WO2020125646A1 - 一种光学次模块及光模块 - Google Patents

一种光学次模块及光模块 Download PDF

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Publication number
WO2020125646A1
WO2020125646A1 PCT/CN2019/126061 CN2019126061W WO2020125646A1 WO 2020125646 A1 WO2020125646 A1 WO 2020125646A1 CN 2019126061 W CN2019126061 W CN 2019126061W WO 2020125646 A1 WO2020125646 A1 WO 2020125646A1
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WO
WIPO (PCT)
Prior art keywords
plate
upper cover
housing
optical
side plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/126061
Other languages
English (en)
French (fr)
Inventor
付孟博
谢一帆
傅钦豪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hisense Broadband Multimedia Technology Co Ltd
Original Assignee
Hisense Broadband Multimedia Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201811543875.0A external-priority patent/CN109407235B/zh
Priority claimed from CN201811540334.2A external-priority patent/CN109407233B/zh
Application filed by Hisense Broadband Multimedia Technology Co Ltd filed Critical Hisense Broadband Multimedia Technology Co Ltd
Publication of WO2020125646A1 publication Critical patent/WO2020125646A1/zh
Priority to US17/162,173 priority Critical patent/US11828993B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4267—Reduction of thermal stress, e.g. by selecting thermal coefficient of materials
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/50—Transmitters
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/60—Receivers

Definitions

  • the present application relates to the technical field of optical communication, in particular to an optical sub-module and an optical module.
  • Optical module usually refers to an integrated module used for photoelectric conversion, which can convert optical signals into electrical signals or electrical signals into optical signals, and plays an important role in the field of optical communication.
  • the optical module is mainly composed of an optical sub-module and a functional circuit, that is, a circuit board assembly.
  • the optical sub-module is encapsulated with photoelectric cells such as laser chips and/or photodetectors.
  • the optical sub-module is electrically connected to the circuit board assembly.
  • the circuit board assembly is connected to the external host computer to realize power supply and electrical signal transmission.
  • the optical sub-module is connected to the external Optical transmission media such as optical fibers are connected to achieve optical transmission.
  • optical sub-module is to use an optical BOX packaging structure to encapsulate optical devices such as laser chips to achieve optical transmission.
  • commonly used optical sub-modules include an upper cover 3, a housing 2, a metal substrate 5, an optical device 4, and an electrical device 1.
  • the upper cover 3 and the housing 2 are combined into an optical BOX packaging structure to form In the cavity for packaging the optical sub-module, the metal substrate 5 is placed in the cavity, the optical device 4 is fixed on the metal substrate 5, and the electrical device 1 is connected to one end of the housing 2.
  • the upper cover plate 3 is a solid flat plate structure.
  • the upper cover plate 3 and the housing 2 are sealed by glue to achieve a sealed package, and are connected to the PCB through a flexible board.
  • the glue used for sealing between the upper cover 3 and the casing 2 of the BOX packaging structure is waterproof sealing glue
  • the expansion coefficient of the waterproof sealing glue is relatively large, and the smallest can reach 30 ⁇ 10-6.K-1
  • the expansion coefficient of the metal parts in the optical module is only about 5-6 ⁇ 10-6.K-1. Because the waterproof sealant contains quartz crystals with a diameter of 30um, the hardness after thermal expansion is higher.
  • the expansion of the same amount of glue will be greater than that of the same size of metal
  • the amount of expansion is about 5 times greater, so a squeezing force will be formed on the housing 2 and the upper cover plate 3, so that both the housing 2 and the upper cover plate 3 will be deformed to a certain extent.
  • the same amount of squeezing force acts on the housing 2 and the upper cover 3, the deformation of the housing 2 and the upper cover 3 will be different, the deformation of the housing 2 exceeds the deformation of the upper cover 3 too much, Affect the optical path of the optical device, causing the optical path to deviate from the original design position, making the light transmission effect poor.
  • the present application provides an optical sub-module and an optical module to solve the problem of poor optical transmission effect of the optical sub-module.
  • the present application provides an optical sub-module including: a housing, an upper cover plate and an optical device; the upper cover plate is placed on the housing, and the housing and the upper cover plate form a receiving cavity; the optical device is placed in the receiving cavity and fixed On the bottom surface of the casing; the upper cover plate includes a top plate and side plates perpendicular to the top plate; the side plates are connected to the casing through a layer of glue; the expansion coefficients of the glue layer are respectively greater than the expansion coefficient of the casing and the upper cover The coefficient of expansion of the board.
  • an optical sub-module and an optical module provided by the embodiments of the present application include an optical sub-module and a circuit board;
  • the optical sub-module includes: a housing, an upper cover plate and an optical device, and the upper cover plate is placed in the housing An accommodating cavity is formed on the top, and the optical device is placed in the accommodating cavity and fixed on the bottom surface of the housing;
  • the upper cover plate includes a top plate and a side plate perpendicular to the top plate; the side plate is connected to the housing through a glue layer, and the expansion coefficients of the glue layer are greater than
  • the expansion coefficient of the housing and the expansion cover of the upper cover plate make the optical submodule provided in this application have a higher degree of expansion of the glue layer than the housing and the upper cover plate at a higher temperature; the expanded glue generates thrust on the housing and the upper cover plate When the pushing force acts on the side plate of the upper cover plate, a moment is formed.
  • the structure of the upper cover plate makes it easier to deform than the outer shell, and then the upper cover plate is deformed to provide space for the expansion of the glue to make the outer shell form.
  • the variable becomes smaller, thereby improving the influence on the position of the optical device, so as to reduce the influence of the optical sub-module on the optical path, and improve the optical transmission effect.
  • the casing includes a bottom plate and a side wall plate perpendicular to the bottom plate; a recessed platform is provided at the top of the side wall plate, and the inner side wall of the recessed platform is respectively connected to the side panel through the glue layer The outer side wall is connected.
  • the bottom end of the top plate is located above the top end of the housing.
  • the height of the glue layer is smaller than the height of the side plate.
  • the upper cover plate has a lower rigidity than the outer shell.
  • the side panel includes: a first side panel, a second side panel, a third side panel, and a fourth side panel; the first side panel and the second side panel are disposed opposite to the top panel At both ends, the third side plate and the fourth side plate are provided at the other opposite ends of the top plate; the first side plate, the second side plate, the third side plate and all The fourth side plate is perpendicular to the top plate respectively; the first side plate, the third side plate, the second side plate and the fourth side plate are vertically connected in order end to end.
  • the width H2 of the first side plate accounts for 60%-80% of the width H1 of the recess.
  • the side plate is located in the receiving cavity formed by the housing and the upper cover plate, and the inner side of the side plate and the side wall is adhered by glue.
  • the side plate is located in the housing formed by the housing and the upper cover plate, and the outer side of the side plate and the side wall are bonded by glue.
  • the height of the side plate of the upper cover plate is smaller than the height of the side wall plate of the housing.
  • the upper cover plate has a smaller expansion coefficient than the outer shell.
  • the upper cover plate has a lower yield strength than the outer shell.
  • the embodiments of the present application provide an optical module, and the optical module includes the above optical submodule.
