WO2020111137A1 - Composant électronique et son procédé de fabrication - Google Patents

Composant électronique et son procédé de fabrication Download PDF

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Publication number
WO2020111137A1
WO2020111137A1 PCT/JP2019/046417 JP2019046417W WO2020111137A1 WO 2020111137 A1 WO2020111137 A1 WO 2020111137A1 JP 2019046417 W JP2019046417 W JP 2019046417W WO 2020111137 A1 WO2020111137 A1 WO 2020111137A1
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WIPO (PCT)
Prior art keywords
conductor
electronic component
magnetic body
magnetic
layer
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Application number
PCT/JP2019/046417
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English (en)
Japanese (ja)
Inventor
松岡　孝
達 波多江
良弥 小関
和宏 長原
俊造 末松
望 神山
Original Assignee
日本ケミコン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority claimed from JP2018222537A external-priority patent/JP2020088243A/ja
Priority claimed from JP2018222536A external-priority patent/JP7196566B2/ja
Priority claimed from JP2018222535A external-priority patent/JP2020088241A/ja
Priority claimed from JP2018222534A external-priority patent/JP7298139B2/ja
Application filed by 日本ケミコン株式会社 filed Critical 日本ケミコン株式会社
Publication of WO2020111137A1 publication Critical patent/WO2020111137A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H01F17/06—Fixed inductances of the signal type  with magnetic core with core substantially closed in itself, e.g. toroid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/15—Solid electrolytic capacitors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks

Definitions

  • the technology of the present disclosure relates to an electronic component having an inductor and a capacitance and a manufacturing method thereof.
  • Such an electronic component includes, for example, a substrate and an inductor and a capacitor arranged on the substrate.
  • the substrate is connected to the inductor and the capacitor to obtain, for example, a noise filter.
  • an electronic component in which a conductor is arranged in a hollow portion of a magnetic body, the conductor and the magnetic body are linked to each other to form an inductor.
  • an air core is provided in the center of a toroidal magnetic core, and a conductor is inserted and arranged in the air core of the toroidal core (for example, Patent Document 2).
  • Such an electronic component is used as a noise filter, for example.
  • inductors and capacitors are integrated with a circuit board or resin body, it is necessary to secure a footprint for both inductors and capacitors, and the footprint is larger than the total area of inductors and capacitors, for example. There is a problem of becoming. Further, in order to obtain an LC circuit from individual inductors and capacitors, it is necessary to connect the inductors and capacitors with a wire. Further, it is necessary to change the connection between the inductor and the capacitor depending on the circuit form such as the T-type LC circuit and the ⁇ -type LC circuit.
  • the conductor in the hollow portion of the magnetic body, for example, a conductor having an outer diameter smaller than the diameter of the hollow portion is inserted into the hollow portion of the magnetic body. Therefore, when a gap is created between the magnetic body and the conductor and vibration is applied to the magnetic body and the conductor, mutual interference such as collision and friction occurs between the magnetic body and the conductor. Moreover, when a current flows through the electronic component, the electronic component generates heat. In order to protect the electronic component and the circuit in which the electronic component is installed from this heat generation, there is a problem that the current flowing through the electronic component is limited, for example.
  • inductors may be used as LC electronic components in combination with capacitance.
  • capacitance When an overvoltage is applied to this LC electronic component, there is a problem that the functions of the capacitance such as the noise filtering function are impaired.
  • the technology of the present disclosure has, for example, at least one of the following purposes.
  • an electronic component includes a magnetic body having a hollow portion, a conductor penetrating the hollow portion of the magnetic body and protruding from the hollow portion, and a dielectric formed on the surface of the conductor.
  • the magnetic body may have a tubular shape
  • the conductor may have a tubular shape or a cylindrical shape
  • the magnetic body and the conductor may be arranged coaxially.
  • part of the dielectric layer and part of the solid electrolyte layer may be arranged in the hollow portion of the magnetic body.
  • all of the solid electrolyte layer may be arranged in the hollow portion of the magnetic body, or a part of the solid electrolyte layer may be exposed from the magnetic body.
  • the solid electrolyte layer may include a plurality of solid electrolyte layers.
  • the lead layer may include a plurality of lead layers electrically connected to the plurality of solid electrolyte layers, respectively.
  • a plurality of capacitors may be formed between the plurality of solid electrolyte layers and the conductor, and capacitance values of the plurality of capacitors may be different.
  • the electronic component may further include a lead conductor connected to the plurality of lead layers.
  • the lead conductor may be led out to the outside of the hollow portion through between the magnetic body and the conductor.
  • the electronic component may further include a resin that is disposed between the magnetic body and the conductor and that contacts the magnetic body and the conductor.
  • the resin may be filled between the magnetic body and the conductor.
  • the magnetic body may have a tubular shape.
  • the conductor may have a cylindrical shape or a cylindrical shape.
  • the magnetic body and the conductor may be coaxially fixed by the resin.
  • the resin may be a thermoplastic resin, a thermosetting resin, or a resin crosslinkable with a curing agent.
  • the resin may include a heat transfer filler.
  • the magnetic body may include a first magnetic material and a second magnetic material different from the first magnetic material.
  • the first magnetic material and the second magnetic material may be band-shaped.
  • the strip-shaped first magnetic material and the strip-shaped second magnetic material may be wound in a laminated state.
  • the first magnetic material has a strip shape and may be wound.
  • the second magnetic material has a strip shape and may be wound.
  • the wound first magnetic material and the wound second magnetic material may be arranged adjacent to each other.
  • the conductor and the magnetic body may form an inductor, and by including the first magnetic material, an overvoltage applied to the electronic component may be reduced.
  • the magnetic body includes the first magnetic material, a first magnetic body having a part of the hollow portion, and a second magnetic material, and another one of the hollow portions.
  • a second magnetic body having a portion may be included.
  • the first magnetic body may be arranged next to the second magnetic body.
  • the first magnetic body may be joined to the second magnetic body.
  • the magnetic body may include a first magnetic foil containing the first magnetic material and a second magnetic foil containing the second magnetic material.
  • the first magnetic foil and the second magnetic foil may be laminated and wound together.
  • the first magnetic material and the second magnetic material may be silicon steel, a soft magnetic crystal material, a nanocrystal material, an amorphous metal or an amorphous alloy.
  • a method of manufacturing an electronic component includes a step of forming a magnetic body having a hollow portion, and a step of sequentially forming a dielectric layer, a solid electrolyte layer and a lead layer on the surface of a conductor. And inserting the conductor on which the dielectric layer, the solid electrolyte layer and the extraction layer are formed, into the hollow portion of the magnetic body, and disposing the conductor in the hollow portion and the end portion of the conductor. Projecting from the hollow portion.
  • a method of manufacturing an electronic component includes a step of forming a magnetic body having a hollow portion, and a dielectric layer, a plurality of solid electrolyte layers, and a plurality of lead layers on a surface of a conductor in that order.
  • the dielectric layer, the plurality of solid electrolyte layers and the plurality of lead layers are formed. Inserting the conductor into the hollow portion of the magnetic body, disposing the conductor in the hollow portion, and projecting the end portion of the conductor from the hollow portion.
  • the method of manufacturing the electronic component may further include a step of injecting a resin between the magnetic body and the conductor and bringing the injected resin into contact with the magnetic body and the conductor.
  • the magnetic body may include a first magnetic material and a second magnetic material different from the first magnetic material.
  • the degree of freedom in adjusting the arrangement of the dielectric layer and solid electrolyte layer is high.
  • the circuit form of the electronic component can be changed, and the degree of freedom in setting the circuit form can be increased.
  • the electronic component contains resin
  • the resin placed between the magnetic body and the conductor is in contact with the magnetic body and the conductor, so the resin functions as a cushioning material, and Mutual interference is suppressed. As a result, the vibration resistance of the electronic component is improved.
  • the resin that is in contact with the magnetic body and the conductor conducts heat generated in the conductor to the magnetic body, so that the heat of the conductor easily reaches the outer surface of the magnetic body. The heat dissipation is improved.
  • the inductor is formed by the magnetic substance and the conductor, and multiple capacitors are formed between the conductor and the multiple solid electrolyte layers.
  • An electronic component having a high degree of freedom and a high degree of freedom in adjusting these can be formed.
  • the electronic component has a plurality of types of reduction targets among reduction targets such as noise and overvoltage. Can be reduced, and the reduction function of the reduction target can be enhanced.
  • FIG. 1A shows an example of an electronic component according to the first embodiment
  • FIG. 1B conceptually shows a cross section of a conductor and a laminated portion included in the electronic component.
  • a part of the magnetic body 4 is omitted to show the inside of the electronic component.
  • the linear or rod-shaped conductor and the laminated portion are cut along the direction in which they extend.
  • the electronic component illustrated in FIG. 1 is an example, and the technology of the present disclosure is not limited to such an electronic component.
  • the electronic component 2 includes a magnetic body 4, a conductor 6, a laminated portion 8, a resist layer 10 and a lead conductor 12.
  • the magnetic body 4 has, for example, a tubular shape and has a hollow portion 13 inside.
  • the hollow portion 13 reaches the end of the cylinder of the magnetic body 4 and penetrates the inside of the magnetic body 4.
  • the conductor 6 is arranged in the hollow portion 13 of the magnetic body 4, protrudes from the hollow portion 13, and is exposed at the end portion of the magnetic body 4. That is, the conductor 6 penetrates the hollow portion 13 of the magnetic body 4.
  • the magnetic body 4 is linked to the conductor 6, and the magnetic body 4 and the conductor 6 form an inductor.
  • the laminated portion 8 is formed on the surface of the conductor 6.
  • the electronic component 2 functions as an LC electronic component having an inductor and a capacitance, and is used as, for example, a noise filter. That is, the electronic component 2 has an impedance different from the internal impedance of the noise source, and the electronic component 2 blocks noise due to impedance mismatch.
  • the interrupted noise current flows through the lead conductor 12 toward the ground.
  • the conductor 6 has, for example, a cylindrical shape, and the magnetic body 4 and the conductor 6 are coaxially arranged. That is, the central axis of the magnetic body 4 having a tubular shape is aligned with the central axis of the conductor 6. Therefore, in the cross section of the electronic component 2, the conductor 6, the laminated portion 8, and the magnetic body 4 form, for example, concentric circles. As a result, it is possible to obtain an inductor and a capacitor that are efficient and stable against the attenuation of signals such as noise. Further, by adjusting the length or thickness of the magnetic body 4, the inductance of the inductor formed can be adjusted. That is, the electronic component 2 has a high inductance adjusting function.
  • the magnetic body 4 is a foil having magnetism, for example, and is formed by winding a strip-shaped magnetic foil, for example.
  • the magnetic body 4 includes a magnetic material such as silicon steel, a soft magnetic crystal material, a nanocrystal material, an amorphous metal or an amorphous alloy.
  • the magnetic body 4 includes a magnetic material such as an iron-based amorphous material, a cobalt-based amorphous material, an iron-based nanocrystal material, an iron-nickel-based alloy, and an iron-silicon alloy.
  • Iron-based amorphous material is an example of iron-based amorphous metal or iron-based amorphous alloy, and is a material that is hard to magnetically saturate. Since the electronic component 2 including the iron-based amorphous material has the inductance even when the current is superimposed, the electronic component 2 can have the inductance while outputting the current.
