WO2020100434A1 - Ruban adhésif et procédé de production de boîtier à semi-conducteur - Google Patents

Ruban adhésif et procédé de production de boîtier à semi-conducteur Download PDF

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Publication number
WO2020100434A1
WO2020100434A1 PCT/JP2019/037160 JP2019037160W WO2020100434A1 WO 2020100434 A1 WO2020100434 A1 WO 2020100434A1 JP 2019037160 W JP2019037160 W JP 2019037160W WO 2020100434 A1 WO2020100434 A1 WO 2020100434A1
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WO
WIPO (PCT)
Prior art keywords
adhesive tape
adhesive layer
lead frame
semiconductor package
linking agent
Prior art date
Application number
PCT/JP2019/037160
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English (en)
Japanese (ja)
Inventor
憲明 阿部
佐藤　信之
透 太刀川
Original Assignee
株式会社有沢製作所
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Publication date
Application filed by 株式会社有沢製作所 filed Critical 株式会社有沢製作所
Priority to JP2020556665A priority Critical patent/JP7168681B2/ja
Publication of WO2020100434A1 publication Critical patent/WO2020100434A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings

Definitions

  • the present invention relates to an adhesive tape for use in a semiconductor package manufacturing method, and a semiconductor package manufacturing method.
  • Patent Document 1 discloses “a base material layer made of a polyimide material and an adhesive having a storage elastic modulus at 200 ° C. of 1.0 ⁇ 10 5 Pa or more and an acrylic material having a thickness of 1 to 20 ⁇ m.
  • a heat-resistant adhesive tape characterized in that it is composed of at least a layer and is attached to the back surface of the lead frame.
  • Patent Document 2 discloses an "adhesive tape comprising a base material layer and an adhesive layer laminated on the base material layer, wherein the adhesive layer contains (meth) acrylic acid and It is formed by a pressure-sensitive adhesive containing a polymer containing a structural unit derived from a monomer component other than (meth) acrylic acid and an epoxy crosslinking agent, and the (meth) acrylic acid is based on 100 parts by weight of the monomer component.
  • Non-Patent Document 1 describes the effect of plasma on acrylic resins. Specifically, it is described that the bond is selectively cleaved at a site adjacent to the benzene ring contained in the acrylic resin by exposure to plasma.
  • Patent Document 2 describes that the plasma resistance of the adhesive tape is improved by increasing the degree of crosslinking of the polymer contained in the adhesive layer. However, if the degree of crosslinking of the polymer is increased, it becomes difficult to secure the adhesive force of the adhesive tape under high temperature conditions necessary to prevent mold flash.
  • the present invention provides an adhesive tape that can be peeled off cleanly from a lead frame without leaving a part of the adhesive layer and can prevent mold flash, and a method of manufacturing a semiconductor package using the same.
  • the purpose is to
  • the present invention includes the following embodiments.
  • the adhesive layer contains a non-aromatic acrylic polymer cross-linked by a metal chelate cross-linking agent, Adhesive tape for use in a method of manufacturing a semiconductor package.
  • Adhesive tape for use in a method of manufacturing a semiconductor package.
  • the metal chelate crosslinking agent is an aluminum chelate crosslinking agent.
  • a pressure-sensitive adhesive tape for use in a method for manufacturing a semiconductor package comprising a base material and an adhesive layer arranged on the base material,
  • the following formula: [(AB) / A] x 100 (In the formula, A is the contact angle of water with respect to the adhesive layer before plasma treatment, B is the contact angle of water with respect to the adhesive layer after plasma treatment) And the change rate (%) of the contact angle of water with respect to the adhesive layer before and after the plasma treatment is 10% or less,
  • the pressure-sensitive adhesive tape, wherein the peeling force of the pressure-sensitive adhesive tape from the copper foil is 100 mN / 25 mm or more at 150 ° C.
  • a method for manufacturing a semiconductor package comprising:
  • the adhesive tape which can be peeled off from a lead frame neatly, without leaving a part of adhesive layer, and can prevent mold flash, and the manufacturing method of a semiconductor package using this. Can be provided.
