WO2020118983A1 - 异方性导电膜制造方法及其设备 - Google Patents

异方性导电膜制造方法及其设备 Download PDF

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Publication number
WO2020118983A1
WO2020118983A1 PCT/CN2019/082163 CN2019082163W WO2020118983A1 WO 2020118983 A1 WO2020118983 A1 WO 2020118983A1 CN 2019082163 W CN2019082163 W CN 2019082163W WO 2020118983 A1 WO2020118983 A1 WO 2020118983A1
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WO
WIPO (PCT)
Prior art keywords
indenter
resin layer
substrate
metal contacts
conductive film
Prior art date
Application number
PCT/CN2019/082163
Other languages
English (en)
French (fr)
Inventor
郭子豪
Original Assignee
武汉华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US16/499,641 priority Critical patent/US11735333B2/en
Publication of WO2020118983A1 publication Critical patent/WO2020118983A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/20—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by magnetic fields
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0016—Apparatus or processes specially adapted for manufacturing conductors or cables for heat treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0036—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/706—Anisotropic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration

Definitions

  • the invention relates to a method and equipment for manufacturing an anisotropic conductive film, in particular to a method and equipment for manufacturing an anisotropic conductive film for a display.
  • ACF anisotropic conductive film
  • the electrodes between the flexible substrate and the glass substrate on which the integrated circuit chip is provided are connected by conductive particles to make it conductive, while avoiding There is a short circuit between two adjacent electrodes to achieve the purpose of conducting only in the Z-axis direction.
  • the anisotropic conductive film is usually composed of an adhesive layer and a plurality of conductive particles distributed therein.
  • the anisotropic conductive film When the flexible substrate and the glass substrate are bonded by an anisotropic conductive film during bonding to form a contact that leads to the upper and lower substrates, but the plurality of conductive particles may be displaced under the effect of pressing, so that the two adjacent The contact forms a short circuit.
  • the present invention provides a method and apparatus for manufacturing an anisotropic conductive film to solve the problem of short circuit between two adjacent contacts in the prior art.
  • the main object of the present invention is to provide a method and device for manufacturing an anisotropic conductive film, which can improve the problem of short circuit between two adjacent contacts.
  • the secondary object of the present invention is to provide a method for manufacturing an anisotropic conductive film and its equipment, which can reduce the problem of short circuit between contacts by placing conductive particles relative to the contacts on the substrate, thereby improving the product Yield and reliability.
  • an embodiment of the present invention provides a method for manufacturing an anisotropic conductive film, including the steps of:
  • a first pitch of the plurality of metal contacts is the same as a second pitch of the plurality of adjustable magnetic coils.
  • the step (e) further includes: heating the resin layer through the indenter to melt the resin layer, thereby embedding the plurality of conductive particles into the resin layer And correspond to a corresponding position of the plurality of metal contacts.
  • the temperature of the indenter is cooled to cure the resin layer; and the indenter is moved away from the resin Floor.
  • the manufacturing method of the anisotropic conductive film further includes: providing a second substrate, disposed on the resin layer, and applying a pressure to the second substrate, so that the The second substrate is electrically connected to the plurality of metal contacts of the first substrate through the plurality of conductive particles.
  • another embodiment of the present invention provides a method for manufacturing an anisotropic conductive film, including the steps of:
  • the indenter is a magnetic indenter
  • the magnetic indenter has a plurality of adjustable magnetic coils, the plurality of adjustable magnetic coils corresponding to the suction pattern settings; and A first pitch of the plurality of metal contacts is the same as a second pitch of the plurality of adjustable magnetic coils.
  • the step (e) further includes: aligning the indenter with the plurality of metal contacts; and heating the resin layer by the indenter to make the resin The layer melts, so that the plurality of conductive particles are embedded in the resin layer and correspond to a corresponding position of the plurality of metal contacts.
  • the temperature of the indenter is cooled to cure the resin layer; and the indenter is moved away from the resin Floor.
  • the manufacturing method of the anisotropic conductive film further includes: providing a second substrate, disposed on the resin layer, and applying a pressure to the second substrate, so that the The second substrate is electrically connected to the plurality of metal contacts of the first substrate through the plurality of conductive particles.
