WO2020124434A1

WO2020124434A1 - Flexible module and manufacturing method thereof

Info

Publication number: WO2020124434A1
Application number: PCT/CN2018/122083
Authority: WO
Inventors: 胡康军; 陈鑫; 李贺
Original assignee: 深圳市柔宇科技有限公司
Priority date: 2018-12-19
Filing date: 2018-12-19
Publication date: 2020-06-25
Also published as: CN113169148A

Abstract

A flexible module (100) and a manufacturing method thereof, the manufacturing method comprising: providing a flexible substrate (10); forming a first reinforcing layer (11) in a binding region (101) of the flexible substrate (10); manufacturing a binding electrode (12) in the binding region (101), wherein the first reinforcing layer (11) is used to provide support when the binding electrode is in a binding process so as to reduce or prevent the deformation of the flexible substrate (10) in the binding region (101). As a first reinforcing layer (11) is formed on a flexible substrate (10), the first reinforcing layer (11) can provide corresponding support during a hot pressing process so as to effectively prevent the deformation of the flexible substrate (10).

Description

Method for manufacturing flexible module and flexible module

Technical field

The present application relates to the technical field of flexible modules, in particular to a method for manufacturing flexible modules and flexible modules.

Background technique

As an input device for improving the man-machine operation interface, the flexible electronic display device has great application value in the field of consumer electronic products. The manufacturing method of the flexible electronic display module involves the interconnection between the electrode terminals of the flexible display module and the flexible circuit board, rigid circuit board and the like.

In the manufacturing process of flexible electronic display devices, the electrodes of the flexible circuit board or the rigid circuit board and the electrodes of the flexible display module underneath need to withstand certain high temperatures and pressures during the binding process. In the traditional technology, the substrate of the display module is generally glass, Rigid materials such as polyimide and polyterephthalic acid plastics, and when flexible substrates such as polyurethane systems and silicone rubber systems are used to make flexible display modules, the flexible substrates are easier to bind Due to the problems of insufficient temperature resistance and deformation under pressure, it is impossible to bind or the connection of the upper and lower electrodes fails.

Summary of the invention

The present application aims to provide a method for manufacturing a flexible module and a flexible module to solve the technical problem that a flexible substrate is easily deformed during the manufacturing process of a traditional flexible module.

In order to solve the above technical problems, a technical solution adopted in the embodiments of the present application is to provide a method for manufacturing a flexible module. The manufacturing method includes: providing a flexible substrate, the flexible substrate includes a binding area; The binding area forms a first reinforcement layer; a binding electrode is made on the binding area, and the first reinforcement layer is used to provide support when the binding electrode is bound to reduce or prevent the flexible substrate The wood is deformed in the binding area.

Optionally, the binding electrode is formed on an upper surface of the first reinforcement layer facing away from the flexible substrate.

Optionally, the binding electrode directly contacts the first reinforcement layer.

Optionally, the first reinforcement layer is located between the binding electrode and the flexible substrate.

Optionally, the binding electrode covers the first reinforcement layer and extends to connect with the functional pattern of the flexible substrate.

Optionally, the first reinforcement layer is a hard ink material.

Optionally, the first reinforcement layer is bonded to the flexible substrate through an adhesive.

Optionally, the first reinforcement layer is embedded in the flexible substrate by hot pressing.

Optionally, the material of the first reinforcement layer is one or more of the following: polyethylene terephthalate, polyimide, polycarbonate, polystyrene, polymethyl methacrylate, Polyphenylene sulfide, ceramic sheet or metal sheet with insulated surface.

Optionally, the manufacturing method further includes: correspondingly forming a second reinforcement layer on the lower surface of the flexible substrate facing away from the first reinforcement layer.

Optionally, the manufacturing method further includes: manufacturing a thermally conductive layer on the upper surface of the first reinforcing layer facing away from the flexible substrate.

Optionally, the material of the thermal conductive layer is one or more of the following: graphene, diamond thin film, graphite sheet, carbon nanotube film, copper metal film, silver metal film or aluminum metal film.

Optionally, the thermally conductive layer is subjected to insulation treatment on the upper surface facing away from the first reinforcement layer.

Optionally, the first reinforcing layer is embedded into the flexible substrate by hot pressing, the thermally conductive layer covers the first reinforcing layer, and the thermally conductive layer extends beyond the first reinforcing layer The junction with the flexible substrate.

In order to solve the above technical problems, a technical solution adopted by the embodiments of the present application is: to provide a flexible module, the flexible module includes: a flexible substrate, the flexible substrate includes a binding region; a first reinforcement layer, The first reinforcement layer is provided on the binding area; a binding electrode is provided in the binding area, and the first reinforcement layer is used for binding on the binding electrode To provide support to reduce or prevent deformation of the flexible substrate in the binding area.

