WO2020150995A1 - 图传设备和具有该图传设备的无人机 - Google Patents

图传设备和具有该图传设备的无人机 Download PDF

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Publication number
WO2020150995A1
WO2020150995A1 PCT/CN2019/073144 CN2019073144W WO2020150995A1 WO 2020150995 A1 WO2020150995 A1 WO 2020150995A1 CN 2019073144 W CN2019073144 W CN 2019073144W WO 2020150995 A1 WO2020150995 A1 WO 2020150995A1
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WO
WIPO (PCT)
Prior art keywords
heat
image transmission
heat pipe
board
transmission device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/073144
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English (en)
French (fr)
Inventor
詹雪超
张雅文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SZ DJI Technology Co Ltd
Original Assignee
SZ DJI Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SZ DJI Technology Co Ltd filed Critical SZ DJI Technology Co Ltd
Priority to CN201980005396.XA priority Critical patent/CN111466161B/zh
Priority to PCT/CN2019/073144 priority patent/WO2020150995A1/zh
Publication of WO2020150995A1 publication Critical patent/WO2020150995A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/2099—Liquid coolant with phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0213—Venting apertures; Constructional details thereof
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64U—UNMANNED AERIAL VEHICLES [UAV]; EQUIPMENT THEREFOR
    • B64U2101/00—UAVs specially adapted for particular uses or applications
    • B64U2101/30—UAVs specially adapted for particular uses or applications for imaging, photography or videography

Definitions

  • the present invention relates to the field of image transmission equipment, in particular to an image transmission equipment and an unmanned aerial vehicle with the image transmission equipment.
  • the sealing performance of the housing of the image transmission device is usually better, which causes a large amount of heat inside the image transmission device.
  • a large amount of heat accumulation will have a greater impact on the display screen of the image transmission device, the circuit board inside the image transmission device, etc.
  • the circuit board inside the image transmission device may not work properly or even burn out due to high temperature.
  • the heat inside the image transmission device is usually conducted to the outside of the image transmission device based on the housing of the image transmission device, which causes a large amount of heat to accumulate on the housing and the user's touch experience is poor.
  • the invention provides a picture transmission device and an unmanned aerial vehicle with the picture transmission device.
  • the present invention is implemented through the following technical solutions:
  • an image transmission device including:
  • the outer shell includes a bottom shell and a side part, the side part is provided with an air inlet and an air outlet;
  • the display screen is arranged on the casing and opposite to the bottom casing, and the display screen and the casing form a receiving space;
  • the circuit board is arranged in the receiving space and is arranged at a distance from the housing;
  • the radiator is arranged in the accommodating space, and the radiator is matched with the air inlet and the air outlet respectively;
  • the first heat-conducting substrate is in contact with the side of the circuit board away from the display screen to conduct heat
  • a first heat pipe, the first heat pipe is in contact with the first heat conducting substrate and the heat sink to conduct heat respectively;
  • the first heat-conducting substrate, the first heat pipe and the bottom shell are spaced apart.
  • an unmanned aerial vehicle includes a fuselage, a controller, and a video transmission device.
  • the fuselage is equipped with a camera, and the controller is provided on the aircraft.
  • the camera is connected to the camera, and the controller communicates wirelessly with the image transmission device, and the controller can transmit the image collected by the camera to the image transmission device;
  • the Image transmission equipment includes:
  • the outer shell includes a bottom shell and a side part, the side part is provided with an air inlet and an air outlet;
  • the display screen is arranged on the casing and opposite to the bottom casing, and the display screen and the casing form a receiving space;
  • the circuit board is arranged in the receiving space and is arranged at a distance from the housing;
  • the radiator is arranged in the accommodating space, and the radiator is matched with the air inlet and the air outlet respectively;
  • the first heat-conducting substrate is in contact with the side of the circuit board away from the display screen to conduct heat
  • a first heat pipe, the first heat pipe is in contact with the first heat conducting substrate and the heat sink to conduct heat respectively;
  • the first heat-conducting substrate, the first heat pipe and the bottom shell are spaced apart.
  • the heat sink, the first heat conduction plate and the first heat pipe in the housing of the image transmission device are based on the heat conduction method.
  • the heat is transferred to the radiator, and the heat is conducted to the outside of the shell by the radiator to achieve the effect of rapid heat dissipation; at the same time, the first heat conducting substrate, the first heat pipe and the bottom shell are arranged at intervals to avoid heat transfer to the shell as much as possible , Thereby improving user touch experience.
  • Figure 1 is a schematic diagram of the structure of an image transmission device in an embodiment of the present invention.
  • FIG. 2 is a schematic structural diagram of the image transmission device in another direction in an embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of a video transmission device in another direction in an embodiment of the present invention.
  • FIG. 4 is a schematic diagram of the structure of the image transmission device in another direction in an embodiment of the present invention.
  • FIG. 5 is a schematic diagram of a partial structure split of an image transmission device in an embodiment of the present invention.
  • FIG. 6 is a schematic structural diagram of a part of the structure of a picture transmission device in an embodiment of the present invention.
  • Figure 7A is a schematic cross-sectional view of an image transmission device in an embodiment of the present invention.
  • FIG. 7B is a partial enlarged view of the image transmission device of the embodiment shown in FIG. 7A;
  • FIG. 8 is a schematic structural diagram of another part of the structure of the image transmission device in an embodiment of the present invention.
  • FIG. 9 is a schematic structural diagram of another part of the structure of the image transmission device in an embodiment of the present invention.
  • Fig. 10 is a schematic diagram of the structure of an unmanned aerial vehicle in an embodiment of the present invention.
  • 300 image transmission equipment; 1: outer shell; 11: bottom shell; 12: side part; 121: air inlet part; 1211: first air inlet part; 1212: second air inlet part; 122: air outlet part; 123: First side part; 124: second side part; 125: third side part; 126: fourth side part; 127: battery slot; 2: display screen; 3: circuit board; 31: radio frequency board; 32: image transmission Board; 33: image processing board; 4: radiator; 41: fan; 42: first radiator; 421: channel; 43: second radiator; 5: first thermally conductive substrate; 51: first thermally conductive area; 52 : Second heat conduction area; 6: first heat pipe; 7: second heat conduction substrate; 8: second heat pipe; 9: third heat pipe; 10: power supply battery;
  • an embodiment of the present invention provides an image transmission device 300
  • the image transmission device 300 may include a housing 1, a display screen 2, a circuit board 3, a heat sink 4, a first thermally conductive substrate 5 and a first heat pipe 6.
  • the outer shell 1 includes a bottom shell 11 and a side portion 12, and the side portion 12 in this embodiment is provided with an air inlet 121 and an air outlet 122.
  • the display screen 2 is arranged on the housing 1, and the display screen 2 is arranged opposite to the bottom shell 11.
  • the display screen 2 is clamped on the inner ring of the side wall away from the bottom shell 11.
  • the display screen 2 and the housing 1 form an accommodating space
  • the circuit board 3 is arranged in the accommodating space
  • the circuit board 3 and the housing 1 are spaced apart.
