WO2020147491A1 - 显示基板及其制备方法、显示装置 - Google Patents

显示基板及其制备方法、显示装置 Download PDF

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Publication number
WO2020147491A1
WO2020147491A1 PCT/CN2019/126183 CN2019126183W WO2020147491A1 WO 2020147491 A1 WO2020147491 A1 WO 2020147491A1 CN 2019126183 W CN2019126183 W CN 2019126183W WO 2020147491 A1 WO2020147491 A1 WO 2020147491A1
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Prior art keywords
layer
groove
insulating layer
metal layer
display substrate
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PCT/CN2019/126183
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English (en)
French (fr)
Inventor
程博
张顺
周洋
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BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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Priority to US16/767,972 priority Critical patent/US11164929B2/en
Publication of WO2020147491A1 publication Critical patent/WO2020147491A1/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/126—Shielding, e.g. light-blocking means over the TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment

Definitions

  • the present disclosure relates to the field of communication technology, and in particular to a display substrate, a preparation method thereof, and a display device.
  • AMOLED Active-matrix organic light-emitting diode
  • Some embodiments of the present disclosure provide a display substrate, the display substrate comprising: a base substrate, on which a light shielding layer, a first insulating layer, a first metal layer, and a second An insulating layer and a light emitting device; wherein the second insulating layer has a first groove and a second groove, and the portion of the second insulating layer between the first groove and the second groove constitutes a retaining wall Structure; relative to the second groove, the first groove is located on the side of the retaining wall structure close to the light emitting device; the first metal layer includes: in the first groove away from the The signal line on one side of the retaining wall structure, and the connecting terminal on the side of the second groove away from the retaining wall structure; the light shielding layer includes a connecting lead, and the signal line and the connecting terminal are connected through the The leads are electrically connected.
  • the connecting terminal on the side of the second groove away from the retaining wall structure and the signal line on the side of the first groove away from the retaining wall structure are shielded from light
  • the connecting leads of the layers are electrically connected, so as to prevent the first metal layer from being corroded in the groove area and prevent the formation of water and oxygen channels while ensuring the connection between the signal line and the connection terminal, thereby avoiding subsequent packaging failures and improving packaging reliability , It can also reduce the possibility of GDS and improve the display effect.
  • the orthographic projection of the first metal layer on the base substrate does not overlap with the orthographic projections of the first groove, the second groove, and the barrier structure on the base substrate.
  • the first metal layer has no pattern in the area of the first groove, the area of the second groove and the area of the barrier structure, and the first metal layer has no pattern in the first groove area and the second groove area, so that the first There is no area in the metal layer that is not protected by the second insulating layer, so that it can prevent the first metal layer from being corroded in the groove area while ensuring the connection between the signal line and the connection terminal, preventing the formation of water and oxygen channels, and thus avoiding subsequent packaging Failure to improve packaging reliability can also reduce the incidence of GDS and improve the display effect.
  • the signal line and the connection terminal pass through the connecting lead, and a first insulating layer is provided on the connecting lead.
  • An insulating layer can prevent the connection leads from being corroded.
  • the first insulating layer includes: a first sub-insulating layer and a second sub-insulating layer, and the display substrate further includes a first sub-insulating layer located between the first sub-insulating layer and the second sub-insulating layer.
  • the second metal layer includes a first lap lead and/or a second lap lead
  • connection terminal is electrically connected to the light shielding layer through the first lap lead, and the signal line is electrically connected to the light shield layer through the second lap lead.
  • the first metal layer is a source and drain metal layer; the second metal layer is a gate metal layer.
  • the thickness of the light shielding layer is equal to the thickness of the first metal layer.
  • the thickness uniformity of the lead can be improved, and the uniformity of the resistance of the lead can be improved.
  • the material of the light shielding layer is the same as the material of the first metal layer.
  • the thickness of the light-shielding layer is equal to the thickness of the first metal layer, and the material of the light-shielding layer is the same as that of the first metal layer, so as to ensure that the resistance of the light-shielding layer and the first metal layer are the same, and avoid the influence of lead loading on product performance. .
  • the material of the light shielding layer and the first metal layer is a laminated material of titanium, aluminum, or titanium.
