WO2020113885A1 - 用于显示装置的膜层结构 - Google Patents

用于显示装置的膜层结构 Download PDF

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Publication number
WO2020113885A1
WO2020113885A1 PCT/CN2019/083002 CN2019083002W WO2020113885A1 WO 2020113885 A1 WO2020113885 A1 WO 2020113885A1 CN 2019083002 W CN2019083002 W CN 2019083002W WO 2020113885 A1 WO2020113885 A1 WO 2020113885A1
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Prior art keywords
film
area
polarizer
layer structure
film layer
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PCT/CN2019/083002
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English (en)
French (fr)
Inventor
陈敏
袁朝煜
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to US16/467,052 priority Critical patent/US20200183449A1/en
Publication of WO2020113885A1 publication Critical patent/WO2020113885A1/zh
Anticipated expiration legal-status Critical
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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00

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  • the present application relates to the field of display, and in particular to a film structure for a display device.
  • the laser anisotropic cutting technology In order to realize the narrow frame of the display device, the most important one is the laser anisotropic cutting technology.
  • the principle is that the product film material is ablated by high-energy laser to cause a vaporization reaction, but on the one hand, the material will produce a pungent odor when vaporized On the other hand, a lot of ash will be produced, which will reduce the cutting quality.
  • FIG. 1 The structure of the film layer of the OLED product in the prior art is shown in FIG. 1, and the schematic diagram of using the laser cutting to cut the dummy area of the edge to achieve the narrow border design is shown in FIG. 2, but the laser cutting process will produce a pungent odor and a large number of Ashes reduce the cutting quality and product yield. Therefore, how to reduce the ash and pungent odor and improve the cutting quality and product yield is a technical problem to be urgently solved by those skilled in the art.
  • the present application provides a film layer structure for a display device, which is used to alleviate the technical problems of the pungent smell and a large amount of ash generated in the existing laser cutting process, and to reduce the cutting quality and product yield.
  • This application provides a film structure for a display device, which includes:
  • the protection area is used to form the film structure required for the display device
  • the scrap area is used to protect the protection area when forming the film layer
  • a cutting area located between the protection area and the scrap material area, for cutting to form the protection area
  • the cutting area includes a target area, the first thickness of the target area is smaller than the second thickness of the protection area;
  • the cutting area is provided with at least two of the target areas;
  • the shape of the target area is circular.
  • the film layer structure includes a backplane, the backplane includes three backplane sub-film layers of a backplane body, a protective film, and a release film, and the backplane At least one of the backboard sub-film layers is provided with the target area.
  • the film layer structure includes a back plate, and the back plate includes at most two of the back plate sub-film layers of the back plate body, the protective film, and the release film, At least one sub-film layer of the back plate is provided with the target area.
  • the back plate includes a back plate body and a release film, and the target area is provided on the back plate body.
  • the film layer structure includes a polarizer, and the polarizer includes four polarizer sub-film layers of a polarizing layer, a pressure sensitive adhesive, a release film, and a protective film. At least one polarizer sub-film layer of the polarizer is provided with the target area.
  • the film layer structure includes a polarizer, and the polarizer includes at most three polarizer sub-film layers of a polarizing layer, a pressure sensitive adhesive, a release film, and a protective film At least one of the polarizer sub-film layers is provided with the target area.
  • the polarizer includes a polarizing layer, a pressure-sensitive adhesive, and a release film, and the target region is provided on the polarizing layer and the release film.
  • the present application also provides a film layer structure for a display device, which includes:
  • the protection area is used to form the film structure required for the display device
  • the scrap area is used to protect the protection area when forming the film layer
  • a cutting area located between the protection area and the scrap material area, for cutting to form the protection area
  • the cutting area includes a target area, and the first thickness of the target area is smaller than the second thickness of the protection area.
  • the thickness of the target area is greater than zero, and the target area is the cutting area.
  • the cutting area is provided with at least two target areas.
  • the thickness of the target area is zero.
  • the film layer structure includes a backplane, the backplane includes three backplane sub-film layers of a backplane body, a protective film, and a release film, and the backplane At least one of the backboard sub-film layers is provided with the target area.
  • the film layer structure includes a back plate, and the back plate includes at most two of the back plate sub-film layers of the back plate body, the protection and the release film, At least one sub-film layer of the back plate is provided with the target area.
  • the back plate includes a back plate body and a release film, and the target area is provided on the back plate body.
  • the film layer structure includes a polarizer, and the polarizer includes four polarizer sub-film layers of a polarizing layer, a pressure sensitive adhesive, a release film, and a protective film. At least one polarizer sub-film layer of the polarizer is provided with the target area.