  • the radiator 4 is arranged in the accommodating space, and the radiator 4 is matched with the air inlet 121 and the air outlet 122 respectively.
  • the first heat-conducting substrate 5 is in contact with the circuit board 3 on the side away from the display screen 2 for heat conduction
  • the first heat pipe 6 is in contact with the first heat-conducting substrate 5 and the heat sink 4, respectively
  • the bottom shell 11 is arranged at intervals.
  • the heat sink 4, the first heat conducting plate and the first heat pipe 6 are arranged in the housing 1.
  • the first heat conducting substrate 5, the first heat pipe 6 and the circuit board 3 in the housing 1 are based on heat conduction. Way to transfer heat to the radiator 4, and the radiator 4 conducts the heat to the outside of the housing 1 to achieve the effect of rapid heat dissipation; at the same time, the first heat conducting substrate 5, the first heat pipe 6 and the bottom shell 11 are spaced apart as much as possible Avoid heat transfer to the housing 1, thereby improving the user's touch experience.
  • the housing 1 of this embodiment is roughly rectangular parallelepiped, cube or other shapes.
  • the side portion 12 may include a first side portion 123 and a second side portion 124 disposed oppositely, and a third side portion 125 and a fourth side portion 126 disposed oppositely.
  • the first side portion 12 and/or the second side portion 124 are provided with buttons and/or interfaces, such as a power-on button, a playback button, a memory card interface, and a data interface.
  • the air inlet 121 is provided on the third side 125 and/or the fourth side 126
  • the air outlet 122 is provided on the third side 125 and/or the fourth side 126 to improve the aesthetics of the image transmission device 300.
  • the first side 123 and the second side 124 are two oppositely arranged short sides, and the third side 125 and the fourth side 126 are two oppositely arranged long sides , In line with user habits.
  • the air inlet 121 may include a first air inlet 1211, the air outlet 122 includes a first air outlet, and the first air inlet 1211 and the first air outlet are arranged opposite to each other. Section 12 on both sides.
  • the side portion 12 includes two opposed long sides and two opposed short sides.
  • the first air inlet portion 1211 may be provided on one of the long sides, and the first air outlet portion may be provided on the other long side.
  • the first air inlet 1211 includes one or more air inlets, or other air inlet structures.
  • the first air outlet includes one or more air outlets, or other air outlet structures. Taking the first air inlet 1211 including multiple air inlets and the first air outlet including multiple air outlets as an example, in this embodiment, the multiple air inlets of the first air inlet 1211 and the first air outlet The multiple air outlets of the part are opposite.
  • the line connecting the center of the first air inlet 1211 and the center of the first air outlet is substantially parallel to the short side.
  • the radiator 4 may include a fan 41 and a first radiator 42, and the fan 41 includes an air inlet and an air outlet.
  • the air inlet is matched with the first air inlet 1211.
  • the air inlet is aligned with the first air inlet 1211, for example, the air inlet is directly opposite to the first air inlet 1211.
  • the first radiator 42 is arranged on one side of the air outlet, and the air outlet is matched with the first air outlet through the first radiator 42.
  • one end of the first radiator 42 is aligned with the air outlet, and the other end of the first radiator 42 is aligned with the first air outlet.
  • one end of the first radiator 42 is directly opposite to the air outlet.
  • the other end of the radiator 42 is directly opposite to the first air outlet.
  • the heat in the receiving space can be dissipated to the outside in time, and the operation of the display screen 2 and the circuit board 3 can be avoided. affected.
  • the radiator 4 of this embodiment may further include a second radiator 43, and the second radiator 43 may be disposed between the air inlet of the fan 41 and the first air inlet 1211.
  • the second heat sink 43 may include a substrate and fins provided on the substrate.
  • the heat sink 4 and the bottom housing 11 are spaced apart.
  • the radiator 4 of this embodiment can be detachably connected to the bottom shell 11 through a quick-release part, which facilitates the installation and maintenance of the radiator 4.
  • the material of the quick release component is a non-thermal conductive material such as plastic, which further prevents heat from being transferred from the heat sink 4 to the housing 1. It can be understood that the heat sink 4 of this embodiment can also be detachably connected to the bottom shell 11 in other ways.
  • the circuit board 3, the bottom case 11, and the display screen 2 are substantially parallel. This arrangement makes the structure more compact and can reduce the thickness of the image transmission device 300, thereby reducing the volume of the image transmission device 300; At the same time, this arrangement is beneficial to the placement of the first heat conducting element and the first heat pipe 6.
  • the circuit board 3 of this embodiment may be provided with heating elements such as processors, resistors and other electronic elements, and the first heat conducting substrate 5 contacts and conducts heat conduction with the heating elements on the side of the circuit board 3 away from the display screen 2.
  • the first heat conducting substrate 5 is attached to the heating element on the side of the circuit board 3 away from the display screen 2 to realize contact heat conduction.
  • the circuit board 3 of this embodiment includes a radio frequency board 31, an image transmission board 32 and an image processing board 33, wherein the radio frequency board 31 communicates with the image processing board 33 via the image transmission board 32.
  • the radio frequency board 31 of this embodiment wirelessly communicates with an external device based on a radio frequency communication method, and can receive an image sent by the external device.
  • the image can be a single picture or a video stream.
  • the image transmission board 32 is responsible for transmitting the image received by the radio frequency board 31 to the image processing board 33, and the image processing board 33 can process the image, such as denoising and enhancing.
  • the image processing board 33 is an independent circuit board 3. If the image processing board 33 is damaged, it will not affect the use of the radio frequency board 31 and the image transmission board 32, and the image processing board 33 is set independently for easy replacement and maintenance.
  • the heat sink 4 and the image processing board 33 of this embodiment can be arranged on both sides of the radio frequency board 31 and the image transmission board 32 opposite to each other.
  • the radio frequency board 31 and the image transmission board 32 are integrated. In another embodiment, the radio frequency board 31 and the image transmission board 32 are independent circuit boards 3, and the radio frequency board 31 and the image transmission board 32 are arranged side by side. In this embodiment, one of the radio frequency board 31 and the image transmission board 32 is damaged, which will not affect the use of the other, and the radio frequency board 31 and the image transmission board 32 are arranged separately to facilitate the replacement and maintenance of the radio frequency board 31 and the image transmission board 32 .
  • the arrangement direction of the radio frequency board 31 and the image transmission board 32 is substantially parallel to the short side of the housing 1, which is beneficial to the layout of the structure.
  • a part of the first thermally conductive substrate 5 and the radio frequency board 31 and/or the image transmission board 32 are far away from the display
  • One side of the screen 2 is in contact with heat conduction
  • the other part of the first heat conducting substrate 5 is in contact with the first heat sink 42 for heat conduction.
  • a part of the first thermally conductive substrate 5 is directly covered on the surface of the radio frequency board 31 and/or the image transmission board 32 away from the display screen 2, and the heat generated by the radio frequency board 31 and/or the image transmission board 32 can be quickly Conducted to the first thermally conductive substrate 5.