  • it further includes: an inorganic encapsulation layer covering the first groove, the second groove, the barrier structure and the light emitting device.
  • Some embodiments of the present disclosure provide a method for preparing a display substrate, the method comprising sequentially forming a light shielding layer, a first insulating layer, a first metal layer, a second insulating layer, a light emitting device, and an encapsulation layer on the base substrate; Wherein, when the first insulating layer is formed, a through hole is formed in the first insulating layer, so that the signal line in the first metal layer is connected to the connecting lead in the light shielding layer through the through hole, so that The connection terminal in the first metal layer is connected to the connection lead in the light shielding layer through a through hole.
  • a display device provided by some embodiments of the present disclosure includes the above-mentioned display substrate provided by some embodiments of the present disclosure.
  • Figure 1 is a schematic diagram of the structure of a related art display panel
  • Figure 2 is a schematic diagram of the failure of the related technology to package at the edge of the lead
  • FIG. 3 is a schematic structural diagram of a display substrate provided by some embodiments of the present disclosure.
  • FIG. 4 is a schematic structural diagram of another display substrate provided by some embodiments of the present disclosure.
  • FIG. 5 is a schematic structural diagram of yet another display substrate provided by some embodiments of the present disclosure.
  • FIG. 6 is a schematic structural diagram of yet another display substrate provided by some embodiments of the present disclosure.
  • FIG. 7 is a schematic structural diagram of yet another display substrate provided by some embodiments of the present disclosure.
  • FIG. 8 is a schematic structural diagram of still another display substrate provided by some embodiments of the present disclosure.
  • AMOLED is an array (Array) backplane circuit, OLED device light-emitting layer, cathode and encapsulation layer.
  • the power line (VDD lead) and low potential power line (VSS lead) in the frame area are generally on the same layer as the source and drain of the thin film transistor. Take the VDD lead as an example, as shown in Figure 1.
  • the display panel includes: a base substrate 1, a buffer layer 2, a gate insulating layer 3, an interlayer insulating layer 4, a VDD lead 5, a planarization layer 6, a pixel definition layer 7, a spacer layer 8, an inorganic encapsulation layer 9, Related technology Due to packaging requirements, it is necessary to design a retaining wall (Dam) 10. There are recessed areas 11 on both sides of Dam 10, VDD lead 5 turns in recessed area 11, and there is no insulating layer to protect VDD lead 5 on both sides of Dam 10, making VDD lead 5 The edge 12 is more likely to be corroded and becomes a water and oxygen channel. And at the edge 12 of the VDD lead 5, as shown in FIG.
  • the edge of the VDD lead 5 is corroded, and the inorganic encapsulation layer 9 is cracked.
  • the inorganic encapsulation layer is destroyed, water vapor and oxygen will enter the display area along the channel, and the water and oxygen will corrode the device to form growing dark spots (GDS), which gradually increase with time and deteriorate the device performance , And cause display abnormalities.
  • GDS growing dark spots
  • the display substrate includes: a base substrate 1, on which a light shielding layer 13 and a first insulating layer are sequentially stacked and arranged 14.
  • the first metal layer includes: the signal line 21 on the side of the first groove 18 away from the retaining wall structure 20, and the second groove 19 away from the retaining wall structure
  • the connecting terminal 22 on the side of 20; the light shielding layer 13 includes a connecting lead 23, and the signal line 21 and the connecting terminal 22 are electrically connected 23 through the connecting lead.
  • the connecting terminal on the side of the second groove away from the retaining wall structure and the signal line on the side of the first groove away from the retaining wall structure are shielded from light
  • the connecting leads of the layers are electrically connected, so as to prevent the first metal layer from being corroded in the groove area and prevent the formation of water and oxygen channels while ensuring the connection between the signal line and the connection terminal, thereby avoiding subsequent packaging failures and improving packaging reliability , It can also reduce the incidence of GDS and improve the display effect.
  • some embodiments of the present disclosure provide a display substrate as shown in FIG. 3, the orthographic projection of the first metal layer 15 on the base substrate is related to the first groove 18, the second groove 19, and the stopper.
  • the orthographic projections of the wall structure 20 on the base substrate 1 do not overlap each other.
