WO2020134315A1 - 一种扬声器结构、移动设备及扬声器结构的组装方法 - Google Patents

一种扬声器结构、移动设备及扬声器结构的组装方法 Download PDF

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Publication number
WO2020134315A1
WO2020134315A1 PCT/CN2019/110102 CN2019110102W WO2020134315A1 WO 2020134315 A1 WO2020134315 A1 WO 2020134315A1 CN 2019110102 W CN2019110102 W CN 2019110102W WO 2020134315 A1 WO2020134315 A1 WO 2020134315A1
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WO
WIPO (PCT)
Prior art keywords
cover plate
ring
speaker
wall
hole
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/110102
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English (en)
French (fr)
Inventor
王程良
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AAC Technologies Holdings Shenzhen Co Ltd
AAC Technologies Pte Ltd
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AAC Acoustic Technologies Shenzhen Co Ltd
AAC Technologies Pte Ltd
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Application filed by AAC Acoustic Technologies Shenzhen Co Ltd, AAC Technologies Pte Ltd filed Critical AAC Acoustic Technologies Shenzhen Co Ltd
Publication of WO2020134315A1 publication Critical patent/WO2020134315A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
    • H04R1/2876—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding
    • H04R1/288—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/025—Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/021—Casings; Cabinets ; Supports therefor; Mountings therein incorporating only one transducer
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2803—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/16—Mounting or tensioning of diaphragms or cones
    • H04R7/18—Mounting or tensioning of diaphragms or cones at the periphery
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00—Loudspeakers
    • H04R2400/11—Aspects regarding the frame of loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Definitions

  • the invention belongs to the technical field of generators, and particularly relates to a speaker structure, a mobile device, and a method of assembling a speaker structure.
  • Portable mobile devices have become an indispensable part of people's lives, and the sound playback function is an important part of portable devices. During the rapid development of portable mobile devices, speakers for playing sounds are also constantly developing.
  • the speaker in the prior art includes an upper cover, a speaker unit, and a lower cover.
  • a surrounding wall is integrally provided in the lower cover.
  • an accommodating cavity is formed between the surrounding wall and the upper cover.
  • the speaker The monomer is assembled in the accommodating cavity, and the upper cover, the lower cover and the speaker monomer are enclosed together to form a rear cavity.
  • the existing speaker structure when faced with a variety of portable mobile devices, the existing speaker structure will be limited by the molding requirements of the mold, the cost is higher, and it is not suitable for large-scale use.
  • the technical problem to be solved by the present invention is to provide a speaker structure, a mobile device, and a method of assembling a speaker structure, which can adapt to a complicated structure and facilitate large-scale applications.
  • a speaker structure includes: a first cover plate, a second cover plate, an encapsulation ring and a speaker unit, the speaker unit is assembled on the first On the cover plate, the second cover plate is closed on the first cover plate, the second cover plate is provided with an assembly port, the packaging ring is snap-fitted into the assembly port, and the packaging ring Enclosed outside the speaker unit, the encapsulating ring, the first cover plate and the second cover plate together form a rear cavity, the rear cavity is filled with Dbass material, and the rear cavity surrounds
  • a through hole is opened in the peripheral wall of the encapsulation ring, the through hole connects the rear cavity and the speaker unit, the encapsulation ring includes a mesh plate, and the mesh plate is provided at the The peripheral wall of the packaging ring covers the through hole.
  • a filler hole is opened on the first cover plate, and a sealing cover is assembled on the filler hole.
  • a groove is provided at an edge of the assembly port of the second cover plate, and a flange is provided at a top side edge of the packaging ring, when the packaging ring is assembled in the assembly port, The flange is embedded in the groove.
  • the speaker unit has a basin frame and a diaphragm, the diaphragm is assembled on the basin frame, the first cover plate is provided with a sound hole, and the first cover plate is provided with a surround
  • the engaging wall of the sound hole is assembled, the basin frame is assembled in the engaging wall, the basin frame, the vibrating membrane, the engaging wall and the first cover plate are enclosed before forming Cavity, the sound hole communicates with the front cavity.
  • the packaging ring is sleeved outside the clamping wall, the peripheral wall of the packaging ring has a notch on one side, the notch matches the clamping wall structure at the sound hole, and the packaging ring On the other three sides of the peripheral wall, a plurality of through holes are opened and mesh plates are attached to each other, and the mesh plates are attached to the inner wall of the packaging ring.
