WO2020140804A1 - 显示基板、显示装置和显示基板的制造方法 - Google Patents

显示基板、显示装置和显示基板的制造方法 Download PDF

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WO2020140804A1
WO2020140804A1 PCT/CN2019/128262 CN2019128262W WO2020140804A1 WO 2020140804 A1 WO2020140804 A1 WO 2020140804A1 CN 2019128262 W CN2019128262 W CN 2019128262W WO 2020140804 A1 WO2020140804 A1 WO 2020140804A1
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pixel
defining layer
substrate
receiving holes
pixel defining
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PCT/CN2019/128262
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English (en)
French (fr)
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麻清琳
熊正平
江伯軒
冯永安
见帅敏
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京东方科技集团股份有限公司
绵阳京东方光电科技有限公司
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Priority to US16/768,320 priority Critical patent/US11349107B2/en
Publication of WO2020140804A1 publication Critical patent/WO2020140804A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/173—Passive-matrix OLED displays comprising banks or shadow masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes

Definitions

  • the present disclosure belongs to the field of display technology, and specifically relates to a display substrate, a display device, and a method of manufacturing a display substrate.
  • a plurality of pixel receiving holes are formed by the pixel defining layer.
  • the organic light emitting diode is disposed in the pixel receiving hole.
  • the organic light emitting diode is composed of an opposing first electrode, a second electrode, and an organic functional layer sandwiched between the two.
  • the organic functional layer includes a composite light-emitting layer, and further preferably may also include an electron transport layer, a hole transport layer, and the like.
  • the present disclosure at least partially solves the problem of poor color mixing of existing organic light emitting diode display substrates, and provides a display substrate and a method of manufacturing the display substrate.
  • a display substrate including a substrate, a pixel defining layer on the substrate, and a plurality of organic light emitting diodes arranged in an array, the pixel defining layer is provided with a plurality of pixel receiving holes, organic light emitting diodes Corresponding to the pixel receiving holes, the organic light emitting diodes are located in the corresponding pixel receiving holes;
  • a plurality of support structures corresponding to the pixel receiving holes are formed in one-to-one correspondence.
  • the orthographic projection of the support structure on the pixel defining layer surrounds the corresponding pixel receiving holes.
  • the shape of the cross section of the support structure parallel to the base is rectangular.
  • all support structures are connected in a grid.
  • all support structures are integrally formed.
  • the shape of the cross section of the support structure parallel to the base is circular.
  • a display device including the display substrate of the first aspect of the present disclosure.
  • a method for manufacturing a display substrate including:
  • a pixel defining layer is formed on the substrate, and a plurality of pixel receiving holes are formed on the pixel defining layer;
  • a plurality of supporting structures are formed on the side of the pixel defining layer facing away from the substrate, the supporting structures correspond one-to-one with the pixel receiving holes, and the front projection of the supporting structure on the pixel defining layer surrounds the corresponding pixel receiving holes;
  • An organic light emitting diode is formed on the substrate, the organic light emitting diode corresponds to the pixel receiving hole in one-to-one relationship, and the organic light emitting diode is located in the corresponding pixel receiving hole.
  • the steps of forming a pixel defining layer, forming a support structure, and forming an organic light emitting diode specifically include:
  • a pixel defining layer is formed on the side of the substrate with the first electrode, and a plurality of pixel receiving holes corresponding to the first electrode are formed on the pixel defining layer, and the pixel receiving holes expose at least part of the corresponding first electrode;
  • a plurality of supporting structures are formed on the side of the pixel defining layer facing away from the substrate, the supporting structures correspond one-to-one with the pixel receiving holes, and the front projection of the supporting structure on the pixel defining layer surrounds the corresponding pixel receiving holes;
  • a second electrode is formed on the side of the organic functional layer facing away from the substrate.
  • the first electrode, the organic functional layer and the second electrode located in the same pixel receiving hole constitute an organic light emitting diode.
  • the shape of the cross section of the support structure parallel to the base is rectangular.
  • all support structures are connected in a grid.
  • all support structures are integrally formed.
  • FIG. 1 is a top view of a partial structure of a display substrate according to an embodiment of the present disclosure
  • FIG. 2 is a schematic diagram of a manufacturing process of a display substrate according to an embodiment of the present disclosure.
  • patterning process refers to a step of forming a structure having a specific pattern, which may be a photolithography process, which includes forming a material layer, coating a photoresist, exposing, developing, etching, photolithography One or more of the steps such as stripping of the resist; of course, the “patterning process” can also be other processes such as imprinting process, inkjet printing process.
  • the first electrode of the organic light emitting diode is usually formed on the substrate, and then the pixel defining layer is formed, and then through the opening of the evaporation mask to the pixel receiving hole located in the pixel defining layer
  • An organic functional layer is evaporated on the first electrode inside. Since there is a certain distance between the vapor deposition reticle and the pixel defining layer, it is easy to cause the material vaporized into one pixel receiving hole to diffuse into the adjacent pixel receiving hole, resulting in poor color mixing of the final display.
