WO2020103156A1 - 电路板及计算设备 - Google Patents

电路板及计算设备

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Publication number
WO2020103156A1
WO2020103156A1 PCT/CN2018/117294 CN2018117294W WO2020103156A1 WO 2020103156 A1 WO2020103156 A1 WO 2020103156A1 CN 2018117294 W CN2018117294 W CN 2018117294W WO 2020103156 A1 WO2020103156 A1 WO 2020103156A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
chassis
heat dissipation
pcb board
wall
Prior art date
Application number
PCT/CN2018/117294
Other languages
English (en)
French (fr)
Inventor
杨斌
Original Assignee
北京比特大陆科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 北京比特大陆科技有限公司 filed Critical 北京比特大陆科技有限公司
Priority to PCT/CN2018/117294 priority Critical patent/WO2020103156A1/zh
Publication of WO2020103156A1 publication Critical patent/WO2020103156A1/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means

Definitions

  • the present disclosure relates to the technical field of electrical equipment, in particular to a circuit board and computing equipment.
  • the host generally includes a chassis and a printed circuit board (Printed Circuit Board, referred to as a PCB board) disposed in the chassis.
  • the PCB board is provided with a chip; because the chip generates heat when it is working Therefore, how to release the heat generated by the chip to avoid overheating of the PCB has become a research hotspot.
  • a heat sink is usually provided on the PCB board to release the heat generated by the chip.
  • the PCB board and the chassis are connected by fastening bolts.
  • the heat sink is generally mainly composed of metal, and the quality of the heat sink is large, so that the PCB board directly connected to the chassis is subjected to a large force, and the PCB board is easily damaged.
  • An embodiment of the present disclosure provides a circuit board, including: a PCB board and a first heat sink connected to one side of the PCB board; wherein, the PCB board is disposed on a heat dissipation substrate of the first heat sink;
  • the first heat sink has a first connection part, and the PCB board and the first heat sink are fixed in the chassis through the first connection part.
  • the first heat sink includes a heat sink, and the heat sink and the heat sink bottom are integrally formed.
  • the PCB board is fixed on the heat dissipation substrate of the first heat sink through a structural member, and a thermally conductive silicone glue is filled between the PCB board and the heat dissipation substrate.
  • the first connection portion includes a first plug-in portion, a first slot is provided on an inner wall of the chassis, and the first plug-in portion is inserted in the first In a slot.
  • the first plug-in portion includes a plate body extending from the heat dissipation bottom plate of the first heat sink to the outside of the PCB board.
  • the first connection portion further includes a locking structure connected to the first insertion portion, when the first insertion portion is inserted in the first slot Afterwards, the locking structure abuts the side wall of the first slot, so that the heat dissipation bottom sheet moves toward the heat dissipation inner wall of the chassis.
  • the distance between the first heat sink and the heat dissipation inner wall is a preset value.
  • the other side of the PCB board is further provided with a second heat sink.
  • An embodiment of the present disclosure also provides a computing device, including a chassis, and at least one circuit board as described above disposed in the chassis.
  • At least one outer wall of the chassis is provided with a plurality of heat dissipation fins.
  • the PCB board is provided on the heat dissipation film of the first heat sink, and the first connection part is provided on the first heat sink.
  • the first heat sink is fixed on the chassis; the PCB board is connected to the chassis through the first connection part on the first heat sink, reducing the stress on the PCB board and avoiding the damage of the PCB board; and, the body of the first heat sink is used as The connection piece directly contacts the chassis, which also improves the heat dissipation efficiency.
  • FIG. 1 is a schematic structural diagram of a circuit board provided by an embodiment of the present disclosure.
  • FIG. 1 is a schematic structural diagram of a circuit board provided by an embodiment of the present disclosure. For the sake of clarity, the figure shows the chassis for detailed description.
  • This embodiment provides a circuit board, including: a PCB board 20 and a first heat sink 30 connected to one side of the PCB board 20; wherein, the PCB board 20 is disposed on the heat dissipation substrate 302 of the first heat sink 30; the first heat dissipation
  • the device 30 has a first connection portion, and the PCB board 20 and the first heat sink 30 are fixed in the chassis 10 through the first connection portion.
  • the cabinet 10 has a receiving cavity, and the circuit board is disposed in the receiving cavity.
  • the case 10 is surrounded by a plurality of side plates, and the PCB board 20 and the heat dissipation bottom plate 302 are both disposed parallel to the heat dissipation inner wall 101 of the case 10.
  • the heat dissipation inner wall 101 is the innermost wall in the accommodating cavity.
