WO2020133444A1 - 显示装置 - Google Patents

显示装置 Download PDF

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Publication number
WO2020133444A1
WO2020133444A1 PCT/CN2018/125718 CN2018125718W WO2020133444A1 WO 2020133444 A1 WO2020133444 A1 WO 2020133444A1 CN 2018125718 W CN2018125718 W CN 2018125718W WO 2020133444 A1 WO2020133444 A1 WO 2020133444A1
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WO
WIPO (PCT)
Prior art keywords
module
area
display device
areas
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/125718
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English (en)
French (fr)
Inventor
郭星灵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Royole Technologies Co Ltd
Original Assignee
Shenzhen Royole Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Royole Technologies Co Ltd filed Critical Shenzhen Royole Technologies Co Ltd
Priority to CN201880095894.3A priority Critical patent/CN112639929A/zh
Priority to PCT/CN2018/125718 priority patent/WO2020133444A1/zh
Priority to TW108142702A priority patent/TW202014063A/zh
Publication of WO2020133444A1 publication Critical patent/WO2020133444A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details

Definitions

  • Embodiments of the present application relate to the field of display technology, and in particular, to a display device.
  • the display device can gradually be folded or even completely flexible.
  • the foldable and flexible display screen has the characteristics of bendability and good flexibility, which improves the portability of the display device. At the same time, the probability of damage to the display device can be reduced.
  • the embodiments of the present application aim to provide a display device, so as to solve the technical problem in the prior art that the display device can be bent in a small range.
  • a flexible display device including:
  • a display panel the display panel includes adjacent first connecting edges and second connecting edges, the first connecting edges are disposed along a first straight line, the second connecting edges are disposed along a second straight line, and the first straight line Perpendicular to the second straight line;
  • a flip-chip film the flip-chip film is disposed on one side of the second connecting edge, the flip-chip film includes a plurality of module areas and a plurality of bending axes, and the plurality of bending axes are parallel to the first A straight line, at least one bending axis is provided between each two adjacent module areas, and the flip chip can be bent along each bending axis; and
  • a driving chip the driving chip is disposed on the flip chip, the driving chip includes a plurality of functional modules, and each of the functional modules may be disposed in any of the module areas.
  • the flip chip includes a signal input binding area and a signal output binding area, and a plurality of the module areas are disposed between the input binding area and the signal output binding area.
  • the flip chip includes multiple signal input binding areas and multiple signal output binding areas, and the multiple signal input binding areas are disposed on one side of the flip chip at a predetermined distance; A plurality of the signal output binding areas are arranged on the opposite side of the flip-chip film at a predetermined distance;
  • a plurality of the signal input binding areas and a plurality of the signal output binding areas are in one-to-one correspondence, and each of the signal input binding areas is disposed opposite to the corresponding one of the signal output binding areas;
  • the module area is formed between every two oppositely disposed signal input binding areas and the signal output binding areas.
  • one of the bending axes is an axis of symmetry for every two adjacent module areas.
  • the driver chip includes a power module, a processor interface module, a logic module, and a plurality of data processing modules
  • the processor interface module is connected to the logic module
  • the power module is respectively connected to the processor
  • the module is connected to the logic module
  • the logic module is connected to a plurality of the data processing modules.
  • the power supply module, the processor interface module, the logic module, and a plurality of the data processing modules may be respectively provided in any of the module areas.
  • processor interface module and the logic module are located in the same module area;
  • the power module is located in an adjacent one of the module areas;
  • a plurality of the data processing modules correspond to a plurality of the module areas, and each of the data processing modules is disposed in a corresponding one of the module areas.
  • the power supply module, the processor interface module, the logic module and a plurality of the data processing modules are all arranged in the same module area.
  • the power supply module, the processor interface module, and the logic module are respectively located in the module area adjacent to each other, and each of the data processing modules is disposed in any one of the module areas.
  • the power supply module and the processor interface module respectively correspond to one of the signal input binding areas, and are respectively set close to the corresponding one of the signal input binding areas;
  • Each of the data processing modules respectively corresponds to one of the signal output binding areas, and is respectively set close to the corresponding one of the signal output binding areas.
  • the flexible display device further includes a connector, and the connector is disposed between any two adjacent bending shafts.
  • a flexible display device including:
  • a display panel the display panel includes adjacent first connecting edges and second connecting edges, the first connecting edges are disposed along a first straight line, the second connecting edges are disposed along a second straight line, and the first straight line Perpendicular to the second straight line;
  • a flip chip the flip chip is provided on one side of the second connecting edge, and a plurality of bending axes are provided on the flip chip in parallel to the first straight line;
  • a driving chip the driving chip is disposed between any two adjacent bending axes on the flip chip, and the flip chip can be bent along the bending axis.
  • the flip chip includes a signal input binding area and a signal output binding area
  • the driving chip is disposed between the input binding area and the signal output binding area
  • the driving chip includes a first side, a second side, a third side, and a fourth side, the first side and the second side are oppositely arranged along the second straight line, and the third side It is opposite to the fourth side along the first straight line, and the lengths of the first side and the second side are respectively shorter than the lengths of the third side and the fourth side.
  • a plurality of bending axes are provided on the outer side of the third side along the first straight line, and the flip chip may be bent along each bending axis.
  • a plurality of bending axes are provided on the outer side of the fourth side along the first straight line, and the flip chip may be bent along each bending axis.
  • a first output area is provided inside the first side, and a second signal output area is provided inside the second side;
  • the first output area is connected to the input binding area through a lead;
  • the second output area is connected to the output binding area through a lead.
  • the shapes of the first output area and the second output area are both “concave”.
  • the first output area includes a first sub-output area, a second sub-output area, and a third sub-output area
  • the second sub-output area is disposed in the first sub-output area and the third Between sub-output areas.
