CN201758118U - 用于固定晶圆的支撑物 - Google Patents
用于固定晶圆的支撑物 Download PDFInfo
- Publication number
- CN201758118U CN201758118U CN200920213426XU CN200920213426U CN201758118U CN 201758118 U CN201758118 U CN 201758118U CN 200920213426X U CN200920213426X U CN 200920213426XU CN 200920213426 U CN200920213426 U CN 200920213426U CN 201758118 U CN201758118 U CN 201758118U
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- Prior art keywords
- wafer
- supporter
- support
- millimeters
- intersection
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Chemical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
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Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN200920213426XU CN201758118U (zh) | 2009-12-15 | 2009-12-15 | 用于固定晶圆的支撑物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN200920213426XU CN201758118U (zh) | 2009-12-15 | 2009-12-15 | 用于固定晶圆的支撑物 |
Publications (1)
Publication Number | Publication Date |
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CN201758118U true CN201758118U (zh) | 2011-03-09 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN200920213426XU Expired - Fee Related CN201758118U (zh) | 2009-12-15 | 2009-12-15 | 用于固定晶圆的支撑物 |
Country Status (1)
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CN (1) | CN201758118U (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102270597A (zh) * | 2011-08-16 | 2011-12-07 | 清华大学 | 用于晶圆交换装置的晶圆托架组件和晶圆交换装置 |
CN103904016A (zh) * | 2014-04-04 | 2014-07-02 | 株洲南车时代电气股份有限公司 | 硅片承载装置 |
CN109755183A (zh) * | 2017-11-08 | 2019-05-14 | 台湾积体电路制造股份有限公司 | 晶圆容器及固持晶圆的方法 |
-
2009
- 2009-12-15 CN CN200920213426XU patent/CN201758118U/zh not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102270597A (zh) * | 2011-08-16 | 2011-12-07 | 清华大学 | 用于晶圆交换装置的晶圆托架组件和晶圆交换装置 |
CN102270597B (zh) * | 2011-08-16 | 2014-04-09 | 清华大学 | 用于晶圆交换装置的晶圆托架组件和晶圆交换装置 |
CN103904016A (zh) * | 2014-04-04 | 2014-07-02 | 株洲南车时代电气股份有限公司 | 硅片承载装置 |
CN109755183A (zh) * | 2017-11-08 | 2019-05-14 | 台湾积体电路制造股份有限公司 | 晶圆容器及固持晶圆的方法 |
CN109755183B (zh) * | 2017-11-08 | 2023-07-07 | 台湾积体电路制造股份有限公司 | 晶圆容器及固持晶圆的方法 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20121109 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
|
TR01 | Transfer of patent right |
Effective date of registration: 20121109 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110309 Termination date: 20181215 |
|
CF01 | Termination of patent right due to non-payment of annual fee |