WO2020118628A1 - Vibration-reducing structure, installation method, and electronic device - Google Patents

Abstract

A vibration-reducing structure (70) comprises a plate body, a vibration-reducing component (72) and an installation portion (73). The vibration-reducing component is installed at the plate body by means of the installation portion. The vibration-reducing component comprises a solid portion (721) and a hollow portion (722). A first ratio of the length occupied by the solid portion to the total length of the vibration reducing component falls within a first preset range, and/or a second ratio of the cross section area occupied by the solid portion to the total cross section area of the vibration-reducing component falls within a second preset range. The vibration-reducing structure can meet the vibration reduction requirement of an electronic device. Also provided are an electronic device (100) comprising the vibration-reducing structure and an installation method for installation of the vibration-reducing structure.

Description

Shock-absorbing structure, installation method and electronic equipment Technical field

The present application relates to the technical field of electronic equipment, and more specifically, to a shock-absorbing structure, installation method, and electronic equipment.

Background technique

Generally, electronic devices, such as drones, are provided with shock-absorbing structures to protect the components in the electronic device from damage due to excessive vibration, thereby ensuring the normal operation of the electronic device. However, due to structural limitations, the shock-absorbing parts of the shock-absorbing structure cannot be designed with an ideal mode, and the shock-absorbing parts are often designed to be too soft or too hard, and the shock-absorbing effect is poor.

Summary of the invention

This application provides a shock absorption structure, installation method, and electronic equipment.

The shock-absorbing structure in the present application includes a plate body, a shock-absorbing component and an installation portion, and the shock-absorbing component is installed with the plate body through the installation portion, and the shock-absorbing component includes a solid portion and a hollow portion. The first ratio of the length of the solid portion to the total length of the shock-absorbing member is within a first preset range, and/or, the cross-sectional area of the solid portion to the second of the total cross-sectional area of the shock-absorbing member The ratio is within the second preset range.

In the above shock-absorbing structure, the shock-absorbing component includes a solid part and a hollow part, which can take into account both hardness and softness, and by setting the first ratio and the second ratio, the modal of the shock-absorbing component can be accurately designed, which can satisfy The demand for shock absorption of electronic equipment.

The electronic device of the present application includes a housing and the shock absorbing structure described in any of the above embodiments, and the shock absorbing structure is disposed in the housing.

In the above electronic equipment, the shock-absorbing component includes a solid part and a hollow part, which can take into account both hardness and softness, and by setting the first ratio and the second ratio, the modal of the shock-absorbing component can be accurately designed to meet the electronic The shock absorption requirements of the equipment.

The installation method of the shock-absorbing structure in the present application is used to install the shock-absorbing structure. The shock-absorbing structure includes a plate body, a shock-absorbing component and an installation portion. The installation portion includes a holding portion and a pre-installation portion, and the holding portion is connected For the pre-installation part and the shock-absorbing component, the installation method includes:

Making the pre-mounting part penetrate the mounting hole and expose from the mounting hole;

The plate body is fixed and the pre-mounting portion is stretched in a direction away from the plate body so that the holding portion is caught on the plate body.

In the installation method of the above shock-absorbing structure, the shock-absorbing component includes a solid portion and a hollow portion, which can take into account both hardness and softness, and by setting the first ratio and the second ratio, the modal of the shock-absorbing component can be accurately designed , To meet the shock absorption needs of electronic equipment.

Additional aspects and advantages of the embodiments of the present application will be partially given in the following description, and some will become apparent from the following description, or be learned through practice of the present application.

BRIEF DESCRIPTION

The above and/or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

FIG. 1 is a schematic perspective view of an electronic device according to an embodiment of the present application;

2 is an enlarged schematic view of the electronic device I part of FIG. 1;

3 is an exploded perspective view of an electronic device according to an embodiment of the present application;

4 is an enlarged schematic view of the electronic device II part of FIG. 3;

5 is an enlarged schematic view of the electronic device III part of FIG. 4;

6 is an enlarged schematic view of the portion IV of the electronic device of FIG. 4;

7 is a schematic structural diagram of a casing of an electronic device according to an embodiment of the present application;

8 is a schematic partial cross-sectional view of an electronic device according to an embodiment of the present application;

9 is a schematic perspective view of a heat dissipation assembly of an electronic device according to an embodiment of the present application;

10 is another schematic perspective view of a heat dissipation assembly of an electronic device according to an embodiment of the present application;

11 is a schematic structural diagram of an air intake component of an electronic device according to an embodiment of the present application;

12 is a schematic cross-sectional view of an air intake component of an electronic device according to an embodiment of the present application;

13 is a schematic structural diagram of an air outlet component of an electronic device according to an embodiment of the present application;

14 is a schematic cross-sectional view of an air outlet component of an electronic device according to an embodiment of the present application;

15 is a schematic perspective view of a fan bracket of an electronic device according to an embodiment of the present application;

16 is a schematic structural diagram of a heat sink structure of an electronic device according to an embodiment of the present application;

17 is a schematic cross-sectional view of a heat dissipation structure of an electronic device according to an embodiment of the present application;

18 is a schematic cross-sectional view of a heat sink structure of an electronic device according to an embodiment of the present application;

19 is an enlarged schematic view of the heat sink structure V part of FIG. 18;

20 is a schematic structural diagram of a first shield cover of an electronic device according to an embodiment of the present application;

21 is a perspective schematic view of a shock-absorbing structure of an electronic device according to an embodiment of the present application;

22 is a schematic side view of a shock absorbing structure of an electronic device according to an embodiment of the present application;

23 is a schematic cross-sectional view of a shock-absorbing structure of an electronic device according to an embodiment of the present application;

24 is a schematic cross-sectional view of a shock-absorbing member and a mounting portion of a shock-absorbing structure of an electronic device according to an embodiment of the present application;

25 is a schematic diagram of the size of the solid portion and the hollow portion of the shock absorbing structure of the embodiment of the present application;

Fig. 26 is another schematic view of the solid portion and the hollow portion of the shock absorbing structure according to the embodiment of the present application.