  • the first metal layer has no pattern in the area of the first groove, the area of the second groove and the area of the barrier structure, and the first metal layer has no pattern in the first groove area and the second groove area, so that the first There is no area in the metal layer that is not protected by the second insulating layer, so that it can prevent the first metal layer from being corroded in the groove area while ensuring the connection between the signal line and the connection terminal, preventing the formation of water and oxygen channels, and thus avoiding subsequent packaging Failure to improve packaging reliability can also reduce the incidence of GDS and improve the display effect.
  • the signal line and the connection terminal pass through the connecting lead, and a first insulating layer is provided on the connecting lead.
  • An insulating layer can prevent the connection leads from being corroded.
  • the first insulating layer 14 includes: a buffer layer 2, a gate insulating layer 3, and an interlayer insulating layer 4; and the second insulating layer 16 includes :Planarization layer 6, pixel definition layer 7, spacer layer 8.
  • the light shielding layer may be used for fingerprint recognition, for example.
  • the signal line may be a VDD lead or a VSS lead.
  • the first insulating layer 14 includes a first sub-insulating layer 24 and a second sub-insulating layer 25, and the display substrate further includes a first sub-insulating layer 24.
  • the second metal layer between the second sub-insulating layer 25;
  • the second metal layer includes a first lap lead 26 and/or a second lap lead 27;
  • the connecting terminal 22 is electrically connected to the light shielding layer 13 through the first bonding wire 26, and the signal line 21 is electrically connected to the light shielding layer 13 through the second bonding wire 27.
  • the first sub-insulating layer 24 includes the buffer layer 2, and the second sub-insulating layer 25 includes the gate insulating layer 3 and the interlayer insulating layer 4.
  • the connecting terminal 22 is electrically connected to the light shielding layer 13 through the first bonding wire 26, and the signal line 21 is directly electrically connected to the light shielding layer 13.
  • the signal line 21 is electrically connected to the light shielding layer 13 through the second bonding wire 27, and the connecting terminal 22 is directly electrically connected to the light shielding layer 13.
  • the connecting terminal 22 is electrically connected to the light shielding layer 13 through the first bonding wire 26, and the signal line 21 is electrically connected to the light shielding layer 13 through the second bonding wire 27.
  • the first metal layer is a source and drain metal layer; the second metal layer is a gate metal layer.
  • the gate in the display substrate may include a first gate metal layer and a second gate metal layer
  • the gate insulating layer includes a first gate insulating layer and a second gate insulating layer
  • the first gate insulating layer is located on the first gate insulating layer.
  • the second gate insulating layer is located on the second gate metal layer.
  • the first bonding lead can be provided in the same layer as the first gate metal layer, or can be provided in the same layer as the second gate metal layer
  • the second bonding lead can be provided in the same layer as the first gate metal layer, or can be The second gate metal layer is arranged in the same layer.
  • the gate insulating layer includes a first gate insulating layer 28 and a second gate insulating layer 29, and the first bonding wire 26
  • the second bonding wire 27 and the first gate metal layer are arranged on the buffer layer 2 in the same layer.
  • the gate insulating layer includes a first gate insulating layer 28 and a second gate insulating layer 29.
  • the first bonding wire 26 and the second bonding wire 27 are arranged in the same layer as the second gate metal layer.
  • the bonding wire 26 and the second bonding wire 27 are located between the first gate insulating layer 28 and the second gate insulating layer 29.
  • the thickness of the light shielding layer is equal to the thickness of the first metal layer.
  • the thickness uniformity of the lead can be improved, and the uniformity of the resistance of the lead can be improved.
  • the material of the light shielding layer is the same as the material of the first metal layer.
  • the thickness of the light-shielding layer is equal to the thickness of the first metal layer, and the material of the light-shielding layer is the same as that of the first metal layer, so that the resistance of the light-shielding layer and the first metal layer can be the same, and the lead load (loading) can be prevented from increasing. Performance impact.
  • the material of the light shielding layer and the first metal layer is a laminated material of titanium, aluminum, or titanium.
  • the light shielding layer and the first metal layer can also be made of other materials.