  • the film layer structure includes a polarizer, and the polarizer includes at most three of the polarizer layer, a pressure sensitive adhesive, a release film, and a protective film
  • the polarizer includes at most three of the polarizer layer, a pressure sensitive adhesive, a release film, and a protective film
  • the film layer at least one of the polarizer sub-film layers is provided with the target area.
  • the polarizer includes a polarizing layer, a pressure-sensitive adhesive, and a release film, and the target region is provided on the polarizing layer and the release film.
  • the film layer structure includes a thin film transistor, and the thin film transistor includes a metal layer, and the metal layer is provided with the target region.
  • the shape of the target area is circular.
  • the width of the cutting area is greater than 30 ⁇ m.
  • Embodiments of the present application provide a film layer structure for a display device.
  • the film layer structure includes a protection region to form a film layer structure required for a display device; a scrap region to protect the protection region when the film layer is formed; A cutting area, located between the protection area and the scrap material area, for cutting to form the protection area; wherein, the cutting area includes a target area, and the first thickness of the target area is smaller than the first area of the protection area Two thicknesses; when the thickness of the protective area of the film structure is fixed, by reducing the thickness of the cutting area in the film structure, the material vaporized in the cutting area is reduced during the laser cutting process, thereby reducing the ash and The pungent smell improves the cutting quality and product yield.
  • Figure 1 is a schematic diagram of the film structure of the prior art OLED product
  • Figure 2 is a schematic diagram of laser cutting of an existing OLED product
  • FIG. 3 is a schematic diagram of the structure of the first film layer of the backplane of the application.
  • FIG. 4 is a schematic diagram of the structure of the second film layer of the backplane of the application.
  • FIG. 5 is a schematic diagram of the structure of the third film layer of the backplane of the application.
  • FIG. 6 is a schematic diagram of the fourth film structure of the polarizer of the present application.
  • FIG. 7 is a schematic diagram of the structure of the fifth film layer of the polarizer of the present application.
  • FIG. 8 is a schematic diagram of the structure of the sixth film layer of the polarizer of the present application.
  • FIG. 9 is a schematic diagram of the structure of the metal layer of the thin film transistor of the present application.
  • This application is directed to the problem that the existing display device will generate more ash and pungent odor during cutting, which reduces the cutting quality and product yield.
  • the embodiments of this application can alleviate this problem.
  • the existing OLED film layer structure includes a polarizer 11, a touch screen 12, an encapsulation layer 13, an OLED 14, a flexible substrate 15 and a back plate 16, and the thickness of each film layer structure is shown in Table 1 below:
  • the thickness of the back plate and the polarizer is the largest, accounting for about 2/3 of the film thickness of all products, and during the laser anisotropic cutting process, as shown in FIG. 2, the polarizer 21 in the OLED film structure, touch
  • the control panel 22, the encapsulation layer 23, the OLED 24, the flexible substrate 25 and the back plate 26 are cut through the cutting lane 27 to remove the Dummy area 28, a large amount of ash and pungent odor will be generated, so it is necessary to reduce the ash and pungent odor to improve Cutting quality and product yield, combined with the analysis of Table 1, the embodiments of the present application improve the structure of the backplane and polarizer film layer.
  • an embodiment of the present application provides a backplane film layer structure. As shown in (a) of FIG. 3, it includes a protective film 31, a backplane body 32, and a release film 33. The structure of the body 32 is improved. As shown in (b) of FIG. 3, the backplane body is provided with a protection zone 301 and a scrap zone 302.
  • the backplane protection zone 301 and the backplane scrap zone 302 are provided between There is a backplane cutting area 303, a target area 304 and a first connection area 305 are provided on the backplane cutting area 303, the thickness of the backplane target area 304 is 0, that is, the backplane target area 304 is empty,
  • the first connection zone is connected to the backplane protection zone 301 and the backplane trim zone 302, and the thickness of the first connection zone 305 is the same as the thickness of the backplane protection zone 30, as shown in FIG.
  • an embodiment of the present application provides a backplane film layer structure. As shown in (a) of FIG. 4, it includes a protective film 41, a backplane body 42, and a release film 43. The structure of the body 42 is improved. As shown in (b) of FIG. 4, the back plate body 42 includes a protection area 401 and a scrap area 402. A back is provided between the back plate protection area 401 and the scrap area 402 Board cutting area 403, the back plate cutting area 403 is provided with two target areas 404 and a second connection area 405, the thickness of the target area 404 is 0, that is, the target area 404 is empty, the second connection The area 405 is connected to the backplane protection area 401 and the backplane edge material area 402. By providing two target areas and changing the thickness of the target area to 0, the material of the cutting area is reduced, so that during the cutting process The amount of ash is reduced, at the same time reducing the pungent smell, improving the cutting quality and product yield.