  • An embodiment of the present disclosure provides a display substrate including a substrate 10, a pixel defining layer 11 on the substrate 10, and a plurality of organic light emitting diodes arranged in an array, the pixel defining layer 11 is provided with a plurality of pixel receiving holes 11a, The organic light emitting diodes correspond to the pixel receiving holes 11a one by one, and the organic light emitting diodes are located in the corresponding pixel receiving holes 11a. 1 and 2 only show the first electrode 12 in the organic light emitting diode.
  • each supporting structure 13 is on the periphery of the corresponding pixel receiving hole 11a, so that when the organic functional layer of the organic light emitting diode is vapor-deposited, the material forming the organic functional layer (the arrows in FIG. 2 indicate the The motion track is blocked by the support structure 13 so as not to diffuse into the adjacent pixel receiving holes 11a, so that the occurrence of poor color mixing can be avoided.
  • the material of the support structure 13 may be a cured photoresist.
  • the shape of the cross section of the support structure 13 parallel to the base 10 is rectangular.
  • the rectangular support structures 13 shown in FIG. 1 are connected together.
  • the rectangular support structures 13 may also be separate, that is, one independent rectangular support structure 13 corresponds to one pixel receiving hole 11a.
  • the shape of the support structure 13 parallel to the cross section of the base 10 may also be various closed patterns such as a circle, a diamond, and a hexagon. This can be adjusted adaptively according to the shape of the organic functional layer and the overall arrangement of the organic functional layer.
  • each support structure 13 is formed by a plurality of first support bars and a plurality of second support bars arranged crosswise.
  • the first support bar extends in the row direction
  • the second support bar extends in the column direction.
  • the included angle between the row direction and the column direction may be a right angle or an acute angle.
  • the angle between the row direction and the column direction in the grid formed by connecting the support structures 13 in FIG. 1 is a right angle.
  • all the support structures 13 are integrally formed. Of course, the support structures 13 can also be separated from each other.
  • An embodiment of the present disclosure also provides a display device including the display substrate of the embodiment of the present disclosure.
  • the display device may be any product or component with a display function such as an organic light-emitting diode (OLED) display panel, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, and a navigator.
  • OLED organic light-emitting diode
  • Embodiments of the present disclosure also provide a method of manufacturing a display substrate, including:
  • a pixel defining layer 11 is formed on the substrate 10, and a plurality of pixel receiving holes 11a are formed on the pixel defining layer 11;
  • a plurality of supporting structures 13 are formed on the side of the pixel defining layer 11 facing away from the substrate 10, and the supporting structures 13 correspond to the pixel receiving holes 11a one by one.
  • the orthographic projection of the supporting structure 13 on the pixel defining layer 11 surrounds the corresponding pixel receiving holes 11a ;
  • An organic light emitting diode is formed on the substrate 10, and the organic light emitting diode corresponds to the pixel receiving hole 11a one by one, and the organic light emitting diode is located in the corresponding pixel receiving hole 11a.
  • each supporting structure 13 Since the orthographic projection of the supporting structure 13 on the pixel defining layer 11 surrounds the corresponding pixel receiving hole 11a, with reference to FIG. 2, each supporting structure 13 is on the periphery of the corresponding pixel receiving hole 11a.
  • the materials forming the organic functional layer (the arrows in FIG. 2 indicate the movement trajectories of these materials) are blocked by the support structure 13 so as not to diffuse into the adjacent pixel receiving holes 11a, so that poor color mixing can be avoided occur.
  • the shape of the cross section of the support structure 13 parallel to the base 10 is rectangular.
  • all the support structures 13 are connected in a grid.
  • all the support structures 13 are integrally formed.
  • the supporting structure 13 only needs to be able to block the diffusion of the vapor deposition material in four directions parallel to the substrate 10.
  • the specific shape of the supporting structure 13 please refer to the above embodiments.
  • the steps of forming the pixel defining layer 11, forming the support structure 13 and forming the organic light emitting diode specifically include:
  • a plurality of first electrodes 12 are formed on one side of the substrate 10.
  • a pixel defining layer 11 is formed on the side of the substrate 10 with the first electrode 12, and a plurality of pixel receiving holes 11 a corresponding to the first electrode 12 are formed on the pixel defining layer 11.
  • the pixel receiving holes 11 a At least part of the corresponding first electrode 12 is exposed.
  • a plurality of supporting structures 13 are formed on the side of the pixel defining layer 11 facing away from the substrate 10, and the supporting structures 13 correspond to the pixel receiving holes 11a one by one.
  • the orthographic projection of the supporting structure 13 on the pixel defining layer 11 surrounds the corresponding Pixel receiving hole 11a.
  • a photoresist can be coated on the substrate 10, and the photoresist can be exposed and developed to remove the regions where the support structure 13 is not required to be formed, and the remaining photoresist forms each support structure 13.
  • a corresponding organic functional layer is formed in each pixel receiving hole 11a through an evaporation process.
  • a second electrode is formed on the side of the organic functional layer facing away from the substrate 10, and the first electrode 12, the organic functional layer, and the second electrode located in the same pixel receiving hole 11a constitute an organic light emitting diode.