  • the display substrate as shown in FIGS. 1 to 8 provided by some embodiments of the present disclosure further includes: covering the first groove 18, the second groove 19, the retaining wall structure 20 and the light emitting device 17 Inorganic encapsulation layer 9.
  • Some embodiments of the present disclosure also provide a method for preparing the above-mentioned display substrate provided by some embodiments of the present disclosure.
  • the method includes sequentially forming a light shielding layer, a first insulating layer, and a first metal layer on the base substrate. , A second insulating layer, a light emitting device, and an encapsulation layer; wherein, when the first insulating layer is formed, a through hole is formed in the first insulating layer so that the signal line in the first metal layer passes through The hole is connected to the connecting lead in the light shielding layer, so that the connecting terminal in the first metal layer is connected to the connecting lead in the light shielding layer through the through hole.
  • the first insulating layer includes: a first sub-insulating layer and a second sub-insulating layer, and the method further includes forming a second sub-insulating layer between the first sub-insulating layer and the second sub-insulating layer.
  • a step of a metal layer wherein, when the first sub-insulating layer is formed, a through hole is formed in the first sub-insulating layer, so that the first bonding wire and/or the second bonding wire in the second metal layer
  • the connecting leads are connected to the connecting leads in the light shielding layer through the through holes; when the second sub-insulating layer is formed, a through hole is formed in the second sub-insulating layer so that the connecting terminals in the first metal layer pass through The hole is connected with the first lap lead, and/or the signal line in the first metal layer is connected with the second lap lead through the through hole.
