WO2020133260A1 - 一种改善导电粒子聚集的fpc、导电结合结构和触控传感器 - Google Patents

一种改善导电粒子聚集的fpc、导电结合结构和触控传感器 Download PDF

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Publication number
WO2020133260A1
WO2020133260A1 PCT/CN2018/125018 CN2018125018W WO2020133260A1 WO 2020133260 A1 WO2020133260 A1 WO 2020133260A1 CN 2018125018 W CN2018125018 W CN 2018125018W WO 2020133260 A1 WO2020133260 A1 WO 2020133260A1
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Prior art keywords
conductive particles
conductive
aggregation
pins
groove
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PCT/CN2018/125018
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English (en)
French (fr)
Inventor
陈林海
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Shenzhen Royole Technologies Co Ltd
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Shenzhen Royole Technologies Co Ltd
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Priority to CN201880095906.2A priority Critical patent/CN112640588A/zh
Priority to PCT/CN2018/125018 priority patent/WO2020133260A1/zh
Publication of WO2020133260A1 publication Critical patent/WO2020133260A1/zh
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Definitions

  • the present application relates to the field of conductive bonding technology, and in particular, to an FPC, conductive bonding structure, and touch sensor that improve the aggregation of conductive particles.
  • FPC Flexible Printed Circuit
  • ACF Anisotropic Conductive Film
  • ACF Anisotropic Conductive film
  • conductive particles tend to gather between adjacent pins, which may cause short circuit of adjacent pins.
  • the gap between the pins in the frame becomes smaller and smaller, and the possibility that the conductive particles are aggregated to cause the adjacent pins to short-circuit further increases.
  • an embodiment of the present application provides an FPC that improves the aggregation of conductive particles
  • the FPC includes a first base layer, a second base layer, and a first sandwiched between the first base layer and the second base layer Conductive layer;
  • the first conductive layer includes a plurality of first pins spaced apart, the first base layer barely exposes the ends of the first pins, and a groove is formed at the edge of the first base layer, so The groove is located between two adjacent first pins, and the groove is used to increase a path for the accumulation of conductive particles.
  • the FPC for improving the aggregation of conductive particles provided in the first aspect is provided with a groove at the edge of the first base layer and between two adjacent first pins.
  • the conductive The particles will accumulate along the wall of the groove, so that the path for the accumulation of conductive particles between the two adjacent first pins that increase the edge of the first base layer will reduce the conduction between the conductive particles to cause the two adjacent first pins Risk of short circuit.
  • the width of the opening of the groove is equal to the distance between two adjacent first pins. In this way, the length of the wall surface of the groove is made as large as possible, that is, the path for the accumulation of conductive particles is further increased.
  • the number of the grooves is multiple, and the multiple grooves are arranged side by side between two adjacent first pins .
  • multiple grooves side by side can further increase the wall surface of the groove, that is, further increase the path of the accumulation of conductive particles.
  • the cross-sectional shape of the groove is a polygon or an arc. In this way, it is ensured that the groove has a longer wall surface.
  • the inner surface of the groove is provided with a convex portion, and the convex portion is used to increase a path for accumulation of conductive particles.
  • a convex portion is provided on the inner surface of the groove, and the contour of the convex portion serves as the wall surface of the groove, which can increase the length of the wall surface of the groove, that is, the path for accumulating conductive particles.
  • the cross-sectional shape of the convex portion is triangular, trapezoidal, or arc-shaped. In this way, it is ensured that the convex portion has a longer contour length.
  • the number of the convex portions is multiple, and the multiple convex portions are arranged at intervals. In this way, the outline length of the convex portion is further increased, that is, the path of the accumulation of conductive particles is further increased.
  • the cross-sectional shape of the groove is triangular, and two opposite side walls in the groove are provided with The convex part.
  • the cross-sectional shape of the groove is trapezoidal, and two opposite side walls in the groove are provided with The convex part.
  • an embodiment of the present application provides a conductive bonding structure that improves the aggregation of conductive particles
  • the conductive bonding structure includes an FPC that improves the aggregation of conductive particles, a connection matrix that improves the aggregation of conductive particles, and an anisotropic conductive material, wherein ,
  • the anisotropic conductive material includes resin and conductive particles embedded in the resin;
  • the FPC includes a first base layer, a second base layer, and a first sandwiched between the first base layer and the second base layer A conductive layer, the first conductive layer includes a plurality of first pins spaced apart, the first base layer barely exposes the end of the first pin, and the end of the first pin passes through the different
  • the square conductive material is electrically connected to the connection base;
  • the edge of the first base layer is provided with a groove, the groove is located between two adjacent first pins, and the groove is used to grow Describe the path of conductive particles accumulation.
  • the conductive bonding structure for improving the aggregation of conductive particles provided in the second aspect is provided with a groove at the edge of the first base layer and between two adjacent first pins.
  • the conductive particles in the anisotropic conductive material will follow Accumulate the wall surface of the groove, so that the path of the accumulation of conductive particles between the two adjacent first pins on the edge of the first base layer is increased, reducing the risk of short circuit between the two adjacent first pins due to the conduction of the conductive particles .
  • connection base includes a base material, an insulating layer, and a second conductive layer sandwiched between the base material and the insulating layer,
  • the second conductive layer includes a plurality of second pins spaced apart, the insulating layer barely exposes the end of the second pin; the anisotropic conductive material is clamped on the first pin Between the end and the end of the second pin, the end of the first pin corresponds to the end of the second pin.
  • the connecting base body further includes a diversion block, and the diversion block is located at two adjacent second diversions Between the feet and at or near the position where the second pin is to be bound, the deflector block is used to guide the conductive particles.
  • the conductive particles will accumulate along the outline of the deflector block, and the accumulation path is longer, which reduces the risk of the conductive particles conducting to each other and causing the adjacent two second pins to short-circuit.
  • the number of the diversion blocks is multiple, and the multiple diversion blocks are arranged side by side in adjacent two Between the second pins.
  • multiple guide blocks side by side can further increase the outline length of the guide blocks, that is, the path for the accumulation of conductive particles.
  • the cross-sectional shape of the deflector block is a polygon, an ellipse, or a circle. In this way, it is ensured that the guide block has a longer contour length.