  • the maximum current of the electronic component 2 including the iron-based amorphous material is, for example, 100 to 200 amperes, and the frequency of the electronic component 2 is, for example, 0 to 100 MHz.
  • the magnetic foil containing the iron-based amorphous material is thin, for example, 20 micrometers or about 20 micrometers, and thus the magnetic foil containing the iron-based amorphous material is suitable for winding the magnetic foil.
  • the magnetic permeability of the magnetic foil containing the iron-based amorphous material can be controlled in a wide range of 150 to 5000 [H/m] by heat treatment.
  • a magnetic foil containing an iron-based amorphous material has excellent availability and cost performance.
  • the cobalt-based amorphous material is an example of an amorphous metal or an amorphous alloy, and has a square BH curve (magnetic hysteresis curve) at high frequencies.
  • the maximum current of the electronic component 2 including the cobalt-based amorphous material is, for example, 100 to 200 amperes, and the electronic component 2 is suitable for, for example, a saturable coil, and is suitable for suppressing spike noise generated during switching of a semiconductor element. ..
  • the electronic component 2 including the cobalt-based amorphous material has a high impedance in a wide frequency range, for example, 0.01 to 30 MHz.
  • Magnetic foil containing cobalt-based amorphous material is suitable for winding magnetic foil.
  • a magnetic foil containing a cobalt-based amorphous material With a magnetic foil containing a cobalt-based amorphous material, a square BH curve is easily obtained by heat treatment, and a flat BH curve is easily obtained by magnetic field heat treatment in a direction perpendicular to the magnetic path. That is, the magnetic foil containing the cobalt-based amorphous material has a high ability to adjust the BH curve.
  • An iron-based nanocrystal material is an example of a nanocrystal material, which has a square BH curve at high frequencies, has a high saturation magnetic flux density, and can absorb high energy pulses.
  • the maximum current of the electronic component 2 including the iron-based nanocrystal material is, for example, 100 to 200 amperes, and the electronic component 2 is suitable for, for example, a saturable coil, and is suitable for suppressing spike noise generated during switching of a semiconductor element. There is. Further, the electronic component 2 including the iron-based nanocrystal material has a high impedance in a wide frequency range, for example, 0.01 to 30 MHz.
  • Magnetic foil containing iron-based nanocrystal material is suitable for winding magnetic foil.
  • a magnetic foil containing an iron-based nanocrystal material it is easy to obtain a square BH curve by magnetic field heat treatment, and it is easy to obtain a flat BH curve by magnetic field heat treatment in a direction perpendicular to the magnetic path. That is, the magnetic foil containing the iron-based nanocrystal material has a high ability to adjust the BH curve.
  • Magnetic foils containing iron-based nanocrystal materials have good availability and cost performance.
  • the iron-nickel alloy is an example of a soft magnetic crystal material, has a square BH curve, has a high saturation magnetic flux density, and can absorb high energy pulses.
  • the maximum current of the electronic component 2 containing the iron-nickel alloy is, for example, 100 to 200 amperes.
  • the electronic component 2 containing the iron-nickel alloy has a high impedance, and its frequency is, for example, 0.1 to 1 megahertz.
  • the magnetic foil containing the iron-nickel alloy has a high ability to adjust the BH curve.
  • Iron-silicon alloy is an example of silicon steel, and magnetic foil containing iron-silicon alloy is widely distributed in the market and has excellent availability and cost performance.
  • the magnetic body 4 has an insulating layer on the inner or outer surface of the foil, and the magnetic material is exposed on the other surface of the foil of the magnetic body 4.
  • the insulating layer insulates between the laminated foils of the magnetic body 4 in the laminating direction.
  • the insulating layer divides the eddy current generated by the noise current into each layer of the magnetic body 4, and efficiently converts the noise into heat.
  • the insulating layer has an insulating property and is, for example, an aggregate of nonmagnetic insulating powders.
  • the insulating layer is, for example, the following substances, (1) Sodium silicate, aluminosilicate alkali salt, phyllosilicate alkali salt, silicon carbide, calcium sulfate hemihydrate, potassium carbonate, magnesium carbonate, calcium carbonate, natural inorganic compounds such as barium sulfate, (2) Metal oxides such as aluminum oxide, boron oxide, magnesium oxide, silicon dioxide, tin dioxide, zinc oxide, zirconium dioxide, diantimony pentoxide, and titanium oxide, (3) Ceramics composed of complex oxides such as perovskite, silicate glass, phosphate, titanate, niobium, tantalum, and tungstate, aluminum nitride, aluminum oxynitride sintered body, boron nitride, magnesium boron nitride , Boron nitride composites, nitrides such as silicon nitride, lanthanum silicon nitride, sialon, etc., carb
  • the insulating layer may be a single material or a mixture of a plurality of materials.
  • the insulating layer is preferably an aggregate of powders of, for example, silicon dioxide, aluminum oxide, zirconium dioxide, diantimony pentoxide or titanium oxide.
  • the insulating layer may have an air layer between insulating powders. The air layer has an insulating property and can improve the insulating property of the insulating layer.
  • the magnetic foil is connected by spot welding or other welding, and the shape of the magnetic body 4 is maintained.
  • the conductor 6 is a linear member or a rod-shaped member that has conductivity and can be formed.
  • the conductor 6 is, for example, a wire or a rod of a valve metal such as aluminum, niobium, tantalum, titanium, hafnium, zirconium, zinc, or tungsten, preferably an aluminum wire or an aluminum rod.
  • the side surface of the conductor 6 is etched to increase the area of the side surface of the conductor 6.
  • the laminated portion 8 includes a dielectric layer 14 and an electrode layer 16.
  • the dielectric layer 14 has a dielectric property and is arranged between the conductor 6 and the electrode layer 16. Therefore, the conductor 6, the dielectric layer 14, and the electrode layer 16 form a capacitance.
  • the conductor 6 forms the first electrode of this capacitance and the electrode layer 16 forms the second electrode of this capacitance.
  • the first electrode may be, for example, an anode and may be a cathode
  • the second electrode may be, for example, a cathode and may be an anode.
  • the capacitance of the electronic component 2 can be adjusted by adjusting the formation area of the laminated portion 8, the surface area of the conductor 6 enlarged by etching, or the internal structure and thickness of the dielectric layer 14. That is, the electronic component 2 has a high-capacity adjusting function.
  • the dielectric layer 14 is formed by chemical conversion treatment of the conductor 6, for example.
  • this dielectric layer 14 is, for example, an aluminum oxide film. That is, the dielectric layer 14 is, for example, an oxide of the material existing on the surface of the conductor 6.
  • the dielectric layer 14 is arranged not only between the conductor 6 and the electrode layer 16 but also outside the electrode layer 16. However, in the present disclosure, a part of the dielectric layer 14 disposed between the conductor 6 and the electrode layer 16 is included in the laminated portion 8.
  • the electrode layer 16 has conductivity, and has, for example, a precoat layer 16-1, a solid electrolyte layer 16-2, a carbon layer 16-3, and a silver layer 16-4.
  • the precoat layer 16-1, the solid electrolyte layer 16-2, the carbon layer 16-3, and the silver layer 16-4 are the precoat layer 16-1, the solid electrolyte layer 16-2, and the carbon layer 16 from the dielectric layer 14 side. -3, and a silver layer 16-4 are laminated in this order.
  • the precoat layer 16-1 and the solid electrolyte layer 16-2 contain, for example, a conductive polymer such as PEDOT (poly(3,4-ethylenedioxythiophene)), and function as a solid electrolyte layer of a capacitor.
  • PEDOT poly(3,4-ethylenedioxythiophene
  • the carbon layer 16-3 contains carbon and the silver layer 16-4 contains silver.
  • the carbon layer 16-3 and the silver layer 16-4 form an extraction layer (for example, a cathode extraction layer).
  • the extraction layer has a function of electrically connecting to the solid electrolyte layer 16-2 and drawing electricity from the solid electrolyte layer 16-2.
  • the electrode layer 16 may include other layers and is formed of a part of the precoat layer 16-1, the solid electrolyte layer 16-2, the carbon layer 16-3, and the silver layer 16-4. Good.
  • the resist layer 10 is an example of a coating layer that partially and cylindrically covers the conductor 6, and is, for example, a resin such as an epoxy resin, a phenol resin, and an acrylic resin.
  • the resist layer 10 has a high resistance and blocks the passage of direct current.
  • the resist layer 10 is formed on the surface of the dielectric layer 14 on the conductor 6, for example, and is in contact with both ends of the laminated portion 8.
  • the resist layer 10 has the same height as the outer surface of the solid electrolyte layer 16-2, for example. Since the resist layer 10 has a high resistance, the resist layer 10, together with the dielectric layer 14, prevents the conductor 6 and the electrode layer 16 from being short-circuited in terms of direct current.
  • the resist layer 10 protects the surface of the dielectric layer 14 and regulates the formation range of the electrode layer 16.
  • the lead conductor 12 is a conductive foil or wire, for example, a copper foil or a copper wire. One end of the lead conductor 12 is connected to the extraction layer of the electrode layer 16 of the laminated portion 8 and the other end is extracted to the outside of the magnetic body 4.
  • the lead conductor 12 is arranged, for example, between the magnetic body 4 and the laminated portion 8 on the conductor 6, and is arranged along the inner surface of the magnetic body 4, the side surface of the conductor 6, and the laminated portion 8.
  • 2 and 3 show examples of equivalent circuits represented as electronic components and their distributed constant circuits.
  • 2A and 3A the front surface of the magnetic body 4 is omitted because the conductor 6, the laminated portion 8, and the resist layer 10 in the hollow portion 13 are shown.
  • the laminated portion 8 is entirely arranged in the hollow portion 13 of the magnetic body 4, but as shown in FIG. 3A, a part of the laminated portion 8 is separated from the magnetic body 4. It may be exposed. That is, a part of the solid electrolyte layer 16-2 relating to the position where the capacitance is formed is arranged outside the magnetic body 4.
  • Capacitors C1 and C2 are formed outside the inductor L in the outer portion of the magnetic body 4 surrounded by the broken line in A of FIG. 3B shows an equivalent circuit represented as a distributed constant circuit of the electronic component 2. Capacitance is formed outside the inductor at both ends of the magnetic body 4 and outside the magnetic body 4.
  • a ⁇ -type LC circuit can be formed.
  • a high frequency region such as a gigahertz region
  • the voltage of each portion of the laminated portion 8 changes with time and position, and the laminated portion 8 is divided in high frequency.
  • two capacitors can be formed in a circuit.
  • the circuit form such as the T-type LC circuit and the ⁇ -type LC circuit is selected depending on the situation of the noise source to which the electronic component 2 is connected, for example.
  • the electronic component 2 can be adapted to a plurality of circuit configurations by adjusting the arrangement position of the laminated portion 8 in the manufacturing process, particularly the arrangement positions of the dielectric layer 14 and the solid electrolyte layer 16-2, and depending on the impedance of the noise source. It has high circuit selectivity.
  • the circuit form of the electronic component 2 is, for example, T type or ⁇ . Can be changed to the type.
  • one end of the laminated portion 8 is arranged in the hollow portion 13 as shown in A of FIG. 2, and the other end of the laminated portion 8 is exposed from the magnetic body 4 as shown in A of FIG.
  • one end of the solid electrolyte layer 16-2 is disposed inside the hollow portion 13 and the other end is exposed from the magnetic body 4. Therefore, an L-type LC circuit (not shown) is formed.