  • a cavity for accommodating optical devices is formed on the upper cover plate and the housing, the optical devices are placed on the bottom plate of the housing, and the side plates of the upper cover plate and the side walls of the housing are adhered by glue. Then, since the expansion coefficients of the glue are greater than the expansion coefficients of the casing and the upper cover, respectively, the volume of the glue after expansion is significantly larger than that of the casing and the upper cover, which will squeeze the upper cover and the casing. There is glue in between, the glue directly squeezes the side plates and the side walls, and the cover plate is provided with side plates.
  • the upper cover plate is more easily deformed by force and provides a room for the expanded glue to release the glue
  • the squeezing force after expansion reduces the influence of the deformation of the housing on the position of the optical device, and improves the problem of the decrease in optical power.
  • Figure 1 is a schematic structural diagram of a typical optical sub-module
  • FIG. 2 is a side view of a typical optical sub-module
  • FIG. 3 is a schematic structural diagram of an optical sub-module provided by an embodiment of the present application.
  • FIG. 4 is a side view of an optical sub-module provided by an embodiment of this application.
  • FIG. 5 is a schematic structural diagram of an upper cover plate provided by an embodiment of the present application.
  • FIG. 6 is a partial exploded view of an optical sub-module provided by an embodiment of this application.
  • FIG. 7 is a combination diagram of FIG. 6;
  • FIG. 8 is a perspective view of a housing provided by an embodiment of this application.
  • Figure 9(a) and Figure 9(b) are simulation results of a typical optical sub-module
  • 10(a) and 10(b) are simulation result diagrams of the optical sub-module provided by the embodiment of the present application.
  • FIG. 11 is a schematic structural diagram of an optical module provided by an embodiment of the present application.
  • FIG. 13 is a schematic diagram of the force of the optical sub-module provided by the embodiment of the present application.
  • FIG. 14 is a cross-sectional view of another optical sub-module provided by an embodiment of the present application.
  • 15 is a schematic diagram of the force of another optical sub-module provided by an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of an optical sub-module provided by an embodiment of the present application
  • FIG. 4 is a side view of the optical sub-module provided by an embodiment of the present application.
  • the optical sub-module provided by the embodiment of the present application is used in the optical module shown in FIG. 11, the optical sub-module and the circuit board assembly are electrically connected to form an optical module, and the circuit board assembly and the external host
  • the machine connection realizes power supply and electric signal transmission
  • the optical sub-module is connected with external optical fibers and other light transmission media to realize optical transmission.
  • the optical sub-module provided in this embodiment includes: a housing 2, an upper cover 3 and an optical device 4.
  • the light-emitting submodule and/or light-receiving submodule in the embodiment of the present application are packaged in an optical box BOX manner.
  • the optical box includes a housing 2 and an upper cover plate 3, and forms a sealed cavity with the upper cover plate 3.
  • the casing 2 is a frame-like structure provided with an opening on one side, and its longitudinal section is concave, so that the interior of the casing 2 has a cavity, and the cavity is used to accommodate optical devices, electrical devices, and the like.
  • the upper cover plate 3 is placed on the housing 2 so that the housing 2 and the upper cover plate 3 form a receiving cavity.
  • the optical sub-module further includes an optical device 4, the optical device 4 is placed in the accommodating cavity, and the optical device 4 is fixed on the bottom surface of the housing 2.
  • the optical device may be directly fixed on the bottom surface of the housing 2; or it may be indirectly fixed on the bottom surface, that is, a substrate is provided on the bottom surface, and the optical device 4 is provided on the substrate. Regardless of whether the optical device 4 is directly or indirectly disposed on the bottom surface, the deformation of the bottom surface will affect the position of the optical device 4 and thus affect the preset optical path.
  • the optical sub-module is connected to an external optical fiber and other optical transmission media to realize optical transmission.
  • Common optical devices include optical multiplexing/demultiplexing devices, lenses, and optical chips (laser chips or light receiving chips).
  • the optical sub-module provided in this embodiment includes: a housing 2, an upper cover 3, optical devices (optical chips, optical multiplexing/demultiplexing devices and lenses), and optical fiber sockets 7, optical multiplexing/demultiplexing devices, and optical chips ( Laser chip or light receiving chip), lens and other optical devices are set on the bottom plate of the housing 2, the optical fiber socket is set on the side wall of the housing 2, and the optical fiber adapter is inserted into the optical fiber socket to realize the light inside and outside the optical submodule through the optical fiber adapter connection.
  • the light emitted by the laser chip enters the optical fiber for external transmission through the optical multiplexing/demultiplexing device and/or lens, light socket and fiber adapter; when the optical sub-module includes the light receiving chip, The light transmitted from the optical fiber passes through the optical fiber adapter, the light socket, the optical multiplexing/demultiplexing device and/or the lens, and is finally received by the light receiving chip.
  • the structure of the upper cover plate 3 is improved in this embodiment, that is, the flat cover plate 3 is modified into a groove-shaped upper cover plate 3.
  • the upper cover plate 3 includes a top plate 35 and side plates perpendicular to the top plate 35, so that the upper cover plate 3 forms a groove structure.
  • the cross-sectional view of the optical submodule shows the upper cover 3, the housing 2, the optical device 4, and the optical fiber socket 7.
  • the optical device is provided on the bottom plate of the housing 2, and the optical fiber socket 7 is provided on the side wall of the housing 2
  • the upper cover 3 and the housing 2 form a sealed cavity.
  • the position change of the optical device and the optical fiber socket will change the preset optical path, and the preset optical path is designed according to the optimal optical power, and the change of the preset optical path will cause the optical power to decrease.
  • the upper cover plate 3 is placed on the side wall of the housing 2, the upper cover plate 3 has a side plate extending into the cavity, the side plate and the cover plate body have different extension directions, the side plate Adhesion to the side wall through a glue layer; the side plate is bonded to the inside of the side wall with glue; the side wall is used to bond the surface of the side plate, and the side wall is used to support the surface of the cover plate, which is a different surface .
  • the glue expands due to heat. Since the expansion coefficient of the glue layer is greater than the expansion coefficient of the casing and the expansion coefficient of the upper cover plate respectively, the volume of the glue increases after expansion, which will squeeze the casing or upper cover plate and deform the casing or upper cover plate .
  • the purpose of the embodiments of the present application is to allow the upper cover plate to undergo a larger deformation to balance the squeezing force, and the outer shell to undergo a smaller deformation or not to deform to balance the squeezing force.
  • the side panels of the present application include: a first side panel 31, a second side panel 32, a third side panel 33, and a fourth side panel 34, each side panel surrounding the top panel 35; the first side panel 31 and the second The side plates 32 are provided at opposite ends of the top plate 35, the third side plate 33 and the fourth side plate 34 are provided at the other opposite ends of the top plate 35, and the first side plate 31, the second side plate 32, and the third side The plate 33 and the fourth side plate 34 are perpendicular to the top plate 35 respectively; the first side plate 31, the third side plate 33, the second side plate 32, and the fourth side plate 34 are vertically connected in order end to end, so that the upper cover plate 3 forms a recess Groove structure; adjacent two side plates are perpendicular to each other, and opposite two side plates are parallel to each other, the first side plate 31, the second side plate 32, the third side plate 33 and the fourth side plate 34 along the outer edge of the top plate 35
  • the secondary connection forms a profiled cover plate with a groove inside.