  • the cross-sectional shape of the deflector block is triangular.
  • the width of the triangle gradually increases in a direction away from the position to be bound. In this way, the conductive particles accumulate along the two sides of the triangle, and the accumulation path is long.
  • the cross-sectional shape of the diversion block is trapezoidal.
  • the width of the trapezoid gradually increases in a direction away from the position to be bound. In this way, the conductive particles accumulate along the two waists and one short side of the trapezoid, and the accumulation path is longer.
  • a touch sensor is provided in an embodiment of the present application.
  • the touch sensor includes the FPC provided in the first aspect.
  • an embodiment of the present application provides a touch sensor.
  • the touch sensor includes the conductive bonding structure provided in the second aspect.
  • the path for the accumulation of conductive particles between the two adjacent first pins on the edge of the first base layer is increased to reduce the conduction between the conductive particles causing the two adjacent first pins Risk of short-circuiting the pins.
  • FIG. 1 is a schematic structural diagram of an existing conductive bonding structure.
  • FIG. 2 is a schematic diagram of the conductive particles gathered in the edge of the FPC in FIG. 1 causing the corresponding pins to short-circuit.
  • FIG. 3 is a schematic diagram of the conductive particles in FIG. 1 gathering at the edge of the connecting substrate to cause a short circuit of the corresponding pin.
  • FIG. 4 is a schematic diagram of a conductive bonding structure for improving the aggregation of conductive particles provided by an embodiment of the present application.
  • FIG. 5 is a top view of the FPC of FIG. 4 that improves the aggregation of conductive particles.
  • FIG. 6 is a schematic diagram of the working principle of a groove with a triangular cross-sectional shape.
  • FIG. 7 is a schematic diagram of a groove having a trapezoidal cross-sectional shape.
  • FIG. 8 is a schematic diagram of a groove with a semicircular arc shape in cross-section.
  • FIG. 9 is a schematic diagram of a plurality of grooves side by side.
  • FIG. 10 is a schematic diagram of providing a convex portion on the inner surface of the groove.
  • FIG. 11 is a top view of the connection base of FIG. 4 that improves the aggregation of conductive particles.
  • FIG. 12 is a schematic diagram of the working principle of a guide block with a triangular cross-sectional shape.
  • FIG. 13 is a schematic diagram of a deflector block having a trapezoidal cross-sectional shape.
  • FIG. 14 is a schematic view of a deflector block with an elliptical cross-sectional shape.
  • 15 is a schematic diagram of a guide block having a rectangular cross-sectional shape.
  • 16 is a schematic diagram of multiple diversion blocks side by side.
  • Icon 01-conductive bonding structure; 02-FPC; 03-connecting substrate; 04-ACF; 05-conductive particles; 06-pin; 100-conductive bonding structure to improve the aggregation of conductive particles; 110-FPC to improve the aggregation of conductive particles 111-first base layer; 112-groove; 113-second base layer; 114-first conductive layer; 115-first pin; 116-protrusions; 120-connecting substrate to improve the aggregation of conductive particles; 121-base Material; 122-insulating layer; 123-second conductive layer; 124-second pin; 125-diversion block; 130-anisotropic conductive material.
  • connection should be broadly understood, for example, it can be a fixed connection, It can also be a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication between two components.
  • setup “installation”, “connection”, and “connection” should be broadly understood, for example, it can be a fixed connection, It can also be a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication between two components.
  • the existing conductive bonding structure 01 includes an FPC02, a connection base 03, and an ACF04 bonded between the FPC02 and the connection base 03.
  • ACF04 is in a liquid state after being heated.
  • the conductive particles 05 in ACF04 tend to gather at the binding position of FPC02, where the binding position is at the edge of FPC02 ( Figure (As shown in area A in 1) or it is also easy to gather at the edge of the connecting substrate 03 (shown in area B of FIG. 1), and may also gather at the edge of the FPC02 and the connecting substrate 03 at the same time.
  • connection base 03 on the edge of the connection base 03, too many conductive particles 05 are accumulated between two adjacent pins 06, and the conductive particles 05 are connected to each other, causing the two adjacent pins 06 to short-circuit, resulting in a conductive bonding structure 01 failed.
  • Embodiments of the present application provide a conductive bonding structure that improves the aggregation of conductive particles.
  • a structure that increases the accumulation path of conductive particles is provided in a region where conductive particles are easily aggregated, to avoid conductive particles between two adjacent pins Mutual conduction to avoid short circuit between two adjacent pins.
  • the conductive bonding structure 100 for improving the aggregation of conductive particles includes an FPC for improving the aggregation of conductive particles, a connecting substrate 120 for improving the aggregation of conductive particles, and an anisotropic conductive material 130.
  • the anisotropic conductive material 130 It is bonded between the FPC and the connection base 120.
  • the anisotropic conductive material 130 can be ACF or ACA/ACP (full name: Anisotropic conductive/adhesive/paste, Chinese name: anisotropic conductive adhesive).
  • the anisotropic conductive material 130 includes resin and conductive particles 05 embedded in the resin.
  • the FPC includes a first base layer 111, a second base layer 113, and a first conductive layer 114 sandwiched between the first base layer 111 and the second base layer 113;
  • the connection base 120 includes a base 121, an insulating layer 122, and a base
  • the second conductive layer 123 between 121 and the insulating layer 122; the first conductive layer 114 and the second conductive layer 123 are electrically connected by an anisotropic conductive material 130.
  • both the first base layer 111 and the second base layer 113 may be made of PI (full name: Polyimide, Chinese name: polyimide), or both may be made of electromagnetic shielding materials.
  • the structure of the FPC is shown in FIG. 5.
  • the first conductive layer 114 includes a plurality of first pins 115, and the first pins 115 are evenly spaced on the second base layer 113.
  • the first base layer 111 covers the first pin 115 and exposes the end of the first pin 115.
  • the anisotropic conductive material 130 is sandwiched between the end of the first lead 115 and the connection base 120.
  • the conductive particles 05 in the anisotropic conductive material 130 will flow toward the edge of the first base layer 111, and the arrow in FIG. 6 indicates the flow direction of the conductive particles 05.