  • another embodiment of the present invention further provides an anisotropic conductive film manufacturing apparatus, including: a first substrate feeding area configured to provide a first substrate, the first substrate having a plurality of metal contacts At this point, the first substrate further has a resin layer disposed on the first substrate and covering the plurality of metal contacts; a conductive particle feeding area configured to provide a plurality of conductive particles; a press-fit Area, the first substrate moves from the first substrate feed area to the nip area; and a pressure head having a suction pattern corresponding to the plurality of metal contact settings, the pressure head from the The conductive particle feeding area sucks the plurality of conductive particles; and the pressing head moves to the nip area to press the plurality of conductive particles into the resin layer.
  • the indenter is a magnetic indenter
  • the magnetic indenter has a plurality of adjustable magnetic coils, the plurality of adjustable magnetic coils corresponding to the suction pattern settings; and A first pitch of the plurality of metal contacts is the same as a second pitch of the plurality of adjustable magnetic coils.
  • the anisotropic conductive film manufacturing equipment further includes an alignment device configured to align the indenter with the plurality of metal contacts; and a heating device configuration The resin layer is heated by the indenter to melt the resin layer, so that the plurality of conductive particles are embedded in the resin layer and correspond to a corresponding position of the plurality of metal contacts.
  • the anisotropic conductive film manufacturing equipment further includes a control device connected to the heating device; and a temperature measuring device configured to measure the temperature of the indenter to So that when the heating device heats the indenter to a first temperature, the heating of the heating device is stopped by the control device, and the temperature is measured by the temperature measuring device to stop the heating after the indenter stops heating At a second temperature, the indenter is moved away from the resin layer.
  • the anisotropic conductive film manufacturing equipment further includes: a resin coating device configured to apply the resin coating when the first substrate is provided in the nip area The cloth device coats the resin layer on the first substrate; and a pre-curing device configured for pre-curing the resin layer.
  • the manufacturing method and equipment of the anisotropic conductive film of the present invention can not only improve the placement of conductive particles relative to the contacts on the substrate, so that the conductive particles are distributed at the positions of the contacts, Furthermore, the chance of short-circuiting between contacts is reduced to improve the product yield and reliability.
  • FIGS. 1A to 1H are schematic views of an anisotropic conductive film manufacturing method and equipment according to an embodiment of the invention.
  • FIG. 2 is a block schematic diagram of an anisotropic conductive film manufacturing equipment according to an embodiment of the invention.
  • FIG. 3 is a block diagram of an indenter in an anisotropic conductive film manufacturing apparatus according to an embodiment of the invention.
  • an embodiment of the present invention provides a method for manufacturing an anisotropic conductive film.
  • the manufacturing method of the anisotropic conductive film includes steps:
  • a resin layer 20 is provided on the first substrate 10 and covers the plurality of metal contacts 101;
  • (C) Provide an indenter 30 having a suction pattern 301 corresponding to the plurality of metal contacts 101;
  • an embodiment of the present invention provides an anisotropic conductive film manufacturing apparatus including: a first substrate feeding area 201, a conductive particle feeding area 202, a pressing area 203 and a pressing Head 30.
  • the first substrate feeding area 201 is configured to provide a first substrate 10, the first substrate 10 has a plurality of metal contacts 101, and the first substrate 10 further has a resin layer 20 disposed on the first substrate 10 A plurality of metal contacts 101 are covered on a substrate 10.
  • the conductive particle feeding area 202 is configured to provide a plurality of conductive particles 401.
  • the first substrate 10 moves from the first substrate feed zone 201 to the nip zone 203.
  • the indenter 30 has a suction pattern 301 corresponding to the plurality of metal contacts 101.
  • the indenter 30 can suck the plurality of conductive particles 401 from the conductive particle feeding area 202; and the pressure The head 30 can then move to the nip 203 to press the plurality of conductive particles 401 into the resin layer
  • the first substrate 10 may be a printed circuit board with a plurality of metal contacts 101 disposed on a surface of the first substrate 10.
  • the first substrate 10 may also be a flexible circuit board, a glass substrate or other components that can provide circuit connection.
  • the plurality of metal contacts 101 may be pads plated with nickel-gold plating, which is covered with a solder resist layer.
  • the plurality of metal contacts 101 may be connected to a plurality of traces provided on the first substrate 10.
  • step (a) provides the first substrate 10, and the first substrate 10 has the plurality of metal contacts 101.
  • a plurality of the first substrates 10 can be placed in a first substrate feeding area 201 and fed to the nip area 203 by a pickup device.
  • a resin coating device (not shown) may be used to dispose a resin layer 20 on the first substrate 10 and cover the plurality of metal contacts 101.
  • the resin coating device is configured to coat the resin layer 20 on the first substrate 10 by the resin coating device when the first substrate 10 is provided in the nip 203.
