WO2020107579A1 - 显示面板的制备方法及显示面板 - Google Patents

显示面板的制备方法及显示面板 Download PDF

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Publication number
WO2020107579A1
WO2020107579A1 PCT/CN2018/122425 CN2018122425W WO2020107579A1 WO 2020107579 A1 WO2020107579 A1 WO 2020107579A1 CN 2018122425 W CN2018122425 W CN 2018122425W WO 2020107579 A1 WO2020107579 A1 WO 2020107579A1
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WIPO (PCT)
Prior art keywords
area
organic material
deposition
deposition area
display panel
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PCT/CN2018/122425
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English (en)
French (fr)
Inventor
沐俊应
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to US16/320,391 priority Critical patent/US10923687B2/en
Publication of WO2020107579A1 publication Critical patent/WO2020107579A1/zh
Anticipated expiration legal-status Critical
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Definitions

  • the present invention relates to the field of display devices, and in particular, to a preparation method of a display panel and a display panel.
  • OLED display technology Compared with current mainstream liquid crystal display technology, OLED display technology has outstanding advantages such as high contrast, wide color gamut, flexibility, lightness and thinness, and energy saving.
  • OLED display technology has gradually been popularized in mobile devices such as smart phones and tablet computers, flexible wearable devices such as smart watches, large-size curved TVs, and white light lighting. The development momentum is strong.
  • the OLED display devices currently put into commercialization mainly include RGB three-color OLED display devices and white light OLED display devices with color film (CF).
  • FIG. 1A is a schematic diagram of a fine metal mask plate welded on a mask support frame. Please refer to FIG. 1A, a fine metal mask plate 10 is welded on a mask plate support frame 11.
  • FIG. 1B is a schematic top view of the fine metal mask 10
  • FIG. 1C is a schematic cross-sectional view taken along line AA of FIG. 1B.
  • the fine metal mask 10 has a plurality of openings 12. In the substrate position corresponding to the opening 12, organic materials are deposited to form sub-pixels.
  • FIG. 1D is a schematic diagram of sub-pixel evaporation using a fine metal mask
  • FIG. 1E is an enlarged schematic diagram of area C in FIG. 1D.
  • the organic material evaporated by the evaporation source 13 is deposited through the opening 12
  • sub-pixels 15 are formed on the substrate 14, and the evaporation area of the organic material is depicted by dotted lines.
  • a shadow area (Shadow area) A is generated at both edges of the sub-pixel 15, wherein the shadow area A includes An outer shadow area A1 located on the left side of the opening 12 edge and an inner shadow area A2 located on the right side of the opening 12 edge.
  • the thickness of the sub-pixels is uneven and decreases gradually.
  • the width of the shadow area A reaches 5 microns or more.
  • the width of the sub-pixel 15 must be increased, which limits the manufacture of higher resolution display devices .
  • Traditional FMM resolution is generally difficult to exceed 250ppi.
  • the technical problem to be solved by the present invention is to provide a preparation method of a display panel and a display panel, which can be applied to the manufacture of a high-resolution display panel.
  • the present invention provides a method for manufacturing a display panel, including the following steps: providing a substrate, the substrate having a first surface and a second surface, the first surface and the second surface Relatively arranged, there are a plurality of deposition areas and a plurality of non-deposition areas alternately arranged on the first surface; a mask plate is provided, and the mask plate includes a plurality of barrier areas and a plurality of hollowed-out areas arranged at intervals, The blocking area corresponds to the deposition area, and the hollow area corresponds to the non-deposition area; a light source is provided, the light source illuminates the mask plate, and the light source passes through the hollow area The hollow area is irradiated on the non-deposition area, and the light source is blocked in the blocking area; an evaporation source generates an organic material vapor, the organic material vapor is in contact with the first surface, the organic The material vapor forms an organic material block in the deposition area, and the organic material vapor does
  • the deposition area is a sub-pixel area
  • the non-deposition area is a non-sub-pixel area
  • the organic material block formed in the deposition area is a sub-pixel
  • the side of the organic material block protrudes beyond the boundary between the deposition area and the non-deposition area, and the thickness of the organic material block decreases in the non-deposition area.
  • the light source is a laser light source.
  • the present invention also provides a method for manufacturing a display panel, comprising the following steps: providing a substrate, the substrate having a first surface and a second surface, the first surface and the second surface The surfaces are arranged oppositely, with a plurality of deposition areas and a plurality of non-deposition areas alternately arranged on the first surface; providing a light source, the light source illuminating the second surface, and further illuminating the second surface from The non-deposited area; and an evaporation source generates an organic material vapor that contacts the first surface, the organic material vapor forms an organic material block in the deposition area, and the non-deposited area Zone, the organic material vapor does not form an organic material block.