  • the first side plate 31, the second side plate 32, the third side plate 33, and the fourth side plate 34 are in contact with the housing 2, so that The groove formed by the upper cover plate 3 is combined with the cavity of the housing 2 to form an accommodating cavity, so as to increase the accommodating space of the optical sub-module and avoid affecting the optical path.
  • the first side plate 31, the second side plate 32, the third side plate 33 and the fourth side plate 34 are connected to the housing 2 through the glue layer 6 respectively.
  • the expansion coefficient of the glue layer is greater than the expansion coefficient of the casing and the expansion coefficient of the upper cover plate respectively, so that the expanded glue will generate a thrust force on the casing 2 and the upper cover plate 3, and the thrust force acts on the groove-shaped upper cover A moment is formed on the first side plate 31, the second side plate 32, the third side plate 33, and the fourth side plate 34 of the plate 3.
  • the generation of torque will make the groove-shaped upper cover plate 3 easier to deform, and then the expansion of the glue on the cover plate to provide space to make the deformation of the housing smaller, thus improving the light
  • the influence of the position of the device can further prevent the deformation from being transmitted to the housing 2.
  • the casing 2 does not deform or the deformation is very small, thereby greatly reducing the influence on the optical path.
  • the expansion of the glue requires enough space to generate squeezing force in all directions, and the squeezing force in the horizontal direction will affect the deformation of the housing or the upper cover.
  • the side wall of the shell will be subjected to squeezing force away from the interior direction of the cavity, while the side plate of the upper cover plate will be subjected to squeezing force toward the interior direction of the cavity, and the upper cover plate is more likely to be deformed by force to provide expanded glue Accommodating space to release the squeezing force after the glue expands, thereby reducing the squeezing force received by the housing, reducing the deformation of the housing, and then weakening the influence of the housing deformation on the position of the optical device, which is conducive to the maintenance of the preset optical path and improves the optical power The problem of decline.
  • the height of the side plate of the upper cover plate is smaller than the height of the side wall of the housing, the volume of the upper cover plate is smaller than the volume of the housing, and the deformation is more likely to occur under force.
  • the deformation of the upper cover plate provides sufficient expansion space to avoid the occurrence of the housing deformation.
  • the upper cover plate is more likely to be deformed, providing sufficient expansion space for the glue, improving the deformation of the housing, reducing the impact on the preset optical path on the bottom plate of the housing, and improving the problem of optical power drop .
  • the upper cover plate In order to make the upper cover plate easier to deform, materials with different expansion coefficients can be used for the upper cover plate and the outer shell.
  • the expansion coefficient of the cover plate is smaller than that of the outer shell.
  • the upper cover and the housing can use different stiffness materials.
  • the rigidity of the upper cover is less than the rigidity of the housing. When the same force is applied, the upper cover is more likely to deform.
  • the cover plate and the outer shell In order to make the upper cover plate easier to deform, materials with different yield strengths can be used for the cover plate and the outer shell.
  • the yield strength of the upper cover plate is less than the yield strength of the outer shell, and the upper cover plate is more likely to deform.
  • the upper cover plate 3 provided in this embodiment may adopt an integrally formed structure.
  • the upper cover plate and the outer shell use the same material, for example, Kovar alloy.
  • the upper cover plate is designed more than before It is easier to deform; the upper cover can be made of different materials from the outer shell. Based on the different deformation characteristics of the material, on the basis of the above structure, the upper cover can be deformed more easily.
  • the upper cover can also be processed and welded with different materials.
  • the top plate 35 may be made of a material with a high heat dissipation coefficient such as tungsten copper material, so as to increase the heat dissipation speed of the optical sub-module and prevent the temperature from being too high to affect the light The normal use of devices and electrical devices.
  • the first side plate 31, the second side plate 32, the third side plate 33, and the fourth side plate 34 can be made of materials such as Kovar alloy materials that are easy to weld, process, and have a high expansion coefficient, which can improve the upper cover plate 3 Wear resistance.
  • the upper cover plate 3 made of the above materials has the characteristics of not only absorbing stress effectively but also dissipating heat better.
  • the top plate 35 Is located above the top of the housing 2.
  • the height of the top plate 35 is set higher than the top of the housing 2, that is, the top plate 35 is located above the top of the recess 21, so that the outer side wall of the top plate 35 does not contact the glue layer 6, and the glue layer 6 will not cause stress to the top plate 35 when it expands. Or the generated stress is small, and the stress generated on the side plate is greater than the stress generated on the top plate 35, making the side plate more likely to deform.
  • the height of the glue layer 6 is smaller than the height of the side plate.
  • the area of the side wall outer wall coated with the glue layer 6 is smaller than the overall area of the side wall outer wall, so that the glue layer 6 does not cover the side wall outer wall, that is, the portion of the side plate close to the top plate 35 does not touch the glue layer 6, It is also possible that the glue layer 6 is not in contact with the outer side wall of the top plate 35. The stress generated on the side plate when the glue layer 6 expands is greater than the stress on the top plate 35, making the side plate more likely to deform.
  • an anticorrosive layer may be provided on the surface of the upper cover plate 3, for example, the anticorrosive material is electroplated on the surface of the upper cover plate 3 by electroplating.
  • the casing 2 includes a bottom plate and a side wall plate perpendicular to the bottom plate. The side wall plate surrounds the bottom plate so that the casing 2 forms a cavity. The height of the side wall plate of the housing 2 is greater than the height of the side plates of the upper cover plate 3, so that the depth of the groove formed by the housing 2 is greater than the depth of the groove formed by the upper cover plate 3.
  • the housing 2 Because the size of the housing 2 is larger than the size of the upper cover 3, the housing 2 has a stronger ability to withstand the thrust of the expansion glue and is less likely to deform; and the upper cover 3 has a weaker thrust capacity to withstand the expansion glue and is more likely to deform, which can be improved
  • the housing 2 easily affects the optical path.
  • the worker needs to align the side of the upper cover 3 with the side of the housing 2 to ensure that the structure of the optical sub-module is neat and avoid Affect the deformation effect.
  • manual alignment operation is not easy to control, and when the glue is added, a force will be generated on the upper cover plate 3 or the housing 2, so that the upper cover plate 3 and the housing 2 are misaligned.
  • a recess 21 is provided at the top of the side wall plate of the housing 2.
  • the projection shape of the recess 21 is the same as the projection shape of the upper cover 3.
  • the plane of the recess is used to support the upper cover and the boss
  • the side wall is used for bonding with the side plate of the upper cover plate by glue.
  • the upper cover plate 3 can be snap-fitted with the top of the housing 2, and the upper cover plate 3 is initially restricted by the concave table 21 to avoid misalignment. There is a gap between the upper cover plate 3 and the recess 21 to facilitate the sealing by adding glue, and the upper cover plate 3 and the top of the housing 2 are fixed by the glue layer 6.
  • the top plate 35 In order to increase the space of the accommodating cavity of the optical sub-module, the top plate 35 needs to be located above the concave table 21, and the side plate of the upper cover plate 3 is in contact with the concave table 21, that is, the groove of the upper cover plate 3 and the housing 2 are empty Cavity combined.
  • connection parts are the outer side walls of the first side plate 31, the second side plate 32, the third side plate 33, and the fourth side plate 34, respectively. And, the inner side wall of the recess 21.
