WO2020098779A1 - 用于模组通电测试的连接结构和相应的转接件 - Google Patents

用于模组通电测试的连接结构和相应的转接件 Download PDF

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Publication number
WO2020098779A1
WO2020098779A1 PCT/CN2019/118772 CN2019118772W WO2020098779A1 WO 2020098779 A1 WO2020098779 A1 WO 2020098779A1 CN 2019118772 W CN2019118772 W CN 2019118772W WO 2020098779 A1 WO2020098779 A1 WO 2020098779A1
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WIPO (PCT)
Prior art keywords
connector
module
array
connection structure
structure according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/118772
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English (en)
French (fr)
Inventor
史文均
叶虹强
王永峰
毛狄青
陈余天
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Sunny Opotech Co Ltd
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Ningbo Sunny Opotech Co Ltd
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Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Publication of WO2020098779A1 publication Critical patent/WO2020098779A1/zh
Anticipated expiration legal-status Critical
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2825—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere in household appliances or professional audio/video equipment
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2894—Aspects of quality control [QC]

Definitions

  • This application relates to the module power-on test of the production line body.
  • camera modules usually need to pass a series of tests (sometimes called group tests) before leaving the factory.
  • group tests sometimes called group tests
  • a number of performance tests and burning of the camera module are required to ensure the normal use of the camera module when it is installed in the mobile device terminal.
  • the intermediate adapter is used to take over the camera module, and then the array of multiple camera modules is fixed on the puzzle board, and then the puzzle board and the test equipment are electrically connected to complete multiple cameras at the same time
  • the testing of the module greatly improves the production efficiency.
  • the connector may be damaged, and such damage is usually not recognized by the naked eye.
  • this damaged intermediary adapter will cause the module to fail to open (that is, the photosensitive chip of the camera module cannot display the imaging results normally after power-on), affecting production efficiency.
  • the intermediate adapter structure includes an interface connected to the module connector and a connection port to the probe of the test equipment. In order to achieve a good connection, the interface between the intermediary adapter and the module connector is plugged using a male and female connector adapted to the module connector.
  • the intermediary adapter After the intermediary adapter has undergone multiple circulations, its connector (referred to as the connector of the intermediary adapter) may be damaged due to frequent insertion and removal, but this damage cannot be recognized by the naked eye, which leads to the failure of the module drawing , Affecting production efficiency. Therefore, there is an urgent need for a solution for module power-on testing that can increase the service life, improve the through rate of products in the production line, and improve the production efficiency.
  • the present application aims to provide a solution that can overcome at least one drawback of the prior art.
  • a connection structure for module power-on testing which includes: a circuit board; a sheet-shaped conductive element having a first surface and a second surface opposite to the first surface, The second surface is attached to the surface of the circuit board, and the sheet-shaped conductive element conducts electricity in the normal direction of the first surface, but does not conduct electricity in a direction parallel to the first surface; It is suitable for carrying a module to be powered on and tested.
  • the module to be powered on and testing includes a connector, and the carrier includes a limit structure, the limit structure is suitable for receiving the connector and restricting the connector to Movement in a direction parallel to the first surface; and a fastener for pressing the connector against the first surface.
  • the connector includes an array of connector pins.
  • the circuit board includes a contact array that is in contact with the second surface, and each contact position of the contact array is suitable for the position of each pin of the connector pin array accommodated in the limit structure Match.
  • the connector includes a connector pin array
  • the sheet-like conductive element includes an insulating medium and a conductive pin array distributed in the insulating medium; and when the connector is pressed tightly on the first surface, the Each pin of the connector pin array may cover a plurality of conductive pins of the conductive pin array.
  • the sheet-shaped conductive element is a conductive cloth
  • the conductive cloth includes silica gel and a conductive pin array distributed in the silica gel.
  • the conductive needle is columnar.
  • the conductive needle is made of metal.
  • the axis of the conductive needle forms an angle of 0-90 degrees with the first surface.
  • the axis of the conductive needle forms an angle of 45-75 degrees with the first surface.
  • the circuit board further includes a transfer electrode array and a wiring that leads the contact array to the transfer electrode array.
  • the transfer electrode array includes a plurality of transfer electrodes, and the size of the transfer electrode is larger than the size of the contact.
  • the distance between the transition electrodes of the transition electrode array is greater than the distance between the contacts of the contact array.
  • the module to be powered on for testing is an optical device module.
  • the module to be powered on for testing is a camera module or a projection module.
  • the module to be energized for testing includes a module body and a connector connected to the module body through a flexible connection belt, and the connector has the connector pin array.
  • the connector is a female plug connector or a male plug connector.
  • the limiting structure is a limiting hole.
  • the fastener includes: a pressing plate, which is suitable for pressing the module to be energized and tested between the pressing plate and the carrier; and a buckle, which is suitable for fixing the pressing plate at Pressed state.
  • one end of the pressing plate is pivotally connected to the carrier, and the other end of the pressing plate is connected to the buckle.
  • one end of the buckle is pivotally connected to the pressing plate, and the other end of the buckle is suitable for buckling with the carrier.
  • the carrier includes: a carrier base adapted to bear the module to be energized and tested, and the carrier base has a through hole to receive the connector;
  • the through holes match and have the limiting structure.
  • the pressure plate has a light-through hole adapted to the module to be powered on for testing.
  • the circuit board has an avoidance structure for avoiding an optical path
  • the optical path is an optical path used for conducting power test on the module.
  • connection structure is located in an adaptor, wherein the adaptor is used to adapt the module to be tested for power to test equipment.
  • connection structure is located in the test equipment.
  • an adaptor for module power-on testing which includes: an adaptor circuit board; a sheet-shaped conductive element having a first surface and the first surface Opposite second surface, the second surface is attached to the surface of the adapter circuit board, the sheet-shaped conductive element conducts electricity in the normal direction of the first surface, parallel to the first surface Direction is not conductive; a carrier, which is suitable for carrying a module to be energized for testing, the module to be energized for testing includes a connector, the carrier includes a limit structure, the limit structure is suitable for accommodating the An array of connector pins and restricts the movement of the connector in a direction parallel to the first surface; and a fastener for pressing the connector against the first surface.
  • the connector includes a connector pin array
  • the adapter circuit board includes a contact array in contact with the second surface, an adapter electrode array, and conducting the contact array to the adapter The wiring of the electrode array.
  • each contact position of the contact array is adapted to the position of each pin of the connector pin array accommodated in the limit structure, and the size of the transfer electrode is larger than the size of the contact, And the spacing between the switching electrodes of the switching electrode array is greater than the spacing between the contacts of the contact array.
  • the connector includes a connector pin array
  • the sheet-like conductive element includes an insulating medium and a conductive pin array distributed in the insulating medium; and when the connector is pressed tightly on the first surface, the Each pin of the connector pin array may cover a plurality of conductive pins of the conductive pin array.
  • the sheet-shaped conductive element is a conductive cloth.
  • the conductive cloth includes silica gel and a conductive pin array distributed in the silica gel.
  • the conductive needle is columnar.
  • the conductive needle is made of metal.
  • the axis of the conductive needle forms an angle of 0-90 degrees with the first surface.
  • the axis of the conductive needle forms an angle of 45-75 degrees with the first surface.
  • the module to be powered on for testing is an optical device module.
  • the module to be powered on for testing is a camera module or a projection module.
  • the module to be energized for testing includes a module body and a connector connected to the module body through a flexible connection belt, and the connector has the connector pin array.
  • the connector is a female plug connector or a male plug connector.
  • the limiting structure is a limiting hole.
  • the fastener includes: a pressing plate, which is suitable for pressing the module to be energized and tested between the pressing plate and the carrier; and a buckle, which is suitable for fixing the pressing plate at Pressed state.
  • one end of the pressing plate is pivotally connected to the carrier, and the other end of the pressing plate is connected to the buckle.
  • one end of the buckle is pivotally connected to the pressing plate, and the other end of the buckle is suitable for buckling with the carrier.
  • the carrier includes: a carrier base adapted to bear the module to be energized and tested, and the carrier base has a through hole to receive the connector;
  • the through holes match and have the limiting structure.
  • the pressure plate has a light-through hole adapted to the module to be powered on for testing.
