WO2020124939A1 - Oled显示面板及其制备方法 - Google Patents
Oled显示面板及其制备方法 Download PDFInfo
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- WO2020124939A1 WO2020124939A1 PCT/CN2019/086607 CN2019086607W WO2020124939A1 WO 2020124939 A1 WO2020124939 A1 WO 2020124939A1 CN 2019086607 W CN2019086607 W CN 2019086607W WO 2020124939 A1 WO2020124939 A1 WO 2020124939A1
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- layer
- water
- display panel
- oled display
- pixel defining
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000011368 organic material Substances 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims description 66
- 238000005538 encapsulation Methods 0.000 claims description 51
- 239000011347 resin Substances 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 18
- 239000002250 absorbent Substances 0.000 claims description 12
- 238000010521 absorption reaction Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 9
- -1 polyoxyalkylenes Polymers 0.000 claims description 8
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 7
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 6
- 239000005018 casein Substances 0.000 claims description 6
- BECPQYXYKAMYBN-UHFFFAOYSA-N casein, tech. Chemical compound NCCCCC(C(O)=O)N=C(O)C(CC(O)=O)N=C(O)C(CCC(O)=N)N=C(O)C(CC(C)C)N=C(O)C(CCC(O)=O)N=C(O)C(CC(O)=O)N=C(O)C(CCC(O)=O)N=C(O)C(C(C)O)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=O)N=C(O)C(CCC(O)=O)N=C(O)C(COP(O)(O)=O)N=C(O)C(CCC(O)=N)N=C(O)C(N)CC1=CC=CC=C1 BECPQYXYKAMYBN-UHFFFAOYSA-N 0.000 claims description 6
- 235000021240 caseins Nutrition 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 229920000058 polyacrylate Polymers 0.000 claims description 6
- 229920002635 polyurethane Polymers 0.000 claims description 6
- 239000004814 polyurethane Substances 0.000 claims description 6
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 6
- 235000019422 polyvinyl alcohol Nutrition 0.000 claims description 6
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims description 4
- 239000000292 calcium oxide Substances 0.000 claims description 4
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 11
- 229910052760 oxygen Inorganic materials 0.000 abstract description 11
- 239000001301 oxygen Substances 0.000 abstract description 11
- 239000010409 thin film Substances 0.000 description 15
- 239000000463 material Substances 0.000 description 8
- 239000007788 liquid Substances 0.000 description 6
- 150000001805 chlorine compounds Chemical class 0.000 description 5
- 239000002274 desiccant Substances 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 239000001110 calcium chloride Substances 0.000 description 2
- 229910001628 calcium chloride Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910021389 graphene Inorganic materials 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 229910000480 nickel oxide Inorganic materials 0.000 description 2
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 229920005553 polystyrene-acrylate Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 2
- 239000011592 zinc chloride Substances 0.000 description 2
- 235000005074 zinc chloride Nutrition 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000002000 scavenging effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
Definitions
- the invention relates to the technical field of displays, in particular to an OLED display panel and a preparation method thereof.
- OLED Organic Light-Emitting Diode
- Current OLED display panels usually include an array substrate and an encapsulation layer.
- a pixel defining layer is provided on the surface of the array substrate.
- the pixel defining layer has a plurality of openings. Each opening is provided with an OLED light emitting device, and the encapsulation layer covers the pixel defining layer. Side to isolate the OLED light-emitting device from the external environment and to prevent the OLED light-emitting device from being affected by water and oxygen in the external environment. For this reason, the packaging materials of OLED display panels have been further researched and developed.
- the encapsulated internal organic materials also need to have the ability to remove water and oxygen, this is because the OLED display panel's organic light-emitting layer materials and cathode metal materials are very It is easily eroded by water and oxygen in the environment, and the material of the organic light-emitting layer of the OLED itself contains a certain amount of moisture, so that a certain amount of moisture will be sealed between the array substrate and the encapsulation layer during the process, and this moisture will The release of water vapor affects the OLED display panel, causing the OLED display panel to be damaged due to moisture absorption, thereby shortening the life of the OLED display panel.
- An object of the present invention is to provide an OLED display panel and a preparation method thereof, which can enable the encapsulated internal organic material to have the ability to remove water and oxygen, thereby further ensuring the reliable service life of the OLED display panel.