  • the anisotropic conductive film manufacturing equipment may further include a pre-curing device configured to pre-cur the resin layer 20.
  • the resin layer 20 may be pre-cured via the pre-curing device (for example, to the B-stage of the resin).
  • the resin layer 20 has been disposed on the first substrate 10.
  • step (c) provides the indenter 30.
  • the indenter 30 has the suction pattern 301 corresponding to the plurality of metal contacts 101.
  • the indenter 30 may be a magnetic indenter, the magnetic indenter has a plurality of adjustable magnetic coils, the plurality of adjustable magnetic coils are arranged corresponding to the suction pattern 301; and the plurality of metal contacts 101 has a first pitch, and a second pitch of the plurality of adjustable magnetic coils is the same as the first pitch of the plurality of metal contacts 101.
  • step (d) the plurality of conductive particles 401 are sucked from the conductive particle feeding area 202 through the indenter 30.
  • the plurality of conductive particles 401 are disposed in a conductive particle feeding device 40.
  • the conductive particle feeding device 40 has a plurality of grooves for accommodating the plurality of conductive particles 401.
  • the plurality of trenches have a third pitch, which is the same as the first pitch and the second pitch.
  • the indenter 30 absorbs the multiple Out of conductive particles 401.
  • the indenter 30 absorbs a plurality of conductive particles 401
  • the indenter 30 moves to the nip 203.
  • the indenter 30 is aligned with the plurality of metal contacts 101 so that the plurality of conductive particles 401 are aligned with the plurality of metal contacts Point 101.
  • the resin layer 20 is heated by the indenter 30 to melt the resin layer 20.
  • the indenter 30 has a heating device 303 configured to heat the resin layer 20 through the indenter 30 to melt the resin layer 20.
  • an infrared heating device is provided on the pressing head 30, and when the pressing head 30 abuts the resin layer 20, the infrared heating device emits an infrared light to the resin layer 20 to The temperature of the resin layer 20 is raised, and the resin layer 20 is melted.
  • the heating device 303 only softens the upper half of the resin layer 20 so that the plurality of conductive particles 401 can be embedded in the resin layer 20, but does not excessively soften the The resin layer 20 maintains a sufficient standing height of the resin layer 20.
  • step (e) the plurality of conductive particles 401 are pressed into the resin layer 20 by the indenter 30.
  • the heating device 303 is set to heat the indenter 30 to a first temperature
  • the indenter 30 is pressed down so that the plurality of conductive particles 401 are pressed Into the resin layer 20, so that the plurality of conductive particles 401 are embedded in the resin layer 20 and correspond to a corresponding position of the plurality of metal contacts 101.
  • the corresponding position is located above the plurality of metal contacts 101, but the plurality of conductive particles 401 are not in contact with the plurality of metal contacts 101.
  • the temperature of the indenter 30 is cooled to cure the resin layer 20; and the pressure The head 30 moves away from the resin layer 20.
  • a second temperature is set for the indenter 30. After the indenter 30 is cooled to the second temperature, the indenter 30 is moved away from the resin layer 20.
  • a second substrate is provided on the resin layer 20, and a pressure is applied to the second substrate so that the second substrate passes through the plurality of conductive particles 401 is electrically connected to the plurality of metal contacts 101 of the first substrate 10. After the pressure is applied, the plurality of conductive particles 401 are in contact with the plurality of metal contacts 101 to form electrical conduction. When the plurality of conductive particles 401 are embedded in the resin layer 20 and still maintain a distance from the plurality of metal contacts 101 without contacting the plurality of metal contacts 101, the After the pressure, the plurality of conductive particles 401 will not shift left and right, thereby reducing the chance of short circuit.
  • the configuration of the anisotropic conductive film manufacturing equipment and the indenter 30 further includes a control device 302, a heating device 303, a temperature measuring device 304, and a driving device 305.
  • the control device 302 is configured to connect to the heating device 303.
  • the temperature measuring device 304 is configured to measure a temperature of the indenter 30 so that when the heating device 303 heats the indenter 30 to a first temperature, it is stopped by the control device 302 When the heating device 303 heats and the temperature measuring device 304 detects that the indenter 30 stops heating and then cools to a second temperature, the indenter 30 is moved away from the resin layer 20.
  • the indenter 30 is connected to the driving device 305, and the driving device 305 is used to move the indenter 30 to the conductive particle feeding area 202 to suck the plurality of conductive particles 401, and then to suck the After a plurality of conductive particles 401, the indenter 30 moves to the nip 203.
