WO2020134353A1 - 扬声器模组 - Google Patents

扬声器模组 Download PDF

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Publication number
WO2020134353A1
WO2020134353A1 PCT/CN2019/110718 CN2019110718W WO2020134353A1 WO 2020134353 A1 WO2020134353 A1 WO 2020134353A1 CN 2019110718 W CN2019110718 W CN 2019110718W WO 2020134353 A1 WO2020134353 A1 WO 2020134353A1
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WO
WIPO (PCT)
Prior art keywords
conductive
cover
speaker module
cover body
speaker
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/110718
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English (en)
French (fr)
Inventor
冯炉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AAC Technologies Holdings Shenzhen Co Ltd
AAC Technologies Pte Ltd
Original Assignee
AAC Acoustic Technologies Shenzhen Co Ltd
AAC Technologies Pte Ltd
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Publication date
Application filed by AAC Acoustic Technologies Shenzhen Co Ltd, AAC Technologies Pte Ltd filed Critical AAC Acoustic Technologies Shenzhen Co Ltd
Publication of WO2020134353A1 publication Critical patent/WO2020134353A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/025—Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/026—Supports for loudspeaker casings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms

Definitions

  • the invention relates to the technical field of electroacoustics, in particular, to a speaker module.
  • the speaker module is an important acoustic component of portable electronic equipment, which can convert electrical energy into sound energy and radiate it out.
  • speaker modules have been widely used in a variety of portable electronic devices.
  • the speaker module often uses a flexible printed circuit board (Flexible Printed Circuit Board, FPCB) as an internal connector to electrically connect the speaker unit to an external circuit.
  • FPCB Flexible Printed Circuit Board
  • the speaker module 10 includes a housing 11, a speaker unit 13, a flexible printed circuit board 15 and a cover 17.
  • the housing 11 cooperates with the cover 17 to form an accommodation space for accommodating the speaker unit 13.
  • the flexible printed circuit board 15 is electrically connected to the speaker unit 13 at one end and connected to an external circuit at the other end.
  • the reinforcement board of the FPCB pad part is a non-conductive material. If the pad part of the FPCB is a double-sided pad design, the reinforcement part of the non-conductive material makes the pad on one side of the pad part impossible The electrical connection with other components limits the flexibility of module structure design.
  • the present invention provides a speaker module with a simple structure, a high degree of integration, a high reliability of product electrical connection and a compact structure.
  • the invention provides a speaker module including a housing
  • the speaker unit includes a basin stand and a working pad fixed to the basin stand and electrically connecting the speaker unit with an external circuit;
  • the cover body cooperates with the basin frame to form an accommodation space for accommodating the speaker unit.
  • the cover body includes a conductive portion, the conductive portion is formed on the cover body, and the conductive portion is on one of the cover bodies
  • a conductive pin is formed on one side, and a conductive terminal is formed on the other side of the cover, the conductive pin is electrically connected to the working pad of the speaker unit, and the conductive terminal is correspondingly electrically connected to an external circuit.
  • the conductive portion is formed on the cover body by an injection molding process, the conductive portion penetrates the cover body and is located at two opposite sides of the cover body The sides form the conductive pins and the conductive terminals, respectively.
  • the number of the conductive parts is two, which are symmetrically arranged in the edge area of the cover body.
  • the conductive pin includes a body, a connecting body, an abutting body and an extending body, the body is embedded in the cover body, and the connecting body The two ends of the are respectively connected to one end of the abutment body and one end of the body, the extension body extends from the abutment body toward the cover body side, and the end portion is embedded in the cover body, so The abutment body exposes the surface of the cover body.
  • the conductive terminal is formed on the surface of the body, and the surface of the cover is exposed.
  • the conductive terminal is a metal conductive layer formed on the surface of the body, and the conductive terminal is electrically connected to the body of the conductive pin correspondingly.
  • the metal conductive layer is any one of gold, silver, tin, copper and alloys thereof.
  • the abutment body abuts the working pad of the speaker unit and is elastically interposed between the speaker unit and the cover between.
  • the conductive portion and the cover are an integral structure.
  • the speaker module provided by the present invention has the following beneficial effects:
  • the conductive portion and the cover body have an integrated structure, eliminating the use of a separate printed circuit board, reducing the number of components, simplifying the structure, and solving the unreliability and components of the electrical connection using the printed circuit board Many troublesome assembly problems.
  • FIG. 1 is a schematic diagram of a three-dimensional exploded structure of a speaker module disclosed in the related art
  • FIG. 2 is a three-dimensional assembly schematic diagram of a speaker module provided by the present invention.
  • FIG. 3 is a schematic exploded view of the speaker module shown in FIG. 2;
  • FIG. 4 is a schematic structural view of the speaker unit shown in FIG. 3 from another angle;
  • FIG. 5 is a cross-sectional view of the speaker module shown in FIG. 2 along line V-V.