  • the PCB board 20 may include a substrate 201 and a chip 202 provided on the substrate 201;
  • the substrate 201 is mainly composed of an insulating material such as resin, a circuit with a certain pattern is provided on the side of the substrate 201, and the chip 202 is connected to the circuit on the substrate 201 ;
  • the chip 202 may be provided on the side of the substrate 201 facing the heat dissipation inner wall 101 and the side of the back discrete heat inner wall 101; of course, the chip 202 may also be provided only on the side of the substrate 201 facing the heat dissipation inner wall 101 Or, the chip 202 is only provided on the side of the substrate 201 on the back of the discrete thermal inner wall 101.
  • the PCB board 20 is fixed on the heat dissipation bottom plate 302 of the first heat sink 30 through a structural member, and the thermal conductive silicone 50 is filled between the PCB board 20 and the heat dissipation bottom plate 302.
  • the thermally conductive silicone 50 not only plays a role of bonding, but also improves the heat transfer efficiency between the PCB board 20 and the first heat sink 30.
  • the PCB board 20 is fixed on the heat dissipation bottom plate 302 of the first heat sink 30 by a structural member, wherein the structure member may be a bolt.
  • the substrate 201 of the PCB board 20 is fixed on the heat dissipation bottom plate 302 by bolting.
  • the structural member may also have other structures, as long as the PCB board 20 can be fixed on the heat dissipation substrate 302 of the first heat sink 30.
  • the first heat sink 30 includes a heat dissipation substrate 302 and A heat sink 301 provided on the heat sink 302, a first connection surface of the heat sink 302 is connected to the PCB board, a second connection surface on the heat sink 302 opposite to the first connection surface is connected to the heat sink 301; the heat sink 302 and the heat sink
  • the heat sink 301 may be made of copper, iron, aluminum and other metal materials, so that the heat on the PCB 20 can be quickly transferred to the heat sink 302 and the heat sink 301, and then released by the heat sink 302 and the heat sink 301 into the air .
  • the heat sink 301 and the heat sink 302 are integrally formed; in other implementations, the heat sink 302 can also be connected to the heat sink 301 by bolting; or the heat sink 302 can be welded Connected to the heat sink 301. Further, there may be multiple heat sinks 301, and each heat sink 301 is arranged in parallel and at equal intervals. The heat sink 301 may be perpendicular to the heat sink 302, or another angle between the heat sink 301 and the heat sink 302.
  • the area of the heat dissipation substrate 302 can be larger than the surface area of the PCB board 20, so that the PCB board 20 can completely contact the heat dissipation substrate 302, so as to improve the heat transfer efficiency between the heat dissipation substrate 302 and the PCB board 20; of course, The area of the heat dissipation substrate 302 may be slightly smaller than the surface area of the PCB board 20 as long as the chip can contact the first heat sink 30 without affecting the connection between the first connection portion and the chassis 10.
  • the first heat sink 30 may also have other structures.
  • the first heat sink 30 may include a heat dissipation block, one side of the heat dissipation block is connected to the PCB board 20, and the other side of the heat dissipation block opposite the side
  • the side surface is arranged toward the heat dissipation inner wall 101; a plurality of heat dissipation holes are arranged at intervals on the heat dissipation block to increase the contact area between the heat dissipation block and the air.
  • the center line of the heat dissipation hole may be disposed perpendicular to the heat dissipation inner wall 101, or the center line of the heat dissipation hole may be disposed parallel to the heat dissipation inner wall 101.
  • the cross section of the heat dissipation hole may have a circular, rectangular, regular hexagonal or other regular shape or the cross section of the heat dissipation hole may have another irregular shape.
  • the first connection portion cooperates with the chassis 10 to fix the first heat sink 30 in the chassis 10 through the first connection portion.
  • the first connecting portion includes a first plug-in portion 3021, a first slot 1021 is provided on the inner wall of the chassis 10, and the first plug-in portion 3021 is inserted in the first slot 1021.
  • installation inner wall is the inner wall adjacent to the heat dissipation inner wall 101 in the chassis 10.
  • the first connection portion further includes a second insertion portion 3022, the first insertion portion 3021 is located at the first end of the first heat sink 30 parallel to the direction of the PCB board 20 and toward the first slot 1021, the second insertion portion
  • the connecting portion 3022 is located on the second end of the first heat sink 30 opposite to the first end;
  • a second slot 1031 is provided on the second mounting inner wall 103 of the chassis 10, and the second insertion portion 3022 is inserted in the second insertion In the slot 1031.
  • the connection strength between the first heat sink 30 and the chassis 10 can be further improved to prevent the first heat sink 30 from shaking.
