TW202016488A - Hot air flowing direction controlling mechanism of substrate baking machine characterized in a thermal convention of the hot air in the baking chamber is used to stabilize a temperature therein, so as to maintain the substrate in the environment of uniform temperature and achieve a better substrate baking quality - Google Patents
Hot air flowing direction controlling mechanism of substrate baking machine characterized in a thermal convention of the hot air in the baking chamber is used to stabilize a temperature therein, so as to maintain the substrate in the environment of uniform temperature and achieve a better substrate baking quality Download PDFInfo
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Abstract
Description
本發明為一種基板烘烤機台之熱風流向控制機構,其係於腔體內設有熱風裝置,並藉由熱風在腔體內進行熱對流,使基板全面性均勻受熱。 The invention is a hot air flow control mechanism of a substrate baking machine, which is provided with a hot air device in a cavity, and performs hot convection in the cavity by the hot air, so that the substrate is uniformly heated.
按,玻璃基板是液晶顯示裝置(TFT-LCD)的主要製程原料,就是俗稱的母玻璃或素玻璃,是一種高精密透明的電子零件,玻璃在液晶顯示裝置(TFT-LCD)產業中扮演的角色好比是半導體產業中的晶圓,因此液晶顯示裝置(TFT-LCD)產業對玻璃基板表面精密度之要求近乎完美。 According to the press, the glass substrate is the main process material of the liquid crystal display device (TFT-LCD), which is commonly known as mother glass or plain glass. It is a high-precision and transparent electronic component. Glass plays a role in the liquid crystal display device (TFT-LCD) industry. The role is like a wafer in the semiconductor industry, so the liquid crystal display device (TFT-LCD) industry has nearly perfect requirements for the surface precision of the glass substrate.
其次,液晶顯示裝置(TFT-LCD)的製程是分別利用兩塊無鹼玻璃基板,於無鹼玻璃基板表面構裝彩色濾色片與IC電路,並將玻璃基板表面經過乾式蝕刻,將紅、藍、綠三原色與黑色以微細的結構建置於玻璃表面,成為彩色濾色片,IC驅動電路則利用半導體製程,再將CMOS電路建置於玻璃表面,玻璃基板之功能係做為彩色濾色片與IC驅動電路之承載材料,而液晶顯示裝置(TFT-LCD)製程需要真空蒸鍍與蝕刻,所以玻璃基板,必須要能忍受強酸強鹼之腐蝕、高溫的製程環境,並且必須具備非常精密的表面平整度與平面起伏度。 Secondly, the manufacturing process of the liquid crystal display device (TFT-LCD) is to use two alkali-free glass substrates respectively, construct color filters and IC circuits on the surface of the alkali-free glass substrates, and dry-etch the surface of the glass substrates. The three primary colors of blue, green and black are built on a glass surface with a fine structure to become a color filter. The IC driver circuit uses a semiconductor process to build a CMOS circuit on the glass surface. The function of the glass substrate is used as a color filter The carrier material of the chip and IC drive circuit, and the liquid crystal display (TFT-LCD) process requires vacuum evaporation and etching, so the glass substrate must be able to withstand the corrosion of strong acids and alkalis, high temperature process environment, and must be very precise Flatness and flatness of the surface.