  • the preparation method further includes the following step: before the step of illuminating the non-sub-pixel region from the second surface, a mask plate is provided, the mask plate includes a spacer A plurality of barrier regions and a plurality of hollow regions provided, the barrier region is disposed corresponding to the deposition region, and the hollow region is disposed corresponding to the non-deposition region; when the light source irradiates the non-deposited region from the second surface In the step of depositing the area, the light source illuminates the mask plate, and in the hollow area, the light source illuminates the non-deposition area after passing through the hollow area, and in the blocking area, the The light source is blocked.
  • the preparation method further includes a pair of alignment steps to adjust the positions of the substrate and the mask plate so that the barrier area corresponds to the deposition area, and the hollow area corresponds to the Non-deposition zone setting.
  • the edge of the side of the organic material block protrudes beyond the boundary between the deposition area and the non-deposition area.
  • the deposition area is a sub-pixel area
  • the non-deposition area is a non-sub-pixel area
  • the organic material block formed in the deposition area is a sub-pixel
  • the side of the organic material block protrudes beyond the boundary between the deposition area and the non-deposition area, and the thickness of the organic material block decreases in the non-deposition area.
  • the light source is a laser light source.
  • the invention also provides a display panel prepared by the above method, comprising a substrate, the substrate having a plurality of deposition areas and a plurality of non-deposition areas arranged alternately, an organic material block is provided in the deposition area, The side of the organic material block protrudes beyond the boundary between the deposition area and the non-deposition area, and the thickness of the organic material block decreases in the non-deposition area.
  • the organic material block is a sub-pixel.
  • the side of the organic material block is curved.
  • the advantage of the present invention is that the light source is selectively irradiated onto the substrate, and a thermal effect or a photochemical effect is generated in the area irradiated by the light source, activating the particles in the vapor of the organic material and preventing the deposition of the particles in the area.
  • the preparation method of the present invention avoids the use of fine metal masks, eliminates the need for periodic web-screening and cleaning processes, reduces mass production and maintenance costs, and at the same time avoids large shadow areas on the edges of pixels due to evaporation angles, and also avoids
  • the PPA changes caused by the temperature increase of the fine metal mask during the coating process can be applied to the manufacture of high-resolution display panels.
  • FIG. 1A is a schematic view of a fine metal mask plate welded on a mask plate support frame
  • 1B is a schematic top view of a fine metal mask plate
  • FIG. 1C is a schematic cross-sectional view taken along line A-A of FIG. 1B;
  • FIG. 1D is a schematic diagram of sub-pixel evaporation using a fine metal mask
  • FIG. 1E is an enlarged schematic view of the area C in FIG. 1D;
  • FIG. 2 is a schematic diagram of the steps of the manufacturing method of the display panel of the present invention.
  • 3A ⁇ 3D are process flow diagrams of the method for manufacturing the display panel of the present invention.
  • FIG. 4 is a schematic structural diagram of a display panel of the present invention.
  • FIG. 2 is a schematic diagram of the steps of the manufacturing method of the display panel of the present invention
  • FIGS. 3A to 3D are process flowcharts of the manufacturing method of the display panel of the present invention.
  • FIG. 3A is a top view
  • FIG. 3B is a cross-sectional view along line FF in FIG. 3A to provide a substrate 300 having a first surface 301 and a second surface 302.
  • the first surface 301 is disposed opposite to the second surface 302, that is, the first surface 301 and the second surface 302 are opposite surfaces.
  • the first surface 301 has a plurality of deposition areas B1 and a plurality of non-deposition areas B2 arranged alternately, that is, between two adjacent deposition areas B1 is the non-deposition area B2.
  • FIGS. 3A and 3B two of the deposition areas B1 and one of the non-deposition areas B2 are schematically shown.
  • the substrate 300 is a conventional substrate for manufacturing a display panel, such as a glass substrate, a flexible substrate, and the like.
  • the setting of the deposition area B1 and the non-deposition area B2 may be set according to specific conditions, for example, according to function settings.
  • the boundaries of the deposition area B1 and the non-deposition area B2 may be defined by external structures or by changes in the heights of the deposition area B1 and the non-deposition area B2.
  • the substrate 300 is a glass substrate, which is a transparent structure that allows light to pass through, and a conventional structure such as a thin film transistor layer (not shown in the drawings) is deposited on the substrate 300
  • the substrate may also be a flexible substrate.