  • a groove 112 is formed on the edge of the first base layer 111 and between two adjacent first pins 115. The wall surface of the groove 112 will be used to accumulate conductive particles 05. In this way, the length of the path for the conductive particles 05 to be stacked between the two adjacent first pins 115 will be longer than the distance between the two adjacent first pins 115, which reduces the conduction between the conductive particles 05 and causes adjacent Risk of short-circuiting the two first pins 115.
  • the maximum width of the opening of the groove 112 is equal to the distance between two adjacent first pins 115. In this way, the wall surface of the groove 112 can be made as long as possible, and the path for depositing the conductive particles 05 between the two adjacent first pins 115 is as long as possible.
  • the minimum value of the width of the opening of the groove 112 is not limited as long as the path for accumulating conductive particles 05 between two adjacent first pins 115 can be increased.
  • the depth of the groove 112 is not specifically limited, and the depth of the groove 112 may be as large as possible in order to increase the length of the wall surface of the groove 112 as much as possible.
  • the cross-sectional shape of the groove 112 is a triangle, and the apex of the triangle is located in the innermost part of the first base layer 111. If the two adjacent first pins 115 are short-circuited due to the aggregation of the conductive particles 05, the path for the conductive particles 05 to pile up includes the gap between the groove 112 and the two first pins 115, and at least part of the outline length of the groove 112 . At least part of the profile length of the groove 112 is greater than the width of the opening of the groove 112 and less than or equal to the length of the wall surface of the groove 112, and the length of the wall surface of the groove 112 is the sum of the two sides of the triangle. Therefore, the groove 112 increases the path for the conductive particles 05 to pile up, reducing the risk of short-circuiting the two adjacent first pins 115.
  • the cross-sectional shape of the groove 112 can also be selected, for example, trapezoidal (as shown in FIG. 7) or semi-circular arc (as shown in FIG. 8). It is foreseeable that the cross-sectional shape of the groove 112 may also be other polygons or arcs.
  • the number of grooves 112 between two adjacent first pins 115 is not limited to one, and may be multiple.
  • the multiple grooves 112 are arranged side by side between two adjacent first pins 115. Referring to FIG. 9, two grooves 112 with a triangular cross-sectional shape are provided between two adjacent first pins 115.
  • the number of grooves 112 between two adjacent first pins 115 is not limited to one or two, and there may be more, such as three, four, or five.
  • the cross-sectional shape of the groove 112 between two adjacent first pins 115 is not limited to a triangle, and may be other shapes as described above, such as a plurality of trapezoids arranged side by side, or a plurality of grooves 112 of different cross-sectional shapes arranged side by side.
  • the inner surface of the groove 112 is provided with a convex portion 116, and the length of the outline of the convex portion 116 can increase the length of the wall surface of the groove 112, thereby increasing the path of the conductive particles 05 accumulation.
  • the cross-sectional shape of the groove 112 is selected to be a trapezoid, and two opposite side walls in the groove 112 are provided with protrusions 116.
  • the cross-sectional shape of the convex portion 116 is selected to be triangular. It is foreseeable that the cross-sectional shape of the groove 112 may also be selected as a triangle. Similarly, protrusions 116 are provided on two opposite side walls of the groove 112.
  • the cross-sectional shape of the convex portion 116 is not limited to a triangle, but may be other polygons, such as a trapezoid; and may also be an arc, such as a semicircular arc.
  • each groove 112 is not limited to one or two, but may be more, such as three, four, or five.
  • the plurality of convex portions 116 arranged at intervals can further increase the length of the wall surface of the groove 112.
  • connection base 120 The structure of the connection base 120 is shown in FIGS. 11 and 4.
  • the second conductive layer 123 includes a plurality of second pins 124, and the second pins 124 are arranged on the substrate 121 at even intervals.
  • the insulating layer 122 covers the second pin 124 and exposes the end of the second pin 124.
  • the anisotropic conductive material 130 is adhered between the end of the first lead 115 and the end of the second lead 124, and the end of the first lead 115 corresponds to the end of the second lead 124 in one-to-one correspondence.
  • the connection base 120 further includes a diversion block 125, which is disposed between two adjacent second pins 124 and is located at or near the position where the second pins 124 are to be bound.
  • the position where the second pin 124 is to be bound may be adjacent to the edge of the insulating layer 122, and may be separated from the edge of the insulating layer 122 by a certain distance.
  • the deflector 125 may be integrated with the insulating layer 122 or a certain distance from the edge of the insulating layer 122, but the distance between the distances is less than the diameter of one conductive particle 05.
  • the insulating layer 122 can prevent the second pin 124 from being oxidized and corroded, and can also prevent the silver migration of the second pin 124 when it is energized in a high-temperature and high-humidity environment, causing the two adjacent second pins 124 to short-circuit.
  • the conductive particles 05 flow to the guide block 125.
  • the arrow in FIG. 12 indicates the overflow direction of the conductive particles 05.
  • the deflector block 125 conducts the conductive particles 05 so that the conductive particles 05 will accumulate along the outline of the deflector block 125. In this way, the length of the path for the accumulation of the conductive particles 05 between the two adjacent second pins 124 will be The distance between the two adjacent second pins 124 is greater than that, which reduces the risk that the conductive particles 05 conduct to each other and cause the two adjacent second pins 124 to short-circuit.
  • the cross-sectional shape of the deflector 125 is a triangle, and the width of the triangle gradually increases in a direction away from the position to be bound, that is, one vertex of the triangle faces away from the edge of the insulating layer 122. In this way, the conductive particles 05 will accumulate along two sides of the triangle facing away from the edge of the insulating layer 122.
  • the path of the accumulation of the conductive particles 05 includes the gap between the triangle and the two second pins 124, the partial outline length of the triangle (the partial outline of the triangle Length refers to at least part of the length of the two sides of the triangle), and the stacked path must cross the top corner of the triangle. Therefore, the triangular guide block 125 increases the path of the conductive particles 05 and reduces the risk of short-circuiting of the two adjacent second pins 124.
  • the cross-sectional shape of the deflector 125 is an isosceles triangle.
  • the apex angle of the isosceles triangle is away from the edge of the insulating layer 122.
  • the two waists of the isosceles triangle are as long as possible, so that the path for the conductive particles 05 to accumulate is as long as possible.