- the present invention provides an OLED display panel including an array substrate, a pixel defining layer disposed on the array substrate, and an encapsulation layer, the pixel defining layer being encapsulated in the encapsulation layer And the array substrate, a water-absorbing layer is provided on the pixel defining layer, the water-absorbing layer is used to remove moisture between the array substrate and the encapsulation layer; the OLED display panel further includes an adhesion layer, The adhesion layer is disposed between the water-absorbing layer and the pixel defining layer, and the adhesion layer is used to attach the water-absorbing layer to the pixel defining layer; the water-absorbing layer uses oxides and chlorides A mixture of at least one of the above and a water-absorbent resin; the water-absorbent resin includes at least one of polyacrylates, polyvinyl alcohols, polyoxyalkylenes, polyurethanes, general-purpose acrylates, and casein.
- the present invention provides an OLED display panel including an array substrate, a pixel defining layer disposed on the array substrate, and an encapsulation layer, the pixel defining layer being encapsulated in the package Between the layer and the array substrate, a water absorbing layer is provided on the pixel defining layer, and the water absorbing layer is used to remove moisture between the array substrate and the encapsulation layer.
- the OLED display panel further includes an adhesion layer disposed between the water-absorbing layer and the pixel defining layer, the adhesion layer is used to make the water-absorbing layer Attached to the pixel defining layer.
- the water-absorbing layer uses a mixture of at least one of oxide and chloride and a water-absorbing resin.
- the water-absorbent resin includes at least one of polyacrylates, polyvinyl alcohols, polyoxyalkylenes, polyurethanes, general-purpose acrylates, and casein.
- the oxide includes at least one of calcium oxide and aluminum oxide.
- the adhesion layer is made of organic materials.
- the present invention provides a display device including the above-mentioned OLED display panel.
- the present invention also provides a method for manufacturing an OLED display panel, the method includes: providing an array substrate; forming an anode on a surface of the array substrate; A pixel defining layer is formed on the array substrate of the anode, and an opening exposing the anode is provided on the pixel defining layer; an organic light emitting diode layer is formed in the opening; a cathode is formed on the organic light emitting diode layer; A water absorption layer is formed on the pixel defining layer; and an encapsulation layer is formed so that the water absorption layer, the organic light emitting diode layer and the cathode are encapsulated between the array substrate and the encapsulation layer.
- the method before the step of forming the water absorbing layer on the pixel defining layer, the method further includes: forming an adhesion layer on the pixel defining layer.
- the adhesion layer is made of organic materials.
- the advantage of the present invention is that the OLED display panel of the present invention is provided with a water absorption layer on the pixel defining layer to remove water and oxygen from the organic material inside the encapsulation layer, thereby further ensuring the reliable service life of the OLED display panel.
- the display device of the present invention also has the above-mentioned advantages.
- FIG. 1 is a schematic structural diagram of an OLED display panel according to an embodiment of the invention.
- FIG. 2 is a schematic diagram of a display device in an embodiment of the invention.
- FIG. 3 is a flowchart of steps of a method for manufacturing an OLED display panel according to an embodiment of the invention.
- Embodiments of the present invention provide an OLED display panel, a preparation method thereof, and a display device. Each will be described in detail below.
- an OLED display panel 100 is provided.
- the OLED display panel 100 includes an array substrate 10, a pixel defining layer 20 and an encapsulating layer 30 disposed on the array substrate 10, the pixel defining layer 20 is encapsulated in the encapsulating layer 30 and the array substrate Between 10, a water absorbing layer 51 is provided on the pixel defining layer 20, and the water absorbing layer 51 is used to remove moisture between the array substrate 10 and the encapsulation layer 30, so as to avoid moisture absorption of the OLED, which is beneficial to the OLED The service life of the display panel 100.
- a mixture of at least one of oxide and chloride and a water-absorbing resin may be used for the water-absorbing layer 51.
- the oxides, chlorides, and water-absorbent resins all have a strong absorption capacity for water, and can remove moisture enclosed between the array substrate 10 and the encapsulation layer 30. Oxides and chlorides will gradually become liquid after absorbing a lot of moisture, and will easily flow to the organic light-emitting diode layer 42 or the cathode 43, and the water-absorbent resin has a good water-retaining effect, and can keep the formed liquid in the water-absorbent resin Thereby, damage to the organic light emitting diode or the cathode 43 caused by liquid flowing is avoided.
- the water-absorbing resin includes at least one of polyacrylates, polyvinyl alcohols, polyoxyalkylenes, polyurethanes, general-purpose acrylates, and casein, but is not limited thereto.
