WO2020135561A1 - 芯片与背板连接器互连装置及通信设备 - Google Patents

芯片与背板连接器互连装置及通信设备 Download PDF

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Publication number
WO2020135561A1
WO2020135561A1 PCT/CN2019/128620 CN2019128620W WO2020135561A1 WO 2020135561 A1 WO2020135561 A1 WO 2020135561A1 CN 2019128620 W CN2019128620 W CN 2019128620W WO 2020135561 A1 WO2020135561 A1 WO 2020135561A1
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WO
WIPO (PCT)
Prior art keywords
chip
backplane connector
backplane
interconnection device
board
Prior art date
Application number
PCT/CN2019/128620
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English (en)
French (fr)
Inventor
尚迎春
叶兵
陈勋
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中兴通讯股份有限公司
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Publication of WO2020135561A1 publication Critical patent/WO2020135561A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/735—Printed circuits including an angle between each other
    • H01R12/737—Printed circuits being substantially perpendicular to each other

Definitions

  • the present application relates to the field of communications, for example, to a chip and backplane connector interconnection device and communication equipment.
  • Centralized switching equipment based on optical transport network (Optical Transport Network, OTN), packet transport network (Packet Transport Net, PTN) and other fields usually consists of multiple business boards ⁇ line cards (LC) and multiple switching boards ⁇ Switch card (Switch Card), each business board and each switch board there is an integrated circuit (IC) chip for high-speed business processing or a special application integrated circuit (Application) Integrated Circuit (ASIC) chip, There must be enough physical connection paths between these IC chips. These paths are either directly interconnected through a single-board printed circuit board (Printed Circuit Board, PCB), or the circuit board on the backplane realizes the service board and the switching board. High-speed signal interconnection.
  • OTN optical Transport Network
  • PTN Packet Transport Net
  • IC chips or ASIC chips are basically solder balls soldered to the single-board PCB using the ball grid array (BGA) package on the bottom of the chip to achieve all high-speed signals and low speeds on the chip
  • All signals, such as signals and power, are connected to the single-board PCB.
  • the single-board side backplane connector is generally the single-board side of the single-board side backplane connector crimped on the single-board PCB to realize the transmission of the signal on the single-board PCB to the single-board side backplane connector;
  • the mating surface of the side backplane connector is mated with the backplane side backplane connector to realize the transmission of the signal on the single-board PCB to the backplane.
  • the high-speed business signal of the IC chip is connected to the backplane connector on the single board side through the transmission line inside the PCB.
  • high-speed electrical signals will cause certain losses through BGA soldering.
  • High-speed electrical signals also need to be transmitted on the single-board PCB after a certain distance to the single-board side backplane connector, so the single-board PCB will also produce high Large loss, which will cause high-speed electrical signal loss on the single-board PCB.
  • the present application provides a chip-to-backplane connector interconnection device and a communication device based on the interconnection device to at least solve the problem of electrical signal transmission loss caused by the connection method of the IC chip and the backplane connector in the related art .
  • a chip-to-backplane connector interconnection device including a first IC chip and a first backplane connector, wherein the first IC chip and the first backplane connector are directly interconnection.
  • the first IC chip is interconnected with the first backplane connector by soldering or crimping.
  • the bottom of the substrate of the first IC chip is provided with BGA solder balls or pads, and the soldering surface of the first backplane connector is provided with corresponding BGA pads or solder balls.
  • the bottom of the substrate of the first IC chip is provided with a pin or hole for crimping
  • the connection surface of the first backplane connector is provided with a corresponding hole or pin for crimping
  • the above interconnection device further includes a single-board PCB, and the first IC chip is connected to the single-board PCB through soldering or pin connectors.
  • the edge of the substrate of the first IC chip is provided with an electrical pin for soldering, and is soldered to the single-board PCB through the electrical pin.
  • a pin or hole is provided at the bottom of the substrate of the first IC chip, and is connected to the pin connector of the single-board PCB through the pin or hole.
  • a second IC chip is further provided on the single-board PCB, and the first IC chip and the second IC chip are connected by a soldering cable or a cable connector.
  • the bottom layer and/or top layer of the substrate of the first IC chip is provided with BGA solder balls, or with pins or holes for crimping, so as to be connected by soldering cables or by cable connectors To the second IC chip.
  • the first backplane connector is fixed on the single-board PCB by crimping or screwing.
  • the PCB contact surface of the first backplane connector is provided with a pin or a hole for crimping, or the surface of the first backplane connector on the first side of the PCB contact surface and the second The side surface is provided with screw holes or screw hole columns for fixing, so as to perform crimping or screw fixing with the single-board PCB board.
  • the interconnection device further includes a second backplane connector, wherein the first backplane connector is mated with one or more of the second backplane connectors.
  • the plug surface of the first backplane connector and the plug surface of the second backplane connector are correspondingly provided with holes or pins for plug connection.
  • the interconnection device further includes a backplane, and the second backplane connector is disposed on the backplane.