  • FIG. 2 is a three-dimensional assembly schematic diagram of the speaker module provided by the present invention.
  • FIG. 3 is an exploded schematic diagram of the speaker module shown in FIG. 2.
  • the speaker module 20 is used to realize electro-acoustic conversion.
  • the speaker module 20 includes a housing 21, a speaker unit 23, and a cover 25.
  • the housing 21 cooperates with the cover 25 to form an accommodation space for accommodating the speaker unit 23 therein.
  • the speaker unit 23 is correspondingly electrically connected to an external circuit through the cover 25.
  • the housing 21 includes an accommodating space with an opening.
  • FIG. 4 is a partial schematic view of the speaker unit shown in FIG. 4 from another angle.
  • the speaker unit 23 is a sound generating unit, which correspondingly converts the received electrical signal into an acoustic signal and outputs it.
  • the speaker unit 23 includes a basin frame 24 with a storage space and working pads 231 formed on the basin frame and electrically connected to an external circuit. The number of the working pads 231 is multiple, which is close to the speaker unit The edge layout of the body 23.
  • the cover body 25 has a flat shape as a whole, and the cover body 25 is provided at the opening of the casing 21 corresponding to the cover, and together forms a closed storage space for accommodating the speaker unit 23.
  • the cover 25 includes a body portion 251 and a conductive portion 253.
  • the body 251 has a flat shape, and its outer contour is consistent with the inner contour of the opening.
  • the conductive portion 253 is embedded in the body portion 251, wherein the number of the conductive portion 253 is plural, and is symmetrically disposed on the edge area of the cover 25.
  • the conductive portion 253 is embedded in the cover body 25 through an injection molding process, penetrates two opposite side surfaces of the cover body 25, and has an integrated structure with the cover body 25.
  • the conductive portion 253 includes conductive pins 2531 and conductive terminals 2532 disposed on two opposite side surfaces of the cover 25, wherein the conductive pins 2531 are disposed on the cover 25 adjacent to the speaker unit 23 Side surface, and extends from the surface of the cover body 25 toward the speaker unit 23; the conductive terminal 2532 is provided on the side surface of the cover body 25 away from the speaker unit 23, the surface of which exposes the cover body 25 surface.
  • the conductive pin 2531 is a conductive end processed by any one of gold, silver, copper, tin and its alloy.
  • the conductive pin 2531 includes a body 2533, a connecting body 2534, an abutting body 2535 and an extension body 2536 which are arranged in this order.
  • the body 2533 is embedded in the cover 25, and the body 2533 is disposed parallel to the surface of the cover 25.
  • Two ends of the connecting body 2534 are respectively connected to one end of the body 2533 and one end of the abutment body 2535. After assembly, the abutment body 2535 abuts correspondingly to the working pad 231 of the speaker unit 23 to realize electrical connection between the two.
  • extension body 2536 is connected to the abutment body 2535, and the other end extends toward the cover body 25.
  • the abutment body 2535 protrudes from the surface of the cover body 25 and is exposed and convex toward the speaker unit 23 side.
  • the body 2533 and the extension 2536 are embedded in the cover 25.
  • the conductive terminal 2532 is provided on the other side surface of the cover 25, and the conductive pin 2531 is provided on two opposite sides of the cover 25, which is formed on the surface of the conductive pin 2531
  • the conductive metal layer is formed.
  • the conductive terminal 2532 may be a gold layer plated on the surface of the conductive pin 2531.
  • the conductive terminal 2532 covers the body 2533 of the conductive pin 2531, is electrically connected correspondingly to the body 2533 of the conductive pin, and barely exposes the surface of the cover 25.
  • the conductive terminal 2532 is directly electrically connected to the external circuit.
  • Step S01 providing a housing 21, the housing 21 includes an accommodating space with an opening;
  • Step S02 providing a speaker unit 23, and correspondingly accommodated in the accommodation space;
  • step S03 a cover 25 is provided and correspondingly covered at the opening of the housing space of the housing 21, and at the same time, the conductive pin 2531 of the conductive portion 253 abuts the working pad 231 of the speaker unit 23, As shown in Figure 5.
  • the conductive pin 2531 of the conductive portion 253 is directly electrically connected to the conductive terminal 2532, so when the conductive pin 2531 and the working pad 231 of the speaker unit 23 correspond to During connection, correspondingly, the conductive terminal 2532 is indirectly electrically connected to the working pad 231, and when the conductive terminal 2532 is correspondingly electrically connected to an external conductive line, the driving signal generated by the conductive terminal 2532 can be directly passed through the conductive portion 253 The speaker unit 23 is driven to work.
  • the conductive terminals are embedded in the cover body 25 by injection molding, instead of the printed circuit board in the prior art, through the conductive pins 2531 directly
  • the working pad 231 of the speaker unit 23 is connected to realize the electrical connection between the speaker unit 23 and an external circuit. Because the conductive pin 2531 has hardness and is convenient for direct contact, the reliability of the product electrical connection is improved .
  • the use of flexible printed circuit boards is reduced, the space of the rear cavity of the speaker module 20 is saved, and the integration of products is improved. On the other hand, reduce the number of components, facilitate assembly and improve work efficiency.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Abstract