  • the thickness of the protection area is constant, and the layers of the back plate are retained.
  • the ash generated during the laser anisotropic cutting is reduced, which reduces The odor generated during vaporization improves the cutting quality and product yield.
  • This application divides the backplane cutting area into a target area and a connection area.
  • the thickness of the target area can be reduced to varying degrees, and the structure can be applied to the backplane body, protective film, Any layer of the type film can also be applied to any two layers of the backplane body, protective film, and release film, and can also be used simultaneously on the three layers of the backplane body, protective film, and release film, thereby reducing the cutting to varying degrees.
  • the material in the zone has the effect of reducing the amount of ash and pungent odor, improving the cutting quality and product yield.
  • an embodiment of the present application provides a backplane film layer structure.
  • a) of FIG. 5 it includes a backplane body 51 and a release film 52.
  • the layer structure is improved.
  • the backplane body 51 includes a scrap area 501 and a protection area 503, and between the backplane body trim area 501 and the backplane body protection area 503
  • a cutting area 502 is provided, wherein the target area is the cutting area 502, the thickness of the back plate body cutting area 502 is lower than the thickness of the back plate body protection area 503, by setting the target area, and integrating the target area
  • the reduced thickness reduces the amount of ash produced and the pungent smell, and improves the cutting quality and product yield.
  • the embodiments of the present application change the structure of the film layer so that the back plate becomes the back plate body and the release film, and then improves the cutting area, sets a target area in the cutting area, and reduces the overall thickness of the target area, and the film
  • the layer structure can be used on any layer of the backplane body and release film, and can also be used on both layers of the backplane body and release film to reduce the thickness of the target area and reduce the amount of ash and thorns caused by laser cutting.
  • the smell of the nose improves the cutting quality and product yield.
  • an embodiment of the present application provides a polarizer film layer structure.
  • the polarizer includes a release film 61, a pressure sensitive adhesive 62, a polarizer 63 and Protect the film 64, and make the same improvements to each of the film layers.
  • the polarizer includes a release film 61, a pressure sensitive adhesive 62, a polarizer 63 and Protect the film 64, and make the same improvements to each of the film layers.
  • the polarizer includes a release film 61, a pressure sensitive adhesive 62, a polarizer 63 and Protect the film 64, and make the same improvements to each of the film layers.
  • the polarizer is provided with a protection area 601, a corner material area 602, and the polarizer protection area 601 is A polarizer cutting region 603 is provided between the polarizer edge material regions 602, the polarizer cutting region 603 is provided with a target region 604 and a third connection region 605, the third connection region 605 and the polarizer protection region 601 Connected to the polarizer edge material region 602, by setting a target region 604 in the polarizer cutting region 603, and changing the thickness of the polarizer target region 604 to 0, that is, the polarizer target region 604 is empty, The material in the cutting area is reduced, the amount of ash and pungent odor generated during laser cutting is reduced, and the cutting quality and product yield are improved.
  • an embodiment of the present application provides a polarizer film layer structure.
  • the polarizer includes a release film 71, a pressure sensitive adhesive 72, a polarizing layer 73, and The protective film 74 improves the polarizing layer 73.
  • the polarizing layer 73 includes a protective region 701, a scrap material region 702, the polarizer protective region 701 and the polarizer A polarizer cutting area 703 is provided between the scrap material area 702.
  • the polarizing film cutting area 703 is provided with two target areas 704 and a fourth connection area 705.
  • the fourth connection area 705 and the polarizer protection area 701 and The polarizer edge material area 702 is connected.
  • the embodiment of the present application has found through analysis that the thickness of the polarizer in the product is relatively large.
  • the thickness of the protection area is constant, while retaining each layer, a target area or multiple target areas are provided in the cutting area, and the target area is set at
  • the release film, pressure-sensitive adhesive, polarizing layer and protective film can be set on any two layers, any three layers, or four layers at the same time, which reduces the cutting area.
  • the material reduces the amount of ash and pungent odor generated during laser cutting, and improves the cutting quality and product yield.
  • an embodiment of the present application provides a polarizer film layer structure. As shown in (a) of FIG. 8, it includes a release film 81, a pressure sensitive adhesive 82 and a polarizing layer 83. The photosensitive adhesive 82 and the polarizing layer 83 are improved. As shown in (b) of FIG. 8, it includes a corner material area 801 and a protection area 803. The polarizer edge material area 801 and the polarizer protection area 803 are provided.