  • the first embodiment of the present invention comprises a non-aromatic acrylic polymer comprising a substrate and an adhesive layer disposed on the substrate, wherein the adhesive layer is cross-linked by a metal chelate cross-linking agent.
  • An adhesive tape for use in a method of manufacturing a semiconductor package including: Specifically, the adhesive tape is used to prevent mold flash.
  • a non-aromatic acrylic polymer and a metal chelate cross-linking agent By using a non-aromatic acrylic polymer and a metal chelate cross-linking agent, excellent plasma resistance and high adhesion under high temperature conditions can be obtained. As a result, the adhesive tape can be cleanly peeled from the lead frame without leaving a part of the adhesive layer, and mold flash can be prevented.
  • the base material in the present embodiment is not particularly limited as long as it is a heat resistant base material that can withstand the temperature conditions in the manufacturing process of the semiconductor package.
  • the heat resistant substrate is preferably a substrate that can withstand a temperature of 150 ° C., 170 ° C., 200 ° C., 250 ° C., or 300 ° C., for example.
  • Specific examples of the base material include polyimide, polyethylene terephthalate, polyethylene naphthalate, polyether sulfone, polyetherimide, polysulfone, polyphenylene sulfide, polyether ether ketone, polyarylate, and aramid.
  • the thickness of the substrate is not particularly limited, but may be, for example, 5 to 50 ⁇ m, 10 to 40 ⁇ m, 20 to 30 ⁇ m, or the like.
  • the adhesive layer in the present embodiment contains a non-aromatic acrylic polymer cross-linked by a metal chelate cross-linking agent.
  • a non-aromatic acrylic polymer cross-linked by a metal chelate cross-linking agent.
  • plasma resistance is improved.
  • the present inventors presume as follows.
  • the adhesive layer contains an aromatic acrylic polymer
  • the plasma treatment intensively cuts the bonds around the aromatic ring.
  • the degree of modification of the surface of the adhesive layer becomes strong, and the plasma resistance is significantly reduced.
  • the adhesive layer in the present embodiment contains the non-aromatic acrylic polymer, the above-mentioned intensive cutting does not occur even if the plasma treatment is performed.
  • the degree of modification of the surface of the adhesive layer due to the plasma treatment is weakened, and good plasma resistance can be secured.
  • the non-aromatic acrylic polymer cross-linked by the metal chelate cross-linking agent may be only one kind or a combination of two or more kinds. When two or more kinds are combined, at least one kind of non-aromatic acrylic polymer must contain 1 to 20% by weight of a structural unit derived from acrylic acid, based on the total amount of the non-aromatic acrylic polymer. Is preferred. Since a polymer usually has a molecular weight distribution, a combination of a plurality of polymer molecules constituting the molecular weight distribution is regarded as one type.
  • the metal chelate crosslinking agent may be only one kind or a combination of two or more kinds.
  • the adhesive layer may contain further components as long as the effects of the present invention are not impaired. Further components include, for example, plasticizers, pigments, dyes, antistatic agents, fillers and the like.
  • the thickness of the adhesive layer after drying is preferably 2 to 12 ⁇ m, more preferably 4 to 10 ⁇ m, and further preferably 6 to 8 ⁇ m.
  • the non-aromatic acrylic polymer in the present embodiment means a polymer having a structural unit (hereinafter referred to as “acrylic unit”) derived from (meth) acrylic acid and / or a derivative thereof and having no aromatic ring.
  • (meth) acrylic acid means acrylic acid and / or methacrylic acid.
  • examples of the (meth) acrylic acid derivative include (meth) acrylic acid ester.
  • Specific derivatives of (meth) acrylic acid include, for example, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, and (meth) acrylic acid.
  • the non-aromatic acrylic polymer needs to have a functional group for bonding with the metal chelate crosslinking agent.
  • the functional group is preferably a carboxyl group.
  • the constituent unit having a functional group is preferably contained in an amount of 1 to 20% by weight based on the total amount of the non-aromatic acrylic polymer.
  • the non-aromatic acrylic polymer may have an additional structural unit in addition to the acrylic unit.
  • the further structural unit include structural units derived from acrylonitrile, vinyl acetate, vinyl chloride, butadiene, isoprene and the like.