  • the first sub-output area abuts the first side and the third side, respectively, and the input binding area is connected to the first sub-output area and the first by a lead The edge where the side and the third side abut;
  • the second sub-output area is in contact with the first side, and the input binding area is connected to an edge where the second sub-output area is in contact with the first side by a lead;
  • the third sub-output area is in contact with the first side and the fourth side, and the input binding area is respectively connected to the third sub-output area and the first side The edge where the fourth side abuts.
  • the display device provided by the embodiment of the present application is provided with a plurality of bending axes on the flip-chip film, and the display device can be bent along each bending axis, thereby expanding the The bendable range of the display device can better meet the needs of use.
  • FIG. 1 is a schematic structural diagram of a display device provided by one embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of a driving chip and a flip chip of the display device shown in FIG. 1;
  • FIG. 3 is a schematic structural diagram of a display device provided by another embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of a driving chip of the display device shown in FIG. 3;
  • FIG. 5 is a schematic diagram of the structure of the driving chip and the flip chip of the display device shown in FIG. 3.
  • a display device 100 provided in one embodiment of the present application includes: a display panel 10, a chip on film (COF) 20, a driving chip 30, and a flexible printed circuit (Flexible Printed Circuit) , FPC) 40 and connector 50.
  • the driving chip 30 is disposed on the flip chip 20, and the driving chip 30 is connected to the display panel 10 and is used to provide a driving signal to the display device.
  • the connector 50 is provided on the flexible circuit board 40, and the connector 50 is connected to the display panel 10 for electrically and mechanically connecting the display panel 10 to a system circuit board (that is, a system motherboard).
  • the display panel 10 is rectangular when flattened, and the display panel 10 includes adjacent first connecting edges 12 and second connecting edges 14.
  • the first connecting edge 12 is arranged along a first straight line L1
  • the second connecting edge 14 is arranged along a second straight line L2
  • the first straight line L1 and the second straight line L2 are perpendicular to each other
  • the driving chip 30 is respectively connected to the first connecting edge 12 and the second connecting edge 14 through a lead wire, and is used for connecting with the display device, thereby driving or controlling the display of the display device.
  • the display panel 10 further includes a top film, a display device having a structure of thin film transistors and pixels, a substrate, and a bottom film, and the substrate, the display device, and the top film are sequentially disposed on the bottom film.
  • the top film may be a circular polarizer, a touch film, a water-oxygen barrier film, an anti-scratch film, or other optical films.
  • the substrate may be a flexible substrate made of plastic, for example, a polyimide (PI) flexible substrate.
  • PI polyimide
  • the base film may be a film material such as water and oxygen barrier film, PET, PEN, and PI, or may be a heat dissipation function film material such as graphite sheet, copper foil, or the like.
  • the display panel 10 uses a flexible substrate instead of COF and FPC, that is, the display panel 10 uses only one integrated flexible substrate. Not only the display device is provided on the flexible substrate, but also the driving chip 30 and the connector 50 are also provided on the flexible substrate, thereby eliminating the COF currently used to realize the electrical connection between the display device, the driving chip 30 and the connector 50 With FPC, the process complexity of the flexible display device is reduced.
  • the shape of the connector 50 is rectangular.
  • the connector 50 is disposed on the outer side of the second connecting edge 14.
  • the connector 50 includes adjacent first side ends 52 and second side ends 54.
  • the first side end 52 is parallel to the first straight line L1
  • the second side end 54 is parallel to the second straight line L2
  • the length of the first side end 52 is greater than the length of the second side end 54.
  • the flexible circuit board 40 may be provided with a plurality of bending axes arranged parallel to the first straight line L1, and the display device 100 may be bent along each of the bending axes, thereby
  • the flexible range of the flexible display device 100 is expanded to better meet the needs of use.
  • the connector 50 can be fixed on the flexible circuit board 40 by means of conductive adhesive, wire bonding or soldering.
  • the conductive adhesive is preferably anisotropic conductive adhesive (Anisotropic Conductive Film, ACF).
  • the flexible circuit board 40 is provided with conductive leads, such as metal leads, and pins connected to the conductive leads are provided on the bottom surface of the connector 50.
  • the connector 50 is electrically connected to the driving chip through the conductive leads, respectively 30 and the display device on the display panel 10.
  • the connector 50 may be made of ceramic material.
  • the pin is made of copper, and the surface of the pin is plated with a conductive, corrosion-resistant metal material, such as gold or nickel alloy, and the pin has a protrusion with a certain thickness.
  • the flexible circuit board 40 is formed with connection pins that have undergone electroplating treatment at locations where the connector 50 or external components need to be connected, so that it can be easily combined with solder to be used for soldering the connector 50.
  • the upper surface of the connector 50 is kept flat, which can conduct heat better, and can be conducted between the flexible circuit board 40 and the connector 50 during hot pressing On the ACF, which makes the ACF easy to flow and solidify.
  • the driving chip 30 can be fixed on the flip chip 20 by means of conductive adhesive, wire bonding or welding.
  • the conductive paste is preferably ACF.
  • the driving chip 30 is fixed on the flip chip 20 by wire bonding, and conductive leads (such as metal leads) made by sputtering, coating, or printing process and the display on the display panel 10
  • conductive leads such as metal leads
  • the devices are electrically connected and electrically connected to the connector 50 through conductive leads.
  • the flip chip 20 is disposed parallel to the outside of the second connecting edge 14 of the display panel 10.
  • the flip chip 20 includes multiple signal input binding regions 22 and multiple signal output binding regions 24.
  • a plurality of the signal input binding regions 22 are disposed on one side of the flip chip 20 at a predetermined distance; a plurality of the signal output binding regions 24 are disposed opposite to the flip chip 20 at a predetermined distance. On the other side.
  • a plurality of the signal input binding areas 22 correspond to a plurality of the signal output binding areas 24, and each of the signal input binding areas 22 is opposite to a corresponding one of the signal output binding areas 24 Settings.
  • a module area 26 is formed between each two oppositely disposed signal input binding areas 22 and the signal output binding area 24, and a plurality of relatively disposed signal input binding areas 22 and the signal output binding area 24 are formed Multiple module area 26.