  • the cross-sectional shape of the deflector 125 is a trapezoid, and the width of the trapezoid gradually increases in a direction away from the position to be bound, that is, the short side of the trapezoid faces away from the edge of the insulating layer 122. In this way, the conductive particles 05 will accumulate along the two waists and one short side of the trapezoid.
  • the path of the accumulation of the conductive particles 05 includes the gap between the trapezoid and the two second pins 124, the partial contour length of the trapezoid (partial contour of the trapezoid Length refers to the sum of at least part of the length of the two sides of the trapezoid and the length of the short side). Therefore, the trapezoidal guide block 125 increases the path of the conductive particles 05 and reduces the risk of short-circuiting of the two adjacent second pins 124.
  • the cross-sectional shape of the deflector 125 is an isosceles trapezoid
  • the short sides of the isosceles trapezoid face away from the edge of the insulating layer 122
  • the two waists and the short sides of the isosceles triangle are as long as possible
  • the path for the conductive particles 05 to be stacked is as long as possible .
  • FIG. 14 is a schematic diagram of the ellipse in the cross-sectional shape of the deflector 125.
  • FIG. 15 is a schematic diagram of the cross-sectional shape of the deflector 125 being rectangular.
  • the number of the guide blocks 125 between two adjacent second pins 124 is not limited to one, and may be multiple.
  • the multiple guide blocks 125 are arranged side by side between the two adjacent second pins 124.
  • two guide blocks 125 having a triangular cross-sectional shape are provided between two adjacent second pins 124. The two adjacent corners of the two triangles are connected together, and the top corners of the two triangles face away from the edge of the insulating layer 122.
  • the path of the conductive particles 05 stacking includes the gap between the two triangles and the two second pins 124, and the partial outline length of the two triangles (
  • the partial contour length of the two triangles refers to at least part of the lengths of the four sides of the two triangles), and the path of the stack must cross the two vertex angles of the two triangles.
  • the number of the guiding blocks 125 between two adjacent second pins 124 is not limited to one or two, and there may be more, such as three, four, or five.
  • the cross-sectional shape of the deflector 125 between two adjacent second pins 124 is not limited to a triangle, and may be other shapes as described above, such as multiple trapezoids arranged side by side, or multiple deflectors 125 of different cross-sectional shapes arranged side by side .
  • the deflector block 125 and the insulating layer 122 are made of the same material, and the deflector block 125 and the insulating layer 122 are simultaneously formed through a coating process. In this way, compared with the existing manufacturing process of the connecting base 120, the connecting base 120 in this embodiment does not add any processing steps, and the preparation is convenient.
