TW201616244A - Photoresist pre-baking oven heater temperature controller - Google Patents

Abstract

This invention relates to a photoresist pre-baking oven heater temperature controller, and more particularly to a photoresist pre-baking oven heater applicable to a liquid crystal display (LCD) process, which can allow uniform temperature of the heating plate at the heating area to increase the product quality and production yield. It mainly comprises a chamber, a heater, a heating plate, and a temperature sensor. The chamber is of a tank shape and is provided with the heater on the support bottom board to heat the heating plate. The heating plate is provided therein with a plurality of temperature sensors to detect the temperature of each area in the heating plate. Then the temperature detected by each temperature sensor is used as the reference to modify the temperature of the heater so as to unify the temperature of the center, the periphery or the edge of the heating plate, such that the glass substrate placed on and heated by the heating plate can be uniformly heated.

Description

Photoresist pre-bake heater temperature control device

The invention relates to a photoresist preheater heater temperature control device, which utilizes a plurality of temperature sensors to adjust the heater to make the temperature of the surface of the hot plate uniform.

According to the glass substrate, the main processing material of the liquid crystal display device (TFT-LCD) is commonly known as mother glass or plain glass. It is a high-precision and transparent electronic component. The glass plays a role in the liquid crystal display device (TFT-LCD) industry. The role is like a wafer in the semiconductor industry, so the liquid crystal display device (TFT-LCD) industry has almost perfect surface glass surface accuracy requirements.

Secondly, the process of the liquid crystal display device (TFT-LCD) is to use two alkali-free glass substrates to form a color filter and an IC circuit on the surface of the alkali-free glass substrate, and dry-etch the surface of the glass substrate to red, The blue and green primary colors and black are placed on the glass surface in a fine structure to form a color filter. The IC driver circuit uses a semiconductor process, and the CMOS circuit is placed on the glass surface. The function of the glass substrate is used as a color filter. The substrate and the IC driver circuit carrier material, and the liquid crystal display device (TFT-LCD) process requires vacuum evaporation and etching, so the glass substrate must be able to withstand the strong acid and alkali corrosion, high temperature process environment, and must be very precise Surface flatness and flatness.

Therefore, each process of the glass substrate is very fine in the manufacturing process. When the photoresist is applied, the sensitizer and the photoresist are volatilized by baking. In this case, please refer to Figure 1. As shown in the figure, when the substrate 1 is baked, the substrate 1 is first placed on the hot plate 11, and the chemical substance on the surface of the glass substrate 1 is volatilized by the heat of the hot plate 11, in which the temperature is as high as about 70 to 150 ° C, and the heat source of the hot plate 11 is from the heater 12 at the bottom, and the heater 12 is disposed under the hot plate 11 in 1 to 15 regions, so that the center, the ring or the end of the hot plate 11 It is possible to maintain a balanced temperature as much as possible. However, although the hot plate 11 has been set with 1 to 15 zones to control the temperature, it is still impossible to maintain the average temperature during the baking process, and the temperature of each adjacent zone interferes with each other, so that The baking effect is not good, which affects the production quality of the liquid crystal display device.

In view of this, the inventors have specially improved the heating device, and developed a more precise temperature control by inputting a multi-point measuring temperature to improve the temperature control accuracy in the heating region, when the heating region is heated. When the temperature deviates from the set value, it can be returned to the set range more quickly, so as to increase the temperature uniformity of the hot plate and improve the production yield of the product, which is an ideal heating performance improvement of the hot plate of the photoresist pre-baking oven. Improvements in structure and control methods.

The invention relates to an improvement of the heating performance of a heater of a photoresist pre-baking oven, in particular to a photoresist pre-baking oven used in a liquid crystal display device (LCD) process, which can achieve a hot plate in a heating zone Average temperature to improve product production yield. The utility model mainly comprises a cavity, a heater, a hot plate and a temperature sensor. The cavity is a groove-shaped shape, and a support bottom plate is arranged at the bottom, and the top end surface is closed by the upper cover plate into a heating space, and the cavity body is located at the cavity body. The side is provided with an inlet for inserting the glass substrate, and an air outlet is opened on either side, and a heater is arranged above the support bottom plate, which uses a heating wire to generate a heat source, and a hot plate is placed on the heater. The hot plate is a heat-conducting metal plate, and is heated under the hot plate by a plurality of heaters capable of independent temperature control and heating, and a plurality of temperature sensors are disposed in the heater coverage of each independent zone. The temperature sensor is disposed in the heater or in the hot plate to detect the temperature at different positions on each partition, and then use the reference data to adjust the heating of the heater.

