WO2020118936A1 - 显示面板及其边框基板 - Google Patents

显示面板及其边框基板 Download PDF

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Publication number
WO2020118936A1
WO2020118936A1 PCT/CN2019/078194 CN2019078194W WO2020118936A1 WO 2020118936 A1 WO2020118936 A1 WO 2020118936A1 CN 2019078194 W CN2019078194 W CN 2019078194W WO 2020118936 A1 WO2020118936 A1 WO 2020118936A1
Authority
WO
WIPO (PCT)
Prior art keywords
traces
area
display panel
frame substrate
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/078194
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English (en)
French (fr)
Inventor
程艳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Technology Co Ltd
Priority to US16/471,995 priority Critical patent/US11206733B2/en
Publication of WO2020118936A1 publication Critical patent/WO2020118936A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]

Definitions

  • the present invention relates to the technical field of liquid crystal display, and particularly to a display panel having a thin film flip chip package (COF).
  • COF thin film flip chip package
  • the glass adopts thin film flip chip packaging (COF, Chip On Film), that is, the chip is bound to a flexible printed circuit (FPC, Flexible Printed Circuit), and folded to the back of the display substrate package, thereby reducing the occupation of the glass substrate, can shorten the size of the small display module Bezel to achieve a narrow bezel, however, when the thin film flip chip package is in an assembled state, the thin film flip chip package has one end attached to the upper portion of the display panel and is bent to be installed under the display panel, the restoring force at this time is along with The opposite direction of the bending direction of the thin film flip chip package acts on the thin film flip chip package, so as time goes by, the peeling phenomenon of the thin film flip chip package from the bottom of the display panel may occur, and even metal may easily occur during the bending process The problem of broken wiring.
  • COF Chip On Film
  • FPC Flexible Printed Circuit
  • the radius of the bending area of the thin film flip chip package is bound to the glass substrate architecture (COG) compared to the ordinary chip
  • COG glass substrate architecture
  • the display panel must be large and not easy to be bent. To realize the extremely narrow bezel technology of mobile phones, this shortcoming must be overcome.
  • the temperature of the thin film flip chip package is high, and the expansion coefficient of the flexible circuit board is large, and it is susceptible to thermal deformation, so the binding process of the flexible circuit board has higher requirements.
  • the present invention provides a display panel and its bezel substrate to solve the problem of the prior art where a strong rebound stress is formed in the bending area after the bezel substrate is folded back, and this rebound stress makes such products often Defective phenomena such as peeling of the frame substrate from the display panel occur.
  • the main object of the present invention is to provide a display panel and its frame substrate.
  • the present invention effectively prevents the multiple traces from being bent for a long time by providing a first line area with a larger width at the bending area It is broken, and the plurality of traces form a cross-displacement structure, which reduces the stress concentration during bending, and reduces the width of the bending area and avoids signal interference.
  • the plurality of traces can also be a single metal layer to reduce the volume of the bending area.
  • the secondary object of the present invention is to provide a display panel and its frame substrate.
  • a plurality of openings are provided between the plurality of traces, when the flexible circuit board in the frame substrate is bent In the zone, the plurality of openings are stretched and the aperture becomes larger to reduce the stress on the bending area and reduce the squeezing force on the plurality of traces.
  • the plurality of openings are reduced
  • the area of the bending area of the flexible circuit board reduces the undesirable phenomenon that the flexible circuit board peels off from the display panel and affects the screen display, and effectively suppresses the crack propagation in the metal wiring.
  • the multiple openings overcome the problem that the flexible circuit board is easily deformed by heat due to a large expansion coefficient, and at the same time reduce the bonding process of the flexible circuit board Requirements to improve the reliability and durability of the flexible circuit board.
  • an embodiment of the invention provides a frame substrate of a display panel, which includes:
  • a plurality of traces each of the plurality of traces includes a first line area and a second line area, the first line area and the second line area are disposed on the bending area, each of the The width of the first line area of the plurality of traces is greater than the width of the second line area of the plurality of traces, and the first line areas of the adjacent traces are arranged to be offset from each other, and The plurality of first line regions are arranged in a zigzag pattern perpendicular to the extending direction of the plurality of traces.
  • the bending area is provided with a plurality of openings, and the adjacent openings are arranged to be offset from each other.
  • the plurality of openings are provided between the plurality of traces, and the plurality of openings are provided in the first line area or location corresponding to the traces Describe the location of the second line area.
  • the shapes of the openings are selected from a group consisting of a circle, a semicircle, a rectangle, a diamond, a cone, and a combination thereof.
  • the junction positions of the first line regions of the adjacent traces are 0.010 mm to 0.020 mm apart along the extending direction of the traces.
  • the frame substrate includes a flexible circuit board and a chip, and the chip is bound to the flexible circuit board.