  • the glue layer 6 is located between the concave table 21 and the side plates, and the glue drops are added between the inner side wall of the concave table 21 and each opposite side plate, so that the concave table 21 passes through the glue layer 6 and the first side plate 31, the second The side plate 32, the third side plate 33, and the fourth side plate 34 are connected to achieve the fixing of the upper cover plate 3 and the housing 2.
  • the dropping thickness of the glue layer 6 is related to the size of the reserved gap between the concave table 21 and the upper cover plate 3, so as to achieve fixation without wasting glue.
  • the size of the reserved gap between the concave table 21 and each side plate of the upper cover plate 3 is set to be 0.05 mm-0.1 mm, that is, the thickness of the glue layer 6 is 0.05 mm-0.1 mm.
  • the thickness of the glue layer 6 can be set to 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, or 0.1 mm, etc., which is not specifically limited in this embodiment.
  • the width of each side plate of the upper cover plate 3 is set to be smaller than that of the concave table 21 width.
  • the width H2 of the first side plate 31 accounts for 60% to 80% of the width H1 of the recess 21.
  • the width of the recess 21 is greater than the width of the first side plate 31, that is, the ratio of the width H2 of the first side plate 31 to the width H1 of the recess 21 may be 60%, 65%, 70%, 75%, 80%, etc., preferably the width H2 of the first side plate 31 occupies 70% of the width H1 of the recess 21.
  • the thickness of the upper cover plate 3 should not be too thick, and the length and width are determined according to the size of the housing 2, and generally the sealable housing 2 shall prevail.
  • the thickness of the top plate 35 it is necessary to make the thickness of the top plate 35 smaller than the thickness of the side plates on the premise of satisfying the requirements of normal use, that is, in this embodiment, the thickness d1 of the top plate 35 takes the first place
  • the width H2 of the side plate 31 is 45%-55%.
  • the thickness of the side plate is designed to be greater than the thickness of the top plate 35. That is, the thickness d1 of the top plate 35 occupies 45%, 50%, or 55% of the width H2 of the first side plate 31.
  • a light-transmitting port 7 is provided on the side wall of the housing 2 perpendicular to the longitudinal direction, and an adapter 1 is installed at the light-transmitting port 7.
  • a light-transmitting port 7 is provided at one end of the housing 2 for installing the adapter 1 to connect the optical sub-module with other electronic devices.
  • the end of the housing 2 opposite to the light-transmitting port 7 is provided with an opening slot 8, which is used to connect the circuit board.
  • a wire escape groove 9 is provided in the accommodating cavity, and is provided on the inner side wall of the housing 2 to reserve an operation space so as to facilitate subsequent connection of the gold wire to the circuit board.
  • the optical sub-module provided in this embodiment is compared with a typical optical sub-module in the following simulation.
  • FIGS. 10(a) and 10(b) are simulation result diagrams of the optical sub-module provided by this embodiment.
  • the maximum deformation of the upper cover plate 3 is 3.19um, and the maximum deformation of the housing 2 is 1.44um, that is, it is depressed by the same amount of squeezing force of the glue
  • the upper cover plate 3 of the groove is the one that mainly absorbs strain, and the deformation of the housing 2 will be smaller.
  • the deformation of the housing 2 provided in this embodiment is reduced by nearly 4 times, thereby reducing the impact on the stability of the optical path. Make the optical performance of the optical module more stable.
  • the upper cover plate 3 of the optical sub-module is designed as a grooved shaped plate, which can effectively absorb the stress and make the optical path not Affected by the stress deformation, the process is reduced, which is more advantageous for the stability of the optical path.
  • the upper cover plate 3 is placed on the side wall of the housing 2.
  • the upper cover plate 3 has a side plate extending along the outer side of the side wall, and the side plate and the cover plate body have Different extension directions, unlike the structure shown above, the side plate of the upper cover plate is outside the cavity; the side plate and the side wall are glued together; the side plate and the inner side of the side wall are glued together; The surface to which the wall and the side plate are bonded is different from the surface on which the side wall supports the upper cover plate.
  • the glue dispensing position is located outside the cavity, which can prevent the glue from flowing into the cavity and prevent the uncontrollable flow of glue from affecting the devices or the optical path inside the cavity.
  • the glue expands due to heat. Since the expansion coefficient of the glue layer is greater than the expansion coefficient of the casing and the expansion coefficient of the upper cover plate, respectively, the expansion of the glue will squeeze the casing or the upper cover plate and deform the casing or the upper cover plate.
  • the purpose of the embodiments of the present application is to allow the upper cover plate to undergo a larger deformation to balance the squeezing force, and the outer shell to undergo a smaller deformation or not to deform to balance the squeezing force.
  • the expansion of the glue requires enough space to generate squeezing force in various directions, and the squeezing force in the horizontal direction will affect the deformation of the housing or the upper cover.
  • the side wall of the casing will be subjected to squeezing force toward the inside of the cavity, and the side plate of the upper cover plate will be subjected to squeezing force away from the direction of the cavity.
  • the cover plate is more easily deformed by force, and provides a room for the expanded glue to release the squeezing force of the expanded glue, thereby reducing the squeezing force of the casing and reducing the deformation of the casing.
  • the influence of the deformation of the housing on the position of the optical device is reduced, which is beneficial to the maintenance of the preset optical path and improves the problem of the drop of optical power;
  • the height of the side plate of the upper cover plate is smaller than the height of the side wall of the housing, and the volume of the upper cover plate is smaller than the volume of the housing, and the deformation of the upper cover plate is more likely to occur.
  • the deformation of the upper cover plate is shown in Figure 15, through the upper cover plate The deformation of the glue provides enough expansion space to avoid deformation of the shell.
  • an embodiment of the present application further provides an optical module, including a filter device 400, a circuit board 500, and the optical sub-module 300 described in the above embodiment, the circuit board 500 is connected to the optical sub-module 300 through an opening slot
  • the optical sub-module 300 is packaged with optical devices and electrical devices; the optical sub-module 300 and the circuit board 500 are packaged in a cavity formed by the housing 100 and the base 200.
  • the function of the optical module is photoelectric conversion.
  • the transmitting end converts the electrical signal into an optical signal. After transmitting through the optical fiber, the receiving end converts the optical signal into an electrical signal.