因此,玻璃基板在製造過程中的每個流程都非常精細,其中,該玻璃基板為相當精密的電子零件,絕對不容許玻璃基板上有任何的雜質、損傷或刮傷。當基板30進行烘烤時,請參閱第8圖所示,係將該基板30置放在腔體3內,一般都是經由基板30下方的熱板31進行加熱,再藉由熱板31的熱度使基板30表面的化學物質揮發,在此過程中,其溫度高達約攝氏70~150℃,且熱板31之熱源通常來自於底部之加熱器311,而該加熱器311則設置在熱板31下方,使熱板31中央、環邊或端邊能盡量保持均衡的溫度,然而,儘管熱板31已經分區域來調整加熱的溫度,卻還是無法在烘烤過程中保持均溫,加上每一相鄰區域的溫度會互相干擾,使得烘烤效果不佳,而影響基板30生產的品質,尤其該基板30之端邊301或局部,容易產生翹起或隆起,常導致該翹起或隆
起的部分無法受熱,因而造成基板30的不良。
Therefore, each process of the glass substrate in the manufacturing process is very fine. Among them, the glass substrate is a relatively precise electronic component, and absolutely no impurities, damage or scratches on the glass substrate are allowed. When the
有鑑於此,發明人特別研發一種控制熱風流向機構,其係利用熱風產生熱對流,並控制其流向,使腔體不僅能均勻充滿熱度,藉以烘烤基板,並改善腔體端邊溫度不足之缺失,加強基板翹起或隆起處之受熱,以達到基板之全面性均勻受熱,並補足熱板使用上的缺點,進一步降低烘烤上的不良率,而為一理想基板烘烤機台之熱風流向控制機構。 In view of this, the inventor specially developed a hot air flow control mechanism, which uses hot air to generate heat convection and control its flow direction, so that the cavity can not only fill the heat evenly, so as to bake the substrate, and improve the lack of temperature at the end of the cavity Missing, strengthen the heating of the substrate uplift or bulge, so as to achieve the overall heating of the substrate, and make up for the shortcomings of the hot plate, and further reduce the defect rate of baking, and it is an ideal substrate baking machine hot air Flow to the control agency.
本發明係有關於一種基板烘烤機台之熱風流向控制機構,其係為一種用於基板烘烤機台的熱風機構,其利用熱風裝置於腔體內逐漸加熱,再由吸風單元將熱風排出,以產生腔體內的熱對流,藉以將基板均勻加熱,有效降低不良率。 The invention relates to a hot air flow control mechanism of a substrate baking machine, which is a hot air mechanism for a substrate baking machine, which uses a hot air device to gradually heat in a cavity, and then the hot air is discharged by an air suction unit In order to generate heat convection in the cavity, the substrate is heated uniformly, and the defect rate is effectively reduced.
其主要係在腔體內側邊設有熱風裝置,將熱風吹出後發散在腔體內,再藉由設置在腔體周邊的複數個吸風單元將熱風排出,利用在送風及排風的過程中,可控制熱氣之流向移動,使熱風傳導至腔體的各角落,而能將基板之端邊、翹起或隆起處加強受熱。 It is mainly provided with a hot air device on the inner side of the cavity, which blows out the hot air and then distributes it in the cavity, and then discharges the hot air through a plurality of air suction units arranged around the cavity, and is used in the process of air supply and exhaust. It can control the flow of hot gas to move the hot air to all corners of the cavity, and can strengthen the end of the substrate, warp or bulge.
本發明之重點在於,該熱風裝置係由一熱風裝置及吸風單元所組成,其由腔體之一側送出熱風,再由設置在腔體側邊及四周角落的吸風單元將熱風排出,利用設置在四周角落的吸風單元,使熱風能流動到腔體的邊緣,且使熱風充滿於腔體內,藉以補足基板端邊不易受熱之缺失,進而達到基板的全方位受熱。 The main point of the present invention is that the hot air device is composed of a hot air device and an air suction unit. The hot air is sent from one side of the cavity, and then the hot air is discharged by the air suction unit provided on the side and corner of the cavity. By using the air suction units arranged in the four corners, the hot air can flow to the edge of the cavity, and the hot air can be filled into the cavity, so as to make up for the lack of the edge of the substrate that is not easily heated, and then achieve the full range of heating of the substrate.
本發明之重點在於,為加強熱風的全面性送風,能將熱風裝置裝設在上蓋內側,使熱風裝置向下直接對基板吹出熱風,再由設置在腔體之底板環邊的的複數個吸風單元,能依溫度來控制吸風單元之啟閉,使熱風能補償基板端邊的溫度,並能加速熱風的流動及熱風的擴散。 The key point of the present invention is that in order to enhance the overall air supply of hot air, the hot air device can be installed on the inner side of the upper cover, so that the hot air device directly blows out the hot air to the substrate, and then is sucked by a plurality of The air unit can control the opening and closing of the air suction unit according to the temperature, so that the hot air can compensate the temperature of the end of the substrate, and can accelerate the flow of the hot air and the diffusion of the hot air.