  • the first backplane connector has a trumpet shape, and the high-speed signal line on the connection sheet inside the first backplane connector is connected to the second IC backplane on the first IC chip connection surface
  • the connection surface of the device is the relationship of amplitude amplification.
  • a communication device which includes the interconnection device between the chip and the backplane connector in the foregoing embodiment.
  • FIG. 1 is a schematic diagram of a connection relationship between an IC chip on a single board and a backboard connector on a single board in the related art
  • FIG. 2 is a schematic diagram of a connection relationship between an IC chip and a single-board side backplane connector provided by an embodiment of this application;
  • FIG. 3 is a schematic diagram of a connection relationship between an IC chip on a single-board PCB, a single-board side backplane connector, and other components provided by an embodiment of the present application;
  • FIG. 4(a) is a schematic diagram of an IC chip pin provided by an embodiment of the present application.
  • 4(b) is a schematic diagram of another IC chip pin provided by an embodiment of the present application.
  • 4(c) is a schematic diagram of another IC chip pin provided by an embodiment of the present application.
  • 4(d) is a schematic diagram of another IC chip pin provided by an embodiment of the present application.
  • 5(a) is a schematic diagram of a single-board side backplane connector provided by an embodiment of the present application.
  • FIG. 5(b) is a schematic diagram of another single-board side backplane connector provided by an embodiment of the present application.
  • 5(c) is a schematic diagram of another single-board side backplane connector provided by an embodiment of the present application.
  • 5(d) is a schematic diagram of another single-board side backplane connector provided by an embodiment of the present application.
  • FIG. 5(e) is a schematic diagram of another single-board side backplane connector provided by an embodiment of the present application.
  • 5(f) is a schematic diagram of another single-board side backplane connector provided by an embodiment of the present application.
  • 5(g) is a schematic diagram of another single-board side backplane connector provided by an embodiment of the present application.
  • 6(a) is a schematic diagram of connection between an IC chip and a single-board side backplane connector provided by an embodiment of the present application;
  • 6(b) is a schematic diagram of another IC chip connected to a single-board side backplane connector according to an embodiment of the present application
  • FIG. 7 is a schematic diagram of the relationship between the IC chip on the PCB and the backplane connector on the single board side provided by the embodiment of the present application and the backplane;
  • FIG. 8 is a structural diagram of a communication device provided by an embodiment of the present application.
  • An embodiment of the present application provides a device for interconnecting a chip and a backplane connector. For ease of description, this embodiment will be described from the perspective of the IC chip, the backplane connector, and the interconnection between the IC chip and the backplane connector.
  • the bottom of the substrate of the IC chip is a BGA solder ball, so as to perform solder connection with the backplane connector.
  • the bottom of the substrate of the IC chip includes a pin or hole for crimping, so as to make a crimp connection with the hole or pin on the backplane connector.
  • the bottom of the substrate of the IC chip has pins or holes for soldering or connecting with the pin connector; or the edge of the substrate of the IC chip has solderable electrical pins for passing through the PCB Solder solder directly.
  • the bottom layer and/or top layer of the substrate of the IC chip also has BGA solder balls, or there are also crimpable pins or holes so that the single board can be connected by soldering the cable or by the cable connector Other chips or modules on the PCB to achieve high-speed interconnection within the board.
  • the PCB contact surface of the backplane connector has a pin for crimping or a screw hole that is convenient for fixing, or there are screw hole columns for installation on both sides of the PCB contact surface of the backplane connector, Used for welding or crimping or screwing with the PCB board.
  • the connector surface of the backplane connector may also be provided with holes or pins for connection with other backplane connectors, for example, the backplane connector and the backplane side backplane connector Make the plug connection.
  • BGA pads or solder balls may be provided on the non-backplane connector surface of the backplane connector or the PCB contact surface to facilitate solder connection with the IC chip; or there may be pins or holes to facilitate contact with The holes or pins on the bottom of the IC chip are connected by crimping.
  • the wafer unit inside the backplane connector may have an amplitude-amplified relationship between the chip connection surface and the backplane connector surface on the backplane side, so that high-density IC chips and low-density Backplane connector on the backplane side.
  • the IC chip is interconnected with the backplane connector on the single board side by soldering or crimping.
  • the IC chip can also be connected to the single-board PCB through soldering or pin connectors. In one embodiment, the IC chip is also connected to other chips or modules on the single-board PCB through soldering cables or through cable connectors.
  • the single-board side backplane connector may be fixed on the single-board PCB by crimping or screwing.
  • the high-speed signal of the IC chip can be directly connected to the backplane connector without going through the single-board PCB, the signal loss caused by the high-speed signal connecting to the backplane connector through the single-board PCB is avoided The problem of abnormal transmission and reception of electrical signals. Moreover, there is no need to transmit a large amount of high-speed signals to the backplane connector on the single-board PCB, so the single-board PCB can also reduce the difficulty of manufacturing, save the manufacturing cost, and reduce the area of the single board.
