WO2020124795A1 - 显示面板的封装结构以及显示装置 - Google Patents

显示面板的封装结构以及显示装置 Download PDF

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Publication number
WO2020124795A1
WO2020124795A1 PCT/CN2019/077013 CN2019077013W WO2020124795A1 WO 2020124795 A1 WO2020124795 A1 WO 2020124795A1 CN 2019077013 W CN2019077013 W CN 2019077013W WO 2020124795 A1 WO2020124795 A1 WO 2020124795A1
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WIPO (PCT)
Prior art keywords
display panel
heat sink
type heat
packaging structure
structure according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/077013
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English (en)
French (fr)
Inventor
孙立志
徐向阳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Application filed by Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Publication of WO2020124795A1 publication Critical patent/WO2020124795A1/zh
Anticipated expiration legal-status Critical
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/87—Arrangements for heating or cooling

Definitions

  • the present application relates to the field of display technology, in particular to a packaging structure of a display panel and a display device.
  • AMOLED Active matrix organic light emitting diode
  • OLED Organic Light-Emitting Diode
  • the organic light emitting diode is usually provided on the thin film transistor array substrate.
  • the thin film transistor array substrate is the main light emitting driving substrate of the organic light emitting diode.
  • the technical problem mainly solved by this application is how to improve the luminous efficiency of the organic light emitting diode and extend its life.
  • Embodiments of the present application provide a packaging structure of a display panel and a display device, which improve the luminous efficiency of an organic light-emitting diode and extend its life.
  • an embodiment of the present application provides a packaging structure of a display panel, including:
  • a sealant is provided on the periphery of the display panel, the sealant includes a third surface and a fourth surface opposite to the third surface, the third surface is connected to the display panel, the The fourth surface is provided with a second heat sink;
  • An encapsulation cover plate is provided on the display panel and the sealant, the encapsulation cover plate includes a first surface and a second surface opposite to the first surface, the first surface Covering the display panel and the frame glue, the second surface is provided with a first heat dissipation groove, and a groove or a protrusion is formed on the groove wall of the first heat dissipation groove.
  • the first heat sink includes a first type heat sink and a second type heat sink, and the depth of the first type heat sink is greater than or equal to the second type The depth of the heat sink.
  • the first-type heat sink and the second-type heat sink are arranged at intervals.
  • the number of the first type heat sinks is at least two
  • the number of the second type heat sinks is at least two
  • the at least two first type heat sinks and The at least two second-type heat sinks are arranged on the second surface of the packaging cover according to a preset arrangement rule.
  • the number of the recesses or the number of the protrusions formed on the groove wall of each of the first heat dissipation grooves is at least two.
  • the shape of the longitudinal cross section of the first heat sink includes semicircle, rectangle, and cone.
  • the packaging structure further includes a thin film transistor film layer, the thin film transistor film layer is disposed on a side of the display panel facing away from the packaging cover plate, and the The sealant is disposed on the periphery of the thin film transistor film layer.
  • an embodiment of the present application provides a packaging structure of a display panel, including:
  • Frame glue is arranged on the periphery of the display panel
  • An encapsulation cover plate is provided on the display panel and the sealant, the encapsulation cover plate includes a first surface and a second surface opposite to the first surface, the first surface Covering the display panel and the frame glue, a first heat sink is provided on the second surface.
  • the first heat sink includes a first type heat sink and a second type heat sink, and the depth of the first type heat sink is greater than or equal to the second type The depth of the heat sink.
  • the first-type heat sink and the second-type heat sink are arranged at intervals.
  • the number of the first type heat sinks is at least two
  • the number of the second type heat sinks is at least two
  • the heat dissipation groove and the at least two second type heat dissipation grooves are arranged on the second surface of the packaging cover according to a preset arrangement rule.
  • a recess or a protrusion is formed on the groove wall of the first heat dissipation groove.
  • the number of the recesses or the number of the protrusions formed on the groove wall of each of the first heat dissipation grooves is at least two.
  • the sealant includes a third surface and a fourth surface opposite to the third surface, the third surface is connected to the display panel, and the first Second surfaces are provided with second heat sinks.