Optionally, the first reinforcement layer is a hard ink material.

Optionally, the first reinforcement layer is embedded in the flexible substrate.

Optionally, the flexible module further includes: a second reinforcement layer stacked on the other surface of the flexible substrate facing away from the first reinforcement layer.

Optionally, the flexible module further includes: a thermally conductive layer; the thermally conductive layer is stacked between the first reinforcement layer and the binding electrode.

Optionally, the first reinforcing layer is embedded in the flexible substrate, the thermally conductive layer covers the first reinforcing layer, and the thermally conductive layer extends beyond the first reinforcing layer and the flexible The junction of substrates.

In the manufacturing method and the flexible module provided by the embodiments of the present application, during the manufacturing process, a reinforcing layer is formed on the flexible substrate. The reinforcing layer can provide corresponding supporting force and effectively prevent the deformation of the flexible substrate.

BRIEF DESCRIPTION

1 is a schematic structural diagram of a flexible module provided by the first embodiment of the present application;

2 is a schematic structural view of a flexible substrate of the flexible module shown in FIG. 1;

FIG. 3 is a schematic structural view of the thermal compression bonding of the flexible module shown in FIG. 1;

4 is a schematic structural diagram of a flexible module provided by a second embodiment of the present application;

5a and 5b are schematic structural views of a flexible module provided by a third embodiment of the present application;

6a and 6b are schematic structural views of a flexible module provided by a fourth embodiment of the present application;

7a and 7b are schematic structural diagrams of a flexible module provided by a fifth embodiment of the present application;

8a and 8b are schematic structural views of a flexible module provided by the sixth embodiment of the present application;

9a and 9b are schematic structural views of a flexible module provided by a seventh embodiment of the present application;

10a and 10b are schematic structural diagrams of a flexible module provided by an eighth embodiment of the present application.

detailed description

In order to make the objectives, solutions and advantages of the present application clearer, the following describes the present application in further detail with reference to the embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, and are not used to limit the present application. In addition, the technical features involved in different embodiments of the present application described below can be combined as long as they do not conflict with each other.

The embodiment of the present application improves the flexible module, and applying the flexible module provided by the embodiment of the present application can well solve the problem that the flexible substrate is easily deformed during the preparation process of the flexible module.

An embodiment of the present application first provides a method for manufacturing a flexible module. The method includes the following steps:

Step 1. Provide a flexible substrate, the flexible substrate including a binding area.

The flexible module involves the connection between the flexible substrate and the binding substrate to be bound during the manufacturing process. The binding substrate may be a driving integrated circuit, a flexible circuit board, a rigid circuit board, a rigid chip, and other substrates connected to the flexible substrate, which is selected by those skilled in the art according to actual needs.

A binding area is provided on the flexible substrate, and the binding area is an area where the flexible substrate needs to bear corresponding pressure when binding, and is used to realize the connection between the flexible substrate and the corresponding binding substrate.

Step 2. Form a first enhancement layer in the binding area.

Before binding, a first reinforcing layer may be formed on the binding area. The first reinforcing layer is a reinforcing structure of the flexible substrate, which may provide a corresponding supporting force for the flexible substrate.

The first reinforcing layer is a hard ink material, for example, hard polyvinyl chloride, hard polyterephthalate plastic, hard polypropylene, and the like.

The first reinforcement layer may be formed in the binding area by any suitable method, for example, the first reinforcement layer is bonded to the flexible substrate by an adhesive; for another example, the first reinforcement layer passes It is embedded into the flexible substrate by hot pressing. Preferably, the surface of the first reinforcing layer after being embedded is flush with the flexible substrate.

Step 3. Make a binding electrode on the binding area.

The first reinforcement layer is specifically used to provide support when the binding electrode is bound to reduce or prevent deformation of the flexible substrate in the binding area.

Making the binding electrode in the binding area can realize the interconnection with the binding substrate electrode.

In the embodiment of the present application, during the manufacturing process of the flexible module, a first reinforcement layer is formed on the flexible substrate, the first reinforcement layer can provide corresponding support for the flexible substrate, and effectively prevent the deformation of the flexible substrate .

The embodiment of the present application does not limit the specific position and arrangement manner of the first reinforcement layer in the binding area, which can provide support when the binding electrode is bound to reduce or prevent the flexible substrate from occurring in the binding area Just deform it.

For example, the binding electrode may be formed on an upper surface of the first reinforcement layer facing away from the flexible substrate; for example, the first reinforcement layer directly contacts the binding electrode to provide support for the binding electrode. As another example, the first reinforcement layer is located between the binding electrode and the flexible substrate.