  • the circuit board has an avoidance structure for avoiding an optical path
  • the optical path is an optical path for conducting a power-on test on the module.
  • This application can replace the connection of the original male and female connectors by external structural snaps, thereby reducing the damage caused by plugging and unplugging of the module connector during the assembly test phase.
  • the original connector connection method can be replaced by a conductive cloth, which reduces the abrasion of the connector due to the ferrule process and the problem of connector deformation due to external force, and improves the service life of the intermediate adapter.
  • the conductive cloth (or similar other sheet-like conductive elements) can tolerate a good connection without being affected by uneven stress during the installation process of the module connector.
  • the intermediary adapter that uses the conductive cloth as the connector has good contact during the product circulation process, and the number of circulations is much higher than the original connector method, which improves the product production rate of automated production. To improve production efficiency.
  • FIG. 1 shows a three-dimensional exploded schematic view of an adapter used for module power-on test according to an embodiment of the present application
  • FIG. 2 shows a three-dimensional exploded schematic view of an adapter of a circuit board with an escape structure in an embodiment of the present application
  • FIG. 3 is a schematic diagram showing a state after the adapter shown in FIG. 2 is assembled and fastened;
  • FIG. 4 shows a partially enlarged schematic view of the positional relationship between the needle holder and the conductive cloth in an embodiment of the present application
  • FIG. 5 shows an enlarged schematic view of a partial structure of a conductive cloth according to an embodiment of the present application
  • FIG. 6 shows a schematic diagram of a module connector according to an embodiment of the present application.
  • first, second, etc. are only used to distinguish one feature from another feature, and do not represent any limitation on the feature. Therefore, without departing from the teachings of the present application, the first body discussed below may also be referred to as the second body.
  • the terms “substantially”, “approximately”, and similar terms are used as an approximation term, not as a degree term, and are intended to illustrate the measurement that will be recognized by those of ordinary skill in the art. The inherent deviation in the value or calculated value.
  • FIG. 1 shows a three-dimensional exploded schematic diagram of an adapter used for module power-on testing according to an embodiment of the present application.
  • the adapter can also be called an intermediary adapter.
  • the adapter includes a connection structure 100 including a circuit board 10, a conductive cloth 20, a carrier 30 and a fastener 40.
  • the conductive cloth 20 has a first surface 21 and a second surface 22 opposite to the first surface 21, the second surface 22 is attached to the surface of the circuit board 10, and the conductive cloth is on the first surface 21 is conductive in the normal direction (that is, conducting in the direction from the first surface 21 to the second surface 22), and is not conducting in the direction parallel to the first surface 21.
  • the carrier 30 is suitable for carrying a module (such as a camera module) to be powered on for testing, and the module includes an array of connector pins.
  • the connector is used to electrically connect the module to the circuit of other equipment.
  • the connector can be independent of the module body.
  • the connector can be electrically connected to the module body through a flexible connection strap.
  • the connector has a connector pin array to simultaneously input and output multiple signals (or data). For example, a camera module usually requires a large number of pins to output image data, so the connector pin array is often dense.
  • the carrier 30 includes a limiting structure 34 that is adapted to receive the connector pin array and limit the connector pin array in a direction parallel to the first surface 21 On the move.
  • the limiting structure 34 can limit the horizontal movement of the connector pin array, that is, the limiting structure 34 can prevent the connector pin array from moving in the horizontal direction.
  • the fastener 40 is used to press the pin array against the first surface 21.
  • the circuit board 10 may include a contact array that contacts the second surface 22, and each contact position of the contact array is suitable for the position of each pin of the connector pin array accommodated in the limit structure 34 Match.
  • the module to be powered on may be an optical device module, for example, a camera module or a projection module.
  • the projection module may be, for example, a structured light projection module.
  • the camera module can be a single camera module or a dual camera module.
  • the optical device module may also be a structured light module composed of a camera module and a projection module or other modules capable of three-dimensional imaging.
  • Each of the above types of modules has connectors to plug into the circuit boards of other devices, components or modules (such as mobile phone motherboards) to achieve circuit board connection with other devices, components or modules (such as mobile phone motherboards) Electrical connection.
  • the conductive cloth may be, for example, a fiber cloth as a base material, and after a pre-treatment, an electroplated metal plating layer is applied to make it have metal characteristics to become a conductive fiber cloth. Because the conductive cloth has a good electromagnetic shielding effect, it is often used as an electromagnetic shielding protective cover.
  • the original adapter connector is replaced with a conductive cloth, and the connection position of the connector of the camera module and the conductive cloth is positioned and limited by the external structure limit, so that the conductive cloth It has good electrical connection effect with the connector of the module.
  • the damage of the module connector caused by insertion and removal during the assembly test can be reduced; the adapter of this embodiment can replace the original connector connection method by conductive cloth to reduce the connector.
  • the wear and tear caused by the insertion and removal process and the deformation of the connector due to external forces increase the service life of the adapter and reduce the failure of drawing due to the damage of the adapter, thereby improving the direct production of automated products. Rate and improve production efficiency.
  • the conductive cloth includes silica gel and conductive pin arrays distributed in the silica gel.
  • the conductive needle may be columnar.
  • the conductive needle may be made of metal.
  • the axis of the conductive pin may form an angle of 0-90 degrees with the first surface.
  • the axis of the conductive pin may form an angle of 45-75 degrees with the first surface.
  • the circuit board 10 may include a contact array, a transfer electrode array, and a path for conducting the contact array to the transfer electrode array line.
  • the contact array is in contact with the second surface 22 of the conductive cloth 20, and each contact position of the contact array and each pin of the connector pin array accommodated in the limit structure 34 The location of the adaptation.
  • the transfer electrode array may include a plurality of transfer electrodes, and the size of the transfer electrode may be larger than the size of the contact.
  • the spacing between the switching electrodes of the switching electrode array may be greater than the spacing between the contacts of the contact array.
  • the module to be energized for testing may include a module body and a connector connected to the module body through a flexible connection belt, the connector having the connector Pin array.
  • the connector may be a female plug connector or a male plug connector.
  • the connection structure using conductive cloth in this application is applicable to both modules with female connectors and modules with male connectors.
  • the module to be powered on may be an optical device module, for example, a camera module or a projection module.
  • the projection module may be, for example, a structured light projection module.
  • the camera module can be a single camera module or a dual camera module.
  • the optical device module may also be a structured light module composed of a camera module and a projection module or other modules capable of three-dimensional imaging. All of the above types of modules have connectors to plug in the circuit boards of other devices, components or modules (such as mobile phone motherboards), so as to realize the connection with other devices, components or modules of circuit boards (such as mobile phone motherboards). Electrical connection.
  • the limiting structure 33 may be a limiting hole.
  • the fastener 40 includes a pressing plate 41 and a buckle 42.
  • the carrier 30 includes a carrier base 31 and a needle base 32.
  • the carrier base 31 is adapted to bear on the module to be energized and tested, and the carrier base 31 has a through hole 33 for receiving the connector.
  • the needle base 32 matches the through hole 33 and has the limiting structure 34 (that is, the limiting hole).
  • the pressing plate 41 is suitable for pressing the module to be energized and tested between the pressing plate 41 and the carrier 30 (for example, between the pressing plate 41 and the carrier base 31), and the buckle 42 is suitable In order to fix the pressing plate 41 in a compressed state.
  • one end of the pressure plate 41 is pivotally connected to the carrier 30 (for example, pivotally connected to the carrier base 31), and the other end of the pressure plate 41 is connected to the buckle 42.
  • One end of the buckle 42 is pivotally connected to the pressing plate 41, and the other end of the buckle 42 is adapted to be buckled with the carrier 30 (for example, buckled with the carrier base 31).
  • the pressure plate 41 has a light-through hole 43 adapted to the module to be tested for power, so that the test optical path of the camera module or the projection module is not affected Occlusion.
  • This embodiment is applicable to the case where the module body and the connector are oriented in opposite directions. In this case, the module body is against the carrier base 31 (that is, the module body is facing upward), and the connector is facing the conductive cloth 20 (that is, the connector is facing downward).
  • the adapter is structurally divided into upper and lower structures, and the upper structure mainly includes a buckle 42 and a pressing plate 41.