Symbol description of main components:

Electronic equipment 100;

Housing 10, air inlet member 11, air inlet dust cover 110, air inlet 111, air inlet hole 1101, air inlet channel 112, channel outlet 1121, air inlet baffle 113, air outlet member 12, air outlet dust The cover 120, the air outlet hole 1201, the air outlet 121, the air outlet channel 122, the first channel 1221, the second channel 1222, the air outlet baffle 123, the air channel 13, the heat dissipation assembly 20, the heat sink 21, the upper surface 211, The lower surface 212, the first heat dissipation fin 213, the first fin 2131, the second fin 2132, the receiving channel 2134, the body portion 214, the first mounting portion 215, the first receiving groove 2151, the heat pipe 22, the circuit board 30, The first heat source 31, the first heating element 311, the second heat source 32, the second heating element 321, the first sub heating element 322, the second sub heating element 323, the main control board 33, the power board 34, the third heat source 340, Image transmission plate 35, image transmission plate heat sink 351, flight control board 36, positioning plate 37, fan assembly 40, fan bracket 41, accommodating portion 411, accommodating cavity 4111, baffle portion 412, baffle 4121, fan 42 , The first shield 50, the convex hull 501, the second shield 51, the third shield 52, the heat dissipation block 54, the bottom plate 60, the through hole 601, the heat sink structure 61, the insulating sheet 62, the mounting member 63, the substrate 64, The first mounting hole 640, the convex portion 641, the surface portion 642, the fin portion 65, the connection plate 651, the second heat dissipation fin 652, the damping structure 70, the second mounting hole 711, the damping member 72, the solid portion 721, The hollow portion 722, the holding portion 723, the first block 724, the second mounting portion 73, the pre-mounting portion 731, and the second block 732.

detailed description

The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the drawings, in which the same or similar reference numerals indicate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary, and are only used to explain the present application, and cannot be construed as limiting the present application.

In the description of this application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back, "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise" etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it cannot be understood as a limitation to this application. In addition, the terms “first” and “second” are used for description purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise specifically limited.

In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense, for example, it can be fixed connection or detachable Connect, or connect integrally. It can be mechanical or electrical. It can be directly connected or indirectly connected through an intermediate medium. It can be the connection between two elements or the interaction between two elements. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application according to specific situations.

Referring to FIGS. 1 and 3, the electronic device 100 according to the embodiment of the present application includes a housing 10, a heat dissipation component 20, a circuit board 30, a fan component 40, and a shock absorbing structure 70 (see FIG. 22). The electronic device 100 includes a drone and a robot. In the illustrated embodiment, the electronic device 100 is a drone. Among them, the fan assembly 40 is disposed in the housing 10.

Please refer to FIGS. 1-3 and FIGS. 11-14, the housing 10 includes an air inlet component 11 and an air outlet component 12. The air inlet member 11 is provided with an air inlet 111. The air outlet member 12 is provided with an air outlet 121. The casing 10 defines an air duct 13 communicating with the air inlet 111 and the air outlet 121. The heat dissipation assembly 20 and the circuit board 30 are located in the air duct 13. Outside air can flow into the air duct 13 from the air inlet 111 and can form an air flow in the air duct 13. The airflow can dissipate the heat in the air duct 13 through the air outlet 121.

The fan assembly 40 may be located between the heat dissipation assembly 20 and the air outlet member 12, that is, between the heat dissipation assembly 20 and the air outlet 121, or between the heat dissipation assembly 20 and the air inlet member 11, that is, between the heat dissipation assembly 20 and the air inlet Between 111. In the illustrated example, the fan assembly 40 is located between the heat dissipation assembly 20 and the air outlet 121.

In order to prevent dust from entering the air duct 13 from the air inlet 111, an air inlet dust cover 110 may be provided at the air inlet 111. Furthermore, the air inlet dust cover 110 is provided with a grid-like array of air inlet through holes 1101. In this way, the air intake at the air inlet 111 is relatively uniform.

In the examples shown in FIGS. 7 and 11, the number of air inlets 111 is plural, and each air inlet 111 is provided with a plurality of air inlet through holes 1101 in an array of air inlet through holes 1101.

In order to prevent dust from entering the air duct 13 through the air outlet 121, an air outlet dust cover 120 may be provided at the air outlet 121 (as shown in FIG. 13). Furthermore, the air outlet dust cover 120 is provided with a grid-shaped air outlet through hole 1201 array. It can be understood that the array of through holes on the dust cover may be evenly arranged or arranged in intervals, which is not limited herein.