The flexible substrate can also be provided with corresponding other layer reinforcement structures according to the temperature and pressure it bears during the actual binding process. For example, a second reinforcement layer is correspondingly formed on the lower surface of the flexible substrate facing away from the first reinforcement layer.

In some embodiments, a thermally conductive layer can also be formed on the flexible substrate. The thermally conductive layer can diffuse the heat concentrated in the binding area during the binding process to reduce the influence of the high temperature of the binding area on the flexible substrate and effectively prevent the substrate Deformation.

Wherein, the material of the thermal conductive layer may be selected from one or more of graphene, diamond thin film, graphite sheet, carbon nanotube film, copper metal film, silver metal film or aluminum metal film.

In some embodiments, the flexible substrate may also be provided with a functional circuit area on one side of the binding area to form a corresponding functional pattern. The binding electrode covers the first reinforcement layer and extends to connect with the functional pattern of the flexible substrate, so that the functional pattern can be connected to the binding substrate through the binding electrode.

The binding module and the binding electrode of the flexible substrate can be bound by welding, bonding or the like to obtain the flexible module. The structure of the flexible display module obtained by different binding methods is different. In order to describe the technical solution of the present application in detail, the binding between the electrode of the binding substrate and the binding electrode of the flexible substrate is achieved by conductive adhesive to prepare the flexible module with a suitable structure Instructions.

First embodiment

Please refer to FIGS. 1 and 2 together. A flexible module 100 provided in the first embodiment of the present application includes: a flexible substrate 10, a colloid layer 20 and a binding substrate 30. The binding substrate 30 passes through the colloid layer 20 FIXED to the flexible substrate 10.

The flexible substrate 10 has a certain thickness and strength. The flexible substrate 10 serves as a supporting mechanism of the flexible module 100 for supporting the functional layer and other components thereon, for example, it can support the colloid layer 20 shown in FIG. 1和Binding substrate 30. The flexible substrate 10 may be selected from polyethylene terephthalate, polyethylene naphthalate, polyimide, polyethersulfone resin, polyethylene, polystyrene, polycarbonate, polyurethane or Any one or more of silicone rubber. The flexible substrate 10 formed using the above materials has good flexibility. A binding area 101 is provided on the upper surface of the flexible substrate 10, and the binding area 101 is an area on the flexible substrate 10 that needs to be hot-pressed, and is used for hot-press binding with the binding substrate 30.

A first reinforcement layer 11 is formed on the binding area 101, and a binding electrode 12 is provided on the first reinforcement layer 11, as can be clearly seen from FIG. 1, the binding electrode 12 is specifically disposed on the first reinforcement layer 11 facing away from the flexible substrate 10 Upper surface.

The flexible substrate 10 is provided with a functional circuit area near the binding area 101 to form a functional pattern layer 102 as shown in FIG. 1. The flexible substrate 10 is also used to support the functional pattern layer 102 and the binding electrode 12. The other end is in contact with the functional pattern layer 102 as shown in FIG. 2, so that the functional pattern layer 102 can be connected to the binding substrate 30 through the binding electrode 12.

The colloid layer 20 is bonded between the binding electrode 12 and the electrode of the binding substrate 30. The colloid layer 20 is an anisotropic conductive film (Anisotropic Conductive Film, ACF), which can be conducted in the Z-axis direction and insulated in the XY plane. In some other embodiments, the anisotropic conductive film may also be replaced by anisotropic conductive adhesive (ACA) or the like that achieves the same function.

The binding substrate 30 is a substrate involved in the preparation process of the flexible module 100 and is connected to the flexible substrate 10 through a binding process, which will not be repeated here.

In the flexible module 100 provided in the first embodiment of the present application, a first reinforcement layer 11 is formed between the flexible substrate 10 and the bonding electrode 12, and the first reinforcement layer 11 can be a flexible substrate during the thermocompression bonding process 10 provides corresponding supporting force to effectively prevent the hot-press deformation of the flexible substrate 10 due to insufficient temperature resistance and pressure resistance.

The manufacturing method of the flexible module 100 will be described in detail below in conjunction with FIG. 3. In FIG. 3, the upper pressing head 40 and the lower pressing head 50 of the hot press are used to illustrate the hot-pressing process. The manufacturing method of the flexible module 100 includes the following steps:

Step 2. Form a first enhancement layer in the binding area.

Step 3: Making a binding electrode on the upper surface of the first reinforcing layer facing away from the flexible substrate.

After the first reinforcement layer 11 is formed on the binding region 101 of the flexible substrate 10, a binding electrode 12 needs to be made on the upper surface of the first reinforcement layer 11 facing away from the flexible substrate 10, and the binding electrode 12 includes binding The electrode and the circuit are used for subsequent thermocompression bonding with the bonding substrate 30.