  • the deposition area B1 is a sub-pixel area
  • the non-deposition area B2 is a non-sub-pixel area
  • the boundary between the deposition area B1 and the non-deposition area B2 is cut out by a mask The edge of the area 321 (marked in FIG.
  • a pixel defining layer is formed on the substrate 300, and the hollow area of the pixel defining layer is the deposition area B1.
  • the area of the pixel defining layer except for the hollow area is the non-deposition area B2.
  • a light source 310 is provided.
  • the light source 310 illuminates the second surface 302, and further illuminates the non-deposited area B2 from the second surface 302. That is, the light source 310 selectively illuminates the non-deposition area B2 through the substrate 300, and the light source 310 does not illuminate the deposition area B1.
  • the light source 310 includes but is not limited to a laser light source. In the prior art, there are many methods for realizing that the light source 310 illuminates only the non-deposition area B2 without illuminating the deposition area B1, and those skilled in the art can choose from existing methods.
  • the light source 310 is irradiated on the substrate 300 after passing through a mask 320, that is, the mask 320 is disposed between the light source 310 and the substrate 300.
  • the mask plate 320 is a conventional photo mask.
  • the mask plate 320 has a plurality of hollowed-out regions 321 and a plurality of blocking regions 322, the hollowed-out regions 321 are correspondingly disposed to the non-deposition region B2, and the blocking regions are correspondingly disposed to the deposition region B1. That is, the mask plate 320 is not blocked at the position corresponding to the non-deposition area B2, and the mask plate 320 is blocked at the position corresponding to the deposition area B1.
  • the light from the light source 310 is shown by an arrow in the figure. After the light from the light source 310 is irradiated to the mask plate 320, the light from the light source 310 is directly irradiated on the substrate 300 at the hollow area 321 And illuminate the non-deposited area B2 through the substrate 300, and in the blocking area 322, the light generated by the light source 310 is blocked by the mask plate 320 and is not irradiated on the substrate 300 On, that is, the deposition area B1 is not irradiated.
  • an evaporation source 330 generates an organic material vapor (as indicated by the dotted arrow in the figure), and the organic material vapor is in contact with the first surface 301. That is, the evaporation source 330 delivers organic material vapor from the first surface 301 side to the substrate 300.
  • the evaporation source 330 is a conventional structure of an evaporation process in the art, and will not be described in detail.
  • the light source 310 also acts on the substrate 300.
  • the organic material vapor After being blocked by the substrate 300, the organic material vapor is deposited on the first surface 301 of the substrate 300. Specifically, in the deposited area B1, the organic material vapor nucleates and forms a film to form an organic material block 340; in the non-deposited area B2, the organic material vapor does not form an organic material block, the reason Because the light source 310 is irradiated on the non-deposited area B2, after the organic material vapor reaches the non-deposited area B2, it is irradiated and activated by the light source 310, the organic material vapor cannot nucleate and form a film, That is, the organic material vapor cannot be deposited at the non-deposition area B2 to form an organic material block.
  • the organic material block 340 is a sub-pixel.
  • the manufacturing method of the display panel of the present invention utilizes the existing photomask technology to irradiate the mask plate 320 with a light source such as a laser, and the light of the light source 310 selectively irradiates the substrate 300 through the mask plate.
  • the area produces thermal effects or photochemical effects, activates the particles in the vapor of the organic material, and prevents the deposition of particles in the area.
  • the preparation method of the present invention avoids the use of fine metal masks, eliminates the need for periodic web-screening and cleaning processes, reduces mass production and maintenance costs, and at the same time avoids large shadow areas on the edges of pixels due to evaporation angles, and also avoids
  • the PPA changes caused by the temperature increase of the fine metal mask during the coating process can be applied to the manufacture of high-resolution display panels.
  • the preparation method further includes a pair of alignment steps to adjust the positions of the substrate 300 and the mask plate 320 so that the blocking area 322 is disposed corresponding to the deposition area B1.
  • the hollow area 321 is disposed corresponding to the non-deposition area B2.
  • the adjustment method is a conventional method in the art.
  • the alignment systems of the substrate 300 and the mask plate 320 may be used for adjustment, which will not be repeated here.
  • the side of the organic material block 340 protrudes from the deposition area B1 and the non-deposition area B2.
  • Limit E that is, the organic material block 340 covers part of the non-deposited area B2 in addition to the deposition area B1, and the edge of the hollowed area 321 is the deposition area B1 and the non-deposited area The boundary of zone B2.