Specifically, the heat dissipation component 20 and the circuit board 30 may constitute a heat dissipation component of the electronic device 100. The heat dissipation component is located in the air duct 13. In order to improve the waterproof performance of the electronic device 100 and improve the heat dissipation efficiency of the heat dissipation component, the air inlet component 11 is opened to communicate The air inlet duct 112 of the air inlet 111 and the side wall of the air inlet duct 112 form an air inlet baffle 113. The air inlet baffle 113 is configured to divert the airflow entering the air inlet passage 112 from the air inlet 111 upward to the air duct 13 (as shown in FIG. 12 ). In this way, by providing the corresponding air inlet baffle 113 in the air inlet channel 112, the incoming air flow is diverted, and the size of the air inlet 111 can be maximized while meeting the waterproof performance requirements of the electronic device 100, therefore, the reliability of the electronic device 100 is improved At the same time, it can also improve the heat dissipation efficiency of the heat dissipation components. It can be understood that, in other embodiments, the heat dissipation component may be the heat dissipation component 20 or the circuit board 30, or the heat dissipation component 20 and other components of the electronic device 100, or the circuit board 30 and other components of the electronic device 100, or the electronic device Other components that need heat dissipation.

The air outlet member 12 defines an air outlet passage 122 communicating with the air outlet 121, and an air outlet baffle 123 is formed on the side wall of the air outlet passage 122. The air outlet baffle 123 is configured to turn the airflow entering the air outlet channel 122 downward to the air outlet 121 (as shown in FIG. 14 ). In this way, by providing the corresponding air outlet baffle 123 in the air outlet channel 122, the air outlet air flow is diverted, and the size of the air outlet 121 can be maximized while meeting the waterproof performance requirements of the electronic device 100. Therefore, the At the same time as the reliability, the heat dissipation efficiency of the heat dissipation assembly 20 can also be improved. Of course, in other embodiments, the side wall of the air inlet channel 112 forms an air baffle 113 or the side wall of the air outlet channel 122 forms an air baffle 123.

In this embodiment, referring to FIG. 12, the number of the air inlet channels 112 may be multiple. A plurality of air inlet channels 112 are arranged in the vertical direction. The air inlet channel 112 includes a channel outlet 1121. The air inlet baffle 113 is opposed to the adjacent channel outlet 1121. Among them, the flow direction of the air flow in the air inlet channel 112 is shown by the dotted arrow in FIG. 12.

14, the air outlet channel 122 includes a first channel 1221 and a second channel 1222. The second channel 1222 communicates with the first channel 1221 and the air outlet 121. The slope of the second channel 1222 is greater than the slope of the first channel 1221. In this way, it is advantageous for the airflow to be led out from the air outlet channel 122, and it is dustproof and waterproof. Specifically, both the first channel 1221 and the second energy channel 1222 are linear, so that the resistance of the airflow can be reduced, the airflow can be smoother, and the heat dissipation efficiency of the electronic device is improved.

5 and 9, the heat dissipation assembly 20 includes a heat sink 21 and a heat pipe 22. The heat sink 21 includes an upper surface 211 and a lower surface 212. The upper surface 211 of the heat sink 21 is provided with first heat dissipation fins 213. The arrangement of the first heat radiation fin 213 can increase the heat radiation area of the heat radiation fin 21. The integrated arrangement of the heat sink 21, the heat pipe 22 and the first heat dissipation fin 213 can improve the overall integration of the electronic device 100.

Further, referring to FIGS. 5 and -9, the first heat dissipation fin 213 includes a first fin 2131 and a second fin 2132. The first fin 2131 and the heat sink 21 have an integrated structure. The heat sink 21 is provided with a body portion 214 and a first mounting portion 215. The body portion 214 is connected to the first mounting portion 215. The first fin 2131 is provided on the body portion 214. The second fin 2132 is formed on the first mounting portion 215 by stamping.

The second fins 2132 can be made by an aluminum alloy stamping process, so that the fin spacing of the second fins 2132 can be set very small, so as to increase the heat exchange area of the heat sink 21 with a limited volume.

Further, the cross section of the first fin 2131 is a stepped shape that rises in the direction from the air inlet 111 to the air outlet 121. In this way, the first fins 2131 can reduce the concentration of heat in the first heat dissipation fins 213, so that the heat can be quickly dissipated under the guidance of the first fins 2131, and because the first fins 2131 have different heights, the The higher first fins 2131 away from the air inlet 111 can also obtain more cold air. In this embodiment, the first fin 2131 forms two steps.

Further, referring to FIG. 5, the first mounting portion 215 defines a first receiving slot 2151. The heat pipe 22 is accommodated at least partially in the first accommodation groove 2151, for example, the lower half of the heat pipe 22 is accommodated in the first accommodation groove 2151. The heat pipe 22 connects the first fin 2131 and the second fin 2132. In this way, the contact area between the heat pipe 22 and the heat sink 21 is large, and the heat dissipation efficiency can be effectively improved. Further, a second receiving groove (not shown) corresponding to the first receiving groove 2151 is opened at the lower end of the second fin 2132. The first receiving groove 2151 and the second receiving groove together form a receiving passage 2134. The heat pipe 22 is accommodated at least partially in the accommodation passage 2134. In this way, the heat sink 21 connects the heat source in the electronic device to the heat pipe 22 and the first heat dissipation fin 213, the integration is relatively high, and the area of the heat sink 21, the heat pipe 22, and the first heat dissipation fin 213 contacting each other is large , Conducive to heat transfer and distribution. Wherein, the heat pipe 22 can quickly conduct heat to the first heat dissipation fin 213 by means of vapor-liquid commutation circulation, and then radiate it to the environment.