  • the lower structure mainly includes a carrier 30 (which includes a carrier base 31 and a needle base 32), a conductive cloth 20, and a circuit board 10 (such as but not limited to a PCB board), and the structure of each part is adapted to each other.
  • the buckle 42 and the pressure plate 41 are connected by a pivot (for example, a pin), and the buckle 42 is used to tightly buckle the pressure plate 41 and the carrier base 31.
  • the buckle 42 and the pressure plate 41 can also be connected by other mechanical means, as long as the buckle 42 and the pressure plate 41 are easy to open and buckle.
  • the pressure plate 41 has a module through hole 43 as a window for opening the camera module during the performance test.
  • the carrier base 31 and the pressure plate 41 are mechanically coupled and connected.
  • the carrier base 31 has a connector limiting structure 34 (in FIG. 1 is a limiting hole), which is used to place the module in the intermediate adapter Limit the position of the module connector.
  • the conductive needles on the conductive cloth 20 are densely distributed, and the angle of the needles may be 0-90 degrees (preferably 45-75 degrees), and have the ability to generate a certain angle of bending under stress and still be able to conduct the circuit.
  • the circuit board is connected to the conductive cloth, and the internal circuit has a large re-emission, and a large metal conductive point is formed on the other side, which is used to connect with the test probe during the performance test, thereby reducing the requirement for probe accuracy.
  • the needle base 32 can be combined with the conductive cloth 20 and the PCB to form a circuit path between the module connector and the probe of the test equipment.
  • the workflow of the connection structure of the above adapter is as follows: open the buckle 42 so that the pressure plate 41 and the carrier base 31 are at 90 degrees; then put the camera module (or other module to be powered on) The carrier base 31, and the connector is placed at the limit position, wherein the connector pin array is placed in the limit structure 34 (for example, the limit hole); finally, the pressure plate 41 is pressed down, and the buckle 42 is engaged, so that The connector pin array is in close contact with the conductive cloth 20, and then is connected to the contact array of the circuit board 10 through the conductive cloth 20.
  • FIG. 2 shows a three-dimensional exploded schematic view of an adaptor with an escape structure in a circuit board according to an embodiment of the present application.
  • the circuit board 10 of the adapter has an escape structure 19 for avoiding an optical path, where the optical path is an optical path used for conducting power test on the module.
  • This embodiment is applicable to the case where the module body and the connector are oriented in the same direction.
  • the position of the module body is adapted to the avoidance structure, and the module body faces downward, and the connector faces the conductive cloth (ie, the connector faces downward).
  • the module is a camera module
  • the lens of the camera module is facing down, and its connector is also facing down.
  • FIG. 3 shows a schematic diagram of a state after the adapter shown in FIG. 2 is assembled and fastened.
  • the buckle 42 is engaged, so that the pressure plate 41 and the carrier base 31 are pressed against each other, so that the connector pin array located in the limiting structure 34 is in close contact with the conductive cloth (note the conductive cloth in FIG. 3 Is blocked, not shown), and then conducts with the contact array of the circuit board 10 through the conductive cloth.
  • the position of the lens of the camera module may correspond to the avoidance structure 19, so as to arrange an optical path to conduct power-on testing for the optical performance of the camera module.
  • FIG. 4 shows a partially enlarged schematic diagram of the positional relationship between the needle holder and the conductive cloth in an embodiment of the present application.
  • the pin holder 32 has a limiting hole to accommodate the connector pin array.
  • the conductive cloth 20 is located below the needle base 32.
  • Each pin of the connector pin array arranged in the limiting hole may pass through the limiting hole to contact the conductive cloth 20.
  • FIG. 5 shows an enlarged schematic view of a partial structure of a conductive cloth according to an embodiment of the present application.
  • the conductive cloth 20 has a conductive pin array composed of conductive pins 23 uniformly distributed.
  • the conductive needle 23 may be columnar.
  • the conductive pin 23 may be made of a metal material, such as a copper alloy.
  • the copper alloy may be further plated with gold.
  • the axis of the conductive pin 23 may form an angle of 0-90 degrees with the first surface.
  • the axis of the conductive pin may form an angle of 45-75 degrees with the first surface.
  • the cross section of the conductive pin 23 is very small, and each pin in the connector pin array may correspond to multiple conductive pins.
  • each pin in the connector pin array may cover a plurality of conductive pins 23 of the conductive cloth 20.
  • these conductive pins can conduct current from the front of the conductive cloth 20 (such as shown in FIG. 1
  • the first surface 21) is transferred to the back surface (for example, the second surface 22 shown in FIG. 1), and is then electrically connected to corresponding contacts on the circuit board on the back surface of the conductive cloth 20.
  • the back surface for example, the second surface 22 shown in FIG. 1
  • the pins are mated one-to-one, and any damaged pin will cause the drawing to fail. Therefore, the design of this embodiment can obtain better reliability.
  • longitudinal conduction can be achieved while lateral conduction is not conducted, that is, conduction is performed in the normal direction of the first surface, but not in a direction parallel to the first surface Conductive.
  • the conductive cloth can also be replaced by other sheet-shaped conductive elements.
  • the sheet-shaped conductive element has a first surface and a second surface opposite to the first surface, the second surface is attached to the surface of the circuit board, and the sheet-shaped conductive element is on the first surface Conduction in the direction of the normal line does not conduct electricity in the direction parallel to the first surface.
  • the sheet-shaped conductive element may include, for example, an insulating medium and a conductive pin array distributed in the insulating medium; and when the connector is pressed against the first surface, the connector pin array Each pin can cover a plurality of conductive pins of the conductive pin array.
  • FIG. 6 shows a schematic diagram of a module connector according to an embodiment of the present application.
  • the connector 50 includes a pin array composed of a plurality of pins 51.
  • the pins 51 may be metal wires, and a plurality of pins 51 may be arranged on the protruding insulating keel 52 in sequence.
  • the insulating keel 52 may be installed on the base 53.
  • the insulating keel 52 may have a square shape. It should be noted that, in FIG. 6, the module connector is in the upward state, and when the connection is made, the module connector faces the conductive cloth (that is, the downward direction in FIGS. 1, 2, and 3).
  • connection structure similar to the above adapter can also be provided on the test equipment, so that the connector pin array of the module can be directly electrically connected to the test equipment through the connection structure to complete the test.
  • This embodiment is particularly suitable for a non-panel type module production line.
  • the material (or line body) on the production line is a single module, not a panel composed of multiple modules.
  • the connection structure for the module power-on test is located in the test equipment.
  • the connection structure includes: circuit board, conductive cloth, carrier and fastener.
  • the conductive cloth has a first surface and a second surface opposite to the first surface, the second surface is attached to the surface of the circuit board, and the conductive cloth conducts electricity in the normal direction of the first surface , Not conductive in the direction parallel to the first surface.
  • the carrier is suitable for carrying a module to be powered on for testing (such as a camera module), the module includes an array of connector pins, the carrier includes a limit structure, and the limit structure is suitable for accommodating the connector pins The array also restricts the movement of the array of connector pins in a direction parallel to the first surface.
  • the fastener is used to press the pin array against the first surface.
  • the circuit board may include a contact array in contact with the second surface, and the position of each contact of the contact array is adapted to the position of each pin of the connector pin array accommodated in the limit structure.
  • the module to be powered on is an optical device module, such as a camera module or a projection module (such as a structured light projection module).
  • the circuit board of the test equipment may be integrated with the circuit board of the connection structure. The test equipment can be directly connected to the module through the contact array to conduct the power-on test.
  • the positions of the contacts of the contact array are adapted to the positions of the pins of the connector pin array accommodated in the limit structure
  • the size of the transfer electrode may be greater than the size of the contact, and the distance between the transfer electrodes of the transfer electrode array may be greater than the distance between the contacts of the contact array.
  • the test equipment can be connected to the module through the transfer electrode array to conduct the power-on test.
  • the test device may have a device probe array that is adapted to the transfer electrode array, and conduction is achieved by plugging the device probe array and the transfer electrode array.
  • an intermediary transfer board (which can be regarded as a plate-shaped intermediary adapter) is provided.