  • the amount of acrylic units constituting the non-aromatic acrylic polymer is preferably 70% by weight or more, more preferably 80% by weight or more, further preferably 90% by weight based on the non-aromatic acrylic polymer. It is more than weight%.
  • the upper limit of the amount of acrylic units is not particularly limited, but may be, for example, 100% by weight or 95% by weight.
  • the weight average molecular weight of the non-aromatic acrylic polymer is preferably 300,000 to 1,500,000, and more preferably 500,000 to 1,000,000, from the viewpoint of achieving both workability and adhesive residue.
  • the amount of the non-aromatic acrylic polymer is preferably 85 to 99% by weight, more preferably 90 to 98% by weight, further preferably 93 to 97% by weight, based on the adhesive layer. :
  • the metal chelate cross-linking agent in this embodiment means a cross-linking agent having a metal ion and a ligand. Since the metal chelate cross-linking agent is an ionic bond-forming cross-linking agent, it has a lower elastic modulus at 175 ° C. than the covalent-bonding cross-linking agent. As a result, the adhesive layer has a high adhesive force under high temperature conditions, and mold flash can be effectively suppressed. Further, the metal chelate crosslinking agent preferably has a ligand having a boiling point of 200 ° C. or lower.
  • the ligand is volatilized by drying, and the metal chelate crosslinking agent can irreversibly crosslink with the non-aromatic acrylic polymer.
  • the lower limit of the boiling point of the ligand is not particularly limited, but may be, for example, 60 ° C, 70 ° C, 80 ° C or the like.
  • metal chelate cross-linking agent having a ligand having a boiling point of 200 ° C. or less examples include an aluminum chelate cross-linking agent, a titanium chelate cross-linking agent, a zirconium chelate cross-linking agent, and the like.
  • Examples of the aluminum chelate cross-linking agent include aluminum tris (acetylacetonate), aluminum bisethylacetoacetate monoacetylacetonate, and aluminum tris (ethylacetoacetate).
  • Examples of the titanium chelate cross-linking agent include titanium diisopropoxybis (acetylacetonate), titanium tetraacetylacetonate, titanium diisopropoxybis (ethylacetoacetate), titanium di-2-ethylhexoxybis (2-ethyl). -3-hydroxyhexoxide), titanium lactate ammonium salt, titanium lactate, titanium diisopropoxybis (triethanolaminate), titanium aminoethylaminoethanolate, and the like.
  • zirconium chelate cross-linking agent examples include zirconium tetraacetylacetonate, zirconium tributoxymonoacetylacetonate, zirconium dibutoxybis (ethylacetoacetate), zirconium lactate ammonium salt and the like.
  • the metal chelate cross-linking agent is preferably an aluminum chelate cross-linking agent, and more preferably aluminum tris (acetylacetonate).
  • the amount of the metal chelate cross-linking agent is preferably 1 to 15% by weight, more preferably 2 to 10% by weight, further preferably 3 to 7% by weight, based on the adhesive layer.
  • the adhesive tape according to the present embodiment may include a release film on the adhesive layer.
  • the adhesive tape according to this embodiment can be manufactured by a known method. For example, a step of mixing a non-aromatic acrylic polymer, a metal chelate crosslinking agent, and a solvent (mixing step), a step of applying the mixture to a substrate (application step), a step of drying the applied mixture (drying step) ),
  • the adhesive tape can be manufactured by the method including.
  • Examples of the solvent used in the mixing step include a ketone solvent (acetylacetone, methylethylketone, acetone, etc.), an alcohol solvent (methanol, ethanol, propanol, butanol, etc.), an ether solvent (tetrahydrofuran, etc.), a nitrile solvent (acetonitrile, etc.), an amide. Solvents (N, N-dimethylformamide etc.) and the like can be mentioned.
  • Examples of the coating method in the coating step include die coater coating, bar coater coating, air knife coater coating, gravure coater coating, reverse roll coater coating, lip coater coating and the like.
  • the adhesive tape according to this embodiment may further have the features of the adhesive tape according to the following second embodiment.