4 and 10, in some embodiments, the circuit board 30 is provided with a first heat source 31 and a second heat source 32. The first heat source 31 is located on the upper surface 211 of the heat sink 21 and is thermally connected to the heat sink 21. The second heat source 32 is located on the lower surface 212 of the heat sink 21 and is thermally connected to the heat sink 21. Since the first heat source 31 and the second heat source 32 are respectively distributed on the upper and lower surfaces of the heat sink 21, the heat resistance of the air duct 13 is formed in the housing 10 in parallel, which reduces the heat resistance of the entire electronic device 100, thereby satisfying The heat dissipation requirements of the distributed heat sources in the housing 10 are improved, and the heat dissipation efficiency of the electronic device 100 is improved.

In the present embodiment, the heat generated by the second heat source 32 is greater than the heat generated by the first heat source 31, and the second heat source 32 is closer to the middle position in the air duct 13 relative to the first heat source 31. In this way, the thermal resistance at the second heat source 32 is lower, which is advantageous for the airflow to take away the heat of the second heat source 32.

It can be understood that, in order to further promote the heat dissipation of the first heat source 31, the first heat source 31 may be directly disposed on the first heat dissipation fin 213, so that the contact area between the first heat source 31 and the heat dissipation fin 21 is larger, and the heat is radiated faster.

5, the first heat source 31 includes at least one first heating element 311. The first heating element 311 generates heat during operation. 4, the second heat source 32 includes at least one second heating element 321. The second heating element 321 generates heat during operation.

2 to FIG. 6, the circuit board 30 includes a main control board 33, a power board 34, an image transmission board 35, a flight control board 36 and a positioning board 37.

The main control board 33 is located below the heat sink 21, and at least one second heating element 321 is disposed on the main control board 33. Of course, it can be understood that the number of the second heating elements 321 provided on the main control board 33 can be set according to specific circumstances.

In one embodiment, at least one second heating element 321 includes a first sub heating element 322 and a second sub heating element 323 and a third sub heating element 324 spaced apart from the first sub heating element 322. The thermally conductive first shield 50 connects the first sub-heating element 322 and the heat sink 21. The heat-conductive second shield 51 connects the second sub-heating element 323, the third sub-heating element 324 and the heat sink 21. The heat generated by the first sub-heating element 322 can be conducted to the surface of the first shielding case 50 and be conducted to the heat sink 21 via the first shielding case 50 to be radiated. The heat generated by the second sub-heating element 323 can be conducted to the surface of the second shield case 51 and conducted to the heat sink 21 via the second shield case 51 to be radiated. The arrangement of the first shielding cover 50 and the second shielding cover 51 can effectively reduce the adverse effects of the outside world on the first sub heating element 322 and the second sub heating element 323. The first sub heating element 322, the second sub heating element 323, and the third sub heating element 324 may be some processing chips or control chips.

It can be understood that the first shield 50 has a protective effect on the first sub-heating element 322, and the second shield 51 has a protective effect on the second sub-heating element 323. Both the first shield 50 and the second shield 51 can be formed of copper material with high thermal conductivity, for example, copper alloy material with high thermal conductivity can be formed without affecting the normal operation of the circuit board.

It can be understood that, in order to improve the heat transfer efficiency between the first shielding case 50 and the first sub-heating member 322, the first shielding case 50 and the first sub-heating member 322 may be connected through a thermal conductive coating. Wherein, the thermally conductive coating may be thermally conductive silicone grease, for example. In the example shown in FIG. 20, preferably, the first shielding case 50 is convexly provided with a convex hull 501 toward the first sub-heating element 322, and the first shielding case 50 is connected to the thermally conductive coating through the convex hull 501.

It can be understood that, in order to improve the heat transfer efficiency between the second shielding case 51 and the second sub heating element 323, the second shielding case 51 and the second sub heating element 323 may be connected through the heat dissipation block 54. It can be understood that the heat conduction system of the heat dissipation block 54 can be set higher, so that even if the power consumption of the second sub-heating element 323 is high, the heat dissipation block 54 can sufficiently conduct the heat generated by the second sub-heating element 323 to the second The surface of the shield 51 is further transferred to the heat sink for effective distribution. The third sub-heating element 324 may also be connected to the second shield 51 through a thermally conductive coating.

In one example, the heat sink block 54 is an aluminum block. The heat dissipation block 54 is attached between the second shield 51 and the second sub-heating element 323. Since the heat dissipation block 54 of the aluminum material has a high thermal conductivity, the heat generated by the second sub-heating element 323 can be sufficiently dissipated. In this way, even if the power consumption of the second sub-heating element 323 is high (for example, 25W), and the rated temperature of the chip used is low (for example, 85 degrees Celsius), when the temperature of the whole machine is high (for example, 55 degrees Celsius) , It can still ensure that the heat generated by the second sub-heating element 323 can be effectively dissipated.

The power board 34 is located below the main control board 33. The installation method of the power board 34 and the heat dissipation method will be described below. Among them, the power board 34 may include a printed circuit board.

6, FIG. 16 to FIG. 19, this embodiment provides a heat dissipation structure. The heat dissipation structure includes a circuit board, a bottom plate 60 and a heat sink structure 61. In the illustrated embodiment, the power board 34 is used as an example for the circuit board. It can be understood that in other embodiments, the circuit board may be another circuit board of the electronic device, which is not specifically limited herein.