  • the first heat pipe 6 is provided on the side of the first heat-conducting substrate 5 away from the radio frequency board 31 and the image transfer plate 32, so that the heat on the first heat-conducting substrate 5 is quickly transferred to the first heat sink through the first heat pipe 6 ⁇ 42 ⁇ .
  • the first heat sink 42 is located on one side of the radio frequency board 31 and the image transmission board 32, and the first heat sink 42 is provided between the bottom case 11 and the first heat dissipation substrate, and is separated by the first heat sink 42 The first heat dissipation substrate and the bottom case 11 further prevent the heat on the first heat dissipation plate from being transferred to the housing 1.
  • the first thermally conductive substrate 5 may include a first thermally conductive area 51 and a second thermally conductive area 52, wherein the first thermally conductive area 51 and the radio frequency board 31 and/or the image transmission board 32
  • the side away from the display screen 2 is in contact with heat conduction
  • the second heat conduction area 52 is in contact with the first heat sink 42 to conduct heat.
  • the first heat conduction area 51 is covered with the radio frequency board 31 and the image transmission board 32 on a side away from the display screen 2 to dissipate the heat generated by the radio frequency board 31 and the image transmission board 32 as soon as possible.
  • the second heat conduction area 52 covers the first heat sink 42, and through the cooperation of the fan 41 and the first heat sink 42, the heat accumulated on the second heat conduction area 52 is quickly dissipated.
  • first heat pipe 6 contacts the first heat conduction area 51 to conduct heat
  • another part of the first heat pipe 6 contacts the second heat conduction area 52 to conduct heat
  • the heat of the first heat conduction area 51 is faster through the first heat pipe 6
  • the heat is conducted to the second heat-conducting area 52, so that the heat of the first heat-conducting substrate 5 is transmitted to the first heat sink 42 as soon as possible to be dissipated.
  • the second heat conducting area 52 cooperates with the first heat sink 42 to form a sealed channel 421, one end of the channel 421 is matched with the air outlet of the fan 41, and the other end of the channel 421 is connected with the first outlet The wind part cooperates to improve the heat dissipation efficiency.
  • the channel 421 includes one.
  • the channel 421 includes a plurality of sub-channels, and adjacent sub-channels are separated from each other. In this embodiment, adjacent sub-channels can be separated by barriers.
  • the baffle is provided on one of the first heat sink 42 and the second heat conduction area 52.
  • the baffle is provided on the first heat sink 42, and the second heat conduction area is covered with a baffle to form Multiple sub-channels.
  • the baffle includes an upper baffle provided in the second heat conduction area 52 and a lower baffle provided in the first heat sink 42. The upper baffle and the lower baffle are matched correspondingly to form a plurality of sub-channels .
  • the first heat-conducting substrate 5 is provided with a groove, and the first heat pipe 6 is at least partially embedded in the groove of the first heat-conducting substrate 5, which can achieve stable contact between the first heat pipe 6 and the first heat-conducting substrate 5 .
  • a thermally conductive filler material may be provided between the first heat conducting substrate 5 and the first heat pipe 6, and the gap between the first heat pipe 6 and the first thermally conductive substrate 5 is filled with the filler material to ensure that the first heat pipe 6 and the first heat conducting The sufficient contact of the substrate 5 enables the heat to be quickly transferred from the first thermally conductive substrate 5 to the first heat pipe 6.
  • the filler material is powder or wire metal.
  • the thermal conductivity of the first heat pipe 6 is greater than the thermal conductivity of the first thermally conductive substrate 5.
  • the first heat pipe 6 is made of copper pipe or other materials.
  • the first thermally conductive substrate 5 is a substrate made of aluminum, magnesium, or other materials, and the material of the first thermally conductive substrate 5 can be selected in consideration of factors such as weight, volume, and thermal conductivity.
  • the first heat pipe 6 is flat, which reduces the space occupied by the first heat pipe 6.
  • the first heat pipe 6 can also be designed in other shapes.
  • the image transmission device 300 of this embodiment may further include a second heat-conducting substrate 7 and a second heat pipe 8.
  • the second heat-conducting substrate 7 and the image processing board 33 are in contact with the side facing the display screen 2 to conduct heat, and the second One end of the heat pipe 8 contacts the second heat-conducting substrate 7 to conduct heat, and the other end of the second heat pipe 8 contacts the first heat sink 42 to conduct heat.
  • the second heat-conducting substrate 7 conducts the heat of the image processing board 33 to the second heat pipe 8, and then the second heat pipe 8 conducts the heat on the second heat-conducting substrate 7 to the first heat sink 42 to realize the image processing board. 33's heat dissipation.
  • one end of the second heat pipe 8 is provided between the second heat conducting substrate 7 and the display screen 2.
  • the second heat-conducting substrate 7 is provided with a groove, and the second heat pipe 8 is at least partially embedded in the groove of the second heat-conducting substrate 7, which can achieve stable contact between the second heat pipe 8 and the second heat-conducting substrate 7 .
  • a thermally conductive filler material may be provided between the second heat conducting substrate 7 and the second heat pipe 8, and the gap between the second heat pipe 8 and the second thermally conductive substrate 7 is filled with the filler material to ensure that the second heat pipe 8 and the second heat conduction The sufficient contact of the substrate 7 allows the heat to be quickly transferred from the second thermally conductive substrate 7 to the second heat pipe 8.
  • the filler material is powder or wire metal.
  • the thermal conductivity of the second heat pipe 8 is greater than the thermal conductivity of the second thermally conductive substrate 7.
  • the second heat pipe 8 is made of copper pipe or other materials.
  • the second thermally conductive substrate 7 is a substrate made of aluminum, magnesium or other materials, and the material of the second thermally conductive substrate 7 can be selected in consideration of factors such as weight, volume, and thermal conductivity.
  • the second heat pipe 8 is flat, which reduces the occupied space of the second heat pipe 8.
  • the second heat pipe 8 can also be designed in other shapes.
  • the image transmission device 300 of this embodiment further includes a third heat pipe 9, which is arranged between the image processing board 33 and the display screen 2, and a part of the third heat pipe 9 contacts the display screen 2 to conduct heat.
  • the other part of the third heat pipe 9 is at least in contact with the first heat sink 42 to conduct heat.
  • the third heat pipe 9 promptly dissipates heat to the display screen 2 to prevent the display screen 2 from being damaged due to excessive temperature.
  • the third heat pipe 9 and the second heat pipe 8 are the same component, which reduces the cost of heat dissipation design and minimizes the weight added to the image transmission device 300 by the heat dissipation structure.
  • the third heat pipe 9 and the second heat pipe 8 are two independent components, and the heat dissipation structure of the image processing board 33 and the heat dissipation structure of the display screen 2 are independent, which is beneficial to realize the image processing board 33 and the display.
  • Screen 2 has a fast heat dissipation effect and is easy to install.
  • the third heat pipe 9 is distributed along the edge of the side portion 12 to prevent the third heat pipe 9 from causing installation troubles to other structures.