本发明公开一种扬声器模组。所述扬声器模组包括壳体、具工作焊盘的扬声器单体及盖体，所述盖体配合所述壳体围成收容空间收容所述扬声器单体，所述盖体包括导电部，所述导电部成型于所述盖体，所述导电部一侧形成导电引脚，另一侧形成导电端子，所述导电引脚与所述扬声器单体的工作焊盘电连接，所述导电端子与外部电路对应电连接。本发明通过导电引脚取代柔性印刷电路板，简化结构，提高产品可靠度和节约后腔空间。

Description

扬声器模组 技术领域
本发明涉及电声技术领域，特别地，涉及一种扬声器模组。
 背景技术
扬声器模组是便携式电子设备的重要声学部件，可以将电能转换为声能辐射出去。随着电子技术的飞速发展，扬声器模组在多种便携式电子设备中均得到了广泛的应用。
目前相关技术中，扬声器模组常采用柔性印刷电路板(Flexible Printed Circuit Board，FPCB)作为内部连接件将扬声器单体与外部电路电连接。如图1所示，所述扬声器模组10包括壳体11、扬声器单体13、柔性印刷电路板15及盖体17。
所述壳体11配合所述盖体17围成收容空间收容所述扬声器单体13，所述柔性印刷电路板15一端电连接所述扬声器单体13，另一端连接外部电路。
为了提高FPCB强度，保证FPCB内部线路的可靠性，需要在FPCB上设置补强板，尤其在FPCB的焊盘部，补强板的作用尤为明显。
相关技术中的扬声器模组，FPCB焊盘部补强板为非导电材料，若FPCB的焊盘部为双面焊盘设计，则非导电材料的补强部使焊盘部的一面焊盘无法与其他部件电连接，限制了模组结构设计的灵活性。
另一方面，因为所述FPCB的可挠性，需要提供一定的空间来收容所述FPCB，导致所述扬声器模组10的后腔占用空间较大。
再者，因为FPCB的元件多，所以组装麻烦，不利于提高生产效率。
因此，有必要提供一种改进，以克服相关技术的扬声器模组缺陷。
 技术问题
为了解决上述扬声器模组的技术问题，本发明提供一种结构简单、整合度高、产品电连接可靠性高及结构紧凑的扬声器模组。
 技术解决方案
本发明提供了一种扬声器模组，包括壳体；
扬声器单体，包括盆架以及固定于所述盆架并将所述扬声器单体与外界电路电连接的工作焊盘；
盖体，配合所述盆架围成收容空间收容所述扬声器单体，所述盖体包括导电部，所述导电部成型于所述盖体，所述导电部在所述盖体的其中一侧形成导电引脚，在所述盖体的另一侧形成导电端子，所述导电引脚与所述扬声器单体的工作焊盘电连接，所述导电端子与外部电路对应电连接。
在本发明所提供扬声器模组的一种较佳实施例中，所述导电部通过注塑成型工艺成型于所述盖体，所述导电部贯穿所述盖体并在所述盖体的相对两侧分别形成所述导电引脚和所述导电端子。
在本发明所提供扬声器模组的一种较佳实施例中，所述导电部的数量为两个，分别对称设于所述盖体的边缘区域。
在本发明所提供扬声器模组的一种较佳实施例中，所述导电引脚包括本体、连接体、抵接体及延伸体，所述本体嵌设于所述盖体，所述连接体的两端分别连接所述抵接体的一端和所述本体的一端，所述延伸体自所述抵接体朝向所述盖体侧延伸设置，其端部嵌设于所述盖体，所述抵接体裸露出所述盖体表面。
在本发明所提供扬声器模组的一种较佳实施例中，所述导电端子形成于所述本体表面，且裸露出所述盖体表面。
在本发明所提供扬声器模组的一种较佳实施例中，所述导电端子是形成于所述本体表面的金属导电层，所述导电端子与所述导电引脚的本体对应电连接。
在本发明所提供扬声器模组的一种较佳实施例中，所述金属导电层是金、银、锡、铜及其合金中的任一种。
在本发明所提供扬声器模组的一种较佳实施例中，所述抵接体抵接所述扬声器单体的工作焊盘，并弹性夹设于所述扬声器单体与所述盖体之间。
在本发明所提供扬声器模组的一种较佳实施例中，所述导电部与所述盖体为一体结构。
 有益效果
相较于现有技术，本发明提供的扬声器模组具有以下有益效果：
通过将导电部整合于所述盖体，使得导电部与盖体呈一体结构，取消使用单独的印刷电路板，减少元件数量，简化结构，解决了采用印刷电路板电连接的不可靠性和元件众多组装麻烦的问题。
 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图，其中：
图1是相关技术所揭示一种扬声器模组立体分解结构示意图；
图2是本发明提供扬声器模组的立体组装示意图；
图3是图2所示扬声器模组的立体分解结构示意图；
图4是图3所示扬声器单体的另一个角度的结构示意图；
图5图2所示的扬声器模组沿V-V线的剖视图。
 本发明的实施方式
下面将对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。