The heat sink structure 61 includes a substrate 64 and a fin portion 65 connected to the substrate 64 side. The power board 34 is mounted on the bottom plate 60. The substrate 64 is located between the power board 34 and the bottom plate 60. The power board 34 is provided with a heat source. For example, in this embodiment, the heat source is the third heat source 340. The substrate 64 is thermally connected to the third heat source 340. In this way, the base plate 64 of the heat sink structure 61 is placed between the power board 34 and the bottom plate 60, so that the space of the heat dissipation structure can be fully utilized, and the power board 34 and the bottom plate 60 basically do not need any modification. At the same time, the fins 65 on the side of the substrate 64 can dissipate the heat transferred from the third heat source 340 to the substrate 64 in time, ensuring the heat dissipation effect of the third heat source 340. It should be noted that the entire heat sink structure 61 is used as a power board heat sink of the power board 34 to promote heat dissipation of the power board 34. In addition, the wall thickness of the substrate 64 may be set according to specific circumstances, for example, the wall thickness of the substrate 64 may be 1 mm. The bottom plate 60 may be a structural bottom plate.

Further, referring to FIGS. 17 and 18, the substrate 64 is provided with a convex portion 64 that protrudes toward the power supply board 34. The third heat source 340 is thermally connected to the convex portion 641. In this way, the heat generated by the third heat source 340 can be sufficiently conducted to the substrate 64 via the convex portion 641 to be radiated.

It can be understood that, in order to improve the heat transfer efficiency, the third heat source 340 and the convex portion 641 may be connected by a heat conductive layer. Wherein, for example, the thermally conductive layer may use thermally conductive silicone.

In this embodiment, the number of convex portions 641 may be plural. The heat dissipation structure may have a through hole 601 penetrating through the substrate 64, and a plurality of convex portions 641 are disposed around the through hole 601. The plurality of convex portions 641 may be respectively provided corresponding to the plurality of third heat sources 340. In this way, the third heat source 340 can fully conduct the heat to the respective convex portions 641, and then exchange heat with the air through the fin portion 65, and then achieve the purpose of transferring the heat of the high power consumption device to the environment. The arrangement of the through hole 601 allows cold air at the bottom of the heat dissipation structure to enter the heat dissipation fin structure 61, which accelerates the heat dissipation efficiency of the heat dissipation structure. In the orientation shown in FIG. 18, the through hole 601 penetrates the substrate 64 up and down.

It can be understood that the convex portion 641 can be formed by pressing the substrate 64, that is, the convex portion 641 and the through hole 601 can be formed by stamping the plate material through a die with a convex-concave pattern. This facilitates the formation of the convex portion 641 and the through hole 601, which reduces the manufacturing process. The substrate 64 can be made of aluminum alloy with high thermal conductivity die-casting, so the manufacturing cost is lower.

In some embodiments, the fin part 65 includes a connection plate 651 and a second heat dissipation fin 652. The connection plate 651 is connected to one side of the substrate 64 and is mounted on the bottom plate 60. The second heat dissipation fin 652 is disposed on a surface of the connecting plate 651 opposite to the bottom plate 60. In this way, the heat dissipation area of the fin portion 65 is large, which facilitates the heat dissipation of the substrate 64.

Further, the number of the second heat dissipation fins 652 is plural. A plurality of second heat dissipation fins 652 are arranged on the surface of the connecting plate 651 at intervals. Two adjacent second heat dissipation fins 652 form a channel 6521. One end of the channel 6521 is open at least partially toward the space between the power board 34 and the bottom plate 60. In this way, the airflow in the air duct 13 can enter the passage 6521 through the space between the power board 34 and the bottom plate 60 to take away the heat of the power board 34, so that the heat dissipation of the power board 34 can be radiated in time. Preferably, one end of the channel 6521 is open to face the space between the power board 34 and the bottom plate 60.

Further, multiple channels 6521 are parallel to each other. In this way, the multiple channels 6521 parallel to each other can have a better rectification effect on the airflow, without causing or turbulence of the airflow, so that the airflow can pass through the multiple channels 6521 faster, and the heat sink structure 61 has a better heat radiation.

Please refer to FIG. 17. Preferably, in order to improve the heat dissipation efficiency of the second heat dissipation fin 652, the second heat dissipation fin 652 may be located on the side of the power board 34, and the height of the second heat dissipation fin 652 is higher than the power supply The height of the plate 34. This enables the airflow above the power board 34 to blow to the second heat dissipation fin 652.

Generally, the heat sink structure is made of metal materials. The power board 34 is provided with a capacitor (not shown). In order to reduce the influence of the substrate 64 on the capacitor, the capacitor can be insulated from the substrate 64. Therefore, please refer to FIG. 19, the heat dissipation structure includes an insulating sheet 62, the insulating sheet 62 is provided on the surface portion 642 of the substrate 64, and the surface portion 642 is opposite to the power board 34 and corresponds to the position of the capacitor. Among them, the insulating sheet 62 can be made of polycarbonate (PC) material, so that the hardness is higher. The insulating sheet 62 can be attached to the substrate 64 by a single piece of adhesive.

In order to facilitate the installation of the substrate 64 and improve the installation stability, the substrate 64 defines a first mounting hole 640, and the mounting member 63 penetrates the first mounting hole 640 and connects the power board 34 and the bottom plate 60. In FIG. 16, the number of the first mounting holes 640 is plural, and the plurality of first mounting holes 640 are arranged at intervals along the circumferential direction of the substrate 64. In one example, the mounting member 63 may be a screw and/or a clip.

It can be understood that the above-mentioned power board 34 setting method and heat dissipation method are also applicable to other circuit boards, which will not be further elaborated here. For details, refer to the power board 34 setting method and heat dissipation method.