Abstract

本公开提供一种显示基板、显示装置和显示基板的制造方法，属于显示技术领域，其可至少部分解决现有的有机发光二极管型的显示基板中混色的问题。本公开的显示基板包括基底、位于基底上的像素界定层和呈阵列排布的多个有机发光二极管，像素界定层上设置有多个像素容纳孔，有机发光二极管与像素容纳孔一一对应，有机发光二极管位于对应的像素容纳孔内；像素界定层背向基底的一侧形成有与像素容纳孔一一对应的多个支撑结构，支撑结构在像素界定层上的正投影包围对应的像素容纳孔。

Description

显示基板、显示装置和显示基板的制造方法
相关申请的交叉引用
本申请要求于2019年1月2日递交的中国专利申请第201910002691.1号的优先权，在此其内容以引文方式整体并入本文。
技术领域
本公开属于显示技术领域，具体涉及一种显示基板、一种显示装置以及一种显示基板的制造方法。
背景技术
在有机发光二极管显示基板中，由像素界定层形成多个像素容纳孔。有机发光二极管设置在像素容纳孔中。有机发光二极管由相对的第一电极、第二电极、以及夹在二者之间的有机功能层构成。有机功能层包括复合发光层，进一步优选地还可能包括电子传输层、空穴传输层等。
发明内容
本公开至少部分解决现有的有机发光二极管显示基板的混色不良的问题，提供一种显示基板以及显示基板的制造方法。
根据本公开第一方面，提供一种显示基板，包括基底、位于基底上的像素界定层和呈阵列排布的多个有机发光二极管，像素界定层上设置有多个像素容纳孔，有机发光二极管与像素容纳孔一一对应，有机发光二极管位于对应的像素容纳孔内；
像素界定层背向基底的一侧形成有与像素容纳孔一一对应的多个支撑结构，支撑结构在像素界定层上的正投影包围对应的像素容纳孔。
可选地，支撑结构的平行于基底的截面的形状为矩形。
可选地，全部支撑结构连成网格。
可选地，全部支撑结构一体成型。
可选地，支撑结构的平行于基底的截面的形状为圆形。
根据本公开第二方面，提供显示装置，包括本公开第一方面的显示基板。
根据本公开第三方面，提供一种显示基板的制造方法，包括：
在基底上形成像素界定层，像素界定层上形成有多个像素容纳孔；
在像素界定层背向基底的一侧形成多个支撑结构，支撑结构与像素容纳孔一一对应，支撑结构在像素界定层上的正投影包围对应的像素容纳孔；
在基底上形成有机发光二极管，有机发光二极管与像素容纳孔一一对应，有机发光二极管位于对应的像素容纳孔内。
可选地，形成像素界定层、形成支撑结构和形成有机发光二极管的步骤具体包括：
在基底的一侧形成多个第一电极；
在基底上有第一电极的一侧形成像素界定层，在像素界定层上形成有与第一电极一一对应的多个像素容纳孔，像素容纳孔使得对应的第一电极的至少部分露出；
在像素界定层背向基底的一侧形成多个支撑结构，支撑结构与像素容纳孔一一对应，支撑结构在像素界定层上的正投影包围对应的像素容纳孔；
通过蒸镀工艺在各像素容纳孔内形成对应的有机功能层；
在有机功能层背向基底的一侧形成第二电极，位于同一像素容纳孔内的第一电极、有机功能层和第二电极构成有机发光二极管。
可选地，支撑结构的平行于基底的截面的形状为矩形。
可选地，全部支撑结构连成网格。
可选地，全部支撑结构一体成型。
附图说明
图1为本公开的实施例的一种显示基板部分结构的俯视图；
以及
图2为本公开的实施例的一种显示基板的制造工艺的示意图。
具体实施方式
为使本领域技术人员更好地理解本公开的技术方案，下面结合附图和具体实施方式对本公开作进一步详细描述。
在本公开中，“构图工艺”是指形成具有特定的图形的结构的步骤，其可为光刻工艺，光刻工艺包括形成材料层、涂布光刻胶、曝光、显影、刻蚀、光刻胶剥离等步骤中的一步或多步；当然，“构图工艺”也可为压印工艺、喷墨打印工艺等其它工艺。
在制造有机发光二极管显示基板的工艺中，通常是先在基底上形成有机发光二极管的第一电极，然后形成像素界定层，随后透过蒸镀掩模版的开口向位于像素界定层的像素容纳孔内的第一电极蒸镀有机功能层。由于蒸镀掩模版与像素界定层存在一定的距离，这容易导致向一个像素容纳孔蒸镀的材料扩散到相邻的像素容纳孔中，导致最终显示的混色不良。
本公开的实施例提供一种显示基板，包括基底10、位于基底10上的像素界定层11和呈阵列排布的多个有机发光二极管，像素界定层11上设置有多个像素容纳孔11a，有机发光二极管与像素容纳孔11a一一对应，有机发光二极管位于对应的像素容纳孔11a内。图1和图2仅示出了有机发光二极管中的第一电极12。
