WO2020125344A1 - 基于移相网络提高隔离度的射频压电多工器和电子设备 - Google Patents

基于移相网络提高隔离度的射频压电多工器和电子设备 Download PDF

Info

Publication number
WO2020125344A1
WO2020125344A1 PCT/CN2019/121010 CN2019121010W WO2020125344A1 WO 2020125344 A1 WO2020125344 A1 WO 2020125344A1 CN 2019121010 W CN2019121010 W CN 2019121010W WO 2020125344 A1 WO2020125344 A1 WO 2020125344A1
Authority
WO
WIPO (PCT)
Prior art keywords
phase
package carrier
filter
matching
common port
Prior art date
Application number
PCT/CN2019/121010
Other languages
English (en)
French (fr)
Inventor
庞慰
郑云卓
Original Assignee
天津大学
诺思(天津)微系统有限责任公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 天津大学, 诺思(天津)微系统有限责任公司 filed Critical 天津大学
Publication of WO2020125344A1 publication Critical patent/WO2020125344A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source

Definitions

  • Embodiments of the present invention relate to a filter device for communication, and particularly to a radio frequency piezoelectric multiplexer unit, a multiplexer having the multiplexer unit, a package carrier board for the multiplexer, and An electronic device with the multiplexer unit.
  • carrier aggregation (CA, Carrier Aggregation) solutions that support high data transmission rates have become a necessary technical means. Two or even more than three frequency bands are combined at the RF front end to achieve direct expansion of the communication frequency band.
  • Multi-mode-multi-band mobile terminals that support carrier aggregation must use small-size, high-performance RF multiplexers to achieve this function.
  • the multiplexer generally consists of at least three or more piezoelectric filters.
  • the resonators that constitute this type of piezoelectric filter mainly include: FBAR (Film Bulk Acoustic Resonator), SMR (Solidly Mounted) Resonator, solid state assembly resonator) and SAW (Surface Acoustic Wave, surface acoustic wave resonator). Due to the larger number of filters, the design difficulty of the multiplexer is also much higher than that of the traditional single-band filters and duplexers. The two most important difficulties are: One is the impedance of each filter connected to the antenna end. Matching; The second is to achieve isolation between various frequency bands in a small size.
  • the reference numeral 100 in FIG. 1 is a schematic diagram of a design principle of a multiplexer unit (four-plexer in this example), which is relatively common in the prior art.
  • the multiplexer unit 100 is a quaternary device including four filter chips and a package carrier board, wherein the filter is a piezoelectric filter, and the resonator constituting the piezoelectric filter may be SAW, FBAR, or SMR.
  • Reference numeral 120 is a common port to which each filter is connected (an antenna may or may not be connected to the port, which is shown as a connected antenna).
  • Reference numerals 102, 104, 106, and 108 are the four filters that make up the four-plexer, respectively.
  • Reference numerals 122, 124, 126, and 128 are ports derived from the four filters, respectively, and are connected to other parts of the system circuit. These four ports and the common port constitute five ports of the quadplexer.
  • Reference numerals 112, 114, 116, and 118 are impedance matching networks connected between each port and the filter.
  • the matching network may be composed of matching devices, which may be inductors, capacitors, or may be connected in series or Parallel connection can also be a combination of multiple matching devices and multiple connection methods.
  • the matching network can also be matched in the form of discrete components outside the device.
  • Reference numeral 101 is a phase-shifting electrical device between the filter and the common port, which is generally an inductance, a capacitor, or a transmission line with a certain electrical length in series, and its role is to phase the filter impedance seen from the common terminal Move to achieve a better matching state between the filters.
  • the phase-shifting electrical device can be arranged between multiple filters and the common terminal.
  • phase shift network and matching network of each channel are integrated in the package carrier board, which can be a PCB (printed circuit board), LTCC (low temperature co-fired ceramic) substrate, etc.
  • the package carrier board can be a PCB (printed circuit board), LTCC (low temperature co-fired ceramic) substrate, etc.
  • the piezoelectric filter appears as a capacitor beyond the resonance frequency, the impedance of each channel seen from the common terminal is also mostly capacitive, so the matching of the four-way device on the common terminal is generally achieved by an inductor 130 connected in parallel to ground .
  • the junction point A of four filters (the junction point before the multiple filters are connected to the equivalent inductance) is inside the quaternary device (inside the package carrier board), and the matching inductor 130 is located in the device Externally, therefore, there is generally a small equivalent inductance 132 from the junction of the device to the position of the matching inductor 130, which is in the order of a few nH.
  • each channel 3 is the impedance position of each channel (including the phase-shifting electrical device, filter, and matching network of the channel, and other channels are disconnected) when each channel of the multiplexer unit 100 in FIG. 1 is viewed from the common port alone Smith chart, from the Smith chart, the impedance of each channel in the passband range is located in the lower left position, showing a relatively uniform capacitive.
  • FIG. 4 is a Smith chart showing the impedance position of each channel when each channel of the multiplexer in FIG. 1 is viewed from the common port after the common port is connected.
  • the solid line in FIG. 4 is the impedance position of each channel when the multiplexer unit 100 in FIG. 1 connects the channels at the common end and looks in from the common port; the dotted line is after the matching inductance 130 is added to the common port The impedance position of each channel.
  • the impedance of each channel is located at the center of the Smith chart. As can be understood by those skilled in the art, the closer the curve is to the center point of the circle (for example, 50 ohms), the better the matching effect.
  • the multiplexer unit 200 includes a matching inductor 230. That is, the matching inductor 230 is integrated with the phase shifting electrical device or other port matching network in the package carrier board, so that the equivalent inductance 232 The position is exchanged with the matching inductor 230, the matching effect of the equivalent inductor 232 on the junction A of each channel will be smaller (not equal to no), and the matching inductor 230 is closer to the junction A (equivalent to the equivalent in Figure 1 Inductor 132 is 0nH), the inductance value is relatively smaller, and the Q value can be higher, reducing the device insertion loss.
  • the scheme in FIG. 2 can use a matching inductor with a smaller inductance to solve the matching problem to a certain extent, because the junction A generally needs to be close to the common port 220, otherwise the equivalent inductance 232 will be relatively large, so matching The inductor 230 is generally closer to the common port 220. The limitation of this position poses a challenge to the isolation between the filter channel ports located near the common port.