4 and 5, the picture transmission board 35 is located above the heat sink 21. At least one first heating element 311 is provided on the image transmission board 35. It can be understood that the number of the first heating elements 311 can be set according to specific conditions. It can be understood that, in order to promote the heat dissipation of the first heat generating element 311, a heat transmitting plate fin 351 may be provided above the picture transmitting plate 35, and the heat transmitting plate fin 351 is thermally connected to at least one first heat generating element 311. The at least one first heating element 311 may include one, two or more first heating elements 311.

In order to reduce the influence of the outside on the operation of the first heating element 311, at least one first heating element 311 and the heat sink 21 of the image transmission board may be connected through the thermally conductive third shield 52. It can be understood that the third shield 52 has a protective effect on the first heating element 311. The third shield 52 can be formed by using a copper material with a high thermal conductivity. For example, it can be formed by using a copper alloy material with a high thermal conductivity without affecting the normal operation of the circuit board.

In the example shown in FIG. 5, the number of the first heating elements 311 is two, and the two first heating elements 311 are spaced apart. The third shield 52 covers two first heating elements 311. The heat generated by the two first heating elements 311 can be conducted to the surface of the third shield 52 and dissipated through the heat sink 21 of the image transmission plate. The image transmission plate heat sink 21 may also include heat dissipation fins.

The flight control board 36 is provided on the upper surface of the heat sink 21. Specifically, the image transmission plate 35 is provided at the lower level of the first fin 2131, and the flight control plate 36 is provided at the higher level of the first fin 2131. Thus, the image transmission plate 35 and the flight control are arranged by split layers The board 36 enables both circuit boards to obtain effective heat dissipation.

4 and FIG. 15, the fan assembly 40 includes a fan bracket 41 and a fan 42. The fan bracket 41 includes an accommodating portion 411 and a baffle portion 412. The accommodating portion 411 defines an accommodating cavity 4111. The fan 42 is accommodated in the accommodating cavity 4111. The air duct 13 includes a baffle air duct 131 formed in the baffle portion 412 and tapered in a direction close to the air outlet 11. The accommodating cavity 4111 communicates with the baffle duct 131 and the air outlet 11. Among them, the fan bracket 41 can play a role of mounting the fan 42 to the housing 10.

In the example shown in FIG. 15, the baffle portion 412 includes two baffles 4121 connected to both sides of the accommodating portion 411. The baffle duct 131 is formed between the two baffles 4121. Two baffles 4121 are connected to the bottom of the housing 10. The two baffles 4121 enclose a funnel-shaped air duct shape to ensure that the air entering the inside of the housing 10 from the air inlet side can be discharged to the maximum extent by the fan 42 to avoid vortexes and dead zones on both sides of the fan 42.

Preferably, in order to enable the fan 42 to provide a larger air volume, the fan 42 is an axial fan. The fan 42 sucks the air in the air duct 13 and discharges it through the air outlet 11.

It can be understood that, in order to facilitate the formation of the fan bracket 41 and improve the structural strength of the fan bracket 41, the fan bracket 41 may be made into an integrated structure. Moreover, the fan bracket 41 can be formed by an injection molding process to reduce the number of parts and reduce the weight of the entire electronic device 100.

In some embodiments, in order to dissipate heat from the positioning plate 35, the positioning plate 35 is located at least partially within the baffle duct 131 and is thermally connected to the heat sink 21. In this way, the positioning plate 35 is closer to the fan 42 and the wind pressure is higher, so no other processing is required. Wherein, the positioning board 35 may be positioned using RTK (Real-time Kinematic, real-time dynamic) carrier phase differential technology, or may be positioned through a global positioning system (GPS), which is not limited herein.

It can be understood that in other embodiments, the arrangement of the main control board 33, the power board 34, the image transmission board 35, the flight control board 36 and the positioning board 37 can be set according to actual needs, and the circuit board can also include the main control board 33. One or more of the power board 34, the image transmission board 35, the flight control board 36 and the positioning board 37. This embodiment is only an exemplary description and is not limited herein.

21 and FIG. 25, this embodiment provides a shock absorbing structure 70, which is disposed in the housing 10. The shock absorbing structure 70 includes a plate body, a shock absorbing member 72, and a second mounting portion 73. The shock absorbing member 72 is attached to the plate body through the second attachment portion 73. The shock absorbing member 72 includes a solid portion 721 and a hollow portion 722.

23, in order to further optimize the damping effect of the damping structure 70, the first proportion of the total length H1 of the damping member 72 occupied by the length H2 of the solid portion 721 may be within a first preset range to make the solid The portion 721 and the hollow portion 722 can take into account both the hardness and the softness, so that by setting the first ratio, the modal of the shock-absorbing member 72 can be accurately designed, which can meet the shock-absorbing requirements of the electronic device 100. And/or, the cross-sectional area m1 of the solid portion 721 (the area of the cross-sectional area of the damping member 72 in the dotted frame k2 shown in FIG. 23) can occupy the total cross-sectional area m2 of the damping member 72 (see FIG. 23 The second ratio of the area of the cross-sectional area of the shock absorbing member 72 in the dashed frame k1 shown is within the second preset range, so that the solid portion 721 and the hollow portion 722 can take into account both hardness and softness, so that it can pass For the setting of the second ratio, the modal of the shock-absorbing component 72 can be accurately designed to meet the shock-absorbing requirements of the electronic device 100. It can be understood that the first ratio and the second ratio can be set at the same time to meet the shock absorption requirements of the electronic device 100.