  • a plurality of bending axes B1 are provided between each two adjacent module regions 26, and each of the bending axes B1 is disposed along the first straight line L1, and the chip-on-film 20 may be along each of the The bending is performed on the bending axis B1. Every two adjacent module areas 26 take one of the bending axes B1 as an axis of symmetry.
  • the connector is disposed between any two adjacent bending shafts.
  • the driving chip 30 includes a plurality of functional modules, and each of the functional modules can be disposed in any of the module areas 26;
  • the driver chip 30 includes a power module 39a, a processor interface module 39b, a logic module 39c, and a plurality of data processing modules 39d.
  • the processor interface module 39b is connected to the logic module 39c.
  • the power supply module 39a is connected to the processor interface module 39b and the logic module 39c, respectively.
  • the logic module 39c is connected to a plurality of data processing modules 39d.
  • the power supply module 39a, the processor interface module 39b, the logic module 39c, and a plurality of the data processing modules 39d may be respectively disposed in any of the module areas 26.
  • the processor interface module 39b and the logic module 39c are located in the same module area 26.
  • the power module 39a is located in an adjacent module area 26.
  • a plurality of the data processing modules 39d correspond to a plurality of the module areas 26, and each of the data processing modules 39d is disposed in a corresponding one of the module areas 26.
  • the power supply module 39a and the processor interface module 39b respectively correspond to one of the signal input binding areas 22, and are respectively disposed close to the signal input binding area 22.
  • Each of the data processing modules 39d corresponds to one of the signal output binding areas 24, respectively, and is disposed close to the signal output binding areas 24, respectively.
  • the logic module 39c is located between the processor interface module 39b and a corresponding one of the data processing modules 39d.
  • the above-mentioned design of the power module 39a, the processor interface module 39b, the logic module 39c and a number of the data processing modules 39d can facilitate the connection of a plurality of signal input binding areas 22 and a plurality of The signal output binding area 24 is connected to facilitate the layout of the leads.
  • the power module 39a, the processor interface module 39b, the logic module 39c, and a plurality of the data processing modules 39d are all disposed in the same module area 26, and the power module 39a, the The mutual positions between the processor interface module 39b, the logic module 39c, and the plurality of data processing modules 39d can be arbitrarily set as needed, and are not limited herein.
  • the power module 39a, the processor interface module 39b, and the logic module 39c are all disposed in the same module area 26, and a plurality of the data processing modules 39d are disposed in any of the module areas 26.
  • the power supply module 39a, the processor interface module 39b, and the logic module 39c are respectively located in the adjacent module area 26, and each of the data processing modules 39d is disposed in any one of the Module area 26.
  • the power supply module 39a, the processor interface module 39b, the logic module 39c and a plurality of the data processing modules 39d are located at a plurality of positions in the module area 26 and the power supply module 39a,
  • the mutual positional relationship and connection mode between the processor interface module 39b, the logic module 39c and a plurality of the data processing modules 39d can be changed according to actual needs, which are not listed here one by one, but the many These variations are within the scope of protection of this application.
  • the display device 100 of the present application by changing the integrated design of the existing driving chip to a modular separate design, inputs the signal input of the current flip chip into the binding area and the signal output
  • the binding area is also designed as a distributed area design, so that a plurality of bending axes B1 can be provided on the flip chip 20, and the display device 100 can be bent along each bending axis B1, thereby expanding
  • the bendable range of the display device 100 can better meet the needs of use.
  • FIG. 3 another embodiment of the present application also provides a display device 100a. It should be noted that the above explanation of the embodiment of the display device 100 is also applicable to the display device 100a of this embodiment, in order to avoid redundancy , Will not be detailed here.
  • the display panel 100a includes a display panel 10, a flip chip 20a, a driving chip 30a, a flexible circuit board 40, and a connector 50.
  • the driving chip 30a is disposed on the flip chip 20a, and the driving chip 30a is connected to the display panel 10 for providing a driving signal to the display device.
  • the connector 50 is provided on the flexible circuit board 40, and the connector 50 is connected to the display panel 10 for electrically and mechanically connecting the display panel 10 to a system circuit board (that is, a system motherboard).
  • the driving chip 30a is rectangular, and includes a first side 31, a second side 33, a third side 35, and a fourth side 37 that are connected in sequence.
  • the first side 31 and the third side The two side edges 33 are oppositely arranged along the second straight line L2, the third side edge 35 and the fourth side edge 37 are oppositely arranged parallel to the first straight line L1, and the lengths of the first side edge 31 and the second side edge 33 are They are smaller than the lengths of the third side 35 and the fourth side 37, respectively.
  • the flip chip 20a includes an input binding area 22a and a signal output binding area 24a, the input binding area 22a and the signal output binding area 24a are respectively provided On opposite sides of the flip chip 20a.
  • a first output area is provided inside the first side 31, and a second signal output area is provided inside the second side 33.
  • the shapes of the first output region and the second output region are both "concave".
  • the first output area is connected to the input binding area 22a by a wire; the second output area is connected to the output binding area 24a by a wire.
  • the first output area includes a first sub-output area 32, a second sub-output area 34, and a third sub-output area 36, and the second sub-output area 34 is disposed in the first sub-output area 32 and the first Between the three sub-output areas 36.
  • the first sub-output area 32 abuts the first side 31 and the third side 35, respectively, and the input binding area 22a is connected to the first sub-output area 32 and the first The edge where one side 31 and the third side 35 abut.
  • the second sub-output area 34 abuts on the first side 31, and the input binding area 22a is connected to an edge of the second sub-output area 34 that abuts on the first side 31 through a wire Office.
  • the third sub-output area 36 abuts on the first side 31 and the fourth side 37, respectively, and the input binding area 22a is connected to the third sub-output area 36 and all The edge where the first side 31 and the fourth side 37 abut.
  • the design of the second output area is the same as the design of the first output area, which will not be repeated here.
  • connection between the second output area and the signal output binding area 24a is the same as the connection between the first output area and the signal input binding area 22a, and will not be repeated here.
