect of colour mixture is generated in 40 evaporation process of target base plate.
In one embodiment, the first opening in 410 outer boundary of pixel unit and the metal pattern layer 210
211 the outer boundary of the frontal plane of projection of the target base plate 40 spacing be a, a be greater than 0.
Although the setting of the application thermal insulation layer and coolant liquid reduces the temperature of the metal pattern layer to a certain extent,
Certain error is equally existed in technique, therefore there are certain surpluses for needs when designing first opening.
Present applicant proposes a kind of metal mask device, including outline border, the outline border includes hollow area；Positioned at described hollow
Metal mask layer in area, comprising: metal pattern layer, including at least one first opening, the shape and target of first opening
The shape of pixel unit is identical in substrate；And the thermal insulation layer in the metal pattern layer；When to the target base plate into
When row processing, the metal pattern layer is close to the target base plate, and the thermal insulation layer is far from the target base plate.The application passes through
One thermal insulation layer is set on the surface of existing metal mask device, metal mask device is avoided to cause target to show because of expanded by heating
Panel colour mixture
Although above preferred embodiment is not to limit in conclusion the application is disclosed above with preferred embodiment
The application processed, those skilled in the art are not departing from spirit and scope, can make various changes and profit
Decorations, therefore the protection scope of the application subjects to the scope of the claims.
Claims (10)
1. a kind of metal mask device characterized by comprising
Outline border, the outline border include hollow area；
Metal mask layer in the hollow area, comprising:
Metal pattern layer, including at least one first opening, it is described first opening shape and target base plate in pixel unit shape
Shape is identical；And
Thermal insulation layer in the metal pattern layer；
When processing to the target base plate, for the metal pattern layer close to the target base plate, the thermal insulation layer is separate
The target base plate.
2. metal mask device according to claim 1, which is characterized in that
The material of the thermal insulation layer is silica.
3. metal mask device according to claim 1, which is characterized in that
The thermal insulation layer further includes the second opening；
Second opening is identical as the shape of first opening.
4. metal mask device according to claim 1, which is characterized in that
The pixel unit outer boundary is in the spacing of the outer boundary of the frontal plane of projection of the target base plate with first opening
A, a are greater than 0.
5. metal mask device according to claim 1, which is characterized in that
The metal pattern layer further includes the first protrusion in first opening；
Frontal plane of projection of first protrusion in the target base plate is not overlapped with the pixel unit.
6. metal mask device according to claim 1, which is characterized in that
The metal mask device further includes at least two support bars in lath-shaped；
The part support bar is located at the hollow area of the outline border along first direction；
Support bar described in rest part is located at the hollow area of the outline border in a second direction, to constitute supporting network；
The both ends of the support bar are connect with the outline border respectively；
The first direction intersects with the second direction.
7. metal mask device according to claim 6, which is characterized in that
The outline border further includes the first groove on first surface；
The support bar is embedded in first groove, and the metal pattern layer is supported on the hollow area.
8. metal mask device according to claim 1, which is characterized in that
The outline border further includes the second groove positioned at the hollow cavity side；
The metal pattern layer is embedded in second groove.
9. metal mask device according to claim 8, which is characterized in that
It further include continuous hollow cavity in the metal pattern layer；
Cooling fluid is filled in the hollow cavity.
10. metal mask device according to claim 9, which is characterized in that
The metal pattern layer further includes the first import and first outlet；
The coolant liquid flows into the hollow cavity by first import, and described hollow by first outlet outflow
Cavity carries out cooling processing to the metal pattern layer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910099209.0A CN109735801A (en) | 2019-01-31 | 2019-01-31 | Metal mask device |
| PCT/CN2019/080193 WO2020155357A1 (en) | 2019-01-31 | 2019-03-28 | Metal mask device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910099209.0A CN109735801A (en) | 2019-01-31 | 2019-01-31 | Metal mask device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109735801A true CN109735801A (en) | 2019-05-10 |
Family
ID=66367085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910099209.0A Pending CN109735801A (en) | 2019-01-31 | 2019-01-31 | Metal mask device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109735801A (en) |
| WO (1) | WO2020155357A1 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5511185A (en) * | 1978-07-11 | 1980-01-25 | Mitsubishi Electric Corp | Mask jig |
| CN106480404A (en) * | 2016-12-28 | 2017-03-08 | 京东方科技集团股份有限公司 | A kind of mask integrated framework and evaporation coating device |
| CN106893982A (en) * | 2017-03-30 | 2017-06-27 | 京东方科技集团股份有限公司 | A kind of coldplate and evaporation coating device |
| CN108149192A (en) * | 2018-02-08 | 2018-06-12 | 京东方科技集团股份有限公司 | A kind of metal mask version and its manufacturing method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11222664A (en) * | 1998-02-04 | 1999-08-17 | Matsushita Electric Ind Co Ltd | Metal mask, formation of resistor by using this metal mask and production of resistor using this metal mask |
| JP2004269968A (en) * | 2003-03-10 | 2004-09-30 | Sony Corp | Mask for vapor deposition |
| JP2011117028A (en) * | 2009-12-02 | 2011-06-16 | Seiko Epson Corp | Mask for vapor deposition |
| TWI456080B (en) * | 2012-07-17 | 2014-10-11 | Wintek Corp | Shadow mask module and organic vapor deposition apparatus and thermal evaporation apparatus using the same |
| CN103572245A (en) * | 2012-08-07 | 2014-02-12 | 联胜（中国）科技有限公司 | Mask module and organic vapor deposition device and thermal evaporation device using mask module |
-
2019
- 2019-01-31 CN CN201910099209.0A patent/CN109735801A/en active Pending
- 2019-03-28 WO PCT/CN2019/080193 patent/WO2020155357A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5511185A (en) * | 1978-07-11 | 1980-01-25 | Mitsubishi Electric Corp | Mask jig |
| CN106480404A (en) * | 2016-12-28 | 2017-03-08 | 京东方科技集团股份有限公司 | A kind of mask integrated framework and evaporation coating device |
| CN106893982A (en) * | 2017-03-30 | 2017-06-27 | 京东方科技集团股份有限公司 | A kind of coldplate and evaporation coating device |
| CN108149192A (en) * | 2018-02-08 | 2018-06-12 | 京东方科技集团股份有限公司 | A kind of metal mask version and its manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020155357A1 (en) | 2020-08-06 |
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Application publication date: 20190510 |