- the oxide includes at least one of calcium oxide and aluminum oxide, which is easy to obtain and has low cost.
- the chloride may include at least one of zinc chloride, calcium chloride, and tin chloride. It has a strong hygroscopicity, can remove moisture from the OLED display panel 100, and prolong the service life of the OLED display panel 100.
- the material in the water-absorbing layer is replaced with a material that can be used to remove oxygen, that is, the layer is an oxygen scavenging layer, the oxygen that has penetrated between the encapsulation layer and the array substrate can be better removed. The service life of the OLED display panel 100 is guaranteed.
- the OLED display panel 100 further includes an adhesion layer 52 disposed between the water-absorbing layer 51 and the pixel defining layer 20, the adhesion layer 52 is used to make the water-absorbing layer 51 It can be well attached on the pixel defining layer 20.
- the adhesion layer 52 is made of organic materials. Of course, in other embodiments, the adhesion layer 52 may also be made of inorganic materials.
- the water absorption layer 51 is provided to absorb the moisture between the array substrate 10 and the encapsulation layer 30 to avoid moisture absorption by the OLED.
- a desiccant can be provided in the encapsulation layer 30. Because there is a small amount of moisture in the outside air, the conventional encapsulation layer can play a certain role in preventing the moisture in the outside air from contacting the OLED display panel 100 inside, but the moisture in the air will still slowly penetrate into the interior of the OLED display panel 100.
- the moisture will be restricted in the encapsulation layer 30 and cannot penetrate further, thereby improving the encapsulation The ability of the layer 30 to isolate external moisture to further prevent external moisture from entering the OLED display panel 100.
- the OLED display panel 100 further includes a surface encapsulation layer (not shown), the surface encapsulation layer is coated on the encapsulation layer 30, and no desiccant is provided in the surface encapsulation layer. After the surface encapsulation layer is provided, the surface encapsulation layer isolates the external environment for the first time in an environment with high humidity, which can prevent the encapsulation layer from absorbing excessive moisture from the external environment.
- the array substrate 10 may include a base substrate and a plurality of thin film transistors disposed on the base substrate.
- the plurality of thin film transistors may be distributed in an array on the base substrate.
- the array substrate 10 is provided with an anode 41 of OLEDs distributed in an array, and the anode 41 is connected to a source or a drain of a thin film transistor.
- the base substrate may be a transparent substrate, for example, a glass substrate, a silicon substrate, or a plastic substrate.
- the thin film transistor may be an amorphous silicon thin film transistor, a low temperature polysilicon thin film transistor, or a metal oxide thin film transistor.
- the anode 41 can be made of materials with good conductivity and chemical stability, such as indium tin oxide, silver, nickel oxide, graphene, etc.
- the thickness of the anode 41 can be 1 to 2 microns.
- the anode 41 may correspond to the thin film transistor, and the array is distributed on the array substrate 10.
- the pixel defining layer 20 may be made of transparent insulating material.
- the transparent insulating material may be polyimide, silicon nitride, or silicon oxide.
- An opening for exposing the anode 41 is provided on the pixel defining layer 20 at a position corresponding to the anode 41, and each opening is uniformly provided with an organic light emitting diode layer 42.
- the organic light emitting diode layer 42 includes, but is not limited to, a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, and an electron injection layer that are sequentially stacked on the anode 41.
- Each opening on the pixel defining layer 20 corresponds to a sub-pixel.
- a cathode 43 is provided on the organic light emitting diode layer 42.
- the cathode 43 may be made of a metal material with high electrical performance, such as silver metal.
- the encapsulation layer 30 may use an encapsulation layer substrate, and the encapsulation layer substrate includes one of polyethylene terephthalate, polycarbonate, polystyrene, and polymethyl methacrylate. These encapsulation layer substrates can better isolate external moisture and prevent moisture from penetrating into the OLED display panel 100.
- the encapsulation layer 30 may also be made of an encapsulation layer base material and a desiccant.
- the present invention provides a display device including the OLED display panel 100 described above.
- the specific structure of the OLED display panel 100 is as described above and will not be elaborated here.
- the present invention also provides a method for manufacturing an OLED display panel 100.
- the specific structure of the OLED display panel 100 is as described above.
- the manufacturing method includes:
- Step S310 Provide an array substrate.