  • the second insulating layer includes: a planarization layer, a pixel definition layer, and a spacer layer; the first sub-insulating layer is a buffer layer, and the second sub-insulating layer includes a gate insulating layer and an interlayer insulating layer; or One sub-insulating layer includes a buffer layer, and the second sub-insulating layer includes: a first gate insulating layer, a second gate insulating layer, and an interlayer insulating layer; or, the first sub-insulating layer includes a buffer layer and a first gate insulating layer.
  • the second insulating layer includes: a second gate insulating layer and an interlayer insulating layer.
  • a display device provided by some embodiments of the present disclosure includes the above-mentioned display substrate provided by some embodiments of the present disclosure.
  • the display device provided by some embodiments of the present disclosure may be, for example, a mobile phone, a tablet computer, and other devices.
  • connection terminal on the side of the second groove away from the retaining wall structure and the connection terminal on the side away from the first groove The signal line on one side of the retaining wall structure is electrically connected through the connecting lead of the light shielding layer, so that the first metal layer can be prevented from being corroded in the groove area while ensuring the connection between the signal line and the connection terminal, and the formation of water and oxygen channels is prevented Therefore, subsequent packaging failures can be avoided, the packaging reliability can be improved, the incidence of GDS can be reduced, and the display effect can be improved.

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Abstract

一种显示基板及其制备方法、显示装置。所述显示基板包括：衬底基板（1），在所述衬底基板（1）之上依次层叠设置的遮光层（13）、第一绝缘层（14）、第一金属层（15）、第二绝缘层（16）、发光器件（17）；其中，所述第二绝缘层（16）具有第一凹槽（18）以及第二凹槽（19），所述第二绝缘层（16）在所述第一凹槽（18）和第二凹槽（19）之间的部分构成挡墙结构（20）；相对于所述第二凹槽（19），所述第一凹槽（18）位于所述挡墙结构（20）靠近所述发光器件（17）的一侧；所述第一金属层（15）包括：在所述第一凹槽（18）远离所述挡墙结构（20）一侧的信号线（21），以及在所述第二凹槽（19）远离所述挡墙结构（20）一侧的连接端子（22）；所述遮光层（13）包括连接引线（23），所述信号线（21）与所述连接端子（22）通过所述连接引线（23）电连接。

Description

显示基板及其制备方法、显示装置
相关申请的交叉引用
本申请主张在2019年1月14日在中国提交的中国专利申请号No.201910031922.1的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及通信技术领域，尤其涉及一种显示基板及其制备方法、显示装置。