本發明在基板烘烤機台上設置熱風裝置,而能運用熱對流,使熱度能遍佈整個腔體內,其概念看似簡單,卻從未有人應用在烘烤基板之腔體上,以效果可改善基板端邊不易受熱之缺失,並經專利檢索後並無類似本案之熱風流向控制機構,而為創新之基板烘烤機台。 The invention is provided with a hot air device on the substrate baking machine, and can use heat convection to make the heat spread throughout the cavity. The concept seems simple, but no one has ever applied it to the cavity of the baking substrate. To improve the lack of heat resistance at the end of the substrate, and after the patent search, there is no hot air flow to the control mechanism similar to this case, which is an innovative substrate baking machine.
3‧‧‧腔體 3‧‧‧cavity
30‧‧‧基板 30‧‧‧ substrate
301‧‧‧端邊 301‧‧‧End
31‧‧‧熱板 31‧‧‧Hot plate
11‧‧‧底座 11‧‧‧Base
12‧‧‧控制器 12‧‧‧Controller
13‧‧‧腔體 13‧‧‧ Cavity
131‧‧‧溫度感應器 131‧‧‧Temperature sensor
132‧‧‧底板 132‧‧‧Bottom plate
14‧‧‧熱風裝置 14‧‧‧Hot air device
141‧‧‧吸風單元 141‧‧‧Suction unit
15‧‧‧上蓋 15‧‧‧Cover
2‧‧‧基板 2‧‧‧ substrate
21‧‧‧端邊 21‧‧‧End
第1圖係本發明基板烘烤機台之熱風裝置立體圖。 Figure 1 is a perspective view of the hot air device of the substrate baking machine of the present invention.
第2圖係本發明熱風流動方向示意圖。 Figure 2 is a schematic diagram of the hot air flow direction of the present invention.
第3圖係本發明熱風裝置之吸風單元的第1實施例圖。 Fig. 3 is a diagram of the first embodiment of the air suction unit of the hot air device of the present invention.
第4圖係本發明熱風流動方向之另一示意圖。 Figure 4 is another schematic diagram of the hot air flow direction of the present invention.
第5圖係本發明熱風流動方向之剖面示意圖。 Figure 5 is a schematic cross-sectional view of the hot air flow direction of the present invention.
第6圖係本發明熱風裝置之另一實施例圖。 Figure 6 is another embodiment of the hot air device of the present invention.
第7圖係本發明熱風裝置之另一實施例的熱風流動示意圖。 FIG. 7 is a schematic diagram of hot air flow in another embodiment of the hot air device of the present invention.
第8圖係習知烘烤基板之示意圖。 Figure 8 is a schematic diagram of a conventional baking substrate.
發明人係專門從事光阻預烤爐設備的開發、改良及販賣,為致力於基板烘烤的品質提升,而不斷進行基板烘烤機台的改良,包括:熱板、腔體…等內部元件的技術研發,發明人註冊有發明第I601926號增加光阻預烤爐內獨立溫控區域數量之結構、第I574346號玻璃基板冷卻用之複合式冷板及第I557389號光阻預烤爐加熱裝置之改良,主要都是對於熱板的改良,並配合精細的溫度控制,確實提升基板的烘烤品質。 The inventor specializes in the development, improvement and sale of photoresist pre-baking oven equipment. In order to improve the quality of substrate baking, the substrate baking machine is continuously improved, including: internal components such as hot plates, cavities... The technical research and development, the inventor registered the invention No. I601926 structure to increase the number of independent temperature control areas in the photoresist pre-baked oven, No. I574346 composite cold plate for cooling the glass substrate and No. I557389 photoresist pre-baked oven heating device The improvement is mainly for the improvement of the hot plate, and with the fine temperature control, it really improves the baking quality of the substrate.