  • the design of the first output area and the second output area can be conveniently connected to the signal input binding area 22a and the signal output binding area 24a through leads, respectively, to facilitate the layout of the leads.
  • a plurality of bending axes B1 are provided outside the third side 35, and each of the bending axes B1 is provided along the first straight line L1, and the flip chip 20a may be along each of the bending axes B1 bends.
  • a plurality of bending axes B1 are provided outside the fourth side 37, and each of the bending axes B1 is provided along the first straight line L1, and the flip chip 20 may be along each of the bending axes B1 bends.
  • the driving chip is disposed between any two adjacent bending shafts on the flip chip.
  • the shape of the connector 50 is not limited to a rectangle.
  • the shape of the connector 50 may be square, trapezoidal, circular, or elliptical, as long as the connector 50 After the position is adjusted, it may be located in one of the plurality of module areas 26 or between any two of the bending axes B1.
  • the shape of the driving chip 30a is not limited to a rectangle.
  • the shape of the driving chip 30a may be circular, elliptical, trapezoidal, or other quadrilateral shapes, as long as the driving chip 30a After the position is adjusted, it may be located between the two bending axes B1.
  • the display device 100a Compared with the prior art, the display device 100a provided by the present application adjusts the relative position of the driving chip 30a on the flip chip 20a and the signal input binding area 22a and the signal output binding area 24a, so that A plurality of bending axes B1 are set in the reserved area on the flip chip 20a, and the display device 100a can be bent along each bending axis B1, thereby expanding the bendability of the display device 100a
  • the scope of the discount can better meet the needs of use.

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  • Physics & Mathematics (AREA)
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Abstract

一种显示装置(100)，其包括：显示面板(10)、覆晶薄膜(20)及驱动芯片(30)，覆晶薄膜(20)包括多个模块区(26)和多个弯折轴(B1)，多个弯折轴(B1)平行于第一直线(L1)设置，每相邻的两个模块区(26)之间设有至少一个弯折轴(B1),覆晶薄膜(20)可沿每个弯折轴(B1)进行弯折；驱动芯片(30)包括多个功能模块，每个功能模块可设置于任一模块区(26)。通过将驱动芯片(30)进行模块化分离式设计，从而可在覆晶薄膜(20)上设置多个弯折轴(B1)，进而扩大了显示装置(100)的可弯折的范围，更好的满足使用需求。

Description

显示装置 技术领域
本申请实施例涉及显示技术领域，尤其涉及一种显示装置。
背景技术
随着显示技术的不断发展，显示装置逐渐可以折叠甚至完全柔性化，与常规的显示屏相比，可折叠和柔性显示屏具有可弯曲、柔韧性佳的特性，提高了显示设备的便携性，同时，能够降低显示设备损坏的概率。
然而目前的可折叠或柔性显示装置中的驱动芯片和连接器等部件所设置的区域还无法实现弯折，限制了可折叠和柔性显示装置可弯折的范围。
发明内容
本申请实施例旨在提供一种显示装置，以解决现有技术中显示装置可弯折的范围较小的技术问题。