  • the anisotropic conductive film manufacturing equipment further includes an alignment device (not shown) configured to align the indenter 30 with the plurality of grooves on the conductive particle feeding device 40, And align the indenter 30 with the plurality of metal contacts 101.
  • the driving device 305 may also move the indenter 30 to a waiting area between the conductive particle feeding area 202 and the nip area 203 ( As shown in FIG. 2 where the indenter 30 is located) to wait for the next operation.
  • the method and apparatus for manufacturing an anisotropic conductive film of the present invention is to arrange conductive particles relative to contacts on a substrate, and when the plurality of conductive particles are embedded in the resin layer Remains at a distance from the plurality of metal contacts without contacting the plurality of metal contacts, so when the pressure is applied, the plurality of conductive particles will not shift left and right, thereby reducing the short circuit An opportunity occurs to reduce the problem of short circuit between contacts, thereby improving the yield and reliability of the product.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

本发明公开一种异方性导电膜制造方法及其设备。所述异方性导电膜制造方法，包含步骤：（a）提供一第一基板，具有多个金属触点；（b）设置一树脂层于所述第一基板上，并覆盖所述多个金属触点；（c）提供一压头，具有一吸取图案对应于所述多个金属触点设置；（d）通过所述压头吸取多个导电粒子；及（e）通过所述压头将所述多个导电粒子压入所述树脂层中。本发明通过将导电粒子相对于基板上的触点设置，以达到减少触点间短路的问题，从而提高产品的良率及信赖性。

Description

异方性导电膜制造方法及其设备 技术领域
本发明是有关于一种异方性导电膜制造方法及其设备，特别是有关于一种用于显示器的异方性导电膜制造方法及其设备。
 背景技术
近年来，随着电子产品朝着轻、薄、短、小的快速发展，各种便携式电子产品使用的显示面板的需求越来越大。为了将驱动电路及控制芯片等半导体元件与显示面板电性连接，通常将上述元件设置于一基板上，再经由异方性导电膜（ACF）与显示面板的玻璃基板电性连接。异方性导电膜的特点在于Z轴电气导通方向与XY绝缘平面的电阻特性具有明显的差异性。当Z轴导通电阻值与XY平面绝缘电阻值的差异超过一定比值后，利用导电粒子连接设置有集成电路芯片的柔性基板与玻璃基板两者之间的电极使之导通，同时又能避免相邻两电极间导通短路，而达成只在Z轴方向导通之目的。
 技术问题
异方性导电膜通常由黏胶层及分布于其中的多个导电粒子所组成。当柔性基板与玻璃基板经由异方性导电膜在邦定过程中经由压合形成导通上下基板的触点，但所述多个导电粒子可能在压合作用下发生位移，使得两相邻的触点形成短路。
故，有必要提供一种异方性导电膜制造方法及其设备，以解决现有技术所存在的问题。
 技术解决方案
有鉴于此，本发明提供一种异方性导电膜制造方法及其设备，以解决现有技术所存在的两相邻的触点形成短路的问题。