  • the longitudinal cross-sectional shape of the first heat sink includes a semicircle, a rectangle, and a cone.
  • the packaging structure further includes a thin film transistor film layer, the thin film transistor film layer is disposed on a side of the display panel facing away from the packaging cover plate, and the The sealant is disposed on the periphery of the thin film transistor film layer.
  • an embodiment of the present application provides a display device, including:
  • Frame glue is arranged on the periphery of the display panel
  • An encapsulation cover plate is provided on the display panel and the sealant, the encapsulation cover plate includes a first surface and a second surface opposite to the first surface, the first surface Covering the display panel and the frame glue, a first heat sink is provided on the second surface.
  • the first heat sink includes a first type heat sink and a second type heat sink, and the depth of the first type heat sink is greater than or equal to that of the second type heat sink depth.
  • the first type heat sink and the second type heat sink are spaced apart.
  • a recess or a protrusion is formed on the groove wall of the first heat dissipation groove.
  • the packaging structure and display device of the display panel of the present application include: a display panel; a frame glue, the frame glue is arranged at the periphery of the display panel; On the sealant, the packaging cover includes a first surface and a second surface opposite to the first surface, the first surface covers the display panel and the sealant, and the second surface is provided with The first heat sink.
  • the heat accumulated on the display panel is transferred through the first heat dissipation groove of the package cover. Finally, the heat around the display panel is reduced, thereby improving the luminous efficiency of the display panel and extending the life of the display panel.
  • FIG. 1 is a first structural schematic diagram of a packaging structure of a display panel provided by an embodiment of the present application.
  • FIG. 2 is a second schematic structural diagram of a packaging structure of a display panel provided by an embodiment of the present application.
  • FIG. 3 is a third structural schematic diagram of a packaging structure of a display panel provided by an embodiment of the present application.
  • FIG. 4 is a fourth schematic structural diagram of a packaging structure of a display panel provided by an embodiment of the present application.
  • FIG. 5 is a fifth schematic structural diagram of a packaging structure of a display panel provided by an embodiment of the present application.
  • FIG. 6 is a sixth schematic structural diagram of a packaging structure of a display panel provided by an embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of a display device provided by an embodiment of the present application.
  • FIG. 1 is a first structural schematic diagram of a packaging structure of a display panel provided by an embodiment of the present application.
  • Package structure 1 includes:
  • the thin film transistor 2 includes a thin film transistor film layer 50 and a base substrate 40.
  • the thin film transistor film layer 50 is disposed on the side of the display panel 10 facing away from the packaging cover 30, and the sealant 20 is provided on the periphery of the thin film transistor film layer 50.
  • the display panel 10 may be an organic light-emitting diode (Organic Light-Emitting) Diode, OLED). Organic light emitting diodes are used to emit light.
  • the thin film transistor film layer 50 is provided on the base substrate 40.
  • the display panel 10 is provided on the thin film transistor film layer 50.
  • the material of the base substrate 40 includes quartz or glass.
  • the display panel 10 includes an anode, a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, an electron injection layer, and a cathode formed in this order.
  • the sealant 20 is provided on the periphery of the display panel 10.
  • the package cover 30 is provided on the display panel 10 and the sealant 20.
  • the package cover 30 includes a first surface 301 and a second surface 302 opposite to the first surface 301.
  • the first surface 301 covers the display panel 10 and the sealant 20.
  • the second surface 302 is provided with a first heat sink 31.
  • the first heat dissipation groove 31 is provided on the second surface 302 to dissipate heat from the display panel 10 through the first heat dissipation groove 31, which can quickly reduce the heat of the display panel 10, thereby reducing the temperature of the display panel 10. And finally, the service life of the display panel 10 can be extended.
  • the packaging structure 1 is cut in the longitudinal direction to form a longitudinal section of the packaging structure 1, as shown in FIG.
  • the shape of the longitudinal section of the first heat sink 31 includes a semicircle, as shown in FIG. 1.