When the photoresist pre-baking chamber is baked, the glass substrate is first placed into the cavity from the inlet, and then the inlet is closed, so that the cavity forms a closed space, and only the side air outlet is reserved to facilitate the air. Circulating, and the hot plate located in the cavity is heated by the heater to reach a temperature of about 70 to 150 ° C, thereby heating the glass substrate and volatilizing the solvent in the photoresist, after baking for a period of time, The temperature of each small section of the hot plate will change slightly. Generally speaking, the temperature in the center of the hot plate is usually higher than the end edge, which tends to cause uneven heating of the glass substrate. At this time, the average temperature of the hot plate is maintained. Important, although the hot plate is divided into multiple zones to achieve temperature improvement in small zones, the temperature adjustment of the small zone of the hot plate requires a plurality of temperature sensors provided in the heater or the hot plate. It can detect the temperature in the hot plate covered by the heater, and then enable the heater to fine tune the temperature within the coverage to make the corresponding small score on the hot plate The temperature in the zone is evenly heated, which effectively improves the production yield of the product.

[study]

1‧‧‧Substrate

11‧‧‧Hot board

12‧‧‧heater

[this creation]

2‧‧‧ cavity

20‧‧‧Upper cover

201‧‧‧Support floor

202‧‧‧ exhaust vents

203‧‧‧ entrance

21‧‧‧ heater

22‧‧‧Hot board

221‧‧‧Small partition

23‧‧‧ Temperature sensor

3‧‧‧ glass substrate

Figure 1 is a schematic cross-sectional view of a conventional baked glass substrate

Figure 2 is a perspective view of the present invention.

Figure 3 is a perspective exploded view of the present invention.

Figure 4 is a view of another embodiment of the present invention.

Fig. 5 is a schematic cross-sectional view showing the baking of the present invention.

Figure 6 is a schematic representation of the use of the invention.

Figure 7 is a schematic illustration of the use of the multi-region of the present invention.

First, please refer to FIG. 2 and in conjunction with FIG. 3, which is mainly composed of a cavity 2, a hot plate 22, a heater 21 and a temperature sensor 23, which is in the shape of a groove and is located at the bottom. There is a supporting bottom plate 201, and the top end surface is closed by a top cover 20 to form a heating space, and an inlet 203 is disposed on the side of the cavity 2 for inserting the glass substrate 3, and an air outlet 202 is opened on either side. And a heater 21 is disposed above the support bottom plate 201, which uses a heating wire to generate a heat source, and then a hot plate 22 is placed on the heater 21, so that the heater 21 is disposed on the back surface of the hot plate 22 by a plurality of independent devices. The hot plate 22 is a metal plate having thermal conductivity, and is projected on the back surface of the hot plate 22 by the number of heaters 21 to form a plurality of small partitions 221, that is, the heater 21 can be used to heat the hot plate 22 in a partition manner. In particular, the heaters 21 are independently temperature controlled, so the temperature of each small section 221 can be set separately. In particular, the plurality of temperature sensors 23 are disposed in the hot plate 22 and each of the small sections 221, and can detect each The temperature of different locations within a small partition 221, and reference data To adjust the heating of the heater 21, and the temperature sensor 23 can also be disposed in the heater 21. Please refer to FIG. 4, the heater 21 is set to correspond to the number of small partitions 221 of the hot plate 22. The number of each small partition 221 is set to one or more.