  • the packaging ring is sleeved outside the clamping wall, the peripheral wall of the packaging ring has a notch on one side, the notch matches the clamping wall structure at the sound hole, and the packaging ring On the other three sides of the peripheral wall, a plurality of through holes are opened and mesh plates are all attached, and the mesh plates are attached to the outer wall of the packaging ring.
  • a mobile device including the speaker structure as described above.
  • a method for assembling a speaker structure for assembling any one of the speaker structures described above, including: assembling the speaker unit on the first cover plate; and closing the second cover plate on the first cover plate A cover plate is fixed; the packaging ring is sheathed outside the speaker unit from the assembly port, and the packaging ring, the second cover plate and the first cover plate form a rear cavity; The cavity is filled with Dbass material.
  • the speaker structure, the mobile device and the speaker structure assembly method in the present invention have the following beneficial effects:
  • the speaker unit is assembled on the first cover, the second cover is assembled on the first cover, and then the encapsulation ring is assembled in the assembly port of the second cover, at this time the encapsulation ring is sleeved outside the speaker unit, and
  • the first cover plate, the second cover plate and the encapsulation ring surround to form a rear cavity wrapped around the speaker unit. Filling the rear cavity with Dbass material can achieve a good acoustic effect, and the through hole opened on the peripheral side of the encapsulation ring can The rear cavity is connected with the speaker monomer, and the mesh plate can block the Dbass material from entering into the speaker monomer from the rear cavity, avoiding the impact on the speaker monomer.
  • the speaker structure of this solution is not limited by the mold molding requirements, which is convenient Large-scale application, lower cost.
  • FIG. 1 is a schematic view of the overall structure of the speaker structure in the first perspective of the embodiment of the present invention
  • FIG. 2 is an exploded schematic view of the speaker structure in the embodiment of the present invention.
  • FIG. 3 is a sectional view taken along line A-A of FIG. 1;
  • FIG. 4 is an isometric view of the structure of the speaker in FIG. 3;
  • FIG. 5 is a schematic view of the overall structure of the speaker structure from a second perspective in the embodiment of the present invention.
  • each reference sign indicates: 1. The first cover plate; 11. The sound hole; 12. The embedded wall; 13. The filler hole; 2. The second cover plate; 21. The assembly port; 22. The concave Slot; 3. Encapsulation ring; 31. Through hole; 32. Flange; 33. Screen plate; 4. Speaker unit; 41. Basin stand; 42. Vibrating membrane; 5. Sealing cover.
  • the mobile device (not shown) includes a speaker structure, wherein the speaker structure includes: a first cover plate 1, a second cover plate 2, an encapsulation ring 3, and a speaker unit Body 4, the speaker unit 4 is assembled on the first cover plate 1, the second cover plate 2 is closed on the first cover plate 1, and the second cover plate 2 is provided with an assembly Mouth 21, the encapsulation ring 3 is snap-fitted into the assembly mouth 21, the encapsulation ring 3 is sleeved outside the speaker unit 4, the encapsulation ring 3, the first cover plate 1 and all
  • the second cover plate 2 encloses a back cavity together, the back cavity is filled with Dbass material (sound absorbing material), the back cavity surrounds the speaker unit 4, and the peripheral wall of the encapsulation ring 3 is provided with a through hole 31.
  • the through hole 31 communicates the rear cavity and the speaker unit 4, the packaging ring 3 includes a mesh plate 33, the mesh plate 33 is disposed on the peripheral wall of the packaging
  • the speaker unit 4 is assembled on the first cover plate 1, the second cover plate 2 is assembled on the first cover plate 1, and then the packaging ring 3 is assembled in the assembly opening 21 of the second cover plate 2, at this time the packaging ring 3 It is sheathed outside the speaker unit 4, and the first cover plate 1, the second cover plate 2 and the encapsulating ring 3 are enclosed to form a back cavity wrapped around the speaker unit 4, and filling the back cavity with Dbass material can achieve good
  • the through hole 31 provided on the peripheral side of the encapsulation ring 3 can communicate the rear cavity with the speaker monomer 4 and the mesh plate 33 can block the Dbass material from entering the speaker cavity 4 from the rear cavity, avoiding Due to the influence of the speaker unit 4, the speaker structure of this solution is not limited by the molding requirements, which is convenient for large-scale application and low in cost.
  • the first cover plate 1 has an outer wall, and a slot is opened at an end surface of the outer wall, and the second cover plate 2 is fitted into the slot on the outer wall, and the first The second cover plate 2 and the outer wall of the first cover plate 1 are fixed by ultrasonic welding.
