WO2020135041A1 - 摄像装置及电子设备 - Google Patents
摄像装置及电子设备 Download PDFInfo
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- WO2020135041A1 WO2020135041A1 PCT/CN2019/124519 CN2019124519W WO2020135041A1 WO 2020135041 A1 WO2020135041 A1 WO 2020135041A1 CN 2019124519 W CN2019124519 W CN 2019124519W WO 2020135041 A1 WO2020135041 A1 WO 2020135041A1
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- WO
- WIPO (PCT)
- Prior art keywords
- imaging device
- lens
- deformation
- bracket
- transparent
- Prior art date
Links
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- 230000002093 peripheral effect Effects 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
Definitions
- the present disclosure relates to the technical field of imaging devices, and in particular, to an imaging device and electronic equipment.
- the camera devices are provided in electronic devices such as mobile phones, tablet computers, and notebooks.
- the camera devices can be used for taking pictures or recording videos.
- the camera device 2 used in electronic devices in the related art includes a lens group 21.
- the voice coil motor must occupy a certain thickness of space, which makes the camera device unable to be thin.
- the camera device protrudes from the electronic device and affects the appearance of the electronic device.
- Embodiments of the present disclosure provide an imaging device and electronic equipment, which solves the problem that the imaging device in the related art is provided with a voice coil motor, resulting in the inability of the imaging device to be thin and occupying the thickness space of the electronic device; if the electronic device is thinned, the imaging device It will protrude from the electronic device and affect the appearance of the electronic device.
- an imaging device which includes a support, a deformation lens, an electromagnetic coil, and an image sensor assembly, the deformation lens is disposed in the support, the electromagnetic coil is disposed on the support, and surrounds the deformation lens,
- the image sensor assembly is disposed at one end of the bracket and corresponds to the deformable lens, wherein the deformable lens produces a deformation in the magnetic field generated by the electromagnetic coil, and the deformation changes the focal length of the deformable lens.
- an electronic device which includes the camera device of the first aspect.
- the magnetic field generated by the electromagnetic coil installed in the bracket acts on the deformable lens to deform the deformable lens to adjust the focal length of the deformable lens.
- the imaging device of the present disclosure omits the setting of the voice coil motor, which is effective Reduce the thickness of the camera device to prevent the camera device from occupying the thickness space of the electronic device, so that the electronic device can be thin, and the camera device can be hidden in the electronic device without affecting the appearance of the electronic device.
- FIG. 1 is a cross-sectional view of an imaging device of the present disclosure
- FIG. 2 is a usage state diagram of the imaging device of the present disclosure
- FIG. 3 is a cross-sectional view of an imaging device in the related art.
- FIG. 1 is a cross-sectional view of the camera device of the present disclosure.
- this embodiment provides an camera device 1.
- the camera device 1 includes a bracket 10, a deformation lens 11, an electromagnetic coil 12, and an image sensor assembly 13.
- the stent 10 of this embodiment has a first hollow end 101 and a second hollow end 102.
- the first hollow end 101 is provided at one end of the second hollow end 102 and communicates with the second hollow end 102.
- the deformable lens 11 is disposed in the first hollow end 101 of the bracket 10, and its peripheral edge abuts the side wall of the first hollow end 101.
- the material of the deformation lens 11 is a transparent magnetostrictive material.
- the transparent magnetostrictive material is mainly formed by distributing nano-scale magnetic powder in a transparent matrix.
- the material of the nano-scale magnetic powder may be a metal alloy (such as nickel alloy (nickel-cobalt) Alloy, nickel-cobalt-chromium alloy), iron alloy (iron-nickel alloy, iron-cobalt alloy, iron-cobalt-vanadium alloy), ferrite (such as nickel-cobalt ferrite, nickel-cobalt-copper ferrite), or rare earth metal compound.
- Transparent substrate It is a glass ceramic, which is mainly formed by adding metal to the glass.
- the deformation lens 11 of this embodiment is to add nano-scale iron-cobalt alloy powder to aluminum fluoride.
- the electromagnetic coil 12 is disposed on the bracket 10 and surrounds the deformation lens 11, in this embodiment In this case, the electromagnetic coil 12 is embedded in the side wall of the first hollow end 101 of the bracket 10 by insert molding.