2 and 3 respectively illustrate the specific position of the binding electrode 12 on the first reinforcement layer 11. As can be seen from FIG. 2, one end of the binding electrode 12 is located in the binding area 101, which can be realized with the binding substrate 30 Connection.

The flexible substrate 10 near the binding area 101 is provided with a functional circuit area to form a functional pattern layer 102 as shown in FIG. 1, and the other end of the binding electrode 12 is in contact with the functional pattern layer 102 as shown in FIG. 2, so that the functional pattern layer 102 can be connected to the binding substrate 30 through the binding electrode 12.

Step 4. Provide a binding substrate, and coat one or both of the binding electrode and the binding substrate to form a colloid layer.

After the fabrication of the binding electrode 12, the binding substrate 30 or the binding electrode 12 needs to be coated with a colloid to form a colloid layer 20. When the colloid layer 20 is used for pressing, the flexible substrate 10 and the binding base The material 30 is fixed to finally achieve the connection between the functional pattern layer 102 and the binding substrate 30. Wherein, the colloid may be coated on the binding substrate 30 and the binding electrode 12 at the same time, and the colloid layer 20 is formed on both the binding substrate 30 and the binding electrode 12.

Step 5. Align the electrode of the substrate with the binding electrode.

Step 6. Pressing the flexible substrate and the binding substrate at a preset temperature, so that the colloid layer fixes the flexible substrate and the binding substrate to form the flexible module.

In the embodiment of the present application, the preset temperature may be 140-180°C, that is, at 140-180°C, the flexible substrate 100 and the binding substrate 30 are pressed to form the flexible module 100.

In the manufacturing method provided in the embodiment of the present application, during the binding process, the electrode of the binding substrate 30 and the electrode of the flexible substrate 10 need to withstand a certain temperature and pressure, and the flexible substrate 10 has insufficient temperature resistance and pressure resistance Under the influence of the temperature and pressure during the hot pressing process, distortion and even melting occur, resulting in the failure of the connection between the electrode of the binding substrate 30 and the electrode of the flexible substrate 10, or even the failure of binding. In the embodiment of the present application, the first reinforcement layer 11 is formed between the flexible substrate 10 and the bonding electrode 12. The first reinforcement layer 11 can provide a corresponding supporting force during the thermocompression bonding process to effectively prevent the flexible substrate 10 Deformation.

Second embodiment

The second embodiment of the present application further provides a flexible module 200. The difference between the flexible module 200 and the flexible module 100 in the first embodiment described above is that, as shown in FIG. 4, the flexible module 200 further includes: a second Enhanced layer 13.

The second reinforcement layer 13 is disposed on the lower surface of the flexible substrate 10 facing away from the first reinforcement layer 11. The position of the second reinforcement layer 13 on the flexible substrate 10 corresponds to the position of the first reinforcement layer 11 on the flexible substrate 10.

During the hot pressing process, the lower surface of the flexible substrate 10 facing away from the first reinforcing layer 11 needs to be in contact with the lower head 50 of the hot press, although during the hot pressing process, the flexible substrate 10 is facing away from the lower surface of the first reinforcing layer 11 The force is smaller than the upper surface close to the first reinforcement layer 11, but the lower surface is also stressed, and the second reinforcement layer 13 can also achieve deformation protection of the flexible substrate 10. Therefore, before the flexible substrate 10 and the binding substrate 30 are pressed together, a second reinforcement layer 13 can be correspondingly formed on the lower surface of the flexible substrate 10 facing away from the first reinforcement layer 11.

Both the first reinforcement layer 11 and the second reinforcement layer 13 can be formed by processes such as printing, coating, yellow light pattern or inkjet printing.

Third embodiment

The third embodiment of the present application further provides a flexible module 300. The difference between the flexible module 300 and the flexible module 100 and the flexible module 200 in the above embodiments is shown in FIGS. 5a and 5b.

First, referring to FIG. 5a, the flexible module 300 further includes: a first adhesive layer 14; the first adhesive layer 14 is disposed between the first reinforcement layer 11 and the flexible substrate 10.

The first reinforcement layer 11 may be formed by an adhesive to bond the first adhesive layer 14 to the flexible substrate 10 to be fixed on the upper surface of the flexible substrate 10.

Next, referring to FIG. 5b, the flexible module 300 further includes: a second adhesive layer 15; the second adhesive layer 15 is disposed between the second reinforcement layer 13 and the flexible substrate 10.

The second reinforcing layer 13 may be formed by an adhesive to bond the second adhesive layer 15 to the flexible substrate 10 and be fixed on the lower surface of the flexible substrate 10.