  • another embodiment of the present invention further provides a frame substrate of a display panel, which includes:
  • a plurality of traces each of the plurality of traces includes a first line area and a second line area, the first line area and the second line area are disposed on the bending area, each of the The width of the first line area of the plurality of traces is greater than the width of the second line area of the plurality of traces, and the first line areas of the adjacent traces are arranged to be offset from each other.
  • the bending area is provided with a plurality of openings, and the adjacent openings are arranged to be offset from each other.
  • the plurality of openings are provided between the plurality of traces, and the plurality of openings are provided in the first line area or location corresponding to the traces Describe the location of the second line area.
  • the shapes of the openings are selected from a group consisting of a circle, a semicircle, a rectangle, a diamond, a cone, and a combination thereof.
  • the junction positions of the first line regions of the adjacent traces are 0.010 mm to 0.020 mm apart along the extending direction of the traces.
  • the frame substrate includes a flexible circuit board and a chip, and the chip is bound to the flexible circuit board.
  • a display panel which includes:
  • a non-display area including:
  • a frame substrate, the frame substrate includes:
  • a bending area, the bending area is provided with a plurality of openings;
  • a plurality of traces each of the plurality of traces includes a first line area and a second line area, the first line area and the second line area are disposed on the bending area, each of the The width of the first line area of the plurality of traces is greater than the width of the second line area of the plurality of traces, and the first line areas of the adjacent traces are arranged to be offset from each other.
  • the junction positions of the first line regions of the adjacent traces are 0.010 mm to 0.020 mm apart along the extending direction of the traces.
  • the plurality of first line regions are arranged in a zigzag pattern perpendicular to the extending direction of the plurality of traces.
  • the present invention effectively avoids the problem by providing a first line area with a larger width at the bending area Multiple traces are broken due to long-term bending, and the multiple traces form a cross-displacement structure to reduce stress concentration during bending, while reducing the width of the bending area and avoiding signal interference, ensuring the display panel Display effect.
  • a plurality of openings are provided between the plurality of traces to reduce the stress on the bending area, reduce the squeezing force on the plurality of traces, and at the same time reduce the flexible circuit board
  • the area of the bending area reduces the defect that the flexible circuit board peels off from the display panel and affects the screen display, and effectively suppresses the crack propagation in the metal wiring.
  • the multiple openings overcome the problem that the flexible circuit board is easily deformed by heat due to a large expansion coefficient, and at the same time reduce the bonding process of the flexible circuit board Requirements to improve the reliability and durability of the flexible circuit board.
  • FIG. 1 is a schematic diagram of a display panel according to an embodiment of the invention.
  • FIG. 2 is a schematic cross-sectional view of a frame substrate bent to the back of the display panel of FIG. 1 according to an embodiment of the present invention
  • FIG. 3 is a schematic diagram of a bending area of the frame substrate of FIG. 2;
  • FIG. 4 is a schematic diagram of a bending area of another embodiment of the frame substrate of FIG. 2.
  • a processing module or “at least one processing module” may include multiple processing modules, including combinations thereof.
  • frame substrate refers to a substrate located at a frame of a display panel.
  • FIG. 1 is a schematic diagram of a display panel according to an embodiment of the present invention
  • FIG. 2 is a frame substrate bent to the rear of the display panel of FIG. 1 according to an embodiment of the present invention.
  • the display panel 1 includes a display area 10 and a non-display area 20.
  • a display module 11 is provided on the display area 10 and displays a picture by receiving a signal.
  • the display module 11 may be selected from an organic light emitting diode (OLED) display module and a liquid crystal display (LCD) display module One of a group consisting of a group or a flexible OLED display.
  • a frame substrate 21 is provided on the non-display area.
  • the frame substrate 21 includes a flexible circuit board 22.
  • the flexible circuit board 22 is provided with one or more driving chips 23.
  • the flexible circuit board 22 is bound by a The fixed area 24 fixes the flexible circuit board 22 on the non-display area 20.
  • the non-display area 20 further includes a middle frame 50 for fixing the frame substrate 21.
  • a bending region 221 is defined on the flexible circuit board 22 in the frame substrate 21.
  • a first end of the flexible circuit board 22 on the frame substrate 21 is attached to the upper portion of the display panel 1 through the binding area 24 for further connection To the display area 11, a signal is transmitted to the display area 11 to display a picture.
  • the bending region 221 is bent so that a second end of the flexible circuit board 22 and the driving chip 23 on the flexible circuit board 22 are fixed under the display panel 1 together.
  • FIG. 3 is a schematic diagram of a bending area of the frame substrate of FIG. 2.
  • the flexible circuit board 22 of the frame substrate 21 is provided with a plurality of traces 30, each of the plurality of traces 30 includes a first line area 31 and a second line area 32, the first line area 31 and The second line area 32 is disposed on the bending area 221, wherein the second line area 32 extends from the flexible circuit board 22 to the bending area 221 along the direction of the trace 30, and It extends from the bending area 221 to the display area 11.