  • the second cover plate 2 and the outer wall of the first cover plate 1 can also be screwed, Connect by bonding or snapping.
  • a groove 22 is provided at the edge of the assembly port 21 of the second cover plate 2, and the groove 22 is located at the outer surface of the second cover plate 2, and a top side edge of the packaging ring 3 is provided with an outwardly extending The flange 32, when the packaging ring 3 is assembled in the assembly port 21, the flange 32 is embedded in the groove 22 of the second cover plate 2 and fixed by bonding, at this time the top surface of the packaging ring 3, the speaker unit 4 And the top surface of the second cover plate 2 are flush.
  • the first cover plate 1 is provided with a filler hole 13 (see FIG. 5).
  • the filler hole 13 is used to fill the back cavity with Dbass material.
  • the filler hole 13 is equipped with a sealing cover 5 (see FIG. 5).
  • the sealing cover 5 and the filler Hole 13 matches.
  • the Dbass material is a granular sound-absorbing material.
  • the Dbass material is filled into the rear cavity from the filler hole 13 and sealed with a sealing cover 5. Filling the rear cavity with the Dbass material can improve the low-frequency sound performance of the speaker structure.
  • the speaker unit 4 has a basin frame 41 and a diaphragm 42.
  • the diaphragm 42 is assembled on the bottom side of the basin frame 41.
  • the first cover plate 1 is provided with a sound output hole 11, and the first cover plate 1 is provided with enclosed sound output
  • the engaging wall 12 of the hole 11 is provided with a limiting structure in the engaging wall 12, and the basin frame 41 is assembled in the engaging wall 12 and abuts against the limiting structure. At this time, the basin frame 41, the diaphragm 42 and the engaging wall 12 and the first cover plate 1 form a front cavity, and the sound hole 11 communicates with the front cavity.
  • the encapsulating ring 3 is sleeved outside the snap-in wall 12, and one side of the peripheral wall of the encapsulating ring 3 has a notch which matches the structure of the snap-in wall 12 at the sound hole 11. Therefore, the encapsulating ring 3