  • the first connection portion provided on the first heat sink 30 may also have other structures, for example: the first connection portion includes a connection plate, the connection plate is disposed parallel to the inner wall of the chassis 10, and the connection plate A connection hole is provided on the corresponding wall. Correspondingly, a connection thread hole is formed on the inner wall of the chassis 10. The connection screw passes through the connection hole and cooperates with the connection thread hole to realize the connection between the first radiator 30 and the chassis 10.
  • the installation process of the circuit board provided in this embodiment is as follows: first, the substrate 201 is installed on the heat dissipation substrate 301 by bolt connection, so as to realize the assembly of the circuit board. After this, the first heat sink 30 on the PCB board 20 is disposed toward the heat dissipation inner wall 101 of the chassis 10, and the first connection portion on the first heat sink 30 is connected to the chassis 10 to dissipate the PCB board 20 and the first heat sink The device 30 is fixed on the chassis 10.
  • the chip 202 on the PCB board 20 When the host works, the chip 202 on the PCB board 20 generates heat, and then transfers the heat to the heat dissipation substrate 301, and then transfers the heat to the air inside the chassis 10 through the heat dissipation substrate 301 on the first radiator 30 to 20 to cool, to avoid the PCB board 20 temperature is too high and affect the work of the chip 202 on the PCB board 20.
  • each PCB board 20 is arranged in parallel, and each PCB board 20 is provided with a first heat sink 30 on the side facing the heat dissipation inner wall 101, each Each of the first heat sinks 30 is provided with a first connection portion, and the first connection portion of each first heat sink 30 is connected to the chassis 10 to realize the connection between each PCB board 20 and the chassis 10.
  • the PCB board 20 is disposed on the heat dissipation substrate 302 of the first heat sink 30, and a first connection portion is provided on the first heat sink 30.
  • the first connection portion is connected to the chassis 10 to connect the PCB 20
  • the first heat sink 30 is fixed on the chassis 10; the PCB board 20 is connected to the chassis 10 through the first connection portion on the first heat sink 30, which reduces the stress on the PCB board 20 and avoids damage to the PCB board 20.
  • the first plug-in portion 3021 may be a plate body that extends from the heat-dissipating bottom plate 302 of the first heat sink 30 to the outside of the PCB board 20, and has a simple structure and firm plug-in connection. Moreover, the plate body of the first heat sink 30 directly contacts the chassis 10 as a connecting member, which also improves the heat dissipation efficiency.
  • the first insertion portion 3021 may have other structures as long as it can be inserted into the first slot 1021.
  • the first mounting inner wall 102 is the inner wall of the chassis 10 adjacent to the heat dissipating inner wall 101 and located at the bottom end of the chassis 10
  • the second mounting inner wall 103 is the inner wall of the chassis 10 adjacent to the heat dissipating inner wall 101 and located at the top of the chassis 10 ;
  • the first installation inner wall 102 and the second installation inner wall 103 are parallel, and the first installation inner wall 102 and the second installation inner wall 103 are perpendicular to the heat dissipation inner wall 101.
  • the first heat sink 30 disposed between the PCB board 20 and the heat dissipation inner wall 101 includes a heat dissipation substrate 302 and a plurality of spaced apart heat dissipation fins 301, the heat dissipation substrate 302 is connected to the PCB board 20 toward the side of the PCB board 20, and each heat dissipation fin 301 is disposed on the side of the heat dissipation bottom sheet 302 facing the heat dissipation inner wall 101; the bottom end of the heat dissipation bottom sheet 302 extends toward the first mounting inner wall 102 to form a first board body located outside the PCB board 20, and the first insertion portion 3021 includes the first board Similarly, the top end of the heat dissipation bottom plate 302 extends toward the second mounting inner wall 103 to form a second board body located on the outside of the PCB board.
  • the second insertion portion 3022 includes a second board body; the first board body is inserted in the first The first slot 1021 on the mounting
  • the first connection portion further includes a locking structure connected to the first insertion portion 3021.
  • the locking structure abuts the first insertion portion
  • the side wall of the slot 1021 moves the heat dissipation film 302 toward the heat dissipation inner wall 101 of the chassis 10.
  • the locking structure may abut the first insertion portion 3021 toward the heat dissipation inner wall 101 to prevent the first insertion portion 3021 from shaking in the first slot 1021.
  • the locking structure may include a locking bar.
  • the locking structure may also have other structures, as long as it can abut the side wall of the first slot 1021 and then push the heat dissipation bottom plate 302 toward the heat dissipation inner wall 101 of the chassis 10.