本申请实施例解决其技术问题提供以下技术方案：
一种柔性显示装置，包括：
显示面板，所述显示面板包括相邻的第一连接边和第二连接边，所述第一连接边沿第一直线设置，所述第二连接边沿第二直线设置，所述第一直线和所述第二直线相互垂直；
覆晶薄膜，所述覆晶薄膜设置于所述第二连接边的一侧，所述覆晶薄膜包括多个模块区和多个弯折轴，多个所述弯折轴平行于所述第一直线设置，每相邻的两个所述模块区之间设有至少一个所述弯折轴，所述 覆晶薄膜可沿每个所述弯折轴进行弯折；以及
驱动芯片，所述驱动芯片设置在所述覆晶薄膜上，所述驱动芯片包括多个功能模块，每个所述功能模块可设置于任一所述模块区。
可选地，所述覆晶薄膜包括信号输入绑定区和信号输出绑定区，多个所述模块区设置于所述输入绑定区和所述信号输出绑定区之间。
可选地，所述覆晶薄膜包括多个信号输入绑定区和多个信号输出绑定区，多个所述信号输入绑定区间隔预设距离设置于所述覆晶薄膜的一侧；多个所述信号输出绑定区间隔预设距离设置于所述覆晶薄膜相对的另一侧；
多个所述信号输入绑定区和多个所述信号输出绑定区一一对应，每个所述信号输入绑定区与相对应的一个所述信号输出绑定区相对设置；
每两个相对设置的所述信号输入绑定区和所述信号输出绑定区之间形成一所述模块区。
可选地，每相邻两个所述模块区以其中一个所述弯折轴为对称轴。
可选地，所述驱动芯片包括电源模块、处理器接口模块、逻辑模块和多个数据处理模块，所述处理器接口模块与所述逻辑模块连接，所述电源模块分别与所述处理器接口模块和所述逻辑模块连接，所述逻辑模块与多个所述数据处理模块连接。
可选地，所述电源模块、所述处理器接口模块、所述逻辑模块和多个所述数据处理模块可分别设置于任一所述模块区。
可选地，所述处理器接口模块与所述逻辑模块位于同一个所述模块区；
所述电源模块位于相邻的一个所述模块区；
多个所述数据处理模块与多个所述模块区一一对应，每个所述数据处理模块设置于对应的一个所述模块区。
可选地，所述电源模块、所述处理器接口模块、所述逻辑模块和多个所述数据处理模块均设置于同一所述模块区。
可选地，所述电源模块、所述处理器接口模块、所述逻辑模块分别位于相互相邻的所述模块区，每个所述数据处理模块设置于任意一个所述模块区。
可选地，所述电源模块和所述处理器接口模块分别对应一个所述信号输入绑定区，且分别靠近对应的一个所述信号输入绑定区设置；
每个所述数据处理模块分别对应一个所述信号输出绑定区，且分别靠近对应的一个所述信号输出绑定区设置。
可选地，所述柔性显示装置还包括连接器，所述连接器设置于任意相邻的两个所述弯折轴之间。
本申请实施例解决其技术问题还提供以下技术方案：
一种柔性显示装置，包括：
显示面板，所述显示面板包括相邻的第一连接边和第二连接边，所述第一连接边沿第一直线设置，所述第二连接边沿第二直线设置，所述第一直线和所述第二直线相互垂直；
覆晶薄膜，所述覆晶薄膜设置于所述第二连接边的一侧，所述覆晶薄膜上平行于所述第一直线设置有多个弯折轴；以及
驱动芯片，所述驱动芯片设置在所述覆晶薄膜上任意相邻的两个所述弯折轴之间，所述覆晶薄膜可沿所述弯折轴进行弯折。
可选地，所述覆晶薄膜包括信号输入绑定区和信号输出绑定区，所述驱动芯片设置于所述输入绑定区和所述信号输出绑定区之间，
所述驱动芯片包括第一侧边、第二侧边、第三侧边和第四侧边，所述第一侧边和第二侧边沿所述第二直线相对设置，所述第三侧边和第四侧边沿所述第一直线相对设置，所述第一侧边和第二侧边的长度分别小 于第三侧边和第四侧边的长度。
可选地，所述第三侧边外侧沿所述第一直线设置有多个所述弯折轴，所述覆晶薄膜可沿每个所述弯折轴进行弯折。
可选地，所述第四侧边外侧沿所述第一直线设置有多个所述弯折轴，所述覆晶薄膜可沿每个所述弯折轴进行弯折。
可选地，所述第一侧边内侧设置有第一输出区域，所述第二侧边内侧设置有第二信号输出区域；
所述第一输出区域通过引线连接至所述输入绑定区；
所述第二输出区域通过引线连接至所述输出绑定区。
可选地，所述第一输出区域和所述第二输出区域的形状均为“凹”字型。
可选地，所述第一输出区域包括第一子输出区域、第二子输出区域和第三子输出区域，所述第二子输出区域设置于所述第一子输出区域和所述第三子输出区域之间。
可选地，所述第一子输出区域分别抵接所述第一侧边和所述第三侧边，所述输入绑定区通过引线连接至所述第一子输出区域与所述第一侧边和所述第三侧边抵接的边缘处；
所述第二子输出区域抵接于所述第一侧边，所述输入绑定区通过引线连接至所述第二子输出区域与所述第一侧边抵接的边缘处；
所述第三子输出区域抵接于所述第一侧边和所述第四侧边，所述输入绑定区通过引线分别连接至所述第三子输出区域与所述第一侧边和所述第四侧边抵接的边缘处。
与现有技术相比较，本申请实施例提供的显示装置在所述覆晶薄膜上设置多个弯折轴，所述显示装置可沿每个所述弯折轴进行弯曲，从而扩大了所述显示装置的可弯折的范围，更好的满足使用需求。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。
图1是本申请其中一个实施例提供的一种显示装置的结构示意图；
图2是图1所示的显示装置的驱动芯片和覆晶薄膜的结构示意图；
图3是本申请另一实施例提供的一种显示装置的结构示意图；
图4是图3所示的显示装置的驱动芯片的结构示意图；
图5是图3所示的显示装置的驱动芯片和覆晶薄膜的结构示意图。
具体实施方式
为了便于理解本申请，下面结合附图和具体实施例，对本申请进行更详细的说明。需要说明的是，当元件被表述“固定于”另一个元件，它可以直接在另一个元件上、或者其间可以存在一个或多个居中的元件。当一个元件被表述“连接”另一个元件，它可以是直接连接到另一个元件、或者其间可以存在一个或多个居中的元件。本说明书所使用的术语“垂直的”、“水平的”、“左”、“右”、“内”、“外”以及类似的表述只是为了说明的目的，并且仅表达实质上的位置关系，例如对于“垂直的”，如果某位置关系因为了实现某目的的缘故并非严格垂直，但实质上是垂直的，或者利用了垂直的特性，则属于本说明书所述“垂直的”范畴。