  • the shape of the longitudinal section of the first heat dissipation groove 31 may also include other shapes such as a rectangle or a cone. That is, the shape of the longitudinal section of the first heat sink 31 includes a semicircle, a rectangle, and a cone. Therefore, the shape of the longitudinal section of the first heat dissipation groove 31 will not be repeated here.
  • FIG. 2 is a second structural schematic diagram of a packaging structure of a display panel provided by an embodiment of the present application.
  • the first heat sink 31 includes a first type heat sink 311 and a second type heat sink 312.
  • the depth D1 of the first type heat sink 311 is greater than or equal to the depth D2 of the second type heat sink 312.
  • the first type heat sink 311 and the second type heat sink 312 are spaced apart.
  • the interval L1 may be in units of millimeters, centimeters, or meters.
  • L1 may be 1 mm, 2 cm, or 1 meter.
  • FIG. 3 is a third structural schematic diagram of a package structure of a display panel provided by an embodiment of the present application.
  • the number of the first type heat sink 311 is at least two, and the number of the second type heat sink 312 is at least two.
  • the first type heat dissipation groove 311 and the second type heat dissipation groove 312 are disposed on the second surface 302 of the package cover 30 according to a preset arrangement rule.
  • the preset arrangement rule may be in a symmetrical form. For example, taking 313 as a line of symmetry, the first-type heat dissipation groove 311 and the second-type heat dissipation groove 312 take the symmetry line 313 as a symmetry axis and are disposed on the second surface 302 in a symmetrical manner.
  • the number of first-type heat sinks 311 on one side of the axis of symmetry and the number of first-type heat sinks 311 on the other side of symmetry are equal.
  • two heat sinks 311 of the first type may be arranged in series, and one heat sink 312 of the second type may be arranged. Then, one heat dissipation slot 311 of the first type is continuously arranged one more, and three heat dissipation slots 312 of the second type may be arranged continuously three more. Therefore, the preset arrangement rule may be that the arrangement order of the first type heat sink 311 and the second type heat sink 312 are different or the number is different.
  • the preset arrangement rule may be a regular arrangement.
  • the first type heat dissipation slots 311 may be arranged in succession first.
  • five second-type heat dissipation grooves 312 are continuously arranged so that the first type heat dissipation grooves 311 and the second type heat dissipation grooves 312 are arranged in a regular form. That is, the regular arrangement may include that the arrangement order of the first type heat sink 311 and the second type heat sink 312 is the same or the number is equal.
  • FIG. 4 is a fourth structural schematic diagram of a package structure of a display panel provided by an embodiment of the present application.
  • a recess 33 or a protrusion 32 is formed on the groove wall 310 of the first heat sink 31.
  • the number of recesses 33 or protrusions 32 formed on the groove wall 310 of each first heat sink 31 is at least two.
  • Each first heat sink 31 may form at least one groove 33.
  • each first heat sink 31 forms at least one protrusion 32.
  • each first heat sink 31 forms at least one groove 33 and at least one protrusion 32.
  • it may include: one first heat sink 31 may form a groove 33, another first heat sink 31 may form a protrusion 32, and another first heat sink 31 may form a groove 33 and a The number of protrusions 32, wherein the number of grooves 33 and protrusions 32 is not limited.
  • each first heat sink 31 may form at least two grooves 33.
  • Each first heat sink 31 may form at least two protrusions 32.
  • I will not repeat them here.
  • the shape of the longitudinal section of the recess 33 includes a semicircle, as shown in FIG. 4.
  • the shape of the longitudinal section of the recess 33 may also include a rectangle or a cone.
  • the shape of the longitudinal section of the recess 33 is not limited to the shape of the above-mentioned recess 33 and will not be repeated here.
  • the shape of the longitudinal section of the protrusion 32 includes a semicircle, as shown in FIG. 4.
  • the shape of the longitudinal section of the protrusion 32 may also include a rectangle or a cone.
  • the shape of the longitudinal section of the protrusion 33 is not limited to the shape of the protrusion 33 described above, and will not be repeated here.
  • FIG. 5 is a fifth schematic structural diagram of a package structure of a display panel provided by an embodiment of the present application.