  • a plurality of the intermediary transfer board can be combined with the material puzzle, camera module and camera module test equipment to form a camera module test system.
  • the camera module test equipment can be any test project test equipment, which is not limited in this article.
  • a plurality of adapter boards are used to fix and electrically connect the plurality of camera modules to be tested, and each adapter board has a plurality of electrical connections to the respective pins of the corresponding camera module to be tested. Jacks (these jacks can be used as an adapter electrode array).
  • the spacing between the plurality of jacks is greater than the spacing between the respective pins of the corresponding camera module to be tested, and the size of the jack is also greater than the dimensions of the pins of the camera module to be tested.
  • the material jigsaw has a plurality of mounting positions for the adapter plates; the plurality of adapter plates are respectively fixed to the mounting positions for the plurality of adapter plates.
  • the material puzzle can be fixed to the material receiving unit of the camera module test equipment, and the plurality of jacks of the plurality of adapter plates can be electrically connected to the material receiving unit. It can be seen that the jack of the adapter plate can be used as an adapter electrode, so as to be plugged into the probe of the test equipment and realize electrical connection.
  • a plurality of probes of the test device constitute a probe array, and the probe array may also be referred to as a probe base in this document.
  • the probe base is used for electrical connection with the camera module to be tested.
  • a plurality of camera modules to be tested are fixed on the material panel, and the loading and unloading are in the unit of the material panel.
  • each material panel is installed on a test device, and Each probe base of the test equipment is inserted into the jack corresponding to each camera module to be tested on the material panel, and then each camera module to be tested on the material panel is powered on and each camera module to be tested.
  • the images captured by the group are transmitted to each image data collection box in parallel, and then the simultaneous testing of multiple camera modules is completed.
  • the adapter board is used to respectively fix and electrically connect the plurality of camera modules to be tested.
  • each adapter board has a plurality of jacks electrically connected to the pins of the camera module to be tested, and the spacing between the plurality of jacks is greater than that of the pins of the camera module to be tested The distance between them, the size of the jack is also larger than the size of the pin of the camera module to be tested.
  • the material jigsaw has a plurality of mounting positions of the adapter plates, and the plurality of adapter plates are respectively fixed to the mounting positions of the plurality of adapter plates.
  • the material puzzle may be fixed to the material receiving unit of the camera module test equipment, and the plurality of jacks of the plurality of adapter plates may be electrically connected to the material receiving unit. Since the pins of the camera module to be tested are very dense, when multiple camera modules to be tested are fixed in an array on the material panel, the pin positions of the camera modules to be tested at different positions are difficult to determine accurately. For example, a small deformation of the material panel may cause the pins of the camera module to be tested to be misaligned in different positions, making it difficult to plug the test equipment.