  • an L-type LC circuit is formed even if the entire laminated portion 8 is exposed from the magnetic body 4. Since the conductor 6 projects from the hollow portion 13, the laminated portion 8, particularly the end portion of the dielectric layer 14 or the solid electrolyte layer 16-2 is arranged at a position exposed not only in the hollow portion 13 but also from the magnetic body 4. be able to. The degree of freedom of the arrangement position of the laminated portion 8 is high, and the electronic component 2 can support a plurality of circuit forms of the LC circuit. [Procedure for manufacturing electronic components]
  • FIGS. 4 and 5 show an example of a procedure for manufacturing an electronic component
  • FIGS. 6 and 7 show an example of a change in the surface of a conductor and a process of forming a laminated portion.
  • the electronic component manufacturing procedure is an example of an electronic component manufacturing method.
  • the manufacturing procedure of the electronic component, the change of the surface of the conductor, and the forming process of the laminated portion are examples, and the technique of the present disclosure is not limited by these procedures, changes, and processes.
  • the manufacturing procedure of the electronic component 2 includes an etching step, a dielectric layer forming step, a masking step, an electrode layer forming step, a dielectric layer repairing step, a resist layer forming step, an electrode forming step, and an aging step.
  • the electrode layer forming step includes a precoat layer forming step, a solid electrolyte layer forming step, and a lead layer forming step.
  • the extraction layer forming step includes a carbon layer forming step and a silver layer forming step.
  • the conductor 6 is immersed in an aqueous chloride solution. After that, a direct current or an alternating current is passed through the conductor 6 to etch the surface of the conductor 6.
  • a direct current or an alternating current is passed through the conductor 6 to etch the surface of the conductor 6.
  • the etched conductor 6 is immersed in a chemical conversion treatment solution such as ammonium adipate, ammonium dihydrogen phosphate, or an aqueous solution of ammonium borate. Then, a predetermined voltage is applied to the conductor 6 to form an oxide film (dielectric layer 14) on the surface of the conductor 6.
  • a chemical conversion treatment solution such as ammonium adipate, ammonium dihydrogen phosphate, or an aqueous solution of ammonium borate.
  • the solid electrolyte layer forming surface 22 is set on the side surface of the conductor 6. Then, the masking member 24 is attached to the side surface of the conductor 6 at a portion adjacent to the set solid electrolyte layer forming surface 22.
  • the masking member 24 covers the side surface of the conductor 6 in a portion adjacent to the solid electrolyte layer forming surface 22 and suppresses a layer formed in a later step from coming out from the solid electrolyte layer forming surface 22. Further, the layer protruding from the solid electrolyte layer forming surface 22 to the outside can be removed from the surface of the conductor 6 by removing the masking member 24.
  • the masking member 24 is, for example, a chemical resistant tape such as a polyimide tape.
  • the polyimide tape is not only excellent in chemical resistance, but also excellent in heat resistance and has excellent stability in heating and treatment involving chemicals.
  • the precoat layer 16-1 is formed on the solid electrolyte layer forming surface 22 of the conductor 6.
  • the conductor 6 with the masking member 24 is immersed in the chemical polymerization liquid 26.
  • the chemical polymerization liquid 26 has, for example, a monomer solution as the first liquid and an oxidizer solution as the second liquid.
  • the conductor 6 provided with the masking member 24 is dipped in, for example, a monomer solution and then, for example, in an oxidant solution.
  • the monomer solution and the oxidant solution cause chemical polymerization to form the precoat layer 16-1.
  • the monomer solution contains a monomer such as EDOT (3,4-ethylenedioxythiophene) and a solvent such as ethanol.
  • the oxidizing agent solution contains an oxidizing agent such as iron p-toluenesulfonate and a solvent such as ethanol.
  • the solvent may be any volatile solvent that can disperse the monomer or the oxidant, and is not limited to ethanol.
  • the monomer solution and the oxidant solution may be appropriately selected depending on the precoat layer 16-1 to be formed.
  • the precoat layer 16-1 is formed on the dielectric layer 14, as shown in FIG.
  • the precoat layer 16-1 may be formed by a method other than this precoat layer forming step, or the precoat layer 16-1 may be formed by applying and drying a dispersion liquid of a conductive polymer.
  • the solid electrolyte layer 16-2 is formed on the solid electrolyte layer forming surface 22.
  • the conductor 6 and the electrode 30 are immersed in the electrolytic polymerization liquid 28 and are connected to the positive electrode and the negative electrode of the DC power supply 32, respectively.
  • the electropolymerization liquid 28 contains a monomer such as EDOT, a supporting electrolyte, and a solvent such as water or acetonitrile.
  • Supporting electrolytes include, for example, ammonium borodisartylate and sodium butylnaphthalene sulfonate.
  • the electrolytic polymerization liquid 28 may be appropriately selected depending on the solid electrolyte layer 16-2 to be formed.
  • the solid electrolyte layer 16-2 is formed on the precoat layer 16-1 as shown in FIG. 7B.
  • the conductor 6 is connected to the positive electrode of the DC power supply 32 in this solid electrolyte layer forming step, the connection of the DC power supply 32 is not limited to such connection.
  • the precoat layer 16-1 may be connected to the positive electrode of the DC power supply 32 by a needle-shaped electrode such as a probe. It is preferable that the formed precoat layer 16-1 has sufficiently high conductivity.
  • the conductivity of the precoat layer 16-1 may be low and the direct current from the conductor 6 may not flow to the surface of the precoat layer 16-1.
  • the conductivity of the precoat layer 16-1 may be low and the direct current from the conductor 6 may not flow to the surface of the precoat layer 16-1.
  • the conductor 6 having the solid electrolyte layer 16-2 formed thereon is immersed in the chemical conversion treatment liquid 34. Then, a predetermined voltage is applied to the conductor 6 to restore the dielectric layer 14. After this dielectric layer restoration step, the masking member 24 is removed from the conductor 6.
  • a resist is applied to the surface of the conductor 6 adjacent to the solid electrolyte layer 16-2 and dried at 150 [° C.] for 15 minutes.
  • the resist layer 10 is formed outside the solid electrolyte layer 16-2.
  • the resist is a raw material of the resist layer 10 and is a liquid that is solidified by drying.
  • carbon paste is applied onto the solid electrolyte layer 16-2 and dried at 150 [° C.] for 15 minutes, for example. By drying the carbon paste, a carbon layer 16-3 is formed as shown in FIG. 5B. The carbon layer 16-3 is formed on the solid electrolyte layer 16-2, as shown in FIG. 7C.
  • a silver paste is applied on the carbon layer 16-3 and dried at 150[° C.] for 15 minutes, for example.
  • a silver layer 16-4 is formed as shown in FIG. 5C.
  • the silver layer 16-4 is formed on the carbon layer 16-3, as shown in FIG. 7D.
  • the lead conductor 12 is adhered to the silver layer 16-4 with a conductive paste, for example.
  • the conductive paste is dried at 150[° C.] for 15 minutes, for example.
  • the solid electrolyte layer 16-2 formed in the defective portion of the dielectric layer 14 is insulated by, for example, aging treatment.
  • a DC voltage is applied between the conductor 6 and the lead conductor 12.
  • the direct-current voltage is, for example, a voltage equal to or higher than the set maximum voltage of the electronic component 2.
  • the magnetic body 4 and the conductor 6 form an inductor, but since a capacitance is formed on the surface of the conductor 6, the component hardly expands due to the formation of the capacitance. Therefore, the electronic component 2 can be made smaller than an LC circuit including an inductor element and a capacitor element connected by wiring. Further, the installation area of the electronic component 2 on the circuit board can be made smaller than that of the LC circuit including the inductor element and the capacitor element.
  • the conductor 6 functions not only as the conductor part of the inductor but also as the first electrode of the capacitor, and since the inductor and the capacitor are connected, it is not necessary to connect the inductor and the capacitor by wiring, and the inductor and the capacitor are connected. The burden is reduced.
  • the connection between the inductor and the capacitance by the wiring may cause deterioration of characteristics such as self-resonance frequency characteristic and influence on surrounding electronic components due to parasitic capacitance generated in the wiring.
  • the electronic component 2 due to the absence of wiring, for example, the deterioration of the characteristics is small and the deterioration of the filter characteristics as the LC electronic component can be suppressed.
  • the electronic component 2 has higher robustness than an LC circuit including, for example, a substrate and an inductor element and a capacitive element arranged on the substrate.
  • the inductance of the electronic component 2 can be adjusted.
  • the capacitance of the electronic component 2 can be adjusted by adjusting the formation area of the laminated portion 8, the surface area of the conductor 6 enlarged by etching, or the internal structure and thickness of the dielectric layer 14.
  • the circuit form of the electronic component 2 can be changed by adjusting the arrangement position of the laminated portion 8. The degree of freedom in adjusting the inductance, capacitance, and circuit form is high, and the circuit of the electronic component 2 is highly flexible and flexible. Further, by adjusting the length of the magnetic body 4 and the formation area of the laminated portion 8, the electronic component 2 can have a practical inductance and capacitance, for example, as a noise filter, and is also practical.
  • the lead conductor 12 is arranged, for example, between the magnetic body 4 and the laminated portion 8 and is drawn out to the outside of the magnetic body 4. Therefore, the lead conductor 12 is not arranged in the radial direction of the magnetic body 4 from the inner surface to the outer surface of the magnetic body 4, and the lead conductor 12 interferes with the magnetic path of the magnetic body 4 (that is, the magnetic path is There is no interruption.
  • the break in the magnetic path causes a magnetic gap.
  • the magnetic gap may cause loss factors such as an increase in magnetic resistance, a decrease in magnetic permeability, a decrease in inductance, a leakage of magnetic flux, generation of an induced current in the surrounding conductive parts, and heat generation due to the leakage of magnetic flux. is there.
  • the heat generated by the magnetic body 4 may have a thermal effect on the solid electrolyte layer 16-2, and the leaked magnetic flux may have a magnetic effect on the solid electrolyte layer 16-2 such as malfunction.
  • the lead conductor 12 along the magnetic body 4 and the laminated portion 8 to avoid interruption of the magnetic path, this loss factor, thermal influence, and magnetic influence can be suppressed.
  • the leakage of the magnetic flux is suppressed, the overcurrent loss due to the leaked magnetic flux is suppressed, the AC loss of the magnetic body 4 is suppressed, and the equivalent series resistance (ESR) of the electronic component 2 can be suppressed.
  • ESR equivalent series resistance
  • FIG. 8 shows an example of the electronic component according to the second embodiment. 8, the same parts as those in FIG. 1 are designated by the same reference numerals.
  • 8B is a view of the electronic component viewed from the VIIIB direction shown in A of FIG.
  • FIG. 8C the front surfaces of the magnetic body 4 and the resin 44 are omitted to show the inside of the electronic component.
  • a space is formed between the magnetic body 4 and the conductor 6, the laminated portion 8 or the resist layer 10, but in the electronic component 42 of the second embodiment, A resin 44 is disposed between the magnetic body 4 and the conductor 6, the laminated portion 8 or the resist layer 10.
  • the end of the resin 44 may be positionally aligned with the end of the cylinder of the magnetic body 4 or may be different, as shown in FIG. 8C. Further, the resin 44 may be partially disposed between the magnetic body 4 and the conductor 6, the laminated portion 8 or the resist layer 10.
  • the arrangement is such that mutual interference between the conductor 6 and the magnetic body 4 is least likely to occur, and the heat generated in the conductor 6 is generated. It is arranged so that it is transmitted to the magnetic body 4 without any bias.