  • the distance between the first heat sink 30 and the heat dissipation inner wall 101 is a preset value. Properly reducing the size of the preset value can reduce the distance between the first heat sink 30 and the heat dissipation inner wall 101, so that the heat on the first heat sink 30 can be quickly transferred to the heat dissipation inner wall 101, and then the chassis 10 is released into the outside air to speed up the cooling rate of the PCB 20.
  • the size of the preset value is reduced as much as possible to increase the heat in the first The transfer rate between the heat sink 30 and the heat dissipation inner wall 101.
  • the distance between the first slot 1021 and the heat dissipation interior 101 is a preset distance.
  • a second heat sink 40 is also provided on the other side of the PCB board 20.
  • the first heat sink 30 is provided on the first side of the PCB board 20 facing the heat dissipation inner wall 101
  • the second heat sink 40 is provided on the second side of the PCB board 20 opposite to the first side. The heat on the PCB board 20 can be released into the air through the second heat sink 40 and the first heat sink 30 at the same time, and the cooling effect on the PCB board 20 can be improved.
  • a protrusion 401 is provided on the second heat sink 40, and the protrusion 401 is connected to the chip 202 on the second side.
  • the connection of the protruding portion 401 and the chip 202 can directly transfer the heat generated by the chip 202 to the second heat sink 40, and then be released into the air by the second heat sink 40.
  • a thermally conductive adhesive pad is provided between the protrusion 401 and the chip 202.
  • the thermal conductive glue can accelerate the heat transfer speed between the protrusion 401 and the chip 202.
  • a computing device including a chassis 10, and at least one circuit board as described above disposed in the chassis 10.
  • a plurality of heat dissipation fins 104 are provided on the outer wall of at least one chassis 10.
  • a plurality of heat dissipation fins 104 provided on the outer wall of the chassis 10 can increase the contact area between the outer wall of the chassis 10 and the outside air, so that the heat of the chassis 10 can be quickly transferred to the air, so as to avoid excessive temperature of the air inside the chassis 10 .