  • the target area is the polarizer cutting area 802
  • the thickness of the polarizer cutting area 802 is lower than the thickness of the polarizer protection area 803 and the laser cutting is reduced by reducing the overall thickness of the cutting area The amount of ash produced and the pungent smell improve the cutting quality and product yield.
  • the thickness of the target area is reduced as a whole, and the film structure of the polarizer can be provided in any layer of the polarizing layer, the release film, and the pressure-sensitive adhesive. It can also be set on any two layers at the same time, or on three layers at the same time, which reduces the amount of ash and pungent odor generated during laser cutting, and improves the cutting quality and product yield.
  • the embodiments of the present application have analyzed that the thickness of the back plate and polarizer in the product is large, and the back plate and polarizer have a multi-layer structure, then the layers of the back plate and polarizer can be improved, and the target area is set in the cutting area , The thickness of the target area is reduced, and the target area can be multiple, thereby reducing the material of the cutting area to different degrees, reducing the amount of ash and pungent odor generated during laser cutting, and improving the cutting quality and product Yield purpose.
  • an embodiment of the present application provides a thin film transistor metal layer film structure
  • the metal layer is provided with a protection area 901, a scrap material area 902, the metal layer protection area 901 and the metal layer scrap material area
  • a metal layer cutting area 903 is provided between 902.
  • the metal layer cutting area 903 is provided with a target area 904 and a fifth connection area 905.
  • the target area 904 is circular and the thickness is 0, that is, the target area 904 is Empty, reduce the ash and pungent odor generated by laser cutting, improve cutting quality and product yield.
  • the film layer structure is improved, and a target area is provided on the cutting area, and the size, shape, and thickness of the target area can be adjusted, and the cutting area is reduced to varying degrees
  • the material reduces the amount of ash and pungent smell of laser cutting, and improves the cutting quality and product yield.