  • the sealant 20 includes a third surface 201 and a fourth surface 202 opposite to the third surface 201.
  • the third surface 201 is connected to the display panel 10.
  • the fourth surface 202 is provided with a second heat sink 203. When the thin film transistor 2 is operating, the generated heat can also be dissipated through the second heat dissipation groove 203 to reduce the temperature of the display panel 10.
  • FIG. 6 is a sixth structural schematic diagram of a package structure of a display panel provided by an embodiment of the present application.
  • the package cover 30 includes at least two surfaces. If there are package covers 30 with more than three surfaces, as shown in FIG. 6. Take four surfaces as an example.
  • the package cover 30 includes a first surface 301, a second surface 302, a fifth surface 303, and a sixth surface 304.
  • the first heat sink 31 is provided on the second surface 302.
  • the third heat dissipation groove 315 is provided on both the fifth surface 303 and the sixth surface 304.
  • the heat of the display panel 10 can be dissipated not only through the first heat sink 31 provided on the second surface, but also through the third heat sink 315 provided on both the fifth surface 303 and the sixth surface 304.
  • FIG. 7 is a schematic structural diagram of a display device provided by an embodiment of the present application.
  • the display device 3 includes a packaging structure 1.
  • the packaging structure 1 can protect the display device 3 from damage.
  • the packaging structure 1 and the display device 3 of the display panel 10 of the present application include a display panel 10.
  • the frame glue 20 is disposed on the periphery of the display panel 10.
  • the packaging cover 30 is covered on the display panel 10 and the sealant 20.
  • the package cover 30 includes a first surface 301 and a second surface 302 opposite to the first surface 301.
