WO2020107745A1 - 检测承接座的异常端子的方法 - Google Patents

检测承接座的异常端子的方法 Download PDF

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Publication number
WO2020107745A1
WO2020107745A1 PCT/CN2019/077963 CN2019077963W WO2020107745A1 WO 2020107745 A1 WO2020107745 A1 WO 2020107745A1 CN 2019077963 W CN2019077963 W CN 2019077963W WO 2020107745 A1 WO2020107745 A1 WO 2020107745A1
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Prior art keywords
terminals
substrate
socket
terminal
abnormal
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English (en)
French (fr)
Inventor
董明君
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to US16/463,159 priority Critical patent/US20200173874A1/en
Publication of WO2020107745A1 publication Critical patent/WO2020107745A1/zh
Anticipated expiration legal-status Critical
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M13/00—Testing of machine parts

Definitions

  • the invention relates to the technical field of substrate receiving, in particular to a method for detecting abnormal terminals of a receiving seat.
  • the preparation of electronic products such as liquid crystal display panels, semiconductor devices, or solar cells all require multiple processes on various substrates, such as etching, sputtering, and cleaning processes. These processes may each be performed by a single process machine. carried out. Since multiple processes must be carried out, the substrate must be picked and placed, and then transferred from one process machine to the next process machine.
  • the substrate carrier (Carrier) on the process machine is prone to bend the terminals of the receiving substrate due to long-term use, so that the height of each terminal is different.
  • picking and placing substrates, especially glass substrates the supporting forces received across the substrate may be inconsistent, which may cause fragmentation. This problem not only affects production capacity, but also increases manufacturing costs.
  • the substrate carrier (Carrier) on the process machine is prone to bend the terminals of the receiving substrate due to long-term use, so that the height of each terminal is different.
  • the supporting forces received across the substrate may be inconsistent, which may cause fragmentation. This problem not only affects production capacity, but also increases manufacturing costs.
  • An object of the present invention is to provide a method for detecting abnormal terminals of a socket, which can instantly detect abnormal terminals of the socket and reduce the chance of chipping of the substrate.
  • the present invention provides a method for detecting abnormal terminals of a socket, the socket includes a plurality of ring-shaped areas, each ring-shaped area is provided with a plurality of terminals for receiving a substrate, the plurality of terminals It is evenly distributed on the bearing seat, characterized in that the method includes:
  • the terminal having a different force value from the same is determined as the abnormal terminal.
  • the present invention provides a method for detecting abnormal terminals of a socket, the socket includes a plurality of ring-shaped areas, each ring-shaped area is provided with a plurality of terminals for receiving substrates
  • the methods described include:
  • the step of comparing the force values of the plurality of terminals in the same annular area includes:
  • the terminal having a different force value from the same is determined as the abnormal terminal.
  • the step of comparing the force values of the plurality of terminals in the same annular area includes:
  • the degree of difference between the force value of each terminal and the average value is compared to detect the abnormal terminal.
  • the plurality of terminals are evenly arranged on the receiving seat.
  • the plurality of annular regions are arranged on the receiving seat at intervals.
  • the shape of the annular region is one of circular, rectangular, and triangular.
  • the substrate is a glass substrate.
  • the invention can immediately detect the abnormal terminal of the receiving seat and reduce the chance of the substrate breaking.
  • Figure 1 is a plan view of a socket used in an embodiment of the present invention
  • Figure 2 is a flowchart of a method for detecting abnormal terminals of a socket provided by an embodiment of the present invention
  • FIG. 3 is a method flowchart of an embodiment of step S03 in Figure 2;
  • FIG. 4 is a method flowchart of another embodiment of step S03 in Figure 2;
  • Figure 5 is a force distribution diagram of the receiving terminal used in the embodiment of the present invention under normal conditions
  • FIG. 6 is a force distribution diagram of the socket terminal used in the embodiment of the present invention under abnormal conditions.
  • FIG. 1 illustrates a top view of the socket 1 used in the embodiment of the present invention.
  • the receiving seat 1 includes a plurality of ring-shaped regions 10A and 10B, and the ring-shaped regions 10A and 10B are respectively provided with a plurality of terminals 12A and 12B for receiving a substrate (not shown).
  • the terminals 12A and 12B are evenly arranged on the receiving base 1, and the annular regions 10A and 10B are arranged on the receiving base 1 from inside to outside at intervals.
  • the shapes of the annular regions 10A and 10B are rectangular, but the application of the present invention is not limited to the above examples, and the shapes of the annular regions 10A and 10B may also be circular, triangular or other shapes.
  • the method for detecting abnormal terminals of the socket 11 of the present invention includes the following steps:
  • Step S01 Place a substrate on the plurality of terminals 12A and 12B of the socket 1.
  • the substrate may be, but not limited to, a glass substrate.
  • Step S02 Measure the force value when a plurality of terminals 12A and 12B receive the substrate.
  • Step S03 Compare the force values of the multiple terminals 12A, 12B in the same annular area 10A, 10B, and according to the comparison result, the abnormal terminals corresponding to the respective annular areas 10A, 10B can be detected.
  • the comparison method of this step please refer to the description of FIG. 3 and FIG. 4.
  • FIG. 3 is a method flowchart of an embodiment of step S03 in FIG. 2. Specifically, step S03 includes the following steps:
  • Step S04 Determine two or more terminals 12A (or 12B) having the same force value as normal terminals.
  • Step S05 Determine the terminal 12A (or 12B) having the same force value as the abnormal terminal.
  • FIG. 4 is a method flowchart of another embodiment of step S03 in FIG. 2. Specifically, step S03 includes the following steps:
  • Step S06 Calculate the average value of the sum of the force values of the multiple terminals 12A (or 12B).
  • Step S07 Compare the difference between the force value of each terminal 12A (or 12B) and the average value to detect the abnormal terminal.
  • FIG. 5 is a force distribution diagram of a socket terminal used in an embodiment of the present invention under normal conditions.
  • point A, point B, and point C represent the force values of the three terminals 12B in the same annular area 10B.
  • the figure shows that the force values of point A, point B and point C are all 10.00 force units, so that the force distribution maps formed by point A, point B and point C are evenly and symmetrically distributed. Further, by performing the detection method of the present invention, it can be detected that no abnormal terminal occurs in the annular area 10B.
  • FIG. 6 is a force distribution diagram of the socket terminal used in the embodiment of the present invention under abnormal conditions.
  • point D, point E, and point F represent the force values of the three terminals 12A in the same annular area 10A.
  • the figure shows that the force values of point E and point F are 10.50 force units, but the force value of point D is 11.00 force units, so that the force distribution formed by point D, point E and point F
  • the figure is obviously asymmetrically distributed.
  • the detection method of the present invention it can be detected that the terminal 12A corresponding to the point D is an abnormal terminal in the annular area 10A.
  • the present invention provides a method for detecting abnormal terminals of a socket, mainly by comparing the force values of multiple terminals in the same annular area to detect the abnormal terminals of the socket, which can reduce substrate fragmentation Opportunities, not only can increase production capacity, but also can reduce production costs.
  • the method for detecting the abnormal terminal of the socket can reduce the chance of chip breaking of the substrate, not only can increase the production capacity, but also can reduce the manufacturing cost.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