  • the invention provides a radio frequency piezoelectric multiplexer unit, which includes: a package carrier board; at least three filters, packaged in the package carrier board and suitable for being connected to a common port together; a matching inductance for grounding; A phase network module, wherein: the matching inductor and the phase shift network module are packaged in the package carrier; at least a portion of the phase shift network module is adapted to be connected between the common port and the matching inductor.
  • the linear distance between the matching inductor and the side of the package carrier board where the common port is located is in the range of one third to two thirds of the side length of the side of the package carrier board parallel to the straight line distance within.
  • the at least three filters include a reception filter and a transmission filter; the package carrier includes a common port connection area provided between the reception filter and the transmission filter; and the matching The inductance is located outside the isolation degradation region between the receiving filter and the transmitting filter.
  • the phase-shifting network module includes at least one phase-shifting electrical device. Further, at least one of the phase-shifting electrical devices is connected between the junction and the matching inductor.
  • the common port is adapted to be connected to the antenna through an equivalent inductance; and the equivalent inductance is located outside the package carrier.
  • the phase-shifting network module is set in a step-by-step matching manner.
  • the embodiment of the present invention also relates to a package carrier board for a multiplexer, which includes: a matching inductance matched with a common port of the multiplexer; at least one phase-shifting electrical device for filtering the multiplexer The phase of the impedance is shifted, wherein: at least one of the at least one phase-shifting electrical device is adapted to be connected between the common port and the matching inductor.
  • the above packaging substrate match the linear distance between the inductor and the side of the package carrier board where the common port is located, and between one third of the side length of the side of the package carrier board parallel to the straight line distance to Within two thirds.
  • the above package carrier board is adapted to set at least three filters, the at least three filters include a receiving filter and a transmission filter; the package carrier board includes the receiving filter and the A common port connection area between the transmission filters; and the matching inductance is located outside the isolation degradation area between the reception filter and the transmission filter.
  • a radio frequency piezoelectric multiplexer including the foregoing radio frequency piezoelectric multiplexer unit or the package carrier board described above.
  • an electronic device including the above-mentioned radio frequency piezoelectric multiplexer unit.
  • FIG. 1 is a schematic diagram of the design principle of a multiplexer in the prior art
  • FIG. 2 is a schematic diagram of the design principle of another multiplexer in the prior art
  • FIG. 3 is a Smith chart showing the impedance position of each channel when each channel of the multiplexer in FIG. 1 is viewed from a common port alone;
  • FIG. 4 is a Smith chart showing the impedance position of each channel when the channels of the multiplexer in FIG. 1 are viewed from the common port after the common port is joined;
  • FIG. 5 is a schematic diagram of a design principle of a multiplexer according to an exemplary embodiment of the present invention.
  • FIG. 6 is a schematic diagram of an exemplary implementation corresponding to the multiplexer in FIG. 5;
  • FIG. 9 exemplarily shows the amplitude-frequency response curve of each channel of the multiplexer according to FIG. 5, where the abscissa is the frequency and the ordinate is the insertion loss;
  • FIG. 10 exemplarily shows the isolation curve between B1Rx and B3Tx of the multiplexer according to FIG. 6, wherein the dotted line corresponds to the prior art, and the solid line corresponds to the technology adopting the technical solution of the present invention;
  • FIG. 11 is a schematic diagram of a design principle of a multiplexer according to an exemplary embodiment of the present invention.
  • FIG. 12 is a schematic diagram of a design principle of a multiplexer according to an exemplary embodiment of the present invention.
  • FIG. 13 is a schematic diagram of a design principle of a multiplexer according to an exemplary embodiment of the present invention.
  • FIG. 14 is a schematic diagram of a design principle of a multiplexer according to an exemplary embodiment of the present invention.
  • radio frequency piezoelectric multiplexer unit and the radio frequency piezoelectric multiplexer according to the present invention are exemplarily described below with reference to the drawings.
  • Reference numeral 600 denotes a radio frequency piezoelectric multiplexer unit.
  • the phase-shifting electrical device 642 is located between the filter 602 and the filter 604; the phase-shifting electrical device 644 is located between the filter 604 and the filter 606; the phase-shifting electrical device 646 is located at the filter 606 Between the filter 608 and between the filter 606 and the matching point B (connected to the matching inductor 630); the phase-shifting electrical device 648 is located between the matching point B or the matching inductor 630 and the filter 608.
  • each filter is cascaded through phase-shifting electrical devices, and finally connected to the junction point A.
  • the matching inductor 630 can be seen The operation is located at the initial stage of the tandem, so there are multiple phase-shifting electrical devices or phase-shifting networks 642, 644, and 646 between the final common port 620, so that the matching inductor 630 can be located away from the common port 620.
  • reference numerals 612, 614, 616, and 618 are impedance matching networks connected between each port and the filter.
  • the matching network may be composed of matching devices.
  • the matching devices may be inductors or capacitors, and may be connected in series.
  • the connection may also be connected in parallel, or a combination of multiple matching devices and multiple connection methods.
  • the matching network can also be matched in the form of discrete components outside the device.
  • phase-shifting network or the phase-shifting electrical device between the matching inductor 630 and the common port 620 is not limited to the form in FIG. 5, and various modifications can be adopted.
  • Figures 11-14 show different exemplary embodiments.
  • FIG. 11 is an exemplary embodiment, which differs from FIG. 5 in that the phase shifting electrical device 646 is eliminated, and the matching inductor 630 is moved slightly closer to the common port 620, but the same technical effect can still be achieved .
  • FIG. 12 is yet another exemplary embodiment, which differs from FIG. 5 in that the network closer to the matching inductor 630 as the initial tandem network is not a filter, but a pair of two ports directly connected together. Tool (the bottom two filters).
  • FIG. 13 is another exemplary embodiment, which differs from FIG. 5 in that the two channels that are matched in the subsequent stage are not separate filters, but two duplexers (composed of two filters One duplexer, the next two filters form another duplexer).
  • FIG. 14 is still another exemplary embodiment, which differs from FIG. 13 in that the multiplexer is a quintuplexer.