The first reinforcement layer 11 and the second reinforcement layer 13 may be polyethylene terephthalate, polyimide, polycarbonate, polystyrene, polymethyl methacrylate, polyphenylene sulfide, ceramic sheet Or a metal sheet with an insulated surface.

Fourth embodiment

When the first reinforcement layer 11 or the second reinforcement layer 13 is formed on the surface of the flexible substrate 10 by printing, coating, yellow light pattern or inkjet printing, etc., between the flexible substrate 10 and the first reinforcement layer 11 and Steps are generated between the flexible substrate 10 and the second reinforcement layer 13, which affects the subsequent wiring process of the binding electrode 12 of the flexible substrate 10.

Therefore, the fourth embodiment of the present application further provides a flexible module 400. The difference between the flexible module 400 and the flexible module 100 and the flexible module 200 in the above embodiments is shown in FIGS. 6a and 6b.

First, referring to FIG. 6a, the first reinforcement layer 11 of the flexible module 400 is embedded into the flexible substrate 10 by hot pressing. The surface of the embedded first reinforcement layer 11 is kept flush with the flexible substrate 10 as shown in FIG. 6a by hot pressing, so as not to affect the wiring.

Secondly, referring to FIG. 6b, both the first reinforcement layer 11 and the second reinforcement layer 13 of the flexible module 400 are embedded into the flexible substrate 10 by hot pressing.

Both the surface of the embedded first reinforcement layer 11 and the surface of the second reinforcement layer 13 are flush with the flexible substrate 10 by hot pressing to avoid affecting the wiring.

It can be understood that, in some embodiments, the surface of the first reinforcement layer embedded by hot pressing may not be flush with the flexible substrate, that is, the upper surface of the first reinforcement layer is on the flexible substrate There is a certain distance from the surface of the flexible substrate.

The material of the first reinforcement layer 11 and the second reinforcement layer 13 is one or more of the following: polyethylene terephthalate, polyimide, polycarbonate, polystyrene, polymethacrylate Ester, polyphenylene sulfide, ceramic flakes or metal sheets with insulated surfaces.

Fifth embodiment

The fifth embodiment of the present application also provides a flexible module 500. The difference between the flexible module 500 and the flexible module 100 and the flexible module 200 in the above embodiments is shown in FIGS. 7a and 7b. 500 further includes: a heat conductive layer 16.

The heat conductive layer 16 is disposed between the first reinforcement layer 11 and the bonding electrode 12.

Before the binding electrode 12 is formed on the upper surface of the first reinforcing layer 11 facing away from the flexible substrate 10, the method further includes: forming a thermal conductive layer 16 on the upper surface of the first reinforcing layer 11 facing away from the flexible substrate 10.

During the thermocompression bonding process, the thermally conductive layer 16 can diffuse the heat concentrated in the bonding region 101 during the bonding process to reduce the influence of the high temperature of the bonding region 101 on the flexible substrate 10 and effectively prevent the deformation of the substrate 10.

The material of the thermal conductive layer 16 may be selected from one or more of graphene, diamond thin film, graphite sheet, carbon nanotube film, copper metal film, silver metal film, or aluminum metal film.

Specifically, in order to avoid the influence of the thermal conductive layer 16 on the electrical performance of the flexible module, the upper surface of the thermal conductive layer 16 may also be insulated to form an insulating layer. The insulating layer can be selected from organic silicon dioxide film, silicon nitride film, organic polymer film or hardened film layer on the surface to achieve insulation.

Sixth embodiment

The sixth embodiment of the present application further provides a flexible module 600. The difference between the flexible module 600 and the flexible module 300 in the above embodiments is shown in FIGS. 8a and 8b. The flexible module 600 further includes: a thermal conductive layer 16 .

The thermally conductive layer 16 is the thermally conductive layer 16 in the above-mentioned fifth embodiment, and will not be repeated here.

Seventh embodiment

The seventh embodiment of the present application further provides a flexible module 700. The difference between the flexible module 700 and the flexible module 400 in the above embodiments is shown in FIGS. 9a and 9b. The flexible module 700 further includes: a thermal conductive layer 16 .

Eighth embodiment

The eighth embodiment of the present application also provides a flexible module 800. The difference between the flexible module 800 and the flexible module 400 in the above embodiments is shown in FIGS. 10a and 10b. The thermal conductive layer 16 in the flexible module 800 covers The first reinforcement layer 11 and the thermally conductive layer 16 extend beyond the boundary between the first reinforcement layer 11 and the flexible substrate 10.