  • the camera module to be tested is first installed on the adapter board, and then the adapter board with the camera module to be tested is installed on the material puzzle. Since the spacing between the jacks on the adapter board is greater than the spacing between the pins of the camera module to be tested, the size of the jack is also larger than the pin dimensions of the camera module to be tested, so the position error The tolerance is improved, which facilitates the insertion of the probes on the panel of the test unit and the electrical connection between the camera module to be tested and the test unit.
  • each adapter board may need to be plugged into a large number of camera modules during the flow process, which inevitably causes wear of its plug-in parts.
  • the new connection structure proposed in this application can replace the wear-resistant plug-in parts with conductive cloth, thereby increasing the service life of the adapter plate.
  • the connection structure based on conductive cloth of the present application can reduce the number of drawing failures during the test process, which is beneficial to improve production efficiency (or test efficiency). Due to the puzzle test method, when any camera module in a puzzle fails to open a drawing, it is necessary to pick out the module that failed to open the drawing in the puzzle, remove it and re-test. These steps increase the difficulty of automated operations. Therefore, reducing the number of drawing failures will be very beneficial to improve the production efficiency of the camera module.
  • connection structure of the present application is not only suitable for testing the assembled module, but also suitable for testing the semi-finished product of the module.

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Abstract

一种用于模组通电测试的连接结构（100）和转接件，用于模组通电测试的连接结构（100）包括：线路板（10）；片状导电元件（20），其具有第一表面（21）和与第一表面（21）相反的第二表面（22），第二表面（22）附着于线路板（10）的表面，片状导电元件（20）在第一表面（21）的法线方向上导电，在平行于第一表面（21）的方向不导电；载具（30），其适于承载待通电测试的模组，待通电测试的模组包括连接器（50），载具（30）包括限位结构（34），限位结构（34）适于容纳连接器（50）并限制连接器（50）在平行于第一表面（21）的方向上的移动；以及紧固件（40），其用于将连接器（50）紧压在第一表面（21）。

Description

用于模组通电测试的连接结构和相应的转接件
交叉引用
本申请要求于2018年11月15日向中国专利局提交的、发明名称为“用于模组通电测试的连接结构和相应的转接件”的第201811359457.6号发明专利申请的优先权，上述专利申请的全部内容通过引用并入本文。
技术领域
本申请涉及生产线线体的模组通电测试。
背景技术
随着手机、电脑等终端的发展，用户对于各项需求都有着不小的提升，尤其随着手机的发展，用户对于拍摄质量的追求，使得厂商发展出了个性化、定制化的摄像模组，例如大光圈，大广角，解决像差而出现的数量较多的镜片的镜头等。这促使光学设计越来越复杂，而复杂的光学系统又很敏感，这对制造的良率和产品质量造成了不小的挑战。
另一方面，为保证产品质量，摄像模组出厂前通常需要通过一系列的测试(有时也称为组测)。在摄像模组组测阶段，需要对摄像模组进行多项性能测试和烧录，以保证摄像模组在安装到移动设备终端时的正常使用。由于市场需求巨大，摄像模组(尤其是手机摄像模组)往往需要在短时间内达到千万级甚至亿级的生产规模。为解决单个模组测试效率低的问题，申请人提出了一种拼版测试方案。在模组生产测试过程中，用中介转接件承接摄像模组，进而把多个摄像模组构成的阵列固定在拼板上，再将拼板与测试设备的电连接以同时完成多个摄像模组的测试，从而大大地提高了生产效率。
然而，中介转接件在经历多次流转后，连接器可能会出现损害， 这种损害肉眼通常无法识别。在组测阶段，这种损坏的中介转接件会导致模组开图失败(即通电后摄像模组的感光芯片无法正常地显示成像结果)，影响生产效率。具体来说，中介转接件结构包括与模组连接器连接的接口，以及与测试设备探针的连接端口。为实现良好连接，中介转接件上与模组连接器的接口采用与模组连接器适配的公母连接器进行插接。而中介转接件在经历多次流转后，其连接器(指中介转接件的连接器)可能因频繁地插拔而出现损害，但这种损害肉眼无法识别，从而导致模组开图失败，影响生产效率。因此，当前迫切需要可以提高使用寿命、提高产线中产品的直通率、提高生产效率的用于模组通电测试的解决方案。
发明内容
本申请旨在提供一种能够克服现有技术的至少一个缺陷的解决方案。
根据本申请的一个方面，提供了一种用于模组通电测试的连接结构，其包括：线路板；片状导电元件，其具有第一表面和与所述第一表面相反的第二表面，所述第二表面附着于所述线路板的表面，所述片状导电元件在所述第一表面的法线方向上导电，在平行于所述第一表面的方向不导电；载具，其适于承载待通电测试的模组，所述待通电测试的模组包括连接器，所述载具包括限位结构，所述限位结构适于容纳所述连接器并限制所述连接器在平行于所述第一表面的方向上的移动；以及紧固件，其用于将所述连接器紧压在所述第一表面。
其中，所述连接器包括连接器阵脚阵列。
其中，所述线路板包括与所述第二表面接触的触点阵列，所述触点阵列的各个触点位置与容纳于所述限位结构的所述连接器针脚阵列的各个针脚的位置适配。
其中，所述连接器包括连接器针脚阵列，所述片状导电元件包括绝缘介质和分布在绝缘介质中的导电针阵列；并且在所述连接器紧压在所述第一表面时，所述连接器针脚阵列的每个针脚可覆盖所述导电针阵列的多个导电针。
其中，所述片状导电元件为导电布，所述导电布包括硅胶和分布在所述硅胶中的导电针阵列。
其中，所述导电针呈柱状。
其中，所述导电针为金属材质。
其中，所述导电针的轴线与所述第一表面呈0-90度夹角。
其中，所述导电针的轴线与所述第一表面呈45-75度夹角。
其中，所述线路板还包括转接电极阵列和将所述触点阵列导通至所述转接电极阵列的走线。
其中，所述转接电极阵列包括多个转接电极，所述转接电极的尺寸大于所述触点的尺寸。
其中，所述转接电极阵列的转接电极之间的间距大于所述触点阵列的触点之间的间距。
其中，所述待通电测试的模组是光学器件模组。
其中，所述待通电测试的模组是摄像模组或投射模组。
其中，所述待通电测试的模组包括模组主体和通过柔性连接带与所述模组主体连接的连接器，所述连接器具有所述连接器针脚阵列。
其中，所述连接器为母插接件或公插接件。
其中，所述限位结构为限位孔。
其中，所述紧固件包括：压板，其适于将所述待通电测试的模组紧压在所述压板和所述载具之间；以及卡扣，其适于将所述压板固定在压紧状态。
其中，所述压板的一端与所述载具枢轴连接，所述压板的另一端连接所述卡扣。
其中，所述卡扣的一端与所述压板枢轴连接，所述卡扣的另一端适于与所述载具扣合。
其中，所述载具包括：载具底座，其适于承靠所述待通电测试的模组，并且所述载具底座具有容纳所述连接器的通孔；以及针座，其与所述通孔匹配并具有所述限位结构。
其中，所述压板具有与所述待通电测试的模组适配的通光孔。
其中，所述线路板具有用于避让光路的避让结构，所述光路是用 于对所述模组进行通电测试的光路。
其中，所述连接结构位于转接件，其中所述转接件用于将所述待通电测试的模组转接至测试设备。
其中，所述连接结构位于测试设备。