  • Embodiments of the present application provide a film layer structure for a display device.
  • the film layer structure includes a protection region to form a film layer structure required for a display device; a scrap region to protect the protection region when the film layer is formed; A cutting area, located between the protection area and the scrap material area, for cutting to form the protection area; wherein, the cutting area includes a target area, and the first thickness of the target area is smaller than the first area of the protection area Two thicknesses; when the thickness of the protective area of the film structure is fixed, by reducing the thickness of the cutting area in the film structure, the material vaporized in the cutting area is reduced during the laser cutting process, thereby reducing the ash and The pungent smell improves the cutting quality and product yield.

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Abstract

一种用于显示装置的膜层结构，膜层结构包括保护区（301，401，503，601，701，803，901），形成显示装置所需要的膜层结构；边角料区（302，402，501，602，702，801，902），形成膜层时，保护保护区（301，401，503，601，701，803，901）；切割区（303，403，502，603，703，802，903），位于保护区（301，401，503，601，701，803，901）和边角料区（302，402，501，602，702，801，902）之间，用于切割形成保护区（301，401，503，601，701，803，901）；其中，切割区（303，403，502，603，703，802，903）包括目标区（304，404，604，704，904），目标区（304，404，604，704，904）的第一厚度小于保护区（301，401，503，601，701，803，901）的第二厚度。

Description

用于显示装置的膜层结构 技术领域
本申请涉及显示领域，尤其是涉及一种用于显示装置的膜层结构。
背景技术
为了实现显示装置的窄边框，其中最关键的就是激光异性切割技术，其原理是通过高能量激光烧蚀产品膜层材料，使其发生汽化反应，但材料汽化时一方面会产生刺鼻的气味，另一方面会产生大量的灰烬，降低切割品质。
现有技术中OLED产品膜层结构如图1所示，其采用激光切割切除边缘的dummy区实现窄边框设计的示意图如图2所示，但激光切割过程中会产生刺鼻的气味和大量的灰烬，降低切割品质和产品良率。所以，如何减少灰烬和刺鼻的气味，提高切割品质和产品良率就是一个本领域技术人员亟待解决的技术问题。
技术问题
本申请提供一种用于显示装置的膜层结构，用以缓解现有激光切割过程中产生刺鼻的气味和大量的灰烬、降低切割品质和产品良率的技术问题。
技术解决方案
本申请提供一种用于显示装置的膜层结构，其包括:
保护区，用于形成显示装置所需要的膜层结构；
边角料区，用于形成所述膜层时，保护所述保护区；
切割区，位于所述保护区和所述边角料区之间，用于切割形成所述保护区；
其中，所述切割区包括目标区，所述目标区的第一厚度小于所述保护区的第二厚度；
所述切割区设有至少两个所述目标区；
所述目标区形状为圆形。
在本申请提供的用于显示装置的膜层结构中，所述膜层结构包括背板，所述背板包括背板本体、保护膜和离型膜三个背板子膜层，所述背板至少有一个所述背板子膜层设有所述目标区。
在本申请提供的用于显示装置的膜层结构中，所述膜层结构包括背板，所述背板至多包括背板本体、保护膜和离型膜中两个所述背板子膜层，所述背板至少有一个所述背板子膜层设有所述目标区。
在本申请提供的用于显示装置的膜层结构中，所述背板包括背板本体和离型膜，所述背板本体上设有所述目标区。
在本申请提供的用于显示装置的膜层结构中，所述膜层结构包括偏光片，所述偏光片包括偏光层、压敏胶、离型膜和保护膜四个偏光片子膜层，所述偏光片至少有一个所述偏光片子膜层设有所述目标区。