  • an optical sub-module and an optical module provided by the embodiments of the present application include an optical sub-module and a circuit board;
  • the optical sub-module includes: a housing 2, an upper cover 3, and an optical device 4, the upper cover 3 is placed on the housing 2 to form an accommodating cavity, and the optical device 4 is placed in the accommodating cavity and fixed on the bottom surface of the housing 2;
  • the upper cover plate 3 includes a top plate 35 and side plates perpendicular to the top plate 35 to form the upper cover plate 3 Groove structure;
  • the side plate is connected to the casing 2 through the glue layer 6, the expansion coefficient of the glue layer 6 is greater than the expansion coefficient of the casing 2 and the expansion coefficient of the upper cover plate 3, respectively, so that the optical sub-module provided by the present application is baked at high temperature ,
  • the expansion of the glue layer 6 is greater than that of the housing 2 and the upper cover 3; the expanded glue generates a thrust on the housing 2 and the upper cover 3, and when the thrust acts on the side plate, a moment is formed

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Abstract

一种光学次模块及光模块，光模块包括光学次模块和电路板；光学次模块中，上盖板（3）置于外壳（2）上形成容纳腔，光器件（4）置于容纳腔内，且固定在外壳（2）的底面上；上盖板（2）包括顶板（35）和垂直于顶板（35）的侧板；侧板通过胶水层（6）与外壳（2）连接，胶水层（6）的膨胀系数分别大于外壳（2）的膨胀系数和上盖板（3）的膨胀系数，使得光学次模块在高温烘烤时，胶水层（6）的膨胀度要大于外壳（2）和上盖板（3）；膨胀的胶水对外壳（2）和上盖板（3）产生推力，该推力作用在侧板上时，形成力矩，使上盖板（3）较外壳（2）更容易产生形变，进而可防止形变传递到外壳（2）上。而外壳（2）产生的形变量变小，会改善影响光路的情况。

Description

一种光学次模块及光模块
本申请要求在2018年12月17日提交中国专利局、申请号为201811540334.2、发明名称为“一种光学次模块及光模块”，以及在2018年12月17日提交中国专利局、申请号为201811543875.0、发明名称为“一种光学次模块及光模块”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及光通信技术领域，尤其涉及一种光学次模块及光模块。
背景技术
光模块通常指用于光电转换的一种集成模块，可以将光信号转换为电信号，或者将电信号转换为光信号，在光通信领域发挥着重要作用。光模块主要由光学次模块和功能电路，即电路板组件构成。光学次模块里封装有激光芯片和/或光探测器等光电芯，光学次模块与电路板组件之间电连接，电路板组件与外部上位机连接实现供电及电信号传输，光学次模块与外部光纤等传光介质连接实现光传输。
光学次模块的一种实现方式为：采用光学BOX封装结构来封装激光芯片等光学器件，以实现光传输。如图1和图2所示，常用的光学次模块包括上盖板3、外壳2、金属基板5、光学器件4和电器件1，上盖板3和外壳2结合成光学BOX封装结构，形成用于封装光学次模块的腔体，金属基板5置于腔体内，光学器件4固定在金属基板5上，电器件1与外壳2的一端连接。上盖板3为实心平板结构，上盖板3与外壳2之间通过胶水粘结实现密封封装，并通过柔板与PCB连接。
但是，由于BOX封装结构的上盖板3与外壳2之间用于密封的胶水为防水密封胶水，防水密封胶水的膨胀系数都比较大，最小的也可达到30×10-6.K-1，而光模块中金属件的膨胀系数只有5～6×10-6.K-1左右。由于防水密封胶水中含有直径为30um大小的石英晶粒，受热膨胀后的硬度较高，在光学次模块生产过程中，经过高温烘烤后，相同大小量的胶水膨胀量会比相同大小的金属膨胀量大5倍左右，因此会对外壳2和上盖板3形成挤压力，使外壳2和上盖板3均会产生一定程度的形变。而同样大小的挤压力作用在外壳2和上盖板3上，外壳2和上盖板3所产生的形变则会有所不同，外壳2的形变量超出上盖板3形变量过多，影响光学器件的光路，导致光路偏离原设计位置，使得光传输效果不佳。
发明内容
本申请提供一种光学次模块及光模块，以解决光学次模块光传输效果不佳的问题。
本申请提供一种光学次模块，包括：外壳、上盖板和光器件；所述上盖板置于外壳上，外壳和上盖板形成容纳腔；所述光器件置于容纳腔内，且固定在外壳的底面上；所述上盖板包括顶板和垂直于所述顶板的侧板；所述侧板通过胶水层与外壳连接；所述胶水层的膨胀系数分别大于外壳的膨胀系数和上盖板的膨胀系数。
由以上技术方案可知，本申请实施例提供的一种光学次模块及光模块，光模块包括光 学次模块和电路板；光学次模块包括：外壳、上盖板和光器件，上盖板置于外壳上形成容纳腔，光器件置于容纳腔内，且固定在外壳的底面上；上盖板包括顶板和垂直于顶板的侧板；侧板通过胶水层与外壳连接，胶水层的膨胀系数分别大于外壳的膨胀系数和上盖板的膨胀系数，使得本申请提供的光学次模块在较高温度下，胶水层的膨胀度要大于外壳和上盖板；膨胀的胶水对外壳和上盖板产生推力，该推力作用在上盖板的侧板上时，形成力矩，上盖板的结构使其较外壳更容易产生形变，进而通过上盖板的形变为胶水的膨胀提供空间，使外壳产生的形变量变小，从而改善对光器件的位置的影响，以减轻光学次模块对光路的影响，提高光传输效果。
可选的，所述外壳包括底板和垂直于所述底板的侧壁板；所述侧壁板的顶端设有凹台，所述凹台的内侧壁通过所述胶水层分别与所述侧板的外侧壁连接。