  • the first surface 301 covers the display panel 10 and the sealant 20.
  • the second surface 302 is provided with a first heat sink 31.
  • the heat accumulated on the display panel 10 is transferred through the heat dissipation groove 31 on the package cover 30.
  • the heat around the display panel 10 is reduced to improve the luminous efficiency of the display panel 10 and extend the life of the display panel 10.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种显示面板的封装结构以及显示装置，包括：显示面板；框胶，所述框胶设置在所述显示面板周缘；封装盖板，所述封装盖板盖设在所述显示面板和所述框胶上，所述封装盖板包括第一表面以及与所述第一表面相对的第二表面，所述第一表面覆盖所述显示面板和所述框胶，所述第二表面设置有第一散热槽。

Description

显示面板的封装结构以及显示装置 技术领域
本申请涉及显示技术领域，特别涉及一种显示面板的封装结构以及显示装置。
 背景技术
有源矩阵有机发光二极管发光器（Active-matrix Organic Light Emitting Diode，AMOLED）具有自发光、驱动电压低、发光效率高以及大视角等优点。AMOLED主要包括主动式驱动器件和有机发光二极管（Organic Light-Emitting Diode，OLED）。有机发光二极管通常设于薄膜晶体管阵列基板上。薄膜晶体管阵列基板为有机发光二极管的主要发光驱动基板。
 技术问题
本申请主要解决的技术问题，如何提高有机发光二极管的发光效率以及延长其寿命。
 技术解决方案
本申请实施例提供一种显示面板的封装结构以及显示装置，提高有机发光二极管的发光效率以及延长其寿命。
第一方面，本申请实施例提供了一种显示面板的封装结构，包括：
显示面板；
框胶，所述框胶设置在所述显示面板周缘，所述框胶包括第三表面以及与所述第三表面相对的第四表面，所述第三表面与所述显示面板连接，所述第四表面设置有第二散热槽；
封装盖板，所述封装盖板盖设在所述显示面板和所述框胶上，所述封装盖板包括第一表面以及与所述第一表面相对的第二表面，所述第一表面覆盖所述显示面板和所述框胶，所述第二表面设置有第一散热槽，所述第一散热槽的槽壁上形成有凹陷或凸起。
在本申请实施例提供的显示面板的封装结构中，所述第一散热槽包括第一类型散热槽和第二类型散热槽，所述第一类型散热槽的深度大于或者等于所述第二类型散热槽的深度。
在本申请实施例提供的显示面板的封装结构中，所述第一类型散热槽和所述第二类型散热槽间隔设置。
在本申请实施例提供的封装结构中，所述第一类型散热槽的数量为至少两个，所述第二类型散热槽的数量为至少两个，所述至少两个第一类型散热槽和所述至少两个第二类型散热槽按照预设排列规则设置在所述封装盖板的第二表面。
在本申请实施例提供的显示面板的封装结构中，每一所述第一散热槽的槽壁上形成的所述凹陷的数量或所述凸起的数量为至少两个。
在本申请实施例提供的显示面板的封装结构中，所述第一散热槽纵截面的形状包括半圆形、矩形以及锥形。
在本申请实施例提供的显示面板的封装结构中，所述封装结构还包括薄膜晶体管膜层，所述薄膜晶体管膜层设置在所述显示面板背离所述封装盖板的一侧，且所述框胶设置在所述薄膜晶体管膜层周缘。
第二方面，本申请实施例提供了一种显示面板的封装结构，包括：
显示面板；
框胶，所述框胶设置在所述显示面板周缘；
封装盖板，所述封装盖板盖设在所述显示面板和所述框胶上，所述封装盖板包括第一表面以及与所述第一表面相对的第二表面，所述第一表面覆盖所述显示面板和所述框胶，所述第二表面设置有第一散热槽。
在本申请实施例提供的显示面板的封装结构中，所述第一散热槽包括第一类型散热槽和第二类型散热槽，所述第一类型散热槽的深度大于或者等于所述第二类型散热槽的深度。
在本申请实施例提供的显示面板的封装结构中，所述第一类型散热槽和所述第二类型散热槽间隔设置。