  • a second embodiment of the present invention is an adhesive tape for use in a method for manufacturing a semiconductor package, which comprises a base material and an adhesive layer disposed on the base material, and has the following formula: [(AB) / A] x 100 (In the formula, A is a contact angle of water with respect to the adhesive layer before plasma treatment, B is the contact angle of water with respect to the adhesive layer after plasma treatment) And the change rate (%) of the contact angle of water with respect to the adhesive layer before and after the plasma treatment is 10% or less,
  • the adhesive tape has a peeling force of 100 mN / 25 mm or more at 150 ° C. from the copper foil. Specifically, the adhesive tape is used to prevent mold flash.
  • the contact angle of water to the adhesive layer is reduced by the plasma treatment, the adhesive strength of the adhesive layer increases and it becomes impossible to cleanly remove the adhesive tape from the lead frame.
  • the change rate (%) of the contact angle of water before and after the plasma treatment is 10% or less, an increase in the adhesive force can be suppressed and the adhesive tape can be peeled off neatly at room temperature. Further, by setting the peeling force of the adhesive tape to 100 mN / 25 mm or more at 150 ° C., mold flash can be prevented.
  • the rate of change (%) in the contact angle of water with respect to the adhesive layer before and after plasma treatment is preferably 10% or less, more preferably 5% or less, and further preferably 3% or less.
  • the lower limit of the rate of change (%) is not particularly limited, but may be 0%, 1% or the like, for example.
  • the contact angle before and after the plasma treatment can be measured by the method described in the examples below, and the rate of change can be calculated based on the measured contact angle.
  • the peeling force of the adhesive tape at 25 ° C can be measured by the method described in the following examples.
  • the lower limit of the peeling force of the adhesive tape at 25 ° C. is not particularly limited, but may be 100 mN / 25 mm, 200 mN / 25 mm or the like, for example.
  • 100 mN / 25 mm or more is preferable, and 150 mN / 25 mm or more is more preferable.
  • the peeling force of the adhesive tape at 150 ° C can be measured by the method described in the following examples.
  • the upper limit of the peeling force of the adhesive tape at 150 ° C. is not particularly limited, but may be, for example, 500 mN / 25 mm, 1000 mN / 25 mm or the like.
  • the elastic modulus of the adhesive tape is 175 ° C., preferably 5 ⁇ 10 5 to 20 ⁇ 10 5 in order to secure mold flash resistance and to sufficiently connect the semiconductor chip and the surface of the lead frame with a bonding wire. Pa, more preferably 5 ⁇ 10 5 to 10 ⁇ 10 5 Pa.
  • the elastic modulus of the adhesive tape can be measured by the method described in the examples below.
  • the adhesive tape according to this embodiment may further have the features of the adhesive tape according to the first embodiment.
  • the third embodiment of the present invention relates to a method of manufacturing a semiconductor package including a sticking step, a fixing step, a plasma processing step, a connecting step, a sealing step, and a peeling step.
  • a sticking step a sticking step
  • a fixing step a fixing step
  • a plasma processing step a plasma processing step
  • a connecting step a sealing step
  • a peeling step a peeling step
  • the sticking step in this embodiment is a step of sticking the adhesive tape according to the first embodiment or the second embodiment to the back surface of the lead frame.
  • the attaching step can be performed by a known method.
  • the fixing step in this embodiment is a step of fixing the semiconductor chip to the die pad on the surface of the lead frame to which the adhesive tape is attached.
  • the fixing step can be performed by a known method.
  • the plasma treatment step in this embodiment is a step of treating the semiconductor chip and the surface of the lead frame with plasma.
  • the plasma treatment step can be performed by a known method.
  • plasma treatment can be performed under an atmosphere of an inert gas (argon, nitrogen, etc.) under the conditions of 50 to 300 W (preferably 100 to 150 W) and 5 to 60 seconds (preferably 10 to 30 seconds). .
  • an inert gas argon, nitrogen, etc.
  • connection step in this embodiment is a step of connecting the semiconductor chip, which has been treated with plasma, and the surface of the lead frame with a bonding wire.
  • the connecting step can be performed by a known method.
  • the sealing step in this embodiment is a step of sealing the bonding wire, the semiconductor chip, and the surface of the lead frame with resin.
  • the sealing step can be performed by a known method.
  • the sealing step can be performed at 110 to 200 ° C, preferably 130 to 180 ° C.