It should be noted that the above-mentioned first ratio and second ratio can be set according to specific conditions. Preferably, the ratio range of the first ratio is greater than 0.3 and less than 0.5, and the ratio range of the second ratio is greater than 0.5 and less than 0.75. In some examples, the first ratio is 0.38 and the second ratio is 0.64. In addition, the modal design of the shock-absorbing structure 70 can also be optimized according to the specific use needs. For example, when the electronic device 100 is a drone, the shock-absorbing structure can be adjusted in the range of 20-70 hertz (Hz) 70 performs modal design to avoid the resonant frequency of UAV's whole machine vibration and gimbal vibration, and to ensure the actual shock absorption effect of shock absorption structure 70.

In an example, the solid portion 721 and the hollow portion 722 are both cylindrical, and the diameter of the solid portion 721 is larger than the diameter of the hollow portion 722, so that the solid area 721 has a larger bearing area, which is beneficial to the shock absorption of the shock absorbing structure 70. Of course, the solid portion 721 and the hollow portion 722 may also have other shapes, which can be set according to specific circumstances.

In the examples shown in FIGS. 23 to 25, the solid portion 721 and the hollow portion 722 are both cylindrical, where D ₁ and D ₃ respectively represent the outer diameter and the inner diameter of the hollow portion 722, and D ₂ represents the diameter of the solid portion 721. In the actual design of the mode of the shock absorbing structure 70 can be set when three directions (X direction, Y direction and Z direction shown in FIG. 24) distribution of simulation frequency f _x, f _y, and f _z, and setting the X-direction, the target frequency Y and Z directions respectively f _x0, f _y0 and f _z0. In this way, f _z can be adjusted by changing H ₂ and D ₂ , and f _x and f _y can be adjusted by changing D ₂ . In one embodiment, H ₁ and H ₂ can be set to fixed values limited by the structural form, and D ₃ also remains unchanged. In this way, new H ₂ and D ₂ can be obtained by the following formula.

Repeat the above steps, so that iterative algorithm can obtain the appropriate H ₂ and D ₂ by the above formula.

In this embodiment, the number of the second mounting portions 73 is two, and the two second mounting portions 73 are respectively installed on opposite sides of the shock absorbing member 72, so that the shock absorbing member 72 can achieve better shock absorption. Effect, and the shock absorbing member 72 can also be installed with more plates.

Specifically, the plate body may include a first plate and a second plate, and two second mounting portions 73 may be installed on the first plate and the second plate, respectively, to reduce vibration between the first plate and the second plate. It should be noted that the shock absorbing member 72 may be composed of a material with a certain elasticity, for example, it may include silicone.

In an embodiment, the board body may be a circuit board, such as one or more of a main control board, a power board, a picture transmission board, a flight control board, and a positioning board, which is not limited herein.

In this embodiment, please refer to FIG. 21, the first board may be a heat sink 21 and the second board may be a power board 34.

Further, the plate body includes a third plate, and the third plate is mounted on the shock absorbing member 72 through the first plate. In this way, the third board is suspended on the shock-absorbing structure through the first board, so that the third board has a better shock-absorbing effect.

In this embodiment, please refer to FIG. 21, the third board may be the main control board 33. In addition, the number and type of the board bodies included in the board body can be set according to specific conditions, and is not specifically limited herein.

In the examples shown in FIGS. 9 and 21, the first plate is a heat sink 21. The heat sink 21 includes a mounting arm 216, and the mounting arm 216 defines a mounting groove 210. The damping member 72 passes through the second mounting portion 73 and the second mounting hole 711 to connect the first plate to the damping member 72.

In order to further optimize the installation of the shock absorbing structure 70, the second mounting portion 73 includes a holding portion 723 and a pre-installing portion 731, the holding portion 723 connects the pre-installing portion 731 and the hollow portion 722, the plate body defines a second mounting hole 711, and the holding portion 723 The second mounting hole 711 is penetrated and the plate body is fixed to the shock absorbing member 72. Wherein, the pre-mounting portion 731 is used to pre-position the damping member 72 through the second mounting hole 711 when the damping member 72 is mounted on the plate body.

In this way, during installation, the pre-installation portion 731 can be used for positioning, so that the pre-installation portion 731 can provide redundant installation support points when operating in a small space, and the pre-installation portion 731 can realize the shock-absorbing structure 70 After the pre-installation, the pre-installation portion 731 can be stretched to achieve the fixed installation of the shock absorbing member 72, which is convenient for operation and maintenance. In addition, after the installation of the shock absorbing structure 70 is achieved, the pre-installed portion 731 (the t1 and t2 sections shown in FIG. 23) may be removed. It can be understood that, in order to improve the stability of the mounting of the holding portion 723, the first clamping block 724 in a gradually expanding shape may be provided in the holding portion 723 along the direction in which the plate body is mounted to the holding portion 723. In this way, the first clamping block 724 can play a clamping role during the installation of the holding portion 723.

It can be understood that, in order to facilitate positioning of the pre-installation portion 731, the pre-installation portion 731 may be provided with a second block 732 having a gradually expanding shape in the direction of mounting the plate body to the holding portion 723. In addition, with respect to the axis a of the shock absorbing member 72, the protrusion height of the second clamping block 732 may be smaller than the protrusion height of the first clamping block 724, so that the second clamping block 732 has better guidance to the pre-mounting portion 731 The first clamping block 724 has a better clamping effect.