  • FIG. 2 is an exemplary diagram of the connection relationship between the IC chip and the single-board side backplane connector provided by the embodiment of the present application.
  • the IC chip is interconnected with the single-board side backplane connector by soldering or crimping to achieve high-speed service signal transmission between the IC chip and the single-board side backplane connector, therefore, no longer It needs to be connected through a single-board PCB.
  • FIG. 3 is a schematic diagram of a connection relationship between an IC chip on a single-board PCB, a single-board side backplane connector, and other components provided by an embodiment of the present application.
  • the IC chip and the single board side backplane connector are directly soldered or crimped, and the chip is connected to the single board PCB through soldering or pin connectors, and the single board side backplane connector is crimped It can be fixed on the single board PCB by screw or screw.
  • the single board side backplane connector and the backplane side backplane connector are in mating relationship.
  • the IC chip can also be connected to other chips or modules on the single-board PCB through soldering cables or through cable connectors; and these chips or modules can be directly soldered or pinned connectors or directly pressed
  • the connection method is fixed on the single-board PCB.
  • FIG. 4(a) is a schematic diagram of an IC chip pin provided by an embodiment of the present application
  • FIG. 4(b) is a schematic diagram of another IC chip pin provided by an embodiment of the present application
  • FIG. 4(c) is Another IC chip pin schematic diagram provided by an embodiment of the present application
  • FIG. 4(d) is another IC chip pin schematic diagram provided by an embodiment of the present application. As shown in Figure 4 (a) to Figure 4 (d).
  • 401 is the substrate of the IC chip.
  • 402 is the BGA solder ball or pad on the bottom of the substrate, which is used for soldering connection with the pad or solder ball on the backplane connector.
  • 402 may also be a pin or hole for crimping at the bottom of the substrate, for crimping connection with the hole or pin on the backplane connector.
  • 403 is an electrical pin that can be welded on the edge of the substrate of the IC chip, and can be distributed at the bottom or top of the IC chip substrate to facilitate direct soldering with the single-board PCB through solder.
  • 404 is a pin or hole at the bottom of the substrate of the IC chip, used for soldering with a single-board PCB or connected through a pin connector.
  • 404 may be a BGA solder ball on the bottom layer and/or top layer of the substrate of the IC chip, or a crimpable pin or hole so that other chips or modules on the board can be connected by soldering cables or by cable connectors, To achieve high-speed interconnection within the board.
  • 405 is the top of the IC chip, which can generally be used to contact the heat sink to transfer the heat generated by the chip during operation.
  • 4(a), 4(b) and 4(c) are schematic views from the bottom of the chip as a perspective
  • FIG. 4(d) is a schematic view from diagonally above the chip as a perspective.
  • 402 is at the bottom of the chip substrate
  • 404 may be provided at the bottom and/or top of the chip substrate.
  • FIG. 5(a) is a schematic diagram of a single-board side backplane connector provided by an embodiment of the application
  • FIG. 5(b) is a schematic diagram of another single-board side backplane connector provided by an embodiment of the application
  • 5(c) is a schematic diagram of another single-board side backplane connector provided by an embodiment of the present application
  • FIG. 5(d) is a schematic diagram of another single-board side backplane connector provided by an embodiment of the present application
  • 5(e) is a schematic diagram of another single-board side backplane connector provided by an embodiment of the present application
  • 5(f) is a schematic diagram of another single-board side backplane connector provided by an embodiment of the present application
  • 5(g) is a schematic diagram of another single-board side backplane connector provided by an embodiment of the present application. As shown in Figure 5 (a) to Figure 5 (g).
  • the single-board side backplane connector has a PCB contact surface on one side, and there are pins for crimping on this side, so that the connector can be crimped into the hole of the single-board PCB. Or there is a screw hole for fixing on this surface, so that it can be fixed to the connector from the bottom of the PCB with screws. Or there are screw hole columns for installation on both sides of the PCB contact surface, such as 505 in FIG. 5(g), for screw fixing with the PCB board. There are holes or pins for connection on the mating surface of the backplane connector 501, so as to make mating connection with the backplane connector on the backplane side.
  • 502 is a BGA pad or solder ball, which is used for solder connection with the solder ball or pad on the bottom of the IC chip substrate; or 502 may also be a pin or a hole, so that Connect to the holes or pins on the bottom of the IC chip substrate for crimping. And the position of 502 may be located on one or more sides of 501.
  • 502 is located on the opposite side of the connector surface of the backplane connector.
  • 502 is located on the opposite side of the PCB contact surface.
  • 502 is located on the side adjacent to both the PCB contact surface and the connector surface.
  • 503 is the pin or hole when the single-board side backplane connector 501 and the backplane side backplane connector are plugged, and is located on the plugging surface of 501 so that Realize the mating connection with the hole or pin on the backplane connector on the backplane side.
  • 504 is a circuit inside the single-board side backplane connector 501 to realize the connection between 502 and 503, which may be a metal sheet and/or a cable.