- the array substrate 10 may include a base substrate and a plurality of thin film transistors disposed on the base substrate.
- the plurality of thin film transistors may be distributed in an array on the base substrate.
- the base substrate may be a transparent substrate, for example, a glass substrate, a silicon substrate, or a plastic substrate.
- the thin film transistor may be an amorphous silicon thin film transistor, a low temperature polysilicon thin film transistor, or a metal oxide thin film transistor.
- Step S320 forming an anode on a surface of the array substrate.
- the anode 41 can be made of materials with good conductivity and chemical stability, such as indium tin oxide, silver, nickel oxide, graphene, etc.
- the thickness of the anode 41 can be 1 to 2 microns.
- the anode 41 may correspond to the thin film transistor, and the array is distributed on the array substrate 10.
- Step S330 forming a pixel defining layer 20 on the array substrate on which the anode is fabricated, and an opening exposing the anode 41 is provided on the pixel defining layer 20.
- the pixel defining layer 20 may be made of transparent insulating material.
- the transparent insulating material may be polyimide, silicon nitride, or silicon oxide.
- An opening for exposing the anode 41 is provided on the pixel defining layer 20 at a position corresponding to the anode 41.
- Step S340 forming an organic light emitting diode layer in the opening.
- the organic light emitting diode layer 42 includes, but is not limited to, a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, and an electron injection layer that are sequentially stacked on the anode 41.
- Step S350 forming a cathode on the organic light emitting diode layer.
- a cathode 43 is provided on the organic light emitting diode layer 42.
- the cathode 43 may be made of a metal material with high electrical performance, such as silver metal.
- Step S360 forming a water absorbing layer on the pixel defining layer.
- the water-absorbing layer 51 is used to remove the moisture between the array substrate 10 and the encapsulation layer 30, so as to avoid moisture absorption of the OLED, which is beneficial to the service life of the OLED display panel 100.
- a mixture of at least one of oxide and chloride and a water-absorbing resin may be used for the water-absorbing layer 51.
- the oxides, chlorides, and water-absorbent resins all have a strong absorption capacity for water, and can remove moisture enclosed between the array substrate 10 and the encapsulation layer 30.
- the water-absorbing resin includes at least one of polyacrylates, polyvinyl alcohols, polyoxyalkylenes, polyurethanes, general-purpose acrylates, and casein, but is not limited thereto.
- the oxide includes at least one of calcium oxide and aluminum oxide, which is easy to obtain and has low cost.
- the chloride may include at least one of zinc chloride, calcium chloride, and tin chloride. It has a strong hygroscopic ability, can better remove the moisture in the OLED display panel 100, and prolong the service life of the OLED display panel 100.
- step S360 it may further include the step of forming an adhesion layer 52 on the pixel defining layer 20.
- the adhesion layer 52 is disposed between the water-absorbing layer 51 and the pixel defining layer 20.
- the adhesion layer 52 is used to enable the water-absorbing layer 51 to better adhere to the pixel defining layer 20.
- the adhesion layer 52 is made of organic materials. Of course, in other embodiments, the adhesion layer 52 may also be made of inorganic materials.
- Step S370 forming an encapsulation layer, so that the water-absorbing layer, the organic light-emitting diode layer and the cathode are encapsulated between the array substrate 10 and the encapsulation layer 30.
- the encapsulation layer 30 may use an encapsulation layer substrate, and the encapsulation layer substrate includes one of polyethylene terephthalate, polycarbonate, polystyrene, and polymethyl methacrylate. These encapsulation layers can better isolate external moisture and prevent moisture from penetrating into the OLED display panel 100.
- the encapsulation layer may also be made of an encapsulation layer base material and a desiccant.