  • the edge of the hollowed area 321 of the mask blocks the light of the light source 310, the irradiation intensity of the light source 310 is reduced at the edge of the hollowed area 321, and some particles in the organic material vapor It is not activated, so it deposits there. Since the intensity of the light source gradually increases from the edge of the hollowed area 321 to the center of the hollowed area 321, less and less organic material vapor can be deposited in the non-deposition area B2. Therefore, in the non-deposition In the area B2, the thickness of the organic material block 340 decreases, that is, the side of the organic material block 340 is curved.
  • the invention also provides a display panel prepared by the above method.
  • 4 is a schematic structural diagram of a display panel of the present invention.
  • the display panel includes a substrate 400.
  • the substrate 400 is a conventional substrate of a display panel, such as a glass substrate, a flexible substrate, and the like.
  • the substrate 400 is a glass substrate.
  • a conventional structure such as a thin film transistor layer is provided on the substrate 400.
  • the substrate 400 has a plurality of deposition areas B1 and a plurality of non-deposition areas B2 arranged alternately, and an organic material block 440 is provided in the deposition area B1.
  • the organic material block 440 is a sub-pixel.
  • the side of the organic material block 440 protrudes beyond the boundary E between the deposition area B1 and the non-deposition area B2. That is, in addition to covering the deposition area B1, the organic material block 440 also covers a part of the non-deposition area B2.
  • the boundary between the deposition area B1 and the non-deposition area B2 is determined by its process.
  • the boundary between the deposition area B1 and the non-deposition area B2 is used when preparing the display panel The edge of the cutout area of the mask. At a portion where the organic material block 440 protrudes beyond the limit E, the thickness of the organic material block 440 decreases, and the sides of the organic material block 440 are curved.