  • the resin 44 is a resin that cures from a liquid state, and is, for example, a thermoplastic resin, a thermosetting resin such as a silicone elastomer, or a resin that can be crosslinked with a curing agent.
  • the resin 44 is filled between the magnetic body 4 and the conductor 6, the laminated portion 8 or the resist layer 10 and then cured.
  • the resin 44 fixes the relative position of the conductor 6 to the magnetic body 4.
  • the resin 44 may be partially disposed between the magnetic body 4 and the conductor 6, the laminated portion 8 or the resist layer 10. Fixing the position of the conductor 6 improves the vibration resistance of the electronic component 42 and stabilizes the impedance of the electronic component 42.
  • the resin 44 may include a metal powder filler such as copper powder and aluminum powder.
  • the metal powder filler is an example of the heat transfer filler and has a higher thermal conductivity than the resin 44. When the metal powder filler is dispersed in the resin 44, the thermal conductivity of the resin 44 can be increased and the heat dissipation of the electronic component 42 can be improved.
  • the content of the metal powder filler is not limited, and the resin 44 may have conductivity.
  • the filler contained in the resin 44 may be a non-metal heat transfer filler having a higher thermal conductivity than the resin 44. Such a non-metal heat transfer filler can enhance the thermal conductivity of the resin 44 and enhance the heat dissipation of the electronic component 42.
  • the magnetic body 4, the conductor 6, the laminated portion 8, the resist layer 10 and the lead conductor 12 are the same as those in the first embodiment, and the description thereof will be omitted. [Filling of resin]
  • FIG. 9 shows an example of a conductor inserting step and a resin filling step in the electronic component manufacturing procedure.
  • the lead conductor 12 is omitted.
  • the front surface portion of the magnetic body 4 is omitted in FIG. 9B, and the front surface portions of the magnetic body 4 and the resin 44 are omitted in FIG. 9C.
  • the electronic component manufacturing procedure is an example of an electronic component manufacturing method.
  • the manufacturing procedure of the electronic component, the change of the surface of the conductor, and the forming process of the laminated portion are examples, and the technique of the present disclosure is not limited by these procedures, changes, and processes.
  • the conductor 6 to which the laminated portion 8, the resist layer 10 and the lead conductor 12 are attached is obtained by the same manufacturing procedure as in the first embodiment.
  • the conductor inserting step as shown in FIG. 9A, one end of the conductor 6 is inserted into the support hole 48 of the support base 46 to support the conductor 6 on the support base 46.
  • the magnetic body 4 is arranged around the conductor 6. That is, the conductor 6 is inserted into the hollow portion 13 of the magnetic body 4.
  • the support base 46 includes, for example, a positioning protrusion 50, and the position where the magnetic body 4 is arranged is adjusted by the positioning protrusion 50.
  • the center axis of the magnetic body 4 is adjusted to match the center axis of the conductor 6.
  • the resin filling step as shown in FIG. 9C, the resin 44 is filled between the magnetic body 4 and the conductor 6. After that, the resin 44 is hardened, and the magnetic body 4, the conductor 6 and the laminated portion 8 are bonded and fixed.
  • the magnetic body 4 may be placed on the support base 46, the conductor 6 may be inserted into the magnetic body 4, and one end of the conductor 6 may be inserted into the support hole 48 of the support base 46. .. Further, in the resin filling step, the resin 44 may be partially filled between the magnetic body 4 and the conductor 6.
  • the solid electrolyte layer 16-2 Since the solid electrolyte layer 16-2 is covered with the resin 44, the solid electrolyte layer 16-2 is shielded from the outside air. The moisture resistance of the capacitive element is improved, and stable capacitive characteristics are obtained. In addition, since the solid electrolyte layer 16-2 is covered with the resin 44, the solid electrolyte layer 16-2 is protected and deterioration of the solid electrolyte layer 16-2 is reduced and stable when an impact due to an external force is applied to the electronic component 42. The obtained capacitance characteristic is obtained.
  • the adhesive strength can be improved by covering the adhesive portion between the silver layer 16-4 and the lead conductor 12 with a resin.
  • FIG. 10 shows an example of an electronic component according to the third embodiment. 10, the same parts as those in FIG. 1 are designated by the same reference numerals.
  • the front surface of the magnetic body 4 is omitted to show the inside of the electronic component.
  • the electronic component 52 includes a magnetic body 4, a conductor 6, a plurality of laminated parts 8-1, 8-2, a plurality of resist layers 10 and a plurality of lead conductors 12.
  • the magnetic body 4, the conductor 6, the laminated portions 8-1 and 8-2, the resist layers 10 and the lead conductors 12 are respectively the magnetic body 4, the conductor 6, the laminated portion 8 and the resist layer of the first embodiment. 10 and the lead conductor 12 are similar.
  • the two laminated portions 8-1 and 8-2 are formed on the surface of the conductor 6, and the first capacitance is formed between the solid electrolyte layer of the laminated portion 8-1 and the conductor 6.
  • a second capacitor is formed between the solid electrolyte layer 8-2 and the conductor 6.
  • each lead conductor 12 is connected to one of the lead layers formed in the laminated portions 8-1 and 8-2.
  • one resist layer 10 is arranged between the two laminated parts 8-1 and 8-2.
  • two resist layers 10 are arranged between the two laminated parts 8-1 and 8-2, and each resist layer 10 is in contact with either end of the laminated parts 8-1 and 8-2. Good.
  • FIG. 11 and 12 show examples of equivalent circuits represented as electronic components and their distributed constant circuits.
  • the front surface of the magnetic body 4 is omitted because the conductor 6, the laminated portions 8-1, 8-2 and the resist layer 10 in the hollow portion 13 are shown.
  • a capacitance C31 is formed between the conductor 6 and the laminated portion 8-1, and a capacitance C32 is formed between the conductor 6 and the laminated portion 8-2.
  • the laminated portions 8-1 and 8-2 are all arranged in the hollow portion 13 of the magnetic body 4. That is, all the solid electrolyte layers 16-2 related to the formation positions of the first capacitance and the second capacitance are arranged inside the hollow portion 13 of the magnetic body 4. Therefore, at both ends of the magnetic body 4 surrounded by the broken line in FIG. 11A, the inductor L31 is formed outside the capacitance C31, and the inductor L33 is formed outside the capacitance C32.
  • the inductor L32 is formed between the laminated portion 8-1 and the laminated portion 8-2.
  • B of FIG. 11 shows an equivalent circuit represented as a distributed constant circuit of the electronic component 52. At both ends of the magnetic body 4, only inductors are formed. Therefore, by connecting the lead conductor 12 to each of the laminated portions 8-1 and 8-2 and pulling out the lead conductor 12 to the outside of the magnetic body 4, a ⁇ -type LC circuit having an inductor on the outside can be formed.
  • the laminated portions 8-1 and 8-2 are all disposed inside the hollow portion 13 of the magnetic body 4, but as shown in FIG. , 8-2 may be partially exposed from the magnetic body 4. That is, a part of the solid electrolyte layer 16-2 of the laminated portions 8-1 and 8-2 related to the formation positions of the first capacitance and the second capacitance is arranged outside the magnetic body 4.
  • capacitors C31 and C32 are formed outside the inductor L30.
  • 12B shows an equivalent circuit represented as a distributed constant circuit of the electronic component 52. At both ends of the magnetic body 4 and outside the magnetic body 4, capacitors C31 and C32 are formed outside the inductor L30.
  • a circuit form such as a ⁇ -type LC circuit having an inductor on the outside and a ⁇ -type LC circuit is selected depending on the situation of a noise source to which the electronic component 52 is connected.
  • the electronic component 52 can be adapted to a plurality of circuit configurations by adjusting the arrangement positions of the laminated parts 8-1 and 8-2, particularly the arrangement positions of the dielectric layer 14 and the solid electrolyte layer 16-2 in the manufacturing process, It has high circuit selectivity according to the impedance of the noise source.
  • the circuit form of the electronic component 52 can be obtained.
  • one end of the laminated portions 8-1 and 8-2 is arranged in the hollow portion 13 as shown in FIG. 11A, and the other end of the laminated portions 8-1 and 8-2 is As shown in FIG.
  • a ⁇ -type LC circuit having an inductor on one outside is formed.
  • the ⁇ -type LC circuit is formed even if the entire laminated portions 8-1 and 8-2 are exposed from the magnetic body 4. Since the conductor 6 projects from the hollow portion 13, the laminated portions 8-1 and 8-2, particularly the end portion of the dielectric layer 14 or the solid electrolyte layer 16-2, is not limited to the inside of the hollow portion 13 but also the magnetic body 4. It can be placed at a position exposed from. The degree of freedom in the arrangement position of the laminated portions 8-1 and 8-2 is high, and the electronic component 52 can support a plurality of LC circuit forms.
  • two capacitors that is, a first capacitor and a second capacitor are formed.
  • the capacitance values of the two capacitors are made different by adjusting the formation area of the laminated portions 8-1 and 8-2, the surface area of the conductor 6 enlarged by etching, or the internal structure and thickness of the dielectric layer 14. You can In the electronic component 52, for example, the formation area of the laminated portion 8-1 is smaller than the formation area of the laminated portion 8-2, and the first capacitance has a capacitance value smaller than the capacitance value of the second capacitance.
  • the resonance frequency of a capacitor is determined by the capacitance value of the capacitor. Specifically, the resonance frequency decreases as the capacitance value increases. At the resonant frequency, the impedance of the capacitance drops and current will pass through the capacitance.
  • an LC electronic component such as the electronic component 2, 42, or 52, when the lead conductor 12 is connected to the ground and the capacitance is grounded, a current having a resonance frequency flows to the ground through the capacitance and the current flowing in the conductor 6 is reduced. A current having a resonant frequency can be removed.
  • FIG. 13A shows an example of the individual impedance characteristics of the two capacitors formed in the electronic component 52
  • FIG. 13B shows an example of the impedance characteristics of the entire two capacitors formed in the electronic component 52. ing.
  • the impedance characteristics of the two capacitors are different, as shown in A of FIG.
  • the first capacitance resonates at the frequency f1
  • the impedance 54-1 of the first capacitance becomes the lowest at the frequency f1.
  • the second capacitance resonates at the frequency f2, and the impedance 54-2 of the second capacitance becomes the lowest at the frequency f2.
  • the frequencies f1 and f2 are examples of resonance frequencies.
  • the impedance due to the capacitance of the electronic component 52 has an impedance of 54-1 at each frequency as shown by the solid line in B of FIG. , 54-2, which is the lower impedance. Since the electronic component 52 has capacitances having different capacitance values, the electronic component 52 can have a characteristic in which the characteristics of these capacitances are combined. As a result, the electronic component 52 can attenuate a signal such as noise in a wider frequency band than an LC circuit having one capacitance or an LC circuit having two capacitances having the same capacitance value.
  • the frequency f1 is inversely proportional to ⁇ C F when the first capacitance is C F
  • the frequency f2 is inversely proportional to ⁇ C S when the second capacitance is C S. That is, there is a fixed relationship between frequency and capacity. Therefore, when the frequencies f1 and f2 are set according to the frequency band of noise to be reduced, the capacitance values of the first capacitance and the second capacitance are determined. The first capacitance and the second capacitance are adjusted so as to have a predetermined capacitance value, for example.