根据本申请的另一方面，还提供了一种用于模组通电测试的转接件，其包括：转接件线路板；片状导电元件，其具有第一表面和与所述第一表面相反的第二表面，所述第二表面附着于所述转接件线路板的表面，所述片状导电元件在所述第一表面的法线方向上导电，在平行于所述第一表面的方向不导电；载具，其适于承载待通电测试的模组，所述待通电测试的模组包括连接器，所述载具包括限位结构，所述限位结构适于容纳所述连接器针脚阵列并限制所述连接器在平行于所述第一表面的方向上的移动；以及紧固件，其用于将所述连接器紧压在所述第一表面。
其中，所述连接器包括连接器针脚阵列，所述转接件线路板包括与所述第二表面接触的触点阵列、转接电极阵列和将所述触点阵列导通至所述转接电极阵列的走线。
其中，所述触点阵列的各个触点位置与容纳于所述限位结构的所述连接器针脚阵列的各个针脚的位置适配，所述转接电极的尺寸大于所述触点的尺寸，且所述转接电极阵列的转接电极之间的间距大于所述触点阵列的触点之间的间距。
其中，所述连接器包括连接器针脚阵列，所述片状导电元件包括绝缘介质和分布在绝缘介质中的导电针阵列；并且在所述连接器紧压在所述第一表面时，所述连接器针脚阵列的每个针脚可覆盖所述导电针阵列的多个导电针。
其中，所述片状导电元件为导电布。
其中，所述导电布包括硅胶和分布在所述硅胶中的导电针阵列。
其中，所述导电针呈柱状。
其中，所述导电针为金属材质。
其中，所述导电针的轴线与所述第一表面呈0-90度夹角。
其中，所述导电针的轴线与所述第一表面呈45-75度夹角。
其中，所述待通电测试的模组是光学器件模组。
其中，所述待通电测试的模组是摄像模组或投射模组。
其中，所述待通电测试的模组包括模组主体和通过柔性连接带与所述模组主体连接的连接器，所述连接器具有所述连接器针脚阵列。
其中，所述连接器为母插接件或公插接件。
其中，所述限位结构为限位孔。
其中，所述紧固件包括：压板，其适于将所述待通电测试的模组紧压在所述压板和所述载具之间；以及卡扣，其适于将所述压板固定在压紧状态。
其中，所述压板的一端与所述载具枢轴连接，所述压板的另一端连接所述卡扣。
其中，所述卡扣的一端与所述压板枢轴连接，所述卡扣的另一端适于与所述载具扣合。
其中，所述载具包括：载具底座，其适于承靠所述待通电测试的模组，并且所述载具底座具有容纳所述连接器的通孔；以及针座，其与所述通孔匹配并具有所述限位结构。
其中，所述压板具有与所述待通电测试的模组适配的通光孔。
其中，所述线路板具有用于避让光路的避让结构，所述光路是用于对所述模组进行通电测试的光路。
与现有技术相比，本申请具有下列至少一个技术效果：
1、本申请可以通过外部的结构卡扣来取代原有的公母连接器的连接，从而减少模组连接器的在组测阶段因为插拔引起的损伤。
2、本申请可以通过导电布代替原来的连接器连接的方式，减少连接器因卡套过程而产生的磨损以及因外力作用导致连接器形变的问题，提高中介转接件的使用寿命。
3、本申请中，导电布(或类似其它片状导电元件)能够容忍在与模组连接器安装过程中不均匀受力下仍然实现良好连接，而不受影响。
4、本申请中，根据实际验证，由导电布当作连接器的中介转接 件在产品流转过程中接触良好，流转次数远远高于原有的连接器方式，提高自动化生产的产品直通率，从而提高生产效率。
附图说明
在参考附图中示出示例性实施例。本文中公开的实施例和附图应被视作说明性的，而非限制性的。
图1示出了本申请一个实施例的用于模组通电测试的转接件的立体爆炸示意图；
图2示出了本申请一个实施例中线路板具有避让结构的转接件的立体爆炸示意图；
图3示出了图2所示的转接件组装并扣合后的状态的示意图；
图4示出了本申请一个实施例中针座与导电布的位置关系的局部放大示意图；
图5示出了本申请一个实施例的导电布的局部结构放大示意图；
图6示出了本申请一个实施例的模组连接器的示意图。
具体实施方式
为了更好地理解本申请，将参考附图对本申请的各个方面做出更详细的说明。应理解，这些详细说明只是对本申请的示例性实施方式的描述，而非以任何方式限制本申请的范围。在说明书全文中，相同的附图标号指代相同的元件。表述“和/或”包括相关联的所列项目中的一个或多个的任何和全部组合。
应注意，在本说明书中，第一、第二等的表述仅用于将一个特征与另一个特征区分开来，而不表示对特征的任何限制。因此，在不背离本申请的教导的情况下，下文中讨论的第一主体也可被称作第二主体。
在附图中，为了便于说明，已稍微夸大了物体的厚度、尺寸和形状。附图仅为示例而并非严格按比例绘制。
还应理解的是，用语“包括”、“包括有”、“具有”、“包含”和/或“包 含有”，当在本说明书中使用时表示存在所陈述的特征、整体、步骤、操作、元件和/或部件，但不排除存在或附加有一个或多个其它特征、整体、步骤、操作、元件、部件和/或它们的组合。此外，当诸如“...中的至少一个”的表述出现在所列特征的列表之后时，修饰整个所列特征，而不是修饰列表中的单独元件。此外，当描述本申请的实施方式时，使用“可以”表示“本申请的一个或多个实施方式”。并且，用语“示例性的”旨在指代示例或举例说明。
如在本文中使用的，用语“基本上”、“大约”以及类似的用语用作表近似的用语，而不用作表程度的用语，并且旨在说明将由本领域普通技术人员认识到的、测量值或计算值中的固有偏差。
除非另外限定，否则本文中使用的所有用语(包括技术用语和科学用语)均具有与本申请所属领域普通技术人员的通常理解相同的含义。还应理解的是，用语(例如在常用词典中定义的用语)应被解释为具有与它们在相关技术的上下文中的含义一致的含义，并且将不被以理想化或过度正式意义解释，除非本文中明确如此限定。
需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互组合。下面将参考附图并结合实施例来详细说明本申请。
图1示出了本申请一个实施例的用于模组通电测试的转接件的立体爆炸示意图。本文中，转接件也可以称为中介转接件。参考图1，该转接件包括连接结构100，所述连接结构包括：线路板10、导电布20、载具30和紧固件40。其中导电布20具有第一表面21和与所述第一表面21相反的第二表面22，所述第二表面22附着于所述线路板10的表面，所述导电布在所述第一表面21的法线方向上导电(即在由第一表面21至第二表面22的方向导电)，在平行于所述第一表面21的方向不导电。例如当线路板和导电布均处于水平地放置时，导电布在竖直方向上导电，导电布在水平方向上不导电。载具30适于承载待通电测试的模组(例如摄像模组)，所述模组包括连接器针脚阵列。其中，连接器用于将模组与其它设备的线路电连接。连接器可以独立 于模组主体，例如连接器可以通过柔性连接带与模组主体电连接。连接器具有连接器针脚阵列，以同时进行多路信号(或数据)的输入输出。例如摄像模组通常需要大量的针脚以输出图像数据，因此连接器针脚阵列往往较为密集。并且终端设备(例如手机)内部空间十分紧凑，因此连接器往往尺寸较小，相应地针脚也较细。下文中，还会结合附图对连接器做进一步地描述，因此此处不再展开描述连接器的各项细节。本实施例中，所述载具30包括限位结构34，所述限位结构34适于容纳所述连接器针脚阵列并限制所述连接器针脚阵列在平行于所述第一表面21的方向上的移动。例如当线路板和导电布均处于水平地放置时，限位结构34可以限制所述连接器针脚阵列的水平移动，即限位结构34可以防止所述连接器针脚阵列在水平方向上移动。紧固件40用于将所述针脚阵列紧压在所述第一表面21。线路板10可以包括与所述第二表面22接触的触点阵列，所述触点阵列的各个触点位置与容纳于所述限位结构34的所述连接器针脚阵列的各个针脚的位置适配。所述待通电测试的模组可以是光学器件模组，例如可以是摄像模组或投射模组。投射模组例如可以是结构光投射模组。摄像模组可以单摄模组，也可以是双摄模组。所述光学器件模组还可以是由摄像模组和投射模组组成的结构光模组或其它可进行三维成像的模组。以上各种类型的模组均具有连接器以与其它设备、部件或模组的线路板(例如手机主板)插接，以实现与其它设备、部件或模组的线路板(例如手机主板)的电连接。
需注意，现有技术中，导电布例如可以是以纤维布为基材，经过前置处理后施以电镀金属镀层使其具有金属特性而成为导电纤维布。由于导电布具有良好的电磁屏蔽效果，常常用作电磁屏蔽保护外罩。
而本申请的上述实施例中，用导电布代替原有的转接件的连接器，通过外部的结构限位对摄像模组的连接器与导电布的连接位置进行定位限位，使得导电布与模组的连接器有良好的电连接效果。同时，本申请的上述实施例中，可以减少模组连接器的在组测阶段因为插拔引起的损伤；本实施例的转接件可以通过导电布代替原来的连接器连接方式，减少连接器因插拔过程而产生的磨损以及因外力作用导致的连 接器形变的问题，从而提高转接件的使用寿命，减少了因转接件损坏而导致的开图失败，进而提高自动化生产的产品直通率，提高生产效率。
进一步地，在本申请的一个实施例中，所述导电布包括硅胶和分布在所述硅胶中的导电针阵列。所述导电针可以呈柱状。所述导电针可以为金属材质。所述导电针的轴线可以与所述第一表面呈0-90度夹角。优选地，所述导电针的轴线可以与所述第一表面呈45-75度夹角。上述导电布可以实现：在所述第一表面的法线方向上导电，在平行于所述第一表面的方向不导电。并且，该导电布能够容忍在与模组连接器安装过程中不均匀受力下仍然实现良好连接，而不受影响。根据实际验证，由导电布当作连接器的转接件在产品流转过程中接触良好，流转次数远远高于原有的公母连接器插拔的连接方式。