  • the heat dissipation fins 104 and the chassis 10 can be integrally formed by casting or injection molding to simplify the processing process of the heat dissipation fins 104.
  • the heat dissipation fins 104 can also be connected to the outer wall of the chassis 10 by bolting or snapping.
  • the PCB board 20 is disposed on the heat dissipation substrate 302 of the first heat sink 30, and a first connection portion is provided on the first heat sink 30, and the first connection portion is connected to the chassis 10.
  • the PCB board 20 is connected to the chassis 10 through the first connection portion on the first heat sink 30, reducing the stress on the PCB board 20 and avoiding the PCB board 20 damage; and, the plate body of the first heat sink 30 directly contacts the chassis 10 as a connecting member, which also improves the heat dissipation efficiency.
  • first, second, etc. may be used in this disclosure to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another.
  • the first element can be called the second element, and likewise, the second element can be called the first element, as long as all occurrences of the "first element” are consistently renamed and all occurrences of The “second component” can be renamed consistently.
  • the first element and the second element are both elements, but they may not be the same element.

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  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
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  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本申请涉及一种电路板及计算设备，包括：包括PCB板以及与PCB板一侧连接的第一散热器；其中，PCB板设置在第一散热器的散热底片上；第一散热器具有第一连接部，通过第一连接部将PCB板和第一散热器固定在机箱内；PCB板通过第一散热器上的第一连接部与机箱连接，减小了PCB板的受力，避免PCB板损坏；并且，第一散热器的板体作为连接件直接与机箱接触，也提升了散热效率。

Description

电路板及计算设备 技术领域
本公开涉及电器设备技术领域，尤其涉及一种电路板及计算设备。
背景技术
电器设备中常具有控制其他设备工作的主机，主机一般包括机箱以及设置在机箱内的印制电路板(Printed Circuit Board，简称PCB板)，PCB板上设置有芯片；由于芯片在工作时会产生热量，因此如何释放芯片产生的热量以免PCB板过热成为研究的热点。
现有技术中，通常在PCB板上设置散热器来释放芯片产生的热量。也就是说，将散热器与PCB板或PCB板上的芯片连接后，再将PCB板与机箱之间通过紧固螺栓连接。
然而，散热器一般主要由金属构成，散热器的质量较大，使得直接与机箱连接的PCB板受力较大，容易造成PCB板损坏。
发明内容
本公开实施例提供一种电路板，包括：PCB板以及与所述PCB板一侧连接的第一散热器；其中，所述PCB板设置在所述第一散热器的散热底片上；所述第一散热器具有第一连接部，通过所述第一连接部将所述PCB板和所述第一散热器固定在机箱内。
如上所述的电路板，优选地，所述第一散热器包括散热片，所述散热片与所述散热底片一体成型。
如上所述的电路板，优选地，所述PCB板通过结构件固定在所述第一散热器的所述散热底片上，且所述PCB板和所述散热底片之间填充导热硅 胶。
如上所述的电路板，优选地，所述第一连接部包括第一插接部，所述机箱的安装内壁上设置有第一插槽，所述第一插接部插设在所述第一插槽中。
如上所述的电路板，优选地，所述第一插接部包括所述第一散热器的所述散热底片延伸至所述PCB板外侧的板体。
如上所述的电路板，优选地，所述第一连接部还包括与所述第一插接部连接的锁紧结构，当所述第一插接部插设在所述第一插槽中后，所述锁紧结构抵顶所述第一插槽的侧壁，以使所述散热底片向所述机箱的所述散热内壁移动。