在本申请提供的用于显示装置的膜层结构中，所述膜层结构包括偏光片，所述偏光片至多包括偏光层、压敏胶、离型膜和保护膜中三个偏光片子膜层，所述偏光片至少有一个所述偏光片子膜层设有所述目标区。
在本申请提供的用于显示装置的膜层结构中，所述偏光片包括偏光层、压敏胶和离型膜，所述偏光层和所述离型膜上设有所述目标区。
本申请还提供一种用于显示装置的膜层结构，其包括：
保护区，用于形成显示装置所需要的膜层结构；
边角料区，用于形成所述膜层时，保护所述保护区；
切割区，位于所述保护区和所述边角料区之间，用于切割形成所述保护区；
其中，所述切割区包括目标区，所述目标区的第一厚度小于所述保护区的第二厚度。
在本申请提供的用于显示装置的膜层结构中，所述目标区厚度大于零，所述目标区为所述切割区。
在本申请提供的用于显示装置的膜层结构中，所述切割区设有至少两个所述目标区。
在本申请提供的用于显示装置的膜层结构中，所述目标区厚度为零。
在本申请提供的用于显示装置的膜层结构中，所述膜层结构包括背板，所述背板包括背板本体、保护膜和离型膜三个背板子膜层，所述背板至少有一个所述背板子膜层设有所述目标区。
在本申请提供的用于显示装置的膜层结构中，所述膜层结构包括背板，所述背板至多包括背板本体、保护和离型膜中两个所述的背板子膜层，所述背板至少有一个所述背板子膜层设有所述目标区。
在本申请提供的用于显示装置的膜层结构中，所述背板包括背板本体和离型膜，所述背板本体上设有所述目标区。
在本申请提供的用于显示装置的膜层结构中，所述膜层结构包括偏光片，所述偏光片包括偏光层、压敏胶、离型膜和保护膜四个偏光片子膜层，所述偏光片至少有一个所述偏光片子膜层设有所述目标区。
在本申请提供的用于显示装置的膜层结构中，所述膜层结构包括偏光片，所述偏光片至多包括偏光层、压敏胶、离型膜和保护膜中三个所述偏光片子膜层，所述偏光片至少有一个所述偏光片子膜层设有所述目标区。
在本申请提供的用于显示装置的膜层结构中，所述偏光片包括偏光层、压敏胶和离型膜，所述偏光层和所述离型膜上设有所述目标区。
在本申请提供的用于显示装置的膜层结构中，所述膜层结构包括薄膜晶体管，所述薄膜晶体管包括金属层，所述金属层设有所述目标区。
在本申请提供的用于显示装置的膜层结构中，所述目标区形状为圆形。
在本申请提供的用于显示装置的膜层结构中，所述切割区宽度大于30μm。
有益效果
本申请实施例提供一种用于显示装置的膜层结构，该膜层结构包括保护区，形成显示装置所需要的膜层结构；边角料区，形成所述膜层时，保护所述保护区；切割区，位于所述保护区和所述边角料区之间，用于切割形成所述保护区；其中，所述切割区包括目标区，所述目标区的第一厚度小于所述保护区的第二厚度；在膜层结构保护区厚度一定时，通过将膜层结构中切割区的厚度降低，使得在激光切割过程中，切割区汽化的材料减少，从而降低了激光异性切割后产生的灰烬和刺鼻的气味，提高了切割品质和产品良率。
附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为现有技术OLED产品膜层结构示意图；
图2为现有技术OLED产品激光切割示意图；
图3为本申请背板第一膜层结构示意图；
图4为本申请背板第二膜层结构示意图；
图5为本申请背板第三膜层结构示意图；
图6为本申请偏光片第四膜层结构示意图；
图7为本申请偏光片第五膜层结构示意图；
图8为本申请偏光片第六膜层结构示意图；
图9为本申请薄膜晶体管金属层膜层结构示意图。
本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本申请可用以实施的特定实施例。本申请所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本申请，而非用以限制本申请。在图中，结构相似的单元是用以相同标号表示。
本申请针对现有显示装置在切割过程中会产生较多的灰烬和刺鼻的气味，降低切割品质和产品良率的问题，本申请实施例可以缓解该问题。
如图1所示，现有OLED膜层结构包括偏光片11、触控屏12、封装层13、OLED 14、柔性基板15和背板16，所述各膜层结构厚度如下表1所示：
膜层结构 厚度/um
BP 100
柔性基板 20
OLED 0.3
TFE 5
TP 80
POL 100
表1
从表1可知：背板和偏光片的厚度最大，约占全部产品膜层厚度的2/3，而在激光异性切割过程中，如图2所示，OLED膜层结构中偏光片21，触控屏22、封装层23、OLED 24、柔性基板25和背板26通过切割道27切割去除Dummy区28时会产生大量的灰烬和刺鼻的气味，所以需要减少灰烬和刺鼻的气味，提高切割品质和产品良率，结合对表一的分析，本申请实施例对背板和偏光片膜层结构进行改进。
如图3所示，本申请实施例提供一种背板膜层结构，如图3中的(a)所示，包括保护膜31、背板本体32和离型膜33，对所述背板本体32结构进行改进，如图3中的(b)所示，所述背板本体设有保护区301、边角料区302，所述背板保护区301和所述背板边角料区302之间设有背板切割区303，所述背板切割区303上设有目标区304和第一连接区305，所述背板目标区304厚度为0，即所述背板目标区304是空的，所述第一连接区与所述背板保护区301和所述背板边角料区302连接，所述第一连接区305厚度与所述背板保护区30厚度相同，如图3所示，假设所述背板保护区的宽度为f，长度为d，所述背板切割区厚度为c，切割道的宽度为e，则在切割背板时可以减少的灰烬量体积为V＝2(d+f)*c*e,而由于灰烬量的减少，汽化时的刺鼻气味将会减少，所以提高了切割品质和产品良率。