本发明的主要目的在于提供一种异方性导电膜制造方法及其设备，其可以改善两相邻的触点形成短路的问题。
本发明的次要目的在于提供一种异方性导电膜制造方法及其设备，其可以通过将导电粒子相对于基板上的触点设置，以达到减少触点间短路的问题，从而提高产品的良率及信赖性。
为达成本发明的前述目的，本发明一实施例提供一种异方性导电膜制造方法，包含步骤：
（a）提供一第一基板，具有多个金属触点；
（b）设置一树脂层于所述第一基板上，并覆盖所述多个金属触点；
（c）提供一磁性压头，具有一吸取图案对应于所述多个金属触点设置，所述磁性压头具有多个可调控磁性线圈，所述多个可调控磁性线圈对应于所述吸取图案设置；
（d）通过所述压头吸取多个导电粒子；及
（e）将所述压头与所述多个金属触点对位，通过所述压头将所述多个导电粒子压入所述树脂层中。
在本发明的一实施例中，所述多个金属触点的一第一间距与所述多个可调控磁性线圈的一第二间距相同。
在本发明的一实施例中，所述步骤（e）更包含：通过所述压头加热所述树脂层，使所述树脂层融化，进而使得所述多个导电粒子嵌入到所述树脂层中并对应于所述多个金属触点的一对应位置。
在本发明的一实施例中，所述多个导电粒子嵌入到所述树脂层后，对所述压头进行降温，以使所述树脂层固化；及将所述压头移离所述树脂层。
在本发明的一实施例中，所述异方性导电膜制造方法更包含：提供一第二基板，设置于所述树脂层之上，及对所述第二基板施加一压力，使得所述第二基板通过所述多个导电粒子与所述第一基板的所述多个金属触点电性导通。
另外，本发明另一实施例提供一种异方性导电膜制造方法，包含步骤：
（a）提供一第一基板，具有多个金属触点；
（b）设置一树脂层于所述第一基板上，并覆盖所述多个金属触点；
（c）提供一压头，具有一吸取图案对应于所述多个金属触点设置；
（d）通过所述压头吸取多个导电粒子；及
（e）通过所述压头将所述多个导电粒子压入所述树脂层中。
在本发明的一实施例中，所述压头为一磁性压头，所述磁性压头具有多个可调控磁性线圈，所述多个可调控磁性线圈对应于所述吸取图案设置；及所述多个金属触点的一第一间距与所述多个可调控磁性线圈的一第二间距相同。
在本发明的一实施例中，所述步骤（e）更包含：将所述压头与所述多个金属触点对位；及通过所述压头加热所述树脂层，使所述树脂层融化，进而使得所述多个导电粒子嵌入到所述树脂层中并对应于所述多个金属触点的一对应位置。
在本发明的一实施例中，所述多个导电粒子嵌入到所述树脂层后，对所述压头进行降温，以使所述树脂层固化；及将所述压头移离所述树脂层。
在本发明的一实施例中，所述异方性导电膜制造方法更包含：提供一第二基板，设置于所述树脂层之上，及对所述第二基板施加一压力，使得所述第二基板通过所述多个导电粒子与所述第一基板的所述多个金属触点电性导通。
再者，本发明另一实施例另提供一种异方性导电膜制造设备，包含：一第一基板进料区，配置用以提供一第一基板，所述第一基板具有多个金属触点，所述第一基板更具有一树脂层设置于所述第一基板上，并覆盖所述多个金属触点；一导电粒子进料区，配置用以提供多个导电粒子；一压合区，所述第一基板从所述第一基板进料区移动至所述压合区；及一压头，具有一吸取图案对应于所述多个金属触点设置，所述压头从所述导电粒子进料区吸取所述多个导电粒子；及所述压头移动至所述压合区将所述多个导电粒子压入所述树脂层中。
在本发明的一实施例中，所述压头为一磁性压头，所述磁性压头具有多个可调控磁性线圈，所述多个可调控磁性线圈对应于所述吸取图案设置；及所述多个金属触点的一第一间距与所述多个可调控磁性线圈的一第二间距相同。
在本发明的一实施例中，所述异方性导电膜制造设备更包含一对位装置，配置用以将所述压头与所述多个金属触点对位；及一加热装置配置用以通过所述压头加热所述树脂层，以使所述树脂层融化，进而使得所述多个导电粒子嵌入到所述树脂层中并对应于所述多个金属触点的一对应位置。
在本发明的一实施例中，所述异方性导电膜制造设备更包含一控制装置，连接所述加热装置；及一温度量测装置，配置用以量测所述压头的温度，以使得当所述加热装置将所述压头加热至一第一温度时，经由所述控制装置停止所述加热装置的加热，以及通过所述温度量测装置测得所述压头停止加热后降温至一第二温度时，将所述压头移离所述树脂层。
在本发明的一实施例中，所述异方性导电膜制造设备另包含：一树脂涂布装置，配置用以在所述第一基板提供于所述压合区时，通过所述树脂涂布装置涂布所述树脂层于所述第一基板上；及一预固化装置，配置用于预固化所述树脂层。
 有益效果
与现有技术相比较，本发明的异方性导电膜制造方法及其设备，这样不但可改善通过将导电粒子相对于基板上的触点设置，从而使导电粒子分布于触点的位置处，进而减少触点间短路的机会，以达到提高产品的良率及信赖性。