  • the touch sensor may include the above-mentioned connection base 120 that improves the aggregation of conductive particles, thereby reducing the risk of a short circuit caused by the aggregation of conductive particles 05 between two adjacent first pins 115.
  • the touch sensor may include the above-described FPC that improves the aggregation of conductive particles, thereby reducing the adjacent two second pins 124 at the edge of the first base layer 111 due to the aggregation of conductive particles 05 and causing a short circuit. risks of.
  • the touch sensor may include the conductive bonding structure 100 that improves the aggregation of conductive particles, that is, the touch sensor may include the FPC that improves the aggregation of conductive particles and the connection that improves the aggregation of conductive particles.
  • the substrate 120 reduces the risk of short-circuiting of the two adjacent first pins 115 due to the aggregation of the conductive particles 05, and at the same time, reduces the adjacent two second pins 124 of the edge of the first base layer 111 due to the aggregation of the conductive particles 05 Risk of short circuit.
  • the FPC for improving the aggregation of conductive particles, the connecting substrate 120 for improving the aggregation of conductive particles, the conductive bonding structure 100 for improving the aggregation of conductive particles, and the touch sensor can all reduce the occurrence of the adjacent two pins inside each The risk of short circuit improves the product utilization rate and reliability.

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Abstract

本申请提供了一种改善导电粒子聚集的FPC、导电结合结构和触控传感器。导电结合结构和触控传感器包括上述改善导电粒子聚集的FPC。FPC包括第一基层(111)、第二基层(113)以及夹持于第一基层(111)与第二基层(113)之间的第一导电层(114)；第一导电层(114)包括间隔设置的多根第一引脚(115)，第一基层(111)裸露出第一引脚(115)的端部，第一基层(111)的边缘开设有凹槽(112)，凹槽(112)位于相邻两根第一引脚(115)之间，凹槽(112)用于增长导电粒子(05)堆积的路径。在第一基层(111)的边缘开设凹槽(112)能够增长导电粒子(05)堆积的路径，降低相邻两个第一引脚(115)短路的风险。

Description

一种改善导电粒子聚集的FPC、导电结合结构和触控传感器 技术领域
本申请涉及导电结合技术领域，具体而言，涉及一种改善导电粒子聚集的FPC、导电结合结构和触控传感器。
背景技术
在现有触控设备中，FPC(全称：Flexible Printed Circuit，中文名：柔性印刷电路板)与连接基体之间通过ACF(全称：Anisotropic Conductive Film，中文名：异方性导电胶膜)粘接。其中，ACF包含导电粒子。在制备过程中，ACF在受热后呈液态，在按压FPC的过程，ACF将向周围流动。
ACF在流动过程中，导电粒子容易聚集在相邻引脚之间，容易导致相邻引脚短路。并且，随着触控设备的边框设计越来越窄，边框内的引脚之间的间隙越来越小，导电粒子聚集造成相邻引脚短路的可能性进一步提高。
发明内容
第一方面，本申请实施例中提供一种改善导电粒子聚集的FPC，所述FPC包括第一基层、第二基层以及夹持于所述第一基层与所述第二基层之间的第一导电层；所述第一导电层包括间隔设置的多根第一引脚，所述第一基层裸露出所述第一引脚的端部，所述第一基层的边缘开设有凹槽，所述凹槽位于相邻两根所述第一引脚之间，所述凹槽用于增长导电粒子堆积的路径。
第一方面中提供的改善导电粒子聚集的FPC，在第一基层的边缘、且位于相邻两根第一引脚之间开设有凹槽，在该FPC与异方性导电材料结合时，导电粒子将沿着凹槽的壁面堆积，这样，增长第一基层的边缘的相邻两根第一引脚之间导电粒子堆积的路径，降低导电粒子相互导通造成相邻两根第一引脚短路的风险。
结合第一方面，本申请在第一方面的第一种实现方式中，所述凹槽的开口的宽度等于相邻两根所述第一引脚之间的间距。这样，使凹槽的壁面的长度尽量大，即进一步增长导电粒子堆积的路径。
结合第一方面，本申请在第一方面的第二种实现方式中，所述凹槽的数量为多个，多个所述凹槽并排设置在相邻两根所述第一引脚之间。这样，多个凹槽并排能够进一步增长凹槽的壁面，即进一步增长导电粒子堆积的路径。
结合第一方面，本申请在第一方面的第三种实现方式中，所述凹槽的截面形状为多边形或弧形。这样，保证凹槽具有较长的壁面。
结合第一方面，本申请在第一方面的第四种实现方式中，所述凹槽的内表面上设置有凸部，所述凸部用于增长导电粒子堆积的路径。这样，凹槽的内表面上设置凸部，凸部的轮廓充当凹槽的壁面，能够增长凹槽的壁面长度，即增长导电粒子堆积的路径。
结合第一方面的第四种实现方式，本申请在第一方面的第五种实现方式中，所述凸部的截面形状为三角形或梯形或弧形。这样，保证凸部具有较长的轮廓长度。
结合第一方面的第四种实现方式，本申请在第一方面的第六种实现方式中，所述凸部的数量为多个，多个所述凸部间隔设置。这样，进一步增长凸部的轮廓长度，即进一步增长导电粒子堆积的路径。
结合第一方面的第四种实现方式，本申请在第一方面的第七种实现方式中，所述凹槽的截面形状为三角形，所述凹槽内相对的两个侧壁上均设置有所述凸部。
结合第一方面的第四种实现方式，本申请在第一方面的第八种实现方式中，所述凹槽的截面形状为梯形，所述凹槽内相对的两个侧壁上均设置有所述凸部。
