WO2020125187A1 - Appareil d'impression de pcb et son procédé de commande - Google Patents

Appareil d'impression de pcb et son procédé de commande Download PDF

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Publication number
WO2020125187A1
WO2020125187A1 PCT/CN2019/112502 CN2019112502W WO2020125187A1 WO 2020125187 A1 WO2020125187 A1 WO 2020125187A1 CN 2019112502 W CN2019112502 W CN 2019112502W WO 2020125187 A1 WO2020125187 A1 WO 2020125187A1
Authority
WO
WIPO (PCT)
Prior art keywords
scraper
pcb board
cylinder
printing
ccd
Prior art date
Application number
PCT/CN2019/112502
Other languages
English (en)
Chinese (zh)
Inventor
邱国良
宋先玖
Original Assignee
东莞市凯格精密机械有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 东莞市凯格精密机械有限公司 filed Critical 东莞市凯格精密机械有限公司
Publication of WO2020125187A1 publication Critical patent/WO2020125187A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes

Definitions

  • the invention relates to the technical field of printing, in particular to a PCB board printing device and a control method thereof.
  • the object of the present invention is to provide a device for PCB board printing and a control method thereof to solve the problem of uneven thickness of solder paste.
  • the present invention uses the following technical solutions:
  • a PCB printing device includes a steel mesh, a scraper, and a scraper pressure adjustment mechanism.
  • the pressure adjustment mechanism includes a controller, an electric proportional valve, a scraper cylinder, and a solenoid valve;
  • the controller is connected to the electric proportional valve; the air outlet of the solenoid valve is connected to the air inlet of the electric proportional valve through the trachea, the air inlet of the scraper cylinder is connected to the air outlet of the electric proportional valve through the trachea, and the air outlet of the scraper cylinder is connected to the solenoid valve through the air pipe Exhaust port; the jack of the scraper cylinder is fixedly connected to the scraper to drive the scraper up and down;
  • the controller compares the voltage value output by the electric proportional valve to determine the current pressure value acting on the steel mesh in real time, and increases the compressed air in the scraper cylinder when the current pressure value of the scraper cylinder is less than the preset pressure value, or When the current pressure value of the cylinder is greater than the preset pressure value, the compressed air in the scraper cylinder is reduced.
  • a control method for PCB board printing including: using a scraper cylinder to drive a scraper to perform a solder paste scraping step,
  • the current pressure value of the scraper acting on the steel mesh is detected in real time
  • the compressed air in the cylinder is reduced until the current pressure value is adjusted to the preset pressure value.
  • the step: before using the scraper cylinder to drive the scraper to perform the solder paste scraping operation further includes:
  • the conveyor belt transports the PCB board to the printing platform
  • the printing platform rises from the initial position of the printing platform to the imaging position of the printing platform, and the clamping plate clamps the PCB board;
  • the CCD moves from the initial position of the CCD to the imaging position of the CCD, performs rough stop positioning and imaging on the PCB board, and outputs the image processing result;
  • the PCB board is precisely positioned
  • the CCD returns to the initial position of the CCD, and the printing platform rises to the printing position of the printing platform so that the PCB board contacts the steel mesh.
  • the scraper cylinder drives the scraper to rise back to the alternate position of the scraper, and then the scraper rises from the alternate position of the scraper to the initial position of the scraper.
  • the printing platform descends from the printing position of the printing platform to the initial position of the printing platform;
  • the conveyor belt transports the PCB board out.
  • the stop plate cylinder on the CCD is extended to stop the PCB board. Then the camera on the CCD moves to capture the image information of at least two mark points on the PCB board, and the CCD image the image information Processing, analyze the position of each mark point, and output the image processing result.
  • the position of each mark point on the PCB board output according to the image processing result of the CCD is adjusted to correspond to the mark point on the steel mesh one by one, and the PCB board is precisely positioned.
  • the step: before the transport belt transports the PCB board to the printing platform further includes:
  • the baffle cylinder After receiving the feed signal from the feed sensor, the baffle cylinder acts and extends the baffle.
  • the conveyor belt After receiving the incoming signal from the incoming sensor, the conveyor belt stops.
  • the invention maintains the preset initial pressure by controlling the pressure of the contact between the scraper and the steel mesh, solves the problem of uneven thickness of solder paste during printing, improves the quality of PCB board printing, and enhances the overall performance of the PCB board.
  • FIG. 1 is a flowchart of a method for controlling PCB board printing provided by an embodiment of the present invention
  • FIG. 2 is a schematic structural diagram of a scraper pressure adjustment mechanism for PCB board printing provided by an embodiment of the present invention