  • the peeling step in this embodiment is a step of peeling the adhesive tape from the back surface of the lead frame whose surface is sealed with resin.
  • the peeling step can be performed by a known method.
  • the manufacturing method When the lead frame has a plurality of die pads on the surface, and a plurality of semiconductor chips are fixed to the plurality of die pads, the manufacturing method according to the present embodiment, the adhesive tape is peeled off, the surface is sealed with resin. The method may further include a cutting step of cutting the formed lead frame into individual semiconductor packages.
  • ⁇ Polymer> The following polymers were used in the Examples and Comparative Examples.
  • Acrylic polymer A In a reaction vessel, butyl acrylate (BA) (92 parts by weight), acrylic acid (AA) (8 parts by weight), ethyl acetate (100 parts by weight), and azobisisobutyronitrile (AIBN) (0.3 parts by weight). Part) and stirred at 70 ° C. After 60 minutes from the start of the reaction, a part of the reaction solution was taken out every 30 minutes, the reaction was stopped with deionized water, the mixture was extracted with methyl ethyl ketone, and the extracted solution was analyzed by gel permeation chromatography (GPC).
  • GPC gel permeation chromatography
  • the reaction vessel was cooled to stop the reaction when the weight average molecular weight of the reaction product reached 700,000 or more.
  • the resulting mixture was washed with deionized water and dried to obtain an acrylic polymer A.
  • the weight average molecular weight of the acrylic polymer A was 750,000, and the acid value as determined by titration with an aqueous potassium hydroxide solution was 810 mgKOH / g.
  • the reaction vessel was cooled to stop the reaction when the weight average molecular weight of the reaction product reached 500,000 or more.
  • the resulting mixture was washed with deionized water and dried to obtain an acrylic polymer B.
  • the weight average molecular weight of the acrylic polymer B was 540,000.
  • the reaction vessel was cooled and the reaction was stopped when the weight average molecular weight of the reaction product reached 100,000 or more.
  • the resulting mixture was washed with deionized water and dried to obtain an acrylic polymer C.
  • the weight average molecular weight of the acrylic polymer C was 120,000, and the acid value by titration with an aqueous potassium hydroxide solution was 670 mgKOH / g.
  • ⁇ Crosslinking agent> The following cross-linking agents were used in the examples and comparative examples.
  • Aluminum chelate cross-linking agent [aluminum tris (acetylacetonate), trade name: Organix AL-3100 (manufactured by Matsumoto Fine Chemical Co., Ltd.)]
  • Titanium chelate cross-linking agent [titanium diisopropoxybis (acetylacetonate), trade name: Organix TC-100 (manufactured by Matsumoto Fine Chemical Co., Ltd.)]
  • Zirconium chelate crosslinking agent [zirconium tetraacetylacetonate, trade name: Organix ZC-700 (manufactured by Matsumoto Fine Chemical Co., Ltd.)]
  • Phenol novolac type epoxy resin cross-linking agent [trade name: EPICLON N730A (manufactured by DIC Corporation)]
  • Alicyclic epoxy resin crosslinking agent A [trade name
  • Example 1 ⁇ Production of adhesive tape> Acrylic polymer A (100 parts by weight), aluminum chelate crosslinking agent (4 parts by weight), acetylacetone (10 parts by weight), and methyl ethyl ketone (60 parts by weight) were stirred at room temperature to obtain a composition 1.
  • the composition 1 was applied to a polyimide film (thickness: 25 ⁇ m) using a die coater so that the thickness after drying was 7 ⁇ m, and dried at 150 ° C. for 5 minutes to obtain an adhesive tape.
  • the release surface of the release film that had been subjected to the release treatment was attached to the adhesive layer of the adhesive tape by laminating and heated at 105 ° C. for 24 hours to obtain an adhesive tape with a release film.
  • the pressure-sensitive adhesive tape with a release film was divided into two, a first pressure-sensitive adhesive tape and a second pressure-sensitive adhesive tape, the release film was removed, and the charge was sufficiently removed.
  • Plasma treatment was performed only on the second adhesive tape under an argon atmosphere (flow rate of 50 cc) and 120 W for 20 seconds.