  • FIG. 6 is a schematic diagram of an exemplary implementation of using a phase shift network corresponding to the multiplexer in FIG. 5 to keep the common port away from the matching inductor. It can be considered that FIG. 6 is a specific implementation manner of FIG. 5.
  • reference numeral 900 denotes a multiplexer unit.
  • the five channel ports of the band 1 (Band 1) and band 3 (Band 3) duplexers are shown as black dots, where the channel port B1Rx (passband 1 receiving, 2110MHz-2170MHz) is located in the upper left corner.
  • the channel port B3Rx (passband 3 reception, 1805MHz-1880MHz) is located in the lower left corner, the channel port B3Tx (band 3 transmission, 1710MHz-1785MHz) is located in the upper right corner, and the channel port B1Tx (band 1 transmission, 1920MHz-1980MHz) is located in the lower right corner.
  • the channel port B1Rx has the highest frequency and the highest sensitivity of isolation.
  • the matching inductor 908 is located near the common port connection area 902, such as the area indicated by the dashed box 920 in FIG. 6, the presence of the matching inductor will give the channel port B1Rx and The isolation between other channel ports (eg B3Rx) has an adverse effect.
  • the black circle in the figure represents the via 904 or 906 on the package carrier board, which is used to realize the electrical interconnection between the different layers of the circuit on the package carrier board.
  • the via 904 and FIG. 5 Point A corresponds to and is used to connect to a common port, and via 906 can be used for grounding, for example;
  • the thick solid line represents the circuit in the package carrier board, which is used to implement a phase-shift network or matching network; four solid lines are small
  • the boxes are four filters; the solid dots are the ports of the filter.
  • One port, such as port 905, is connected to the corresponding channel port of the multiplexer device, such as B1Rx, and the other port passes the technical solution of this patent.
  • phase shifting electrical devices 912, 914, 916, and 918 are connected to the common port connection area 902 or the common port.
  • reference numeral 908 is a spiral-shaped matching inductor drawn from a point between the phase-shifting electrical devices 916 and 918, and is connected to the ground of the package carrier through a via.
  • the matched inductor 908 in FIG. 6 corresponds to the matched inductor 630 in FIG. 5.
  • the phase-shifting electrical devices 642, 644, 646, and 648 in FIG. 5 correspond to the phase-shifting electrical devices 912, 914, 916, and 918 in FIG. 6, respectively.
  • the rectangular virtual frame 920 in FIG. 6 near the common port (the ANT port exemplified in FIG. 6) is located between B1Rx and B3Tx. Based on the size of the package carrier, in one embodiment, the size of the rectangular virtual frame 920 is about 1.2 mm x 1.2 mm.
  • the matching inductor integrated on the package carrier should be located in this area 920, but this will result in an inductance between B1Rx and B3Tx, which requires high isolation, resulting in The isolation becomes worse. Therefore, in terms of isolation requirements, the virtual frame 920 (including the small virtual frame as the common port connection area 902) in FIG. 6 is considered to be an area not suitable for setting the matching inductance, and this area may be referred to as an isolation degradation area . As shown in FIG. 6, the isolation degradation area is located between the receiving filter and the transmission filter, and the matching inductance is located outside the isolation degradation area.
  • the matching inductor 908 is completely disposed outside the common port connection area 920 by using a phase-shifting network or a phase-shifting electrical device.
  • the linear distance X (see FIG. 6) between the matching inductor 908 and the side of the package carrier board where the common port 902 is located may be the side length Y (see FIG. 6) of the side of the package carrier board parallel to the straight line where the line distance is located (see Figure 6) within the range of one third to two thirds to improve isolation.
  • FIG. 7 shows a Smith chart of the impedance position of each channel when each channel of the multiplexer in FIG. 5 is viewed from the common port alone.
  • Figure 7 does not contain matching inductance, which shows that the channel (including the closest phase-shifting electrical device, filter, and matching network to the channel when the channel is viewed separately from the common port, other channels are disconnected, belong to other The impedance position of the channel's phase-shifting electrical device).
  • the step-by-step matching can be understood as: the matching inductance mainly acts on the frequency band of the filter connected to the matching point, the matching is relatively easy, and then passes through the phase shift network or the phase shifting electrical device and the next frequency band filter After matching and merging, the two as a whole, then move the input impedance of the two frequency bands to a suitable position through a phase-shifting network or phase-shifting electrical device, and then tandem with the next filter. analogy.
  • FIG. 8 is a Smith chart showing the impedance position of each channel when each channel of the multiplexer in FIG. 5 is viewed from the common port after the common port is connected.
  • FIG. 8 shows the impedance position of each channel when the multiplexer unit 600 in FIG. 5 is matched and viewed from the common terminal. From the impedance curve in the Smith chart in FIG. 8, it can be seen that the impedance of the multiplexer unit 600 in FIG. 5 is closer to the center of the circle than the multiplexer unit 100 shown in FIG. 1. That is to achieve better matching characteristics.
  • FIG. 9 exemplarily shows the amplitude-frequency response curve of each channel of the multiplexer according to FIG. 5, where the abscissa is Frequency and the ordinate is Insertion Loss.
  • the insertion loss of the passband in FIG. 9 is basically the same, and there is no increase in insertion loss due to the movement of the matching inductor position.
  • FIG. 10 exemplarily shows the isolation curve between B1Rx and B3Tx of the multiplexer according to FIGS. 5 and 6, wherein the dotted line corresponds to the prior art, and the solid line corresponds to the technology adopting the technical solution of the present invention.
  • the abscissa is Frequency, and the ordinate is Isolation.
  • the worst value of the isolation within 1710MH-1785MHz is 56dB, and the isolation within 2110MHz-2170MHz The worst value is 54dB.
  • the present invention proposes a radio frequency piezoelectric multiplexer unit, including: a package carrier board; at least three filters, suitable for being commonly connected to a common port; a matching inductance for grounding; a phase shifting network module, wherein : The filter, the matched inductor and the phase shift network module are packaged in the package carrier; at least a part of the phase shift network module is adapted to be connected between the common port and the matched inductor.
  • Embodiments of the present invention also relate to an electronic device, including the above-mentioned radio frequency piezoelectric multiplexer.
  • the electronic devices here include but are not limited to intermediate products such as radio frequency front-ends, filter amplification modules, and terminal products such as mobile phones, WIFI, and drones.