一种检测承接座（1）的异常端子的方法，承接座（1）包括多个环形区域（10A、10B），各环形区域（10A、10B）设置有多个用于承接基板的端子（12A、12B），包括：放置基板于承接座（1）的多个端子（12A、12B）上；接着，测量多个端子（12A、12B）承接基板时的受力值；然后，比较同一个环形区域（10A、10B）内的多个端子（12A、12B）的受力值，以检测得到对应于各环形区域（10A、10B）的异常端子。

Description

[根据细则37.2由ISA制定的发明名称]　检测承接座的异常端子的方法 技术领域
本发明涉及基板承接技术领域，尤其涉及一种检测承接座之异常端子的方法。
 背景技术
目前液晶显示面板、半导体元件或太阳能电池等电子产品的制备皆需要对各种基板执行多重制程，例如：蚀刻、溅镀(Sputtering)以及清洁等制程，这些制程可能分别由单一的制程机台来执行。由于必须进行多重制程，基板便必须被取放，然后从一制程机台被输送至下一制程机台。制程机台上的基板承接座(Carrier)因长时间的使用容易造成承接基板的端子产生弯曲，使得各个端子的高度不相同。当取放基板时，尤其是玻璃基板，便可能因基板各处所受到的支撑力量不一致，进而造成破片，此问题不仅影响产能，也使制造成本增加。
因此，有必要提供一种检测承接座之异常端子的方法，以解决上述基板破片之问题。
 技术问题
制程机台上的基板承接座(Carrier)因长时间的使用容易造成承接基板的端子产生弯曲，使得各个端子的高度不相同。当取放基板时，尤其是玻璃基板，便可能因基板各处所受到的支撑力量不一致，进而造成破片，此问题不仅影响产能，也使制造成本增加。
 技术解决方案
本发明的目的在于提供一种检测承接座之异常端子的方法，可以即时检测出承接座的异常端子，降低基板破片的机会。
为实现上述目的，本发明提供一种检测承接座之异常端子的方法，所述承接座包括多个环形区域，各所述环形区域设置有多个用于承接基板的端子，所述多个端子均匀布设于所述承接座上，其特征在于，所述方法包括：
放置所述基板于所述承接座的多个端子上；
测量所述多个端子承接所述基板时的受力值；以及
比较同一个所述环形区域内的所述多个端子的受力值，以检测得到对应于各所述环形区域的所述异常端子，包括：
将二个以上具有相同受力值的所述端子决定为正常端子；以及
将具有不同于所述相同受力值的所述端子决定为所述异常端子。
为实现上述目的，本发明提供一种检测承接座之异常端子的方法，所述承接座包括多个环形区域，各所述环形区域设置有多个用于承接基板的端子，其特征在于，所述方法包括：
放置所述基板于所述承接座的多个端子上；
测量所述多个端子承接所述基板时的受力值；以及
比较同一个所述环形区域内的所述多个端子的受力值，以检测得到对应于各所述环形区域的所述异常端子。
在一些实施方式中，所述比较同一个所述环形区域内的所述多个端子的受力值的步骤，包括：
将二个以上具有相同受力值的所述端子决定为正常端子；以及
将具有不同于所述相同受力值的所述端子决定为所述异常端子。
在一些实施方式中，所述比较同一个所述环形区域内的所述多个端子的受力值的步骤，包括：
计算所述多个端子的受力值总和的平均值；以及
比较各所述端子的受力值与所述平均值的差异程度，以检测得到所述异常端子。
在一些实施方式中，所述多个端子均匀布设于所述承接座上。
在一些实施方式中，所述多个环形区域彼此间隔排列于所述承接座上。
在一些实施方式中，所述环形区域的形状为圆形、矩形、三角形的其中一种。
在一些实施方式中，所述基板为玻璃基板。
 有益效果
本发明可以即时检测出承接座的异常端子，降低基板破片的机会。
 附图说明
为让本发明的特征以及技术内容能更明显易懂，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考用，并非用来对本发明加以限制。
图1为本发明实施例使用的承接座的俯视图;
图2为本发明实施例提供的检测承接座之异常端子的方法流程图;
图3为图2中步骤S03的一个实施例的方法流程图;