  • the ratio of the first capacitance and the second capacitance is 10 or more (that is, 1:10 or more, or 10 or more: 1), preferably the first capacitance. If the ratio of the first capacitance to the second capacitance is 100 or more, the frequency band in which a signal such as noise is attenuated is widened, which is preferable. For example, if one of the first capacitance and the second capacitance is 0.01 to 2.0 [ ⁇ F] and the other is 1.0 to 100 [ ⁇ F], approximately 100 [kHz] to 100 [MHz] ], the amount of signal attenuation such as noise can be increased. [Procedure for manufacturing electronic components]
  • the electronic component manufacturing procedure is an example of an electronic component manufacturing method.
  • the manufacturing procedure of the electronic component, the change of the surface of the conductor, and the forming process of the laminated portion are examples, and the technique of the present disclosure is not limited by these procedures, changes, and processes.
  • the manufacturing procedure of the electronic component 52 includes an etching step, a dielectric layer forming step, a masking step, an electrode layer forming step, a dielectric layer repairing step, a resist layer forming step, an electrode forming step, and an aging step.
  • the electrode layer forming step includes a precoat layer forming step, a solid electrolyte layer forming step, and a lead layer forming step.
  • the extraction layer forming step includes a carbon layer forming step and a silver layer forming step.
  • the etching process and the dielectric layer forming process are respectively the same as the etching process and the dielectric layer forming process described in the first embodiment.
  • solid electrolyte layer forming surfaces 22-1 and 22-2 are set on the side surfaces of the conductor 6.
  • the lengths of the solid electrolyte layer forming surfaces 22-1 and 22-2 are set according to desired capacities.
  • the size of the capacitance formed between the conductor 6 and the solid electrolyte layer 16-2 is influenced by the area of the conductor 6 facing the solid electrolyte layer 16-2.
  • the surfaces of the conductors 6 are etched under the same conditions, so that the magnifications of the surfaces of the solid electrolyte layer forming surfaces 22-1 and 22-2 are substantially equal.
  • the masking member 24 described in the first embodiment is attached to the side surface of the conductor 6.
  • the precoat layer 16-1 is formed on the solid electrolyte layer forming surfaces 22-1 and 22-2 of the conductor 6.
  • the precoat layer 16-1 can be formed by the precoat layer forming step described in the first embodiment.
  • the solid electrolyte layer 16-2 is formed on the solid electrolyte layer forming surfaces 22-1 and 22-2.
  • the solid electrolyte layer 16-2 can be formed by the solid electrolyte layer forming step described in the first embodiment.
  • the dielectric layer 14 is repaired by the dielectric layer repairing step described in the first embodiment. After this dielectric layer restoration step, the masking member 24 is removed from the conductor 6.
  • the resist layer 10 is formed outside the solid electrolyte layer 16-2 as shown in FIG. 15A by the resist layer forming step described in the first embodiment.
  • the carbon layer 16-3 is formed as shown in FIG. 15B by the carbon layer forming step described in the first embodiment.
  • the silver layer 16-4 is formed as shown in C of FIG. 15 by the silver layer forming step described in the first embodiment.
  • the lead conductor 12 is bonded to the silver layer 16-4 with a conductive paste, for example.
  • the conductive paste is dried at 150[° C.] for 15 minutes, for example.
  • a space is formed between the magnetic body 4 and the conductor 6, the laminated portions 8-1, 8-2 or the resist layer 10, but the resin 44 may be arranged.
  • the positions of the laminated parts 8-1 and 8-2 may be adjusted appropriately.
  • the laminated portions 8-1 and 8-2 may be arranged in the magnetic body 4, or a part or the whole of the laminated portions 8-1 and 8-2 may be exposed from the magnetic body 4.
  • the two laminated portions 8-1 and 8-2 are formed, but three or more laminated portions may be formed.
  • the same effect as that of the first embodiment can be obtained, and signals such as noise can be attenuated in a wide frequency band by the first capacitance and the second capacitance. .. Fourth embodiment
  • FIG. 16 shows an example of the electronic component according to the fourth embodiment.
  • 16B is a diagram of the electronic component viewed from the XVIB direction shown in A of FIG.
  • FIG. 16C the front surfaces of the magnetic body 4 and the resin 8 are omitted to show the inside of the electronic component. 16, the same parts as those in FIG. 1 or 8 are designated by the same reference numerals.
  • the electronic component 62 includes the magnetic body 4, the conductor 6, and the resin 44.
  • the magnetic body 4 and the conductor 6 are the same as those in the first embodiment, the second embodiment, or the third embodiment, and the description thereof will be omitted.
  • the resin 44 is the same as that of the second embodiment, and its explanation is omitted.
  • the magnetic body 4 is linked to the conductor 6, and the magnetic body 4 and the conductor 6 form an inductor.
  • the electronic component 62 has an inductor and is used as a noise filter, for example. In the electronic component 62, a voltage is applied to the two ends of the conductor 6.
  • the dielectric layer 14 described above is formed on the surface of the conductor 6, and the precoat layer 16-1 and the solid electrolyte layer 16-2 described above are formed on the surface of the dielectric layer 14, and the solid electrolyte layer 16-2.
  • the extraction layer described above is electrically connected to the capacitor to form a capacitor.
  • the dielectric layer 14, the precoat layer 16-1, the solid electrolyte layer 16-2 and the lead layer form the above-mentioned laminated portion 8.
  • the electronic component 62 can be obtained by the same manufacturing procedure as the electronic component 42 of the second embodiment, omitting the formation of the resist layer 10 and the lead conductor 12.
  • the conductor 6 may be a conductive linear member or a rod-shaped member, for example, a wire or rod of a low-resistance member such as copper or silver.
  • the conductor 6 may be copper wire or rod-shaped copper.
  • the conductor 6 may be a conductive foil, or may be formed into a tubular shape by winding a strip-shaped conductive foil. Then, the laminated portion 8 may be omitted.
  • FIG. 17 shows an example of an electronic component according to the fifth embodiment. 17, the same parts as those in FIG. 1, FIG. 8, FIG. 10 or FIG. 17B is a diagram of the electronic component viewed from the XVIIB direction shown in A of FIG. In FIG. 17C, the front surfaces of the magnetic body 4 and the resin 44 are omitted to show the inside of the electronic component.
  • the resin 44 is disposed between the magnetic body 4 and the conductor 6, the laminated portions 8-1, 8-2 or the resist layer 10.
  • the electronic component 72 includes a magnetic body 4, a conductor 6, a plurality of laminated portions 8-1 and 8-2, a plurality of resist layers 10, a plurality of lead conductors 12 and a resin 44.
  • the magnetic body 4, the conductor 6, the laminated portions 8-1 and 8-2, the plurality of resist layers 10 and the plurality of lead conductors 12 are the same as those in the third embodiment, and the description thereof is omitted.
  • the resin 44 is the same as in the second and fourth embodiments, and the description thereof is omitted.
  • the electronic component 72 similarly to the electronic component 52 of the third embodiment, two capacitors, that is, a first capacitor and a second capacitor are formed. Further, when the electronic component 72 has capacitances having different capacitance values, the electronic component 72 can have a characteristic in which the characteristics of these capacitances are combined. As a result, the electronic component 72 can attenuate a signal such as noise in a wider frequency band than an LC circuit having one capacitance or an LC circuit having two capacitances having the same capacitance value.
  • the capacity of the electronic component 72 is adjusted, for example, similarly to the electronic component 52 of the third embodiment.
  • the end of the resin 44 may be positionally aligned with the end of the cylinder of the magnetic body 4 as shown in FIG. 17C, or may be different. Further, the resin 44 may be partially disposed between the magnetic body 4 and the conductor 6, the laminated portions 8-1, 8-2 or the resist layer 10. Due to the arrangement of the resin 44, as shown in FIG. 17B, the magnetic body 4 and the conductor 6 are arranged and fixed, for example, in a concentric or substantially concentric shape. [Procedure for manufacturing electronic components]
  • the conductor 6 to which the laminated portions 8-1 and 8-2, the resist layer 10 and the lead conductor 12 are attached is obtained.
  • the conductor inserting step and the resin filling step are performed in the same manner as in the second embodiment, for example.
  • FIG. 18 shows an example of an electronic component according to the sixth embodiment.
  • 18B is a view of the electronic component viewed from the XVIIIB direction shown in A of FIG.
  • FIG. 18C the front surface of the magnetic body 4 is omitted to show the inside of the electronic component.
  • the same parts as those in FIG. 1 are designated by the same reference numerals.
  • the electronic component 82 includes the magnetic body 4 and the conductor 6.
  • the magnetic body 4 has, for example, a tubular shape and has a hollow portion 13 inside.
  • the hollow portion 13 reaches the end of the cylinder of the magnetic body 4 and penetrates the inside of the magnetic body 4.
  • the conductor 6 is arranged in the hollow portion 13 of the magnetic body 4, protrudes from the hollow portion 13, and is exposed at the end portion of the magnetic body 4. That is, the conductor 6 penetrates the hollow portion 13 of the magnetic body 4.
  • the magnetic body 4 is linked to the conductor 6, and the magnetic body 4 and the conductor 6 form an inductor.
  • the electronic component 82 has an inductor and is used as, for example, a noise filter. In the electronic component 82, a voltage is applied to the two ends of the conductor 6.
  • the conductor 6 has, for example, a cylindrical shape, and the magnetic body 4 and the conductor 6 are coaxially arranged. That is, the central axis of the magnetic body 4 having a tubular shape is aligned with the central axis of the conductor 6. Therefore, in the cross section of the electronic component 82, the conductor 6 and the magnetic body 4 form, for example, concentric circles. As a result, it is possible to obtain an inductor that is efficient and stable against the attenuation of signals such as noise. Further, by adjusting the length or thickness of the magnetic body 4, the inductance of the inductor formed can be adjusted. That is, the electronic component 82 has a high inductance adjusting function. A dielectric layer is formed on the surface of the conductor 6, a solid electrolyte layer is formed on the surface of the dielectric layer, and a lead layer is electrically connected to the solid electrolyte layer to form a capacitance.
  • the magnetic body 4 includes a first magnetic body 4-1 containing a first magnetic material and a second magnetic body 4-2 containing a second magnetic material.
  • the first magnetic body 4-1 is arranged, for example, next to the second magnetic body 4-2.
  • the first magnetic material and the second magnetic material are arranged adjacent to each other.
  • the first magnetic body 4-1 and the second magnetic body 4-2 have, for example, a cylindrical shape, and the ends of the first magnetic body 4-1 have a joining means such as an adhesive or spot welding. May be joined to the end of the cylinder of the second magnetic body 4-2.
  • the first magnetic body 4-1 has a part of the hollow portion 13, and the second magnetic body 4-2 has another part of the hollow portion 13.
  • the first magnetic body 4-1 and the conductor 6 form a first inductor
  • the second magnetic body 4-2 and the conductor 6 form a second inductor. Therefore, in the electronic component 82, as shown in FIG. 19, for example, the first inductor L61 and the second inductor L62 are connected in series. In the circuit shown in FIG. 19, the capacitor formed on the surface of the conductor 6 is omitted.
  • the first magnetic material and the second magnetic material are different magnetic materials, so that the first magnetic body 4-1 and the second magnetic body 4-2 have different magnetic characteristics (for example, magnetic permeability characteristics). ), the first inductor L61 and the second inductor L62 have different inductance characteristics. Therefore, the electronic component 82 can reduce a plurality of types of reduction targets among reduction targets such as noise and overvoltage.