  • the third heat pipe 9 and the side portion 12 are spaced apart, and the heat on the third heat pipe 9 will not be transferred to the side portion 12 in a large amount, thereby ensuring that the housing 1 has a good touch experience.
  • the number of third heat pipes 9 can be determined by comprehensively considering factors such as the heat dissipation requirement of the display screen 2 and the volume and weight design of the image transmission device 300.
  • the third heat pipe 9 includes two, and the same ends of the two third heat pipes 9 are connected to the end of the display screen 2 close to the image processing board 33 by welding. Referring to FIG. 9, the other end of one third heat pipe 9 contacts the first radiator 42 to conduct heat, and the other end of the other third heat pipe 9 is arranged between the air inlet of the fan 41 and the first air inlet 1211. Optionally, the other end of the other third heat pipe 9 contacts the second heat sink 43 to conduct heat.
  • the air inlet 121 of this embodiment may further include a second air inlet 1212, which is aligned with the image processing board 33, which is conducive to external air flow entering the containing space and taking away the image processing The heat of the plate 33.
  • the second air inlet 1212 is directly opposite to the image processing board 33.
  • the second air inlet 1212 includes one or more air outlets, or other air outlet structures.
  • the first heat pipe 6, the second heat pipe 8, and the third heat pipe 9 are all special heat conducting devices, which are existing structures.
  • the bottom case 11 of this embodiment is further provided with a battery slot 127.
  • the image transmission device 300 may further include a power supply battery 10 and an electrical connection part provided in the battery slot 127, and the electrical connection part is electrically connected to the circuit board 3 of the above embodiment.
  • the power supply battery 10 can be inserted into the battery slot 127 and contact with the electrical connection part to realize the electrical connection between the power supply battery 10 and the circuit board 3, so that the power supply battery 10 supplies power to the image transmission device 300.
  • an embodiment of the present invention also provides an unmanned aerial vehicle.
  • the unmanned aerial vehicle includes a fuselage 100, a controller 200 and an image transmission device 300.
  • the camera body 100 is equipped with a camera 400.
  • the camera 400 is mounted on the fuselage 100 through a pan/tilt 500, and the camera 400 is stabilized by the pan/tilt 500.
  • the pan/tilt 500 can be a single-axis pan/tilt, a two-axis pan/tilt or a three-axis pan/tilt. Wait.
  • the controller 200 is provided in the body 100, and the controller 200 is communicatively connected with the camera 400.
  • the controller 200 in this embodiment wirelessly communicates with the image transmission device 300.
  • the controller 200 and the radio frequency board 31 of the image transmission device 300 implement communication based on a radio frequency communication manner.
  • the controller 200 of this embodiment can transmit the image collected by the camera 400 to the image transmission device 300.