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Transceivers (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

本发明涉及一种射频压电多工器单元，包括：封装载板；至少三个滤波器，适于共同连接于公共端口；用于接地的匹配电感；移相网络模块，其中：所述滤波器、匹配电感和移相网络模块封装于所述封装载板中；所述移相网络模块的至少一部分适于连接在所述公共端口与所述匹配电感之间。所述至少三个滤波器包括接收滤波器和发射滤波器；公共端口连接区域设置在所述接收滤波器与所述发射滤波器之间；且所述匹配电感位于所述接收滤波器与所述发射滤波器之间的隔离劣化区域之外。本发明还涉及具有该射频压电多工器单元的射频压电多工器以及具有上述单元的电子设备。

Description

基于移相网络提高隔离度的射频压电多工器和电子设备 技术领域
本发明的实施例涉及通信用滤波器器件，尤其涉及一种射频压电多工器单元，一种具有该多工器单元的多工器，一种用于多工器的封装载板，以及一种具有该多工器单元的电子设备。
背景技术
近年来，随着移动通信的发展，移动终端的数据传输峰值速率相比3G及LTE时代已经有了几何级的提高。由于频谱资源的稀缺性，以及各代通信设备组网方案的并存，一种最直接的提高数据传输速率的方案便是利用现有频谱资源，增加系统的数据传输带宽。
在LTE-Advanced(即通常所说的4G+)以及已经逐渐开始商用的5G通信协议，支持高数据传输速率的载波聚合(CA，Carrier Aggregation)方案已经成为必备的技术手段，它通过将原有两个、甚至三个以上的频段，在射频前端进行组合，实现通信频段的直接扩展。
不同频段的信号需要共用天线进行收发，但在射频前端要分开处理，因此支持载波聚合的多模-多频段移动终端，必定会采用小尺寸、高性能的射频多工器实现此功能。
多工器一般至少由3个或3个以上的压电滤波器组成，构成此类压电滤波器的谐振器主要包括：FBAR(Film Bulk Acoustic Resonator，薄膜体声波谐振器)，SMR(Solidly Mounted Resonator，固态装配谐振器)和SAW(Surface Acoustic Wave，表面声波谐振器)。由于组成的滤波器数量更多，多工器的设计难度也远高于传统的单频段滤波器和双工器，其中两个最重要难点为：一是共同连接到天线端的各滤波器的阻抗匹配；二是在小尺寸下实现各频带间的隔离度。
图1中的附图标记100是现有技术比较常见多工器单元(本例为四工器)设计原理示意图。多工器单元100为包含了四颗滤波器芯片以及封装载板的四工器器件，其中滤波器是压电滤波器，组成压电滤波器的谐振器可以是SAW、FBAR或SMR。
附图标记120是各滤波器连接的公共端口(在该端口可以连接天线，也可以不连接天线，图中示出为连接天线)。附图标记102、104、106、108分别是组成四工器的四颗滤波器。附图标记122、124、126、128是分别从四颗滤波器引出的端口，连接到系统电路的其它部分，这四个端口与公共端口，构成了四工器的五个端口。
附图标记112、114、116、118是连接在各端口与滤波器之间的阻抗匹配网络，匹配网络可以由匹配器件组成，匹配器件可以是电感，也可以是电容，可以串联连接，也可以并联连接，也可以是多种匹配器件、多种连接方法的组合。匹配网络也可以在器件外部以分立元件的形式实现匹配。
附图标记101是位于滤波器与公共端口之间的移相电性器件，一般是串联的电感、电容、或具有一定电长度的传输线，作用是将从公共端看入的滤波器阻抗进行相位移动，以使各个滤波器之间实现较好的匹配状态。移相电性器件可以设置在多个滤波器与公共端之间。
各通道的移相网络和匹配网络在封装载板中集成，封装载板可以是PCB(印刷电路板)，LTCC(低温共烧陶瓷)基板等。
由于压电滤波器在谐振频率以外都呈现为一个电容，每个通道从公共端看进去的阻抗也大都呈容性，因此四工器在公共端的匹配一般都是由一个并联接地的电感130实现。
如图1所示，四颗滤波器的汇接点A(为多个滤波器与等效电感连接之前的汇合点)是在四工器器件内部(封装载板内部)，而匹配电感130位于器件外部，因此从器件的汇接点到匹配电感130的位置一般还等效存在一个较小的等效电感132，量级为零点几nH。
图3是图1中的多工器单元100的各通道单独从公共端口看入时各通道(包含该通道的移相电性器件，滤波器，以及匹配网络，其它通道断开)的阻抗位置的Smith圆图，从Smith圆图看，各通道通带范围内，其阻抗均位于下方偏左的位置，呈现比较统一的容性。
图4为示出图1中的多工器各通道在公共端口汇接后从公共端口看入时各通道的阻抗位置的Smith圆图。其中，图4中的实线是图1中的多工器单元100将各通道在公共端汇接后从公共端口看入时各通道的阻抗位置；虚线是在公共端口添加了匹配电感130之后的各通道的阻抗位置。可以看到，在Smith圆图中，添加了匹配电感130 之后，各通道的阻抗均位于Smith圆图的中心。如本领域技术人员能够理解的，曲线越集中靠近圆心点(例如50欧姆)，匹配的效果越好。
但是，在图1中，因为等效电感132由于是在汇接点A外部，对四颗滤波器的匹配会产生同样作用，不利于实现更好的匹配。而且，等效电感132电感量越大，匹配效果越差，匹配电感130的感值也越大。此外，匹配电感130的感值越大，Q值就会越低，从而增加器件的插入损耗。而基于如图1在器件外部设置匹配电感的方案，很难将等效电感132的感值减小到0.1nH以下。
图2与图1类似，区别在于多工器单元200包含了匹配电感230，即匹配电感230与移相电性器件或其它端口匹配网络一样，都集成在封装载板中，这样等效电感232和匹配电感230互换了位置，等效电感232对于各通道汇接点A的匹配影响会变小(不等于没有)，同时匹配电感230因为更靠近汇接点A(相当于图1中的等效电感132为0nH)，电感值相对更小，Q值可以更高，减小了器件插入损耗。