  • FIG. 3 is a flowchart of a method for maintaining a constant voltage for PCB board printing according to an embodiment of the present invention.
  • Controller 20. Electric proportional valve; 30. Scraper cylinder; 40. Solenoid valve; 51. Intake speed adjustment valve; 52. Outlet speed adjustment valve; 60. Industrial control machine.
  • a component when a component is considered to be “connected” to another component, it may be directly connected to another component or there may be a centrally located component at the same time.
  • a component When a component is considered to be “set on” another component, it may be set directly on another component or there may be a center-set component at the same time.
  • Step S101 After receiving the feed signal from the feed sensor, the transport motor rotates, the baffle cylinder moves, and the baffle is extended; wherein, when the PCB board is placed on the transport belt, the feed sensor acts and launches ⁇ Material signals.
  • Step S102 The conveyor belt transports the PCB board to the printing platform. When the PCB board is transported to the baffle, it will be blocked by the baffle.
  • Step S103 After receiving the material arrival signal from the material arrival sensor, the conveyor belt stops; at this time, the PCB board is located on the printing platform, and at this time, the printing platform is located at the initial position of the printing platform.
  • Step S104 the CCD stop plate cylinder coarsely positions the PCB board to ensure accurate position during printing, thereby improving printing quality.
  • Step S105 the baffle cylinder operates, and the baffle is retracted.
  • Step S106 the printing platform rises from the initial position of the printing platform to the image capturing position of the printing platform, and the clamping plate clamps the PCB board.
  • Step S107 the CCD is moved from the initial position of the CCD to the CCD imaging position to perform rough stop positioning and imaging on the PCB board and output image processing results; after the CCD imaging, image processing is performed on the acquired image and corresponding image processing is output result.
  • the stop plate cylinder on the CCD is extended to stop the PCB board, and then the camera on the CCD moves to capture the image information of at least two mark points on the PCB board.
  • the information is image processed, the position of each mark point is analyzed, and the image processing result is output.
  • Step S108 accurately positioning the PCB board according to the image processing result of the CCD; specifically, the position of each mark point on the PCB board output according to the image processing result of the CCD is adjusted to correspond one-to-one with the mark points on the steel mesh , Precise positioning of the PCB board.
  • Step S109 The CCD returns to the initial position of the CCD, and the printing platform rises to the printing position of the printing platform, so that the PCB board and the steel mesh are in full contact.
  • Step S110 a step of using a scraper cylinder to drive the scraper to perform the solder paste scraping operation; in a step of using the scraper cylinder to drive the scraper to perform solder paste scraping operation, the current pressure value of the scraper acting on the steel mesh is detected in real time;
  • the compressed air in the cylinder is reduced until the current pressure value is adjusted to the preset pressure value.
  • step S110 it further includes: after printing is completed, the scraper cylinder 30 drives the scraper to rise back to the alternate position of the scraper, and then the scraper rises from the alternate position of the scraper to the initial position of the scraper.
  • Step S111 The steel mesh is demolded.
  • Step S112 The printing platform is lowered from the printing position of the printing platform to the initial position of the printing platform.
  • Step S113 The conveyor belt transports the PCB board out to complete the printing of the PCB board.
  • a PCB board printing device includes a steel mesh, a scraper, and a scraper pressure adjustment mechanism.
  • the scraper pressure adjustment mechanism includes a controller 10, an electric proportional valve 20, a scraper cylinder 30, a solenoid valve 40, an intake speed adjustment valve 51, an exhaust speed adjustment valve 52, and an industrial control machine 60; the controller 10 is connected to the electrical Proportional valve 20, solenoid valve 40 and industrial control machine 60; the air inlet of the scraper cylinder 30 communicates with the electric proportional valve 20 through the trachea, and the air outlet of the scraper cylinder 30 communicates with the solenoid valve 40 through the trachea; the ejector of the scraper cylinder 30 is fixedly connected to the scraper , So that the scraper cylinder 30 drives the scraper up and down; the intake speed adjustment valve 51 is provided between the intake port of the scraper cylinder 30 and the electric proportional valve 20 for adjusting the speed of compressed air intake, and the exhaust speed adjustment valve 52 is provided on the scraper Between the air outlet of the cylinder 30 and the solenoid valve 40, it is used to adjust the speed of the exhaust when the e
  • the controller 10 compares the voltage value output by the electric proportional valve 20 to determine the current pressure value acting on the steel mesh in real time, and increases the compression in the blade cylinder 30 when the current pressure value of the blade cylinder 30 is less than the preset pressure value Air, or reduce the compressed air in the scraper cylinder 30 when the current pressure value of the scraper cylinder 30 is greater than the preset pressure value.