  • the controller 200 may be, but not limited to, a CPU (Central Processing Unit), a GPU (Graphics Processing Unit, graphics processing unit), an MCU (Microcontroller Unit, micro control unit), and a DSP (Digital Signal Processing Unit). , Digital Signal Processor), FPGA (Field-Programmable Gate Array), etc.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
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Abstract

一种图传设备和具有该图传设备的无人机，所述图传设备包括：外壳(1)，包括底壳(11)和侧部(12)，侧部设有进风部(121)和出风部(122)；显示屏(2)，设在外壳上并与底壳相对设置，并且，显示屏和外壳形成一收容空间；电路板(3)；设于收容空间内，并与外壳间隔设置；散热器(4)，设于收容空间内，且散热器与进风部、出风部分别配合；第一导热基板(5)，与电路板远离显示屏的一侧接触导热；以及第一热管(6)，第一热管与第一导热基板、散热器分别接触导热；第一导热基板、第一热管与底壳间隔设置。本发明的图传设备能够进行快速散热，并具有较好的用户触摸体验。

Description

图传设备和具有该图传设备的无人机 技术领域
本发明涉及图传设备领域，尤其涉及一种图传设备和具有该图传设备的无人机。
背景技术
相关技术中，为确保图传设备的满足防水性能，图传设备外壳的密封性通常涉及的较好，这就导致图传设备内部的热量大量集聚。热量大量集聚，会对图传设备的显示屏、图传设备内部的电路板等造成较大影响，例如，图传设备内部的电路板可能会因温度过高无法正常工作甚至烧毁。对于上述问题，通常会基于该图传设备的外壳将图传设备内部的热量传导至图传设备的外部，这就导致外壳上会集聚大量热量，用户触摸体验较差。
发明内容
本发明提供一种图传设备和具有该图传设备的无人机。
具体地，本发明是通过如下技术方案实现的：
根据本发明的第一方面，提供一种图传设备，所述图传设备包括：
外壳，包括底壳和侧部，所述侧部设有进风部和出风部；
显示屏，设在所述外壳上并与所述底壳相对设置，并且，所述显示屏和所述外壳形成一收容空间；
电路板；设于所述收容空间内，并与所述外壳间隔设置；
散热器，设于所述收容空间内，且所述散热器与所述进风部、所述出风部分别配合；
第一导热基板，与所述电路板远离所述显示屏的一侧接触导热；以及
第一热管，所述第一热管与所述第一导热基板、所述散热器分别接触导热；
所述第一导热基板、所述第一热管与所述底壳间隔设置。
根据本发明的第二方面，提供一种无人机，所述无人机包括机身、控制器和图传设备，所述机身上搭载有拍摄装置，所述控制器设于所述机身，并与所述拍摄装置通信连接，所述控制器与所述图传设备无线通信，并且所述控制器能够将所述拍摄装置采集的图像传输至所述图传设备；其中，所述图传设备包括：
外壳，包括底壳和侧部，所述侧部设有进风部和出风部；
显示屏，设在所述外壳上并与所述底壳相对设置，并且，所述显示屏和所述外壳形成一收容空间；
电路板；设于所述收容空间内，并与所述外壳间隔设置；
散热器，设于所述收容空间内，且所述散热器与所述进风部、所述出风部分别配合；
第一导热基板，与所述电路板远离所述显示屏的一侧接触导热；以及
第一热管，所述第一热管与所述第一导热基板、所述散热器分别接触导热；
所述第一导热基板、所述第一热管与所述底壳间隔设置。
由以上本发明实施例提供的技术方案可见，通过在图传设备的外壳内设置散热器、第一导热板和第一热管，第一导热基板、第一热管和外壳内的电路板基于导热方式将热量传递至散热器，并由散热器将热量传导至外壳的外部，实现快速散热的效果；同时，第一导热基板、第一热管与底壳间隔设置，尽可能避免热量传递导至外壳上，从而提高用户触摸体验。
附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1是本发明一实施例中的图传设备的结构示意图；
图2是本发明一实施例中的图传设备在另一方向的结构示意图；
图3是本发明一实施例中的图传设备在又一方向的结构示意图；
图4是本发明一实施例中的图传设备在还一方向的结构示意图；
图5是本发明一实施例中的图传设备的部分结构拆分示意图；
图6是本发明一实施例中的图传设备的部分结构的结构示意图；
图7A是本发明一实施例中的图传设备的剖面示意图；
图7B是图7A所示实施例的图传设备的局部放大图；
图8是本发明一实施例中的图传设备的另一部分结构的结构示意图；
图9是本发明一实施例中的图传设备的又一部分结构的结构示意图；
图10是本发明一实施例中的无人机的结构示意图。
附图标记：
100：机身；
200：控制器；
300：图传设备；1：外壳；11：底壳；12：侧部；121：进风部；1211：第一进风部；1212：第二进风部；122：出风部；123：第一侧部；124：第 二侧部；125：第三侧部；126：第四侧部；127：电池槽；2：显示屏；3：电路板；31：射频板；32：图传板；33：图像处理板；4：散热器；41：风扇；42：第一散热器；421：通道；43：第二散热器；5：第一导热基板；51：第一导热区域；52：第二导热区域；6：第一热管；7：第二导热基板；8：第二热管；9：第三热管；10：供电电池；
400：拍摄装置；
500：云台。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
下面结合附图，对本发明的图传设备和具有该图传设备的无人机进行详细说明。在不冲突的情况下，下述的实施例及实施方式中的特征可以相互组合。
结合图1至图5，本发明实施例提供一种图传设备300，该图传设备300可包括外壳1、显示屏2、电路板3、散热器4、第一导热基板5和第一热管6。其中，外壳1包括底壳11和侧部12，本实施例的侧部12设有进风部121和出风部122。显示屏2设在外壳1上，并且，显示屏2与底壳11相对设置。可选的，显示屏2卡接在侧壁远离底壳11一侧的内圈。本实施例中，显示屏2和外壳1形成一收容空间，电路板3设于收容空间内，且电路板3与外壳1间隔设置。进一步的，散热器4设于收容空间内，且散热器4与进风部121、出风部122分别配合。第一导热基板5与电路板3远离显示屏2的一侧接触导热，第一热管6与第一导热基板5、散热 器4分别接触导热，并且，第一导热基板5、第一热管6与底壳11间隔设置。
本发明实施例的图传设备300，通过在外壳1内设置散热器4、第一导热板和第一热管6，第一导热基板5、第一热管6和外壳1内的电路板3基于导热方式将热量传递至散热器4，并由散热器4将热量传导至外壳1的外部，实现快速散热的效果；同时，第一导热基板5、第一热管6与底壳11间隔设置，尽可能避免热量传递至外壳1上，从而提高用户触摸体验。
本实施例的外壳1大致呈长方体、正方体或其他形状。
本实施例中，侧部12可包括相对设置的第一侧部123和第二侧部124以及相对设置的第三侧部125和第四侧部126。可选的，第一侧部12和/或第二侧部124设有按键和/或接口，如开机按键、回放按键、存储卡接口、数据接口等。进风部121设于第三侧部125和/或第四侧部126，出风部122设于第三侧部125和/或第四侧部126，提高图传设备300的美观性。可选的，当外壳1呈长方体时，第一侧部123和第二侧部124为两个相对设置的短边，第三侧部125和第四侧部126为两个相对设置的长边，符合用户使用习惯。
结合图1、图2以及图5，进风部121可包括第一进风部1211，出风部122包括第一出风部，第一进风部1211和第一出风部相对设置在侧部12的两侧。例如，当外壳1呈长方体时，侧部12包括两个相对而设的长边和两个相对而设的短边。第一进风部1211可设于其中一长边上，第一出风部可设于另一长边上。
可选的，第一进风部1211包括一个或多个进风孔，或者其他进风结构。可选的，第一出风部包括一个或多个出风孔，或者其他出风结构。以第一进风部1211包括多个进风孔、第一出风部包括多个出风孔为例，本实施例中，第一进风部1211的多个进风孔与第一出风部的多个出风孔相对。 可选的，第一进风部1211的中心与第一出风部的中心连线与短边大致平行。