  • the width of the first line region 31 of each of the plurality of traces 30 is greater than the width of the second line region 32 of the plurality of traces 30, and the first The first-line areas 31 are arranged in phase with each other.
  • the junction positions of the first line regions 31 of the adjacent traces 30 are 0.010 mm to 0.020 mm apart along the extending direction of the trace 30.
  • the intersection positions of the first line regions 31 of the adjacent traces 30 are 0.015 mm apart along the extending direction of the trace 30.
  • the plurality of first line regions 31 are arranged in a zigzag pattern perpendicular to the extending direction of the plurality of traces 30.
  • the plurality of traces 30 of the present invention has a first line area 31 with a larger width at the bending area 221, which effectively prevents the multiple traces 30 from breaking due to long-term bending, and the plurality of traces 30
  • the traces 30 form a cross-displaced structure, which reduces the stress concentration during bending, reduces the width of the bending area 221 and avoids signal interference, and ensures the display effect of the display panel 1.
  • the plurality of traces 30 can also be a single metal layer to reduce the volume of the bending region 221.
  • the plurality of traces 30 may be formed by patterning process, physical vapor deposition film formation (for example, magnetron sputtering method), or wet etching to form a pattern.
  • the above process is only for illustration, and the formation of the plurality of traces 30 of the present invention is not limited to the above method.
  • the photolithography process is one of the patterning processes, and may include steps such as pretreatment, forming a base film, coating photoresist, baking, exposing, developing, and etching.
  • the pretreatment generally includes: wet cleaning, deionized water cleaning, dehydration and baking; for example, the formation of the base film can be achieved by vapor deposition, magnetron sputtering, etc.; for example, the coating of photoresist can be achieved by Static glue or dynamic glue to achieve; baking can be used to remove the solvent in the photoresist or the solvent after development.
  • the photolithography process may further include: hard film baking, development inspection, and other steps.
  • the photolithography process may also include several of the above steps, for example, including the steps of coating photoresist, exposing, and developing.
  • the frame substrate 21 of the present invention may further be provided with a glue 25, which is provided on the surface of the flexible circuit board 22 to protect the plurality of traces 30 for a long time.
  • the bending area 221 is further provided with a plurality of openings 33, and the adjacent openings 33 are arranged to be offset from each other.
  • the plurality of openings may be provided between the plurality of traces, and the plurality of openings 33 are provided in the first line area 31 or the second line area 32 corresponding to the trace 30 To avoid the junction of the first line area 31 and the second line area 32 of each trace 30.
  • the plurality of shapes of the plurality of openings 33 may be selected from a group consisting of a circle, a semicircle, a rectangle, a diamond, a cone, and combinations thereof.
  • the plurality of openings 33 are stretched and the hole diameter becomes larger, so as to reduce the stress on the bending zone 221.
  • the plurality of openings 33 overcomes the problem that the flexible circuit board is easily deformed by heat due to a large expansion coefficient, and at the same time reduces the binding of the flexible circuit board 22 According to the requirements of the fixed process, the reliability and durability of the flexible circuit board 22 are improved.
  • the plurality of openings 33 can be formed by various processes, such as etching a hole or cutting a hole with a laser.
  • the above process is only used as an example, and the formation of the plurality of openings 33 of the present invention is not limited to the above method.
  • each of the plurality of openings 33 may be separated by one or more of the traces 30, as shown in FIG. 3, between each of the plurality of openings 33 Separate two traces 30.
  • FIG. 4 is a schematic diagram of a bending area of another embodiment of the frame substrate of FIG. 2.
  • Each of the plurality of openings 33 may be provided with one or more of the traces 30 at the same time, effectively releasing the bending stress, so as to minimize the stress concentration when the flexible circuit board 22 is bent to achieve The effect of easier bending.
  • a plurality of openings 33 are provided in the bending area 221 of the flexible circuit board 22 in the frame substrate 21 to increase the flexibility of the bending area 221, release bending stress, and facilitate bending.
  • the plurality of openings 30 are provided in the blank area of the flexible circuit board 22, that is, the plurality of openings 33 are provided between the plurality of traces 30, when the flexible circuit board 22 is bent.
  • the plurality of openings 33 are subjected to tensile force and the hole diameter becomes larger, so as to reduce the stress on the bending zone 221 and reduce the squeezing force on the plurality of traces 30.
  • the plurality of openings 33 reduces the area of the bending area 221 of the flexible circuit board 22, thereby reducing the defect that the flexible circuit board 221 peels off from the display panel 1 and affects the screen display.
  • the plurality of traces 30 of the bending area 221 of the present invention have traces with different widths in the bending area 221, and the plurality of traces 30 form a double alternation from the plurality of openings 33 Arrangement, and the plurality of openings are provided at positions corresponding to the first line area 31 or the second line area 32 of the trace 30 to avoid the first of each trace The junction of the line 31 area and the second line area 32. Therefore, the plurality of openings 33 does not affect the circuit, but also reduces the deformation stress and quality caused by the flip chip, and prevents the plurality of traces 30 from breaking.