可选的，所述顶板的底端位于所述外壳顶端的上方。
可选的，所述胶水层的高度小于所述侧板的高度。
可选的，所述上盖板比所述外壳具有更小的刚度。
可选的，所述侧板包括：第一侧板、第二侧板、第三侧板和第四侧板；所述第一侧板和所述第二侧板设于所述顶板的相对两端，所述第三侧板和所述第四侧板设于所述顶板的另一相对两端；所述第一侧板、所述第二侧板、所述第三侧板和所述第四侧板分别与所述顶板垂直；所述第一侧板、所述第三侧板、所述第二侧板和所述第四侧板首尾依次垂直连接。
可选的，所述第一侧板的宽度H2占所述凹台的宽度H1的60％-80％。
可选的，所述侧板位于所述外壳和所述上盖板形成容纳腔内，所述侧板与所述侧壁的内侧通过胶水粘接。
可选的，所述侧板位于所述外壳和所述上盖板形成容纳腔内，所述侧板与所述侧壁的外侧通过胶水粘接。
可选的，所述上盖板侧板的高度小于外壳侧壁板的高度。
可选的，所述上盖板比所述外壳具有更小的膨胀系数。
可选的，所述上盖板比所述外壳具有更小的屈服强度。
另一方面，本申请实施例提供一种光模块，光模块包括上述光学次模块。
本申请实施例提供的光学次模块及光模块，在上盖板与外壳形成容纳光学器件的腔体，光学器件放置在外壳的底板上，上盖板的侧板与外壳的侧壁通过胶水粘接，由于胶水的膨胀系数分别大于外壳及上盖板的膨胀系数，所以胶水膨胀后体积比外壳及上盖板显著增大，会对上盖板及外壳形成挤压，侧板与侧壁之间夹有胶水，胶水直接挤压侧板及侧壁，盖板设置有侧板，与已有技术相比，上盖板更容易受力变形，为膨胀后的胶水提供容纳空间，以释放胶水膨胀后的挤压力，减弱外壳形变对光学器件位置的影响，改善光功率的下降问题。
附图说明
下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，对于本领域普通技术人员而言，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为一种典型光学次模块的结构示意图；
图2为一种典型光学次模块的侧视图；
图3为本申请实施例提供的光学次模块的结构示意图；
图4为本申请实施例提供的光学次模块的侧视图；
图5为本申请实施例提供的上盖板的结构示意图；
图6为本申请实施例提供的光学次模块的局部爆炸图；
图7为图6的结合图；
图8为本申请实施例提供的外壳的立体图；
图9(a)和图9(b)为一种典型光学次模块的仿真结果图；
图10(a)和图10(b)为本申请实施例提供的光学次模块的仿真结果图；
图11为本申请实施例提供的光模块的结构示意图；
图12为本申请实施例提供的光学次模块的剖面图；
图13为本申请实施例提供的光学次模块的受力示意图；
图14为本申请实施例提供的另一光学次模块的剖面图；
图15为本申请实施例提供的另一光学次模块的受力示意图。
具体实施方式
图3为本申请实施例提供的光学次模块的结构示意图；图4为本申请实施例提供的光学次模块的侧视图。
参见图3和图4，本申请实施例提供的光学次模块，用于如图11所示的光模块中，光学次模块与电路板组件之间电连接形成光模块，电路板组件与外部上位机连接实现供电及电信号传输，光学次模块与外部光纤等传光介质连接实现光传输。本实施例提供的光学次模块包括：外壳2、上盖板3和光器件4。
本申请实施例中的光发射次模块和/或光接收次模块采用光学盒子BOX方式进行封装，光学盒子包括外壳2及上盖板3，与上盖板3形成密封腔体。
外壳2为一面设有开口的框状结构，其纵截面为凹型，使外壳2的内部具有空腔，空腔用于容纳光器件和电器件等。使用时，上盖板3置于外壳2上，以使外壳2和上盖板3形成容纳腔。为进行光传输，光学次模块还包括光器件4，光器件4置于容纳腔内，光器件4固定在外壳2的底面上。光器件可以直接固定在外壳2的底面上；也可以间接固定在底面上，即在底面上设置衬底，将光器件4设置在衬底上。不论将光器件4直接或间接设置在底面上，底面发生的形变都会影响光器件4位置，进而影响预设的光路。
光学次模块与外部光纤等传光介质连接实现光传输。常见的光器件包括光复用/解复用器件、透镜及光芯片(激光芯片或光接收芯片)。本实施例提供的光学次模块包括：外壳2、上盖板3、光学器件(光芯片、光复用/解复用器件及透镜)及光纤插口7，光复用/解复用器件、光芯片(激光芯片或光接收芯片)、透镜等光学器件设置在外壳2的底板上，光纤插口设置在外壳2的侧壁上，光纤适配器插入光纤插口中，实现光学次模块内部与外部通过光纤适配器实现光连接。
当光学次模块内包括激光芯片时，激光芯片发出的光经光复用/解复用器件和/或透镜、光线插口及光纤适配器进入光纤中对外传输；当光学次模块内包括光接收芯片时，从光纤传来的光经光纤适配器、光线插口、光复用/解复用器件和/或透镜，最终被光接收芯片接收。
为了解决上盖板3易出现的影响光路的问题，本实施例中将上盖板3的结构进行改进， 即将平板状的上盖板3改进为具有凹槽形状的上盖板3。如图5所示，上盖板3包括顶板35和垂直于顶板35的侧板，使上盖板3形成凹槽结构。
如图12所示，光学次模块的剖面图示出上盖板3、外壳2、光器件4、光纤插口7，光学器件设置在外壳2的底板上，光纤插口7设置在外壳2的侧壁上，上盖板3及外壳2形成密封腔体。光学器件及光纤插口的位置变化会改变预设的光路，而预设光路按照最佳光功率进行设计，对预设光路的改变会导致光功率下降。
在具体的密封腔体结构中，上盖板3放置在外壳2的侧壁上，上盖板3具有伸入腔体内部的侧板，侧板与盖板主体具有不同的延伸方向，侧板与侧壁通过胶水层粘接；侧板与所述侧壁的内侧通过胶水粘接；侧壁用于粘接侧板的表面，与侧壁用于承托盖板的表面，为不同的表面。
高温下胶水受热膨胀，由于胶水层的膨胀系数分别大于外壳的膨胀系数和上盖板的膨胀系数，使得胶水膨胀后体积增大，会挤压外壳或上盖板，使外壳或上盖板变形。本申请实施例的目的是让上盖板发生较大的形变以平衡挤压力，外壳发生较小的形变或不发生形变以平衡挤压力。
本申请侧板包括：第一侧板31、第二侧板32、第三侧板33和第四侧板34，每个侧板环绕设置于顶板35的周围；第一侧板31和第二侧板32设于顶板35的相对两端，第三侧板33和第四侧板34设于顶板35的另一相对两端，且第一侧板31、第二侧板32、第三侧板33和第四侧板34分别与顶板35垂直；第一侧板31、第三侧板33、第二侧板32和第四侧板34首尾依次垂直连接，以使上盖板3形成凹槽结构；相邻两个侧板相互垂直，相对两个侧板相互平行，第一侧板31、第二侧板32、第三侧板33和第四侧板34沿顶板35的外边缘顺次连接形成内部具有凹槽的异形盖板。
在本实施例提供的凹槽形的上盖板3与外壳2连接时，将第一侧板31、第二侧板32、第三侧板33和第四侧板34与外壳2接触，使得上盖板3形成的凹槽与外壳2的空腔结合，形成容纳腔，以增大光学次模块的容纳空间，避免出现影响光路的情况。具体连接时，第一侧板31、第二侧板32、第三侧板33和第四侧板34分别通过胶水层6与外壳2连接。
胶水受热膨胀时，由于胶水层的膨胀系数分别大于外壳的膨胀系数和上盖板的膨胀系数，使得膨胀的胶水会对外壳2和上盖板3产生推力，该推力作用在凹槽形上盖板3的第一侧板31、第二侧板32、第三侧板33和第四侧板34上，形成力矩。与外壳2相比，力矩的产生会使凹槽形上盖板3更容易产生形变，进而通过上盖板的形变为胶水的膨胀提供空间，使外壳产生的形变量变小，从而改善对光器件的位置的影响，进而可防止形变传递到外壳2上。而外壳2不会产生形变，或产生的形变很微小，从而大大减小对光路的影响。