参见图5，散热器4可包括风扇41和第一散热器42，该风扇41包括进风口和出风口。其中，进风口与第一进风部1211配合。可选的，进风口与第一进风部1211对准，如进风口与第一进风部1211正对。第一散热器42设于出风口一侧，出风口经第一散热器42与第一出风部配合。可选的，第一散热器42的一端与出风口对准，第一散热器42的另一端与第一出风部对准，如第一散热器42的一端与出风口正对，第一散热器42的另一端与第一出风部正对。
本实施例通过风扇41、第一散热器42以及第一进风部1211和第一出风部的配合，能够将收容空间内的热量及时散至外部，避免显示屏2、电路板3的工作受到影响。
结合图5、图6以及图8，本实施例的散热器4还可包括第二散热器43，该第二散热器43可设于风扇41进风口与第一进风部1211之间。在本实施例中，第二散热器43可包括基板和设于基板上的鳍片。通过第二散热器43与第一进风部1211的配合，将收容空间内的热量带入风扇41，再由第一散热器42将热量从第一出风部散出，对收容空间进一步散热。
此外，为进一步减少传递至外壳1的热量，在一实施例中，散热器4与底壳11间隔设置。本实施例的散热器4可通过快拆件与底壳11可拆卸连接，方便散热器4的安装与维修。可选的，该快拆件的材质为非导热材质如塑料，进一步避免热量由散热器4传递至外壳1上。可以理解，本实施例的散热器4也可采用其他方式与底壳11可拆卸连接。
在一些实施例中，电路板3、底壳11以及显示屏2大致平行，这种排布方式使得结构更加紧凑，能够减小图传设备300的厚度，从而减小图传设备300的体积；同时，这种排布方式有利于第一导热基本、第一热管 6的放置。
本实施例的电路板3可设有发热元件如处理器、电阻等电子元件，第一导热基板5与电路板3远离显示屏2一侧的发热元件接触导热。可选的，第一导热基板5与电路板3远离显示屏2一侧的发热元件贴设，实现接触导热。
参见图5，本实施例的电路板3包括射频板31、图传板32和图像处理板33，其中，射频板31经图传板32与图像处理板33通信。本实施例的射频板31基于射频通信方式与外部设备进行无线通信，可接收外部设备发送的图像，该图像可为单张图片，也可为视频流。图传板32负责将射频板31接收的图像传输至图像处理板33，图像处理板33可对图像进行处理，如去噪、增强等。
本实施例中，图像处理板33为一独立电路板3，若图像处理板33损坏，不会影响射频板31与图传板32的使用，且图像处理板33独立设置，方便更换与维修。本实施例的散热器4和图像处理板33可相对设置在射频板31与图传板32的两侧。
在一实施例中，射频板31与图传板32为一整体。在另一实施例中，射频板31与图传板32为相互独立的电路板3，射频板31与图传板32并排设置。本实施例中，射频板31和图传板32其中一个损坏，不会影响另一块的使用，且射频板31和图传板32分开设置，方便射频板31和图传板32的更换与维修。可选的，射频板31与图传板32的排布方向与外壳1的短边大致平行，有利于结构的布局。
为将射频板31和/或图传板32产生的热量快速散走，可选地，结合图5和图6，第一导热基板5的一部分与射频板31和/或图传板32远离显示屏2的一侧接触导热，且第一导热基板5的另一部分与第一散热器42接触导热。本实施例中，第一导热基板5的一部分直接盖设在射频板31 和/或图传板32远离显示屏2的一侧表面，射频板31和/或图传板32产生的热量能够快速传导至第一导热基板5上。
本实施例中，第一热管6设于第一导热基板5远离射频板31和图传板32的一侧，从而通过第一热管6将第一导热基板5上的热量快速传导至第一散热器42上。
参见图5，第一散热器42位于射频板31与图传板32的一侧，并且，第一散热器42设于底壳11与第一散热基板之间，通过第一散热器42隔开第一散热基板与底壳11，进一步防止第一散热板上的热量传递至外壳1。
在本实施例中，结合图6和图7A，第一导热基板5可包括第一导热区域51和第二导热区域52，其中，第一导热区域51与射频板31和/或图传板32远离显示屏2的一侧接触导热，第二导热区域52与第一散热器42接触导热。可选的，第一导热区域51盖设射频板31和图传板32远离显示屏2的一侧，以将射频板31和图传板32产生的热量尽快散走。可选的，第二导热区域52盖设第一散热器42，通过风扇41和第一散热器42的配合，将第二导热区域52上集聚的热量迅速散去。
进一步的，第一热管6的一部分与第一导热区域51接触导热，第一热管6的另一部分与第二导热区域52接触导热，通过第一热管6将第一导热区域51的热量更快地传导至第二导热区域52，使得第一导热基板5的热量尽快传导至第一散热器42而散出。
更进一步的，结合图7A和图7B，第二导热区域52与第一散热器42配合形成密封的通道421，通道421的一端与风扇41的出风口配合，通道421的另一端与第一出风部配合，提高散热效率。在一些例子中，通道421包括一个。在另一些例子中，通道421包括多个子通道，相邻子通道相互隔开。在本实施例中，相邻子通道之间可通过隔挡片隔开。可选的，隔挡片设于第一散热器42和第二导热区域52中的一个上，如隔挡片设于 第一散热器42，第二导热区盖设隔挡片，即可形成多个子通道。可选的，隔挡片包括设于第二导热区域52的上隔挡片和设于第一散热器42的下隔挡片，上隔挡片和下隔挡片对应配合，形成多个子通道。
可选的，第一导热基板5设有凹槽，第一热管6至少部分嵌设在第一导热基板5的凹槽中，能够实现第一热管6与第一导热基板5之间的稳定接触。进一步的，第一导热基板5与第一热管6之间可设有导热填充材料，通过填充材料填充第一热管6与第一导热基板5之间的缝隙，确保第一热管6与第一导热基板5的充分接触，从而使得热量由第一导热基板5快速传导至第一热管6上。可选的，填充材料为粉末状或丝状的金属。
本实施例中，第一热管6的导热系数大于第一导热基板5的导热系数。可选的，第一热管6为铜管或其他材质。可选的，第一导热基板5为铝材质、镁材质或其他材质制成的基板，可考虑重量、体积、导热效率等因素来选择第一导热基板5的材质。
可选的，第一热管6呈扁平状，减小第一热管6的占用空间。当然，第一热管6也可设计为其他形状。
参见图8，本实施例的图传设备300还可包括第二导热基板7和第二热管8，其中，第二导热基板7与图像处理板33朝向显示屏2的一侧接触导热，第二热管8的一端与第二导热基板7接触导热，第二热管8的另一端与第一散热器42接触导热。本实施例通过第二导热基板7将图像处理板33的热量传导至第二热管8，再由第二热管8将第二导热基板7上的热量传导至第一散热器42，实现图像处理板33的散热。
可选的，第二热管8的一端设于第二导热基板7与显示屏2之间。
可选的，第二导热基板7设有凹槽，第二热管8至少部分嵌设在第二导热基板7的凹槽中，能够实现第二热管8与第二导热基板7之间的稳定接触。进一步的，第二导热基板7与第二热管8之间可设有导热填充材 料，通过填充材料填充第二热管8与第二导热基板7之间的缝隙，确保第二热管8与第二导热基板7的充分接触，从而使得热量由第二导热基板7快速传导至第二热管8上。可选的，填充材料为粉末状或丝状的金属。
本实施例中，第二热管8的导热系数大于第二导热基板7的导热系数。可选的，第二热管8为铜管或其他材质。可选的，第二导热基板7为铝材质、镁材质或其他材质制成的基板，可考虑重量、体积、导热效率等因素来选择第二导热基板7的材质。
第二热管8呈扁平状，减小第二热管8的占用空间。当然，第二热管8也可设计为其他形状。
参见图9，本实施例的图传设备300还包括第三热管9，第三热管9设于图像处理板33与显示屏2之间，且第三热管9的一部分与显示屏2接触导热，第三热管9的另一部分至少与第一散热器42接触导热。本实施例通过第三热管9及时对显示屏2散热，防止显示屏2因温度过高而损坏。
在一实施例中，第三热管9与第二热管8为同一部件，降低散热设计的成本且尽量减小散热结构给图传设备300增加的重量。而在另一实施例中，第三热管9与第二热管8为相互独立的两个部件，图像处理板33的散热结构以及显示屏2的散热结构独立，有利于实现图像处理板33与显示屏2的快速散热效果，且方便安装。