  • the plurality of openings 33 overcomes the problem that the flexible circuit board is easily deformed by heat due to a large expansion coefficient, and at the same time reduces the binding of the flexible circuit board 22 According to the requirements of the fixed process, the reliability and durability of the flexible circuit board 22 are improved.
  • the radius of the actual bending area 221 of the bending area 221 of the flexible circuit board 22 in the frame substrate 21 can be reduced by at least 0.1 mm in the direction of the frame To achieve a very narrow border with a small size. Therefore, the frame substrate 21 of the present invention is advantageous for manufacturing a lighter and thinner display panel 1.
  • the frame substrate is reflexed to form a strong rebound stress in the bending area, and this rebound stress causes such products to often appear on the frame substrate from the display Defective phenomena such as panel peeling.
  • the present invention effectively provides a first line area 31 with a larger width at the bending area 221, effectively To prevent the multiple traces 30 from being broken due to long-term bending, and the multiple traces 30 form a cross-displacement structure to reduce the stress concentration during bending, while reducing the width of the bending area 221 and avoiding the signal The interference ensures the display effect of the display panel 1.
  • a plurality of openings 33 are provided between the plurality of traces 30.
  • the plurality of openings 33 are subjected to tensile force
  • the diameter of the hole increases to reduce the stress on the bending area 221 and reduce the pressing force on the plurality of traces 30.
  • the plurality of openings 33 reduce the bending of the flexible circuit board 22
  • the area of the area 221 reduces the defect that the flexible circuit board 221 peels from the display panel 1 and affects the screen display, and effectively suppresses crack propagation in the trace 30.