如图13所示，胶水膨胀需要足够的空间，从而会向各个方向产生挤压力，其中在水平方向的挤压力会产生外壳或上盖板变形的影响。外壳的侧壁会受到背离腔体内部方向的挤压力，而上盖板的侧板会受到朝向腔体内部方向的挤压力，上盖板更容易受力变形，为膨胀后的胶水提供容纳空间，以释放胶水膨胀后的挤压力，进而减小外壳受到的挤压力，减小外壳的形变，进而减弱外壳形变对光学器件位置的影响，利于预设光路的保持，改善光功率的下降问题。
上盖板侧板的高度小于所述外壳侧壁的高度，上盖板的体积小于外壳的体积，受力更容易发生形变，通过上盖板的形变为胶水提供足够的膨胀空间，避免外壳发生形变。
通过对上盖板的结构设计，让上盖板更容易发生形变，为胶水提供足够的膨胀空间，改善外壳的形变量，减小对外壳底板上预设光路的影响，改善光功率下降的问题。
为了让上盖板更容易发生形变，上盖板与外壳可以使用不同膨胀系数的材料，盖板的膨胀系数小于外壳的膨胀系数。
为了让上盖板更容易发生形变，上盖板与外壳可以使用不同刚度的材料，上盖板的刚度小于外壳的刚度，在受到相同作用力时，上盖板更容易发生形变。
为了让上盖板更容易发生形变，盖板与外壳可以使用不同屈服强度的材料，上盖板的屈服强度小于外壳的屈服强度，上盖板更容易发生形变。
本实施例提供的上盖板3可以采用一体成型的结构，上盖板与外壳采用相同的材料，例如可伐合金，通过对上盖板的结构进行改进，从而使上盖板较之前的设计更容易发生形变；上盖板可以与外壳采用不同的材料，通过材料变形特性的不同，在上述结构的基础上，使上盖板更容易发生形变。
上盖板也可以采用不同材料分别加工焊接而成。具体地，当上盖板3由不同材料分别加工焊接而成时，顶板35可采用钨铜材料等散热系数高的材料制成，以提高光学次模块的散热速度，避免温度过高而影响光器件和电器件的正常使用。第一侧板31、第二侧板32、第三侧板33和第四侧板34可采用可伐合金材料等易焊接、易加工、膨胀系数高的材料制成，可提高上盖板3的耐磨性。采用上述材料制成的上盖板3，具有既可以有效吸收应力，也能更好散热的特点。
为了使上盖板3的侧板更易产生形变，而不影响顶板35的结构，需要膨胀系数较大的胶水层不要与顶板35接触，因此，在其中一种可行的具体实施方式中，顶板35的底端位于外壳2顶端的上方。设定顶板35的高度高于外壳2的顶端，即顶板35位于凹台21的顶端上方，使得顶板35的外侧壁不与胶水层6接触，胶水层6膨胀时不会对顶板35产生应力，或产生的应力较小，而对侧板产生的应力大于对顶板35产生的应力，使得侧板更易产生形变。
在另一种可行的具体实施方式中，胶水层6的高度小于侧板的高度。侧板外侧壁涂覆胶水层6的面积要小于侧板外侧壁的整体面积，使得胶水层6并未涂满侧板外侧壁，即侧板的靠近顶板35的部分接触不到胶水层6，也可使得胶水层6不与顶板35的外侧壁接触，胶水层6膨胀时对侧板产生的应力大于对顶板35产生的应力，使得侧板更易产生形变。
而为了提高上盖板3的使用寿命，避免出现腐蚀现象，可在上盖板3的表面设置防腐层，例如，通过电镀的方式将防腐材料电镀在上盖板3的表面。外壳2包括底板和垂直于底板的侧壁板，侧壁板围绕在底板的周围使得外壳2形成空腔。外壳2的侧壁板的高度大于上盖板3侧板的高度，使得外壳2形成的凹槽深度要大于上盖板3形成的凹槽深度。由于外壳2的尺寸大于上盖板3的尺寸，使得外壳2承受膨胀胶水推力的能力较强，不易产生形变；而上盖板3承受膨胀胶水的推力能力较弱，更易产生形变，进而可以改善外壳2易影响光路的情况。
由于外壳2与上盖板3通过胶水层6连接，而二者在固定连接时，需由工人自行将上盖板3的边与外壳2的边对齐，以保证光学次模块的结构整齐，避免影响形变效果。但由于手动对齐操作不易控制，且在滴加胶水时会对上盖板3或外壳2产生作用力，使得上盖板3与外壳2产生错位。
因此，如图6、图7和图8所示，为了避免上盖板3和外壳2之间产生错位，影响光学次模块整体结构的整齐性，导致形变效果不佳。本实施例中，在外壳2的侧壁板的顶端设有凹台21，凹台21的投影形状与上盖板3的投影形状相同，凹台的平面用于承托上盖板，凸台的侧壁用于与上盖板的侧板通过胶水粘接。
上盖板3可以与外壳2的顶端卡接，通过凹台21对上盖板3进行初步限位，避免出现错位现象。上盖板3与凹台21之间具有间隙，以便于滴加胶水进行密封，通过胶水层6实现上盖板3和外壳2顶端的固定。
为增大光学次模块的容纳腔的空间，需使顶板35位于凹台21的上方，且上盖板3的侧板与凹台21接触，即将上盖板3的凹槽与外壳2的空腔结合。
本实施例中，上盖板3和外壳2通过胶水层6连接时，连接部位分别为第一侧板31、第二侧板32、第三侧板33和第四侧板34的外侧壁，以及，凹台21的内侧壁。胶水层6位于凹台21与侧板之间，胶水滴加在凹台21的内侧壁和相对的每个侧板之间，使得凹台21通过胶水层6与第一侧板31、第二侧板32、第三侧板33和第四侧板34连接，实现上盖板3与外壳2的固定。
胶水层6的滴加厚度与凹台21和上盖板3之间的预留缝隙大小有关，为了实现固定又不浪费胶水。本实施例中，设定凹台21与上盖板3的每个侧板之间的预留缝隙尺寸为0.05mm-0.1mm，即胶水层6的厚度为0.05mm-0.1mm。根据实际使用需求，胶水层6的厚度可设定为0.05mm、0.06mm、0.07mm、0.08mm、0.09mm或0.1mm等，本实施例不做具体限定。
为了上盖板3可以稳定地固定在凹台21上，即凹台21能够支撑上盖板3，本实施例中，设定上盖板3的每一个侧板的宽度要小于凹台21的宽度。以第一侧板31为例，第一侧板31的宽度H2占凹台21的宽度H1的60％～80％。
在不影响外壳2的容纳空间的情况下，凹台21的宽度要大于第一侧板31的宽度，即第一侧板31的宽度H2与凹台21的宽度H1的比例可为60％、65％、70％、75％或80％等，优选第一侧板31的宽度H2占凹台21的宽度H1的70％。
由于上盖板3的外形尺寸受限于整体光学次模块的大小，因此，上盖板3的厚度不宜太厚，长宽要根据外壳2大小而定，一般要以能密封外壳2为准。且为了上盖板3在高温烘烤时能够产生形变，需要在满足正常使用需求的前提下，使顶板35的厚度小于侧板的厚度，即本实施例中，顶板35的厚度d1占第一侧板31的宽度H2的45％-55％。
在保证侧板能够支撑顶板35的情况下，以及，侧板能够承受外壳2与顶板35的作用力，将侧板的厚度设计成大于顶板35的厚度。即顶板35的厚度d1占第一侧板31的宽度H2的45％、50％或55％。
外壳2与长度方向垂直的侧壁上设有通光口7，通光口7处安装有适配器1。外壳2的一端设置通光口7，用于安装适配器1，以将光学次模块与其他电子设备进行连接。
外壳2与设有通光口7相对的一端设有开口槽8，开口槽8用于连接电路板。光学次模块与电路板连接后即可得到光模块，而电路板组件与外部上位机连接实现供电及电信号传输，光学次模块与外部光纤等传光介质连接实现光传输，以实现光模块的光电信号转换的功能。