可选的，参见图9，第三热管9沿着侧部12边缘分布，防止第三热管9对其他结构造成安装困扰。并且，第三热管9与侧部12间隔设置，第三热管9上的热量不会大量传导至侧部12，从而确保外壳1具备良好的触摸体验。
本实施例中，可综合考虑显示屏2的散热需求、图传设备300的体积和重量设计等因素来确定第三热管9的数量。可选的，第三热管9包括两个，两个第三热管9的同一端通过焊接方式与显示屏2靠近图像处理板 33的一端相连接。参见图9，其中一个第三热管9的另一端与第一散热器42接触导热，另一个第三热管9的另一端设于风扇41的进风口与第一进风部1211之间。可选的，另一个第三热管9的另一端与第二散热器43接触导热。
此外，参见图2，本实施例的进风部121还可包括第二进风部1212，第二进风部1212对准图像处理板33，有利于外部气流进入收容空间，并带走图像处理板33的热量。可选的，第二进风部1212与图像处理板33正对。可选的，第二进风部1212包括一个或多个出风孔，或者其他出风结构。
需要说明的是，本发明中，第一热管6、第二热管8、第三热管9均为专门的导热器件，为现有结构。
又结合图2和图3，本实施例的底壳11还设有电池槽127。图传设备300还可包括供电电池10以及设于电池槽127中的电连接部，该电连接部与上述实施例的电路板3电连接。供电电池10可插接在电池槽127中，并与电连接部接触而实现供电电池10与电路板3的电连接，从而通过供电电池10对图传设备300供电。
参见图10，本发明实施例还提供一种无人机，该无人机包括机身100、控制器200和图传设备300。其中，机身100上搭载有拍摄装置400。可选的，拍摄装置400通过云台500搭载在机身100上，通过云台500对拍摄装置400进行增稳，该云台500可为单轴云台、两轴云台或三轴云台等。
进一步的，控制器200设于机身100，并且，该控制器200与拍摄装置400通信连接。本实施例的控制器200与图传设备300无线通信，具体的，控制器200与图传设备300的射频板31基于射频通信方式实现通信。本实施例的控制器200能够将拍摄装置400采集的图像传输至图传设备 300。可选的，该控制器200可以是但不限于CPU(Central Processing Unit，中央处理器)、GPU(Graphics Processing Unit，图形处理器)、MCU(Microcontroller Unit，微控制单元)、DSP(Digital Signal Processing，数字信号处理器)、FPGA(Field－Programmable Gate Array，即现场可编程门阵列)等。
需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。
以上对本发明实施例所提供的图传设备和具有该图传设备的无人机进行了详细介绍，本文中应用了具体个例对本发明的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本发明的方法及其核心思想；同时，对于本领域的一般技术人员，依据本发明的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本发明的限制。

Claims (50)

  1. 一种图传设备，其特征在于，所述图传设备包括：
    外壳，包括底壳和侧部，所述侧部设有进风部和出风部；
    显示屏，设在所述外壳上并与所述底壳相对设置，并且，所述显示屏和所述外壳形成一收容空间；
    电路板；设于所述收容空间内，并与所述外壳间隔设置；
    散热器，设于所述收容空间内，且所述散热器与所述进风部、所述出风部分别配合；
    第一导热基板，与所述电路板远离所述显示屏的一侧接触导热；以及
    第一热管，所述第一热管与所述第一导热基板、所述散热器分别接触导热；
    所述第一导热基板、所述第一热管与所述底壳间隔设置。
  2. 根据权利要求1所述的图传设备，其特征在于，所述进风部包括第一进风部，所述出风部包括第一出风部，所述第一进风部和所述第一出风部相对设置在所述侧部的两侧；
    所述散热器包括风扇和设于风扇出风口一侧的第一散热器，所述风扇的进风口与所述第一进风部配合，所述风扇的出风口经所述第一散热器与所述第一出风部配合。
  3. 根据权利要求2所述的图传设备，其特征在于，所述散热器还包括设于风扇进风口与所述第一进风部之间的第二散热器，所述第二散热器包括基板和设于基板上的鳍片。
  4. 根据权利要求2或3所述的图传设备，其特征在于，所述散热器与所述底壳间隔设置，并通过快拆件与所述底壳可拆卸连接。
  5. 根据权利要求2或3所述的图传设备，其特征在于，所述电路板包括射频板、图传板和图像处理板，所述射频板经所述图传板与所述图像处理板通信；
    所述射频板与所述图传板为一整体，或者，所述射频板与所述图传板 并排设置；
    所述散热器和所述图像处理板相对设置在所述射频板与所述图传板的两侧。
  6. 根据权利要求5所述的图传设备，其特征在于，所述第一导热基板的一部分与所述射频板和/或所述图传板远离所述显示屏的一侧接触导热，所述第一导热基板的另一部分与所述第一散热器接触导热；
    所述第一热管设于所述第一导热基板远离所述射频板和所述图传板的一侧。
  7. 根据权利要求6所述的图传设备，其特征在于，所述第一散热器位于所述射频板与所述图传板的一侧，并且，所述第一散热器设于所述底壳与所述第一散热基板之间。
  8. 根据权利要求7所述的图传设备，其特征在于，所述第一导热基板包括第一导热区域和第二导热区域，所述第一导热区域与所述射频板和/或所述图传板远离所述显示屏的一侧接触导热，所述第二导热区域与所述第一散热器接触导热；
    所述第一热管的一部分与所述第一导热区域接触导热，所述第一热管的另一部分与所述第二导热区域接触导热。
  9. 根据权利要求8所述的图传设备，其特征在于，所述第二导热区域与所述第一散热器配合形成密封的通道，所述通道的一端与所述风扇的出风口配合，所述通道的另一端与所述第一出风部配合。
  10. 根据权利要求9所述的图传设备，其特征在于，所述通道包括多个子通道。
  11. 根据权利要求5所述的图传设备，其特征在于，所述图传设备还包括第二导热基板和第二热管；
    所述第二导热基板与所述图像处理板朝向所述显示屏的一侧接触导热；
    所述第二热管的一端与所述第二导热基板接触导热，所述第二热管的 另一端与所述第一散热器接触导热。
  12. 根据权利要求11所述的图传设备，其特征在于，所述第二热管的一端设于所述第二导热基板与所述显示屏之间。
  13. 根据权利要求11所述的图传设备，其特征在于，所述进风部还包括第二进风部，所述第二进风部对准所述图像处理板。
  14. 根据权利要求11所述的图传设备，其特征在于，所述图传设备还包括第三热管，所述第三热管设于所述图像处理板与所述显示屏之间，且所述第三热管的一部分与所述显示屏接触导热，所述第三热管的另一部分至少与所述第一散热器接触导热。
  15. 根据权利要求14所述的图传设备，其特征在于，所述第三热管与所述第二热管为同一部件；或者，
    所述第三热管与所述第二热管为相互独立的两个部件。
  16. 根据权利要求14或15所述的图传设备，其特征在于，所述第三热管沿着所述侧部边缘分布，并与所述侧部间隔设置。
  17. 根据权利要求14或15所述的图传设备，其特征在于，所述第三热管包括两个，两个所述第三热管的同一端通过焊接方式与所述显示屏靠近所述图像处理板的一端相连接；
    其中一个第三热管的另一端与所述第一散热器接触导热，另一个第三热管的另一端设于所述风扇的进风口与所述第一进风部之间。
  18. 根据权利要求13所述的图传设备，其特征在于，所述第一导热基板和/或所述第二导热基板分别设有凹槽，所述第一热管至少部分嵌设在所述第一导热基板的凹槽中；和/或