- the image sensor assembly 13 is disposed at one end of the second hollow end 102 of the bracket 10 and corresponds to the deformation lens 11.
- the image sensor assembly 13 includes a circuit board 131 and an image sensor 132 disposed on the circuit board 131.
- the image sensor 132 is electrically connected to the circuit board 131.
- the image sensor 132 is located in the second hollow end 102 and corresponds to the deformable lens 11, and the circuit board 131 closes one end of the second hollow end 102, that is, The end surface of the second hollow end 102 abuts the surface of the circuit board 131 where the image sensor 132 is provided.
- the circuit board 131 is electrically connected to the electromagnetic coil 12 through the lead 121.
- the lead 121 is reserved in the side wall of the second hollow end 102 of the bracket 10 by insert molding, or the lead 121 is directly formed on the bracket 10 by laser forming
- the second hollow end 102 has one end connected to the electromagnetic coil 12 and the other end connected to the circuit board 131.
- the circuit board 131 has a pad 1311, and the leads are connected to the circuit board 131 through the pad 1311.
- a solder paste is coated on the pad 1311, and the lead 121 is soldered to the solder paste to be fixed on the pad 1311.
- FIG. 2 is a usage state diagram of the imaging device of the present disclosure.
- an external light source enters from the deformation lens 11 and the image sensor 132 senses the deformation
- the light source entered by the lens 11 generates an image.
- the external power supply provides power to the circuit board 131, and the power of the circuit board 131 passes a current through the lead 121 to the electromagnetic coil 12, the electromagnetic coil 12 According to Ampere's rule, a magnetic field is generated, and the magnetic field generated by the electromagnetic coil 12 is applied to the deformation lens 11, and the lattice in each magnetic domain in the deformation lens 11 spontaneously deforms along the magnetization intensity of the magnetic domain, causing the deformation lens 11 to deform (Eg: extend or shorten) to change the focal length of the deformation lens 11.
- the material of the bracket 10 in this embodiment may be a thermally conductive plastic or a thermally and electrically conductive plastic, wherein the thermally conductive plastic is a filler added to a substrate, and the substrate is selected from polypropylene (PP), acrylonitrile-butadiene- Acrylonitrile butadiene styrene (ABS), polycarbonate (PC), polyamide (PA), phenyl-propanolamine (PPA), polybutylene terephthalate (polybutylene terephthalate) , PBT, liquid crystal polymer (LCP), polyphenylene sulfide (PPS), polyetherimide (PEI) and polyetheretherketone (PEEK),
- the filler is selected from one of metal, metal oxide, metal nitride and inorganic non-metal.
- the metal is selected from one of copper, aluminum, iron and nickel
- the metal oxide is selected from one of aluminum oxide, beryllium oxide, magnesium oxide, silicon dioxide and zinc oxide
- the metal nitride is selected from aluminum nitride and nitride
- the inorganic non-metal is selected from one of graphite, silicon carbide, carbon fiber, carbon nanotubes and graphene. If metal or inorganic non-metallic fillers are added to the substrate, it can form conductive and thermally conductive plastics.
- the second hollow end 102 of the bracket 10 of this embodiment is in contact with the circuit board 131.
- the bracket 10 When the circuit board 131 is in operation, the heat generated by the circuit board 131 is conducted to the outside through the bracket 10, effectively reducing the temperature rise of the circuit board 131 To improve the heat dissipation capacity of the imaging device 1.
- the material of the bracket 10 is a conductive and thermally conductive plastic, the bracket 10 can have an electromagnetic shielding function, which can shield the magnetic field generated by the electromagnetic coil 12 to avoid interfering with the operation of electronic components adjacent to the camera device of this embodiment.
- a pad 1311 is provided between the circuit board 131 and the end surface of the second hollow end 102 of the bracket 10, and the pad 1311 is coated with a conductive and thermally conductive adhesive, so that the end surface of the second hollow end 102 is bonded to the end surface of the second hollow end 102 through the conductive and thermally conductive adhesive
- the bracket 10 is provided on the circuit board 131.
- the conductive and thermal conductive adhesive can also promote the heat generated by the circuit board 131 to be taken out from the bracket 10, and at the same time can increase the conductivity of the bracket 10, thereby increasing the electromagnetic shielding effect of the bracket 10.