像素界定层11背向基底10的一侧形成有与像素容纳孔11a一一对应的多个支撑结构13，支撑结构13在像素界定层11上的正投影包围对应的像素容纳孔11a。结合图2，每个支撑结构13在对应的像素容纳孔11a的外围，这样当进行有机发光二极管的有机功能层的蒸镀时，形成有机功能层的材料(图2中的箭头表示这些材料的运动轨迹)被支撑结构13阻挡，从而不会扩散到相邻的像素容纳孔11a中，如此可避免混色不良的发生。
具体地，支撑结构13的材料可以是经固化后的光刻胶。
可选地，支撑结构13的平行于基底10的截面的形状为矩形。图1中示出的各矩形的支撑结构13连为了一体。当然实际应用中矩形的支撑结构13也可以是各自分开的，即一个独立的矩形支撑结构13对应一个像素容纳孔11a。
当然支撑结构13的平行于基底10的截面的形状也可以为圆形、菱形、六边形等各种封闭的图案。这可以根据有机功能层的形状以及有机功能层整体的排列方式做出适应性地调整。
可选地，全部支撑结构13连成网格。这种实施方式中，各个支撑结构13是由交叉设置的多个第一支撑条和多个第二支撑条形成的。第一支撑条沿行方向延伸，第二支撑条沿列方向延伸。当然行方向与列方向的夹角可以是直角，也可以是锐角。图1中的各支撑结构13连成的网格中行方向与列方向的夹角为直角。
可选地，全部支撑结构13一体成型。当然，各支撑结构13也可以是彼此分开的。
本公开的实施例还提供一种显示装置，其包括本公开的实施例的显示基板。
具体的，该显示装置可为有机发光二极管(OLED)显示面板、手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
本公开的实施例还提供一种显示基板的制造方法，包括：
在基底10上形成像素界定层11，像素界定层11上形成有多个像素容纳孔11a；
在像素界定层11背向基底10的一侧形成多个支撑结构13，支撑结构13与像素容纳孔11a一一对应，支撑结构13在像素界定层11上的正投影包围对应的像素容纳孔11a；
在基底10上形成有机发光二极管，有机发光二极管与像素容纳孔11a一一对应，有机发光二极管位于对应的像素容纳孔11a 内。
由于支撑结构13在像素界定层11上的正投影包围对应的像素容纳孔11a，结合图2，每个支撑结构13在对应的像素容纳孔11a的外围，这样当进行有机发光二极管的有机功能层的蒸镀时，形成有机功能层的材料(图2中的箭头表示这些材料的运动轨迹)被支撑结构13阻挡，从而不会扩散到相邻的像素容纳孔11a中，如此可避免混色不良的发生。
可选地，支撑结构13的平行于基底10的截面的形状为矩形。
可选地，全部支撑结构13连成网格。
可选地，全部支撑结构13一体成型。
支撑结构13只要在平行于基底10的四个方向上都能阻挡蒸镀材料的扩散即可，支撑结构13具体的形状可参见上述的实施例。
可选地，形成像素界定层11、形成支撑结构13和形成有机发光二极管的步骤具体包括：
第一步，在基底10的一侧形成多个第一电极12。
第二步，在基底10上有第一电极12的一侧形成像素界定层11，在像素界定层11上形成有与第一电极12一一对应的多个像素容纳孔11a，像素容纳孔11a使得对应的第一电极12的至少部分露出。
第三步，在像素界定层11背向基底10的一侧形成多个支撑结构13，支撑结构13与像素容纳孔11a一一对应，支撑结构13在像素界定层11上的正投影包围对应的像素容纳孔11a。
具体地，可以在基底10上涂覆光刻胶，对光刻胶进行曝光以及显影，从而去除掉不需要形成支撑结构13的区域，保留下来的光刻胶便形成了各个支撑结构13。
第四步，通过蒸镀工艺在各像素容纳孔11a内形成对应的有机功能层。
参见图2，蒸镀源20散发出的形成有机功能层的材料在经过蒸镀掩模版30中的开孔之后，绝大多数会停留在像素容纳孔11a限定的区域内，少部分运动方向倾斜的材料则会被支撑结构13阻 挡，不会运动到相邻的像素容纳孔11a内，从而避免了混色不良。
第五步，在有机功能层背向基底10的一侧形成第二电极，位于同一像素容纳孔11a内的第一电极12、有机功能层和第二电极构成有机发光二极管。
可以理解的是，以上实施方式仅仅是为了说明本公开的原理而采用的示例性实施方式，然而本公开并不局限于此。对于本领域内的普通技术人员而言，在不脱离本公开的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本公开的保护范围。