如上所述的电路板，优选地，所述第一散热器与所述散热内壁之间的距离为预设值。
如上所述的电路板，优选地，所述PCB板的另一侧还设置有第二散热器。
本公开实施例还提供一种计算设备，包括机箱，以及设置在所述机箱内的至少一个如上所述的电路板。
如上所述的计算设备，优选地，至少一个所述机箱的外壁上设置有多个散热翅片。
本公开实施例提供的电路板及计算设备，PCB板设置在第一散热器的散热底片上，在第一散热器上设置第一连接部，第一连接部与机箱连接，以将PCB板以及第一散热器固定在机箱上；PCB板通过第一散热器上的第一连接部与机箱连接，减小了PCB板的受力，避免PCB板损坏；并且，第一散热器的板体作为连接件直接与机箱接触，也提升了散热效率。
附图说明
一个或多个实施例通过与之对应的附图进行示例性说明，这些示例性 说明和附图并不构成对实施例的限定，附图中具有相同参考数字标号的元件示为类似的元件，附图不构成比例限制，并且其中：
图1为本公开实施例提供的电路板的结构示意图。
附图标记说明：
10、机箱；
101、散热内壁；
102、第一安装内壁；
103、第二安装内壁；
104、散热翅片；
1021、第一插槽；
1031、第二插槽；
20、PCB板；
201、基板；
202、芯片；
30、第一散热器；
301、散热片；
302、散热底片；
3021、第一插接部；
3022、第二插接部；
40、第二散热器；
401、凸起部；
50、导热硅胶。
具体实施方式
为了能够更加详尽地了解本公开实施例的特点与技术内容，下面结合附图对本公开实施例的实现进行详细阐述，所附附图仅供参考说明之用，并非 用来限定本公开实施例。在以下的技术描述中，为方便解释起见，通过多个细节以提供对所披露实施例的充分理解。然而，在没有这些细节的情况下，一个或多个实施例仍然可以实施。在其它情况下，为简化附图，熟知的结构和装置可以简化展示。
图1为本公开实施例提供的电路板的结构示意图。为了表述清楚，该附图中示出了机箱用以详细说明。
参照图1。本实施例提供一种电路板，包括：PCB板20以及与PCB板20一侧连接的第一散热器30；其中，PCB板20设置在第一散热器30的散热底片302上；第一散热器30具有第一连接部，通过第一连接部将PCB板20和第一散热器30固定在机箱10内。
本实施例中本实施例中，机箱10具有容纳腔，电路板设置在容纳腔内。为了便于描述，以机箱10呈长方体状为例，机箱10由多个侧板围设而成，PCB板20以及散热底片302均平行于机箱10的散热内壁101设置。以图1所示的方位，散热内壁101为容纳腔中位于最右侧的内壁。
具体地，PCB板20可以包括基板201以及设置在基板201上的芯片202；基板201主要由树脂等绝缘材料构成，基板201侧面上设置具有一定图形的电路，芯片202与基板201上的电路连接；当芯片202为多个时，可以在基板201朝向散热内壁101的侧面以及背离散热内壁101的侧面上均设置有芯片202；当然，芯片202也可以只设置在基板201朝向散热内壁101的侧面，或者，芯片202只设置在基板201背离散热内壁101的侧面上。
本实施例中，PCB板20通过结构件固定在第一散热器30的散热底片302上，且PCB板20和散热底片302之间填充导热硅胶50。导热硅胶50不但起到粘接作用，还可以提高PCB板20与第一散热器30之间的热量传递效率。
进一步地，PCB板20通过结构件固定在第一散热器30的散热底片302 上，其中结构件可以为螺栓，相应的，PCB板20的基板201通过螺栓连接的方式固定在散热底片302上，以实现PCB板20与第一散热器30之间的连接；当然结构件还可以具有其他的结构，只要能够将PCB板20固定在第一散热器30的散热底片302上即可。
本实施例中第一散热器30可以有多种，只要能够将PCB板20上的热量释放到空气中，进而对PCB板20进行冷却即可；例如：第一散热器30包括散热底片302以及设置在散热底片302上的散热片301，散热底片302的第一连接面与PCB板连接，散热底片302上与第一连接面相对的第二连接面与散热片301连接；散热底片302和散热片301可以均由铜、铁、铝等金属材质构成，以使PCB板20上的热量可以快速的传递至散热底片302和散热片301上，进而由散热底片302和散热片301释放到空气中。在一个优选地的实现方式中，散热片301与散热底片302一体成型；在其他的实现方式中，散热底片302还可以通过螺栓连接的方式与散热片301连接；或者散热底片302通过焊接的方式与散热片301连接。进一步地，散热片301可以为多个，各散热片301平行且等间隔的设置，散热片301可以垂直于散热底片302，或者散热片301与散热底片302之间具有其他的夹角。
值得注意的是，散热底片302的面积可以大于PCB板20的表面积，以使PCB板20可以完全的与散热底片302接触，以提高散热底片302与PCB板20之间的热量传递效率；当然，散热底片302的面积可以稍小于PCB板20的表面积，只要芯片可以接触到第一散热器30且不影响第一连接部与机箱10的连接即可。
本实施例中，第一散热器30还可以具有其他的结构，例如：第一散热器30可以包括散热块，散热块的一个侧面与PCB板20连接，散热块中与该侧面相对的另一侧面朝向散热内壁101设置；散热块上间隔的设置多个散热孔，以增加散热块与空气的接触面积。具体地，散热孔的中心线可以垂直于散热内壁101设置，或者散热孔的中心线与散热内壁101平行设 置。散热孔的截面可以呈圆形、矩形、正六边形等规则形状或者散热孔的截面呈其他的不规则形状。