虽然图2中的方案可以采用较小感值的匹配电感，一定程度上解决了匹配的问题，但因为汇接点A一般都需要靠近公共端口220，否则等效电感232就会比较大，因此匹配电感230一般也会离公共端口220较近。这个位置的限制，给位于公共端口附近的滤波器通道端口之间的隔离度带来了挑战。
发明内容
为缓解或解决使用现有技术中的上述问题的至少一个方面，提出本发明。
本发明提出了一种射频压电多工器单元，包括：封装载板；至少三个滤波器，封装于所述封装载板且适于共同连接于公共端口；用于接地的匹配电感；移相网络模块，其中：所述匹配电感和移相网络模块封装于所述封装载板中；所述移相网络模块的至少一部分适于连接在所述公共端口与所述匹配电感之间。
可选的，匹配电感与公共端口所在的封装载板的边之间的直线距离在与该直线距离所在直线平行的封装载板的边的边长的三分之一到三分之二的范围之内。或者可选的，所述至少三个滤波器包括接收滤波器和发射滤波器；封装载板包括设置在所述接收滤波器与所述发射滤波器之间的公共端口连接区域；且所述匹配电感位于所述接收滤波器与所述发射滤波器之间的隔离劣化区域之外。
可选的，所述移相网络模块包括至少一个移相电性器件。进一步的，移相电性器 件中的至少一个连接在汇接点与匹配电感之间。
可选的，所述公共端口适于通过等效电感与天线相接；且所述等效电感位于所述封装载板之外。
可选的，采用逐级匹配的方式设置所述移相网络模块。
本发明的实施例还涉及一种用于多工器的封装载板，包括：与多工器的公共端口匹配的匹配电感；至少一个移相电性器件，用于对多工器的滤波器的阻抗进行相位移动，其中：所述至少一个移相电性器件中的至少一个适于连接在公共端口与匹配电感之间。
可选的，上述封装基板中，匹配电感与公共端口所在的封装载板的边之间的直线距离，在与该直线距离所在直线平行的封装载板的边的边长的三分之一到三分之二的范围之内。或者可选的，上述封装载板上适于设置至少三个滤波器，所述至少三个滤波器包括接收滤波器和发射滤波器；所述封装载板包括设置在所述接收滤波器与所述发射滤波器之间的公共端口连接区域；且所述匹配电感位于所述接收滤波器与所述发射滤波器之间的隔离劣化区域之外。
根据本发明的实施例的再一方面，提出了一种射频压电多工器，包括上述的射频压电多工器单元或者上述的封装载板。
根据本发明的实施例的另一方面，提出了一种电子设备，包括上述的射频压电多工器单元。
附图说明
以下描述与附图可以更好地帮助理解本发明所公布的各种实施例中的这些和其他特点、优点，图中相同的附图标记始终表示相同的部件，其中：
图1为现有技术中的一种多工器的设计原理示意图；
图2为现有技术中的另一种多工器的设计原理示意图；
图3为示出图1中的多工器各通道单独从公共端口看入时各通道的阻抗位置的Smith圆图；
图4为示出图1中的多工器各通道在公共端口汇接后从公共端口看入时各通道的阻抗位置的Smith圆图；
图5为根据本发明的一个示例性实施例的多工器的设计原理示意图；
图6为图5中的多工器所对应的一个示例性实施示意图；
图7示出了图5中的多工器各通道单独从公共端口看入时各通道的阻抗位置的Smith圆图；
图8为示出图5中的多工器各通道在公共端口汇接后从公共端口看入时各通道的阻抗位置的Smith圆图；
图9示例性示出了根据图5的多工器的各通道的幅频响应曲线，其中横坐标是频率，纵坐标为插入损耗；
图10示例性示出了根据图6的多工器的B1Rx与B3Tx之间的隔离度曲线，其中虚线对应于现有技术，实线对应于采用了本发明的技术方案的技术；
图11为根据本发明的一个示例性实施例的多工器的设计原理示意图；
图12为根据本发明的一个示例性实施例的多工器的设计原理示意图；
图13为根据本发明的一个示例性实施例的多工器的设计原理示意图；
图14为根据本发明的一个示例性实施例的多工器的设计原理示意图。
具体实施方式
下面通过实施例，并结合附图，对本发明的技术方案作进一步具体的说明。在说明书中，相同或相似的附图标号指示相同或相似的部件。下述参照附图对本发明实施方式的说明旨在对本发明的总体发明构思进行解释，而不应当理解为对本发明的一种限制。
下面参照附图示例性描述根据本发明的射频压电多工器单元以及射频压电多工器。
附图标记600表示射频压电多工器单元。如图5所示，移相电性器件642位于滤波器602与滤波器604之间；移相电性器件644位于滤波器604与滤波器606之间；移相电性器件646位于滤波器606与滤波器608之间、且位于滤波器606与匹配点B(接匹配电感630)之间；移相电性器件648位于匹配点B或者匹配电感630与滤波器608之间。与图1中的多工器单元100不同的是，在图5的示例性实施例中，各滤波器逐级通过移相电性器件汇接，最后连接到汇接点A，匹配电感630可以看作是位于汇接的初始级，因此与最终的公共端口620之间，存在多个移相电性器件或移相网 络642、644、646，从而可以使得匹配电感630的位置远离公共端口620。
图5中，附图标记612、614、616、618是连接在各端口与滤波器之间的阻抗匹配网络，匹配网络可以由匹配器件组成，匹配器件可以是电感，也可以是电容，可以串联连接，也可以并联连接，也可以是多种匹配器件、多种连接方法的组合。匹配网络也可以在器件外部以分立元件的形式实现匹配。
在匹配电感630与公共端口620之间设置移相网络或者移相电性器件不限于图5中的形式，还可以采用多种变形方式。图11-14给出了不同的示例性实施例。
图11为一个示例性实施例，其与图5中的区别在于，取消了其中的移相电性器件646，将匹配电感630向公共端口620略微移近一些，但仍能实现同样的技术效果。
图12为又一示例性实施例，其与图5中的区别在于，与匹配电感630较近的，作为初始汇接的网络，不是一个滤波器，而是两个端口直接接在一起的双工器(最下面的两个滤波器)。
图13为又一示例性实施例，其与图5中的区别在于，作为后级汇接匹配的两个通道，不是单独的滤波器，而是两个双工器(上两个滤波器组成一个双工器，下两个滤波器组成另一个双工器)。
图14为又一示例性实施例，其与图13中的区别在于，该多工器为五工器。