The above shock absorbing structure 70 can be installed by using the following installation method. The installation method of the shock absorbing structure 70 includes steps:

Step S1, the pre-mounting portion 731 is penetrated through the second mounting hole 711 and exposed from the second mounting hole 711;

Step S2: Fix the plate body and stretch the pre-mounting portion 731 in a direction away from the plate body so that the holding portion 723 is stuck to the plate body.

In step S2, after the holding portion 723 is stuck on the plate body (as shown in FIGS. 22 and 23), the pre-installation portion 731 is removed, so that the shock absorbing structure 70 is as shown in FIG. In this way, the occupied space of the shock absorbing structure 70 can be reduced.

In summary, the shock absorbing structure 70 in this embodiment includes a plate body, a shock absorbing member 72, and a mounting portion 73. The shock absorbing member 72 is installed with the plate body through the mounting portion 73, and the shock absorbing member 72 includes a solid portion 721 And the hollow portion 722, the first ratio of the length of the solid portion 721 to the total length of the damping member 72 is within the first preset range, and/or, the cross-sectional area of the solid portion 721 accounts for the total cross section of the damping member 72 The second ratio of the area is within the second preset range.

In the above shock absorbing structure 70, the shock absorbing member 72 includes a solid portion 721 and a hollow portion 722, which can take into account both hardness and softness, and by setting the first ratio and the second ratio, the shock absorbing member 72 can be accurately designed Modal, can meet the shock absorption needs of electronic equipment.

In this application, unless otherwise clearly specified and defined, the first feature "above" or "below" the second feature may include the direct contact of the first and second features, or may include the first and second features Contact not directly but through another feature between them. Moreover, the first feature is “above”, “above” and “above” the second feature includes that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature is “below”, “below” and “below” the second feature includes that the first feature is directly below and obliquely below the second feature, or simply means that the first feature is less horizontal than the second feature.

The above disclosure provides many different implementations or examples for implementing different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit this application. In addition, the present application may repeat reference numerals and/or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity, and does not itself indicate the relationship between the various embodiments and/or settings discussed. In addition, the present application provides examples of various specific processes and materials, but those of ordinary skill in the art may be aware of the application of other processes and/or the use of other materials.

In the description of this specification, the descriptions referring to the terms "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" mean combined embodiments The specific features, structures, materials, or characteristics described in the examples are included in at least one embodiment or example of the present application. In this specification, the schematic expression of the above-mentioned terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although the embodiments of the present application have been shown and described, those of ordinary skill in the art may understand that various changes, modifications, replacements, and variations can be made to these embodiments without departing from the principle and purpose of the present application, The scope of the application is defined by the claims and their equivalents.

Claims (13)

1. A shock absorbing structure, characterized in that it includes a plate body, a shock absorbing component and an installation portion, the shock absorbing component is installed with the plate body through the installation portion, the shock absorbing component includes a solid portion and a hollow Part, the first ratio of the length of the solid part to the total length of the damping member is within a first preset range, and/or, the cross-sectional area of the solid part to the total cross-sectional area of the damping member The second ratio of is within the second preset range.
2. The damping structure according to claim 1, wherein the number of the mounting portions is two, and the two mounting portions are respectively located on opposite sides of the damping member.
3. The shock absorbing structure according to claim 2, wherein the plate body includes a first plate and a second plate, and the two mounting portions are respectively mounted on the first plate and the second plate.
4. The shock absorbing structure according to claim 3, wherein the plate body includes a third plate, and the third plate is mounted on the shock absorbing member through the first plate.
5. The shock absorbing structure according to claim 1, wherein the mounting portion includes a holding portion and a pre-installing portion, the holding portion connects the pre-installing portion and the hollow portion, and the plate body is provided with an installation A hole, the holding portion penetrates the mounting hole and fixes the plate body to the shock absorbing member, and the mounting portion is used to pass the installation when the shock absorbing member is installed with the plate body The hole pre-positions the shock-absorbing member.
6. The shock absorbing structure according to claim 5, characterized in that, along the direction in which the plate body is mounted to the holding portion, the holding portion is provided with a first block having a gradually expanding shape.
7. The shock absorbing structure according to claim 5, wherein the pre-installation portion is provided with a second clamping block in a gradually expanding shape along the direction in which the plate body is attached to the holding portion.
8. The shock absorbing structure according to claim 1, wherein the solid portion and the hollow portion are both cylindrical, and the diameter of the solid portion is larger than the diameter of the hollow portion.
9. The shock absorbing structure according to claim 1, wherein the material of the shock absorbing member comprises silicone.
10. An electronic device, characterized by comprising a casing and the shock-absorbing structure according to any one of claims 1-9, the shock-absorbing structure being provided in the casing.
11. The electronic device according to claim 10, wherein the electronic device includes a drone and a robot.
12. A method for installing a shock-absorbing structure, characterized in that the shock-absorbing structure includes a plate body, a shock-absorbing component and an installation portion, the installation portion includes a holding portion and a pre-installation portion, and the holding portion is connected to the pre-installation And the shock-absorbing component, the installation method includes:

    Making the pre-mounting part penetrate the mounting hole and expose from the mounting hole;

    The plate body is fixed and the pre-mounting portion is stretched in a direction away from the plate body so that the holding portion is caught on the plate body.
13. The installation method according to claim 12, wherein the installation method comprises: removing the pre-installation portion after the holding portion is caught in the board body.

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