  • the single-board side backplane connector 501 may be a regular rectangular parallelepiped.
  • the high-speed signal lines on the connection wafer inside the backplane connector may have a parallel relationship between the chip connection surface and the backplane side backplane connector surface.
  • the single-board side backplane connector 501 may also be horn-shaped, because the pin density of the BGA pads or solder balls 502 may be high, and the spacing between the pins Very small; and the pin density of 503 is small, and the interval may be large, so the trumpet with an amplified relationship can be connected to a high-density IC chip and a low-density backplane side backplane connector, at this time the backplane connector
  • the internal connection wafer can have an amplitude-amplified relationship between the chip connection surface and the backplane connector surface on the backplane side.
  • the mating surface of the single-board side backplane connector 501 can be divided into multiple connector end surfaces, so that this single-board-side backplane connector can be plug-connected with multiple backplane-side backplane connectors.
  • FIG. 6(a) is a schematic diagram of an IC chip connected to a single board side backplane connector provided by an embodiment of the present application
  • FIG. 6(b) is another IC chip provided to a single board side back provided by an embodiment of the present application Schematic diagram of board connector connection.
  • FIG. 6(a) is the situation before the IC chip is connected to the single board side backplane
  • FIG. 6(b) is the situation after the IC chip is connected to the single board side backplane.
  • the BGA pad or solder ball 502 is on the opposite side of the PCB contact surface of the single-board side backplane connector 501.
  • the BGA pads or solder balls 502 may also be on the other surface of the backplane connector 501 on the single board side. After the IC chip and the single-board side backplane are connected together, the connection of the high-speed signal from the IC chip to the single-board side backplane connector is completed without passing through the single-board PCB or the like.
  • FIG. 7 is a schematic diagram of the relationship between the IC chip on the PCB and the backplane connector on the single-board side provided by the embodiment of the present application.
  • 801 is a single-board PCB, and a single-board side backplane connector 501 is mounted on the single-board PCB801, wherein the single-board side backplane connector 501 and the single-board PCB 801 may be crimped, or It can also be fixed by screws at the bottom.