本实施例中，机箱10上与第一连接部配合，以通过第一连接部将第一散热器30固定在机箱10内。在一个可实现的方式中，第一连接部包括第一插接部3021，机箱10的安装内壁上设置有第一插槽1021，第一插接部3021插设在第一插槽1021中。通过将第一散热器30上的第一插接部3021插设在安装内壁上的第一插槽1021内，以实现第一散热器30与机箱10之间的连接，安装和拆卸较为方便。
需要说明的是，安装内壁为机箱10中与散热内壁101相邻的内壁。
进一步地，第一连接部还包括第二插接部3022，第一插接部3021位于第一散热器30沿平行于PCB板20方向且朝向第一插槽1021的第一端，第二插接部3022位于第一散热器30上与第一端相对的第二端；在机箱10的第二安装内壁103上设置有第二插槽1031，第二插接部3022插设在第二插槽1031内。在第一散热器30上的第一插接部3021插设在机箱10内壁上的第一插槽1021内的同时，第一散热器30的第二插接部3022插设在机箱10内壁上的第二插槽1031内，可以进一步提高第一散热器30与机箱10之间的连接强度，以免第一散热器30抖动。
在其他实现方式中，设置在第一散热器30上的第一连接部还可以具有其他的结构，例如：第一连接部包括连接板，连接板与机箱10的安装内壁平行设置，在连接板上设置连接孔，相应的在机箱10内壁上开设有连接螺纹孔，连接螺钉穿过连接孔后与连接螺纹孔配合，以实现第一散热器30与机箱10之间的连接。
本实施例提供的电路板的安装过程为，首先将基板201通过螺栓连接的方式安装在散热底片301上，以实现电路板的组装。在此之后，使PCB板20上的第一散热器30朝向机箱10的散热内壁101设置，并且使第一散热器30上第一连接部与机箱10连接，以将PCB板20和第一散热器30 固定在机箱10上。主机工作时，PCB板20上的芯片202产生热量，进而将热量传递至散热底片301，之后通过第一散热器30上的散热底片301将热量传递至机箱10内部的空气中，以对PCB板20进行冷却，避免PCB板20的温度过高而影响PCB板20上的芯片202工作。
需要说明的是，当机箱10内设置有多个PCB板20时，各PCB板20平行设置，并且每一PCB板20朝向散热内壁101的侧面上均安装有第一散热器30，每一第一散热器30上均设置有第一连接部，每一第一散热器30上的第一连接部均与机箱10连接，以实现各PCB板20与机箱10之间的连接。
本实施提供的电路板，PCB板20设置在第一散热器30的散热底片302上，在第一散热器30上设置第一连接部，第一连接部与机箱10连接，以将PCB板20以及第一散热器30固定在机箱10上；PCB板20通过第一散热器30上的第一连接部与机箱10连接，减小了PCB板20的受力，避免PCB板20损坏。
本实施例中，第一插接部3021可以为第一散热器30的散热底片302延伸至PCB板20外侧的板体，结构简单并且插接牢固。并且，第一散热器30的板体作为连接件直接与机箱10接触，也提升了散热效率。当然，第一插接部3021还可以具有其他的结构，只要能够插设在第一插槽1021内即可。
继续参照图1，第一安装内壁102为机箱10上与散热内壁101相邻且位于机箱10底端的内壁，第二安装内壁103为机箱10上与散热内壁101相邻且位于机箱10顶端的内壁；第一安装内壁102与第二安装内壁103平行，且第一安装内壁102与第二安装内壁103均与散热内壁101垂直。设置在PCB板20与散热内壁101之间的第一散热器30，包括散热底片302以及间隔设置的多个散热片301，散热底片302朝向PCB板20的侧面与PCB板20连接，各散热片301设置在散热底片302朝向散热内壁101的侧 面上；散热底片302的底端向第一安装内壁102延伸，形成位于PCB板20外侧的第一板体，第一插接部3021包括第一板体；相同的，散热底片302的顶端向第二安装内壁103延伸，形成位于PCB板外侧的第二板体，第二插接部3022包括第二板体；第一板体插设在第一安装内壁102上的第一插槽1021内，第二板体插设在第二安装内壁103上的第二插槽1031内。
本实施例中，第一连接部还包括与第一插接部3021连接的锁紧结构，当第一插接部3021插设在第一插槽1021中后，锁紧结构抵顶第一插槽1021的侧壁，以使散热底片302向机箱10的散热内壁101移动。锁紧结构可以向散热内壁101抵顶第一插接部3021，以免第一插接部3021在第一插槽1021内晃动。
锁紧结构可以包括锁紧条，当然锁紧结构还可以具有其他的结构，只要能够抵顶第一插槽1021的侧壁，进而向机箱10的散热内壁101推动散热底片302即可。
具体地，第一散热器30与散热内壁101之间的距离为预设值。适当的减小预设值的大小，可以减小第一散热器30与散热内壁101之间的距离，以使第一散热器30上的热量可以快速的传递至散热内壁101上，进而由机箱10释放到外界空气中，以加快对PCB板20的冷却速度。
具体地，在保证将电路板安装在机箱10内时，第一散热器30不会与第一散热内壁101接触的前提下，尽可能的减小预设值的大小，以提高热量在第一散热器30与散热内壁101之间的传递速率。
合理的设置第一插槽1021与散热内部101之间的距离，可以在将第一插接部3021插设在第一插槽1021内，并且锁紧结构抵顶第一插槽1021的内壁后，第一散热器30与散热内壁101之间的距离为预设距离。
本实施例中，PCB板20的另一侧还设置有第二散热器40。第一散热器30设置在PCB板20朝向散热内壁101的第一侧面上，第二散热器40设置在PCB板20上与第一侧面相对的第二侧面上。PCB板20上的热量可 以经第二散热器40和第一散热器30同时释放到空气中，可以提高对PCB板20的冷却效果。
具体地，第二散热器40上设置有凸起部401，凸起部401与第二侧面上的芯片202连接。凸起部401与芯片202连接可以使芯片202产生的热量直接传递至第二散热器40上，进而由第二散热器40释放到空气中。