In this way, the thermal conductive layer 16 can cover the first reinforcement layer 11 and the interface area between the first reinforcement layer 11 and the flexible substrate 10. The thermally conductive layer 16 covering the interface area between the first reinforcement layer 11 and the flexible substrate 10 can serve as a flat layer, which facilitates the arrangement of the bonding electrode when the bonding electrode is subsequently fabricated.

It should be noted that FIG. 10a and FIG. 10b are for embedding the first reinforcement layer 11 or the second reinforcement layer 13 into the flexible substrate 10 by hot pressing, and the first reinforcement layer 11 or the second reinforcement layer 13 after embedding On the basis that the surface is flush with the flexible substrate 10, the structure of the heat conductive layer 16 as a flat layer is illustrated.

In all the flexible substrates 10 provided with the thermal conductive layer 16 in the above embodiment, the thermal conductive layer 16 can be provided as shown in FIGS. 10a and 10b, which is beneficial to the arrangement of the binding electrode when the binding electrode is subsequently fabricated.

Based on the above manufacturing method, a variety of different flexible substrate binding methods can be obtained, and this application will also describe in detail in conjunction with specific examples.

Example 1

1.1. Form a hard ink material layer as the first reinforcement layer in the binding area of the thermoplastic polyurethane flexible substrate with a thickness of 60 μm by printing or coating process.

1.2. Make a binding electrode on the upper surface of the first reinforcing layer facing away from the flexible substrate and apply colloid on the binding electrode;

1.3. Align the electrodes of the bound substrate and the bound electrodes to bind the flexible substrate to the bound substrate to form a flexible module.

Example 2

2.1. Bond the hard sheet to the binding area of the flexible substrate with an adhesive to form the first reinforcement layer.

The flexible substrate is a thermoplastic polyurethane flexible substrate with a thickness of 60 μm, and the rigid sheet is selected from polyethylene terephthalate, polyimide, polycarbonate, polystyrene, polymethyl methacrylate, poly One or more of phenylene sulfide, ceramic flakes or metal sheets whose surfaces have been subjected to insulation treatment.

2.2. Make a binding electrode on the upper surface of the first reinforcement layer facing away from the flexible substrate and apply colloid on the binding electrode;

2.3. Align the electrodes of the bound substrate and the bound electrode, bind the flexible substrate and the bound substrate to form a flexible module.

Example 3

3.1. The hard sheet is bonded to the binding area of the flexible substrate by an adhesive to form a first reinforcement layer. The thickness of the selected hard sheet is greater than the thickness of the hard sheet selected in Example 2.

3.2. Make a binding electrode on the upper surface of the first reinforcement layer facing away from the flexible substrate and apply colloid on the binding electrode;

3.3. Align the electrodes of the bound substrate and the bound electrode, bind the flexible substrate and the bound substrate to form a flexible module.

Example 4

4.1. In the binding area, through the hot pressing process, the hard sheet is embedded in the flexible substrate and is flush with the flexible substrate to form the first reinforcement layer.

The flexible substrate is a thermoplastic polyurethane flexible substrate with a thickness of 60 μm, and the rigid sheet is selected from polyethylene terephthalate, polyimide, polycarbonate, polystyrene, polymethyl methacrylate, poly One or more of phenylene sulfide, ceramic flakes, or metal flakes whose surface is insulated.

4.2. Make a binding electrode on the upper surface of the first reinforcement layer facing away from the flexible substrate and coat the binding electrode with colloid.

4.3. Align the electrodes of the bound substrate and the bound electrode, bind the flexible substrate and the bound substrate to form a flexible module.

Example 5

5.1. In the binding area, through the hot pressing process, the hard sheet is embedded in the flexible substrate and is flush with the flexible substrate to form the first reinforcing layer. The thickness of the selected hard sheet is greater than that of the hard sheet selected in Example 4. thickness of.

5.2. Make a binding electrode on the upper surface of the first reinforcement layer facing away from the flexible substrate and coat the binding electrode with colloid.

5.3. Align the electrodes of the bound substrate and the bound electrode, bind the flexible substrate and the bound substrate to form a flexible module.

Example 6

6.1. In the binding area of the thermoplastic polyurethane flexible substrate with a thickness of 60 μm, a hard ink material layer is formed as the first reinforcement layer by printing or coating process;

6.2. Set a heat conductive layer on the upper surface of the first reinforcement layer. The material of the thermal conductive layer is selected from one or more of graphene, diamond thin film, graphite sheet, carbon nanotube film, copper metal film, silver metal film or aluminum metal film.

The upper surface of the heat conductive layer is subjected to insulation treatment to form an insulation layer. The insulating layer is a silicon dioxide film, a silicon nitride film, an organic polymer film, or a film layer whose surface is hardened.