在本申请实施例提供的显示面板的封装结构中，所述第一类型散热槽的数量为至少两个，所述第二类型散热槽的数量为至少两个，所述至少两个第一类型散热槽和所述至少两个第二类型散热槽按照预设排列规则设置在所述封装盖板的第二表面。
在本申请实施例提供的显示面板的封装结构中，所述第一散热槽的槽壁上形成有凹陷或凸起。
在本申请实施例提供的显示面板的封装结构中，每一所述第一散热槽的槽壁上形成的所述凹陷的数量或所述凸起的数量为至少两个。
在本申请实施例提供的显示面板的封装结构中，所述框胶包括第三表面以及与所述第三表面相对的第四表面，所述第三表面与所述显示面板连接，所述第四表面设置有第二散热槽。
在本申请实施例提供的显示面板的封装结构中，其特征在于，所述第一散热槽纵截面的形状包括半圆形、矩形以及锥形。
在本申请实施例提供的显示面板的封装结构中，所述封装结构还包括薄膜晶体管膜层，所述薄膜晶体管膜层设置在所述显示面板背离所述封装盖板的一侧，且所述框胶设置在所述薄膜晶体管膜层周缘。
第三方面，本申请实施例提供了一种显示装置，包括：
显示面板；
框胶，所述框胶设置在所述显示面板周缘；
封装盖板，所述封装盖板盖设在所述显示面板和所述框胶上，所述封装盖板包括第一表面以及与所述第一表面相对的第二表面，所述第一表面覆盖所述显示面板和所述框胶，所述第二表面设置有第一散热槽。
在本申请实施例提供的显示装置中，所述第一散热槽包括第一类型散热槽和第二类型散热槽，所述第一类型散热槽的深度大于或者等于所述第二类型散热槽的深度。
在本申请实施例提供的显示装置中，所述第一类型散热槽和所述第二类型散热槽间隔设置。
在本申请实施例提供的显示装置中，所述第一散热槽的槽壁上形成有凹陷或凸起。
 有益效果
本申请的显示面板的封装结构以及显示装置，包括：显示面板；框胶，所述框胶设置在所述显示面板周缘；封装盖板，所述封装盖板盖设在所述显示面板和所述框胶上，所述封装盖板包括第一表面以及与所述第一表面相对的第二表面，所述第一表面覆盖所述显示面板和所述框胶，所述第二表面设置有第一散热槽。本申请将堆积到显示面板的热量，通过封装盖板上的第一散热槽，将该热量传递出去。最终减少显示面板周围的热量，从而提高显示面板的发光效率以及延长显示面板的寿命。
 附图说明
图1为本申请实施例提供的显示面板的封装结构的第一种结构示意图。
图2为本申请实施例提供的显示面板的封装结构的第二种结构示意图。
图3为本申请实施例提供的显示面板的封装结构的第三种结构示意图。
图4为本申请实施例提供的显示面板的封装结构的第四种结构示意图。
图5为本申请实施例提供的显示面板的封装结构的第五种结构示意图。
图6为本申请实施例提供的显示面板的封装结构的第六种结构示意图。
图7为本申请实施例提供的显示装置的结构示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
参阅图1，图1为本申请实施例提供的显示面板的封装结构的第一种结构示意图。
封装结构1包括：
显示面板10、框胶20、薄膜晶体管2以及封装盖板30。其中，薄膜晶体管2包括薄膜晶体管膜层50和衬底基板40。薄膜晶体管膜层50设置在显示面板10背离所述封装盖板30的一侧，且框胶20设置在薄膜晶体管膜层50周缘。
显示面板10可以为有机发光二极管（Organic Light-Emitting Diode，OLED）。有机发光二极管用于发射光线。该薄膜晶体管膜层50设置在衬底基板40上。显示面板10设置在薄膜晶体管膜层50上。其中该衬底基板40的材料包括石英或者玻璃。该显示面板10包括依次形成的阳极、空穴注入层、空穴传输层、有机发光层、电子传输层、电子注入层与阴极。
框胶20设置在显示面板10周缘。
封装盖板30设置在显示面板10和框胶20上。封装盖板30包括第一表面301以及与第一表面301相对的第二表面302。第一表面301覆盖显示面板10和框胶20。第二表面302设置有第一散热槽31。当薄膜晶体管2在工作时，会产生一定的热量。若该热量过高，便会影响显示面板10的发光效率和寿命。因为显示面板10本身工作时也会产生热量，且薄膜晶体管2工作产生的热量也会传输到显示面板10。那么这些能量都堆积到显示面板10的周围，导致显示面板10的温度较高，容易烧坏显示面板10。如果烧坏显示面板10，则导致显示面板10的寿命缩短。
在第二表面302设置第一散热槽31，将显示面板10通过第一散热槽31进行散热，可以较快的减少显示面板10的热量，从而降低显示面板10的温度。且最终可延长显示面板10的使用寿命。
其中，将封装结构1以纵向方向切割，以形成封装结构1的纵截面，如图1所示。第一散热槽31纵截面的形状包括半圆形，如图1所示。该第一散热槽31纵截面的形状还可以包括矩形或者锥形等其他形状。即第一散热槽31纵截面的形状包括半圆形、矩形以及锥形。因此第一散热槽31纵截面的形状在此不作赘述。