 附图说明
为让本发明的上述内容能更明显易懂，下文特举优选实施例，并配合所附图式，作详细说明如下：
图1A至图1H是本发明一实施例的异方性导电膜制造方法及其设备示意图；
图2是本发明一实施例的异方性导电膜制造设备的方框示意图；
图3是本发明一实施例的异方性导电膜制造设备中的压头的方框示意图。
 本发明的实施方式
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。再者，本发明所提到的方向用语，例如上、下、顶、底、前、后、左、右、内、外、侧面、周围、中央、水平、横向、垂直、纵向、轴向、径向、最上层或最下层等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
请参照图1A至图1H，本发明的一实施例提供一种异方性导电膜制造方法。所述异方性导电膜制造方法包含步骤：
（a）提供一第一基板10，具有多个金属触点101；
（b）设置一树脂层20于所述第一基板10上，并覆盖所述多个金属触点101；
（c）提供一压头30，具有一吸取图案301对应于所述多个金属触点101设置；
（d）通过所述压头30吸取多个导电粒子401；及
（e）通过所述压头30将所述多个导电粒子401压入所述树脂层20中。
请参照图2，本发明的一实施例提供一种所述异方性导电膜制造设备包含：一第一基板进料区201、一导电粒子进料区202、一压合区203及一压头30。所述第一基板进料区201配置用以提供一第一基板10，所述第一基板10具有多个金属触点101，所述第一基板10更具有一树脂层20设置于所述第一基板10上，并覆盖所述多个金属触点101。所述导电粒子进料区202配置用以提供多个导电粒子401。所述第一基板10从所述第一基板进料区201移动至所述压合区203。所述压头30具有一吸取图案301对应于所述多个金属触点101设置，所述压头30可从所述导电粒子进料区202吸取所述多个导电粒子401；及所述压头30接着可移动至所述压合区203将所述多个导电粒子401压入所述树脂层20中。
本发明将于下文利用图1A至图1H及图2逐一详细说明在一实施例中上述各元件的细部构造、组装关系及其运作原理。所述第一基板10可以为一印刷电路板，具有多个金属触点101设置于所述第一基板10的一表面上。所述第一基板10也可以是一柔性电路板、一玻璃基板或其他能够提供电路连接的元件。所述多个金属触点101可以是镀有镍金镀层的焊盘（pads），其上覆盖有一防焊剂层。所述多个金属触点101可以连接设置于所述第一基板10上的多条走线。
请参照图1A及图2所示，步骤（a）提供所述第一基板10，所述第一基板10具有所述多个金属触点101。在本步骤中，多个所述第一基板10可以放置于一第一基板进料区201，通过一拾取装置馈送至所述压合区203。在本实施例中，步骤（b）可以通过一树脂涂布装置(未绘示)将一树脂层20设置于所述第一基板10上，并覆盖所述多个金属触点101。所述树脂涂布装置配置用以在所述第一基板10提供于所述压合区203时，通过所述树脂涂布装置涂布所述树脂层20于所述第一基板10上。所述异方性导电膜制造设备更可包含一预固化装置，配置用于预固化所述树脂层20。在所述树脂层20涂布于所述第一基板10上后，可以经由所述预固化装置将所述树脂层20预固化（例如到树脂的B阶段（B-stage））。于本发明的另一个实施例中，当所述第一基板10馈入所述压合区203前，所述树脂层20已经设置于所述第一基板10上。
请参照图1B及图2所示，步骤（c）提供所述压头30，所述压头30具有所述吸取图案301对应于所述多个金属触点101设置。所述压头30可以为一磁性压头，所述磁性压头具有多个可调控磁性线圈，所述多个可调控磁性线圈对应于所述吸取图案301设置；及所述多个金属触点101具有一第一间距，所述多个可调控磁性线圈的一第二间距与所述多个金属触点101的所述第一间距相同。
请参照图1C及图2所示，步骤（d）通过所述压头30于所述导电粒子进料区202吸取所述多个导电粒子401。所述多个导电粒子401设置于一导电粒子进料装置40中。所述导电粒子进料装置40具有多个沟槽用以容置所述多个导电粒子401。所述多个沟槽具有一第三间距，与所述第一间距及所述第二间距相同。
请参照图1D及图2所示，所述压头30的所述吸取图案301与所述导电粒子进料装置40上的所述多个沟槽对齐后，所述压头30吸取所述多个导电粒子401。