如图4所示，本申请实施例提供一种背板膜层结构，如图4中的(a)所示，包括保护膜41、背板本体42、离型膜43，对所述背板本体42结构进行改进，如图4中的(b)所示，所述背板本体42包括保护区401、边角料区402，所述背板保护区401与所述边角料区402之间设有背板切割区403，所述背板切割区403设有两个目标区404和第二连接区405，所述目标区404厚度为0，即所述目标区404是空的，所述第二连接区405与所述背板保护区401和所述背板边角料区402连接，通过提供两个目标区并将所述目标区的厚度变为0使 得切割区的材料减少，从而使得在切割过程中灰烬量减少，同时减少刺鼻的气味，提高切割品质和产品良率。
本申请实施例在考虑到背板厚度较大时，在保护区的厚度一定，保留背板各层的同时，通过减少背板切割区的材料，减少了激光异性切割时产生的灰烬，减少了汽化时产生的气味，从而提高了切割品质和产品良率。本申请将背板切割区划分为目标区和连接区，通过提供一个或多个目标区，所述目标区厚度可以不同程度的降低，且所述结构可运用在背板本体、保护膜、离型膜任一层，也可运用在背板本体、保护膜、离型膜任两层，也可同时运用在背板本体、保护膜和离型膜三层上，从而不同程度的减少了切割区的材料，实现了减少灰烬量和刺鼻的气味，提高切割品质和产品良率的效果。
如图5所示，本申请一实施例提供一种背板膜层结构，如图5中的(a)所示，包括背板本体51、离型膜52，对所述背板本体51膜层结构进行改进，如图5中的(b)所示，所述背板本体51包括边角料区501、保护区503，所述背板本体边角料区501与所述背板本体保护区503之间设有切割区502，其中，所述目标区为所述切割区502，所述背板本体切割区502厚度低于所述背板本体保护区503厚度，通过设置目标区，并将目标区整体厚度降低，减少了产生的灰烬量和刺鼻的气味，提高了切割品质和产品良率。
本申请的实施例通过改变膜层结构，使背板变为背板本体和离型膜组成，再通过改进切割区，在切割区设置目标区，并将目标区整体厚度降低，且所述膜层结构可运用在背板本体和离型膜任一层上，也可同时运用在背板本体和离型膜两层上，达到了降低目标区厚度，减少激光切割使产生的灰烬量和刺鼻的气味，提高了切割品质和产品良率。
如图6所示，本申请一实施例提供一种偏光片膜层结构，如图6中的 (a)所示，所述偏光片包括离型膜61、压敏胶62、偏光片63和保护膜64，并对所述各膜层进行相同的改进，如图6中的(b)所示，所述偏光片设有保护区601、边角料区602，所述偏光片保护区601与所述偏光片边角料区602之间设有偏光片切割区603，所述偏光片切割区603设有目标区604和第三连接区605，所述第三连接区605与所述偏光片保护区601和所述偏光片边角料区602连接，通过在所述偏光片切割区603设置目标区604，并将所述偏光片目标区604厚度变为0，即所述偏光片目标区604是空的，减少了切割区的材料，减少了激光切割时产生的灰烬量和刺鼻的气味，提高了切割品质和产品良率。
如图7所示，本申请一实施例提供一种偏光片膜层结构，如图7中的(a)所示，所述偏光片包括离型膜71、压敏胶72、偏光层73和保护膜74，对所述偏光层73进行改进，如图7中的(b)所示，所述偏光层73包括保护区701、边角料区702，所述偏光片保护区701与所述偏光片边角料区702之间设有偏光片切割区703，所述偏光片切割区703设有两个目标区704和第四连接区705，所述第四连接区705与所述偏光片保护区701和所述偏光片边角料区702连接，通过在切割区703上设置目标区704，减少切割区的材料，从而减少了激光切割时产生的灰烬量和刺鼻的气味，提高了切割品质和产品良率。
本申请实施例通过分析发现产品中偏光片厚度较大，在保护区厚度一定时，在保留各层的同时，通过在切割区设置一个目标区或多个目标区，且所述目标区设置在离型膜、压敏胶、偏光层、保护膜任一层上，也可设置在其中任两层上，也可设置在任三层上，也可同时设置在四层上，减少了切割区的材料，减少了激光切割时产生的灰烬量和刺鼻的气味，提高切割品质和产品良率。
如图8所示，本申请一实施例提供一种偏光片膜层结构，如图8中的(a)所示，包括离型膜81、压敏胶82和偏光层83，对所述压敏胶82和所述偏光层83进行改进，如图8中的(b)所示，包括边角料区801、保护区803，所述偏光片边角料区801与所述偏光片保护区803之间设有偏光片切割区802，所述目标区为所述偏光片切割区802，所述偏光片切割区802厚度低于所述偏光片保护区803厚度，通过降低切割区整体厚度，减少了激光切割产生的灰烬量和刺鼻的气味，提高了切割品质和产品良率。
本申请实施例通过改变偏光片结构，同时通过在切割区设置目标区，整体降低目标区厚度，且所述偏光片膜层结构可设置在偏光层、离型膜、压敏胶任一层，也可同时设置在任意两层上，也可同时设置在三层上，减少了激光切割时产生的灰烬量和刺鼻的气味，提高了切割品质和产品良率。
本申请实施例通过分析得出在产品中背板和偏光片厚度较大，同时背板和偏光片具有多层结构，则可以对背板和偏光片各层进行改进，在切割区设置目标区，所述目标区厚度降低，所述目标区可为多个，从而不同程度的减少了切割区的材料，实现了在激光切割时减少产生的灰烬量和刺鼻的气味，提高切割品质和产品良率的目的。