  • the first inductor L61 reduces overvoltage and the second inductor L62 reduces noise.
  • Overvoltage is a high voltage (eg, 20-30 volts) that can occur momentarily when the voltage of the power supply (eg, 12 volts) fluctuates.
  • the electronic component 82 may reduce a plurality of reduction targets among the reduction targets of the same type. In the electronic component 82, the degree of freedom in adjusting functions such as noise cutting is increased.
  • the first magnetic body 4-1 and the second magnetic body 4-2 are foils having magnetism, for example, and are formed by winding a strip-shaped magnetic foil.
  • the first magnetic body 4-1 and the second magnetic body 4-2 are magnetic materials such as silicon steel, soft magnetic crystal material, nanocrystal material, amorphous metal or amorphous alloy described in the first embodiment. including.
  • the first magnetic body 4-1 and the second magnetic body 4-2 are, for example, the iron-based amorphous material, the cobalt-based amorphous material, the iron-based nanocrystal material, and the iron-nickel-based material described in the first embodiment. It may be a magnetic material such as an alloy or an iron-silicon alloy.
  • the magnetic material is determined according to, for example, the function, purpose or characteristic of the first inductor or the second inductor.
  • the magnetic body 4 is formed of, for example, a magnetic foil made of a magnetic material having a high magnetic permeability such as a cobalt-based amorphous material and a magnetic foil made of a magnetic material such as an iron-based amorphous material, a large current and a low current can be obtained. Inductance can be secured regardless of which of the two flows. In other words, a magnetic material made of an iron-based amorphous material can secure an inductance when a large current flows, and a magnetic material made of a cobalt-based amorphous material makes a coil using only an iron-based amorphous material when a low current flows. Higher inductance can be secured. Moreover, when a plurality of magnetic materials differ in frequency characteristics of magnetic permeability, it is possible to suppress signals such as noise in frequency bands in which the magnetic materials differ.
  • the magnetic bodies 4-1 and 4-2 have the insulating layer described in the first embodiment on the inner surface or the outer surface of the foil, and on the other surface of the foil of the magnetic bodies 4-1 and 4-2. , The magnetic material is exposed.
  • the insulating layer insulates between the laminated foils of the magnetic bodies 4-1 and 4-2 in the laminating direction.
  • the insulating layer divides the eddy current generated by the noise current into the layers of the magnetic bodies 4-1 and 4-2, and efficiently converts the noise into heat.
  • the magnetic foils are connected by spot welding or other welding so that the shapes of the magnetic bodies 4-1, 4-2 are maintained.
  • the conductor 6 is the same as the conductor 6 of the fourth embodiment, and the description thereof is omitted.
  • the electronic component 82 is formed as follows, for example. (1) A magnetic foil is wound to form a first magnetic body 4-1 and a second magnetic body 4-2. (2) The conductor 6 is inserted into the hollow portions 13 of the first magnetic body 4-1 and the second magnetic body 4-2.
  • the electronic component 82 can have a plurality of inductance characteristics, and the degree of freedom in adjusting functions such as noise cut can be increased.
  • the electronic component 82 can reduce a plurality of types of reduction targets among reduction targets such as noise and overvoltage, and can enhance the function of reducing the reduction targets of the electronic component 82.
  • the electronic component 82 can reduce, for example, noise and overvoltage. For example, while protecting the capacitance provided in the electronic component 82 from overvoltage, noise can be reduced together with the capacitance. Seventh embodiment
  • FIG. 20 shows an example of an electronic component according to the seventh embodiment.
  • a part of the magnetic body 4 is omitted to show the inside of the electronic component.
  • the same parts as those in FIG. 1 or 18 are designated by the same reference numerals.
  • the electronic component illustrated in FIG. 20 is an example, and the technology of the present disclosure is not limited to the electronic component.
  • the electronic component 92 includes the magnetic body 4, the conductor 6, the laminated portion 8, the resist layer 10, and the lead conductor 12. Since the magnetic body 4 and the conductor 6 are the same as those in the sixth embodiment, their description will be omitted.
  • the laminated portion 8, the resist layer 10 and the lead conductor 12 are the same as those in the first embodiment, and their explanations are omitted.
  • the conductor 6 is arranged in the hollow portion 13 of the magnetic body 4 and protrudes from the hollow portion 13 as in the sixth embodiment. With such a configuration, the magnetic body 4 is linked to the conductor 6, and the magnetic body 4 and the conductor 6 form an inductor.
  • the laminated portion 8 is formed on the surface of the conductor 6.
  • a capacitance is formed between the solid electrolyte layer 16-2 of the laminated portion 8 and the conductor 6. Therefore, the electronic component 92 functions as an LC electronic component having an inductor and a capacitance, and is used as, for example, a noise filter. That is, the electronic component 92 has an impedance different from the internal impedance of the noise source, and the electronic component 92 blocks noise due to impedance mismatch.
  • the interrupted noise current flows through the lead conductor 12 toward the ground.
  • the magnetic body 4 and the conductor 6 are arranged coaxially, and the conductor 6, the laminated portion 8 and the magnetic body 4 form, for example, concentric circles in the cross section of the electronic component 92.
  • the inductance of the inductor formed can be adjusted. That is, the electronic component 92 has a high inductance adjusting function.
  • the conductor 6 is the same as the conductor 6 of the sixth embodiment, but is preferably a linear member or rod member that can be formed.
  • the conductor 6 is, for example, a valve metal wire or rod, preferably an aluminum wire or aluminum rod.
  • the side surface of the conductor 6 is etched, for example, to increase the area of the side surface of the conductor 6.
  • FIG. 21 and 22 show an example of an equivalent circuit represented as an electronic component and its distributed constant circuit.
  • the conductor 6, the laminated portion 8, and the resist layer 10 in the hollow portion 13 are shown, and thus the front surface portion of the magnetic body 4 is omitted.
  • the laminated portion 8 is entirely arranged in the hollow portion 13 of the magnetic body 4. That is, the solid electrolyte layer 16-2 relating to the position where the capacitance is formed is all arranged in the hollow portion 13 of the magnetic body 4. Therefore, the inductors L71 and L72 are formed outside the capacitor C70 at both end portions of the magnetic body 4 surrounded by the broken line in A of FIG. 21B shows an equivalent circuit represented as a distributed constant circuit of the electronic component 92. At both ends of the magnetic body 4, only inductors are formed. Therefore, when the lead conductor 12 is connected to the laminated portion 8 and the lead conductor 12 is pulled out to the outside of the magnetic body 4, a T-type LC circuit can be formed. Since the first magnetic body 4-1 is related to the formation of the inductor L71, the inductor L71 reduces the overvoltage, for example. The inductor L72 reduces noise, for example.
  • the electronic component 92 of FIG. 21A all the laminated portions 8 are arranged inside the hollow portion 13 of the magnetic body 4, but as shown in FIG. It may be exposed. That is, a part of the solid electrolyte layer 16-2 relating to the position where the capacitance is formed is arranged outside the magnetic body 4. In the outer portion of the magnetic body 4 surrounded by the broken line in A of FIG. 22, capacitors C71 and C72 are formed outside the inductors L71 and L72. 22B shows an equivalent circuit represented as a distributed constant circuit of the electronic component 92. A capacitance is formed outside the inductor outside the magnetic body 4.
  • a ⁇ -type LC circuit can be formed.
  • a high frequency region such as a gigahertz region
  • the voltage of each portion of the laminated portion 8 changes with time and position, and the laminated portion 8 is divided in high frequency.
  • two capacitors can be formed in a circuit. Since the first magnetic body 4-1 is related to the formation of the inductor L71, the inductor L71 reduces the overvoltage, for example.
  • the inductor L72 reduces noise, for example.
  • Circuit types such as the T-type LC circuit and the ⁇ -type LC circuit are selected depending on the situation of the noise source to which the electronic component 92 is connected.
  • the electronic component 92 can be adapted to a plurality of circuit configurations by adjusting the arrangement position of the laminated portion 8, particularly the arrangement positions of the dielectric layer 14 and the solid electrolyte layer 16-2 in the manufacturing process, and can be adapted to the impedance of the noise source. It has high circuit selectivity.
  • the circuit form of the electronic component 92 can be, for example, T type or ⁇ . Can be changed to the type.
  • the degree of freedom in the arrangement position of the laminated portion 8 is high, and the electronic component 92 can support a plurality of circuit forms of the LC circuit.
  • the manufacturing procedure of the electronic component 92 includes an etching step, a dielectric layer forming step, a masking step, an electrode layer forming step, a dielectric layer repairing step, a resist layer forming step, an electrode forming step, and an aging step. including.
  • the etching step, the dielectric layer forming step, the masking step, the electrode layer forming step, the dielectric layer repairing step, the resist layer forming step, the electrode forming step, and the aging step are the same as those in the first embodiment, and the description thereof will be omitted. Omit it.
  • the procedure for manufacturing the electronic component 92 further includes a conductor inserting step.
  • the electronic component 92 is obtained, for example, as follows. (1) A magnetic foil is wound to form a first magnetic body 4-1 and a second magnetic body 4-2. (2) The conductor 6 is inserted into the hollow portions 13 of the first magnetic body 4-1 and the second magnetic body 4-2.
  • FIG. 23 shows an example of the electronic component according to the eighth embodiment.
  • the same parts as those in FIG. 1, FIG. 8, FIG. 18 or FIG. 23B is a diagram of the electronic component viewed from the XXIIIB direction shown in A of FIG.
  • FIG. 23C the front surfaces of the magnetic body 4 and the resin 44 are omitted to show the inside of the electronic component.
  • a space is formed between the magnetic body 4 and the conductor 6, the laminated portion 8 or the resist layer 10.
  • the resin 44 is arranged between the magnetic body 4 and the conductor 6, the laminated portion 8 or the resist layer 10.
  • the end portion of the resin 44 may be positionally aligned with the end portion of the cylinder of the magnetic body 4 as shown in C of FIG. 23, or may be different. Further, the resin 44 may be partially disposed between the magnetic body 4 and the conductor 6, the laminated portion 8 or the resist layer 10.
  • the resin 44 is the same as that of the second embodiment, and its explanation is omitted.
  • the magnetic body 4, the conductor 6, the laminated portion 8, the resist layer 10 and the lead conductor 12 are the same as those in the seventh embodiment, and the description thereof will be omitted.
  • the conductor 6 to which the laminated portion 8, the resist layer 10 and the lead conductor 12 are attached is obtained by the same manufacturing procedure as in the seventh embodiment.
  • the conductor inserting step and the resin filling step are performed in the same manner as in the second embodiment, for example.
  • FIG. 24 shows an example of the electronic component according to the ninth embodiment.
  • the same parts as those in FIG. 10, FIG. 18 or FIG. the front surface of the magnetic body 4 is omitted to show the inside of the electronic component.
  • the electronic component 112 includes a magnetic body 4, a conductor 6, a plurality of laminated portions 8-1, 8-2, a plurality of resist layers 10 and a plurality of lead conductors 12.
  • the magnetic body 4, the conductor 6, the laminated portions 8-1 and 8-2, the resist layers 10 and the lead conductors 12 are the magnetic body 4, the conductor 6, the laminated portion 8 and the resist layer of the seventh embodiment, respectively. 10 and the lead conductor 12 are similar.
  • the two laminated portions 8-1 and 8-2 are formed on the surface of the conductor 6, and the first capacitance is formed between the solid electrolyte layer of the laminated portion 8-1 and the conductor 6.