请结合参阅图2和图3，图2是本发明提供的扬声器模组立体组装结构示意图，图3是图2所示扬声器模组的立体分解示意图。所述扬声器模组20用于实现电声转换。所述扬声器模组20包括壳体21、扬声器单体23及盖体25。
所述壳体21配合所述盖体25围成收容空间收容所述扬声器单体23于其内。所述扬声器单体23通过所述盖体25与外部电路对应电连接。
所述壳体21包括具开口的收容空间。
请参阅图4，是图4所示扬声器单体的另一角度局部示意图。所述扬声器单体23是一发声单元，其对应将接收到的电信号转换为声信号输出。所述扬声器单体23包括具收容空间的盆架24及形成于所述盆架与外部电路电连接的工作焊盘231，所述工作焊盘231的数量是多个，其靠近所述扬声器单体23的边缘布局。
请结合参阅图3及图5，其中图5图1所示的扬声器模组沿V-V线的剖视图。所述盖体25整体呈平板状，所述盖体25对应盖设于所述壳体21的开口处，共同围成封闭收容空间以收容所述扬声器单体23。所述盖体25包括本体部251及导电部253，所述本体251呈平板状，其外轮廓与所述开口处内轮廓相一致。所述导电部253嵌埋于所述本体部251，其中所述导电部253的数量是多个，且对称设于所述盖体25的边缘区域。在本实施方式中，所述导电部253是通过注塑成型工艺埋设于所述盖体25内，贯穿所述盖体25的二相对侧表面，并与所述盖体25呈一体结构。
所述导电部253包括分设于所述盖体25的二相对侧表面的导电引脚2531和导电端子2532，其中所述导电引脚2531设于所述盖体25临近所述扬声器单体23的侧表面，并自所述盖体25表面朝向所述扬声器单体23延伸；所述导电端子2532设于所述盖体25远离所述扬声器单体23侧表面，其表面裸露出所述盖体25表面。
所述导电引脚2531是采用金、银、铜、锡及其合金中的任何一种加工而成的导电端。所述导电引脚2531包括依次相接设置的本体2533、连接体2534、抵接体2535及延伸体2536。所述本体2533埋设于所述盖体25内，所述本体2533平行于所述盖体25的表面设置。所述连接体2534的两端分别连接所述本体2533的一端及所述抵接体2535的一端。所述抵接体2535组装后与所述扬声器单体23的工作焊盘231对应抵接实现二者之间的电连接。所述延伸体2536一端与所述抵接体2535连接，另一端朝向所述盖体25延伸。所述抵接体2535凸出所述盖体25的表面，并朝向所述扬声器单体23侧裸露凸起。所述本体2533及所述延伸体2536埋设于所述盖体25内。
所述导电端子2532设于所述盖体25的另一侧表面，其与所述导电引脚2531分设于所述盖体25的二相对侧，其由形成于所述导电引脚2531表面的导电金属层形成。所述导电端子2532可以是镀设于所述导电引脚2531的表面的金层。所述导电端子2532覆盖所述导电引脚2531的本体2533，与所述导电引脚的本体2533对应电连接，并裸露出所述盖体25的表面。所述导电端子2532直接与外部电路对应电连接。
当组装所述扬声器模组20时，其包括如下步骤：
步骤S01，提供壳体21，所述壳体21包括具开口的收容空间；
步骤S02，提供扬声器单体23，并对应收容于所述收容空间；
步骤S03，提供盖体25，并对应盖设于所述壳体21的收容空间开口处，同时，所述导电部253的导电引脚2531抵接所述扬声器单体23的工作焊盘231，具体如图5所示。
至此，完成所述扬声器模组20的组装。
在上述扬声器模组20中，所述导电部253的导电引脚2531与所述导电端子2532直接电连接，因此当所述导电引脚2531与所述扬声器单体23的工作焊盘231对应电连接时，对应的，所述导电端子2532与所述工作焊盘231间接电连接，当所述导电端子2532与外部导电线路对应电连接时，其产生的驱动信号可以通过所述导电部253直接驱动所述扬声器单体23工作。
相较于现有技术，在本发明的扬声器模组20中，通过注塑成型方式将导电端子埋设于所述盖体25内，取代现有技术中的印刷电路板，通过导电引脚2531直接抵接所述扬声器单体23的工作焊盘231，实现所述扬声器单体23与外部电路的电连接，因为所述导电引脚2531具有硬度，方便直接抵接，所以提高产品电连接的可靠性。同时，减少使用柔性印刷电路板，节约了扬声器模组20的后腔空间，提高产品的整合度。另一方面，减少元件数量，方便组装和提高工作效率。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书内容所作的等效结构或等效流程变换，或直接或间接运用在其它相关的技术领域，均同理包括在本发明的专利保护范围之内。