  • the end surface of the peripheral wall of 3 can be closely attached to the first outer cover, and the bonding position between the encapsulating ring 3 and the lower cover plate is fixed by glue; the other three sides of the peripheral wall of the encapsulating ring 3 are provided with multiple
  • the through holes 31 are all attached to the mesh plate 33, and the mesh plate 33 is attached to the inner wall of the encapsulation ring 3 and covers the through hole 31, and the mesh plate 33 and the peripheral wall of the encapsulation ring 3 are bonded by injection molding, glue or It is connected as an integrated structure by means of hot-melt, etc., through a plurality of mesh plates 33 structure, the ventilation area of Dbass can be increased, thereby effectively increasing the filling effect of Dbas
  • the assembly method of the speaker structure includes:
  • the speaker unit 4 Assemble the speaker unit 4 on the first cover plate 1; specifically, in this embodiment, the speaker unit 4 is assembled in the snap-in wall 12, the outer side of the basin frame 41 and the inner side of the snap-in wall 12 The side surfaces abut, and the bottom surface of the pot holder 41 abuts on the limiting structure in the clamping wall 12 so that a front cavity space is formed between the diaphragm 42 and the first cover plate 1;

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Telephone Set Structure (AREA)

Abstract

本发明提供了一种扬声器结构、移动设备及扬声器结构的组装方法，移动设备内包括扬声器结构，其中，扬声器结构包括：第一盖板、第二盖板、封装环和扬声器单体，扬声器单体装配在第一盖板上，第二盖板盖合在第一盖板上，第二盖板上开设有装配口，封装环卡嵌装配在装配口内，封装环套设在扬声器单体外，封装环、第一盖板和第二盖板共同围合成后腔，后腔内填充Dbass材料，后腔包绕扬声器单体，封装环的周壁上开设有通孔，通孔将后腔和扬声器单体连通，封装环包括网板，网板设置在封装环的周壁上并将通孔覆盖。本方案的扬声器结构不受模具成型要求的限制，便于大规模应用，成本较低。

Description

一种扬声器结构、移动设备及扬声器结构的组装方法 技术领域
本发明属于发生器技术领域，尤其涉及一种扬声器结构、移动设备及扬声器结构的组装方法。
 背景技术
便携式移动设备已经成为了人们生活中必不可少的一部分，而声音播放功能是便携式设备中很重要的一部分，在便携式移动设备快速发展的过程中，用于播放声音的扬声器也在不断地发展。
现有技术中的扬声器包括上盖、扬声器单体和下盖，通常下盖中会一体设置有围合壁，上盖和下盖装配时围合壁和上盖之间形成容置腔，扬声器单体装配在容置腔内，上盖、下盖和扬声器单体共同围合形成后腔。
但面对结构多种多样的便携式移动设备时，现有的扬声器结构应用时会受到模具成型要求的限制，成本较高，不适于大规模使用。
 技术问题
本发明所要解决的技术问题在于提供一种扬声器结构、移动设备及扬声器结构的组装方法，能够适应复杂的结构，便于大规模应用。
 技术解决方案
为解决上述技术问题，本发明是这样实现的，一种扬声器结构，包括：包括：第一盖板、第二盖板、封装环和扬声器单体，所述扬声器单体装配在所述第一盖板上，所述第二盖板盖合在所述第一盖板上，所述第二盖板上开设有装配口，所述封装环卡嵌装配在所述装配口内，所述封装环套设在所述扬声器单体外，所述封装环、所述第一盖板和所述第二盖板共同围合成后腔，所述后腔内填充Dbass材料，所述后腔包绕所述扬声器单体，所述封装环的周壁上开设有通孔，所述通孔将所述后腔和所述扬声器单体连通，所述封装环包括网板，所述网板设置在所述封装环的周壁上并将所述通孔覆盖。