  • the plurality of openings 33 overcomes the problem that the flexible circuit board is easily deformed by heat due to a large expansion coefficient, and at the same time reduces the binding of the flexible circuit board 22 According to the requirements of the fixed process, the reliability and durability of the flexible circuit board 22 are improved.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种显示面板（1）及其边框基板（21），边框基板（21）包括：一弯折区（221）及多个走线（30），每一多个走线（30）包括一第一线区（31）及一第二线区（32），第一线区（31）及第二线区（32）设置在弯折区（221）上，每一多个走线（30）的第一线区（31）的宽度大于多个走线（30）的第二线区（32）的宽度，并且相邻的走线（30）的第一线区（31）彼此相错设置。

Description

显示面板及其边框基板 技术领域
本发明涉及液晶显示技术领域，尤其是指具有薄膜覆晶封装(COF)的显示面板。
 背景技术
随着对显示装置的需求日益增加，对显示外观要求也越来越高，尤其是手机移动显示产品，更多的关注窄边框高屏占比的显示效果，即显示区域周边的非显示区域的尺寸越小显示效果越好。
为了实现更高的屏占比，玻璃采取了薄膜覆晶封装(COF，Chip On Film)，即将芯片绑定在柔性电路板(FPC，Flexible Printed Circuit)上，并且翻折到显示基板的背面的封装，从而减少了玻璃基板的占用，可以缩短小尺寸显示屏模组的下边框，以实现窄边框，然而，当薄膜覆晶封装处于组装状态下时，薄膜覆晶封装具有附着到显示面板的上部的一端并且被弯曲以安装在显示面板下方，此时的回复力沿与薄膜覆晶封装的弯曲方向相反的方向作用在薄膜覆晶封装上，所以随着时间的推移，可能发生薄膜覆晶封装从显示面板下方剥离开的剥离现象，甚至在弯折过程中易发生金属走线断裂的问题。同时，薄膜覆晶封装的折弯区的半径相较于普通芯片绑定在玻璃基板架构(COG) 的显示面板要大且不易被折弯，要实现手机的极窄边框技术必须克服该缺点。此外，薄膜覆晶封装的温度较高，而柔性电路板的膨胀系数较大，易受热变形，所以对于柔性电路板的绑定工艺具有更高的要求。
故，有必要提供一种显示面板及其边框基板，以解决现有技术所存在的问题。
 技术问题
有鉴于此，本发明提供一种显示面板及其边框基板，以解决现有技术中由于边框基板反折后在弯折区形成很强的反弹应力，而导致这个反弹应力使得这类产品常常会出现边框基板从显示面板剥离等不良现象。
 技术解决方案
本发明的主要目的在于提供一种显示面板及其边框基板，本发明通过在所述弯折区处设置具有较大宽度的第一线区，有效地避免所述多走线因长期弯折而断裂，而且所述多个走线形成彼此交叉错位结构，减少了折弯时的应力集中，同时减少所述弯折区的宽度以及避免信号干扰。此外，所述多个走线还可以为一单一金属层，以减小所述弯折区的体积。
本发明的次要目的在于提供一种显示面板及其边框基板，本发明在在所述多个走线之间设置多个开孔，当弯折所述边框基板中的柔性电路板的弯折区时，所述多个开孔受拉伸力而孔径变大，以减缓该弯折区受到的应力，减少所述多个走线受到的挤压力，此外，所述多个开孔减少所述柔性电路板的所述弯折区的面积，从而降低了柔性电路板从所述显示面板剥离而影响画面显示的不良现象，并且有效地抑制金属走线中的裂纹扩展。此外，当进行温度较高的薄膜覆晶封装时，所述多个开孔克服了柔性电路板因膨胀系数较大而容易受热变形的问题，同时降低了对所述柔性电路板的绑定工艺的要求，提高所述柔性电路板的可靠度及耐用度。
为达成本发明的前述目的，本发明的一实施例提供一种显示面板的边框基板，其包括：
一弯折区；及
多个走线，每一所述多个走线包括一第一线区及一第二线区，所述第一线区及所述第二线区设置在所述弯折区上，每一所述多个走线的所述第一线区的宽度大于所述多个走线的所述第二线区的宽度，并且相邻的所述走线的所述第一线区彼此相错设置，以及所述多个第一线区在垂直于所述多个走线的延伸方向呈锯齿状排列。
在本发明的一实施例中，所述弯折区设置有多个开孔，并且相邻的所述开孔彼此相错设置。
在本发明的一实施例中，所述多个开孔设置在所述多个走线之间，并且所述多个开孔设置在对应于所述走线的所述第一线区或所述第二线区的位置。
在本发明的一实施例中，所述多个开孔的多个形状是选自于由圆形、半圆形、矩形、菱形、锥形及其组合所组成一群组。
在本发明的一实施例中，相邻的所述走线的所述第一线区的交接位置沿所述走线的延伸方向相距0.010毫米至0.020毫米。
在本发明的一实施例中，所述边框基板包括一柔性电路板及一芯片，所述芯片绑定在所述柔性电路板上。
再者，本发明另一实施例另提供一种显示面板的边框基板，其包括：
一弯折区；及
多个走线，每一所述多个走线包括一第一线区及一第二线区，所述第一线区及所述第二线区设置在所述弯折区上，每一所述多个走线的所述第一线区的宽度大于所述多个走线的所述第二线区的宽度，并且相邻的所述走线的所述第一线区彼此相错设置。
在本发明的一实施例中，所述弯折区设置有多个开孔，并且相邻的所述开孔彼此相错设置。
在本发明的一实施例中，所述多个开孔设置在所述多个走线之间，并且所述多个开孔设置在对应于所述走线的所述第一线区或所述第二线区的位置。