请参照图1E及图2所示，在所述压头30吸取多个导电粒子401后，所述压头30移动至所述压合区203。当所述压头30移动至所述压合区203后，将所述压头30与所述多个金属触点101对位，以使得所述多个导电粒子401对齐所述多个金属触点101。接着，通过所述压头30加热所述树脂层20，以使所述树脂层20融化。在本实施例中，所述压头30中具有一加热装置303配置用以通过所述压头30加热所述树脂层20，以使所述树脂层20融化。在本实施例中，所述压头30上设置有一红外线加热装置，当所述压头30抵靠所述树脂层20时，所述红外线加热装置对所述树脂层20发射一红外光，以使所述树脂层20的温度上升，进而融化所述树脂层20。在本实施例中，所述加热装置303仅对使所述树脂层20的上半部呈现软化状态，使得所述多个导电粒子401能嵌入所述树脂层20，但不会过度软化所述树脂层20，以维持所述树脂层20足够的站立高度。
请参照图1F及图2所示，步骤（e）通过所述压头30将所述多个导电粒子401压入所述树脂层20中。将所述加热装置303设定加热所述压头30至一第一温度后，维持所述第一温度加热一时间后，将所述压头30下压以使得所述多个导电粒子401压入所述树脂层20中，进而使得所述多个导电粒子401嵌入到所述树脂层20中并对应于所述多个金属触点101的一对应位置。在本实施例中，所述对应位置位于所述多个金属触点101上方，但所述多个导电粒子401未与所述多个金属触点101相接触。
请参照图1G及图2所示，当所述多个导电粒子401嵌入到所述树脂层20后，对所述压头30进行降温，以使所述树脂层20固化；及将所述压头30移离所述树脂层20。在本实施例中，对所述压头30设置一第二温度，当所述压头30进行降温至所述第二温度后，将所述压头30移离所述树脂层20。
请参照图1H及图2所示，提供一第二基板，设置于所述树脂层20之上，并对所述第二基板施加一压力，使得所述第二基板通过所述多个导电粒子401与所述第一基板10的所述多个金属触点101电性导通。施加所述压力后，所述多个导电粒子401与所述多个金属触点101相接触进而形成电性导通。由于当所述多个导电粒子401嵌入到所述树脂层20中仍与所述多个金属触点101保持一距离而未与所述多个金属触点101相接触，因而在当施加所述压力后，所述多个导电粒子401不会左右位移，进而降低短路的发生机会。
请参照图3所示，所述异方性导电膜制造设备与所述压头30相关的配置更包含一控制装置302、一加热装置303、一温度量测装置304及一驱动装置305。所述控制装置302配置用以连接所述加热装置303。所述温度量测装置304配置用以量测所述压头30的一温度，以使得当所述加热装置303将所述压头30加热至一第一温度时，经由所述控制装置302停止所述加热装置303的加热，以及通过所述温度量测装置304测得所述压头30停止加热后降温至一第二温度时，将所述压头30移离所述树脂层20。所述压头30连接所述驱动装置305，所述驱动装置305用以将所述压头30移至所述导电粒子进料区202吸取所述多个导电粒子401，及接着将吸取所述多个导电粒子401后的所述压头30移至所述压合区203。所述异方性导电膜制造设备更包含一对位装置(未绘示)，配置用以将所述压头30与所述导电粒子进料装置40上的所述多个沟槽对齐后，及将所述压头30与所述多个金属触点101对位。在完成上述移动后或是在必要时，所述驱动装置305也可将所述压头30移动至位在所述导电粒子进料区202及所述压合区203之间的一等待区(如图2所述压头30所在的位置)以等待进行下一次的操作。
如上所述，相较于现有显示器面板使用异方性导电膜邦定的问题，却也常因导电粒子可能在邦定压合工艺下发生位移，使得两相邻的触点形成短路，而导致显示面板会出现产品故障或异常，本发明的异方性导电膜制造方法及其设备通过将导电粒子相对于基板上的触点设置，及当所述多个导电粒子嵌入到所述树脂层中仍与所述多个金属触点保持一距离而未与所述多个金属触点相接触，因而在当施加所述压力后，所述多个导电粒子不会左右位移，进而降低短路的发生机会，以达到减少触点间短路的问题，从而提高产品的良率及信赖性。
本发明已由上述相关实施例加以描述，然而上述实施例仅为实施本发明的范例。必需指出的是，已公开的实施例并未限制本发明的范围。相反地，包含于权利要求书的精神及范围的修改及均等设置均包括于本发明的范围内。

Claims (15)

  1. 一种异方性导电膜制造方法，包含步骤：
    （a）提供一第一基板，具有多个金属触点；
    （b）设置一树脂层于所述第一基板上，并覆盖所述多个金属触点；
    （c）提供一磁性压头，具有一吸取图案对应于所述多个金属触点设置，所述磁性压头具有多个可调控磁性线圈，所述多个可调控磁性线圈对应于所述吸取图案设置；