图6为图5中的多工器所对应的使用移相网络使得公共端口与匹配电感远离的一个示例性实施示意图。可以认为图6是图5的实施的具体方式。在图6中，附图标记900表示多工器单元。
参见附图6，频段1(Band 1)和频段3(Band 3)四工器的5个通道端口如黑点所示，其中通道端口B1Rx(通带1接收，2110MHz-2170MHz)位于左上角，通道端口B3Rx(通带3接收，1805MHz-1880MHz)位于左下角，通道端口B3Tx(频段3发送，1710MHz-1785MHz)位于右上角，通道端口B1Tx(频段1发送，1920MHz-1980MHz)位于右下角。其中通道端口B1Rx的频率最高，隔离度的敏感度最高，若匹配电感908位于公共端口连接区域902附近，例如图6中虚框920表示的区域，则该匹配电感的存在会给通道端口B1Rx与其它通道端口(例如B3Rx)之间的隔离度造成不利影响。
在图6中，图中黑环空心的图形代表封装载板上的过孔904或906，用于实现封装载板中不同层电路之间的电学互连，例如，过孔904与附图5中的A点对应，用于连接到公共端口，而过孔906例如可以是用于接地；实心的粗线条代表封装载板中的 线路，用于实现移相网络或者匹配网络；四个实线小方框分别为四颗滤波器；实心的圆点为滤波器的端口，其中一个端口，如端口905接到多工器器件的相应通道端口，如B1Rx，另一个端口通过本专利的技术方案，利用移相电性器件912、914、916、918，将四颗滤波器连接到公共端口连接区域902或者公共端口。在图6中，附图标记908是从移相电性器件916和918之间某点引出的一个螺旋形状的匹配电感，并通过一个过孔连接到封装载板的地端。
图6中的匹配电感908即对应图5中的匹配电感630。此外，图5中的移相电性器件642、644、646、648分别对应图6中的移相电性器件912、914、916、918。图6中的在公共端口(图6中示例为的ANT端口)附近的矩形虚框920，位于B1Rx与B3Tx之间。基于封装载板的尺寸，在一个实施例中，矩形虚框920的尺寸约为1.2mm x 1.2mm。如果按照现有技术，为了达到较好的匹配，集成在封装载板上的匹配电感，应该位于该区域920，但这样会因为对隔离度要求较高的B1Rx与B3Tx之间存在一个电感，导致隔离度变差。因此，从隔离度的要求而言，可以认为图6中的虚框920(包含了作为公共端口连接区域902的小虚框)为不适于设置匹配电感的区域，该区域可以称为隔离劣化区域。如图6所示，隔离劣化区域位于接收滤波器和发射滤波器之间，而匹配电感则位于所述隔离劣化区域之外。
在本发明中，利用移相网络或者移相电性器件，将匹配电感908完全设置在公共端口连接区域920以外的位置。具体的，可以使得匹配电感908与公共端口902所在的封装载板的边之间的直线距离X(参见图6)在与该直线距离所在直线平行的封装载板的边的边长Y(参见图6)的三分之一到三分之二的范围之内，以改善隔离度。
图7示出了图5中的多工器各通道单独从公共端口看入时各通道的阻抗位置的Smith圆图。图7中并不包含匹配电感，示出了从各通道单独从公共端口看入时该通道(包含该距离通道最近的移相电性器件、滤波器以及匹配网络，其它通道断开，属于其它通道的移相电性器件短路)的阻抗位置。
从图7中可以看到，由于采用了移相网络或者移相电性器件逐级匹配的方案，每个通道的视入阻抗位置虽然仍是呈容性，但距离Smith圆图中心点更近，降低了匹配难度。
下面简单说明移相网络的逐级匹配。例如，在现有技术中，在四颗滤波器汇接后，所加的匹配电感，会同时作用于四个频段，匹配难度较大。而在本发明中，逐级匹配 可以理解为：匹配电感主要作用于匹配点连接的那颗滤波器的频段，匹配相对容易，然后通过移相网络或者移相电性器件与下一个频段滤波器匹配，汇接之后，二者作为一个整体，再通过移相网络或者移相电性器件，将两个频段的输入阻抗移到一个合适的位置，再与下一颗滤波器汇接，以此类推。
图8为示出图5中的多工器各通道在公共端口汇接后从公共端口看入时各通道的阻抗位置的Smith圆图。图8示出了图5中的多工器单元600匹配之后，从公共端看入时各通道的阻抗位置。从图8中的Smith圆图中的阻抗曲线可以看出，相比图1中示出的多工器单元100，图5中的多工器单元600的阻抗更趋近于圆图的中心，即实现了更优秀的匹配特性。
图9示例性示出了根据图5的多工器的各通道的幅频响应曲线，其中横坐标是频率(Frequency)，纵坐标为插入损耗(Insertion Loss)。相比现有技术，图9中的通带插入损耗基本相当，没有因为匹配电感位置的移动造成插入损耗增加。
图10示例性示出了根据图5、图6的多工器的B1Rx与B3Tx之间的隔离度曲线，其中虚线对应于现有技术，实线对应于采用了本发明的技术方案的技术，横坐标是频率(Frequency)，纵坐标为隔离度(Isolation)。对于现有技术，因为匹配电感必须位于公共端口附近，匹配电感与B1Rx和B3Tx之间存在电磁场耦合，在1710MH-1785MHz内的隔离度的最差值为56dB，在2110MHz-2170MHz内的隔离度的最差值为54dB。对于采用了本发明的图5和图6中示出的实施方案的技术，由于匹配电感远离了公共端口以及B1Rx与B3Tx，在1710MHz-1785MHz内的隔离度的最差值提高到61dB，在2110MHz-2170MHz内的隔离度的最差值提高到56dB，同时还实现了较好的阻抗匹配效果。
基于以上，本发明提出了一种射频压电多工器单元，包括：封装载板；至少三个滤波器，适于共同连接于公共端口；用于接地的匹配电感；移相网络模块，其中：所述滤波器、匹配电感和移相网络模块封装于所述封装载板中；所述移相网络模块的至少一部分适于连接在公共端口与匹配电感之间。
本发明的实施例也涉及一种电子设备，包括上述的射频压电多工器。需要指出的是，这里的电子设备，包括但不限于射频前端、滤波放大模块等中间产品，以及手机、WIFI、无人机等终端产品。
尽管已经示出和描述了本发明的实施例，对于本领域的普通技术人员而言，可以 理解在不脱离本发明的原理和精神的情况下可以对这些实施例进行变化，本发明的范围由所附权利要求及其等同物限定。