外壳2靠近开口槽8的侧壁上设有打线避让槽9。容纳腔内设有打线避让槽9，设置 在外壳2的内侧壁上，用于预留操作空间，以便于后续将金线与电路板连接。
为了更清楚的说明本实施例提供的光学次模块所能取得的有益效果，下面将本实施例提供的光学次模块与一种典型光学次模块进行仿真对比。
图9(a)和图9(b)为一种典型光学次模块的仿真结果图；图10(a)和图10(b)为本实施例提供的光学次模块的仿真结果图。
参见图9(a)和图9(b)，图10(a)和图10(b)，根据典型光学次模块仿真结果与本实施例提供的改进方案仿真结果对比，在受同样胶水挤压力后，典型光学次模块的上盖板最大形变量为0.14um，而外壳最大形变量为5.6um，也就是说，受胶水挤压力外壳为主要吸收应变的一方，外壳产生形变，进而会导致光路变化，影响光路稳定性，对光模块指标影响较大。而本申请实施例提供的光学次模块中，上盖板3的最大形变量为3.19um，而外壳2的最大形变量为1.44um，也就是说，受胶水相同大小的挤压力，带凹槽的上盖板3为主要吸收应变的一方，且外壳2形变会更小，相比之下，本实施例提供的外壳2产生的形变降低近4倍，进而降低对光路稳定性的影响，使光模块光学性能更稳定。
可见，本申请中，通过取消光学次模块内部的金属基板5，减小整体结构空间，同时对光学次模块的上盖板3设计成带凹槽的异形板，可以有效吸收应力，使光路不受应力形变影响，减少工艺制程，对于光路的稳定性表现更加优势。
在本申请的另一个实施例中，如图14所示，上盖板3放置在外壳2的侧壁上，上盖板3具有沿侧壁外侧延伸的侧板，侧板与盖板主体具有不同的延伸方向，与上述示出的结构不同，上盖板的侧板处于腔体的外部；侧板与侧壁通过胶水粘接；侧板与所述侧壁的内侧通过胶水粘接；侧壁与侧板粘接的表面，与侧壁承托上盖板的表面，为不同的表面。
胶水的点胶位置位于腔体的外部，可以防止胶水流动进入腔体的内部，避免胶水的不可控流动对腔体内部的器件或光路造成影响。
高温下胶水受热膨胀，由于胶水层的膨胀系数分别大于外壳的膨胀系数和上盖板的膨胀系数，使得胶水膨胀会挤压外壳或上盖板，使外壳或上盖板变形。本申请实施例的目的是让上盖板发生较大的形变以平衡挤压力，外壳发生较小的形变或不发生形变以平衡挤压力。
以图15为例，胶水膨胀需要足够的空间，从而会向各个方向产生挤压力，其中在水平方向的挤压力会产生外壳或上盖板变形的影响。外壳的侧壁会受到朝向腔体内部方向的挤压力，而上盖板的侧板会受到背离腔体内部方向的挤压力。与已有技术相比，盖板更容易受力变形，为膨胀后的胶水提供容纳空间，以释放胶水膨胀后的挤压力，进而减小外壳受到的挤压力，减小外壳的形变，进而减弱外壳形变对光学器件位置的影响，利于预设光路的保持，改善光功率的下降问题；
上盖板侧板的高度小于所述外壳侧壁的高度，上盖板的体积小于外壳的体积，受力更容易发生形变，上盖板的受力形变如图15所示，通过上盖板的形变为胶水提供足够的膨胀空间，避免外壳发生形变。
如图11所示，本申请实施例还提供一种光模块，包括滤光器件400、电路板500和上述实施例所述的光学次模块300，电路板500通过开口槽与光学次模块300连接；光学次模块300中封装有光器件和电器件等；光学次模块300和电路板500封装在由外罩100和底座200形成的腔体内。光模块的作用就是光电转换，发送端把电信号转换成光信号，通 过光纤传送后，接收端再把光信号转换成电信号。
由以上技术方案可知，本申请实施例提供的一种光学次模块及光模块，光模块包括光学次模块和电路板；光学次模块包括：外壳2、上盖板3和光器件4，上盖板3置于外壳2上形成容纳腔，光器件4置于容纳腔内，且固定在外壳2的底面上；上盖板3包括顶板35和垂直于顶板35的侧板，使上盖板3形成凹槽结构；侧板通过胶水层6与外壳2连接，胶水层6的膨胀系数分别大于外壳2的膨胀系数和上盖板3的膨胀系数，使得本申请提供的光学次模块在高温烘烤时，胶水层6的膨胀度要大于外壳2和上盖板3；膨胀的胶水对外壳2和上盖板3产生推力，该推力作用在侧板上时，形成力矩，使上盖板3较外壳2更容易产生形变，进而可防止形变传递到外壳2上。而外壳2产生的形变量变小，会改善影响光路的情况，以解决光学次模块易出现影响光路，使得光传输效果不佳的问题。
本领域技术人员在考虑说明书及实践这里公开的发明后，将容易想到本发明的其它实施方案。本申请旨在涵盖本发明的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本发明的一般性原理并包括本发明未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本发明的真正范围和精神由所附的权利要求指出。
应当理解的是，本发明并不局限于上面已经描述并在附图中示出的精确结构，并且可以在不脱离其范围进行各种修改和改变。本发明的范围仅由所附的权利要求来限制。

Claims (13)

  1. 一种光学次模块，包括：外壳、上盖板和光器件；其中，
    所述上盖板置于所述外壳上，所述外壳和所述上盖板形成容纳腔；所述光器件置于所述容纳腔内，且固定在所述外壳的底面上；
    所述上盖板包括顶板和垂直于所述顶板的侧板；所述侧板通过胶水层与所述外壳连接；所述胶水层的膨胀系数分别大于所述外壳的膨胀系数和所述上盖板的膨胀系数。
  2. 根据权利要求1所述的光学次模块，其中，所述外壳包括底板和垂直于所述底板的侧壁板；所述侧壁板的顶端设有凹台，所述凹台的内侧壁通过所述胶水层分别与所述侧板的外侧壁连接。
  3. 根据权利要求1所述的光学次模块，其中，所述顶板的底端位于所述外壳顶端的上方。
  4. 根据权利要求1所述的光学次模块，其中，所述胶水层的高度小于所述侧板的高度。
  5. 根据权利要求1所述的光学次模块，其中，所述上盖板比所述外壳具有更小的刚度。
  6. 根据权利要求1所述的光学次模块，其中，所述侧板包括：第一侧板、第二侧板、第三侧板和第四侧板；所述第一侧板和所述第二侧板设于所述顶板的相对两端，所述第三侧板和所述第四侧板设于所述顶板的另一相对两端；所述第一侧板、所述第二侧板、所述第三侧板和所述第四侧板分别与所述顶板垂直；所述第一侧板、所述第三侧板、所述第二侧板和所述第四侧板首尾依次垂直连接。
  7. 根据权利要求6所述的光学次模块，其中，所述第一侧板的宽度H2占所述凹台的宽度H1的60％-80％。
  8. 根据权利要求1所述的光学次模块，其中，所述侧板位于所述外壳和所述上盖板形成容纳腔内，所述侧板与所述侧壁的内侧通过胶水粘接。
  9. 根据权利要求1所述的光学次模块，其中，所述侧板位于所述外壳和所述上盖板形成容纳腔内，所述侧板与所述侧壁的外侧通过胶水粘接。
  10. 根据权利要求1所述的光学次模块，其中，所述上盖板侧板的高度小于外壳侧壁板的高度。
  11. 根据权利要求1所述的光学次模块，其中，所述上盖板比所述外壳具有更小的膨胀系数。
  12. 根据权利要求1所述的光学次模块，其中，所述上盖板比所述外壳具有更小的屈服强度。
  13. 一种光模块，包括电路板和如权利要求1-12任一项所述的光学次模块，所述电路板与所述光学次模块电连接。
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