在本发明的一实施例中，所述多个开孔的多个形状是选自于由圆形、半圆形、矩形、菱形、锥形及其组合所组成一群组。
在本发明的一实施例中，相邻的所述走线的所述第一线区的交接位置沿所述走线的延伸方向相距0.010毫米至0.020毫米。
在本发明的一实施例中，所述边框基板包括一柔性电路板及一芯片，所述芯片绑定在所述柔性电路板上。
再者，本发明另一实施例另提供一种显示面板，其包括：
一显示区域；及
一非显示区域，包括：
一边框基板，所述边框基板包括：
一弯折区，所述弯折区设置有多个开孔；及
多个走线，每一所述多个走线包括一第一线区及一第二线区，所述第一线区及所述第二线区设置在所述弯折区上，每一所述多个走线的所述第一线区的宽度大于所述多个走线的所述第二线区的宽度，并且相邻的所述走线的所述第一线区彼此相错设置。
在本发明的一实施例中，相邻的所述走线的所述第一线区的交接位置沿所述走线的延伸方向相距0.010毫米至0.020毫米。
在本发明的一实施例中，所述多个第一线区在垂直于所述多个走线的延伸方向呈锯齿状排列。
 有益效果
相较于现有薄膜覆晶封装技术，由于边框基板被反折后在弯折区形成很强的反弹应力，而导致这个反弹应力使得这类产品常常会出现边框基板从显示面板剥离等不良现象。此外，由于薄膜覆晶封装所造成的走线的裂纹倾向于沿垂直走线的方向扩展，本发明通过在所述弯折区处设置具有较大宽度的第一线区，有效地避免所述多走线因长期弯折而断裂，而且所述多个走线形成彼此交叉错位结构，减少了折弯时的应力集中，同时减少所述弯折区的宽度以及避免信号干扰，保证了显示面板的显示效果。进一步，本发明在在所述多个走线之间设置多个开孔，以减缓该弯折区受到的应力，减少所述多个走线受到的挤压力，同时减少所述柔性电路板的所述弯折区的面积，从而降低了柔性电路板从所述显示面板剥离而影响画面显示的不良现象，并且有效地抑制金属走线中的裂纹扩展。此外，当进行温度较高的薄膜覆晶封装时，所述多个开孔克服了柔性电路板因膨胀系数较大而容易受热变形的问题，同时降低了对所述柔性电路板的绑定工艺的要求，提高所述柔性电路板的可靠度及耐用度。
 附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其他有益效果显而易见。
在附图中，
图1是本发明的一实施例的一显示面板的示意图；
图2是本发明的一实施例的一边框基板弯曲到图1的所述显示面板的后面的截面示意图；
图3是图2的所述边框基板的一折弯区的示意图；及
图4是图2的所述边框基板的另一实施例的一折弯区的示意图。
 本发明的实施方式
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。再者，本发明所提到的方向用语，例如上、下、顶、底、前、后、左、右、内、外、侧面、周围、中央、水平、横向、垂直、纵向、轴向、径向、最上层或最下层等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
本文所用术语“包含”、“具有”及其词形变化是指“包含但不限于”。
本文所用术语“一”、“一个”及“至少一”包含复数引用，除非上下文另有明确规定。例如，术语“一处理模组”或“至少一处理模组”可以包含多个处理模组，包含其组合物。
本文所用术语“多个”、“数个”除另有说明外皆可选自二个、三个或以上，而“至少一个”除另有说明外皆可选自一个、二个、三个或以上，于此合先叙明。
本文中所揭露的大小及数值不应意图被理解为严格限于所述精确数值。相反的，除非另外指明，各种大小旨在表示所引用的数值以及功能上与所述数值相同的范围。例如所揭露的大小为“0.010毫米”是指“约0.010毫米”。
本文所用术语“边框基板”是指位于一显示面板的一边框处的一基板。
请参照图1及图2，其中图1是本发明的一实施例的一显示面板的示意图，图2是本发明的一实施例的一边框基板弯曲到图1的所述显示面板的后面的截面示意图。所述显示面板1包括一显示区域10及一非显示区域20。所述显示区域10上设置有一显示模组11，通过接收信号以显示画面，所述显示模组11可以选自于由有机发光二极体(OLED)显示模组、液晶显示器(LCD)显示模组或柔性OLED显示屏所组成的一群组中的一个。所述非显示区域上设置有一边框基板21，所述边框基板21包括一柔性电路板22，所述柔性电路板22上设置有一个或多个驱动芯片23，所述柔性电路板22通过一绑定区24，将柔性电路板22固定在所述非显示区域20上。
如图2所示，所述非显示区域20还包括一中框50，用于固定所述边框基板21。一弯折区221限定在所述边框基板21中的所述柔性电路板22上。当所述边框基板21处于组装状态下时，所述边框基板21上的所述柔性电路板22的一第一端通过所述绑定区24附着到所述显示面板1的上部，以进一步连接到所述显示区域11，传输信号至所述显示区域11以显示画面。所述弯折区221被弯曲，使得所述柔性电路板22的一第二端及位于所述柔性电路板22上的所述驱动芯片23一起固定在所述显示面板1下方。
请一并参照图2及图3，图3是图2的所述边框基板的一折弯区的示意图。所述边框基板21的柔性电路板22上设置有多个走线30，每一所述多个走线30包括一第一线区31及一第二线区32，所述第一线区31及所述第二线区32设置在所述弯折区221上，其中所述第二线区32是沿着所述走线30的方向从所述柔性电路板22延伸至所述弯折区221，并从所述弯折区221延伸至所述显示区域11。