Claims (12)

  1. 一种射频压电多工器单元，包括：
    封装载板；
    至少三个滤波器，封装于所述封装载板，且适于共同连接于公共端口；
    用于接地的匹配电感；
    移相网络模块，
    其中：
    所述匹配电感和移相网络模块封装于所述封装载板中；
    所述移相网络模块的至少一部分适于连接在公共端口与匹配电感之间。
  2. 根据权利要求1所述的射频压电多工器单元，其中：
    匹配电感与公共端口所在的封装载板的边之间的直线距离，在与该直线距离所在直线平行的封装载板的边的边长的三分之一到三分之二的范围之内。
  3. 根据权利要求1所述的射频压电多工器单元，其中：
    所述至少三个滤波器包括接收滤波器和发射滤波器；
    封装载板包括设置在所述接收滤波器与所述发射滤波器之间的公共端口连接区域；且
    所述匹配电感位于所述接收滤波器与所述发射滤波器之间的隔离劣化区域之外。
  4. 根据权利要求1-3中任一项所述的射频压电多工器单元，其中：
    所述移相网络模块包括至少一个移相电性器件。
  5. 根据权利要求4中的射频压电多工器单元，其中：
    移相电性器件中的至少一个连接在汇接点与匹配电感之间。
  6. 根据权利要求1-3中任一项所述的射频压电多工器单元，其中：
    所述公共端口适于通过等效电感与天线相接；且
    所述等效电感位于所述封装载板之外。
  7. 根据权利要求1-3中任一项所述的射频压电多工器单元，其中：
    采用逐级匹配的方式设置所述移相网络模块。
  8. 一种用于多工器的封装载板，包括：
    与多工器的公共端口匹配的匹配电感；
    至少一个移相电性器件，用于对多工器的滤波器的阻抗进行相位移动，
    其中：
    所述至少一个移相电性器件中的至少一个适于连接在公共端口与匹配电感之间。
  9. 根据权利要求8所述的封装载板，其中：
    匹配电感与公共端口所在的封装载板的边之间的直线距离，在与该直线距离所在直线平行的封装载板的边的边长的三分之一到三分之二的范围之内。
  10. 根据权利要求8所述的封装载板，其中：
    所述封装载板上适于设置至少三个滤波器，所述至少三个滤波器包括接收滤波器和发射滤波器；
    所述封装载板包括设置在所述接收滤波器与所述发射滤波器之间的公共端口连接区域；且
    所述匹配电感位于所述接收滤波器与所述发射滤波器之间的隔离劣化区域之外。
  11. 一种射频压电多工器，包括：
    根据权利要求1-7中任一项所述的射频压电多工器单元或者根据权利要求8-10中任一项所述的封装载板。
  12. 一种电子设备，包括根据权利要求1-7中任一项所述的射频压电多工器单元。
PCT/CN2019/121010 2018-12-18 2019-11-26 基于移相网络提高隔离度的射频压电多工器和电子设备 WO2020125344A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201811566387.1A CN111342813B (zh) 2018-12-18 2018-12-18 基于移相网络提高隔离度的射频压电多工器和电子设备
CN201811566387.1 2018-12-18