  • the chip IC is directly connected to the single-board side backplane connector 501 by soldering or crimping.
  • 803 is the backplane PCB
  • 804 is the backplane side backplane connector on the backplane PCB 803
  • 805 is the pin or hole on the 804 connector surface.
  • the signals on the IC chip can be crimped or soldered through the pins on the bottom of the substrate and the pins on one side of the backplane connector, so that the high-speed signals of the IC chip can directly interact with the backplane connector Function.
  • FIG. 8 is a structural diagram of a communication device according to an embodiment of the present application.
  • the communication device 100 includes the chip-to-backplane connector interconnection device 200 in the foregoing embodiment.
  • the communication device 100 may be a communication device interconnected between a high-speed service chip used by a server, a router, and a backplane connector.
  • the communication device 100 may include multiple backplane connector interconnection devices 200 according to the data of the single board.
  • the high-speed signal of the IC chip can be directly connected to the backplane connector without passing through the single-board PCB, the signal caused by the high-speed signal being connected to the backplane connector through the single-board PCB is avoided.
  • the problem of abnormal transmission and reception of electrical signals caused by the loss greatly reduces the loss during transmission of electrical signals, and can also effectively extend the transmission distance of electrical signals on the backplane.
  • the single The board PCB can also reduce the manufacturing difficulty, save the manufacturing cost, and reduce the board area.

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  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

一种芯片与背板连接器互连装置及通信设备，该芯片与背板连接器互连装置包括第一IC芯片和第一背板连接器，其中，所述第一IC芯片与第一背板连接器直接互连。

Description

芯片与背板连接器互连装置及通信设备
本申请要求在2018年12月28日提交中国专利局、申请号为201811626651.6的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。
技术领域
本申请涉及通信领域，例如涉及一种芯片与背板连接器互连装置及通信设备。
背景技术
随着万物互联的需求越来越强烈，互联网的发展越来越迅猛，大量的业务在不同的站点之间即时传递，这些对网络中交换设备的交换容量提出了越来越高的要求。而基于光传送网(Optical Transport Network，OTN)、分组传送网(Packet Transport Net，PTN)等领域的集中交换设备，通常由多个业务板\线卡(Line Card，LC)和多个交换板\交换卡(Switch Card)组成，每个业务板和每个交换板之上存在高速业务处理的集成电路(integrated circuit，IC)芯片或特别应用的集成电路(Application Specific Integrated Circuit，ASIC)芯片，这些IC芯片之间都要有足够多的物理连接通路，这些通路或通过单板印制电路板(Printed Circuit Board，PCB)直接互连，或通过背板上的电路实现业务板与交换板之间的高速信号互连。