第二方面，本申请实施例中提供了一种改善导电粒子聚集的导电结合结构，所述导电结合结构包括改善导电粒子聚集的FPC、改善导电粒子聚集的连接基体和异方性导电材料，其中，所述异方性导电材料包括树脂以及嵌入所述树脂的导电粒子；所述FPC包括第一基层、第二基层以及夹持于所述第一基层与所述第二基层之间的第一导电层，所述第一导电层包括间隔设置的多根第一引脚，所述第一基层裸露出所述第一引脚的端部，所述第一引脚的端部通过所述异方性导电材料与所述连接基体电连接；所述第一基层的边缘开设有凹槽，所述凹槽位于相邻两根所述第一引脚之间，所述凹槽用于增长所述导电粒子堆积的路径。
第二方面中提供的改善导电粒子聚集的导电结合结构，在第一基层的边缘、且位于相邻两根第一引脚之间开设有凹槽，异方性导电材料中的导电粒子将沿着凹槽的壁面堆积，这样，增长第一基层的边缘的相邻两根第一引脚之间导电粒子堆积的路径，降低导电粒子相互导通造成相邻两根第一引脚短路的风险。
结合第二方面，本申请在第二方面的第一种实现方式中，所述连接基体包括基材、绝缘层以及夹持于所述基材与所述绝缘层之间的第二导电层，所述第二导电层包括间隔设置的多根第二引脚，所述绝缘层裸露出所述第二引脚的端部；所述异方性导电材料夹持在所述第一引脚的端部与所述第二引脚的端部之间，所述第一引脚的端部与所述第二引脚的端部一一对应。
结合第二方面的第一种实现方式，本申请在第二方面的第二种实现方式中，所述连接基体还包括导流块，所述导流块位于相邻两根所述第二引脚之间且位于或靠近所述第二引脚待绑定的位置，所述导流块用于对所述导电粒子进行疏导。导电粒子将沿着导流块的轮廓堆积，堆积的路径较长，降低导电粒子相互导通造成相邻两根第二引脚短路的风险。
结合第二方面的第二种实现方式，本申请在第二方面的第三种实现方式中，所述导流块的数量为多个，多个所述导流块并排设置在相邻两根所述第二引脚之间。这样，多个导流块并排能够进一步增长导流块的轮廓长度，即进一步增长导电粒子堆积的路径。
结合第二方面的第二种实现方式，本申请在第二方面的第四种实现方式中，所述导流块的截面形状为多边形或椭圆形或圆形。这样，保证导流块具有较长的轮廓长度。
结合第二方面的第二种实现方式，本申请在第二方面的第五种实现方式中，所述导流块的截面形状为三角形。
结合第二方面的第五种实现方式，本申请在第二方面的第六种实现方式中，所述三角形的宽度沿背离待绑定位置的方向逐渐增加。这样，导电粒子沿着三角形的两条边堆积，堆积的路径较长。
结合第二方面的第二种实现方式，本申请在第二方面的第七种实现方式中，所述导流块的截面形状为梯形。
结合第二方面的第七种实现方式，本申请在第二方面的第八种实现方式中，所述梯形的宽度沿背离待绑定位置的方向逐渐增加。这样，导电粒子沿着梯形的两条腰和一条短边堆积，堆积的路径较长。
第三方面，本申请实施例中提供一种触控传感器，所述触控传感器包括第一方面提供的所述FPC。
第四方面，本申请实施例中提供一种触控传感器，所述触控传感器包括第二方面提供的所述导电结合结构。
第三方面和第四方面提供的触控传感器中，增长第一基层的边缘的相邻两根第一引脚之间导电粒子堆积的路径，降低导电粒子相互导通造成相邻两根第一引脚短路的风险。
附图说明
为了更清楚地说明本申请实施例的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，应当理解，以下附图仅示出了本申请的某些实施例，因此不应被看作是对范围的限定，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他相关的附图。
图1为现有的导电结合结构的结构示意图。
图2为图1中导电粒子聚集在FPC的边缘导致相应引脚短路的示意图。
图3为图1中导电粒子聚集在连接基体的边缘导致相应引脚短路的示意图。
图4为本申请实施例提供的改善导电粒子聚集的导电结合结构的示意图。
图5为图4中改善导电粒子聚集的FPC的俯视图。
图6为截面形状为三角形的凹槽的工作原理示意图。
图7为截面形状为梯形的凹槽的示意图。
图8为截面形状为半圆弧形的凹槽的示意图。
图9为多个凹槽并排的示意图。
图10为在凹槽内表面上设置凸部的示意图。
图11为图4中改善导电粒子聚集的连接基体的俯视图。
图12为截面形状为三角形的导流块的工作原理示意图。
图13为截面形状为梯形的导流块的示意图。
图14为截面形状为椭圆形的导流块的示意图。
图15为截面形状为矩形的导流块的示意图。
图16为多个导流块并排的示意图。
图标：01-导电结合结构；02-FPC；03-连接基体；04-ACF；05-导电粒子；06-引脚；100-改善导电粒子聚集的导电结合结构；110-改善导电粒子聚集的FPC；111-第一基层；112-凹槽；113-第二基层；114-第一导电层；115-第一引脚；116-凸部；120-改善导电粒子聚集的连接基体；121-基材；122-绝缘层；123-第二导电层；124-第二引脚；125-导流块；130-异方性导电材料。
具体实施方式
为使本申请实施例的目的、技术方案和优点更加清楚，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。通常在此处附图中描述和示出的本申请实施例的组件可以以各种不同的配置来布置和设计。
因此，以下对在附图中提供的本申请的实施例的详细描述并非旨在限制要求保护的本申请的范围，而是仅仅表示本申请的选定实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步定义和解释。
在本申请的描述中，需要理解的是，术语“中心”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，或者是该申请产品使用时惯常摆放的方位或位置关系，或者是本领域技术人员惯常理解的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的设备或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
此外，术语“第一”、“第二”、“第三”等仅用于区分描述，而不能理解为指示或暗示相对重要性。
在本申请的描述中，还需要说明的是，除非另有明确的规定和限定，术语“设置”、“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义。
请参阅图1，现有的导电结合结构01包括FPC02、连接基体03以及粘接在FPC02与连接基体03之间的ACF04。在制备过程中，ACF04在受热后呈液态，在按压FPC02的过程，ACF04将向周围流动，ACF04中的导电粒子05容易聚集在FPC02的绑定位置，这里的绑定位置位于FPC02的边缘(图1中A区所示)或也容易聚集在连接基体03的边缘(图1中B区所示)，也可能同时聚集在FPC02的边缘和连接基体03的边缘。
请参阅图2，在FPC02的引脚06的绑定位置，相邻两根引脚06之间堆积了过多导电粒子05，导电粒子05相互导通，导致相邻两根引脚06短路，致使导电结合结构01失效。
请参阅图3，在连接基体03的边缘，相邻两根引脚06之间堆积了过多导电粒子05，导电粒子05相互导通，导致相邻两根引脚06短路，致使导电结合结构01失效。
本申请实施例提供一种改善导电粒子聚集的导电结合结构，该导电结合结构中，在导电粒子容易聚集的区域设置有增长导电粒子堆积路径的结构，避免相邻两根引脚之间导电 粒子相互导通，从而避免相邻两根引脚短路。