Claims (10)

  1. 一种显示基板，包括基底、位于基底上的像素界定层和呈阵列排布的多个有机发光二极管，像素界定层上设置有多个像素容纳孔，有机发光二极管与像素容纳孔一一对应，有机发光二极管位于对应的像素容纳孔内；其特征在于，
    像素界定层背向基底的一侧形成有与像素容纳孔一一对应的多个支撑结构，支撑结构在像素界定层上的正投影包围对应的像素容纳孔。
  2. 根据权利要求1所述的显示基板，其中，支撑结构的平行于基底的截面的形状为矩形。
  3. 根据权利要求2所述的显示基板，其中，全部支撑结构连成网格。
  4. 根据权利要求3所述的显示基板，其中，全部支撑结构一体成型。
  5. 一种显示装置，包括根据权利要求1-4任意一项所述的显示基板。
  6. 一种显示基板的制造方法，包括：
    在基底上形成像素界定层，像素界定层上形成有多个像素容纳孔；
    在像素界定层背向基底的一侧形成多个支撑结构，支撑结构与像素容纳孔一一对应，支撑结构在像素界定层上的正投影包围对应的像素容纳孔；
    在基底上形成有机发光二极管，有机发光二极管与像素容纳孔一一对应，有机发光二极管位于对应的像素容纳孔内。
  7. 根据权利要求6所述的制造方法，其中，形成像素界定层、形成支撑结构和形成有机发光二极管的步骤具体包括：
    在基底的一侧形成多个第一电极；
    在基底上有第一电极的一侧形成像素界定层，在像素界定层上形成有与第一电极一一对应的多个像素容纳孔，像素容纳孔使得对应的第一电极的至少部分露出；
    在像素界定层背向基底的一侧形成多个支撑结构，支撑结构与像素容纳孔一一对应，支撑结构在像素界定层上的正投影包围对应的像素容纳孔；
    通过蒸镀工艺在各像素容纳孔内形成对应的有机功能层；
    在有机功能层背向基底的一侧形成第二电极，位于同一像素容纳孔内的第一电极、有机功能层和第二电极构成有机发光二极管。
  8. 根据权利要求7所述的制造方法，其中，支撑结构的平行于基底的截面的形状为矩形。
  9. 根据权利要求8所述的制造方法，其中，全部支撑结构连成网格。
  10. 根据权利要求9所述的制造方法，其中，全部支撑结构一体成型。
PCT/CN2019/128262 2019-01-02 2019-12-25 显示基板、显示装置和显示基板的制造方法 WO2020140804A1 (zh)

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