进一步地，仍然参考图1，在本申请的一个实施例中，所述线路板10可以包括触点阵列、转接电极阵列和将所述触点阵列导通至所述转接电极阵列的走线。如前文所述，触点阵列与所述导电布20的第二表面22接触，所述触点阵列的各个触点位置与容纳于所述限位结构34的所述连接器针脚阵列的各个针脚的位置适配。所述转接电极阵列可以包括多个转接电极，所述转接电极的尺寸可以大于所述触点的尺寸。所述转接电极阵列的转接电极之间的间距可以大于所述触点阵列的触点之间的间距。
进一步地，在本申请的一个实施例中，所述待通电测试的模组可以包括模组主体和通过柔性连接带与所述模组主体连接的连接器，所述连接器具有所述连接器针脚阵列。所述连接器可以是母插接件，也可以是公插接件。换句话说，本申请中利用导电布的连接结构既适用于具有母连接器的模组，也适用于具有公连接器的模组。所述待通电测试的模组可以是光学器件模组，例如可以是摄像模组或投射模组。投射模组例如可以是结构光投射模组。摄像模组可以单摄模组，也可以是双摄模组。所述光学器件模组还可以是由摄像模组和投射模组组成的结构光模组或其它可进行三维成像的模组。以上各种类型的模组均具有连接器以与其它设备、部件或模组的线路板(例如手机主板) 插接，以实现与其它设备、部件或模组的线路板(例如手机主板)的电连接。
进一步地，在本申请的一个实施例中，所述限位结构33可以为限位孔。所述紧固件40包括：压板41和卡扣42。所述载具30包括载具底座31和针座32。载具底座31适于承靠所述待通电测试的模组，并且所述载具底座31具有容纳所述连接器的通孔33。针座32与所述通孔33匹配并具有所述限位结构34(即限位孔)。压板41适于将所述待通电测试的模组紧压在所述压板41和所述载具30之间(例如紧压在所述压板41和载具底座31之间)，卡扣42适于将所述压板41固定在压紧状态。在一个实施例中，所述压板41的一端与所述载具30枢轴连接(例如与载具底座31枢轴连接)，所述压板41的另一端连接所述卡扣42。所述卡扣42的一端与所述压板41枢轴连接，所述卡扣42的另一端适于与所述载具30扣合(例如与载具底座31扣合)。
仍然参考图1，在本申请的一个实施例中，所述压板41具有与所述待通电测试的模组适配的通光孔43，以使摄像模组或投射模组的测试光路不被遮挡。本实施例适用于模组主体与连接器朝向相反的情况。此情况下，模组主体背靠载具底座31(即模组主体朝上)，连接器朝向导电布20(即连接器朝下)。
进一步地，参考图1，在一个实施例中，转接件从结构上分为上下部结构，上部结构主要包括卡扣42和压板41。下部结构主要包括载具30(其包括载具底座31和针座32)、导电布20以及线路板10(例如但不限于PCB板)，各部分结构相互适配。上部结构中，卡扣42与压板41通过枢轴(例如销轴)连接，卡扣42用于将压板41和载具底座31紧密扣合。需注意，卡扣42与压板41之间也可以通过其它机械方式配合连接，只要卡扣42与压板41便于打开和扣合即可。图1中，压板41上具有模组通光孔43，作为在性能测试过程中摄像模组开图的开窗。下部结构中，载具底座31与压板41通过机械方式配合连接，载具底座31具有连接器限位结构34(图1中为限位孔)，用于将模组放入中介转接件时限制模组连接器的位置。导电布20上导电针密集分布，针的角度可以是0-90度(优选为45-75度)，并且具有在受力情 况下产生一定的角度压弯仍能够导通电路的能力。线路板的一面与导电布连通，内部电路重排放大，在另一面形成大的金属导电点，用于在性能测试过程中与测试探针连接，从而降低对探针精度的要求。本实施例中，针座32可以与导电布20和PCB板共同组成模组连接器与测试设备的探针的电路通道。
示例性地，上述转接件的连接结构的工作流程如下：打开卡扣42，使压板41和载具底座31成90度；然后将摄像模组(或其它待通电测试的模组)放入载具底座31，并且使连接器置于限位位置处，其中使连接器针脚阵列置于限位结构34(例如限位孔)中；最后压板41下压，卡扣42扣合，从而使连接器针脚阵列与导电布20紧密接触，进而通过导电布20与线路板10的触点阵列导通。
进一步地，图2示出了本申请一个实施例中线路板具有避让结构的转接件的立体爆炸示意图。参考图2，在另一个实施例中，所述转接件的线路板10具有用于避让光路的避让结构19，其中光路是用于对所述模组进行通电测试的光路。本实施例适用于模组主体与连接器朝向相同的情况。此情况下，模组主体的位置与所述避让结构适配，且模组主体朝下，并且连接器朝向导电布(即连接器朝下)。例如当模组为摄像模组时，该摄像模组的镜头朝下，其连接器也朝下。进一步地，图3示出了图2所示的转接件组装并扣合后的状态的示意图。如图3所示，卡扣42扣合，使得压板41与载具底座31互相压紧，从而使位于限位结构34中的连接器针脚阵列与导电布紧密接触(需注意图3中导电布被遮挡，未示出)，进而通过导电布与线路板10的触点阵列导通。并且，如图3所示，摄像模组的镜头的位置可对应于避让结构19，以便布置光路来对所述摄像模组的光学性能进行通电测试。
进一步地，图4示出了本申请一个实施例中针座与导电布的位置关系的局部放大示意图。图4中，针座32具有限位孔，以便容纳连接器针脚阵列。导电布20位于针座32下方。布置于限位孔的连接器针脚阵列的各个针脚可以穿过限位孔以与所述导电布20接触。
图5示出了本申请一个实施例的导电布的局部结构放大示意图。参考图5，本实施例中，导电布20具有均匀分布的导电针23所构成 的导电针阵列。所述导电针23可以呈柱状。所述导电针23可以为金属材质，例如铜合金，优选地，该铜合金还可以进一步镀金。所述导电针23的轴线可以与所述第一表面呈0-90度夹角。优选地，所述导电针的轴线可以与所述第一表面呈45-75度夹角。导电针23的截面非常微小，连接器针脚阵列中的每个针脚可以对应于多个导电针。例如，连接器针脚阵列中的每个针脚可以覆盖导电布20的多个导电针23。扣合状态下，对于待通电测试的模组的连接器的任一针脚，只要该针脚与部分导电针导通，这些导电针即可将电流从导电布20的正面(例如图1所示的第一表面21)传递至背面(例如图1所示的第二表面22)，进而与位于导电布20背面的线路板上对应触点电连接。理论上说，对于待通电测试的模组的连接器的任一针脚，只要有一个与其对应的导电针正常，那么就可以实现导通。而作为对比，现有的公母连接器插接方案中，针脚一对一地插接，任何一个针脚损坏都会导致开图失败。因此本实施例的设计可以获得更好的可靠性。同时，由于导电针阵列之间的间隙填充有绝缘物，因此可以实现纵向导电而横向不导电，即在所述第一表面的法线方向上导电，在平行于所述第一表面的方向不导电。需要注意，本申请中，导电布也可以被其它片状导电元件替代。该片状导电元件具有第一表面和与所述第一表面相反的第二表面，所述第二表面附着于所述线路板的表面，并且所述片状导电元件在所述第一表面的法线方向上导电，在平行于所述第一表面的方向不导电。在一个实施例中，该片状导电元件例如可以包括绝缘介质和分布在绝缘介质中的导电针阵列；并且在所述连接器紧压在所述第一表面时，所述连接器针脚阵列的每个针脚可覆盖所述导电针阵列的多个导电针。
图6示出了本申请一个实施例的模组连接器的示意图。参考图6，可以看出连接器50包括多个针脚51组成的针脚阵列。针脚51可以是金属丝，多个针脚51可以依次排列在突出的绝缘龙骨52上。绝缘龙骨52可以安装于底座53上。绝缘龙骨52可以呈方框状。需注意，图6中，模组连接器处于朝上的状态，在进行连接时，该模组连接器朝向导电布(即图1、图2和图3中朝下的方向)。
在一个变型的实施例中，还可以将与上述转接件类似的连接结构设置在测试设备上，这样模组的连接器针脚阵列可以直接通过该连接结构与测试设备电连接，进而完成测试。本实施例尤其适用于非拼板式的模组生产线。非拼板式的模组生产线中，生产线上的物料(或称为线体)是单个模组，而非多个模组构成的拼板。本实施例中，用于模组通电测试的连接结构位于测试设备。该连接结构包括：线路板、导电布、载具和紧固件。其中导电布具有第一表面和与所述第一表面相反的第二表面，所述第二表面附着于所述线路板的表面，所述导电布在所述第一表面的法线方向上导电，在平行于所述第一表面的方向不导电。载具适于承载待通电测试的模组(例如摄像模组)，所述模组包括连接器针脚阵列，所述载具包括限位结构，所述限位结构适于容纳所述连接器针脚阵列并限制所述连接器针脚阵列在平行于所述第一表面的方向上的移动。紧固件用于将所述针脚阵列紧压在所述第一表面。线路板可以包括与所述第二表面接触的触点阵列，所述触点阵列的各个触点位置与容纳于所述限位结构的所述连接器针脚阵列的各个针脚的位置适配。所述待通电测试的模组是光学器件模组，例如摄像模组或投射模组(例如结构光投射模组)。本实施例中，测试设备的线路板可以与连接结构的线路板合为一体。测试设备可以直接通过触点阵列与所述模组导通，从而进行通电测试。
进一步地，在一个实施例中，所述测试设备的连接结构中，所述触点阵列的各个触点位置与容纳于所述限位结构的所述连接器针脚阵列的各个针脚的位置适配，所述转接电极的尺寸可以大于所述触点的尺寸，且所述转接电极阵列的转接电极之间的间距可以大于所述触点阵列的触点之间的间距。本实施例中，测试设备可以通过转接电极阵列与所述模组导通，从而进行通电测试。例如测试设备可以具有与转接电极阵列适配的设备探针阵列，通过设备探针阵列与转接电极阵列的插接来实现导通。
下面以摄像模组及摄像模组测试设备为例，对本申请的中介转接件及连接结构做进一步地说明。