请参阅图4，本申请实施例提供的改善导电粒子聚集的导电结合结构100包括改善导电粒子聚集的FPC、改善导电粒子聚集的连接基体120和异方性导电材料130，异方性导电材料130粘接在FPC与连接基体120之间。
异方性导电材料130可以选用ACF，也可以选用ACA/ACP(全称：Anisotropic conductive adhesive/paste，中文名：异方性导电胶)。异方性导电材料130包括树脂以及嵌入树脂的导电粒子05。
FPC包括第一基层111、第二基层113以及夹持于第一基层111与第二基层113之间的第一导电层114；连接基体120包括基材121、绝缘层122以及夹持于基材121与绝缘层122之间的第二导电层123；第一导电层114与第二导电层123通过异方性导电材料130电连接。
可选地，第一基层111和第二基层113可以均采用PI(全称：Polyimide，中文名：聚酰亚胺)制成，也可以均采用电磁屏蔽材料制成。
FPC的结构如图5所示，第一导电层114包括多根第一引脚115，第一引脚115间隔均匀地设置在第二基层113上。第一基层111覆盖在第一引脚115上、且裸露出第一引脚115的端部。异方性导电材料130夹持在第一引脚115的端部与连接基体120之间。
在按压FPC的过程中，异方性导电材料130中的导电粒子05将向第一基层111的边缘流动，图6中箭头表示导电粒子05的流动方向。在第一基层111的边缘、且在相邻两根第一引脚115之间开设有凹槽112。凹槽112的壁面将用于堆积导电粒子05。这样，相邻两根第一引脚115之间可供导电粒子05堆积的路径的长度将大于相邻两根第一引脚115之间的间距，降低了导电粒子05相互导通造成相邻两根第一引脚115短路的风险。
凹槽112的开口的宽度最大值等于相邻两根第一引脚115之间的间距。这样，能够使凹槽112的壁面尽量长，则相邻两根第一引脚115之间用于堆积导电粒子05的路径尽量长。凹槽112的开口的宽度的最小值不做限定，只要能够增长相邻两根第一引脚115之间用于堆积导电粒子05的路径即可。
凹槽112的深度不做具体限定，在允许的情况下，凹槽112的深度可以尽量大，以尽量增长凹槽112的壁面的长度。
可选地，请参阅图6，凹槽112的截面形状为三角形，三角形的顶点位于第一基层111的最内部。如果因导电粒子05聚集导致相邻两根第一引脚115短路，则导电粒子05堆积的路径包括凹槽112与两根第一引脚115之间的间隙、凹槽112的至少部分轮廓长度。凹槽112的至少部分轮廓长度大于凹槽112的开口的宽度、小于或等于凹槽112的壁面的长度，凹槽112的壁面的长度为三角形的两条边长之和。所以，凹槽112增长了导电粒子05堆积的路径，降低了相邻两根第一引脚115短路的风险。
可选地，凹槽112的截面形状还可以其他选择，例如梯形(如图7所示)或半圆弧形(如图8所示)等。可预想到的，凹槽112的截面形状还可以为其他多边形或弧形。
相邻两根第一引脚115之间凹槽112的数量不限定为一个，也可以为多个，多个凹槽112并排设置在相邻两根第一引脚115之间。请参阅图9，相邻两根第一引脚115之间设置有两个截面形状为三角形的凹槽112。
可以预想得到，相邻两根第一引脚115之间凹槽112的数量不限定为一个或两个，还可以有更多，例如三个、四个或五个等。相邻两根第一引脚115之间凹槽112的截面形状也不限于三角形，还可以为上述其他形状，例如多个梯形并排设置，或者不同截面形状的多个凹槽112并排设置。
可选地，请参阅图10，凹槽112的内表面上设置有凸部116，利用凸部116的轮廓长度能够增长凹槽112的壁面长度，从而增长导电粒子05堆积的路径。
凹槽112的截面形状选为梯形，凹槽112内相对的两个侧壁上均设置有凸部116。凸部116的截面形状选为三角形。可预想到，凹槽112的截面形状也可以选为三角形，同样在凹槽112内相对的两个侧壁上均设置有凸部116。
可预想到，凸部116的截面形状不限于三角形，还可以为其他多边形，例如梯形；还可以为弧形，例如半圆弧形。
可预想到，每个凹槽112内设置凸部116的数量不限定为一个或两个，还可以有更多，例如三个、四个或五个等。多个凸部116间隔设置可以进一步增长凹槽112的壁面的长度。
连接基体120的结构如图11和图4所示，第二导电层123包括多根第二引脚124，第二引脚124间隔均匀地设置的基材121上。绝缘层122覆盖在第二引脚124上、且裸露出第二引脚124的端部。异方性导电材料130粘接在第一引脚115的端部与第二引脚124的端部之间，第一引脚115的端部与第二引脚124的端部一一对应。
连接基体120还包括导流块125，导流块125设置在相邻两根第二引脚124之间、且位于或靠近第二引脚124待绑定的位置。第二引脚124待绑定的位置可以与绝缘层122的边缘相邻，可以与绝缘层122的边缘间隔一定距离。导流块125可以与绝缘层122连成一体，也可以与绝缘层122的边缘间距一定距离，但间距的距离小于一颗导电粒子05的直径。绝缘层122能够防止第二引脚124被氧化腐蚀，也能够避免第二引脚124在高温高湿环境下通电下发生银迁移、造成相邻两根第二引脚124短路。
请参阅图12，在按压FPC的过程中，导电粒子05向导流块125流动。图12中箭头表示导电粒子05的溢出方向。导流块125对导电粒子05进行疏导，使导电粒子05将沿着导流块125的轮廓堆积，这样，相邻两根第二引脚124之间可供导电粒子05堆积的路径的长度将大于相邻两根第二引脚124之间的间距，降低了导电粒子05相互导通造成相邻两根第二引脚124短路的风险。
可选地，导流块125的截面形状为三角形，三角形的宽度沿背离待绑定位置的方向逐渐增加，也就是说，三角形的一个顶点背离绝缘层122的边缘。这样，导电粒子05将沿着三角形背离绝缘层122边缘的两条边堆积。如果因导电粒子05聚集导致相邻两根第二引脚124短路，则导电粒子05堆积的路径包括三角形与两根第二引脚124之间的间隙、三角形的部分轮廓长度(三角形的部分轮廓长度指三角形两条边的至少部分长度)，且堆积的路径必须越过三角形的顶角。所以，三角形的导流块125增长了导电粒子05堆积的路径，降低了相邻两根第二引脚124短路的风险。
进一步地，导流块125的截面形状为等腰三角形，等腰三角形的顶角背离绝缘层122的边缘，等腰三角形的两条腰尽量长，使导电粒子05堆积的路径尽量长。
可选地，请参阅图13，导流块125的截面形状为梯形，梯形的宽度沿背离待绑定位置的方向逐渐增加，也就是说，梯形的短边背离绝缘层122的边缘。这样，导电粒子05将沿着梯形的两条腰和一条短边堆积。如果因导电粒子05聚集导致相邻两根第二引脚124短路，则导电粒子05堆积的路径包括梯形与两根第二引脚124之间的间隙、梯形的部分轮廓长度(梯形的部分轮廓长度指梯形两条边的至少部分长度与短边的长度之和)。所以，梯形的导流块125增长了导电粒子05堆积的路径，降低了相邻两根第二引脚124短路的风险。
进一步地，导流块125的截面形状为等腰梯形，等腰梯形的短边背离绝缘层122的边缘，等腰三角形的两条腰和短边尽量长，使导电粒子05堆积的路径尽量长。
可以预想得到，导流块125的截面形状还可以有很多选择，例如其他多边形或椭圆形或圆形。请参阅图14，即为导流块125的截面形状为椭圆形的示意图。请参阅图15，即为导流块125的截面形状为矩形的示意图。