每一所述多个走线30的所述第一线区31的宽度大于所述多个走线30的所述第二线区32的宽度，并且相邻的所述走线30的所述第一线区31彼此相错设置。在本发明的一实施例中，相邻的所述走线30的所述第一线区31的交接位置沿所述走线30的延伸方向相距0.010毫米至0.020毫米。在本发明的另一实施例中，相邻的所述走线30的所述第一线区31的交接位置沿所述走线30的延伸方向相距0.015毫米。在本发明的一实施例中，所述多个第一线区31在垂直于所述多个走线30的延伸方向呈锯齿状排列。
本发明的所述多个走线30在所述弯折区处221具有宽度较大的第一线区31，有效地避免所述多走线30因长期弯折而断裂，而且所述多个走线30形成彼此交叉错位结构，减少了折弯时的应力集中，同时减少所述弯折区221的宽度以及避免信号干扰，保证了显示面板1的显示效果。
此外，所述多个走线30还可以为一单一金属层，以减小所述弯折区221的体积。所述多个走线30可以采用构图工艺、物理气相沉积成膜(例如磁控溅射法)，或湿法刻蚀形成图形来形成。上述工序仅用作举例说明，本发明的所述多个走线30的形成不限于上述方法。
光刻工艺为构图工艺的一种，例如可以包括：预处理、形成底膜、涂覆光刻胶、烘烤、曝光、显影、刻蚀等步骤。例如，预处理一般包括：湿法清洗、去离子水清洗、脱水烘焙等步骤；例如，形成底膜可以是通过气相沉积、磁控溅射等方法来实现；例如，涂覆光刻胶可以通过静态涂胶、或动态涂胶来实现；烘烤可以用于去除光刻胶中的溶剂或者显影后的溶剂。此外，例如，光刻工艺还可以包括：坚膜烘焙、显影检查等步骤。本文不限定形成白色光阻层和黑色光阻层时所使用的光刻工艺中的步骤以及各步骤的使用次数，以能够形成白色光阻层和黑色光阻层为准。例如，光刻工艺也可以包括上述步骤中的几种，例如包括涂覆光刻胶、曝光、显影等步骤。
本发明的所述边框基板21还可以进一步设置一背胶25，所述背胶25设置在所述柔性电路板22的表面，以长期保护所述多个走线30。
在本发明的一实施例中，所述弯折区221还设置有多个开孔33，并且相邻的所述开孔33彼此相错设置。所述多个开孔可设置在所述多个走线之间，并且所述多个开孔33设置在对应于所述走线30的所述第一线区31或所述第二线区32的位置，以避开每一所述走线30的所述第一线区31与所述第二线区32的交界处。所述多个开孔33的多个形状可选自于由圆形、半圆形、矩形、菱形、锥形及其组合所组成一群组。当所述弯折区221进行弯折时，所述多个开孔33受拉伸力而孔径变大，以减缓该弯折区221受到的应力。此外，当进行温度较高的薄膜覆晶封装时，所述多个开孔33克服了柔性电路板因膨胀系数较大而容易受热变形的问题，同时降低了对所述柔性电路板22的绑定工艺的要求，提高所述柔性电路板22的可靠度及耐用度。
所述多个开孔33可以通过各种工序来形成，例如：蚀刻开孔或利用激光切割开孔，上述工序仅用作举例说明，本发明的所述多个开孔33的形成不限于上述方法。
在本发明的一实施例中，每一所述多个开孔33之间可以相隔一个或多个所述走线30设置，如图3所示，每一所述多个开孔33之间相隔两个走线30。
请参照图4，图4是图2的所述边框基板的另一实施例的一折弯区的示意图。每一所述多个开孔33之间可以同时相隔一个或多个所述走线30设置，有效的释放折弯应力，以最小化地所述柔性电路板22折弯时的应力集中，达到更易折弯的效果。
本发明在所述边框基板21中的所述柔性电路板22的弯折区221上设置了多个开孔33，增加了折弯区221的柔性，释放折弯应力，有利于折弯。此外，所述多个开孔30设置在所述柔性电路板22的空白区，即所述多个开孔33设置在所述多个走线30之间，当弯折所述柔性电路板22的弯折区221时，所述多个开孔33受拉伸力而孔径变大，以减缓该弯折区221受到的应力，并且减少所述多个走线30受到的挤压力，此外，所述多个开孔33减少所述柔性电路板22的所述弯折区221的面积，从而降低了所述柔性电路板221从所述显示面板1剥离而影响画面显示的不良现象。
由于本发明的所述折弯区221的所述多个走线30在弯折区221具有不同宽度的走线，并且所述多个走线30距离所述多个开孔33形成双重的交替布置，并且所述多个开孔设置在对应于所述走线30的所述第一线区31或所述第二线区32的位置，以避开每一所述走线的所述第一线31区与所述第二线区32的交界处。因此，所述多个开孔33既不影响电路，又减少了覆晶薄膜所导致的形变应力及质量，同时防止所述多个走线30发生断裂。此外，当进行温度较高的薄膜覆晶封装时，所述多个开孔33克服了柔性电路板因膨胀系数较大而容易受热变形的问题，同时降低了对所述柔性电路板22的绑定工艺的要求，提高所述柔性电路板22的可靠度及耐用度。
根据本发明的多个实施例，所述边框基板21中的所述柔性电路板22的所述弯折区221的实际的折弯区221的半径可以在边框的方向上缩小至少0.1毫米的宽度，实现小尺寸的极窄边框。因此，本发明的所述边框基板21有利于制造更轻、更薄的显示面板1。