进一步地，凸起部401与芯片202之间设置有导热胶垫。导热胶可以加快凸起部401与芯片202之间的热量传递速度。另外，第二侧面上的芯片202为多个，且多个芯片202间隔的设置，此时设置在凸起部401与芯片202之间的导热胶垫还可以填充相邻两芯片202之间的空隙。
在其他实施例中，还提供一种计算设备，包括机箱10，以及设置在机箱10内的至少一个如上所述的电路板。
在一个可实现的方式中，至少一个机箱10的外壁上设置有多个散热翅片104。设置在机箱10外壁上的多个散热翅片104，可以增大机箱10外壁与外界空气的接触面积，以使机箱10的热量可以快速的传递至空气中，以免机箱10内部的空气温度过高。
散热翅片104与机箱10可以通过铸造或者注塑的方式一体成型，以简化散热翅片104的加工过程。当然，散热翅片104还可以通过螺栓连接或者卡接等方式与机箱10的外壁连接。
本公开实施例提供的电路板及计算设备，PCB板20设置在第一散热器30的散热底片302上，在第一散热器30上设置第一连接部，第一连接部与机箱10连接，以将PCB板20以及第一散热器30固定在机箱10上；PCB板20通过第一散热器30上的第一连接部与机箱10连接，减小了PCB板20的受力，避免PCB板20损坏；并且，第一散热器30的板体作为连接件直接与机箱10接触，也提升了散热效率。
当用于本公开中时，虽然术语“第一”、“第二”等可能会在本公开中使用以描述各元件，但这些元件不应受到这些术语的限制。这些术语仅用于将 一个元件与另一个元件区别开。比如，在不改变描述的含义的情况下，第一元件可以叫做第二元件，并且同样第，第二元件可以叫做第一元件，只要所有出现的“第一元件”一致重命名并且所有出现的“第二元件”一致重命名即可。第一元件和第二元件都是元件，但可以不是相同的元件。
本公开中使用的用词仅用于描述实施例并且不用于限制权利要求。如在实施例以及权利要求的描述中使用的，除非上下文清楚地表明，否则单数形式的“一个”(a)、“一个”(an)和“所述”(the)旨在同样包括复数形式。类似地，如在本公开中所使用的术语“和/或”是指包含一个或一个以上相关联的列出的任何以及所有可能的组合。另外，当用于本公开中时，术语“包括”(comprise)及其变型“包括”(comprises)和/或包括(comprising)等指陈述的特征、整体、步骤、操作、元素，和/或组件的存在，但不排除一个或一个以上其它特征、整体、步骤、操作、元素、组件和/或这些的分组的存在或添加。
上述技术描述可参照附图，这些附图形成了本公开的一部分，并且通过描述在附图中示出了依照所描述的实施例的实施方式。虽然这些实施例描述的足够详细以使本领域技术人员能够实现这些实施例，但这些实施例是非限制性的；这样就可以使用其它的实施例，并且在不脱离所描述的实施例的范围的情况下还可以做出变化。比如，流程图中所描述的操作顺序是非限制性的，因此在流程图中阐释并且根据流程图描述的两个或两个以上操作的顺序可以根据若干实施例进行改变。作为另一个例子，在若干实施例中，在流程图中阐释并且根据流程图描述的一个或一个以上操作是可选的，或是可删除的。另外，某些步骤或功能可以添加到所公开的实施例中，或两个以上的步骤顺序被置换。所有这些变化被认为包含在所公开的实施例以及权利要求中。
另外，上述技术描述中使用术语以提供所描述的实施例的透彻理解。然而，并不需要过于详细的细节以实现所描述的实施例。因此，实施例的上述描述是为了阐释和描述而呈现的。上述描述中所呈现的实施例以及根据这些 实施例所公开的例子是单独提供的，以添加上下文并有助于理解所描述的实施例。上述说明书不用于做到无遗漏或将所描述的实施例限制到本公开的精确形式。根据上述教导，若干修改、选择适用以及变化是可行的。在某些情况下，没有详细描述为人所熟知的处理步骤以避免不必要地影响所描述的实施例。

Claims (10)

  1. 一种电路板，其特征在于，包括：PCB板以及与所述PCB板一侧连接的第一散热器；
    其中，所述PCB板设置在所述第一散热器的散热底片上；
    所述第一散热器具有第一连接部，通过所述第一连接部将所述PCB板和所述第一散热器固定在机箱内。
  2. 根据权利要求1所述的电路板，其特征在于，所述第一散热器包括散热片，所述散热片与所述散热底片一体成型。
  3. 根据权利要求1所述的电路板，其特征在于，所述PCB板通过结构件固定在所述第一散热器的所述散热底片上，且所述PCB板和所述散热底片之间填充导热硅胶。
  4. 根据权利要求1所述的电路板，其特征在于，所述第一连接部包括第一插接部，所述机箱的安装内壁上设置有第一插槽，所述第一插接部插设在所述第一插槽中。
  5. 根据权利要求4所述的电路板，其特征在于，所述第一插接部包括所述第一散热器的所述散热底片延伸至所述PCB板外侧的板体。
  6. 根据权利要求4所述的电路板，其特征在于，所述第一连接部还包括与所述第一插接部连接的锁紧结构，当所述第一插接部插设在所述第一插槽中后，所述锁紧结构抵顶所述第一插槽的侧壁，以使所述散热底片向所述机箱的所述散热内壁移动。
  7. 根据权利要求6所述的电路板，其特征在于，所述第一散热器与所述散热内壁之间的距离为预设值。
  8. 根据权利要求1-7任一项所述的电路板，其特征在于，所述PCB板的另一侧还设置有第二散热器。
  9. 一种计算设备，其特征在于，包括机箱，以及设置在所述机箱内的至少一个如权利要求1-8任一项所述的电路板。
  10. 根据权利要求9所述的计算设备，其特征在于，至少一个所述机箱的外壁上设置有多个散热翅片。
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