背景技术
有源矩阵有机发光二极管(Active-matrix organic light-emitting diode，AMOLED)显示产品因其广色域、轻薄、高对比及自发光等优点，已成为未来显示的趋势。
发明内容
本公开的一些实施例提供的一种显示基板，所述显示基板包括：衬底基板，在所述衬底基板之上依次层叠设置的遮光层、第一绝缘层、第一金属层、第二绝缘层、发光器件；其中，所述第二绝缘层具有第一凹槽以及第二凹槽，所述第二绝缘层在所述第一凹槽和第二凹槽之间的部分构成挡墙结构；相对于所述第二凹槽，所述第一凹槽位于所述挡墙结构靠近所述发光器件的一侧；所述第一金属层包括：在所述第一凹槽远离所述挡墙结构一侧的信号线，以及在所述第二凹槽远离所述挡墙结构一侧的连接端子；所述遮光层包括连接引线，所述信号线与所述连接端子通过所述连接引线电连接。
本公开的一些实施例提供的显示基板，在所述第二凹槽远离所述挡墙结构一侧的连接端子与在所述第一凹槽远离所述挡墙结构一侧的信号线通过遮光层的连接引线电连接，从而可以在保证信号线与连接端子连接的情况下，避免第一金属层在凹槽区被腐蚀，阻止水氧通道形成，进而可以避免后续封装失败，提高封装可靠性，还可以减小出现GDS的可能，提升显示效果。
可选地，所述第一金属层在衬底基板上的正投影与第一凹槽、第二凹槽和挡墙结构在衬底基板上的正投影互不重叠。
即第一金属层在第一凹槽的区域、第二凹槽的区域和挡墙结构的区域无图案，第一金属层在第一凹槽区、第二凹槽区无图案从而使得第一金属层不存在没有第二绝缘层保护的区域，从而可以在保证信号线与连接端子连接的情况下，避免第一金属层在凹槽区被腐蚀，阻止水氧通道形成，进而可以避免后续封装失败，提高封装可靠性，还可以减小GDS的发生率，提升显示效果。并且，在第一金属层在第一凹槽的区域、第二凹槽的区域和挡墙结构的区域，信号线与连接端子在通过连接引线，连接引线之上设置有第一绝缘层，第一绝缘层可以使得连接引线不会被腐蚀。
可选地，所述第一绝缘层包括：第一子绝缘层和第二子绝缘层，所述显示基板还包括位于所述第一子绝缘层和所述第二子绝缘层之间的第二金属层；
所述第二金属层包括第一搭接引线和/或第二搭接引线；
所述连接端子通过所述第一搭接引线与所述遮光层电连接，所述信号线通过所述第二搭接引线与所述遮光层电连接。
可选地，所述第一金属层为源漏极金属层；所述第二金属层为栅极金属层。
可选地，所述遮光层的厚度与所述第一金属层的厚度相等。
从而可以提高引线的厚度均一性，进而提高引线电阻大小均一性。
可选地，所述遮光层的材料与所述第一金属层的材料相同。
遮光层的厚度与第一金属层的厚度相等，遮光层的材料与第一金属层的材料相同，从而可以保证遮光层与第一金属层的电阻相同，避免引线loading变大对产品性能的影响。
可选地，所述遮光层和第一金属层的材料为钛、铝、钛叠层材料。
可选地，还包括：覆盖所述第一凹槽、第二凹槽、挡墙结构和发光器件的无机封装层。
本公开的一些实施例提供的显示基板的制备方法，该方法包括在所述衬底基板上依次形成遮光层、第一绝缘层、第一金属层、第二绝缘层、发光器件以及封装层；其中，在形成所述第一绝缘层时，在所述第一绝缘层中形成通 孔，以使所述第一金属层中的信号线通过通孔与遮光层中的连接引线连接，以使所述第一金属层中的连接端子通过通孔与遮光层中的连接引线连接。
本公开的一些实施例提供的一种显示装置，包括本公开的一些实施例提供的上述显示基板。
附图说明
为了更清楚地说明本公开的一些实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简要介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域的普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为相关技术显示面板的结构示意图；
图2为相关技术在引线边缘封装失败的示意图；
图3为本公开的一些实施例提供的一种显示基板的结构示意图；
图4为本公开的一些实施例提供的另一种显示基板的结构示意图；
图5为本公开的一些实施例提供的又一种显示基板的结构示意图；
图6为本公开的一些实施例提供的又一种显示基板的结构示意图；
图7为本公开的一些实施例提供的又一种显示基板的结构示意图；
图8为本公开的一些实施例提供的又一种显示基板的结构示意图。
具体实施方式
为使本公开的实施例要解决的技术问题、技术方案和优点更加清楚，下面将结合附图及具体实施例进行详细描述。