图4为图2中步骤S03的另一个实施例的方法流程图;
图5为本发明实施例使用的承接座端子于正常情况下的受力分布图;
图6为本发明实施例使用的承接座端子于异常情况下的受力分布图。
 本发明的实施方式
为了使本发明的目的、技术手段及其效果更加清楚明确，以下将结合附图对本发明作进一步地阐述。应当理解，此处所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例，并不用于限定本发明。
请参考图1，其示出本发明实施例使用的承接座1的俯视图。承接座1包括多个环形区域10A、10B，环形区域10A、10B分别设置有多个用于承接基板(图中未示出)的端子12A、12B。在本发明实施方式中，端子12A、12B均匀布设于承接座1上，环形区域10A、10B由内向外彼此间隔排列于承接座1上。具体地，环形区域10A、10B的形状为矩形，但本发明的应用不限于上述的举例，环形区域10A、10B的形状亦可以呈圆形、三角形或其他形状。
图2为本发明实施例提供的检测承接座之异常端子的方法流程图。同时参考图1，本发明检测承接座11之异常端子的方法包括如下步骤：
步骤S01、放置一基板于承接座1的多个端子12A、12B上。在本发明实施方式中，所述基板可以但不限定为玻璃基板。
步骤S02、测量多个端子12A、12B承接所述基板时的受力值。
步骤S03、比较同一个环形区域10A、10B内的多个端子12A、12B的受力值，根据比较的结果可以检测得到对应于各环形区域10A、10B的所述异常端子。关于本步骤的比较方法，请参阅图3及图4的说明。
图3为图2中步骤S03的一个实施例的方法流程图。具体地，步骤S03包括如下步骤：
步骤S04、将二个以上具有相同受力值的端子12A(或12B)决定为正常端子。
步骤S05、将具有不同于所述相同受力值的端子12A(或12B)决定为所述异常端子。
由于异常端子通常不会同时发生，通过步骤S04和步骤S05检测哪一个端子的受力值明显不同于大多数的端子，便能够找出所述异常端子。
图4为图2中步骤S03的另一个实施例的方法流程图。具体地，步骤S03包括如下步骤：
步骤S06、计算多个端子12A(或12B)的受力值总和的平均值。
步骤S07、比较各端子12A(或12B)的受力值与所述平均值的差异程度，以检测得到所述异常端子。
由于异常端子的受力值与所有端子的受力值总和的平均值差异程度最大，因此通过步骤S06和步骤S07检测哪一个端子的受力值与所述平均值差异程度最大，便能够找出所述异常端子。
图5为本发明实施例使用的承接座端子于正常情况下的受力分布图。结合图1来参考图5，假设点A、点B及点C代表同一个环形区域10B内三个端子12B的受力值。图中显示，点A、点B及点C的受力值皆为10.00个受力单位，如此使得点A、点B及点C所形成的受力分布图呈均匀对称分布。进一步的，通过执行本发明的检测方法，可以检测出环形区域10B内并无异常端子发生。
图6为本发明实施例使用的承接座端子于异常情况下的受力分布图。结合图1来参考图6，假设点D、点E及点F代表同一个环形区域10A内三个端子12A的受力值。图中显示，点E及点F的受力值皆为10.50个受力单位，但点D的受力值为11.00个受力单位，使得点D、点E及点F所形成的受力分布图明显呈不对称分布。进一步的，通过执行本发明的检测方法，可以检测得到点D所对应的端子12A为环形区域10A内的异常端子。
综上所述，本发明提供的一种检测承接座之异常端子的方法, 主要通过比较同一个环形区域内的多个端子的受力值来检测得到承接座的异常端子，如此可以降低基板破片的机会，不但可以提升产能，而且能够降低制作成本。
应当理解的是，本发明的应用不限于上述的举例，对本领域普通技术人员来说，可以根据上述说明加以改进或变换，所有这些改进和变换都应属于本发明所附权利要求的保护范围。
 工业实用性
本发明提供的检测承接座之异常端子的方法, 可以降低基板破片的机会，不但可以提升产能，而且能够降低制作成本。