After the setting of the thermal conductive layer is completed, a binding electrode is made on the upper surface of the thermal conductive layer and a gel is coated on the binding electrode.

6.3. Align the electrodes of the bound substrate and the bound electrode, bind the flexible substrate and the bound substrate to form a flexible module.

Example 7

7.1. The hard sheet is bonded to the binding area of the flexible substrate through an adhesive to form a first reinforcement layer.

7.2. Set a heat conductive layer on the upper surface of the first reinforcement layer. The material of the thermal conductive layer is selected from one or more of graphene, diamond thin film, graphite sheet, carbon nanotube film, copper metal film, silver metal film or aluminum metal film.

The upper surface of the thermal conductive layer is an insulating layer that has undergone insulation treatment. The insulating layer is a silicon dioxide film, a silicon nitride film, an organic polymer film, or a film layer whose surface is hardened.

7.3. Align the electrodes of the bound substrate and the bound electrode, bind the flexible substrate and the bound substrate to form a flexible module.

Example 8

8.1. The hard sheet is bonded to the binding area of the flexible substrate by an adhesive to form a first reinforcement layer. The thickness of the selected hard sheet is greater than the thickness of the hard sheet selected in Example 7.

8.2. Set a heat conductive layer on the upper surface of the first reinforcement layer. The material of the thermal conductive layer is selected from one or more of graphene, diamond thin film, graphite sheet, carbon nanotube film, copper metal film, silver metal film or aluminum metal film.

8.3. Align the electrodes of the bound substrate and the bound electrode, bind the flexible substrate and the bound substrate to form a flexible module.

Example 9

9.1. In the binding area, through the hot pressing process, the hard sheet is embedded in the flexible substrate and is flush with the flexible substrate to form the first reinforcement layer.

9.2. Set a heat conductive layer on the upper surface of the first reinforcement layer. The material of the thermal conductive layer is selected from one or more of graphene, diamond thin film, graphite sheet, carbon nanotube film, copper metal film, silver metal film or aluminum metal film.

9.3. Align the electrodes of the bound substrate and the bound electrode, bind the flexible substrate and the bound substrate to form a flexible module.

Example 10

10.1 In the binding area, the hard sheet is embedded in the flexible substrate and is flush with the flexible substrate by a hot pressing process to form the first reinforcement layer. The thickness of the selected hard sheet is greater than that of the hard sheet selected in Example 9 thickness of.

10.2. Set a heat conductive layer on the upper surface of the first reinforcement layer. The material of the thermal conductive layer is selected from one or more of graphene, diamond thin film, graphite sheet, carbon nanotube film, copper metal film, silver metal film or aluminum metal film.

10.3. Align the electrodes of the bound substrate and the bound electrode, bind the flexible substrate and the bound substrate to form a flexible module.

Comparative example

11.1. Make a binding electrode on the upper surface of a thermoplastic polyurethane flexible substrate with a thickness of 60 μm and coat the binding electrode with colloid;

11.2. Align the electrodes of the bound substrate and the bound electrode, bind the flexible substrate and the bound substrate to form a flexible module.

In order to facilitate comparison, in the above examples, the thickness of the first reinforcement layer of Examples 1, 2, 4, 6, 7, 9 is the same; the thickness of the first reinforcement layer of Examples 3, 5, 8, 10 is the same.

Performance Testing

The performance tests were performed on the flexible modules obtained in Examples 1 to 10 and the comparative example, and the test results shown in Table 1 below were obtained (the comparative example is used as a control group, which is the flexibility obtained by the binding process without the first reinforcement layer) Module).

Table 1

Table description: NG indicates that the quality standard is not met, and OK indicates that the quality standard is met.

It can be seen from the test results in Table 1 that when the first reinforcement layer is added and the thickness of the first reinforcement layer is thin (refer to the comparison between Example 2 and Example 3, the comparison between Example 4 and Example 5, Example 7 and Example Comparison of 8, comparison between Example 9 and Example 10) The enhancement effect is better. Generally speaking, the first reinforcement layer can provide a corresponding supporting force during the thermocompression bonding process relative to the comparative example without the reinforcement layer, which can effectively prevent the deformation of the flexible substrate.

During the experiment, the inventor also found that the test results were as follows: Example 6, Example 7 and Example 9 with the addition of the thermal conductive layer and Example 1, Example 2 and Example 4 without the addition of the thermal conductive layer had no electrode cracks and were in line with the breaking Quality standards for differential impedance; if Examples 1 and 6, Example 2 and 7 and Example 4 and Example 9 are compared, the performance of the flexible modules of Example 6, Example 7 and Example 9 with a thermally conductive layer added is better than The performance of the flexible modules of Example 1, Example 2 and Example 4 without the thermal conductive layer.