根据本申请的一个实施例中，提供了一种中介转件板(可视为一 种板状的中介转接件)。多个该中介转件板可以与物料拼板、摄像模组及摄像模组测试设备组成摄像模组测试系统。摄像模组测试设备可以是任意测试项目的测试设备，本文中对此不做限制。本实施例中，多个转接板用于固定和电连接所述多个待测摄像模组，并且每个转接板均具有与相应的待测摄像模组的各个针脚分别电连接的多个插孔(这些插孔可作为转接电极阵列)。所述多个插孔之间的间距大于相应的待测摄像模组的各个针脚之间的间距，所述插孔的尺寸也大于所述待测摄像模组的针脚的尺寸。物料拼板具有多个转接板安装位；所述多个转接板分别固定在所述多个转接板安装位。所述物料拼板可固定至摄像模组测试设备的物料接纳单元，所述多个转接板的所述多个插孔可与所述物料接纳单元电连接。可以看出转接板的插孔可以作为转接电极，以便与测试设备的探针插接并实现电连接。本实施例中，测试设备的多个探针构成探针阵列，本文中也可以将探针阵列称为探针座。探针座用于实现与待测摄像模组的电连接。
在一个实施例中，将多个待测摄像模组固定在物料拼板上，上下料以物料拼板为单位，在基于流水线的测试中，每个物料拼板安装在一个测试设备上，并使该测试设备的各个探针座分别插入物料拼板上对应于每个待测摄像模组的插孔，即可为物料拼板上的各个待测摄像模组通电并将各个待测摄像模组所拍摄的图像并行地传输给各个图像数据采集盒，进而完成多个摄像模组的同步测试。
进一步地，在一个实施例中，转接板用于分别固定和电连接所述多个待测摄像模组。在测试时，先将待测摄像模组安装在转接板上，然后再将安装有待测摄像模组的转接板安装到物料拼板上。其中，每个转接板具有与所述待测摄像模组的各个针脚分别电连接的多个插孔，所述多个插孔之间的间距大于所述待测摄像模组的各个针脚之间的间距，所述插孔的尺寸也大于所述待测摄像模组的针脚的尺寸。物料拼板具有多个转接板安装位，所述多个转接板分别固定在所述多个转接板安装位。所述物料拼板可固定至所述摄像模组测试设备的物料接纳单元，所述多个转接板的所述多个插孔可与所述物料接纳单元电连接。由于待测摄像模组的针脚十分密集，当多个待测摄像模组以阵 列的形式固定在物料拼板上时，不同位置的待测摄像模组的针脚位置难以精确确定。例如，物料拼板的微小变形可能会导致不同位置的待测摄像模组的针脚错位，使其难以与测试设备实现插接。而本实施例中，先将待测摄像模组安装在转接板上，然后再将安装有待测摄像模组的转接板安装到物料拼板上。由于转接板上的插孔之间的间距大于所述待测摄像模组的各个针脚之间的间距，插孔的尺寸也大于所述待测摄像模组的针脚的尺寸，因此对位置误差的容忍度提高，从而便于测试单元面板上的探针插入进而实现待测摄像模组与测试单元的电连接。
基于上述描述，可以看出，每个转接板在流转过程中均可能需要与大量的摄像模组进行插接，这不可避免地导致其插接件磨损。而本申请中提出的新的连接结构可利用导电布替换易于磨损的插接件，从而增加了转接板的使用寿命。并且，本申请的基于导电布的连接结构可以减少测试过程中的开图失败次数，有利于提升生产效率(或测试效率)。由于采用拼板测试方式，当一块拼板中的任一摄像模组开图失败时，都需要在该拼板中挑出该开图失败的模组，将其取下并重新进行测试。这些步骤都增加了自动化作业的难度。因此减少开图失败次数将非常有利于提高摄像模组的生产效率。
需注意，上述摄像模组可以被替换为其它需要对光学性能进行通电测试的模组，这是本领域普通技术人员易于理解的。并且，本申请的连接结构不仅适用于对组装完成的模组进行测试的情形，还可以适于用对模组半成品进行测试的情形。
以上描述仅为本申请的较佳实施方式以及对所运用技术原理的说明。本领域技术人员应当理解，本申请中所涉及的发明范围，并不限于上述技术特征的特定组合而成的技术方案，同时也应涵盖在不脱离所述发明构思的情况下，由上述技术特征或其等同特征进行任意组合而形成的其它技术方案。例如上述特征与本申请中公开的(但不限于)具有类似功能的技术特征进行互相替换而形成的技术方案。

Claims (26)

  1. 用于模组通电测试的连接结构，其特征在于，包括：
    线路板；
    片状导电元件，其具有第一表面和与所述第一表面相反的第二表面，所述第二表面附着于所述线路板的表面，所述片状导电元件在所述第一表面的法线方向上导电，在平行于所述第一表面的方向不导电；
    载具，其适于承载待通电测试的模组，所述待通电测试的模组包括连接器，所述载具包括限位结构，所述限位结构适于容纳所述连接器并限制所述连接器在平行于所述第一表面的方向上的移动；以及
    紧固件，其用于将所述连接器紧压在所述第一表面。
  2. 根据权利要求1所述的连接结构，其特征在于，所述连接器包括连接器阵脚阵列，所述线路板包括与所述第二表面接触的触点阵列，所述触点阵列的各个触点位置与容纳于所述限位结构的所述连接器针脚阵列的各个针脚的位置适配。
  3. 根据权利要求1所述的连接结构，其特征在于，所述连接器包括连接器针脚阵列，所述片状导电元件包括绝缘介质和分布在绝缘介质中的导电针阵列；并且在所述连接器紧压在所述第一表面时，所述连接器针脚阵列的每个针脚可覆盖所述导电针阵列的多个导电针。
  4. 根据权利要求3所述的连接结构，其特征在于，所述片状导电元件为导电布，所述导电布包括硅胶和分布在所述硅胶中的导电针阵列，所述导电针呈柱状。
  5. 根据权利要求3所述的连接结构，其特征在于，所述导电针为金属材质。
  6. 根据权利要求3所述的连接结构，其特征在于，所述导电针 的轴线与所述第一表面呈0-90度夹角。
  7. 根据权利要求3所述的连接结构，其特征在于，所述导电针的轴线与所述第一表面呈45-75度夹角。
  8. 根据权利要求2所述的连接结构，其特征在于，所述线路板还包括转接电极阵列和将所述触点阵列导通至所述转接电极阵列的走线。
  9. 根据权利要求2所述的连接结构，其特征在于，所述转接电极阵列包括多个转接电极，所述转接电极的尺寸大于所述触点的尺寸。
  10. 根据权利要求2所述的连接结构，其特征在于，所述转接电极阵列的转接电极之间的间距大于所述触点阵列的触点之间的间距。
  11. 根据权利要求1所述的连接结构，其特征在于，所述待通电测试的模组是光学器件模组。
  12. 根据权利要求1所述的连接结构，其特征在于，所述待通电测试的模组是摄像模组或投射模组。
  13. 根据权利要求1所述的连接结构，其特征在于，所述待通电测试的模组包括模组主体和通过柔性连接带与所述模组主体连接的连接器，所述连接器具有连接器针脚阵列。
  14. 根据权利要求13所述的连接结构，其特征在于，所述连接器为母插接件或公插接件。
  15. 根据权利要求1所述的连接结构，其特征在于，所述限位结构为限位孔。
  16. 根据权利要求1所述的连接结构，其特征在于，所述紧固件包括：
    压板，其适于将所述待通电测试的模组紧压在所述压板和所述载具之间；以及
    卡扣，其适于将所述压板固定在压紧状态。
  17. 根据权利要求16所述的连接结构，其特征在于，所述压板的一端与所述载具枢轴连接，所述压板的另一端连接所述卡扣。
  18. 根据权利要求17所述的连接结构，其特征在于，所述卡扣的一端与所述压板枢轴连接，所述卡扣的另一端适于与所述载具扣合。
  19. 根据权利要求1所述的连接结构，其特征在于，所述载具包括：
    载具底座，其适于承靠所述待通电测试的模组，并且所述载具底座具有容纳所述连接器的通孔；以及
    针座，其与所述通孔匹配并具有所述限位结构。
  20. 根据权利要求16所述的连接结构，其特征在于，所述压板具有与所述待通电测试的模组适配的通光孔。
  21. 根据权利要求1所述的连接结构，其特征在于，所述线路板具有用于避让光路的避让结构，所述光路是用于对所述模组进行通电测试的光路。
  22. 根据权利要求1所述的连接结构，其特征在于，所述连接结构位于转接件，其中所述转接件用于将所述待通电测试的模组转接至测试设备。
  23. 根据权利要求1所述的连接结构，其特征在于，所述连接结构位于测试设备。
  24. 用于模组通电测试的转接件，其特征在于，包括：
    转接件线路板；
    片状导电元件，其具有第一表面和与所述第一表面相反的第二表面，所述第二表面附着于所述转接件线路板的表面，所述片状导电元件在所述第一表面的法线方向上导电，在平行于所述第一表面的方向不导电；
    载具，其适于承载待通电测试的模组，所述待通电测试的模组包括连接器，所述载具包括限位结构，所述限位结构适于容纳所述连接器针脚阵列并限制所述连接器在平行于所述第一表面的方向上的移动；以及
    紧固件，其用于将所述连接器紧压在所述第一表面。
  25. 根据权利要求24所述的连接结构，其特征在于，所述连接器包括连接器针脚阵列，所述转接件线路板包括与所述第二表面接触的触点阵列、转接电极阵列和将所述触点阵列导通至所述转接电极阵列的走线；
    其中，所述触点阵列的各个触点位置与容纳于所述限位结构的所述连接器针脚阵列的各个针脚的位置适配，所述转接电极的尺寸大于所述触点的尺寸，且所述转接电极阵列的转接电极之间的间距大于所述触点阵列的触点之间的间距。
  26. 根据权利要求24所述的连接结构，其特征在于，所述连接器包括连接器针脚阵列，所述片状导电元件包括绝缘介质和分布在绝缘介质中的导电针阵列；并且在所述连接器紧压在所述第一表面时，所述连接器针脚阵列的每个针脚可覆盖所述导电针阵列的多个导电针。
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