  • the display device further includes a structure such as a cover plate 450, and other structures of the display panel are not described herein. Those skilled in the art should be able to obtain other structures of the display panel from the prior art.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
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  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

本发明提供一种显示面板的制备方法及显示面板。本发明的优点在于，避免了因蒸镀角度造成的像素边缘较大的阴影区，另外还能避免镀膜过程中精细金属掩膜版温度升高造成的PPA变化，能够应用于高解析度显示面板的制造。

Description

显示面板的制备方法及显示面板 技术领域
本发明涉及显示装置领域，尤其涉及一种显示面板的制备方法及显示面板。
 背景技术
OLED显示技术较之当前主流的液晶显示技术，具有对比度高、色域广、柔性、轻薄、节能等突出优点。近年来OLED显示技术逐渐在智能手机和平板电脑等移动设备、智能手表等柔性可穿戴设备、大尺寸曲面电视、白光照明等领域普及，发展势头强劲。
当前投入商业化的OLED显示器件主要有RGB三色OLED显示器件和白光OLED搭配彩膜（CF）的显示器件。
其中，RGB三色OLED显示器件当前广泛应用于移动显示设备。目前比较普遍的制作OLED的方法是真空蒸镀的方法。有机发光（EL）材料在坩埚中受热，由固态变成气态，然后通过精细金属掩膜版（Fine Metal Mask，FMM）的开孔，沉积在薄膜晶体管阵列（TFT Array）基板上对应的像素定义层（PDL，Pixel Definition Layer) 的开口中。传统的精细金属掩膜版主要使用因瓦合金（Invar）材料，经过双面光刻、蚀刻工艺制造而成。通过张网机（mask tension）将精细金属掩膜版与掩膜版支撑架（Mask Frame）对位并激光焊接在掩膜版支撑架上。图1A是精细金属掩膜版焊接在掩膜版支撑架上的示意图，请参阅图1A，精细金属掩膜版10焊接在掩膜版支撑架11上。
精细金属掩膜版技术是显示器件解析度的决定因素。图1B是精细金属掩膜版10的俯视示意图，图1C沿图1B的A-A线的截面示意图，请参阅图1B及图1C，所述精细金属掩膜版10具有多个开口12，在所述开口12对应的基板位置，有机材料沉积形成子像素。图1D是采用精细金属掩膜版蒸镀子像素的示意图，图1E是图1D中C区域的放大示意图，请参阅图1D及图1E，蒸发源13蒸发出的有机材料通过所述开口12沉积在基板14上，从而在所述基板14上形成子像素（Sub-pixel）15，其中有机材料蒸镀区域采用虚线绘示。
 技术问题
其缺点在于，在蒸镀镀膜过程中，受所述开口12的形状及厚度等参数的影响，在子像素15的两边缘会产生阴影区（Shadow area）A，其中，所述阴影区A包括位于所述开口12边缘左侧的外阴影区A1及位于所述开口12边缘右侧的内阴影区A2。在阴影区A内，所述子像素的厚度不均匀，呈梯度递减。通常情况下，所述阴影区A的宽度达到5微米以上，为了避免阴影区A对显示器件的显示效果的影响，必须增大子像素15的宽度，这限制了更高解析度显示器件的制造。传统FMM解析度一般难以超过250ppi，随着对显示器件解析度需求的日益提升（如300ppi以上），现有采用精细金属掩膜版进行真空蒸镀的技术已经难以满足需求，且蒸镀镀膜过程中精细金属掩膜版温度升高（例如5℃或以上），同时精细金属掩膜版需要周期性清洗、重新张网等，易发生PPA精度变化、增加了量产维护成本。因此，需要发展新的显示面板的制备方法。
 技术解决方案
本发明所要解决的技术问题是，提供一种显示面板的制备方法及显示面板，其能够应用于高解析度显示面板的制造。
为了解决上述问题，本发明提供了一种显示面板的制备方法，包括如下步骤：提供一基板，所述基板具有一第一表面及一第二表面，所述第一表面与所述第二表面相对设置，在所述第一表面上具有交替设置的多个沉积区及多个非沉积区；提供一掩膜板，所述掩膜板包括间隔设置的多个阻挡区及多个镂空区，所述阻挡区对应所述沉积区设置，所述镂空区对应所述非沉积区设置；提供一光源，所述光源照射在所述掩膜板上，在所述镂空区，所述光源穿过所述镂空区后照射在所述非沉积区，在所述阻挡区，所述光源被阻挡；一蒸发源产生一有机材料蒸汽，所述有机材料蒸汽与所述第一表面接触，所述有机材料蒸汽在所述沉积区形成一有机材料块，在所述非沉积区，所述有机材料蒸汽未形成一有机材料块,所述有机材料块的侧边的边缘突出于所述沉积区与所述非沉积区的界限；所述制备方法还包括一对位步骤，调整所述基板及所述掩膜板的位置，以使所述阻挡区对应所述沉积区设置，所述镂空区对应所述非沉积区设置。