  • step S110 specifically includes the following steps:
  • Step S1101 the controller 10 controls the blade to be lowered from the initial position of the blade to the alternate position of the blade;
  • Step S1102 the controller 10 controls the solenoid valve 40 to turn on, and compressed air flows from the solenoid valve 40 to the electric proportional valve 20;
  • Step S1103 The controller 10 outputs a preset voltage value to the electric proportional valve 20. After receiving the voltage value output by the controller 10, the electric proportional valve 20 converts the electric proportional valve 20 to output the corresponding proportion of compressed air to the scraper cylinder 30. , Excess compressed air will be discharged from the exhaust port of the electric proportional valve 20.
  • the scraper cylinder 30 drives the scraper down to make full contact with the steel mesh.
  • the pressure between the scraper and the steel mesh is defined as a preset pressure value.
  • the electric proportional valve 20 feeds back the current voltage value to the controller 10 in real time, and reflects the actual compressed air ratio of the current electric proportional valve 20 to the controller 10.
  • the controller 10 converts the current voltage value according to the current voltage value to obtain the current pressure value acting on the steel mesh.
  • Step S1104 The controller 10 controls the scraper to scrape the solder paste.
  • the distance of the cylinder extension will change, so that the cylinder gas storage volume changes, so that The pressure between the scraper and the steel mesh changes.
  • Step S1105 determine whether the current pressure value between the scraper and the steel mesh is less than or greater than the preset pressure value.
  • Step S1106 If the current pressure value between the blade and the steel mesh is less than the preset pressure value, the controller 10 controls the electric proportional valve 20 to deliver compressed air to the blade cylinder 30, thereby increasing the air pressure in the blade cylinder 30 until the current pressure The value is adjusted to a preset pressure value, so that the scraper cylinder 30 maintains a stable pressure output, and finally the pressure at which the scraper contacts the steel mesh is controlled to maintain the preset pressure value.
  • Step S1107 If the current pressure value between the blade and the steel mesh is greater than the preset pressure value, the controller 10 controls the electric proportional valve 20 to discharge excess compressed air through the exhaust port until the current pressure value is adjusted to the preset pressure value , So that the scraper cylinder 30 maintains a stable pressure output, and finally controls the pressure at which the scraper contacts the steel mesh to maintain a preset pressure value.
  • step S1107 it also includes: after the printing is completed, the controller 10 controls the cylinder rod to retract, and drives the scraper to rise away from the stencil. When the cylinder drives the scraper to the alternate position of the scraper, the controller 10 continues to control the scraper to rise until the scraper returns The initial position of the scraper.
  • This embodiment provides a control method for PCB board printing.
  • the pressure of the contact between the scraper and the steel mesh to maintain the preset initial pressure, the problem of uneven thickness of solder paste during printing is solved, and PCB board printing is improved.
  • the quality enhances the overall performance of the PCB board.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Screen Printers (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Appareil d'impression de PCT comprenant un treillis d'acier et une lame de raclage et comprenant en outre un mécanisme de réglage de pression de lame de raclage, le mécanisme de réglage de pression comprenant un dispositif de commande (10), une vanne proportionnelle électrique (20), un cylindre de lame de raclage (30) et une électrovanne (40) ; le dispositif de commande (10) étant connecté à la soupape proportionnelle électrique (20) ; une ouverture de sortie d'air de l'électrovanne (40) étant en communication avec une ouverture d'entrée d'air de la valve proportionnelle électrique (20) au moyen d'un tube d'air, une ouverture d'entrée d'air du cylindre de lame de raclage (30) étant en communication avec une ouverture de sortie d'air de la soupape proportionnelle électrique (20) au moyen d'un tube d'air et une ouverture de sortie d'air du cylindre de lame de raclage (30) étant en communication avec une ouverture d'échappement d'air de l'électrovanne (40) au moyen d'un tube d'air ; une tige de poussée du cylindre de lame de raclage (30) étant reliée de manière fixe à la lame de raclage, de façon à entraîner la lame de raclage à monter et à descendre. Le maintien d'une pression initiale prédéterminée au moyen de la commande de la pression de contact entre une lame de raclage et un treillis d'acier résout le problème de l'épaisseur de pâte de soudure non uniforme qui se produit facilement lors de l'impression, améliorant la qualité d'impression de PCT et renforçant la fonctionnalité globale de PCB.
PCT/CN2019/112502 2018-12-17 2019-10-22 Appareil d'impression de pcb et son procédé de commande WO2020125187A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201811543519.9A CN109413889A (zh) 2018-12-17 2018-12-17 一种pcb板印刷的装置及其控制方法
CN201811543519.9 2018-12-17