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- Engineering & Computer Science (AREA)
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- Optics & Photonics (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
本发明披露一种OLED显示面板及其制备方法,其能够使被封装的内部有机材料具有除水除氧能力,从而进一步保障OLED显示面板的可靠使用寿命。
Description
本发明涉及显示器技术领域,尤其涉及一种OLED显示面板及其制备方法。
有机电致发光器件(Organic Light-Emitting Diode, 简称OLED)因具有诸多优点,如轻薄可弯折、广视角、响应速度快、发光效率高等而成为具有广阔发展前景的新一代显示技术。
目前的OLED显示面板通常包括阵列基板和封装层,阵列基板的表面设置有像素界定层,像素界定层上具有多个开口,每个开口中布置有一个OLED发光器件,封装层覆盖在像素界定层的一侧,以将OLED发光器件与外界环境隔离,避免OLED发光器件受到外部环境中的水和氧的影响。为此,OLED显示面板的封装材料得到了更进一步的研究和发展。
除了OLED显示面板的封装材料必须具有优秀的水氧阻隔能力之外,被封装的内部有机材料也需要有除水除氧的能力,这是因为OLED显示面板的有机发光层材料和阴极金属材料很容易受到环境中的水和氧的侵蚀,而制作OLED的有机发光层的材料本身含有一定的水分,使得在工艺制程中会有一定量的水分被封在阵列基板和封装层之间,这些水分会释放出水汽对OLED显示面板造成影响,使得OLED显示面板因吸潮而损坏,从而缩短OLED显示面板的寿命。
于是,如何使得被封装的内部有机材料也同样具有出色的除水除氧能力成为了相关研究工作人员的重点研究课题。
本发明的目的在于,提供一种OLED显示面板及其制备方法,其能够使被封装的内部有机材料具有除水除氧能力,从而进一步保障OLED显示面板的可靠使用寿命。
根据本发明的一方面,本发明提供一种OLED显示面板,其包括一阵列基板、一设置在所述阵列基板上的像素界定层和一封装层,所述像素界定层封装于所述封装层和所述阵列基板之间,在所述像素界定层上设置有一吸水层,所述吸水层用于去除所述阵列基板和封装层之间的水分;所述OLED显示面板还包括一附着层,所述附着层设置在所述吸水层和所述像素界定层之间,所述附着层用于使所述吸水层附着在所述像素界定层上;所述吸水层采用氧化物和氯化物中的至少一种与吸水性树脂的混合物;所述吸水性树脂包括聚丙烯酸盐类、聚乙烯醇类、聚氧化烷烃类、聚氨酯、通用型丙烯酸酯和酪素中的至少一种。
根据本发明的一方面,本发明提供了一种OLED显示面板,其包括一阵列基板、一设置在所述阵列基板上的像素界定层和一封装层,所述像素界定层封装于所述封装层和所述阵列基板之间,在所述像素界定层上设置有一吸水层,所述吸水层用于去除所述阵列基板和封装层之间的水分。
在本发明的一实施例中,所述OLED显示面板还包括一附着层,所述附着层设置在所述吸水层和所述像素界定层之间,所述附着层用于使所述吸水层附着在所述像素界定层上。
在本发明的一实施例中,所述吸水层采用氧化物和氯化物中的至少一种与吸水性树脂的混合物。
在本发明的一实施例中,所述吸水性树脂包括聚丙烯酸盐类、聚乙烯醇类、聚氧化烷烃类、聚氨酯、通用型丙烯酸酯和酪素中的至少一种。
在本发明的一实施例中,所述氧化物包括氧化钙、氧化铝中的至少一种。
在本发明的一实施例中,所述附着层采用有机材料制成。
根据本发明的另一方面,本发明提供一种显示装置,所述显示装置包括上述OLED显示面板。
根据本发明的又一方面,本发明还提供一种OLED显示面板的制作方法,所述制作方法包括:提供一阵列基板;在所述阵列基板上的一表面上形成阳极;在制作有所述阳极的阵列基板上形成像素界定层,所述像素界定层上设置有露出所述阳极的开口;在所述开口中形成有机发光二极管层;在所述有机发光二极管层上形成阴极;在所述像素界定层上形成吸水层;以及形成一封装层,使得所述吸水层、所述有机发光二极管层和所述阴极被封装在所述阵列基板和所述封装层之间。