在一实施例中，所述沉积区为一子像素区，所述非沉积区为一非子像素区，形成在所述沉积区的所述有机材料块为一子像素。
在一实施例中，所述有机材料块的侧边突出于所述沉积区与所述非沉积区的界限，在所述非沉积区，所述有机材料块的厚度递减。
在一实施例中，所述光源为激光光源。
为了解决上述问题，本发明还提供了一种显示面板的制备方法，包括如下步骤：提供一基板，所述基板具有一第一表面及一第二表面，所述第一表面与所述第二表面相对设置，在所述第一表面上具有交替设置的多个沉积区及多个非沉积区；提供一光源，所述光源照射所述第二表面，并进一步从所述第二表面照射在所述非沉积区；以及一蒸发源产生一有机材料蒸汽，所述有机材料蒸汽与所述第一表面接触，所述有机材料蒸汽在所述沉积区形成一有机材料块，在所述非沉积区，所述有机材料蒸汽未形成一有机材料块。
在一实施例中，所述制备方法还包括如下步骤：在所述光源从所述第二表面照射在所述非子像素区的步骤之前，提供一掩膜板，所述掩膜板包括间隔设置的多个阻挡区及多个镂空区，所述阻挡区对应所述沉积区设置，所述镂空区对应所述非沉积区设置；在所述光源从所述第二表面照射在所述非沉积区的步骤中，所述光源照射在所述掩膜板上，在所述镂空区，所述光源穿过所述镂空区后照射在所述非沉积区，在所述阻挡区，所述光源被阻挡。
在一实施例中，所述制备方法还包括一对位步骤，调整所述基板及所述掩膜板的位置，以使所述阻挡区对应所述沉积区设置，所述镂空区对应所述非沉积区设置。
在一实施例中，在形成所述有机材料块的步骤中，所述有机材料块的侧边的边缘突出于所述沉积区与所述非沉积区的界限。
在一实施例中，所述沉积区为一子像素区，所述非沉积区为一非子像素区，形成在所述沉积区的所述有机材料块为一子像素。
在一实施例中，所述有机材料块的侧边突出于所述沉积区与所述非沉积区的界限，在所述非沉积区，所述有机材料块的厚度递减。
在一实施例中，所述光源为激光光源。
本发明还提供一种采用上述的方法制备的显示面板，包括一基板，所述基板具有交替设置的多个沉积区及多个非沉积区，在所述沉积区设置有一有机材料块，所述有机材料块的侧边突出于所述沉积区与所述非沉积区的界限，在所述非沉积区，所述有机材料块的厚度递减。
在一实施例中，所述有机材料块为一子像素。
在一实施例中，所述有机材料块的侧边呈弧形。
 有益效果
本发明的优点在于，光源选择性照射到基板上，在光源所照射到的区域产生热效应或光化学效应，活化有机材料蒸汽中的粒子，阻止粒子在该区域的沉积。本发明的制备方法避免使用精细金属掩膜版，无需周期性张网、清洗的工序，降低量产维护成本，同时避免了因蒸镀角度造成的像素边缘较大的阴影区，另外还能避免镀膜过程中精细金属掩膜版温度升高造成的PPA变化，能够应用于高解析度显示面板的制造。
 附图说明
图1A是精细金属掩膜版焊接在掩膜版支撑架上的示意图；
图1B是精细金属掩膜版的俯视示意图；
图1C沿图1B的A-A线的截面示意图；
图1D是采用精细金属掩膜版蒸镀子像素的示意图；
图1E是图1D中C区域的放大示意图；
图2是本发明显示面板的制备方法的步骤示意图；
图3A~图3D是本发明显示面板的制备方法的工艺流程图；
图4是本发明显示面板的结构示意图。
 本发明的实施方式
下面结合附图对本发明提供的显示面板的制备方法及显示面板的具体实施方式做详细说明。
图2是本发明显示面板的制备方法的步骤示意图，图3A~图3D是本发明显示面板的制备方法的工艺流程图。
请参阅步骤S20、图3A及图3B，其中图3A是俯视图，图3B是沿图3A中F-F线的截面图，提供一基板300，所述基板300具有一第一表面301及一第二表面302。所述第一表面301与所述第二表面302相对设置，即所述第一表面301与所述第二表面302为相对面。在所述第一表面301上具有交替设置的多个沉积区B1及多个非沉积区B2，即在相邻的两个所述沉积区B1之间为所述非沉积区B2。在本实施例中，在图3A及图3B中，示意性地绘示两个所述沉积区B1及一个所述非沉积区B2。
具体地说，所述基板300为制作显示面板的常规基板，例如玻璃基板、柔性基板等。所述沉积区B1及所述非沉积区B2的设定可根据具体情况设置，例如，根据功能设定。所述沉积区B1及所述非沉积区B2的界限可通过外部结构界定或者通过所述沉积区B1及所述非沉积区B2的高度的变化而界定。