Claims (9)

  1. 一种扬声器模组，包括：
    壳体；
    扬声器单体，包括盆架以及固定于所述盆架并将所述扬声器单体与外界电路电连接的工作焊盘；
    盖体，配合所述盆架围成收容空间收容所述扬声器单体，其特征在于，所述盖体包括导电部，所述导电部成型于所述盖体，所述导电部于所述盖体的一侧形成导电引脚与所述扬声器单体的工作焊盘电连接，于所述盖体的另一侧形成导电端子与外部电路对应电连接。
  2. 如权利要求1所述的扬声器模组，其特征在于，所述导电部通过注塑成型工艺成型于所述盖体，所述导电部贯穿所述盖体并在所述盖体的相对两侧分别形成所述导电引脚和所述导电端子。
  3. 如权利要求2所述的扬声器模组，其特征在于，所述导电部的数量为两个，分别对称设于所述盖体的边缘区域。
  4. 如权利要求2所述的扬声器模组，其特征在于，所述导电引脚包括本体、连接体、抵接体及延伸体，所述本体嵌设于所述盖体，所述连接体的两端分别连接所述抵接体的一端和所述本体的一端，所述延伸体自所述抵接体朝向所述盖体侧延伸设置，其端部嵌设于所述盖体，所述抵接体裸露出所述盖体表面。
  5. 如权利要求4所述的扬声器模组，其特征在于，所述导电端子形成于所述本体表面，且裸露出所述盖体表面。
  6. 如权利要求5所述的扬声器模组，其特征在于，所述导电端子是形成于所述本体表面的金属导电层，所述导电端子与所述导电引脚的本体对应电连接。
  7. 如权利要求6所述的扬声器模组，其特征在于，所述金属导电层是金、银、锡、铜及其合金中的任一种。
  8. 如权利要求4所述的扬声器模组，其特征在于，所述抵接体抵接所述扬声器单体的工作焊盘，并弹性夹设于所述扬声器单体与所述盖体之间。
  9. 如权利要求1所述的扬声器模组，其特征在于，所述导电部与所述盖体为一体结构。
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