When performing the baking operation in the cavity 2, please refer to Fig. 5 and, as shown in Fig. 6, the glass substrate 3 is first placed in the cavity 2 from the inlet 203 (please refer to Fig. 4) Then, the inlet 203 is closed, so that the cavity 2 forms a closed space, and only the side air outlets 202 are reserved to facilitate the circulation of air, and the hot plate 22 located in the cavity 2 is heated by the heater 21. Let it reach about 70-150 ° C, so that the photoresist solvent on the surface of the glass substrate 3 is volatilized. After baking for a period of time, please refer to Figure 7, each small partition of the hot plate 22 221 The temperature will vary slightly. Generally speaking, the temperature in the center of the small partition 221 is generally higher than the end edge, which tends to cause uneven heating of the glass substrate 3. At this time, it is important to maintain the uniform temperature of the small partition 221, although The heater small section 221 is divided into a plurality of zones (16 to 60 zones) to achieve temperature improvement of the small zone 221, but for the temperature control of the small zone 221 of the hot plate 22, a plurality of sets are required by each small section 221. The sensor 23 is adjusted, which is disposed in the heater 21 or in the small section 221 of the hot plate, and is distributed in the area of the ring edge or the end side to detect the temperature of the small section 221 at the center, the ring side or the end side. And take the value of each temperature sensor 23, and then calculate A temperature is obtained. At this time, the temperature of the corresponding heater 21 of the small partition 221 is finely adjusted according to the calculated temperature, so that the temperature on each small section 221 of the hot plate 22 can be uniformly heated, and the glass is effectively raised. The quality of the substrate 3 effectively improves the heating property and the production yield of the glass substrate 3, and further reduces the occurrence of defective ratio.

In summary, the present invention is to set a plurality of temperature sensors in each small partition in or below the hot plate, and then adjust the temperature of the small partition heater by the temperature detected by the temperature sensor, so that each The small partition can reach the average temperature, and each small partition is independent temperature control, so the temperature can be set separately, and the entire surface of the hot plate can be uniformly heated to make the glass substrate on the hot plate The baking temperature is quite consistent, not too high or too low, in order to achieve the best performance. The invention is highly progressive and practical, and has been in compliance with the patent requirements of the invention, and has filed a patent application according to law.

2‧‧‧ cavity

20‧‧‧Upper cover

201‧‧‧Support floor

202‧‧‧ exhaust vents

203‧‧‧ entrance

21‧‧‧ heater

22‧‧‧Hot board

221‧‧‧Small partition

23‧‧‧ Temperature sensor

3‧‧‧ glass substrate

Claims (3)

A photoresist preheater heater temperature control device is mainly composed of a cavity, a heater, a hot plate and a temperature sensor. The cavity is a trough shape, a support bottom plate is arranged at the bottom, and the top end surface is utilized. The cover plate encloses it into a heating space, and an inlet is provided on one side of the cavity for inserting into the glass substrate, and an air outlet is opened on either side, and a heater is arranged on the support bottom plate, and the heating wire is used Generating a heat source and disposing a hot plate on the heater, the hot plate being a metal plate having thermal conductivity, characterized in that the hot plate is divided into a plurality of small partitions, which are projected by a plurality of independent heaters The back of the hot plate is generated so that the heater can independently heat each small partition, and a plurality of temperature sensors are arranged in each small partition or in the heater corresponding to the small partition to detect each small The temperature of the hot plate in the zone, and use this reference data to adjust the heating of the heater. A photoresist preheater heater temperature control device, when the cavity is baked, the glass substrate is first placed into the cavity from the inlet, and then the inlet is closed, so that the cavity forms a closed space, leaving only the side The exhaust vents allow the air to circulate. When the baking is performed for a period of time, the temperature in the center of the small partition is generally higher than the end edge, which easily causes uneven heating of the glass substrate, and is characterized by the temperature of the small partition of the hot plate. The adjustment is to detect the temperature of the hot plate by using a plurality of temperature sensors arranged in each small partition or in the heater to sense the temperature values of each area of each small partition, and then obtain a calculation after calculation. Temperature, and then fine-tune the heater temperature in the small partition according to the calculated temperature, so that the temperature of each small partition of the hot plate can reach uniform heating, effectively increasing the production yield of the glass substrate. The photoresist preheater heater temperature control device according to Item 1, wherein the hot plate is divided into 16 to 60 small partitions, and the bottom of the small partition of the hot plate is respectively provided with a corresponding heater.