The inventor also found during the experiment that although the test results are: Example 1, Example 2, Example 4, Example 6, Example 7 and Example 9 have no electrode cracks and meet the quality standard of breaking resistance; however, the use of heat Examples 4 and 9 of the pressing process have a better effect than Examples 1 and 6 using the printing or coating process, and Examples 1 and 6 using the printing or coating process have a better effect than Example 2 using the adhesive And example 7 for better results.

The above is only an embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the description and drawings of this application, or directly or indirectly used in other related technologies In the field, the same reason is included in the scope of patent protection of this application.

Claims

A method for manufacturing a flexible module, characterized in that it includes:

Providing a flexible substrate, the flexible substrate including a binding area;

Forming a first enhancement layer in the binding area;

A binding electrode is made on the binding area, and the first reinforcement layer is used to provide support when the binding electrode is bound to reduce or prevent deformation of the flexible substrate in the binding area.
The manufacturing method according to claim 1, wherein the binding electrode is formed on an upper surface of the first reinforcement layer facing away from the flexible substrate.
The manufacturing method according to claim 1, wherein the bonding electrode directly contacts the first reinforcement layer.
The manufacturing method according to claim 1, wherein the first reinforcement layer is located between the binding electrode and the flexible substrate.
The manufacturing method according to claim 1, wherein the binding electrode covers the first reinforcement layer and extends to connect with the functional pattern of the flexible substrate.
The manufacturing method according to claim 1, wherein the first reinforcement layer is a hard ink material.
The manufacturing method according to claim 1, wherein the first reinforcement layer is bonded to the flexible substrate by an adhesive.
The manufacturing method according to claim 1, wherein the first reinforcement layer is embedded in the flexible substrate by hot pressing.
The manufacturing method according to claim 1, wherein the material of the first reinforcement layer is one or more of the following: polyethylene terephthalate, polyimide, polycarbonate, poly Styrene, polymethyl methacrylate, polyphenylene sulfide, ceramic flakes or metal sheets with insulated surfaces.
The manufacturing method according to claim 1, wherein the manufacturing method further comprises: correspondingly forming a second reinforcing layer on the lower surface of the flexible substrate facing away from the first reinforcing layer.
The manufacturing method according to any one of claims 1-10, wherein the manufacturing method further comprises:

A heat conducting layer is formed on the upper surface of the first reinforcing layer facing away from the flexible substrate.
The manufacturing method according to claim 11, wherein the material of the thermal conductive layer is one or more of the following: graphene, diamond thin film, graphite sheet, carbon nanotube film, copper metal film, silver metal film or Aluminum metal film.
The manufacturing method according to claim 11, wherein the upper surface of the thermally conductive layer facing away from the first reinforcement layer is insulated.
The production method according to claim 11, characterized in that

The first reinforcing layer is embedded into the flexible substrate by hot pressing, the thermally conductive layer covers the first reinforcing layer, and the thermally conductive layer extends beyond the first reinforcing layer and the flexible The junction of substrates.
A flexible module, characterized in that the flexible module includes:

A flexible substrate, the flexible substrate including a binding area;

A first enhancement layer, the first enhancement layer is disposed on the binding area;

A binding electrode, the binding electrode is disposed in the binding area, and the first reinforcing layer is used to provide support when the binding electrode is binding to reduce or prevent the flexible substrate from binding The area is deformed.
The flexible module according to claim 15, wherein the binding electrode is formed on an upper surface of the first reinforcement layer facing away from the flexible substrate.
The flexible module according to claim 15, wherein the bonding electrode directly contacts the first reinforcement layer.
The flexible module according to claim 15, wherein the first reinforcement layer is located between the binding electrode and the flexible substrate.
The flexible module according to claim 15, wherein the binding electrode covers the first reinforcement layer and extends to be connected to the functional pattern of the flexible substrate.
The flexible module according to claim 15, wherein the first reinforcement layer is a hard ink material.
The flexible module according to claim 15, wherein the first reinforcement layer is bonded to the flexible substrate by an adhesive.
The flexible module according to claim 15, wherein the first reinforcement layer is embedded in the flexible substrate.
The flexible module according to claim 22, further comprising: a second reinforcement layer stacked on the other surface of the flexible substrate facing away from the first reinforcement layer.
The flexible module according to any one of claims 15 to 23, further comprising: a heat conductive layer;

The thermally conductive layer is stacked between the first reinforcement layer and the binding electrode.
The flexible module according to claim 24, wherein the first reinforcing layer is embedded in the flexible substrate, the thermally conductive layer covers the first reinforcing layer, and the thermally conductive layer extends to Beyond the interface between the first reinforcement layer and the flexible substrate.