除非另有定义，本说明书所使用的所有的技术和科学术语与属于本申请的技术领域的技术人员通常理解的含义相同。在本申请的说明书中 所使用的术语只是为了描述具体地实施例的目的，不是用于限制本申请。本说明书所使用的术语“和/或”包括一个或多个相关的所列项目的任意的和所有的组合。
此外，下面所描述的本申请不同实施例中所涉及的技术特征只要彼此之间未构成冲突就可以相互结合。
请一并参阅图1和图2，本申请其中一个实施例提供的显示装置100包括：显示面板10、覆晶薄膜(Chip on Film,COF)20、驱动芯片30、柔性电路板(Flexible Printed Circuit,FPC)40和连接器50。所述驱动芯片30设置在覆晶薄膜20上，所述驱动芯片30与所述显示面板10连接，用于给显示器件提供驱动信号。所述连接器50设置在柔性电路板40上，所述连接器50与所述显示面板10连接，用于将所述显示面板10电连接和机械连接至系统电路板(即系统主板)。
所述显示面板10平展时呈矩形，显示面板10包括相邻的第一连接边12和第二连接边14。所述第一连接边12沿第一直线L1设置，所述第二连接边14沿第二直线L2设置，所述第一直线L1和所述第二直线L2相互垂直；所述驱动芯片30通过引线分别连接至所述第一连接边12和第二连接边14，用于与所述显示器件连接，进而驱动或控制显示器件的显示。
所述显示面板10还包括顶膜、具有薄膜晶体管和像素等结构的显示器件、基板和底膜，所述底膜上依次设置有基板、显示器件和顶膜。
其中，所述顶膜可以为圆偏光片、触控膜、水氧阻隔膜、防刮伤膜、或其他光学薄膜等。
所述基板可以为由塑料制成的柔性基板，例如，聚酰亚胺(PI)柔性基板。
所述底膜可以为水氧阻隔膜、PET、PEN和PI等膜材，也可以是石 墨片、铜箔等散热功能膜材。
在一些实施例中，所述显示面板10使用柔性基板代替COF和FPC，即，显示面板10仅用一块一体成型的柔性基板。不仅显示器件设置在柔性基板上，而且驱动芯片30和连接器50也都设置在柔性基板上，从而省去了目前用于实现显示器件、驱动芯片30和连接器50之间的电连接的COF和FPC,降低了所述柔性显示装置的工艺复杂度。
所述连接器50的形状为长方形，所述连接器50设置于所述第二连接边14的外侧，所述连接器50包括相邻的第一侧端52和第二侧端54，所述第一侧端52平行于第一直线L1，所述第二侧端54平行于第二直线L2，所述第一侧端52的长度大于所述第二侧端54的长度。在所述连接器50的两侧区域，柔性电路板40可设置多个平行于第一直线L1设置的弯折轴，所述显示装置100可沿每个所述弯折轴进行弯曲，从而扩大了所述柔性显示装置100的可弯折的范围，更好的满足使用需求。
所述连接器50可通过导电胶、引线键合(Wire Bonding)或焊接的方式固定在柔性电路板40上。其中，导电胶优选为各向异性导电胶(Anisotropic Conductive Film,ACF)。
在本实施例中，所述柔性电路板40上设置导电引线，如金属引线，在连接器50的底面上设置有与导电引线相连的管脚，连接器50通过导电引线分别电连接至驱动芯片30和显示面板10上的显示器件。其中，连接器50可以为陶瓷材质。优选地，所述管脚由铜制成，并且所述管脚的表面镀易导电、抗腐蚀的金属材料，例如金或镍合金，并且所述管脚具有一定厚度的凸起。或者，在所述柔性电路板40上需要连接连接器50或外部元器件的位置中形成有经过电镀处理的连接管脚，使之易于与焊锡结合，从而用于焊接连接器50。使用ACF将连接器50固定在柔性电路板40上时，保持连接器50的上表面平整，可以较好地传导热 量，在热压时，能够将热传导到柔性电路板40与连接器50之间的ACF上，从而使ACF易于流动展开以及固化。
所述驱动芯片30可通过导电胶、引线键合或焊接的方式固定在覆晶薄膜20上。其中，导电胶优选为ACF。
在本实施例中，所述驱动芯片30通过引线键合的方式固定在覆晶薄膜20上，通过溅射、涂膜或印刷工艺制作的导电引线(如金属引线)与显示面板10上的显示器件电连接，并且通过导电引线与连接器50电连接。
所述覆晶薄膜20平行设置于所述显示面板10的第二连接边14的外侧。
所述覆晶薄膜20包括多个信号输入绑定区22和多个信号输出绑定区24。多个所述信号输入绑定区22间隔预设距离设置于所述覆晶薄膜20的一侧；多个所述信号输出绑定区24间隔预设距离设置于所述覆晶薄膜20的相对的另一侧。
多个所述信号输入绑定区22和多个所述信号输出绑定区24一一对应，且每个所述信号输入绑定区22与相对应的一个所述信号输出绑定区24相对设置。
每两个相对设置的信号输入绑定区22和所述信号输出绑定区24之间形成一模块区26,多个相对设置的信号输入绑定区22和信号输出绑定区24之间形成多个模块区26。
每两个相邻的模块区26之间设置有多个弯折轴B1，每个所述弯折轴B1沿所述第一直线L1设置，所述覆晶薄膜20可沿每个所述弯折轴B1进行弯折。每相邻两个所述模块区26以其中一个所述弯折轴B1为对称轴。所述连接器设置于任意相邻的两个所述弯折轴之间。
所述驱动芯片30包括多个功能模块，每个所述功能模块可设置于 任一所述模块区26；
在本实施例中，所述驱动芯片30包括电源模块39a、处理器接口模块39b、逻辑模块39c和多个数据处理模块39d，所述处理器接口模块39b与所述逻辑模块39c连接，所述电源模块39a分别与所述处理器接口模块39b和所述逻辑模块39c连接。所述逻辑模块39c与多个所述数据处理模块39d连接。
所述电源模块39a、所述处理器接口模块39b、所述逻辑模块39c和多个所述数据处理模块39d均可分别设置于任一所述模块区26。
在本实施例中，所述处理器接口模块39b与所述逻辑模块39c位于同一个所述模块区26。所述电源模块39a位于相邻的一个所述模块区26。
多个所述数据处理模块39d与多个所述模块区26一一对应，每个所述数据处理模块39d设置于对应的一个所述模块区26。
所述电源模块39a和所述处理器接口模块39b分别对应一个所述信号输入绑定区22，且分别靠近所述信号输入绑定区22设置。
每个所述数据处理模块39d分别对应一个所述信号输出绑定区24，且分别靠近所述信号输出绑定区24设置。