  • a second capacitor is formed between the solid electrolyte layer 8-2 and the conductor 6.
  • each lead conductor 12 is connected to one of the lead layers formed in the laminated portions 8-1 and 8-2.
  • one resist layer 10 is arranged between the two laminated parts 8-1 and 8-2.
  • two resist layers 10 are arranged between the two laminated parts 8-1 and 8-2, and each resist layer 10 is in contact with either end of the laminated parts 8-1 and 8-2. Good.
  • two capacitors that is, a first capacitor and a second capacitor, are formed as in the electronic component 52 of the third embodiment and the electronic component 72 of the fifth embodiment.
  • the capacitance values of the two capacitors are made different by adjusting the formation area of the laminated portions 8-1 and 8-2, the surface area of the conductor 6 enlarged by etching, or the internal structure and thickness of the dielectric layer 14. You can In the electronic component 112, for example, the formation area of the laminated portion 8-1 is smaller than the formation area of the laminated portion 8-2, and the first capacitance has a capacitance value smaller than the capacitance value of the second capacitance.
  • the individual impedance characteristics of the two capacitors formed in the electronic component 112 are the same as, for example, the electronic component 52 of the third embodiment, so the description thereof will be omitted.
  • the ratio of the first capacitance and the second capacitance is 10 or more (that is, 1:10 or more, or 10 or more: 1), preferably the first capacitance. If the ratio of the first capacitance to the second capacitance is 100 or more, the frequency band in which a signal such as noise is attenuated is widened, which is preferable. For example, if one of the first capacitance and the second capacitance is 0.01 to 2.0 [ ⁇ F] and the other is 1.0 to 100 [ ⁇ F], approximately 100 [kHz] to 100 [MHz] ], the amount of signal attenuation such as noise can be increased.
  • a space is formed between the magnetic body 4 and the conductor 6, the laminated portions 8-1, 8-2 or the resist layer 10, but the resin 44 may be arranged.
  • the positions of the laminated parts 8-1 and 8-2 may be adjusted appropriately.
  • the laminated portions 8-1 and 8-2 may be arranged in the magnetic body 4, or a part or the whole of the laminated portions 8-1 and 8-2 may be exposed from the magnetic body 4.
  • two laminated parts 8-1 and 8-2 are formed, but three or more laminated parts may be formed.
  • the same effects as those of the sixth and seventh embodiments can be obtained, and noise such as noise in a wide frequency band can be obtained by the first capacitance and the second capacitance.
  • the signal can be attenuated.
  • the conductor 6 has, for example, a valve metal wire, rod, or plate shape.
  • the conductor 6 may have a circular or rectangular cross section.
  • the conductor 6 is not limited to a single member such as an aluminum wire or an aluminum rod.
  • the conductor 6 includes a low resistance member such as copper and silver and a valve metal film formed on the surface of the low resistance member, and may be formed of a plurality of materials.
  • the conductor 6 formed of a plurality of materials has a low resistance value due to the low resistance member and can be formed by the valve metal film. Since the resistance value of the conductor 6 is low, heat generation in the conductor 6 can be suppressed even if a large direct current flows, for example.
  • the magnetic body 4 is formed by winding a strip-shaped magnetic foil, but it may be a sintered body of a magnetic material, for example. If the magnetic body 4 has magnetism, the electronic components 2, 42, 52, 62, 72, 82, 92, 102, 112 can have inductance.
  • the masking member 24 is removed from the conductor 6. After that, the resist layer 10 is formed. However, the removal of the masking member 24 and the formation of the resist layer 10 may be omitted, and the carbon layer 16-3 and the silver layer 16-4 may be formed with the masking member 24 attached to the conductor 6.
  • the masking member 24 is in close contact with the precoat layer 16-1 and the solid electrolyte layer 16-2, the penetration of the carbon layer 16-3 or the silver layer 16-4 is suppressed and the carbon layer 16-3 or the silver layer 16-. It is suppressed that 4 is short-circuited with the conductor 6.
  • the masking member 24 may or may not be removed after the silver layer 16-4 is formed.
  • the resist layer 10 is omitted and the manufacturing load can be reduced. Further, the resist layer 10 may be formed in place of the masking member 24 in the precoat layer formation step to the dielectric layer restoration step. That is, the precoat layer 16-1, the solid electrolyte layer 16-2, the carbon layer 16-3, and the silver layer 16-4 may be formed after forming the resist layer 10 on the portion of the conductor 6 to which the masking member 24 is attached. ..
  • the electronic components 2, 42, 52, 62, 72, 82, 92, 102, 112 are provided with one magnetic body 4 and one conductor 6.
  • the electronic component 122 includes a plurality of magnetic bodies 4 (for example, two magnetic bodies 4) and one conductor 6, and one conductor 6 is provided in the hollow portion 13 of the plurality of magnetic bodies 4. It may be arranged and protrude from the hollow portion 13. Similar to the first embodiment, the laminated portion 8 and the resist layer 10 are formed on the surface of the conductor 6, and the lead conductor 12 is connected to the laminated portion 8. As a result, the electronic component 122 has a plurality of electronic components 2 (for example, two electronic components 2) connected in series.
  • Each electronic component 2 is the same as the electronic component 2 described in the first embodiment.
  • the equivalent circuit represented by the distributed constant circuit of the electronic component 122 is represented by connecting in series the equivalent circuit represented by the distributed constant circuit shown in FIG. 2B or FIG. 3B.
  • the plurality of electronic components 2 are integrally formed, and it is not necessary for the substrate and the connection wiring to connect between the electronic components 2.
  • the electronic component 122 including the plurality of electronic components 2 can remove noise in a wide frequency band or remove noise in a plurality of frequency bands, for example.
  • the electronic component 122 may include the electronic components 42, 52, 62, 72 described in the second to fifth embodiments instead of the electronic components 2.
  • the electronic components Even if the electronic components are replaced, a plurality of electronic components are integrally formed, and it is not necessary for the substrate and the connection wiring to connect the electronic components. Even if the electronic component is replaced, the electronic component 122 can remove noise in a wide frequency band or remove noise in a plurality of frequency bands.
  • the electronic component 132 includes a plurality of magnetic bodies 4 (for example, two magnetic bodies 4) in which each magnetic body 4 includes the magnetic bodies 4-1 and 4-2 and one conductor 6.
  • each magnetic body 4 includes the magnetic bodies 4-1 and 4-2 and one conductor 6.
  • one conductor 6 may be disposed in the hollow portions 13 of the plurality of magnetic bodies 4 and project from the hollow portions 13.
  • the conductor 6 is bent at 90 degrees in two places so that both ends of the conductor 6 are parallel to each other. Further, the two magnetic bodies 4 are arranged so that the hollow portions 13 thereof are parallel to each other. Then, both ends of the conductor 6 are inserted into the hollow portions 13 of the two magnetic bodies 4 to form the electronic component 132. Similar to the seventh embodiment, the laminated portion 8 and the resist layer 10 are formed on the surface of the conductor 6, and the lead conductor 12 is connected to the laminated portion 8. As a result, the electronic component 132 has a plurality of electronic components 132-1 and 132-2 connected in series. The electronic components 132-1 and 132-2 are similar to the electronic component 92 described in the seventh embodiment, for example.
  • the equivalent circuit represented by the distributed constant circuit of the electronic component 132 is represented, for example, by connecting in series the equivalent circuit represented by the distributed constant circuit of the electronic component 92 shown in FIG. 21B.
  • 26B shows an example of an equivalent circuit represented as a distributed constant circuit of the electronic component 132.
  • an equivalent circuit 134-1 is an equivalent circuit represented as a distributed constant circuit of the electronic component 132-1
  • an equivalent circuit 134-2 is an equivalent circuit represented as a distributed constant circuit of the electronic component 132-2. Circuit.
  • the inductances of the inductors L111 and L121 may have the same value or different values
  • the inductances of the inductors L112 and L122 may have the same value or different values.
  • the capacitors C111 and C121 may have the same capacitance value or different capacitance values.
  • the inductor L111 is formed by the magnetic body 4 of the electronic component 132-1.
  • This inductor L111 is adjusted so as to attenuate noise having a voltage (for example, 20 to 30 volts) higher than the rated voltage of the capacitors C111 and C121, for example.
  • the noise having the high voltage is an example of the overvoltage, and may occur when the voltage of the power supply (for example, 12 V) fluctuates, and may be mixed in the direct current flowing into the electronic component 132. Therefore, the inductor L111 attenuates this noise on the input IN side of the electronic component 132, so that the deterioration of the filtering performance of the capacitors C111 and C121 can be suppressed.
  • the inductor L121 is formed in the output portion OUT of the electronic component 132 by the magnetic body 4 of the electronic component 132-2, even if the output portion OUT of the electronic component 132 is installed on the input side, the inductor of the electronic component 132 L121 can attenuate this noise and suppress the deterioration of the filtering performance of the capacitors C111 and C121.
  • the electronic component 132 a plurality of electronic components 132-1 and 132-2 are integrally formed, and it is not necessary for a board or connection wiring to connect between the electronic components 132-1 and 132-2.
  • the electronic component 132 including the plurality of electronic components 132-1 and 132-2 may remove noise in a wide frequency band or remove noise in a plurality of frequency bands.
  • the electronic component 132 is the electronic component 82 described in the sixth embodiment, the electronic component 102 described in the eighth embodiment, or the ninth embodiment.
  • the electronic component 112 may be included. Even if the electronic components are replaced, a plurality of electronic components are integrally formed, and it is not necessary for the substrate and the connection wiring to connect between the electronic components.
  • the electronic component 132 removes, for example, overvoltage and noise, and has a wide frequency band. It is possible to remove noise with or to remove noise in multiple frequency bands.
  • the layer 10 is formed on the surface of the conductor 6 that has been subjected to etching and conversion treatment, that is, the surface of the dielectric layer 14.
  • the resist layer 10 may be formed on the surface of the conductor 6 before the chemical conversion treatment. That is, the dielectric layer 14 may be formed only between the electrode layer 16 of the laminated portion 8 and the conductor 6, and the resist layer 10 may be formed on the surface of the conductor 6.
  • the resist layer 10 may be formed on the surface of the conductor 6 before etching.
  • the resist layer 10 having resistance can insulate the electrode layer 16 and the conductor 6 of the laminated portion 8 from each other and prevent a short circuit between the electrode layer 16 and the conductor 6.
  • the carbon layer 16-3 and the silver layer 16-4 can be formed on the surface of the conductor 6 without paying attention to short circuits.
  • the layer 10 has the same height as the outer surface of the solid electrolyte layer 16-2.
  • the resist layer 10 is higher than the outer surface of the solid electrolyte layer 16-2, for example, the same as the outer surface of the silver layer 16-4. It may have a height. That is, a plurality of resist layers 10 having a predetermined height are formed, a carbon layer 16-3 and a silver layer 16-4 are formed between the plurality of resist layers 10, and the outer surface of the silver layer 16-4 is formed. It may be aligned with the outer surface of the resist layer 10.
  • the resist layer 10 may be flush with the outer surface of the silver layer 16-4 or may be different.
  • the surface of the resist layer 10 on the laminated portion 8 side may be one flat surface as shown in FIG. 27A or may be a flat surface having a step as shown in FIG. 27B.