- the pad 1311 can be soldered to the end surface of the second hollow end 102 of the bracket 10 by solder paste, so that the bracket 10 is disposed on the circuit board 131.
- the imaging device 1 of this embodiment further includes a filter 14, which is disposed at one end of the first hollow end 101 of the bracket 10, and is located between the deformation lens 11 and the image sensor 132 of the image sensor assembly 13.
- the filter 14 is used to filter the light source entering from the deformation lens 11 to enhance the sensing effect of the image sensor 132.
- the present disclosure also provides an electronic device using the camera device of the above embodiment.
- the electronic device may be a mobile phone, a tablet computer, a notebook, a display screen, a navigator, a driving recorder, or other electronic devices.
- the present disclosure provides an imaging device and electronic equipment.
- the magnetic field generated by the electromagnetic coil provided on the bracket acts on the deformation lens to deform the deformation lens to adjust the focal length of the deformation lens.
- the imaging device of the disclosure Omitting the setting of the voice coil motor, effectively reducing the thickness of the camera device, avoiding the camera device occupying the thickness space of the electronic device, making the electronic device thinner, the camera device can be hidden in the electronic device, without affecting the appearance of the electronic device.
- the material of the bracket of the imaging device of the present disclosure can use conductive and thermally conductive materials, so that the imaging device has a good heat dissipation effect and electromagnetic shielding effect.
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Abstract
本公开实施例提供了一种摄像装置及电子设备，该摄像装置包括支架、形变镜头、电磁线圈及影像传感组件，该形变镜头设置于该支架内，该电磁线圈设置于该支架上，并围绕该形变镜头，该影像传感组件设置于该支架的一端，并对应该形变镜头，其中该形变镜头在该电磁线圈产生的磁场中产生形变，该形变改变该形变镜头的焦距。
Description
相关申请的交叉引用
本申请主张在2018年12月26日在中国提交的中国专利申请号No.201811603547.5的优先权，其全部内容通过引用包含于此。
本公开涉及摄像装置的技术领域，尤其涉及一种摄像装置及电子设备。