所述逻辑模块39c位于所述处理器接口模块39b和相对应的一个所述数据处理模块39d之间。
上述所述电源模块39a、所述处理器接口模块39b、所述逻辑模块39c和若干所述数据处理模块39d的设计，可方便通过引线分别与多个所述信号输入绑定区22和多个所述信号输出绑定区24进行连接，便于引线的布局。
在一些实施例中，所述电源模块39a、所述处理器接口模块39b、所述逻辑模块39c和多个所述数据处理模块39d均设置于同一模块区26，所述电源模块39a、所述处理器接口模块39b、所述逻辑模块39c和多个 所述数据处理模块39d之间的相互位置可根据需要任意设置，在此不做限定。
在一些实施例中，所述电源模块39a、所述处理器接口模块39b、所述逻辑模块39c均设置于同一模块区26，多个所述数据处理模块39d设置于任意所述模块区26。
在一些实施例中，所述电源模块39a、所述处理器接口模块39b、所述逻辑模块39c分别位于相邻的所述模块区26，每个所述数据处理模块39d设置于任意一个所述模块区26。
可以理解的是，所述电源模块39a、所述处理器接口模块39b、所述逻辑模块39c和多个所述数据处理模块39d位于多个所述模块区26的位置及所述电源模块39a、所述处理器接口模块39b、所述逻辑模块39c和多个所述数据处理模块39d之间的相互位置关系和连接方式，可以根据实际需求进行变化，在此不一一列举，但是所述多种变化形式均在本申请的保护范围之内。
与现有技术相比较，本申请的显示装置100，通过将现有的驱动芯片的集成化设计改为模块化分离式设计，将目前的覆晶薄膜的信号输入绑定区和所述信号输出绑定区也设计为分散式区域设计，从而可在所述覆晶薄膜20上设置多个弯折轴B1，所述显示装置100可沿每个所述弯折轴B1进行弯曲，从而扩大了所述显示装置100的可弯折的范围，更好的满足使用需求。
请参阅图3，本申请另一实施例还提供一种显示装置100a，需要说明的是，上述对显示装置100的实施例的解释说明也适用于本实施例的显示装置100a，为避免冗余，在此不再详细展开。
所述显示面板100a包括显示面板10、覆晶薄膜20a、驱动芯片30a、柔性电路板40和连接器50。所述驱动芯片30a设置在覆晶薄膜20a上， 所述驱动芯片30a与所述显示面板10连接，用于给显示器件提供驱动信号。所述连接器50设置在柔性电路板40上，所述连接器50与所述显示面板10连接，用于将所述显示面板10电连接和机械连接至系统电路板(即系统主板)。
请参阅图4，所述驱动芯片30a为矩形，包括依次连接的第一侧边31、第二侧边33、第三侧边35和第四侧边37，所述第一侧边31和第二侧边33沿第二直线L2相对设置，所述第三侧边35和第四侧边37平行于第一直线L1相对设置，所述第一侧边31和第二侧边33的长度分别小于第三侧边35和第四侧边37的长度。
请一并参阅图4和图5，所述覆晶薄膜20a包括一输入绑定区22a和一信号输出绑定区24a，所述输入绑定区22a和所述信号输出绑定区24a分别设置于所述覆晶薄膜20a的相对两侧。
所述第一侧边31内侧设置有第一输出区域，所述第二侧边33内侧设置有第二信号输出区域。所述第一输出区域和所述第二输出区域形状均为“凹”字型。所述第一输出区域通过引线连接至所述输入绑定区22a；所述第二输出区域通过引线连接至所述输出绑定区24a。
所述第一输出区域包括第一子输出区域32、第二子输出区域34和第三子输出区域36，所述第二子输出区域34设置于所述第一子输出区域32和所述第三子输出区域36之间。
所述第一子输出区域32分别抵接所述第一侧边31和所述第三侧边35，所述输入绑定区22a通过引线连接至所述第一子输出区域32与所述第一侧边31和所述第三侧边35抵接的边缘处。
所述第二子输出区域34抵接于所述第一侧边31，所述输入绑定区22a通过引线连接至所述第二子输出区域34与所述第一侧边31抵接的边缘处。
所述第三子输出区域36分别抵接于所述第一侧边31和所述第四侧边37，所述输入绑定区22a通过引线分别连接至所述第三子输出区域36与所述第一侧边31和所述第四侧边37抵接的边缘处。
所述第二输出区域的设计与所述第一输出区域的设计相同，在此不再赘述。
所述第二输出区域与所述信号输出绑定区24a的连接方式和所述第一输出区域与所述信号输入绑定区22a的的连接方式一致，在此不再赘述。
所述第一输出区域和所述第二输出区域的设计可方便通过引线分别与所述信号输入绑定区22a和所述信号输出绑定区24a进行连接，便于引线的布局。
所述第三侧边35外侧设置有多个弯折轴B1，每个所述弯折轴B1沿所述第一直线L1设置,所述覆晶薄膜20a可沿每个所述弯折轴B1进行弯折。
所述第四侧边37外侧设置有多个弯折轴B1，每个所述弯折轴B1沿所述第一直线L1设置,所述覆晶薄膜20可沿每个所述弯折轴B1进行弯折。所述驱动芯片设置在所述覆晶薄膜上任意相邻的两个所述弯折轴之间。
需要说明的是，所述连接器50的形状不局限于长方形，在一些实施例中，所述连接器50的形状可为正方形、梯形、圆形或椭圆形等图形，只要所述连接器50的位置调整后位于多个所述模块区26其中一个或者位于任意两个所述弯折轴B1之间即可。
需要说明的是，所述驱动芯片30a的形状不局限于矩形，在一些实施例中，所述驱动芯片30a的形状可为圆形、椭圆形、梯形或其他四边形等图形，只要驱动芯片30a的位置调整后可以位于两个所述弯折轴B1 之间即可。
与现有技术相比较，本申请提供的显示装置100a，通过调整驱动芯片30a在覆晶薄膜20a上与所述信号输入绑定区22a和所述信号输出绑定区24a的相对位置，从而在所述覆晶薄膜20a上预留出区域设置多个所述弯折轴B1，所述显示装置100a可沿每个所述弯折轴B1进行弯曲，从而扩大了所述显示装置100a的可弯折的范围，更好的满足使用需求。
最后应说明的是：以上实施例仅用于说明本申请的技术方案，而非对其限制；在本申请的思路下，以上实施例或者不同实施例中的技术特征之间也可以进行组合，步骤可以以任意顺序实现，并存在如上所述的本申请的不同方面的许多其它变化，为了简明，它们没有在细节中提供；尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的范围。