在本发明的一实施例中,在所述像素界定层上形成吸水层的步骤之前,进一步包括:在所述像素界定层上形成附着层。
在本发明的一实施例中,所述附着层采用有机材料制成。
本发明的优点在于,本发明所述OLED显示面板通过在像素界定层上设置一吸水层以对封装层内部的有机材料进行除水除氧,从而进一步保障OLED显示面板的可靠使用寿命。本发明所述显示装置亦同样具有上述优点。
为了更清楚地说明本发明实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1为本发明的一实施例中的OLED显示面板的结构示意图。
图2为本发明的一实施例中的显示装置的示意图。
图3为本发明的一实施例中的OLED显示面板的制作方法的步骤流程图。
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述。显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
本发明的说明书和权利要求书以及上述附图中的术语“第一”、“第二”、“第三”等(如果存在)是用于区别类似的对象,而不必用于描述特定的顺序或先后次序。应当理解,这样描述的对象在适当情况下可以互换。此外,术语“包括”和“具有”以及他们的任何变形,意图在于覆盖不排他的包含。
在本专利文档中,下文论述的附图以及用来描述本发明公开的原理的各实施例仅用于说明,而不应解释为限制本发明公开的范围。所属领域的技术人员将理解,本发明的原理可在任何适当布置的系统中实施。将详细说明示例性实施方式,在附图中示出了这些实施方式的实例。此外,将参考附图详细描述根据示例性实施例的终端。附图中的相同附图标号指代相同的元件。
本发明说明书中使用的术语仅用来描述特定实施方式,而并不意图显示本发明的概念。除非上下文中有明确不同的意义,否则,以单数形式使用的表达涵盖复数形式的表达。在本发明说明书中,应理解,诸如“包括”、“具有”以及“含有”等术语意图说明存在本发明说明书中揭示的特征、数字、步骤、动作或其组合的可能性,而并不意图排除可存在或可添加一个或多个其他特征、数字、步骤、动作或其组合的可能性。附图中的相同参考标号指代相同部分。
本发明实施例提供一种OLED显示面板及其制备方法、显示装置。以下将分别进行详细说明。
如图1所示,在本发明的一实例中,提供了一种OLED显示面板100。所述OLED显示面板100包括一阵列基板10、一设置在所述阵列基板10上的像素界定层20和一封装层30,所述像素界定层20封装于所述封装层30和所述阵列基板10之间,在所述像素界定层20上设置有一吸水层51,所述吸水层51用于去除所述阵列基板10和封装层30之间的水分,从而可以避免OLED吸潮,有利于OLED显示面板100的使用寿命。其中,所述吸水层51可以采用氧化物和氯化物中的至少一种与吸水性树脂的混合物。氧化物、氯化物和吸水性树脂都对水有较强的吸收能力,可以去除封在阵列基板10和封装层30之间的水分。氧化物和氯化物在吸收大量水分后会逐渐成为液体,容易流动到有机发光二极管层42或阴极43上,而吸水性树脂具有良好的保水作用,可以将形成的液体保持在吸水性树脂中,从而避免液体流动到有机发光二极管或阴极43上造成损害。进一步,所述吸水性树脂包括聚丙烯酸盐类、聚乙烯醇类、聚氧化烷烃类、聚氨酯、通用型丙烯酸酯和酪素中的至少一种,但不限于此。所述氧化物包括氧化钙、氧化铝中的至少一种,其获取方便,成本较低。所述氯化物可以包括氯化锌、氯化钙、氯化锡中的至少一种。其具有较强的吸湿能力,能够较好地去除OLED显示面板100中的水分,延长OLED显示面板100的使用寿命。需说明的是,如果所述吸水层中的材料换成可用于去除氧气的材料,即该层为除氧层,则能够较好地去除渗入至封装层与阵列基板之间的氧气,以进一步保障OLED显示面板100的使用寿命。
进一步,所述OLED显示面板100还包括一附着层52,所述附着层52设置在所述吸水层51和所述像素界定层20之间,所述附着层52用于使所述吸水层51能够较好地附着在所述像素界定层20上。所述附着层52采用有机材料制成。当然,在其他部分实施例中,所述附着层52也可以采用无机材料制成。