Publications (1)

Publication Number Publication Date
WO2020125344A1 true WO2020125344A1 (zh) 2020-06-25

Family

ID=71100185

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/121010 WO2020125344A1 (zh) 2018-12-18 2019-11-26 基于移相网络提高隔离度的射频压电多工器和电子设备

Country Status (2)

Country Link
CN (1) CN111342813B (zh)
WO (1) WO2020125344A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112272030B (zh) * 2020-10-26 2022-07-08 Oppo广东移动通信有限公司 射频前端模组及射频组件、电子设备
CN112511126B (zh) * 2020-10-30 2022-03-15 诺思(天津)微系统有限责任公司 多工器和改善多工器隔离度的方法以及通信设备
CN112865741A (zh) * 2021-01-04 2021-05-28 诺思(天津)微系统有限责任公司 多工器和改善多工器隔离度的方法以及通信设备
CN113162637A (zh) * 2021-04-28 2021-07-23 上海芯波电子科技有限公司 天线复用器的系统级封装终端及方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107623503A (zh) * 2016-07-13 2018-01-23 株式会社村田制作所 多工器、高频前端电路、通信装置及多工器的设计方法
CN108432131A (zh) * 2015-12-28 2018-08-21 株式会社村田制作所 多工器
CN108964633A (zh) * 2017-05-19 2018-12-07 株式会社村田制作所 多工器、高频前端电路以及通信装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8193877B2 (en) * 2009-11-30 2012-06-05 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Duplexer with negative phase shifting circuit
DE102016122000A1 (de) * 2016-11-16 2018-05-17 Snaptrack, Inc. Multiplexer mit verbesserter Isolation, Modul umfassend einen Multiplexer und ein Verfahren zum Entwerfen einer Multiplexer-Topologie

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108432131A (zh) * 2015-12-28 2018-08-21 株式会社村田制作所 多工器
CN107623503A (zh) * 2016-07-13 2018-01-23 株式会社村田制作所 多工器、高频前端电路、通信装置及多工器的设计方法
CN108964633A (zh) * 2017-05-19 2018-12-07 株式会社村田制作所 多工器、高频前端电路以及通信装置

Also Published As

Publication number Publication date
CN111342813B (zh) 2023-05-12
CN111342813A (zh) 2020-06-26

Similar Documents

Publication Publication Date Title
TWI829722B (zh) 與諧振（lc）濾波器級聯之混合式聲音諧振（lc）濾波器
WO2020125344A1 (zh) 基于移相网络提高隔离度的射频压电多工器和电子设备
US7339445B2 (en) BAW duplexer without phase shifter
CN102811032B (zh) 电子电路和电子模块
US9871543B2 (en) Miniature acoustic resonator-based filters and duplexers with cancellation methodology
CN102439789B (zh) Rf前端模块和天线系统
JP6266210B2 (ja) モジュール
KR102060406B1 (ko) 분파 장치 및 그 설계 방법
US8995310B2 (en) Communication module
US20150163044A1 (en) Enhancing Isolation and Impedance Matching in Hybrid-Based Cancellation Networks and Duplexers
WO2021147632A1 (zh) 四工器的拓扑结构
WO2018123972A1 (ja) 高周波モジュール及び通信装置
JP2015029233A (ja) 電子回路
WO2020125208A1 (zh) 带通滤波器及提高其抑制水平的方法、双工器和电子设备
JP2015023557A (ja) 電子回路
EP3902144A1 (en) Multi-channel transmitter radio frequency front-end structure, terminal, and wireless communication device
JP2021064874A (ja) 高周波モジュールおよび通信装置
US9041485B2 (en) High frequency electronic component
TWI540850B (zh) 無線通訊裝置與其濾波器
WO2022044580A1 (ja) 高周波回路および通信装置
US11881844B2 (en) Multiplexer
CN115955211A (zh) 一种体声波滤波器、双工器和电子设备
JP2006514461A (ja) フロントエンド回路
CN215344571U (zh) 应用于载波聚合的四路复用器
TWI834692B (zh) 具有諧波抑制的混合式聲音諧振（lc）濾波器

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19898896

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19898896

Country of ref document: EP

Kind code of ref document: A1