进一步地，所述第一盖板上开设有填料孔，所述填料孔上装配有密封盖。
进一步地，所述第二盖板的位于所述装配口的边缘处设置有凹槽，所述封装环的顶侧边缘处设置有凸缘，当所述封装环装配在所述装配口内时，所述凸缘卡嵌在所述凹槽内。
进一步地，所述扬声器单体具有盆架和振膜，所述振膜装配在所述盆架上，所述第一盖板上开设有出声孔，所述第一盖板内设置有围合所述出声孔的卡嵌壁，所述盆架装配在所述卡嵌壁内，所述盆架、所述振膜、所述卡嵌壁和所述第一盖板围合形成前腔，所述出声孔连通所述前腔。
进一步地，所述封装环套设在所述卡嵌壁外，所述封装环的周壁的一侧具有缺口，所述缺口与所述出声孔处的卡嵌壁结构匹配，所述封装环的周壁的另外三侧上均开设有多个通孔且均贴合有网板，所述网板贴合在所述封装环的内壁上。
进一步地，所述封装环套设在所述卡嵌壁外，所述封装环的周壁的一侧具有缺口，所述缺口与所述出声孔处的卡嵌壁结构匹配，所述封装环的周壁的另外三侧上均开设有多个通孔且均贴合有网板，所述网板贴合在所述封装环的外壁上。
进一步地，提供一种移动设备，包括如上任意一种所述的扬声器结构。
进一步地，提供一种扬声器结构的组装方法，用于组装如上任意一种所述的扬声器结构，包括：将扬声器单体装配在第一盖板上；将第二盖板盖合在所述第一盖板上并固定；将封装环从装配口套设在所述扬声器单体外，所述封装环、所述第二盖板和所述第一盖板围合成后腔；向所述后腔内填充Dbass材料。
 有益效果
本发明中扬声器结构、移动设备及扬声器结构的组装方法与现有技术相比，有益效果在于：
扬声器单体装配在第一盖板上，第二盖板装配在第一盖板上，之后将封装环装配在第二盖板的装配口内，此时封装环套设在扬声器单体外，并且第一盖板、第二盖板和封装环围合形成包绕在扬声器单体外的后腔，在后腔内填充Dbass材料能够达到良好的声学效果，封装环的周侧开设的通孔能够将后腔和扬声器单体连通，且设置的网板可以阻挡Dbass材料从后腔进入到扬声器单体内，避免了对扬声器单体的影响，本方案的扬声器结构不受模具成型要求的限制，便于大规模应用，成本较低。
 附图说明
图1是本发明实施例中扬声器结构第一视角的整体结构示意图；
图2是本发明实施例中扬声器结构的分解结构示意图；
图3是图1中扬声器结构的A-A剖视图；
图4是图3中扬声器结构的轴测图；
图5是本发明实施例中扬声器结构第二视角的整体结构示意图。
在附图中，各附图标记表示：1、第一盖板；11、出声孔；12、卡嵌壁；13、填料孔；2、第二盖板；21、装配口；22、凹槽；3、封装环；31、通孔；32、凸缘；33、网板；4、扬声器单体；41、盆架；42、振膜；5、密封盖。
 本发明的实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
实施例：
在本实施例中，如图1-5所示，移动设备（未示出）内包括扬声器结构，其中，扬声器结构包括：第一盖板1、第二盖板2、封装环3和扬声器单体4，所述扬声器单体4装配在所述第一盖板1上，所述第二盖板2盖合在所述第一盖板1上，所述第二盖板2上开设有装配口21，所述封装环3卡嵌装配在所述装配口21内，所述封装环3套设在所述扬声器单体4外，所述封装环3、所述第一盖板1和所述第二盖板2共同围合成后腔，所述后腔内填充Dbass材料（吸音材料），所述后腔包绕所述扬声器单体4，所述封装环3的周壁上开设有通孔31，所述通孔31将所述后腔和所述扬声器单体4连通，所述封装环3包括网板33，所述网板33设置在所述封装环3的周壁上并将所述通孔31覆盖。
扬声器单体4装配在第一盖板1上，第二盖板2装配在第一盖板1上，之后将封装环3装配在第二盖板2的装配口21内，此时封装环3套设在扬声器单体4外，并且第一盖板1、第二盖板2和封装环3围合形成包绕在扬声器单体4外的后腔，在后腔内填充Dbass材料能够达到良好的声学效果，封装环3的周侧开设的通孔31能够将后腔和扬声器单体4连通，且设置的网板33可以阻挡Dbass材料从后腔进入到扬声器单体4内，避免了对扬声器单体4的影响，本方案的扬声器结构不受模具成型要求的限制，便于大规模应用，成本较低。
具体的，如图2-4所示，在本实施例中，第一盖板1具有外壁，外壁的端面处开设有卡槽，第二盖板2嵌合在外壁的卡槽内，并且第二盖板2和第一盖板1的外壁之间通过超声波焊接固定，当然，在能保证密封性的条件下，第二盖板2和第一盖板1的外壁之间也可以通过螺钉、粘接或卡接等方式连接。
第二盖板2的位于装配口21的边缘处设置有凹槽22，且该凹槽22位于第二盖板2的外侧板面处，封装环3的顶侧边缘处设置有朝外延伸的凸缘32，当封装环3装配在装配口21内时，凸缘32卡嵌在第二盖板2的凹槽22内并粘接固定，此时封装环3的顶面、扬声器单体4的顶面和第二盖板2的顶面均平齐。
第一盖板1上开设有填料孔13（如图5），填料孔13用于向后腔内填充Dbass材料，填料孔13上装配有密封盖5（如图5），密封盖5与填料孔13匹配。在本实施例中，Dbass材料为颗粒状吸音材料，Dbass材料从填料孔13填入到后腔之后用密封盖5进行密封，在后腔内填充Dbass材料可以提升扬声器结构的低频发声性能。
扬声器单体4具有盆架41和振膜42，振膜42装配在盆架41的底侧，第一盖板1上开设有出声孔11，第一盖板1内设置有围合出声孔11的卡嵌壁12，卡嵌壁12内设置有限位结构，盆架41装配在卡嵌壁12内且抵顶在限位结构上，此时盆架41、振膜42、卡嵌壁12和第一盖板1围合形成前腔，出声孔11连通前腔。