如上所述，相较于现有的覆晶薄膜封装技术，由于边框基板被反折后在弯折区形成很强的反弹应力，而导致这个反弹应力使得这类产品常常会出现边框基板从显示面板剥离等不良现象。此外，由于覆晶薄膜封装技术所造成的走线的裂纹倾向于沿垂直走线的方向扩展，本发明通过在所述弯折区处221设置具有较大宽度的第一线区31，有效地避免所述多走线30因长期弯折而断裂，而且所述多个走线30形成彼此交叉错位结构，减少了折弯时的应力集中，同时减少所述弯折区221的宽度以及避免信号干扰，保证了显示面板1的显示效果。
进一步，本发明在在所述多个走线30之间设置多个开孔33，当弯折所述柔性电路板22的弯折区221时，所述多个开孔33受拉伸力而孔径变大，以减缓该弯折区221受到的应力，减少所述多个走线30受到的挤压力，此外，所述多个开孔33减少所述柔性电路板22的所述弯折区221的面积，从而降低了柔性电路板221从所述显示面板1剥离而影响画面显示的不良现象，并且有效地抑制走线30中的裂纹扩展。此外，当进行温度较高的薄膜覆晶封装时，所述多个开孔33克服了柔性电路板因膨胀系数较大而容易受热变形的问题，同时降低了对所述柔性电路板22的绑定工艺的要求，提高所述柔性电路板22的可靠度及耐用度。
相关技术人员将理解，为简单及清楚起见，在图中所示的元件不一定按比例绘制。也就是说，在各种实施例中，图示所选择的元件以强化功能的理解及功能的设置。在市面上实施的案例中，一般容易理解且可能是有用或必需的元件，为方便以下的实施例的示意图不一定会描述。
可以理解，本发明中的特定特征，为清楚起见，在分开的实施例的内文中描述，也可以在单一实施例的组合中提供。相反地，本发明中，为简洁起见，在单一实施例的内文中所描述的各种特征，也可以分开地、或者以任何合适的子组合、或者在适用于本发明的任何其他描述的实施例中提供。在各种实施例的内文中所描述的特定特征，并不被认为是那些实施方案的必要特征，除非该实施例没有那些元素就不起作用。
虽然本发明结合其具体实施例而被描述，应该理解的是，许多替代、修改及变化对于那些本领域的技术人员将是显而易见的。因此，其意在包含落入所附权利要求书的范围内的所有替代、修改及变化。

Claims (15)

  1. 一种显示面板的边框基板，其包括：
    一弯折区；及
    多个走线，每一所述多个走线包括一第一线区及一第二线区，所述第一线区及所述第二线区设置在所述弯折区上，每一所述多个走线的所述第一线区的宽度大于所述多个走线的所述第二线区的宽度，并且相邻的所述走线的所述第一线区彼此相错设置，以及所述多个第一线区在垂直于所述多个走线的延伸方向呈锯齿状排列。
  2. 如权利要求1所述的显示面板的边框基板，其中所述弯折区设置有多个开孔，并且相邻的所述开孔彼此相错设置。
  3. 如权利要求1所述的显示面板的边框基板，其中所述多个开孔设置在所述多个走线之间，并且所述多个开孔设置在对应于所述走线的所述第一线区或所述第二线区的位置。
  4. 如权利要求1所述的显示面板的边框基板，其中所述多个开孔的多个形状是选自于由圆形、半圆形、矩形、菱形、锥形及其组合所组成一群组。
  5. 如权利要求1所述的显示面板的边框基板，其中相邻的所述走线的所述第一线区的交接位置沿所述走线的延伸方向相距0.010毫米至0.020毫米。
  6. 如权利要求1所述所述的显示面板的边框基板，其中所述边框基板包括一柔性电路板及一芯片，所述芯片绑定在所述柔性电路板上。
  7. 一种显示面板的边框基板，其包括：
    一弯折区；及
    多个走线，每一所述多个走线包括一第一线区及一第二线区，所述第一线区及所述第二线区设置在所述弯折区上，每一所述多个走线的所述第一线区的宽度大于所述多个走线的所述第二线区的宽度，并且相邻的所述走线的所述第一线区彼此相错设置。
  8. 如权利要求7所述的显示面板的边框基板，其中所述弯折区设置有多个开孔，并且相邻的所述开孔彼此相错设置。
  9. 如权利要求7所述的显示面板的边框基板，其中所述多个开孔设置在所述多个走线之间，并且所述多个开孔设置在对应于所述走线的所述第一线区或所述第二线区的位置。
  10. 如权利要求7所述的显示面板的边框基板，其中所述多个开孔的多个形状是选自于由圆形、半圆形、矩形、菱形、锥形及其组合所组成一群组。
  11. 如权利要求7所述的显示面板的边框基板，其中相邻的所述走线的所述第一线区的交接位置沿所述走线的延伸方向相距0.010毫米至0.020毫米。
  12. 如权利要求7所述所述的显示面板的边框基板，其中所述边框基板包括一柔性电路板及一芯片，所述芯片绑定在所述柔性电路板上。
  13. 一种显示面板，其包括：
    一显示区域；及
    一非显示区域，包括：
    一边框基板，所述边框基板包括：
    一弯折区；及
    多个走线，每一所述多个走线包括一第一线区及一第二线区，所述第一线区及所述第二线区设置在所述弯折区上，每一所述多个走线的所述第一线区的宽度大于所述多个走线的所述第二线区的宽度，并且相邻的所述走线的所述第一线区彼此相错设置。
  14. 如权利要求13所述的显示面板，其中相邻的所述走线的所述第一线区的交接位置沿所述走线的延伸方向相距0.010毫米至0.020毫米。
  15. 如权利要求13所述的显示面板，其中所述多个第一线区在垂直于所述多个走线的延伸方向呈锯齿状排列。
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