Claims (19)

  1. 一种显示装置，其特征在于，包括：
    显示面板，所述显示面板包括相邻的第一连接边和第二连接边，所述第一连接边沿第一直线设置，所述第二连接边沿第二直线设置；
    覆晶薄膜，所述覆晶薄膜设置于所述第二连接边的一侧，所述覆晶薄膜包括多个模块区和多个弯折轴，多个所述弯折轴平行于所述第一直线设置，每相邻的两个所述模块区之间设有至少一个所述弯折轴，所述覆晶薄膜可沿每个所述弯折轴进行弯折；以及
    驱动芯片，所述驱动芯片设置在所述覆晶薄膜上，所述驱动芯片包括多个功能模块，每个所述功能模块可设置于任一所述模块区。
  2. 根据权利要求1所述的显示装置，其特征在于，
    所述覆晶薄膜包括信号输入绑定区和信号输出绑定区，多个所述模块区设置于所述输入绑定区和所述信号输出绑定区之间。
  3. 根据权利要求1所述的显示装置，其特征在于，
    所述覆晶薄膜包括多个信号输入绑定区和多个信号输出绑定区，多个所述信号输入绑定区间隔预设距离设置于所述覆晶薄膜的一侧；多个所述信号输出绑定区间隔预设距离设置于所述覆晶薄膜相对的另一侧；
    多个所述信号输入绑定区和多个所述信号输出绑定区一一对应，每个所述信号输入绑定区与相对应的一个所述信号输出绑定区相对设置；
    每两个相对设置的所述信号输入绑定区和所述信号输出绑定区之间形成一所述模块区。
  4. 根据权利要求3所述的显示装置，其特征在于，
    每相邻两个所述模块区以其中一个所述弯折轴为对称轴。
  5. 根据权利要求3所述的显示装置，其特征在于，
    所述驱动芯片包括电源模块、处理器接口模块、逻辑模块和多个数据处理模块，所述处理器接口模块与所述逻辑模块连接，所述电源模块分别与所述处理器接口模块和所述逻辑模块连接，所述逻辑模块与多个所述数据处理模块连接。
  6. 根据权利要求5所述的显示装置，其特征在于，
    所述电源模块和所述处理器接口模块分别对应一个所述信号输入绑定区，且分别靠近对应的一个所述信号输入绑定区设置；
    每个所述数据处理模块分别对应一个所述信号输出绑定区，且分别靠近对应的一个所述信号输出绑定区设置。
  7. 根据权利要求5所述的显示装置，其特征在于，
    所述电源模块、所述处理器接口模块、所述逻辑模块和多个所述数据处理模块均设置于同一所述模块区。
  8. 根据权利要求5所述的显示装置，其特征在于，
    所述电源模块、所述处理器接口模块、所述逻辑模块和多个所述数据处理模块可分别设置于任一所述模块区。
  9. 根据权利要求5所述的显示装置，其特征在于，
    所述处理器接口模块与所述逻辑模块位于同一个所述模块区；
    所述电源模块位于相邻的一个所述模块区；
    多个所述数据处理模块与多个所述模块区一一对应，每个所述数据处理模块设置于对应的一个所述模块区。
  10. 根据权利要求5所述的显示装置，其特征在于，
    所述电源模块、所述处理器接口模块、所述逻辑模块分别位于相互相邻的所述模块区，每个所述数据处理模块设置于任意一个所述模块区。
  11. 根据权利要求1-10任一项所述的显示装置，其特征在于，
    所述显示装置还包括连接器，所述连接器设置于任意相邻的两个所述弯折轴之间。
  12. 一种显示装置，其特征在于，包括：
    显示面板，所述显示面板包括相邻的第一连接边和第二连接边，所述第一连接边沿第一直线设置，所述第二连接边沿第二直线设置；
    覆晶薄膜，所述覆晶薄膜设置于所述第二连接边的一侧，所述覆晶薄膜上平行于所述第一直线设置有多个弯折轴；以及
    驱动芯片，所述驱动芯片设置在所述覆晶薄膜上任意相邻的两个所述弯折轴之间，所述覆晶薄膜可沿所述弯折轴进行弯折。
  13. 根据权利要求12所述的显示装置，其特征在于，
    所述覆晶薄膜包括信号输入绑定区和信号输出绑定区，所述驱动芯片设置于所述输入绑定区和所述信号输出绑定区之间，
    所述驱动芯片包括第一侧边、第二侧边、第三侧边和第四侧边，所 述第一侧边和第二侧边沿所述第二直线相对设置，所述第三侧边和第四侧边沿所述第一直线相对设置。
  14. 根据权利要求13所述的显示装置，其特征在于，
    所述第三侧边外侧沿所述第一直线设置有多个所述弯折轴，所述覆晶薄膜可沿每个所述弯折轴进行弯折。
  15. 根据权利要求13所述的显示装置，其特征在于，
    所述第四侧边外侧沿所述第一直线设置有多个所述弯折轴，所述覆晶薄膜可沿每个所述弯折轴进行弯折。
  16. 根据权利要求13所述的显示装置，其特征在于，
    所述第一侧边内侧设置有第一输出区域，所述第二侧边内侧设置有第二信号输出区域；
    所述第一输出区域通过引线连接至所述输入绑定区；
    所述第二输出区域通过引线连接至所述输出绑定区。
  17. 根据权利要求16所述的显示装置，其特征在于，
    所述第一输出区域和所述第二输出区域的形状均为“凹”字型。
  18. 根据权利要求17所述的显示装置，其特征在于，
    所述第一输出区域包括第一子输出区域、第二子输出区域和第三子输出区域，所述第二子输出区域设置于所述第一子输出区域和所述第三子输出区域之间。
  19. 根据权利要求18所述的显示装置，其特征在于，
    所述第一子输出区域分别抵接所述第一侧边和所述第三侧边，所述输入绑定区通过引线连接至所述第一子输出区域与所述第一侧边和所述第三侧边抵接的边缘处；
    所述第二子输出区域抵接于所述第一侧边，所述输入绑定区通过引线连接至所述第二子输出区域与所述第一侧边抵接的边缘处；
    所述第三子输出区域抵接于所述第一侧边和所述第四侧边，所述输入绑定区通过引线分别连接至所述第三子输出区域与所述第一侧边和所述第四侧边抵接的边缘处。
PCT/CN2018/125718 2018-12-29 2018-12-29 显示装置 Ceased WO2020133444A1 (zh)

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