  • the surface of the resist layer 10 has a step, as shown in FIG. 27B, the upper portion of the resist layer 10 projects toward the laminated portion 8 and the end portions of the carbon layer 16-3 and the silver layer 16-4 are formed.
  • the resist layer 10 may be recessed toward the center of the laminated portion 8, the upper part of the resist layer 10 may be recessed toward the center of the resist layer 10, and the end portions of the carbon layer 16-3 and the silver layer 16-4 may be separated from the resist. It may project to the layer 10 side.
  • the carbon layer 16-3 and the silver layer 16-4 may be electrically connected to the solid electrolyte layer 16-2, and the positions of the carbon layer 16-3 and the silver layer 16-4 may be changed to the solid electrolyte layer 16-. It is not necessary to match the position of 2. Further, the shape of the resist layer 10 may be freely set as long as the resist layer 10 can insulate the conductor 6 and the electrode layer 16 from each other.
  • the insulating layer of the magnetic body 4 may be formed on the inner surface and outer surface of the foil of the magnetic body 4.
  • the insulating layers are formed on both sides, the insulating property of the magnetic body 4 is enhanced, and the eddy current generated by the noise current can be easily divided into the layers of the magnetic body 4, and the noise can be efficiently converted into heat. Further, in the magnetic body 4, the insulating layer may be omitted.
  • the magnetic body 4 is formed by winding a foil having magnetism, for example, but a plurality of magnetic foils may be laminated and then wound to form the magnetic body 4. .
  • a plurality of magnetic foils are laminated and then wound to form a magnetic body, the number of windings can be reduced and productivity can be improved.
  • the magnetic body formed of the thin magnetic foil can suppress the eddy current that increases in the high frequency region and relax the skin effect, as compared with the magnetic body formed of the thick magnetic foil.
  • the magnetic body formed of a thin magnetic foil suppresses a decrease in magnetic permeability, and the electronic components 2, 42, 52, 62, 72, 82, 92, 102, 112 can obtain high impedance up to a high frequency region. it can. Therefore, by stacking thin magnetic foils and winding them to form a magnetic body, it is possible to manufacture an electronic component having high impedance in a high frequency region while improving productivity.
  • an insulating layer may be formed on at least one of the plurality of magnetic foils.
  • the magnetic body 4 is formed of a kind of magnetic material, but the magnetic body 4 is formed from the first embodiment to the fifth embodiment. It is not limited to the magnetic body 4 of the embodiment.
  • the magnetic body 4 may be formed of a plurality of magnetic foils made of different magnetic materials.
  • an electronic component having the characteristics of each magnetic material can be obtained.
  • a magnetic foil made of a magnetic material having a high magnetic permeability such as a cobalt-based amorphous material
  • a magnetic foil made of a magnetic material such as an iron-based amorphous material is used as a magnetic material.
  • the inductance can be secured regardless of whether a large current or a low current flows. Further, when a plurality of magnetic materials differ in frequency characteristics of magnetic permeability, it is possible to suppress a signal such as noise in a frequency band in which each magnetic material is different.
  • Different magnetic materials may be formed by winding a magnetic foil made of one magnetic material on the outer periphery of a magnetic body made of the other magnetic material to form a magnetic body.
  • the magnetic material may be formed by stacking the following magnetic foils and winding the stacked magnetic foils. In this case, an insulating layer may be formed on at least one side of the magnetic foil.
  • the electronic components 2, 42, 52, 62, 72, 82, 92, 102, 112 have a plurality of inductance characteristics. This makes it possible to increase the degree of freedom in adjusting functions such as noise cut.
  • the magnetic body 4 includes the first magnetic body 4-1 and the second magnetic body 4-2.
  • the magnetic body 4 may be formed by winding a plurality of magnetic foils made of different materials in a laminated state.
  • one magnetic body can include a plurality of magnetic materials, and the plurality of types of reduction targets described above can be reduced.
  • the number of windings can be reduced and productivity can be improved.
  • the magnetic body formed of the thin magnetic foil can suppress the eddy current that increases in the high frequency region and relax the skin effect, as compared with the magnetic body formed of the thick magnetic foil.
  • the magnetic body formed of a thin magnetic foil can suppress the decrease in magnetic permeability, and the electronic components 82, 92, 102, and 112 can obtain high impedance up to a high frequency region. Therefore, by stacking thin magnetic foils and winding them to form a magnetic body, it is possible to manufacture an electronic component having high impedance in a high frequency region while improving productivity.
  • an insulating layer may be formed on at least one of the plurality of magnetic foils.
  • Different magnetic materials may be formed by winding a magnetic foil made of one magnetic material on the outer periphery of a magnetic body made of the other magnetic material to form a magnetic body.
  • the magnetic material may be formed by stacking the following magnetic foils and winding the stacked magnetic foils.
  • an insulating layer may be formed on at least one side of the magnetic foil.
  • the precoat layer 16-1 and the solid electrolyte layer 16-2 are formed in separate steps, but the precoat layer 16-1 is omitted and only the solid electrolyte layer 16-2 is formed. You may.
  • the precoat layer 16-1 and the solid electrolyte layer 16-2 may be formed by a method other than chemical polymerization and electrolytic polymerization.
  • a method other than the chemical polymerization and the electrolytic polymerization is, for example, a method of applying a dispersion liquid containing a solvent and conductive polymer fine particles or powder dispersed in the solvent.
  • the conductive oxide layer may be formed by, for example, a thermal decomposition method.
  • the precoat layer 16-1 is formed by chemical polymerization, the precoat layer 16-1 is not limited to this and may be formed by applying and applying a conductive material such as carbon.
  • the magnetic body 4, the conductor 6, and the laminated body are laminated.
  • a space is formed between the parts 8, 8-1, 8-2 or the resist layer 10, but there is no space, and the conductor 6, the laminated parts 8, 8-1, 8-2 and the resist layer 10 are magnetic. It may be in contact with the body 4.
  • the conductor 6, the laminated portions 8, 8-1, 8-2 and the magnetic body 4 form a concentric circle, but the conductor 6 and the laminated portions 8, 8-1, 8-2 It may be biased and may be in contact with the magnetic body 4.
  • the amount of conduction heat increases due to the contact between the conductor 6, the laminated portions 8, 8-1, 8-2 and the magnetic body 4, and the heat dissipation of the heat generated by the conductor 6 and the like is improved.
  • the side surface of the conductor 6 is etched.
  • the dielectric layer 14 may be formed on the surface of the conductor 6 without etching. By not performing etching, the surface area of the conductor 6 does not increase and the obtained capacitance becomes smaller, but the resistance can be reduced.
  • each electronic component processes high frequency, for example, but low frequency may be processed.
  • the equivalent circuit of an electronic component that processes low frequencies can be represented as a lumped constant circuit, unlike the case of high frequencies. However, even when the electronic component processes low frequencies, it is possible to increase the degree of freedom in setting the circuit form, as in the case of high frequencies.
  • the conductor 6 projects from the hollow portion 13 of the magnetic body 4, but the conductor 6 may penetrate the hollow portion 13 of the magnetic body 4.
  • the position of the end of the conductor 6 may coincide with the position of the end of the magnetic body 4.
  • two capacitors are formed by the laminated parts 8-1 and 8-2, but three or more capacitors are formed.
  • a laminated part may be formed to form three or more capacitors.
  • the number of capacitors formed and the capacitance value of each capacitor may be set according to the purpose of the electronic component 2, 42, 52, 62, 72, 82, 92, 102, 112.
  • the solid electrolyte layer forming surfaces 22-1 and 22-2 have different lengths in the masking step.
  • the solid electrolyte layers 16-2 formed in the subsequent solid electrolyte layer forming step were made different in length to form a plurality of laminated portions having different capacities.
  • the masking step is performed before the etching step, the etching area where a desired capacitance is obtained is predetermined by masking, and then the etching step, the dielectric layer forming step, and the electrode layer forming step are performed in this order in this order. May be. In this way, the procedure may be changed.
  • a plurality of laminated portions having different capacities may be formed by making the surface conditions of the solid electrolyte layer forming surfaces 22-1 and 22-2 of the conductor 6 different by making the etching conditions different.
  • the magnetic body 4 includes the first magnetic body 4-1 and the second magnetic body 4-2.
  • the magnetic body 4 may include three or more magnetic bodies.
  • the technique of the present disclosure can be used for removing noise from a noise generation source such as a switching power supply, and is useful.

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Abstract

Un objet de la présente invention est, par exemple, de réduire une zone d'installation d'un composant électronique et de réduire une charge de câblage du composant électronique. Un composant électronique (2) comprend : un corps magnétique (4) qui a une partie creuse (13) ; un conducteur (6) qui pénètre dans la partie creuse du corps magnétique et fait saillie à partir de la partie creuse ; une couche diélectrique (14) qui est formée sur la surface du conducteur ; une couche électrolytique à l'état solide (pré-couche 16-1, couche électrolytique à l'état solide 16-2) qui est formée sur la surface de la couche diélectrique ; et une couche de tête (couche de carbone 16-3, couche d'argent 16-4) qui est électriquement connectée à la couche électrolytique à l'état solide.
PCT/JP2019/046417 2018-11-28 2019-11-27 Composant électronique et son procédé de fabrication WO2020111137A1 (fr)

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JP2018222537A JP2020088243A (ja) 2018-11-28 2018-11-28 電子部品およびその製造方法
JP2018222536A JP7196566B2 (ja) 2018-11-28 2018-11-28 電子部品およびその製造方法
JP2018-222536 2018-11-28
JP2018-222537 2018-11-28
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JP2018222535A JP2020088241A (ja) 2018-11-28 2018-11-28 電子部品およびその製造方法
JP2018-222535 2018-11-28
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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS296270B1 (fr) * 1952-10-29 1954-09-30
JPH04356906A (ja) * 1991-06-03 1992-12-10 Mitsui Petrochem Ind Ltd 複合磁心およびその製造方法
JPH06333790A (ja) * 1993-05-18 1994-12-02 Nitsuko Corp 低インピーダンス形固体電解コンデンサ
JPH07201610A (ja) * 1993-11-25 1995-08-04 Mitsui Petrochem Ind Ltd インダクタンス素子およびこれを用いた集合素子
JPH08255991A (ja) * 1994-10-27 1996-10-01 Samsung Electro Mech Co Ltd ビードフィルターの製造方法および装置
JP2014120559A (ja) * 2012-12-14 2014-06-30 Kitagawa Kogyo Co Ltd 磁性体コア
JP2014160704A (ja) * 2013-02-19 2014-09-04 Honda Motor Co Ltd コイル構造および電子機器

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS296270B1 (fr) * 1952-10-29 1954-09-30
JPH04356906A (ja) * 1991-06-03 1992-12-10 Mitsui Petrochem Ind Ltd 複合磁心およびその製造方法
JPH06333790A (ja) * 1993-05-18 1994-12-02 Nitsuko Corp 低インピーダンス形固体電解コンデンサ
JPH07201610A (ja) * 1993-11-25 1995-08-04 Mitsui Petrochem Ind Ltd インダクタンス素子およびこれを用いた集合素子
JPH08255991A (ja) * 1994-10-27 1996-10-01 Samsung Electro Mech Co Ltd ビードフィルターの製造方法および装置
JP2014120559A (ja) * 2012-12-14 2014-06-30 Kitagawa Kogyo Co Ltd 磁性体コア
JP2014160704A (ja) * 2013-02-19 2014-09-04 Honda Motor Co Ltd コイル構造および電子機器

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