  • the first adhesive tape and the second adhesive tape were fixed to a pedestal of a contact angle meter [Product name: CA-X (manufactured by Kyowa Interface Science Co., Ltd.)] with the adhesive layer facing up in an atmosphere of 23 ° C.
  • the contact angle when pure water was dropped on was measured. The measurement was performed 10 times, and the average value was calculated.
  • Rate of change of contact angle of water [(contact angle of water on first adhesive tape-contact angle of water on second adhesive tape after plasma treatment) / contact angle of water on first adhesive tape] ⁇ 100
  • the adhesive tape was roll-laminated (30 ° C., 0.4 MPa, 1 m / min) on the glossy side of the rolled copper foil (thickness 35 ⁇ m), and then a 25 mm width test piece was prepared.
  • the peel strength was evaluated according to the following criteria. The results are shown in Table 1.
  • Peeling force is less than 500 mN / 25 mm ⁇ : Peeling force is 500 mN / 25 mm or more and less than 1200 mN / 25 mm ⁇ : Peeling force is 1200 mN / 25 mm or more and less than 1300 mN / 25 mm ⁇ : Peeling force is 1300 mN / 25 mm or more
  • Peeling force is 150 mN / 25 mm or more
  • Peeling force is 100 mN / 25 mm or more, less than 150 mN / 25 mm
  • Peeling force is 50 mN / 25 mm or more, less than 100 mN / 25 mm
  • Peeling force is less than 50 mN / 25 mm
  • the pressure-sensitive adhesive composition is applied to a release film so as to have a thickness after drying of 100 ⁇ m, dried and then heated at 105 ° C. for 24 hours to remove the release film.
  • Got The storage elastic modulus (E ′) of 23 ° C. to 200 ° C. of the obtained single film was measured at a temperature rising rate of 10 ° C./min and 1 Hz with a dynamic mechanical analysis (DMA) device. .. Among these, the value at 175 ° C. was evaluated according to the following criteria. The results are shown in Table 1.
  • Storage elastic modulus at 175 ° C. is 5 ⁇ 10 5 Pa or more and less than 10 ⁇ 10 5 Pa ⁇ : Storage elastic modulus at 175 ° C. is 10 ⁇ 10 5 Pa or more and less than 20 ⁇ 10 5 Pa ⁇ : Storage elastic modulus at 175 ° C. Is 20 ⁇ 10 5 Pa or more and less than 30 ⁇ 10 5 Pa ⁇ : Storage elastic modulus at 175 ° C. is 30 ⁇ 10 5 Pa or more
  • Examples 2 to 4 and Comparative Examples 1 to 7 A pressure-sensitive adhesive tape with a release film was produced in the same manner as in Example 1 using the polymers and cross-linking agents shown in Tables 1 and 2, and the rate of change in water contact angle was calculated. Moreover, the peeling force and the elastic modulus were measured. The results are shown in Tables 1 and 2.
  • the adhesive tapes of Examples 1 to 4 have plasma resistance, and therefore can be peeled off cleanly from the lead frame without leaving a part of the adhesive layer. Moreover, since the adhesive tapes of Examples 1 to 4 have excellent adhesive strength under high temperature conditions, mold flash can be suppressed.

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  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

La présente invention traite le problème de la fourniture d'un ruban adhésif qui peut être détaché proprement d'une grille de connexion sans laisser un morceau d'une couche adhésive et qui peut éviter une bavure de moule, ainsi qu'un procédé de fabrication d'un boîtier à semi-conducteur dans lequel est utilisé le ruban adhésif. Ce problème peut être résolu par un ruban adhésif destiné à être utilisé dans un procédé de production d'un boîtier à semi-conducteur, le ruban adhésif comprenant un substrat et une couche adhésive disposée sur le substrat et la couche adhésive comprenant un polymère acrylique non aromatique réticulé par un agent de réticulation à base de chélate métallique.
PCT/JP2019/037160 2018-11-16 2019-09-24 Ruban adhésif et procédé de production de boîtier à semi-conducteur WO2020100434A1 (fr)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022208325A1 (fr) * 2021-03-29 2022-10-06 3M Innovative Properties Company Ruban adhésif

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