在本实施例中，封装环3套设在卡嵌壁12外，封装环3的周壁的其中一侧具有缺口，该缺口与出声孔11处的卡嵌壁12结构匹配，因此，封装环3的周壁的端面能够紧密地与第一外盖贴合，封装环3与下盖板之间的贴合处采用胶水粘接方式固定；封装环3的周壁的另外三侧上均开设有多个通孔31且均贴合有网板33，网板33贴合在封装环3的内壁上并将通孔31覆盖，网板33和封装环3的周壁之间采用注塑、胶水粘接或者热熔等方式连接为一体化结构，通过多个网板33结构可以增大Dbass的透气面积，从而有效增加Dbass的填充效果，以提高扬声器结构的声学性能；在其他实施例中，网板33可以采用注塑、胶水粘接或者热熔等方式贴合在封装环3的周壁的外侧。
扬声器结构的组装方法包括：
S1、将扬声器单体4装配在第一盖板1上；具体的，在本实施例中，扬声器单体4装配在卡嵌壁12内，盆架41的外侧面与卡嵌壁12的内侧面抵接，盆架41的底面抵顶在卡嵌壁12内的限位结构上，从而使振膜42和第一盖板1之间形成前腔空间；
S2、将第二盖板2盖合在第一盖板1上并固定；第二盖板2盖合在第一盖板1的外壁的卡槽内，之后通过超声波焊接方式将第二盖板2与第一盖板1的外壁固定，在其他实施例中，第二盖板2和第一盖板1之间也可以采用螺钉、粘接或卡接等方式固定；
S3、将封装环3从装配口21套设在扬声器单体4外，封装环3、第二盖板2和第一盖板1围合成后腔；在封装环3的周壁的端面上以及凸缘32的底侧涂胶，然后将封装环3的周壁从装配口21压入，使得封装环3的周壁的端面与第一盖板1接触，凸缘32卡嵌在凹槽22内，然后保持压紧状态，胶干后封装环3即与第一盖板1以及第二盖板2连接紧密；
S4、向后腔内填充Dbass材料；将颗粒状的Dbass材料从第一盖板1上的填料口向后腔内填入，当后腔内填充满Dbass材料之后把密封盖5将填料口密封。
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。

Claims (8)

  1. 一种扬声器结构，其特征在于，包括：第一盖板(1)、第二盖板(2)、封装环(3)和扬声器单体(4)，所述扬声器单体(4)装配在所述第一盖板(1)上，所述第二盖板(2)盖合在所述第一盖板(1)上，所述第二盖板(2)上开设有装配口(21)，所述封装环(3)卡嵌装配在所述装配口(21)内，所述封装环(3)套设在所述扬声器单体(4)外，所述封装环(3)、所述第一盖板(1)和所述第二盖板(2)共同围合成后腔，所述后腔内填充Dbass材料，所述后腔包绕所述扬声器单体(4)，所述封装环(3)的周壁上开设有通孔(31)，所述通孔(31)将所述后腔和所述扬声器单体(4)连通，所述封装环(3)包括网板(33)，所述网板(33)设置在所述封装环(3)的周壁上并将所述通孔(31)覆盖。
  2. 根据权利要求1所述的扬声器结构，其特征在于，所述第二盖板(2)的位于所述装配口(21)的边缘处设置有凹槽(22)，所述封装环(3)的顶侧边缘处设置有凸缘(32)，当所述封装环(3)装配在所述装配口(21)内时，所述凸缘(32)卡嵌在所述凹槽(22)内。
  3. 根据权利要求1所述的扬声器结构，其特征在于，所述第一盖板(1)上开设有填料孔(13)，所述填料孔(13)上装配有密封盖(5)。
  4. 根据权利要求1-3中任意一项所述的扬声器结构，其特征在于，所述扬声器单体(4)具有盆架(41)和振膜(42)，所述振膜(42)装配在所述盆架(41)上，所述第一盖板(1)上开设有出声孔(11)，所述第一盖板(1)内设置有围合所述出声孔(11)的卡嵌壁(12)，所述盆架(41)装配在所述卡嵌壁(12)内，所述盆架(41)、所述振膜(42)、所述卡嵌壁(12)和所述第一盖板(1)围合形成前腔，所述出声孔(11)连通所述前腔。
  5. 根据权利要求4所述的扬声器结构，其特征在于，所述封装环(3)套设在所述卡嵌壁(12)外，所述封装环(3)的周壁的一侧具有缺口，所述缺口与所述出声孔(11)处的卡嵌壁(12)结构匹配，所述封装环(3)的周壁的另外三侧上均开设有多个通孔(31)且均贴合有网板(33)，所述网板(33)贴合在所述封装环(3)的内壁上。
  6. 根据权利要求4所述的扬声器结构，其特征在于，所述封装环(3)套设在所述卡嵌壁(12)外，所述封装环(3)的周壁的一侧具有缺口，所述缺口与所述出声孔(11)处的卡嵌壁(12)结构匹配，所述封装环(3)的周壁的另外三侧上均开设有多个通孔(31)且均贴合有网板(33)，所述网板(33)贴合在所述封装环(3)的外壁上。
  7. 一种移动设备，其特征在于，包括如权利要求1-6中任意一项所述的扬声器结构。
  8. 一种扬声器结构的组装方法，用于组装如权利要求1-6中任意一项所述的扬声器结构，其特征在于，包括：
    将扬声器单体(4)装配在第一盖板(1)上；
    将第二盖板(2)盖合在所述第一盖板(1)上并固定；
    将封装环(3)从装配口(21)套设在所述扬声器单体(4)外，所述封装环(3)、所述第二盖板(2)和所述第一盖板(1)围合成后腔；
    向所述后腔内填充Dbass材料。
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