如图1所示，IC芯片或ASIC芯片基本都是采用芯片底部的焊球阵列封装(Ball Grid Array，BGA)封装的焊球与单板PCB进行焊接，以实现芯片上所有的高速信号、低速信号和电源等信号全部都连接到单板PCB上。而单板侧背板连接器一般是单板侧背板连接器的单板面压接在单板PCB上，实现将单板PCB上的信号传递到单板侧背板连接器上；单板侧背板连接器的接插面与背板侧背板连接器进行对插连接，实现将单板PCB上的信号传递到背板上。其中IC芯片的高速业务信号通过PCB内部的传输线连接到单板侧背板连接器上。然而，高速电信号经过BGA焊接会产生一定的损耗，高速电信号还需要在单板PCB上传递一段距离后到单板侧背板连接器上，故单板PCB也会对高速电信号产生较大的损耗，这些将导致高速电信号在单板PCB上的损耗较大。
随着电信号速率的提升，这种IC芯片与背板连接器的连接方式带来的电信号传输损耗越来越大，以至于电信号只能传递非常短的距离，而在传输稍长距离后，即跨背板传输时，电信号传递到芯片的接收端仍无法被正确接收。而且，由于IC芯片与背板连接器间的高速信号较多，为实现单板PCB内部芯片的高密 度高速率的电信号之间传输，会导致单板PCB设计、制作高成本、加工时间长、加工难度大等问题。
发明内容
本申请提供了一种芯片与背板连接器互连装置以及基于该互连装置的通信设备，以至少解决相关技术中IC芯片与背板连接器的连接方式所导致的电信号传输损耗的问题。
根据本申请的一个方面，提供了一种芯片与背板连接器互连装置，包括第一IC芯片和第一背板连接器，其中，所述第一IC芯片与第一背板连接器直接互连。
在一实施例中，所述第一IC芯片通过焊接或压接的方式与所述第一背板连接器互连。
在一实施例中，所述第一IC芯片的基板底部设置有BGA焊球或焊盘，所述第一背板连接器的焊接面上设置有对应的BGA焊盘或焊球。
在一实施例中，所述第一IC芯片的基板底部设置有用于压接的针或孔，所述第一背板连接器的连接面上设置有对应的用于压接的孔或针。
在一实施例中，上述互连装置还包括单板PCB，所述第一IC芯片通过焊接或插针连接器连接至所述单板PCB。
在一实施例中，所述第一IC芯片的基板边缘设置有用于焊接的电引脚，通过所述电引脚与所述单板PCB焊接连接。
在一实施例中，第一IC芯片的基板底部设置有插针或孔，通过所述插针或孔与所述单板PCB的插针连接器连接。
在一实施例中，所述单板PCB上还设置第二IC芯片，所述第一IC芯片和所述第二IC芯片之间通过焊接线缆或通过线缆连接器相连接。
在一实施例中，所述第一IC芯片的基板的底层和/或顶层上设置有BGA焊球，或设置有用于压接的针或孔，以便通过焊接线缆或通过线缆连接器连接至所述第二IC芯片。
在一实施例中，所述第一背板连接器通过压接或螺钉固定的方式固定在所述单板PCB上。
在一实施例中，在第一背板连接器的PCB接触面设置有用于压接的针或孔，或在所述第一背板连接器的PCB接触面第一侧的面上和第二侧的面上设置有用于固定的螺钉孔或螺钉孔柱，以便与所述单板PCB板进行压接或螺钉固定。
在一实施例中，该互连装置还包括第二背板连接器，其中，所述第一背板连接器与一个或多个所述第二背板连接器对插连接。
在一实施例中，所述第一背板连接器的接插面上和所述第二背板连接器的接插面上对应设置有用于插接连接的孔或针。
在一实施例中，该互连装置还包括背板，所述第二背板连接器设置在所述背板上。
在一实施例中，所述第一背板连接器呈喇叭形，所述第一背板连接器内部的连接薄片上的高速信号线在所述第一IC芯片连接面和第二背板连接器连接面为幅度放大的关系。
根据本申请的另一方面，提供了一种通信设备，包括上述实施例中的芯片与背板连接器互连装置。
附图说明
图1为相关技术中的单板上IC芯片和单板侧背板连接器的连接关系示意图；
图2为本申请实施例提供的IC芯片与单板侧背板连接器连接关系的示意图；
图3为本申请实施例提供的单板PCB上IC芯片和单板侧背板连接器以及其它部件连接关系的示意图；
图4(a)为本申请实施例提供的一种IC芯片引脚示意图；
图4(b)为本申请实施例提供的另一种IC芯片引脚示意图；
图4(c)为本申请实施例提供的另一种IC芯片引脚示意图；
图4(d)为本申请实施例提供的另一种IC芯片引脚示意图；
图5(a)为本申请实施例提供的一种单板侧背板连接器的示意图；
图5(b)为本申请实施例提供的另一种单板侧背板连接器的示意图；
图5(c)为本申请实施例提供的另一种单板侧背板连接器的示意图；
图5(d)为本申请实施例提供的另一种单板侧背板连接器的示意图；
图5(e)为本申请实施例提供的另一种单板侧背板连接器的示意图；
图5(f)为本申请实施例提供的另一种单板侧背板连接器的示意图；
图5(g)为本申请实施例提供的另一种单板侧背板连接器的示意图；
图6(a)为本申请实施例提供的一种IC芯片与单板侧背板连接器连接示意图；
图6(b)为本申请实施例提供的另一种IC芯片与单板侧背板连接器连接示意图；
图7为本申请实施例提供的PCB板上IC芯片与单板侧背板连接器连接后与背板关系的示意图；
图8为本申请实施例提供的通信设备的结构图。
具体实施方式
下文中将参考附图并结合实施例来说明本申请。
需要说明的是，本申请的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。
本申请实施例提供了一种芯片与背板连接器互连装置。为了便于描述，本实施例将从IC芯片、背板连接器、以及IC芯片与背板连接器之间互连的角度进行描述。
(一)IC芯片
在本实施例中，IC芯片的基板底部为BGA焊球，以便与背板连接器进行焊接连接。或IC芯片的基板底部包括用于压接的针或孔，以便与背板连接器上的孔或针进行压接连接。
在另一实施例中，IC芯片的基板底部还有插针或孔，以便与PCB进行焊接或插针连接器连接；或者IC芯片的基板边缘还有可焊接的电引脚，以便与PCB通过焊锡直接进行焊接。
在另一实施例中，IC芯片的基板的底层和/或顶层上还有BGA焊球，或还有可压接的针或孔，以便可以通过焊接线缆或通过线缆连接器连接单板PCB上的其它芯片或模块，以实现板内的高速互连。
(二)背板连接器