首先,請參閱第1圖所示,係本發明基板烘烤機台之熱風裝置立體圖,其由一底座11、控制器12、腔體13及熱風裝置14及上蓋15所組成,該底座11之側邊設有一控制器12,而於底座11上方放置腔體13,並於該腔體13內具有熱風裝置14,並利用上蓋15封閉該腔體13,其中,該熱風裝置14係設置在腔體13之內側邊,而複數個吸風單元141則設置在熱風裝置14之對應側,藉由送風及吸風的過程中,令熱風產生對流(如第2圖所示),藉以擴大熱風流動且使腔體13內充滿熱風,其中,該控制器12能調整熱風裝置14之定時、定溫及定量之設定,以及吸風單元141之啟閉,並於腔體13內具有溫度感應器131,藉以控制溫度並調整風量。
First, please refer to FIG. 1, which is a perspective view of the hot air device of the substrate baking machine of the present invention, which is composed of a
其次,請繼續參閱第3圖及第4圖所示,為能加強熱風對流效果,該複數個吸風單元141係設置在腔體13之底板132的四周邊,當熱風裝置14吹出熱風後,能藉由調整每一吸風單元141的啟閉來控制熱風流動的方向,使氣流能往熱風裝置14吹出的對應側及左、右側邊移動,確實將熱風延伸至腔體13溫度較低的角落,以補強基板2之端邊21溫度較低的缺失(如第5圖所示)。
Secondly, please continue to refer to FIGS. 3 and 4. In order to enhance the effect of hot air convection, the plurality of
接著,請繼續參閱第6圖所示,係本發明熱風裝置之另一實
施例圖,為加速熱風的全面性流動以及確實控制熱風流向,其係將熱風裝置14裝設在上蓋15內側,當上蓋15封閉腔體13時,該熱風裝置14能向下方進行吹拂,此時,可藉由腔體13之底板132四周邊設置的複數個吸風單元141,當啟動該吸風單元141時(如第7圖所示),可促使熱風往各吸風單元141進行移動,其中,該吸風單元141能選擇式開啟或關閉。因此,烘烤時,可偵測底板132四周邊溫度較低處來開啟該區域的吸風單元141,有效加強腔體13內熱對流的效能,使熱對流更為頻繁,以補強腔體13邊緣的溫度,確實使腔體13內達到全面性的熱源擴散,特別對於基板2之端邊21翹起或隆起處有效加溫(請回顧第5圖所示),以提升基板2的均勻受熱。
Next, please continue to refer to Figure 6 for another example of the hot air device of the present invention.
The embodiment drawing is to accelerate the overall flow of hot air and indeed control the flow of hot air. It is to install the
接著,請仍然參閱第7圖所示,本發明顛覆傳統皆為熱板或紅外線加熱的方式,而採用熱風裝置14來吹送熱風以進行基板2的加熱(請回顧第6圖所示),再利用分布在底板132四周邊的吸風單元141進行排風,來產生熱對流,同時控制熱風的流向,尤其針對腔體13邊緣不易受熱的區域,也能使熱度遍及腔體13的角落,以維持腔體13整體溫度的一致性,使基板2的受熱更為均勻,確實降低基板2的不良率。
Next, please still refer to FIG. 7, the present invention subverts the traditional way of heating by a hot plate or infrared, and uses a
綜上所述,本發明之熱風流向控制機構為業界獨創,其係利用熱風的對流達到全面性加熱,而能令腔體內充滿熱風,使基板能全面性均勻受熱,有效降低不良率,當符合發明專利要件,爰依法提出專利申請。 In summary, the hot air flow control mechanism of the present invention is unique in the industry. It uses convection of hot air to achieve comprehensive heating, and can fill the cavity with hot air, so that the substrate can be heated uniformly in a comprehensive manner, effectively reducing the defect rate. For patent requirements for inventions, a patent application is filed in accordance with the law.
11‧‧‧底座 11‧‧‧Base
12‧‧‧控制器 12‧‧‧Controller
13‧‧‧腔體 13‧‧‧ Cavity
131‧‧‧溫度感應器 131‧‧‧Temperature sensor
14‧‧‧熱風裝置 14‧‧‧Hot air device
141‧‧‧吸風單元 141‧‧‧Suction unit
15‧‧‧上蓋 15‧‧‧Cover
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