    所述第二热管的一部分嵌设在所述第二导热基板的凹槽中。
  19. 根据权利要求18所述的图传设备，其特征在于，所述第一导热基板与所述第一热管之间设有导热填充材料；和/或
    所述第二导热基板与所述第二热管之间设有导热填充材料。
  20. 根据权利要求13所述的图传设备，其特征在于，所述第一热管的 导热系数大于所述第一导热基板的导热系数；和/或
    所述第二热管的导热系数大于所述第二导热基板的导热系数。
  21. 根据权利要求20所述的图传设备，其特征在于，所述第一热管和/或所述第二热管为铜管，所述第一导热基板和/或所述第二导热基板为铝材质或镁材质制成的基板。
  22. 根据权利要求20或21所述的图传设备，其特征在于，所述第一热管和/或所述第二热管呈扁平状。
  23. 根据权利要求1所述的图传设备，其特征在于，所述电路板设有发热元件，所述第一导热基板与所述电路板远离所述显示屏一侧的发热元件接触导热。
  24. 根据权利要求1所述的图传设备，其特征在于，所述侧部包括相对设置的第一侧部和第二侧部，以及相对设置的第三侧部和第四侧部；
    所述第一侧侧部和/或所述第二侧部设有按键和/或接口；
    所述进风部设于所述第三侧部和/或所述第四侧部，所述出风部设于所述第三侧部和/或所述第四侧部。
  25. 根据权利要求1所述的图传设备，其特征在于，所述电路板、所述底壳以及所述显示屏大致平行。
  26. 一种无人机，其特征在于，所述无人机包括机身、控制器和图传设备，所述机身上搭载有拍摄装置，所述控制器设于所述机身，并与所述拍摄装置通信连接，所述控制器与所述图传设备无线通信，并且所述控制器能够将所述拍摄装置采集的图像传输至所述图传设备；其中，所述图传设备包括：
    外壳，包括底壳和侧部，所述侧部设有进风部和出风部；
    显示屏，设在所述外壳上并与所述底壳相对设置，并且，所述显示屏和所述外壳形成一收容空间；
    电路板；设于所述收容空间内，并与所述外壳间隔设置；
    散热器，设于所述收容空间内，且所述散热器与所述进风部、所述出 风部分别配合；
    第一导热基板，与所述电路板远离所述显示屏的一侧接触导热；以及
    第一热管，所述第一热管与所述第一导热基板、所述散热器分别接触导热；
    所述第一导热基板、所述第一热管与所述底壳间隔设置。
  27. 根据权利要求26所述的无人机，其特征在于，所述进风部包括第一进风部，所述出风部包括第一出风部，所述第一进风部和所述第一出风部相对设置在所述侧部的两侧；
    所述散热器包括风扇和设于风扇出风口一侧的第一散热器，所述风扇的进风口与所述第一进风部配合，所述风扇的出风口经所述第一散热器与所述第一出风部配合。
  28. 根据权利要求27所述的无人机，其特征在于，所述散热器还包括设于风扇进风口与所述第一进风部之间的第二散热器，所述第二散热器包括基板和设于基板上的鳍片。
  29. 根据权利要求27或28所述的无人机，其特征在于，所述散热器与所述底壳间隔设置，并通过快拆件与所述底壳可拆卸连接。
  30. 根据权利要求27或28所述的无人机，其特征在于，所述电路板包括射频板、图传板和图像处理板，所述射频板经所述图传板与所述图像处理板通信；
    所述射频板与所述图传板为一整体，或者，所述射频板与所述图传板并排设置；
    所述散热器和所述图像处理板相对设置在所述射频板与所述图传板的两侧。
  31. 根据权利要求30所述的无人机，其特征在于，所述第一导热基板的一部分与所述射频板和/或所述图传板远离所述显示屏的一侧接触导热，所述第一导热基板的另一部分与所述第一散热器接触导热；
    所述第一热管设于所述第一导热基板远离所述射频板和所述图传板的 一侧。
  32. 根据权利要求31所述的无人机，其特征在于，所述第一散热器位于所述射频板与所述图传板的一侧，并且，所述第一散热器设于所述底壳与所述第一散热基板之间。
  33. 根据权利要求32所述的无人机，其特征在于，所述第一导热基板包括第一导热区域和第二导热区域，所述第一导热区域与所述射频板和/或所述图传板远离所述显示屏的一侧接触导热，所述第二导热区域与所述第一散热器接触导热；
    所述第一热管的一部分与所述第一导热区域接触导热，所述第一热管的另一部分与所述第二导热区域接触导热。
  34. 根据权利要求33所述的无人机，其特征在于，所述第二导热区域与所述第一散热器配合形成密封的通道，所述通道的一端与所述风扇的出风口配合，所述通道的另一端与所述第一出风部配合。
  35. 根据权利要求34所述的无人机，其特征在于，所述通道包括多个子通道。
  36. 根据权利要求30所述的无人机，其特征在于，所述图传设备还包括第二导热基板和第二热管；
    所述第二导热基板与所述图像处理板朝向所述显示屏的一侧接触导热；
    所述第二热管的一端与所述第二导热基板接触导热，所述第二热管的另一端与所述第一散热器接触导热。
  37. 根据权利要求36所述的无人机，其特征在于，所述第二热管的一端设于所述第二导热基板与所述显示屏之间。
  38. 根据权利要求36所述的无人机，其特征在于，所述进风部还包括第二进风部，所述第二进风部对准所述图像处理板。
  39. 根据权利要求36所述的无人机，其特征在于，所述图传设备还包括第三热管，所述第三热管设于所述图像处理板与所述显示屏之间，且所 述第三热管的一部分与所述显示屏接触导热，所述第三热管的另一部分至少与所述第一散热器接触导热。
  40. 根据权利要求39所述的无人机，其特征在于，所述第三热管与所述第二热管为同一部件；或者，
    所述第三热管与所述第二热管为相互独立的两个部件。
  41. 根据权利要求39或40所述的无人机，其特征在于，所述第三热管沿着所述侧部边缘分布，并与所述侧部间隔设置。
  42. 根据权利要求39或40所述的无人机，其特征在于，所述第三热管包括两个，两个所述第三热管的同一端通过焊接方式与所述显示屏靠近所述图像处理板的一端相连接；
    其中一个第三热管的另一端与所述第一散热器接触导热，另一个第三热管的另一端设于所述风扇的进风口与所述第一进风部之间。
  43. 根据权利要求38所述的无人机，其特征在于，所述第一导热基板和/或所述第二导热基板分别设有凹槽，所述第一热管至少部分嵌设在所述第一导热基板的凹槽中；和/或
    所述第二热管的一部分嵌设在所述第二导热基板的凹槽中。
  44. 根据权利要求43所述的无人机，其特征在于，所述第一导热基板与所述第一热管之间设有导热填充材料；和/或
    所述第二导热基板与所述第二热管之间设有导热填充材料。
  45. 根据权利要求38所述的无人机，其特征在于，所述第一热管的导热系数大于所述第一导热基板的导热系数；和/或
    所述第二热管的导热系数大于所述第二导热基板的导热系数。
  46. 根据权利要求45所述的无人机，其特征在于，所述第一热管和/或所述第二热管为铜管，所述第一导热基板和/或所述第二导热基板为铝材质或镁材质制成的基板。
  47. 根据权利要求45或46所述的无人机，其特征在于，所述第一热管和/或所述第二热管呈扁平状。
  48. 根据权利要求26所述的无人机，其特征在于，所述电路板设有发热元件，所述第一导热基板与所述电路板远离所述显示屏一侧的发热元件接触导热。
  49. 根据权利要求26所述的无人机，其特征在于，所述侧部包括相对设置的第一侧部和第二侧部，以及相对设置的第三侧部和第四侧部；
    所述第一侧侧部和/或所述第二侧部设有按键和/或接口；
    所述进风部设于所述第三侧部和/或所述第四侧部，所述出风部设于所述第三侧部和/或所述第四侧部。
  50. 根据权利要求26所述的无人机，其特征在于，所述电路板、所述底壳以及所述显示屏大致平行。
PCT/CN2019/073144 2019-01-25 2019-01-25 图传设备和具有该图传设备的无人机 Ceased WO2020150995A1 (zh)

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