    （d）通过所述压头吸取多个导电粒子；及
    （e）将所述压头与所述多个金属触点对位，通过所述压头将所述多个导电粒子压入所述树脂层中。
  2. 如权利要求1所述的异方性导电膜制造方法，其中所述多个金属触点的一第一间距与所述多个可调控磁性线圈的一第二间距相同。
  3. 如权利要求1所述的异方性导电膜制造方法，其中所述步骤（e）更包含：通过所述压头加热所述树脂层，使所述树脂层融化，进而使得所述多个导电粒子嵌入到所述树脂层中并对应于所述多个金属触点的一对应位置。
  4. 如权利要求3所述的异方性导电膜制造方法，其中所述多个导电粒子嵌入到所述树脂层后，对所述压头进行降温，以使所述树脂层固化；及将所述压头移离所述树脂层。
  5. 如权利要求1所述的异方性导电膜制造方法，其中所述异方性导电膜制造方法更包含：提供一第二基板，设置于所述树脂层之上，及对所述第二基板施加一压力，使得所述第二基板通过所述多个导电粒子与所述第一基板的所述多个金属触点电性导通。
  6. 一种异方性导电膜制造方法，包含步骤：
    （a）提供一第一基板，具有多个金属触点；
    （b）设置一树脂层于所述第一基板上，并覆盖所述多个金属触点；
    （c）提供一压头，具有一吸取图案对应于所述多个金属触点设置；
    （d）通过所述压头吸取多个导电粒子；及
    （e）通过所述压头将所述多个导电粒子压入所述树脂层中。
  7. 如权利要求6所述的异方性导电膜制造方法，其中所述压头为一磁性压头，所述磁性压头具有多个可调控磁性线圈，所述多个可调控磁性线圈对应于所述吸取图案设置；及所述多个金属触点的一第一间距与所述多个可调控磁性线圈的一第二间距相同。
  8. 如权利要求6所述的异方性导电膜制造方法，其中所述步骤（e）更包含：将所述压头与所述多个金属触点对位；及通过所述压头加热所述树脂层，使所述树脂层融化，进而使得所述多个导电粒子嵌入到所述树脂层中并对应于所述多个金属触点的一对应位置。
  9. 如权利要求8所述的异方性导电膜制造方法，其中所述多个导电粒子嵌入到所述树脂层后，对所述压头进行降温，以使所述树脂层固化；及将所述压头移离所述树脂层。
  10. 如权利要求6所述的异方性导电膜制造方法，其中所述异方性导电膜制造方法更包含：提供一第二基板，设置于所述树脂层之上，及对所述第二基板施加一压力，使得所述第二基板通过所述多个导电粒子与所述第一基板的所述多个金属触点电性导通。
  11. 一种异方性导电膜制造设备，包含：
    一第一基板进料区，配置用以提供一第一基板，所述第一基板具有多个金属触点，所述第一基板更具有一树脂层设置于所述第一基板上，并覆盖所述多个金属触点；
    一导电粒子进料区，配置用以提供多个导电粒子；
    一压合区，所述第一基板从所述第一基板进料区移动至所述压合区；及
    一压头，具有一吸取图案对应于所述多个金属触点设置，所述压头从所述导电粒子进料区吸取所述多个导电粒子；及所述压头移动至所述压合区将所述多个导电粒子压入所述树脂层中。
  12. 如权利要求11所述的异方性导电膜制造设备，其中所述压头为一磁性压头，所述磁性压头具有多个可调控磁性线圈，所述多个可调控磁性线圈对应于所述吸取图案设置；及所述多个金属触点的一第一间距与所述多个可调控磁性线圈的一第二间距相同。
  13. 如权利要求11所述的异方性导电膜制造设备，其中所述异方性导电膜制造设备更包含一对位装置，配置用以将所述压头与所述多个金属触点对位；及一加热装置配置用以通过所述压头加热所述树脂层，以使所述树脂层融化，进而使得所述多个导电粒子嵌入到所述树脂层中并对应于所述多个金属触点的一对应位置。
  14. 如权利要求13所述的异方性导电膜制造设备，其中所述异方性导电膜制造设备更包含一控制装置，连接所述加热装置；及一温度量测装置，配置用以量测所述压头的温度，以使得当所述加热装置将所述压头加热至一第一温度时，经由所述控制装置停止所述加热装置的加热，以及通过所述温度量测装置测得所述压头停止加热后并降温至一第二温度时，将所述压头移离所述树脂层。
  15. 如权利要求11所述的异方性导电膜制造设备，其中所述异方性导电膜制造设备另包含：一树脂涂布装置，配置用以在所述第一基板提供于所述压合区时，通过所述树脂涂布装置涂布所述树脂层于所述第一基板上；及一预固化装置，配置用于预固化所述树脂层。
PCT/CN2019/082163 2018-12-12 2019-04-11 异方性导电膜制造方法及其设备 WO2020118983A1 (zh)

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