举例说明，在本实施例中，所述基板300为一玻璃基板，其为透明结构，允许光线穿过，在所述基板300上沉积有薄膜晶体管层（附图中未绘示）等常规结构，在本发明其他实施例中，所述基板还可以为柔性基板。在本实施例中，所述沉积区B1为一子像素区，所述非沉积区B2为一非子像素区，所述沉积区B1与所述非沉积区B2的界限通过掩膜板的镂空区321（标示于图3C中）的边缘界定；在本发明其他实施例中，在所述基板300上形成一像素限定层，所述像素限定层的镂空区域即为所述沉积区B1，所述像素限定层除镂空区域之外的区域即为所述非沉积区B2。
请参阅步骤S21及图3C，提供一光源310，所述光源310照射所述第二表面302，并进一步从所述第二表面302照射在所述非沉积区B2。即所述光源310穿过所述基板300有选择地照射在所述非沉积区B2，所述光源310并未照射所述沉积区B1。所述光源310包括但不限于激光光源。在现有技术汇中，实现所述光源310仅照射在所述非沉积区B2而不照射在所述沉积区B1的方法有很多，本领域技术人员可从现有的方法中选取。
在本实施例中，所述光源310通过一掩膜板320后照射在所述基板300上，即所述掩膜板320设置在所述光源310与所述基板300之间。所述掩膜板320为本领域常规的光罩（photo mask）。所述掩膜板320具有多个镂空区321及多个阻挡区322，所述镂空区321与所述非沉积区B2对应设置，所述阻挡区与所述沉积区B1对应设置。即在所述非沉积区B2对应位置没有掩膜板320遮挡，而在所述沉积区B1对应的位置有所述掩膜板320遮挡。其中，所述光源310的光线如图中箭头所示，光源310发出的光照射向所述掩膜板320后，在所述镂空区321处，所述光源310发出的光直接照射在基板300上，并穿过所述基板300照射在所述非沉积区B2，而在所述阻挡区322，所述光源310发生的光被所述掩膜板320阻挡，并未照射在所述基板300上，即并未照射在所述沉积区B1。
请参阅步骤S22及图3D，一蒸发源330产生一有机材料蒸汽（如图中虚线箭头所示），所述有机材料蒸汽与所述第一表面301接触。即所述蒸发源330从所述第一表面301侧向所述基板300输送有机材料蒸汽。所述蒸发源330为本领域蒸镀工艺的常规结构，不再赘述。在该步骤中，所述光源310也作用于所述基板300。
所述有机材料蒸汽被所述基板300阻挡后在所述基板300的第一表面301沉积。具体地说，在所沉积区B1，所述有机材料蒸汽成核及成膜，形成一有机材料块340；在所述非沉积区B2，所述有机材料蒸汽未形成一有机材料块，其原因在于，所述光源310照射在所述非沉积区B2，有机材料蒸汽到达所述非沉积区B2后，受到所述光源310的照射及活化，所述有机材料蒸汽并不能成核及成膜，即所述有机材料蒸汽不能在所述非沉积区B2处沉积形成有机材料块。在本实施例中，所述有机材料块340为子像素。
本发明的显示面板的制备方法利用现有光罩技术，通过激光等光源照射在掩膜板320上，光源310的光线选择性穿过掩膜板照射到基板300上，在光源所照射到的区域产生热效应或光化学效应，活化有机材料蒸汽中的粒子，阻止粒子在该区域的沉积。本发明的制备方法避免使用精细金属掩膜版，无需周期性张网、清洗的工序，降低量产维护成本，同时避免了因蒸镀角度造成的像素边缘较大的阴影区，另外还能避免镀膜过程中精细金属掩膜版温度升高造成的PPA变化，能够应用于高解析度显示面板的制造。
进一步，在一实施例中，所述制备方法还包括一对位步骤，调整所述基板300及所述掩膜板320的位置，以使所述阻挡区322对应所述沉积区B1设置，所述镂空区321对应所述非沉积区B2设置。其中调整的方法为本领域的常规方法，例如，可采用基板300及掩膜板320各自的对位系统进行调整，本文不再赘述。
进一步，请继续参阅图3D，在一实施例中，在形成所述有机材料块340的步骤中，所述有机材料块340的侧边突出于所述沉积区B1与所述非沉积区B2的界限E，即所述有机材料块340除覆盖所述沉积区B1之外，其还覆盖部分所述非沉积区B2，所述镂空区321的边缘即为所述沉积区B1与所述非沉积区B2的界限。其原因在于，由于所述掩膜板的镂空区321的边缘对光源310的光线的遮挡，使得在所述镂空区321的边缘处光源310的照射强度降低，部分所述有机材料蒸汽中的粒子没有被活化，从而在该处沉积。由于从所述镂空区321的边缘至所述镂空区321的中心，所述光源的强度逐渐增加，则能够在非沉积区B2沉积的有机材料蒸汽越来越少，所以，在所述非沉积区B2处所述有机材料块340的厚度递减，即所述有机材料块340的侧边呈弧形。
本发明还提供一种采用上述的方法制备的显示面板。图4是本发明显示面板的结构示意图。请参阅图4，所述显示面板包括一基板400。所述基板400为显示面板的常规基板，例如玻璃基板、柔性基板等。在本实施例中，所述基板400为玻璃基板。在所述基板400上设置有薄膜晶体管层等常规结构。