在本实施例中,通过设置吸水层51能够较好地吸收阵列基板10和封装层30之间的水分,避免OLED吸潮。当然,在其他部分实施例中,可以在封装层30内设置干燥剂,由于外界空气中存在少量水分,常规的封装层可以起到一定的隔绝作用,避免外界空气中的水分接触到OLED显示面板100内部,但是空气中的水分仍然会慢慢地渗透到OLED显示面板100内部,通过在封装层30中设置干燥剂后,水分会被限制在封装层30中而无法进一步渗透,从而提高了封装层30隔绝外界水分的能力,进一步避免外界水分进入OLED显示面板100内部。
另外,在其他部分实施例中,所述OLED显示面板100还包括表面封装层(图中未示),所述表面封装层包覆在封装层30上,表面封装层中未设有干燥剂。设置表面封装层后,在湿度较大的环境下,表面封装层对外界环境进行第一次隔离,可以避免封装层从外界环境吸收过多的水分。
所述阵列基板10可以包括衬底基板和设置在衬底基板上的多个薄膜晶体管,多个薄膜晶体管可以在衬底基板上阵列分布。阵列基板10上设置有阵列分布的OLED的阳极41,阳极41与薄膜晶体管的源极或漏极相连。
所述衬底基板可以为透明基板,例如为玻璃基板、硅基板、塑料基板。薄膜晶体管可以是非晶硅薄膜晶体管、低温多晶硅薄膜晶体管、金属氧化物薄膜晶体管。可选地,阳极41可以选择具有良好的导电性和化学稳定性的材料制成,例如氧化铟锡、银、氧化镍、石墨烯等,阳极41的厚度可以为1~2微米。阳极41可以与薄膜晶体管对应,阵列分布在阵列基板10上。
所述像素界定层20可以采用透明绝缘材料制成。例如,透明绝缘材料可以是聚酰亚胺、氮化硅、氧化硅。
所述像素界定层20上对应阳极41的位置设有露出阳极41的开口,每个开口均匀设置有一有机发光二极管层42。有机发光二极管层42包括但不限于依次层叠在阳极41上的空穴注入层、空穴传输层、有机发光层、电子传输层和电子注入层。像素界定层20上的每一个开口对应子像素。在有机发光二极管层42上设置有阴极43。在本实施例中,所述阴极43可以采用高电性能的金属材料制成,例如金属银。
所述封装层30可以采用封装层基材,所述封装层基材包括聚对苯二甲酸乙二醇酯、聚碳酸酯、聚苯乙烯、聚甲基丙烯酸甲酯中的一种。这些封装层基材可以较好的隔绝外界水分,避免水分渗透到OLED显示面板100内部。当然,在其他实施例中,所述封装层30也可以采用封装层基材和干燥剂制成。
根据本发明的另一方面,本发明提供一种显示装置,所述显示装置包括上述OLED显示面板100。所述OLED显示面板100的具体结构如上文所述,在此不再一一详述。
参阅图3所示,根据本发明的又一方面,本发明还提供一种OLED显示面板100的制作方法,所述OLED显示面板100的具体结构如上文所述。所述制作方法包括:
步骤S310:提供一阵列基板。
所述阵列基板10可以包括衬底基板和设置在衬底基板上的多个薄膜晶体管,多个薄膜晶体管可以在衬底基板上阵列分布。所述衬底基板可以为透明基板,例如为玻璃基板、硅基板、塑料基板。薄膜晶体管可以是非晶硅薄膜晶体管、低温多晶硅薄膜晶体管、金属氧化物薄膜晶体管。
步骤S320:在所述阵列基板上的一表面上形成阳极。
可选地,阳极41可以选择具有良好的导电性和化学稳定性的材料制成,例如氧化铟锡、银、氧化镍、石墨烯等,阳极41的厚度可以为1~2微米。阳极41可以与薄膜晶体管对应,阵列分布在阵列基板10上。
步骤S330:在制作有所述阳极的阵列基板上形成像素界定层20,所述像素界定层20上设置有露出所述阳极41的开口。
所述像素界定层20可以采用透明绝缘材料制成。例如,透明绝缘材料可以是聚酰亚胺、氮化硅、氧化硅。所述像素界定层20上对应阳极41的位置设有露出阳极41的开口。
步骤S340:在所述开口中形成有机发光二极管层。
每个开口均匀设置有一有机发光二极管层42。有机发光二极管层42包括但不限于依次层叠在阳极41上的空穴注入层、空穴传输层、有机发光层、电子传输层和电子注入层。
步骤S350:在所述有机发光二极管层上形成阴极。
在有机发光二极管层42上设置有阴极43。在本实施例中,所述阴极43可以采用高电性能的金属材料制成,例如金属银。
步骤S360:在所述像素界定层上形成吸水层。