相关技术中，在手机、平板电脑和笔记本等电子设备中均设有摄像装置，摄像装置能用于拍照或录像，请参阅图3，相关技术中的电子设备所使用的摄像装置2包括镜头组21、音圈马达22、支架23、传感器24及线路板25，镜头组21设置于音圈马达22内，音圈马达22设置于支架23，传感器24设置于线路板25上，支架23罩设于线路板25上，传感器24位于支架23内，并对应镜头组21。其中音圈马达须占用一定的厚度空间，导致摄像装置无法薄型化，随著电子设备日益轻薄，出现摄像装置从电子设备凸出，影响电子设备的外观的问题。
发明内容
本公开实施例提供一种摄像装置及电子设备，解决相关技术中的摄像装置内设有音圈马达，导致摄像装置无法薄型化，占用电子装置的厚度空间；若电子装置薄型化后，摄像装置会从电子装置凸出，影响电子装置的外观的问题。
为了解决上述技术问题，本公开是这样实现的：
第一方面，提供了一种摄像装置，其包括支架、形变镜头、电磁线圈及影像传感组件，该形变镜头设置于该支架内，该电磁线圈设置于该支架上，并围绕该形变镜头，该影像传感组件设置于该支架的一端，并对应该形变镜头，其中该形变镜头在该电磁线圈产生的磁场中产生形变，该形变改变该形 变镜头的焦距。
第二方面，提供了一种电子设备，其包括第一方面的该摄像装置。
在本公开实施例中，通过设置于支架的电磁线圈所产生的磁场作用于形变镜头，使形变镜头产生形变，以调整形变镜头的焦距，本公开的摄像装置省略了音圈马达的设置，有效缩小摄像装置的厚度，避免摄像装置占用了电子设备的厚度空间，使电子设备能薄型化，摄像装置能隐藏于电子设备内，不影响电子设备的外观。
此处所说明的附图用来提供对本公开的进一步理解，构成本公开的一部分，本公开的示意性实施例及其说明用于解释本公开，并不构成对本公开的不当限定。在附图中：
图1是本公开的摄像装置的剖视图；
图2是本公开的摄像装置的使用状态图；
图3是相关技术中的摄像装置的剖视图。
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
请参阅图1，其是本公开的摄像装置的剖视图；如图所示，本实施例提供一种摄像装置1，摄像装置1包括支架10、形变镜头11、电磁线圈12及影像传感组件13。本实施例的支架10具有第一中空端部101及第二中空端部102，第一中空端部101设置于第二中空端部102的一端，并与第二中空端部102连通。形变镜头11设置于支架10的第一中空端部101内，其周缘抵接于第一中空端部101的侧壁。形变镜头11的材料为透明磁致伸缩材料，透明磁致伸缩材料是主要于透明基体内分布纳米级磁性粉末而形成，其中纳米级磁性粉末的材料可为金属合金(如：镍合金(镍钴合金、镍钴铬合金)、 铁合金(铁镍合金、铁钴合金、铁钴钒合金)、铁氧体(如：镍钴铁氧体、镍钴铜铁氧体)或稀土金属化合物。透明基体为玻璃陶瓷，其主要于玻璃内添加金属而形成，其材料为氧化物透明陶瓷(如：氧化铝、氧化铍、氧化钍、氧化钇)、氟化物透明陶瓷(如：氟化铝)、氮化物透明陶瓷或氧氮化物透明陶瓷。本实施例的形变镜头11是于氟化铝中添加纳米级铁钴合金粉末。电磁线圈12设置于支架10上，并围绕形变镜头11，在本实施例中，电磁线圈12通过嵌件注塑方式嵌设于支架10的第一中空端部101的侧壁内。
影像传感组件13设置于支架10的第二中空端部102的一端，并与形变镜头11对应。影像传感组件13包括线路板131及设置于线路板131的影像传感器132，影像传感器132电性连接线路板131。当影像传感组件13设置于第二中空端部102时，影像传感器132位于第二中空端部102内，并与形变镜头11对应，线路板131封闭第二中空端部102的一端，也就是第二中空端部102的端面抵接于线路板131设有影像传感器132的表面。线路板131通过引线121与电磁线圈12电性连接，引线121通过嵌件注塑时预留于支架10的第二中空端部102的侧壁内，或者引线121通过镭射直接成型形成于支架10的第二中空端部102，其一端连接电磁线圈12，其另一端连接线路板131。线路板131具有焊盘1311，引线通过焊盘1311与线路板131连接，焊盘1311上涂布锡膏，引线121焊接于锡膏上，以固定于焊盘1311上。
请一并参阅图2，其是本公开的摄像装置的使用状态图；如图所示，当本实施例的摄像装置1于使用时，外部光源从形变镜头11进入，影像传感器132感应从形变镜头11进入的光源而产生影像。在摄像装置1于使用过程中，欲调整摄像装置1的形变镜头11的焦距时，外部电源提供电力至线路板131，线路板131的电力通过引线121通入电流至电磁线圈12，电磁线圈12根据安培定则产生磁场，电磁线圈12所产生的磁场施加于形变镜头11，形变镜头11内的每个磁畴内的晶格沿磁畴的磁化强度方向发生自发形变，使形变镜头11产生形变(如：伸长或缩短)，以改变形变镜头11的焦距。