所述基板400具有交替设置的多个沉积区B1及多个非沉积区B2，在所述沉积区B1设置有一有机材料块440。在本实施例中，所述有机材料块440即为子像素。其中，所述有机材料块440的侧边突出于所述沉积区B1与所述非沉积区B2的界限E。即所述有机材料块440除覆盖所述沉积区B1之外，其还覆盖部分所述非沉积区B2。所述沉积区B1与所述非沉积区B2的界限由其工艺决定，在本实施例中，所述沉积区B1与所述非沉积区B2的界限即为在制备所述显示面板时使用的掩膜板的镂空区的边缘。在所述有机材料块440突出于所述界限E的部分，所述有机材料块440的厚度递减，所述有机材料块440的侧边呈弧形。
所述显示装置还包括盖板450等结构，在本文中并未描述所述显示面板的其他结构，本领域技术人员应当能够从现有技术中获取所述显示面板的其他结构。
以上所述仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。
 工业实用性
本申请的主题可以在工业中制造和使用，具备工业实用性。

Claims (14)

  1. 一种显示面板的制备方法，其包括如下步骤：提供一基板，所述基板具有一第一表面及一第二表面，所述第一表面与所述第二表面相对设置，在所述第一表面上具有交替设置的多个沉积区及多个非沉积区；提供一掩膜板，所述掩膜板包括间隔设置的多个阻挡区及多个镂空区，所述阻挡区对应所述沉积区设置，所述镂空区对应所述非沉积区设置；提供一光源，所述光源照射在所述掩膜板上，在所述镂空区，所述光源穿过所述镂空区后照射在所述非沉积区，在所述阻挡区，所述光源被阻挡；一蒸发源产生一有机材料蒸汽，所述有机材料蒸汽与所述第一表面接触，所述有机材料蒸汽在所述沉积区形成一有机材料块，在所述非沉积区，所述有机材料蒸汽未形成一有机材料块,所述有机材料块的侧边的边缘突出于所述沉积区与所述非沉积区的界限；以及所述制备方法还包括一对位步骤，调整所述基板及所述掩膜板的位置，以使所述阻挡区对应所述沉积区设置，所述镂空区对应所述非沉积区设置。
  2. 根据权利要求1所述的显示面板的制备方法，其中所述沉积区为一子像素区，所述非沉积区为一非子像素区，形成在所述沉积区的所述有机材料块为一子像素。
  3. 根据权利要求1所述的显示面板的制备方法，其中所述有机材料块的一侧边突出于所述沉积区与所述非沉积区的界限，在所述非沉积区，所述有机材料块的厚度递减。
  4. 根据权利要求1所述的显示面板的制备方法，其中所述光源为激光光源。
  5. 一种显示面板的制备方法，其中包括如下步骤：提供一基板，所述基板具有一第一表面及一第二表面，所述第一表面与所述第二表面相对设置，在所述第一表面上具有交替设置的多个沉积区及多个非沉积区；提供一光源，所述光源照射所述第二表面，并进一步从所述第二表面照射在所述非沉积区；以及一蒸发源产生一有机材料蒸汽，所述有机材料蒸汽与所述第一表面接触，所述有机材料蒸汽在所述沉积区形成一有机材料块，在所述非沉积区，所述有机材料蒸汽未形成一有机材料块。
  6. 根据权利要求5所述的显示面板的制备方法，其中所述制备方法还包括如下步骤：在所述光源从所述第二表面照射在所述非子像素区的步骤之前，提供一掩膜板，所述掩膜板包括间隔设置的多个阻挡区及多个镂空区，所述阻挡区对应所述沉积区设置，所述镂空区对应所述非沉积区设置；在所述光源从所述第二表面照射在所述非沉积区的步骤中，所述光源照射在所述掩膜板上，在所述镂空区，所述光源穿过所述镂空区后照射在所述非沉积区，在所述阻挡区，所述光源被阻挡。
  7. 根据权利要求6所述的显示面板的制备方法，其中所述制备方法还包括一对位步骤，调整所述基板及所述掩膜板的位置，以使所述阻挡区对应所述沉积区设置，所述镂空区对应所述非沉积区设置。
  8. 根据权利要求6所述的显示面板的制备方法，其中在形成所述有机材料块的步骤中，所述有机材料块的一侧边的边缘突出于所述沉积区与所述非沉积区的界限。
  9. 根据权利要求5所述的显示面板的制备方法，其中所述沉积区为一子像素区，所述非沉积区为一非子像素区，形成在所述沉积区的所述有机材料块为一子像素。
  10. 根据权利要求5所述的显示面板的制备方法，其中所述有机材料块的侧边突出于所述沉积区与所述非沉积区的界限，在所述非沉积区，所述有机材料块的厚度递减。
  11. 根据权利要求5所述的显示面板的制备方法，其中所述光源为激光光源。
  12. 一种采用权利要求5所述的方法制备的显示面板，其中包括一基板，所述基板具有交替设置的多个沉积区及多个非沉积区，在所述沉积区设置有一有机材料块，所述有机材料块的侧边突出于所述沉积区与所述非沉积区的界限，在所述非沉积区，所述有机材料块的厚度递减。
  13. 根据权利要求12所述的显示面板，其中所述有机材料块为一子像素。
  14. 根据权利要求12所述的显示面板，其中所述有机材料块的侧边呈弧形。
PCT/CN2018/122425 2018-11-28 2018-12-20 显示面板的制备方法及显示面板 Ceased WO2020107579A1 (zh)

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