AMOLED的一般结构为阵列(Array)背板电路，OLED器件发光层、阴极以及封装层。Array背板电路设计中，边框区的电源线(VDD引线)和低电位电源线(VSS引线)，一般与薄膜晶体管的源极和漏极同层，以VDD引线为例，如图1所示，显示面板包括：衬底基板1、缓冲层2、栅绝缘层3、层间绝缘层4、VDD引线5、平坦化层6、像素定义层7、隔垫物层8、无机封装层9，相关技术由于封装要求，需要设计挡墙(Dam)10，Dam10两侧具有凹槽区11，VDD引线5在凹槽区11拐弯，Dam10两侧没有保护VDD引 线5的绝缘层，使得VDD引线5边缘12更容易被腐蚀，成为水氧通道。并且在VDD引线5边缘12，如图2所示，VDD引线5边缘被腐蚀，无机封装层9发生断裂(crack)。这样，无机封装层遭到破坏，水汽氧气则会沿着通道进入显示区，水氧腐蚀器件形成小黑点(Growing dark spot，GDS)，随着时间的延长慢慢变大，器件性能变差，并且造成显示异常。综上，相关技术显示产品制备过程中容易出现引线被腐蚀，导致封装失败，影响发光器件性能，影响显示效果。
本公开的一些实施例提供了一种显示基板，如图3所示，所述显示基板包括：衬底基板1，在所述衬底基板之上依次层叠设置的遮光层13、第一绝缘层14、第一金属层15、第二绝缘层16、发光器件17；其中，所述第二绝缘层16具有第一凹槽18以及第二凹槽19，所述第二绝缘层16在所述第一凹槽18和第二凹槽19之间的部分构成挡墙结构20；相对于所述第二凹槽19，所述第一凹槽18位于所述挡墙结构20靠近所述发光器件17的一侧；所述第一金属层包括：在所述第一凹槽18远离所述挡墙结构20一侧的信号线21，以及在所述第二凹槽19远离所述挡墙结构20一侧的连接端子22；所述遮光层13包括连接引线23，所述信号线21与所述连接端子22通过所述连接引线电连接23。
本公开的一些实施例提供的显示基板，在所述第二凹槽远离所述挡墙结构一侧的连接端子与在所述第一凹槽远离所述挡墙结构一侧的信号线通过遮光层的连接引线电连接，从而可以在保证信号线与连接端子连接的情况下，避免第一金属层在凹槽区被腐蚀，阻止水氧通道形成，进而可以避免后续封装失败，提高封装可靠性，还可以减小GDS的发生率，提升显示效果。
可选地，本公开的一些实施例提供的如图3所示的显示基板，所述第一金属层15在衬底基板上的正投影与第一凹槽18、第二凹槽19和挡墙结构20在衬底基板1上的正投影互不重叠。
即第一金属层在第一凹槽的区域、第二凹槽的区域和挡墙结构的区域无图案，第一金属层在第一凹槽区、第二凹槽区无图案从而使得第一金属层不存在没有第二绝缘层保护的区域，从而可以在保证信号线与连接端子连接的情况下，避免第一金属层在凹槽区被腐蚀，阻止水氧通道形成，进而可以避 免后续封装失败，提高封装可靠性，还可以减小GDS的发生率，提升显示效果。并且，在第一金属层在第一凹槽的区域、第二凹槽的区域和挡墙结构的区域，信号线与连接端子在通过连接引线，连接引线之上设置有第一绝缘层，第一绝缘层可以使得连接引线不会被腐蚀。
需要说明的是，本公开的一些实施例提供的如图3所示的显示基板，第一绝缘层14包括：缓冲层2、栅绝缘层3、层间绝缘层4；第二绝缘层16包括：平坦化层6、像素定义层7、隔垫物层8。遮光层例如可以是用于进行指纹识别。
本公开的一些实施例提供的显示基板中，信号线可以是VDD引线也可以是VSS引线。
可选地，如图4～6所示，所述第一绝缘层14包括：第一子绝缘层24和第二子绝缘层25，所述显示基板还包括位于所述第一子绝缘层24和所述第二子绝缘层25之间的第二金属层；
所述第二金属层包括第一搭接引线26和/或第二搭接引线27；
所述连接端子22通过所述第一搭接引线26与所述遮光层13电连接，所述信号线21通过所述第二搭接引线27与所述遮光层13电连接。
图4-6中第一子绝缘层24包括缓冲层2，第二子绝缘层25包括栅绝缘层3以及层间绝缘层4。图4中，连接端子22通过第一搭接引线26与遮光层13电连接，信号线21直接与遮光层13电连接。图5中，信号线21通过第二搭接引线27与遮光层13电连接，连接端子22直接与遮光层13电连接。图6中，连接端子22通过第一搭接引线26与遮光层13电连接，信号线21通过第二搭接引线27与遮光层13电连接。
可选地，所述第一金属层为源漏极金属层；所述第二金属层为栅极金属层。
需要说明的是，显示基板中的栅极可以包括第一栅极金属层和第二栅极金属层，栅绝缘层包括第一栅绝缘层和第二栅绝缘层，第一栅绝缘层位于第一栅极金属层和第二栅极金属层之间，第二栅绝缘层位于第二栅极金属层之上。第一搭接引线可以与第一栅极金属层同层设置，也可以与第二栅极金属层同层设置，第二搭接引线可以与第一栅极金属层同层设置，也可以与第二 栅极金属层同层设置。
以第二金属层包括第一搭接引线和第二搭接引线为例，如图7所示，栅绝缘层包括第一栅绝缘层28和第二栅绝缘层29，第一搭接引线26和第二搭接引线27与第一栅极金属层同层设置位于缓冲层2之上。如图8所示，栅绝缘层包括第一栅绝缘层28和第二栅绝缘层29，第一搭接引线26和第二搭接引线27与第二栅极金属层同层设置，第一搭接引线26和第二搭接引线27位于第一栅绝缘层28和第二栅绝缘层29之间。
可选地，所述遮光层的厚度与所述第一金属层的厚度相等。从而可以提高引线的厚度均一性，进而提高引线电阻大小均一性。
可选地，所述遮光层的材料与所述第一金属层的材料相同。