可选地，本实施例的支架10的材料可为导热塑料或导电导热塑料，其中导热塑料是基材中添加填料，基材选自聚丙烯(polypropylene，PP)、丙烯腈-丁二烯-苯乙烯(acrylonitrile butadiene styrene，ABS)、聚碳酸酯(polycarbonate， PC)、聚酰胺(polyamide，PA)、苯丙醇胺(phenyl-propanolamine，PPA)、聚对苯二甲酸丁二酯(polybutylene terephthalate，PBT)、液晶聚合物(liquid crystal polymer，LCP)、聚苯硫醚(polyphenylene sulfite，PPS)、聚醚酰亚胺(polyetherimide，PEI)及聚醚醚酮(polyetheretherketone，PEEK)中一者，填料选自金属、金属氧化物、金属氮化物及无机非金属中一者。其中金属选自铜、铝、铁及镍中一者，金属氧化物选自氧化铝、氧化铍、氧化镁、二氧化硅及氧化锌中一者，金属氮化物选自氮化铝、氮化硅及氮化硼中一者，无机非金属选自石墨、碳化硅、碳纤维、碳纳米管及石墨烯中一者。若基材中添加金属或无机非金属的填料可形成导电导热塑料。本实施例的支架10的第二中空端部102抵接于线路板131，当线路板131于运作时，线路板131所产生的热通过支架10传导至外部，有效降低线路板131的温升，提高摄像装置1的散热能力。支架10的材料为导电导热塑料时，支架10能具有电磁屏蔽的功能，其能屏蔽电磁线圈12所产生的磁场，避免干扰邻近本实施例的摄像装置的电子元器件的运作。
上述线路板131与支架10的第二中空端部102的端面之间设有焊盘1311，焊盘1311上涂布导电导热胶，使第二中空端部102的端面通过导电导热胶粘接于焊盘1311上，使支架10设置于线路板131上。导电导热胶也能促进线路板131所产生的热从支架10导出，同时能增加支架10的导电性，进而增加支架10的电磁屏蔽效果。当然焊盘1311能通过锡膏焊接于支架10的第二中空端部102的端面，使支架10设置于线路板131上。
本实施例的摄像装置1还包括滤光片14，滤光片14设置于支架10的第一中空端部101的一端，并位于形变镜头11与影像传感组件13的影像传感器132之间。滤光片14用以过滤从形变镜头11进入的光源，提升影像传感器132的传感效果。
本公开还提供一种电子设备，电子设备使用上述实施例的摄像装置，电子设备可为手机、平板电脑、笔记本、显示屏、导航仪、行车记录仪或其他电子设备。
综上所述，本公开提供一种摄像装置及电子设备，通过设置于支架的电磁线圈所产生的磁场作用于形变镜头，使形变镜头产生形变，以调整形变镜 头的焦距，本公开的摄像装置省略了音圈马达的设置，有效缩小摄像装置的厚度，避免摄像装置占用了电子设备的厚度空间，使电子设备能薄型化，摄像装置能隐藏于电子设备内，不影响电子设备的外观。本公开的摄像装置的支架的材料能使用导电导热材料，使摄像装置具有良好的散热效果及电磁屏蔽效果。
需要说明的是，在本文中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者装置不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括该要素的过程、方法、物品或者装置中还存在另外的相同要素。
上面结合附图对本公开的实施例进行了描述，但是本公开并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本公开的启示下，在不脱离本公开宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本公开的保护之内。
Claims (11)
- 一种摄像装置，包括支架、形变镜头、电磁线圈及影像传感组件，所述形变镜头设置于所述支架内，所述电磁线圈设置于所述支架上，并围绕所述形变镜头，所述影像传感组件设置于所述支架的一端，并对应所述形变镜头，其中，所述形变镜头在所述电磁线圈产生的磁场中产生形变，所述形变改变所述形变镜头的焦距。
- 如权利要求1所述的摄像装置，其中，所述形变镜头的材料为透明磁致伸缩材料。
- 如权利要求2所述的摄像装置，其中，所述透明磁致伸缩材料包括透明基体及纳米级磁性粉末，所述纳米级磁性粉末分布于所述透明基体内。
- 如权利要求3所述的摄像装置，其中，所述纳米级磁性粉末的材料选自金属合金、铁氧体及稀土金属化合物中一者。
- 如权利要求4所述的摄像装置，其中，所述纳米级磁性粉末的材料为铁钴合金。
- 如权利要求3所述的摄像装置，其中，所述透明基体的材料选自氧化物透明陶瓷、氟化物透明陶瓷、氮化物透明陶瓷及氧氮化物透明陶瓷中一者。
- 如权利要求6所述的摄像装置，其中，所述透明基体的材料为氟化铝。
- 如权利要求1所述的摄像装置，其中，所述支架的材料为导热塑料或导电导热塑料。
- 如权利要求1所述的摄像装置，其中，所述影像传感组件包括线路板及设置于所述线路板的影像传感器，所述线路板设置于所述支架的一端，所述影像传感器位于所述支架内，并对应所述形变镜头，所述电磁线圈通过引线电性连接所述线路板。
- 如权利要求1所述的摄像装置，还包括滤光片，所述滤光片设置于所述支架内，并位于所述形变镜头与所述影像传感组件之间。
- 一种电子设备，包括如权利要求1-10中任一项所述的摄像装置。
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