所述吸水层51用于去除所述阵列基板10和封装层30之间的水分,从而可以避免OLED吸潮,有利于OLED显示面板100的使用寿命。其中,所述吸水层51可以采用氧化物和氯化物中的至少一种与吸水性树脂的混合物。氧化物、氯化物和吸水性树脂都对水有较强的吸收能力,可以去除封在阵列基板10和封装层30之间的水分。氧化物和氯化物在吸收大量水分后会逐渐成为液体,容易流动到有机发光二极管层42或阴极43上,而吸水性树脂具有良好的保水作用,可以将形成的液体保持在吸水性树脂中,从而避免液体流动到有机发光二极管或阴极43上造成损害。进一步,所述吸水性树脂包括聚丙烯酸盐类、聚乙烯醇类、聚氧化烷烃类、聚氨酯、通用型丙烯酸酯和酪素中的至少一种,但不限于此。所述氧化物包括氧化钙、氧化铝中的至少一种,其获取方便,成本较低。所述氯化物可以包括氯化锌、氯化钙、氯化锡中的至少一种。其具有较强的吸湿能力,能够较好地去除OLED显示面板100中的水分,延长OLED显示面板100的使用寿命。
在步骤S360之前,可以进一步包括步骤:在所述像素界定层20上形成附着层52。所述附着层52设置在所述吸水层51和所述像素界定层20之间,所述附着层52用于使所述吸水层51能够较好地附着在所述像素界定层20上。所述附着层52采用有机材料制成。当然,在其他部分实施例中,所述附着层52也可以采用无机材料制成。
步骤S370:形成一封装层,使得所述吸水层、所述有机发光二极管层和所述阴极被封装在所述阵列基板10和所述封装层30之间。
所述封装层30可以采用封装层基材,所述封装层基材包括聚对苯二甲酸乙二醇酯、聚碳酸酯、聚苯乙烯、聚甲基丙烯酸甲酯中的一种。这些封装层可以较好的隔绝外界水分,避免水分渗透到OLED显示面板100内部。当然,在其他实施例中,所述封装层也可以采用封装层基材和干燥剂制成。
以上所述仅是本发明的优选实施方式,应当指出,对于本技术领域的普通技术人员,在不脱离本发明原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也应视为本发明的保护范围。
本申请的主题可以在工业中制造和使用,具备工业实用性。
Claims (10)
- 一种OLED显示面板,其包括一阵列基板、一设置在所述阵列基板上的像素界定层和一封装层,所述像素界定层封装于所述封装层和所述阵列基板之间,在所述像素界定层上设置有一吸水层,所述吸水层用于去除所述阵列基板和封装层之间的水分;所述OLED显示面板还包括一附着层,所述附着层设置在所述吸水层和所述像素界定层之间,所述附着层用于使所述吸水层附着在所述像素界定层上;所述吸水层采用氧化物和氯化物中的至少一种与吸水性树脂的混合物;所述吸水性树脂包括聚丙烯酸盐类、聚乙烯醇类、聚氧化烷烃类、聚氨酯、通用型丙烯酸酯和酪素中的至少一种。
- 一种OLED显示面板,其包括一阵列基板、一设置在所述阵列基板上的像素界定层和一封装层,所述像素界定层封装于所述封装层和所述阵列基板之间,在所述像素界定层上设置有一吸水层,所述吸水层用于去除所述阵列基板和封装层之间的水分。
- 根据权利要求2所述的OLED显示面板,其中所述OLED显示面板还包括一附着层,所述附着层设置在所述吸水层和所述像素界定层之间,所述附着层用于使所述吸水层附着在所述像素界定层上。
- 根据权利要求2所述的OLED显示面板,其中所述吸水层采用氧化物和氯化物中的至少一种与吸水性树脂的混合物。
- 根据权利要求4所述的OLED显示面板,其中所述吸水性树脂包括聚丙烯酸盐类、聚乙烯醇类、聚氧化烷烃类、聚氨酯、通用型丙烯酸酯和酪素中的至少一种。
- 根据权利要求4所述的OLED显示面板,其中所述氧化物包括氧化钙、氧化铝中的至少一种。
- 根据权利要求2所述的OLED显示面板,其中所述附着层采用有机材料制成。
- 一种如权利要求2所述OLED显示面板的制作方法,其中所述制作方法包括:提供一阵列基板;在所述阵列基板上的一表面上形成阳极;在制作有所述阳极的阵列基板上形成一像素界定层,所述像素界定层上设置有露出所述阳极的开口;在所述开口中形成一有机发光二极管层;在所述有机发光二极管层上形成阴极;在所述像素界定层上形成一吸水层;以及形成一封装层,使得所述吸水层、所述有机发光二极管层和所述阴极被封装在所述阵列基板和所述封装层之间。
- 根据权利要求8所述的制作方法,其中在所述像素界定层上形成吸水层的步骤之前,进一步包括:在所述像素界定层上形成一附着层。
- 根据权利要求9所述的制作方法,其中所述附着层采用有机材料制成。
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