遮光层的厚度与第一金属层的厚度相等，遮光层的材料与第一金属层的材料相同，从而可以保证遮光层与第一金属层的电阻相同，避免引线负载(loading)变大对产品性能的影响。
可选地，所述遮光层和第一金属层的材料为钛、铝、钛叠层材料。
当然遮光层和第一金属层也可以采用其他材料。
可选地，本公开的一些实施例提供的如图1～8所示的显示基板，还包括：覆盖所述第一凹槽18、第二凹槽19、挡墙结构20和发光器件17的无机封装层9。
本公开的一些实施例还提供了一种制备本公开的一些实施例提供的上述显示基板的方法，该方法包括在所述衬底基板上依次形成遮光层、第一绝缘层、第一金属层、第二绝缘层、发光器件以及封装层；其中，在形成所述第一绝缘层时，在所述第一绝缘层中形成通孔，以使所述第一金属层中的信号线通过通孔与遮光层中的连接引线连接，以使所述第一金属层中的连接端子通过通孔与遮光层中的连接引线连接。
可选地，所述第一绝缘层包括：第一子绝缘层和第二子绝缘层，该方法还包括形成位于所述第一子绝缘层和所述第二子绝缘层之间的第二金属层的步骤；其中，在形成所述第一子绝缘层时，在所述第一子绝缘层中形成通孔，以使第二金属层中的第一搭接引线和/或第二搭接引线通过通孔与遮光层中的连接引线连接；在形成所述第二子绝缘层时，在所述第二子绝缘层中形成 通孔，以使第一金属层中的连接端子通过通孔与第一搭接引线连接，和/或第一金属层中的信号线通过通孔与第二搭接引线连接。
可选地，第二绝缘层包括：平坦化层、像素定义层、隔垫物层；第一子绝缘层为缓冲层，第二子绝缘层包括栅绝缘层和层间绝缘层；或者，第一子绝缘层包括缓冲层，第二子绝缘层包括：第一栅绝缘层、第二栅绝缘层以及层间绝缘层；或者，第一子绝缘层包括缓冲层和第一栅绝缘层，第二子绝缘层包括：第二栅绝缘层以及层间绝缘层。
本公开的一些实施例提供的一种显示装置，包括本公开的一些实施例提供的上述显示基板。
本公开的一些实施例提供的显示装置例如可以是手机、平板电脑等装置。
综上所述，本公开的一些实施例提供的显示基板及其制备方法、显示装置，在所述第二凹槽远离所述挡墙结构一侧的连接端子与在所述第一凹槽远离所述挡墙结构一侧的信号线通过遮光层的连接引线电连接，从而可以在保证信号线与连接端子连接的情况下，避免第一金属层在凹槽区被腐蚀，阻止水氧通道形成，进而可以避免后续封装失败，提高封装可靠性，还可以减小GDS的发生率，提升显示效果。
显然，本领域的技术人员可以对本公开的一些进行各种改动和变型而不脱离本公开的一些的精神和范围。这样，倘若本公开的一些的这些修改和变型属于本公开的一些权利要求及其等同技术的范围之内，则本公开的一些也意图包含这些改动和变型在内。

Claims (10)

  1. 一种显示基板，所述显示基板包括：衬底基板，在所述衬底基板之上依次层叠设置的遮光层、第一绝缘层、第一金属层、第二绝缘层、发光器件；其中，所述第二绝缘层具有第一凹槽以及第二凹槽，所述第二绝缘层在所述第一凹槽和第二凹槽之间的部分构成挡墙结构；相对于所述第二凹槽，所述第一凹槽位于所述挡墙结构靠近所述发光器件的一侧；所述第一金属层包括：在所述第一凹槽远离所述挡墙结构一侧的信号线，以及在所述第二凹槽远离所述挡墙结构一侧的连接端子；所述遮光层包括连接引线，所述信号线与所述连接端子通过所述连接引线电连接。
  2. 根据权利要求1所述的显示基板，其中，所述第一金属层在衬底基板上的正投影与第一凹槽、第二凹槽和挡墙结构在衬底基板上的正投影互不重叠。
  3. 根据权利要求1所述的显示基板，其中，所述第一绝缘层包括：第一子绝缘层和第二子绝缘层，所述显示基板还包括位于所述第一子绝缘层和所述第二子绝缘层之间的第二金属层；
    所述第二金属层包括第一搭接引线和/或第二搭接引线；
    所述连接端子通过所述第一搭接引线与所述遮光层电连接，所述信号线通过所述第二搭接引线与所述遮光层电连接。
  4. 根据权利要求2所述的显示基板，其中，所述第一金属层为源漏极金属层；所述第二金属层为栅极金属层。
  5. 根据权利要求1所述的显示基板，其中，所述遮光层的厚度与所述第一金属层的厚度相等。
  6. 根据权利要求1所述的显示基板，其中，所述遮光层的材料与所述第一金属层的材料相同。
  7. 根据权利要求1所述的显示基板，其中，所述遮光层和第一金属层的材料为钛、铝、钛叠层材料。
  8. 根据权利要求1-7任一项所述的显示基板，还包括：覆盖所述第一凹槽、第二凹槽、挡墙结构和发光器件的无机封装层。
  9. 一种根据权利要求1-8任一项所述的显示基板的制备方法，该方法包括在所述衬底基板上依次形成遮光层、第一绝缘层、第一金属层、第二绝缘层、发光器件以及封装层；其中，
    在形成所述第一绝缘层时，在所述第一绝缘层中形成通孔，以使所述第一金属层中的信号线通过通孔与遮光层中的连接引线连接，以使所述第一金属层中的连接端子通过通孔与遮光层中的连接引线连接。
  10. 一种显示装置，包括根据权利要求1～8任一项所述的显示基板。
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