参阅图2，图2为本申请实施例提供的显示面板的封装结构的第二种结构示意图。
第一散热槽31包括第一类型散热槽311和第二类型散热槽312。第一类型散热槽311的深度D1大于或者等于第二类型散热槽312的深度D2。其中第一类型散热槽311和第二类型散热槽312间隔设置。该间隔L1可以以毫米、厘米或者米为单位。例如L1可以为1毫米、2厘米或者1米。
参阅图3，图3为本申请实施例提供的显示面板的封装结构的第三种结构示意图。
第一类型散热槽311的数量为至少两个，第二类型散热槽312的数量为至少两个。并且第一类型散热槽311和第二类型散热槽312按照预设排列规则设置在封装盖板30的第二表面302。该预设排列规则可以为对称形式。例如以313为对称线，第一类型散热槽311和第二类型散热槽312以该对称线313为对称轴，并且以对称的形式设置在第二表面302。即以对称轴为对轴线，对称轴一边的第一类型散热槽311和对称另一边的第一类型散热槽311数量相等。同理，第二类型散热槽312。
在一些实施例中，例如，第一类型散热槽311可以连续排列两个，第二类型散热槽312可以排列一个。然后第一类型散热槽311再连续排列一个，以及第二类型散热槽312可以再连续排列三个。因此该预设排列规则可以是第一类型散热槽311和第二类型散热槽312的排列顺序不同或者数量不同。
该预设排列规则可以为规则排列。例如，第一类型散热槽311可以先连续排列5个。然后第二类型散热槽312连续排列5个，以使第一类型散热槽311和第二类型散热槽312以规则形式进行排列。即该规则排列可以包括第一类型散热槽311和第二类型散热槽312的排列顺序相同或者数量相等。
参阅图4，图4为本申请实施例提供的显示面板的封装结构的第四种结构示意图。
第一散热槽31的槽壁310上形成有凹陷33或凸起32。每一个第一散热槽31的槽壁310上形成的凹陷33或凸起32的数量为至少两个。其中每一个第一散热槽31可以形成至少一个凹槽33。或者每一个第一散热槽31形成至少一个凸起32。或者每一个第一散热槽31形成至少一个凹槽33和至少一个凸起32。另外，还可以包括：一个第一散热槽31既可以形成一个凹槽33、另一个第一散热槽31可以形成一个凸起32、以及再一个第一散热槽31可以形成一个凹槽33和一个凸起32，其中凹槽33和凸起32的数量不在限制。以此类推，每一个第一散热槽31可以形成至少两个凹槽33。每一个第一散热槽31可以形成至少两个凸起32。以此类推，在此不作赘述。
其中，该凹陷33纵截面的形状包括半圆形，如图4所示。该凹陷33纵截面的形状还可以包括矩形或者锥形。且该凹陷33纵截面的形状不仅限于上述凹陷33的形状，在此不作赘述。该凸起32纵截面的形状包括半圆形，如图4所示。该凸起32纵截面的形状还可以包括矩形或者锥形。该凸起33纵截面的形状不仅限于上述凸起33的形状，在此不作赘述。
参阅图5，图5为本申请实施例提供的显示面板的封装结构的第五种结构示意图。
框胶20包括第三表面201以及与第三表面201相对的第四表面202。第三表面201与显示面板10连接。第四表面202设置有第二散热槽203。当薄膜晶体管2工作时，产生的热量也可以通过第二散热槽203进行散热，以降低显示面板10的温度。
参阅图6，图6为本申请实施例提供的显示面板的封装结构的第六种结构示意图。
封装盖板30包括至少两个表面。若存在三个表面以上的封装盖板30，如图6所示。以四个表面为例。例如在封装盖板30包括第一表面301、第二表面302、第五表面303和第六表面304。
其中，在第二表面302设置有第一散热槽31。在第五表面303和第六表面304均设置有第三散热槽315。显示面板10的热量不仅可以通过第二表面设置的第一散热槽31发散，也可以通过第五表面303和第六表面304均设置的第三散热槽315发散。
参阅图7，图7为本申请实施例提供的显示装置的结构示意图。
显示装置3包括封装结构1。封装结构1可以保护显示装置3免于损坏。
本申请的显示面板10的封装结构1以及显示装置3，包括：显示面板10。框胶20，框胶20设置在显示面板10周缘。封装盖板30，封装盖板30盖设在显示面板10和框胶20上。封装盖板30包括第一表面301以及与第一表面301相对的第二表面302。第一表面301覆盖显示面板10和框胶20。第二表面302设置有第一散热槽31。本申请将堆积到显示面板10的热量，通过封装盖板30上的散热槽31，将该热量传递出去。最终减少显示面板10周围的热量，以提高显示面板10的发光效率以及延长显示面板10的寿命。