在一实施例中，背板连接器的PCB接触面有用于压接的针或便于固定的螺钉孔，或在背板连接器的PCB接触面两侧的面上有用于安装的螺钉孔柱，用于与PCB板之间为焊接或压接或螺钉固定。
在一实施例中，在背板连接器的接插面上还可以设置有用于连接的孔或针，以便与其它背板连接器，例如，该背板连接器与背板侧背板连接器进行对插连接。
在一实施例中，在背板连接器的非背板连接器面或PCB接触面上，可以设置有BGA焊盘或焊球，以便与IC芯片进行焊接连接；或有针或孔，以便与IC芯片底部的孔或针进行压接连接。
在一实施例中，背板连接器内部的薄片单元(wafer)在芯片连接面和背板侧背板连接器面可以为幅度放大的关系，以便能分别连接高密度的IC芯片和低密度的背板侧背板连接器。
(三)IC芯片与背板连接器之间互连的装置：
在一实施例中，IC芯片通过焊接或压接的方式与单板侧背板连接器进行互连。
在一实施例中，IC芯片还可通过焊接或插针连接器连接到单板PCB上。在一实施例中，IC芯片还通过焊接线缆或通过线缆连接器连接到单板PCB上的其它芯片或模块上。
在一实施例中，单板侧背板连接器可通过压接或螺钉固定的方式固定在单板PCB上。
在上述实施例中，由于IC芯片的高速信号无需通过单板的PCB即可直接连接到背板连接器上，避免了高速信号通过单板PCB连接到背板连接器带来的信号损失而导致电信号收发异常的问题。而且单板PCB上无需传输大量到背板连接器上的高速信号，故单板PCB也可减小制作难度，节省制作成本，单板面积也会减小。
下面将结合附图2至图8对本申请实施例所提供的芯片与背板连接器互连装置进行描述。
图2为本申请实施例提供的IC芯片与单板侧背板连接器连接关系的示例图。如图2所示，IC芯片通过焊接或压接的方式与单板侧背板连接器进行互连，以实现IC芯片和单板侧背板连接器间的高速业务信号传递，因此，不再需要通过单板PCB进行连接。
图3为本申请实施例提供的单板PCB上IC芯片和单板侧背板连接器以及其它部件连接关系的示意图。在本实施例中，IC芯片与单板侧背板连接器直接进行焊接或压接连接，而且芯片通过焊接或插针连接器连接到单板PCB上，单板侧背板连接器通过压接或螺钉固定的方式安装到单板PCB上，单板侧背板连接器与背板侧背板连接器为对插关系。
如图3所示，IC芯片还可通过焊接线缆或通过线缆连接器连接到单板PCB上的其它芯片或模块上；而这些芯片或模块则可通过焊接或插针连接器或直接压接连接的方式固定在单板PCB上。
图4(a)为本申请实施例提供的一种IC芯片引脚(pins)示意图；图4(b)为本申请实施例提供的另一种IC芯片引脚示意图；图4(c)为本申请实施例提供的另一种IC芯片引脚示意图；图4(d)为本申请实施例提供的另一种IC芯片引脚示意图。如图4(a)至图4(d)所示。
401为IC芯片的基板。402为基板底部的BGA焊球或焊盘，用于与背板连接器上的焊盘或焊球进行焊接连接。402也可以是基板底部用于压接的针或孔，用于与背板连接器上的孔或针进行压接连接。
403为IC芯片的基板边缘可焊接的电引脚，可分布在IC芯片基板的底部或顶部等位置，以便与单板PCB通过焊锡直接进行焊接。404为IC芯片的基板底部的插针或孔，用于与单板PCB进行焊接或通过插针连接器连接。
404可以是IC芯片的基板的底层和/或顶层上的BGA焊球，或可压接的针或孔，以便可以通过焊接线缆或通过线缆连接器连接单板上的其它芯片或模块，以实现单板内的高速互连。
405为IC芯片顶部，一般可用来接触散热器，传递芯片工作时产生的热量。图4(a)、4(b)和4(c)是以芯片底部为视角的示意图，图4(d)以芯片的斜上方为视角的示意图。在图4(d)中，402在芯片基板的底部，404可以设置在芯片基板的底部和/或顶部。
图5(a)为本申请实施例提供的一种单板侧背板连接器的示意图；图5(b)为本申请实施例提供的另一种单板侧背板连接器的示意图；图5(c)为本申请实施例提供的另一种单板侧背板连接器的示意图；图5(d)为本申请实施例提供的另一种单板侧背板连接器的示意图；图5(e)为本申请实施例提供的另一种单板侧背板连接器的示意图；图5(f)为本申请实施例提供的另一种单板侧背板连接器的示意图；图5(g)为本申请实施例提供的另一种单板侧背板连接器的示意图。如图5(a)至图5(g)所示。
501为单板侧背板连接器。单板侧背板连接器有一面为PCB接触面，此面上有用于压接的针，以便能把此连接器压接到单板PCB的孔内。或者此面有用于固定的螺钉孔，以便能用螺钉从PCB的底部与此连接器固定。或者在PCB接触面两侧的面上有用于安装的螺钉孔柱，如图5(g)中的505，以便与PCB板之间螺钉固定。在背板连接器501的接插面上有用于连接的孔或针，以便与背板侧背板连接器进行对插连接。
在图5(a)至图5(g)中，502为BGA焊盘或焊球，用于与IC芯片基板底部的焊球或焊盘进行焊接连接；或者502也可以为针或孔，以便与IC芯片基板底部的孔或针进行压接连接。且502的位置可位于501的某一面或多面上。 在图5(a)、5(b)、5(e)和5(g)中，502位于背板连接器接插面的相对的一面上。在5(c)和图5(f)中，502位于PCB接触面的相对的一面上。在图5(d)中，502位于与PCB接触面和接插面均相邻的一面上。
在图5(b)至图5(f)中，503为单板侧背板连接器501与背板侧背板连接器进行接插时的针或孔，位于501的接插面上，以便实现与背板侧背板连接器上的孔或针进行对插连接。504为单板侧背板连接器501内部实现502和503间连接的线路，可以是金属片和/或线缆等。
如图5(a)、5(b)、5(c)、5(d)和5(g)中所示。单板侧背板连接器501可以是规则的长方体，此时背板连接器内部的连接薄片wafer上的高速信号线在芯片连接面和背板侧背板连接器面可以为平行的关系。
如图5(e)和5(f)中所示，单板侧背板连接器501也可以呈喇叭形，因为BGA焊盘或焊球502的引脚密度可能很高，引脚间的间隔非常小；而503的引脚密度小，间隔可能较大，所以幅度为放大关系的喇叭形能分别连接高密度的IC芯片和低密度的背板侧背板连接器，此时背板连接器内部的连接薄片wafer在芯片连接面和背板侧背板连接器面可以为幅度放大的关系。此时，单板侧背板连接器501的接插面，可以划分为多个连接器端面，以便此一个单板侧背板连接器可与多个背板侧背板连接器接插连接。