相邻两根第二引脚124之间导流块125的数量不限定为一个，也可以为多个，多个导流块125并排设置在相邻两根第二引脚124之间。请参阅图16，相邻两根第二引脚124之间设置有两个截面形状为三角形的导流块125。两个三角形相邻的两个底角连成一体，两个三角形的顶角背离绝缘层122的边缘。如果因导电粒子05聚集导致相邻两根第二引脚124短路，则导电粒子05堆积的路径包括两个三角形与两根第二引脚124之间的间隙、两个三角形的部分轮廓长度(两个三角形的部分轮廓长度指两个三角形四条边的至少部分长度)，且堆积的路径必须越过两个三角形的两个顶角。
可以预想得到，相邻两根第二引脚124之间导流块125的数量不限定为一个或两个，还可以有更多，例如三个、四个或五个等。相邻两根第二引脚124之间导流块125的截面形状也不限于三角形，还可以为上述其他形状，例如多个梯形并排设置，或者不同截面形状的多个导流块125并排设置。
在连接基体120的制备工艺中，导流块125与绝缘层122选用相同的材料制成，并且导流块125与绝缘层122通过一次涂覆工艺同时形成。这样，相比现有连接基体120的制备工艺，本实施例中的连接基体120没有增加任何加工步骤，制备方便。
本实施例还提供一种触控传感器，触控传感器可以包括上述改善导电粒子聚集的连接 基体120，从而降低相邻两根第一引脚115因导电粒子05聚集而导致短路的风险。
本实施例还提供一种触控传感器，触控传感器可以包括上述改善导电粒子聚集的FPC，从而降低第一基层111的边缘的相邻两根第二引脚124因导电粒子05聚集而导致短路的风险。
本实施例还提供一种触控传感器，触控传感器可以包括上述改善导电粒子聚集的导电结合结构100，也就是说，触控传感器可以包括上述改善导电粒子聚集的FPC和改善导电粒子聚集的连接基体120，从而降低相邻两根第一引脚115因导电粒子05聚集而导致短路的风险，同时，降低第一基层111的边缘的相邻两根第二引脚124因导电粒子05聚集而导致短路的风险。本申请实施例提供的改善导电粒子聚集的FPC、改善导电粒子聚集的连接基体120、改善导电粒子聚集的导电结合结构100以及触控传感器，均能够降低各自内部相邻两根引脚之间发生短路的风险，提高产品的良用率和可靠性。
以上所述仅为本申请的优选实施例而已，并不用于限制本申请，对于本领域的技术人员来说，本申请可以有各种更改和变化。凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。

Claims (20)

  1. 一种改善导电粒子聚集的FPC，其特征在于，所述FPC包括第一基层(111)、第二基层(113)以及夹持于所述第一基层(111)与所述第二基层(113)之间的第一导电层(114)；
    所述第一导电层(114)包括间隔设置的多根第一引脚(115)，所述第一基层(111)裸露出所述第一引脚(115)的端部，所述第一基层(111)的边缘开设有凹槽(112)，所述凹槽(112)位于相邻两根所述第一引脚(115)之间，所述凹槽(112)用于增长导电粒子(05)堆积的路径。
  2. 根据权利要求1所述的改善导电粒子聚集的FPC，其特征在于，所述凹槽(112)的开口的宽度等于相邻两根所述第一引脚(115)之间的间距。
  3. 根据权利要求1所述的改善导电粒子聚集的FPC，其特征在于，所述凹槽(112)的数量为多个，多个所述凹槽(112)并排设置在相邻两根所述第一引脚(115)之间。
  4. 根据权利要求1所述的改善导电粒子聚集的FPC，其特征在于，所述凹槽(112)的截面形状为多边形或弧形。
  5. 根据权利要求1所述的改善导电粒子聚集的FPC，其特征在于，所述凹槽(112)的内表面上设置有凸部(116)，所述凸部(116)用于增长导电粒子(05)堆积的路径。
  6. 根据权利要求5所述的改善导电粒子聚集的FPC，其特征在于，所述凸部(116)的截面形状为三角形或梯形或弧形。
  7. 根据权利要求5所述的改善导电粒子聚集的FPC，其特征在于，所述凸部(116)的数量为多个，多个所述凸部(116)间隔设置。
  8. 根据权利要求5所述的改善导电粒子聚集的FPC，其特征在于，所述凹槽(112)的截面形状为三角形，所述凹槽(112)内相对的两个侧壁上均设置有所述凸部(116)。
  9. 根据权利要求5所述的改善导电粒子聚集的FPC，其特征在于，所述凹槽(112)的截面形状为梯形，所述凹槽(112)内相对的两个侧壁上均设置有所述凸部(116)。
  10. 一种改善导电粒子聚集的导电结合结构，其特征在于，所述导电结合结构包括改善导电粒子聚集的FPC、改善导电粒子聚集的连接基体(120)和异方性导电材料(130)，其中，所述异方性导电材料(130)包括树脂以及嵌入所述树脂的导电粒子(05)；
    所述FPC包括第一基层(111)、第二基层(113)以及夹持于所述第一基层(111)与所述第二基层(113)之间的第一导电层(114)，所述第一导电层(114)包括间隔设置的多根第一引脚(115)，所述第一基层(111)裸露出所述第一引脚(115)的端部，所述第一引脚(115)的端部通过所述异方性导电材料(130)与所述连接基体(120)电连接；
    所述第一基层(111)的边缘开设有凹槽(112)，所述凹槽(112)位于相邻两根所述第一引脚(115)之间，所述凹槽(112)用于增长所述导电粒子(05)堆积的路径。
  11. 根据权利要求10所述的改善导电粒子聚集的导电结合结构，其特征在于，所述连接基体(120)包括基材(121)、绝缘层(122)以及夹持于所述基材(121)与所述绝缘层(122)之间的第二导电层(123)，所述第二导电层(123)包括间隔设置的多根第二引脚(124)，所述绝缘层(122)裸露出所述第二引脚(124)的端部；
    所述异方性导电材料(130)夹持在所述第一引脚(115)的端部与所述第二引脚(124)的端部之间，所述第一引脚(115)的端部与所述第二引脚(124)的端部一一对应。
  12. 根据权利要求11所述的改善导电粒子聚集的导电结合结构，其特征在于，所述连接基体(120)还包括导流块(125)，所述导流块(125)位于相邻两根所述第二引脚(124)之间且位于或靠近所述第一引脚(115)待绑定的位置，所述导流块(125)用于对所述导电粒子(05)进行疏导。
  13. 根据权利要求12所述的改善导电粒子聚集的导电结合结构，其特征在于，所述导流块(125)的数量为多个，多个所述导流块(125)并排设置在相邻两根所述第二引脚(124)之间。
  14. 根据权利要求12所述的改善导电粒子聚集的导电结合结构，其特征在于，所述导流块(125)的截面形状为多边形或椭圆形或圆形。
  15. 根据权利要求12所述的改善导电粒子聚集的导电结合结构，其特征在于，所述导流块(125)的截面形状为三角形。
  16. 根据权利要求15所述的改善导电粒子聚集的导电结合结构，其特征在于，所述三角形的宽度沿背离待绑定位置的方向逐渐增加。
  17. 根据权利要求12所述的改善导电粒子聚集的导电结合结构，其特征在于，所述导流块(125)的截面形状为梯形。
  18. 根据权利要求17所述的改善导电粒子聚集的导电结合结构，其特征在于，所述梯形的宽度沿背离待绑定位置的方向逐渐增加。
  19. 一种触控传感器，其特征在于，所述触控传感器包括权利要求1至9任一项所述FPC。
  20. 一种触控传感器，其特征在于，所述触控传感器包括权利要求10至18任一项所述导电结合结构。
PCT/CN2018/125018 2018-12-28 2018-12-28 一种改善导电粒子聚集的fpc、导电结合结构和触控传感器 Ceased WO2020133260A1 (zh)

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