如图9所示，本申请一实施例提供一种薄膜晶体管金属层膜层结构，所述金属层设有保护区901、边角料区902，所述金属层保护区901与所述金属层边角料区902之间设有金属层切割区903，所述金属层切割区903设有目标区904和第五连接区905，所述目标区904为圆形，厚度为0，即所述目标区904是空的，减少了激光切割产生的灰烬和刺鼻的气味，提高切割品质和产品良率。
本申请实施例提供的膜层结构中，对膜层结构进行改进，在切割区上设置目标区，且所述目标区的大小、形状、厚度均可进行调节， 在不同程度上减少了切割区的材料，减少了激光切割的灰烬量和刺鼻的气味，提高了切割品质和产品良率。
根据以上实施例可知：
本申请实施例提供一种用于显示装置的膜层结构，该膜层结构包括保护区，形成显示装置所需要的膜层结构；边角料区，形成所述膜层时，保护所述保护区；切割区，位于所述保护区和所述边角料区之间，用于切割形成所述保护区；其中，所述切割区包括目标区，所述目标区的第一厚度小于所述保护区的第二厚度；在膜层结构保护区厚度一定时，通过将膜层结构中切割区的厚度降低，使得在激光切割过程中，切割区汽化的材料减少，从而降低了激光异性切割后产生的灰烬和刺鼻的气味，提高了切割品质和产品良率。
综上所述，虽然本申请已以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (20)

  1. 一种用于显示装置的膜层结构，其中，包括：
    保护区，用于形成显示装置所需要的膜层结构；
    边角料区，用于形成所述膜层时，保护所述保护区；
    切割区，位于所述保护区和所述边角料区之间，用于切割形成所述保护区；
    其中，所述切割区包括目标区，所述目标区的第一厚度小于所述保护区的第二厚度；
    所述切割区设有至少两个所述目标区；
    所述目标区形状为圆形。
  2. 如权利要求1所述的膜层结构，其中，所述膜层结构包括背板，所述背板包括背板本体、保护膜和离型膜三个背板子膜层，所述背板至少有一个所述背板子膜层设有所述目标区。
  3. 如权利要求1所述的膜层结构，其中，所述膜层结构包括背板，所述背板至多包括背板本体、保护膜和离型膜中两个所述背板子膜层，所述背板至少有一个所述背板子膜层设有所述目标区。
  4. 如权利要求3所述的膜层结构，其中，所述背板包括背板本体和离型膜，所述背板本体上设有所述目标区。
  5. 如权利要求1所述的膜层结构，其中，所述膜层结构包括偏光片，所述偏光片包括偏光层、压敏胶、离型膜和保护膜四个偏光片子膜层，所述偏光片至少有一个所述偏光片子膜层设有所述目标区。
  6. 如权利要求1所述的膜层结构，其中，所述膜层结构包括偏光片，所述偏光片至多包括偏光层、压敏胶、离型膜和保护膜中三个偏光片 子膜层，所述偏光片至少有一个所述偏光片子膜层设有所述目标区。
  7. 如权利要求5所述的膜层结构，其中，所述偏光片包括偏光层、压敏胶和离型膜，所述偏光层和所述离型膜上设有所述目标区。
  8. 一种用于显示装置的膜层结构，其中，包括：
    保护区，用于形成显示装置所需要的膜层结构；
    边角料区，用于形成所述膜层时，保护所述保护区；
    切割区，位于所述保护区和所述边角料区之间，用于切割形成所述保护区；
    其中，所述切割区包括目标区，所述目标区的第一厚度小于所述保护区的第二厚度。
  9. 如权利要求8所述的膜层结构，其中，所述目标区厚度
    大于零，所述目标区为所述切割区。
  10. 如权利要求8所述的膜层结构，其中，所述切割区设有至少两个所述目标区。
  11. 如权利要求8所述的膜层结构，其中，所述目标区厚度为零。
  12. 如权利要求8所述的膜层结构，其中，所述膜层结构包括背板，所述背板包括背板本体、保护膜和离型膜三个背板子膜层，所述背板至少有一个所述背板子膜层设有所述目标区。
  13. 如权利要求8所述的膜层结构，其中，所述膜层结构包括背板，所述背板至多包括背板本体、保护膜和离型膜中两个所述背板子膜层，所述背板至少有一个所述背板子膜层设有所述目标区。
  14. 如权利要求13所述的膜层结构，其中，所述背板包括背板本体和离型膜，所述背板本体上设有所述目标区。
  15. 如权利要求8所述的膜层结构，其中，所述膜层结构包括偏光片，所述偏光片包括偏光层、压敏胶、离型膜和保护膜四个偏光片子膜层，所述偏光片至少有一个所述偏光片子膜层设有所述目标区。
  16. 如权利要求8所述的膜层结构，其中，所述膜层结构包括偏光片，所述偏光片至多包括偏光层、压敏胶、离型膜和保护膜中三个偏光片子膜层，所述偏光片至少有一个所述偏光片子膜层设有所述目标区。
  17. 如权利要求16所述的膜层结构，其特征在于，所述偏光片包括偏光层、压敏胶和离型膜，所述偏光层和所述离型膜上设有所述目标区。
  18. 如权利要求8所述的膜层结构，其中，所述膜层结构包括薄膜晶体管，所述薄膜晶体管包括金属层，所述金属层设有所述目标区。
  19. 如权利要求8所述的膜层结构，其中，所述目标区形状为圆形。
  20. 如权利要求8所述的膜层结构，其中，所述切割区宽度大于30μm。
PCT/CN2019/083002 2018-12-04 2019-04-17 用于显示装置的膜层结构 Ceased WO2020113885A1 (zh)

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