图6(a)为本申请实施例提供的一种IC芯片与单板侧背板连接器连接的示意图；图6(b)为本申请实施例提供的另一种IC芯片与单板侧背板连接器连接的示意图。其中，图6(a)为IC芯片与单板侧背板连接之前的情景，图6(b)为IC芯片与单板侧背板连接之后的情形。如图6(a)和图6(b)所示，BGA焊盘或焊球502在单板侧背板连接器501的PCB接触面的相对的一面。显然BGA焊盘或焊球502也可以在单板侧背板连接器501的其它面上。IC芯片与单板侧背板连接在一块之后，就完成了高速信号从IC芯片到单板侧背板连接器间的连接，无需通过单板PCB等进行传递。
图7为本申请实施例提供的PCB板上IC芯片与单板侧背板连接器连接后与背板关系的示意图。
如图7所示，801为单板PCB，单板PCB801上安装有单板侧背板连接器501，其中，单板侧背板连接器501与单板PCB 801之间可以是压接，或者也可以是通过底部的螺钉进行固定。芯片IC直接与单板侧背板连接器501进行焊接或压接连接。
802为IC芯片与单板PCB 801的插针焊接连接，以完成芯片与单板PCB的信号连接。
803为背板PCB，804为背板PCB 803上的背板侧背板连接器，805为804接插面上的插针或孔。
此本实施例中，只在背板PCB 803上绘制了2个背板侧背板连接器804。在连接时，在推动单板PCB 801向背板PCB 803插入的过程中，就可以实现单板侧背板连接器501与背板侧背板连接器804的接插，进而实现了芯片上的信号通过背板连接器传递到背板PCB 803的功能，避免了高速信号通过单板PCB 801进行传递而产生的信号损耗等问题。
如此，即可将IC芯片上的信号通过基板底部的引脚与背板连接器上某一面的引脚进行压接或焊接互连，实现了IC芯片的高速信号直接与背板连接器进行互连的功能。
本申请实施例还提供了一种通信设备。图8为根据本申请实施例的通信设备的结构图，如图8所示，该通信设备100包括了上述实施例中的芯片与背板连接器互连装置200。该通信设备100可以是服务器、路由器等采用的高速业务芯片与背板连接器之间互连的通讯设备。在本实施例中，通信设备100可以根据单板的数据，包括多个背板连接器互连装置200。
在本申请的上述实施例中，由于IC芯片的高速信号无需通过单板PCB即可直接连接到背板连接器上，从而避免了高速信号通过单板PCB连接到背板连接器带来的信号损失而导致电信号收发异常的问题，极大的减小了电信号传输时的损耗，也可有效延长电信号在背板上的传输距离。另外，由于芯片之间的电信号损耗减小了，可以减小芯片串行解串器的功耗；并且，由于单板PCB上无需传输IC芯片到背板连接器上的高速信号，故单板PCB也可减小制作难度，节省制作成本，单板面积也会减小。

Claims (16)

  1. 一种芯片与背板连接器互连装置，包括第一集成电路IC芯片和第一背板连接器，其中，所述第一IC芯片与所述第一背板连接器直接互连。
  2. 根据权利要求1所述的互连装置，其中，所述第一IC芯片通过焊接或压接的方式与所述第一背板连接器互连。
  3. 根据权利要求2所述的互连装置，其中，所述第一IC芯片的基板底部设置有焊球阵列封装BGA焊球或焊盘，所述第一背板连接器的焊接面上设置有对应的BGA焊盘或焊球。
  4. 根据权利要求2所述的互连装置，其中，所述第一IC芯片的基板底部设置有用于压接的针或孔，所述第一背板连接器的连接面上设置有对应的用于压接的孔或针。
  5. 根据权利要求1所述的互连装置，还包括：单板印制电路板PCB，所述第一IC芯片通过焊接或插针连接器连接到所述单板PCB上。
  6. 根据权利要求5所述的互连装置，其中，所述第一IC芯片的基板边缘设置有用于焊接的电引脚，通过所述电引脚与所述单板PCB焊接连接。
  7. 根据权利要求5所述的互连装置，其中，所述第一IC芯片的基板底部设置有插针或孔，通过所述插针或孔与所述单板PCB的插针连接器连接。
  8. 根据权利要求5所述的互连装置，其中，所述单板PCB上还设置第二IC芯片，所述第一IC芯片和所述第二IC芯片之间通过焊接线缆或通过线缆连接器相连接。
  9. 根据权利要求8所述的互连装置，其中，所述第一IC芯片的基板的底层和顶层中的至少之一上设置有BGA焊球，或设置有用于压接的针或孔，以便所述第一IC芯片通过焊接线缆或通过线缆连接器连接至所述第二IC芯片。
  10. 根据权利要求5所述的互连装置，其中，所述第一背板连接器通过压接或螺钉固定的方式固定在所述单板PCB上。
  11. 根据权利要求10所述的互连装置，其中，在所述第一背板连接器的PCB接触面设置有用于压接的针或孔，或在所述第一背板连接器的PCB接触面的第一侧的面上和第二侧的面上设置有用于固定的螺钉孔或螺钉孔柱，以便所述第一背板连接器与所述单板PCB板进行压接或螺钉固定。
  12. 根据权利要求1所述的互连装置，还包括：第二背板连接器，其中，所述第一背板连接器与所述第二背板连接器对插连接。
  13. 根据权利要求12所述的互连装置，其中，所述第一背板连接器的接插面上和所述第二背板连接器的接插面上对应设置有用于插接连接的孔或针。
  14. 根据权利要求13所述的互连装置，还包括：背板PCB，所述第二背板连接器设置在所述背板PCB上。
  15. 根据权利要求14所述的互连装置，其中，所述第一背板连接器呈喇叭形，所述第一背板连接器内部的连接薄片上的高速信号线在所述第一IC芯片的连接面和第二背板连接器的连接面为幅度放大的关系。
  16. 一种通信设备，包括权利要求1至15中任一项所述的芯片与背板连接器互连装置。
PCT/CN2019/128620 2018-12-28 2019-12-26 芯片与背板连接器互连装置及通信设备 WO2020135561A1 (zh)

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