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WO2020125187A1 true WO2020125187A1 (fr) 2020-06-25

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WO (1) WO2020125187A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114130597A (zh) * 2021-09-14 2022-03-04 宁德卓高新材料科技有限公司 一种厚度可调的隔膜涂覆装置及其方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109413889A (zh) * 2018-12-17 2019-03-01 东莞市凯格精密机械有限公司 一种pcb板印刷的装置及其控制方法
CN113351533B (zh) * 2021-06-02 2023-01-10 珠海冠宇电池股份有限公司 一种刮刀控制方法及极片涂层刮除方法

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CN109413889A (zh) * 2018-12-17 2019-03-01 东莞市凯格精密机械有限公司 一种pcb板印刷的装置及其控制方法

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Publication number Priority date Publication date Assignee Title
JP2008288515A (ja) * 2007-05-21 2008-11-27 Hitachi Plant Technologies Ltd ハンダボール印刷装置
CN104191807A (zh) * 2014-08-04 2014-12-10 深圳劲嘉彩印集团股份有限公司 一种丝网印刷设备
CN204020201U (zh) * 2014-08-04 2014-12-17 深圳劲嘉彩印集团股份有限公司 丝网印刷设备
CN105235367A (zh) * 2015-11-05 2016-01-13 东莞市科隆威自动化设备有限公司 一种硅片印刷机气动式刮刀头控制方法
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CN206394207U (zh) * 2017-01-11 2017-08-11 东莞市准锐自动化设备有限公司 一种结构精简的全自动ccd丝网印刷机
CN109413889A (zh) * 2018-12-17 2019-03-01 东莞市凯格精密机械有限公司 一种pcb板印刷的装置及其控制方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114130597A (zh) * 2021-09-14 2022-03-04 宁德卓高新材料科技有限公司 一种厚度可调的隔膜涂覆装置及其方法

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