以上对本申请实施例提供的显示面板的封装结构以及显示装置进行了详细介绍。本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请。同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种显示面板的封装结构，其中，包括：
    显示面板；
    框胶，所述框胶设置在所述显示面板周缘，所述框胶包括第三表面以及与所述第三表面相对的第四表面，所述第三表面与所述显示面板连接，所述第四表面设置有第二散热槽；
    封装盖板，所述封装盖板盖设在所述显示面板和所述框胶上，所述封装盖板包括第一表面以及与所述第一表面相对的第二表面，所述第一表面覆盖所述显示面板和所述框胶，所述第二表面设置有第一散热槽，所述第一散热槽的槽壁上形成有凹陷或凸起。
  2. 根据权利要求1所述的封装结构，其中，所述第一散热槽包括第一类型散热槽和第二类型散热槽，所述第一类型散热槽的深度大于或者等于所述第二类型散热槽的深度。
  3. 根据权利要求2所述的封装结构，其中，所述第一类型散热槽和所述第二类型散热槽间隔设置。
  4. 根据权利要求3所述的封装结构，其中，所述第一类型散热槽的数量为至少两个，所述第二类型散热槽的数量为至少两个，所述至少两个第一类型散热槽和所述至少两个第二类型散热槽按照预设排列规则设置在所述封装盖板的第二表面。
  5. 根据权利要求1所述的封装结构，其中，每一所述第一散热槽的槽壁上形成的所述凹陷的数量或所述凸起的数量为至少两个。
  6. 根据权利要求1所述的封装结构，其中，所述第一散热槽纵截面的形状包括半圆形、矩形以及锥形。
  7. 根据权利要求1所述的封装结构，其中，所述封装结构还包括薄膜晶体管膜层，所述薄膜晶体管膜层设置在所述显示面板背离所述封装盖板的一侧，且所述框胶设置在所述薄膜晶体管膜层周缘。
  8. 一种显示面板的封装结构，其中，包括：
    显示面板；
    框胶，所述框胶设置在所述显示面板周缘；
    封装盖板，所述封装盖板盖设在所述显示面板和所述框胶上，所述封装盖板包括第一表面以及与所述第一表面相对的第二表面，所述第一表面覆盖所述显示面板和所述框胶，所述第二表面设置有第一散热槽。
  9. 根据权利要求8所述的封装结构，其中，所述第一散热槽包括第一类型散热槽和第二类型散热槽，所述第一类型散热槽的深度大于或者等于所述第二类型散热槽的深度。
  10. 根据权利要求9所述的封装结构，其中，所述第一类型散热槽和所述第二类型散热槽间隔设置。
  11. 根据权利要求10所述的封装结构，其中，所述第一类型散热槽的数量为至少两个，所述第二类型散热槽的数量为至少两个，所述至少两个第一类型散热槽和所述至少两个第二类型散热槽按照预设排列规则设置在所述封装盖板的第二表面。
  12. 根据权利要求8所述的封装结构，其中，所述第一散热槽的槽壁上形成有凹陷或凸起。
  13. 根据权利要求12所述的封装结构，其中，每一所述第一散热槽的槽壁上形成的所述凹陷的数量或所述凸起的数量为至少两个。
  14. 根据权利要求8所述的封装结构，其中，所述框胶包括第三表面以及与所述第三表面相对的第四表面，所述第三表面与所述显示面板连接，所述第四表面设置有第二散热槽。
  15. 根据权利要求8所述的封装结构，其中，所述第一散热槽纵截面的形状包括半圆形、矩形以及锥形。
  16. 根据权利要求8所述的封装结构，其中，所述封装结构还包括薄膜晶体管膜层，所述薄膜晶体管膜层设置在所述显示面板背离所述封装盖板的一侧，且所述框胶设置在所述薄膜晶体管膜层周缘。
  17. 一种显示装置，其中，包括：
    显示面板；
    框胶，所述框胶设置在所述显示面板周缘；
    封装盖板，所述封装盖板盖设在所述显示面板和所述框胶上，所述封装盖板包括第一表面以及与所述第一表面相对的第二表面，所述第一表面覆盖所述显示面板和所述框胶，所述第二表面设置有第一散热槽。
  18. 根据权利要求17所述的显示装置，其中，所述第一散热槽包括第一类型散热槽和第二类型散热槽，所述第一类型散热槽的深度大于或者等于所述第二类型散热槽的深度。
  19. 根据权利要求18所述的显示装置，其中，所述第一类型散热槽和所述第二类型散热槽间隔设置。
  20. 根据权利要求17所述的显示装置，其中，所述第一散热槽的槽壁上形成有凹陷或凸起。
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