Claims (8)

  1.    一种检测承接座之异常端子的方法，所述承接座包括多个环形区域，各所述环形区域设置有多个用于承接基板的端子，所述多个端子均匀布设于所述承接座上，其特征在于，所述方法包括：
    放置所述基板于所述承接座的多个端子上；
    测量所述多个端子承接所述基板时的受力值；以及
    比较同一个所述环形区域内的所述多个端子的受力值，以检测得到对应于各所述环形区域的所述异常端子，包括：
    将二个以上具有相同受力值的所述端子决定为正常端子；以及
    将具有不同于所述相同受力值的所述端子决定为所述异常端子。
  2.    一种检测承接座之异常端子的方法，所述承接座包括多个环形区域，各所述环形区域设置有多个用于承接基板的端子，其特征在于，所述方法包括：
    放置所述基板于所述承接座的多个端子上；
    测量所述多个端子承接所述基板时的受力值；以及
    比较同一个所述环形区域内的所述多个端子的受力值，以检测得到对应于各所述环形区域的所述异常端子。
  3. 如权利要求2所述的方法，其特征在于：所述比较同一个所述环形区域内的所述多个端子的受力值的步骤，包括：
    将二个以上具有相同受力值的所述端子决定为正常端子；以及
    将具有不同于所述相同受力值的所述端子决定为所述异常端子。
  4. 如权利要求2所述的方法，其特征在于：所述比较同一个所述环形区域内的所述多个端子的受力值的步骤，包括：
    计算所述多个端子的受力值总和的平均值；以及
    比较各所述端子的受力值与所述平均值的差异程度，以检测得到所述异常端子。
  5. 如权利要求2所述的方法，其特征在于：所述多个端子均匀布设于所述承接座上。
  6. 如权利要求2所述的方法，其特征在于：所述多个环形区域彼此间隔排列于所述承接座上。
  7. 如权利要求2所述的方法，其特征在于：所述环形区域的形状为圆形、矩形、三角形的其中一种。
  8. 如权利要求2所述的方法，其特征在于：所述基板为玻璃基板。
PCT/CN2019/077963 2018-11-28 2019-03-13 检测承接座的异常端子的方法 Ceased WO2020107745A1 (zh)

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US16/463,159 US20200173874A1 (en) 2018-11-28 2019-03-13 Method for detecting abnormal terminal of carrier

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