WO2020098077A1 - 一种减压干燥设备 - Google Patents

一种减压干燥设备 Download PDF

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Publication number
WO2020098077A1
WO2020098077A1 PCT/CN2018/123127 CN2018123127W WO2020098077A1 WO 2020098077 A1 WO2020098077 A1 WO 2020098077A1 CN 2018123127 W CN2018123127 W CN 2018123127W WO 2020098077 A1 WO2020098077 A1 WO 2020098077A1
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Prior art keywords
sealed chamber
inner tube
reduced
bronchus
drying apparatus
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PCT/CN2018/123127
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English (en)
French (fr)
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管源
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to US16/338,708 priority Critical patent/US10871325B2/en
Publication of WO2020098077A1 publication Critical patent/WO2020098077A1/zh
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements for supplying or controlling air or other gases for drying solid materials or objects
    • F26B21/30—Controlling, e.g. regulating, parameters of gas supply
    • F26B21/35—Temperature; Pressure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/04—Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Definitions

  • the invention relates to the technical field of semiconductor production equipment, in particular to a reduced-pressure drying equipment.
  • VCD vacuum decompression drying
  • the complete lithography process includes three main steps: photoresist coating process, exposure process, and development process, to complete the definition of precision graphics on the substrate.
  • photoresist coating process the substrate coated with the photoresist is placed in a sealed chamber, and a vacuum is drawn in the sealed chamber, so that the photoresist solvent reaches the saturated vapor pressure and quickly volatilizes.
  • the airflow is pumped away to achieve the purpose of preliminary drying the photoresist.
  • the prior art decompression drying equipment mainly adopts the method of air circulation to take away the organic matter in the photoresist on the surface of the glass substrate.
  • the photoresist itself is liquid and has a certain fluidity.
  • the pressure of the air supply of the vacuum drying equipment is unstable, the airflow may cause a small flow of the photoresist when passing through the substrate surface, thereby making the thickness of the photoresist on the glass substrate surface. Uneven conditions occur, affecting product characteristics.
  • Embodiments of the present invention provide a reduced-pressure drying device that shortens the air supply distance of the bronchus and reduces the pressure drop of the airflow, so that the upper and lower air pressures are stable and the product characteristics are stable.
  • the present application provides a reduced-pressure drying device for performing reduced-pressure drying treatment on a photoresist coated on a substrate surface, wherein the reduced-pressure drying device includes a sealed chamber, An air pressure adjusting device and a bearing platform located in the sealed chamber;
  • the carrying platform is used to carry a substrate coated with photoresist on the surface;
  • the air pressure adjusting device is disposed on the side of the sealed chamber, and the air pressure adjusting device includes a protective gas passage to the sealed chamber A main trachea and a bronchus, the bronchus is connected to the main trachea, and the main trachea is arranged symmetrically up and down on the side surface of the sealed chamber;
  • the main trachea includes an upper main trachea and a lower main trachea.
  • the upper main trachea and the lower main trachea are arranged symmetrically up and down on the side surface of the sealed chamber, and the sealed chamber can accommodate 2n
  • the upper main air pipe supplies gas to the upper n substrates in the sealed chamber
  • the lower main gas pipe supplies gas to the n lower substrates in the sealed chamber, where n is a positive integer;
  • the bronchus adopts a double sleeve design.
  • the bronchus includes an outer tube and an inner tube, a first cavity is formed in the inner tube, and a second cavity is formed between the outer tube and the inner tube.
  • the inner tube is provided with a plurality of inner tube air outlets, and when the intake air enters the bronchus through the main air tube, the first cavity is filled, and then passes through the inner tube air outlets on the inner tube Fill the second cavity.
  • the outer tube is provided with a plurality of gas outlets for the outer tube, so as to pass the protective gas into the sealed chamber, so that the photoresist in each area of the substrate surface in the sealed chamber is uniformly dried.
  • outer tube and the inner tube are round tubes, and the outer tube has a larger cross-sectional diameter than the inner tube.
  • an intake pipe is provided on the bronchus, the bronchus passes protective gas into the sealed chamber through the intake pipe, and a butterfly valve for adjusting the size of the airflow is provided on the intake pipe.
  • the reduced-pressure drying equipment further includes:
  • a temperature adjustment module is provided on the carrying platform; the temperature adjustment module includes at least a heating sub-module and a cooling sub-module; wherein, the temperature adjustment module is used for local temperature control of the substrate in the sealed chamber to make the seal
  • the photoresist in each area of the substrate surface in the chamber is uniformly dried.
  • the carrying platform is disposed at a relatively central position in the sealed chamber, so that there is a first gap between the opposite ends of the carrying platform and the side walls of the sealed chamber, and the surface of the carrying platform There is a second gap between the upper cover and the lower cover of the sealed chamber, the first gap between the end opposite to the carrying platform and the side wall of the sealed chamber, the surface of the carrying platform and the sealed chamber
  • the second gap in the upper cover of the chamber forms an air duct.
  • the present application also provides a reduced-pressure drying device for performing reduced-pressure drying treatment on the photoresist coated on the surface of the substrate.
  • the reduced-pressure drying device includes a sealed chamber, an air pressure adjustment device, and a Describe the bearing platform in the sealed chamber;
  • the carrying platform is used to carry a substrate coated with photoresist on the surface;
  • the air pressure adjusting device is disposed on the side of the sealed chamber, and the air pressure adjusting device includes a protective gas passage to the sealed chamber A main trachea and a bronchus, the bronchus is connected to the main trachea, and the main trachea is arranged symmetrically up and down on the side surface of the sealed chamber.
  • the main trachea includes an upper main trachea and a lower main trachea.
  • the upper main trachea and the lower main trachea are arranged symmetrically up and down on the side surface of the sealed chamber, and the sealed chamber It can accommodate 2n substrates, the upper main air pipe supplies gas to the upper n substrates in the sealed chamber, and the lower main gas pipe supplies gas to the n lower substrates in the sealed chamber, where n is Positive integer.
  • bronchus adopts a double sleeve design.
  • the bronchus includes an outer tube and an inner tube, a first cavity is formed in the inner tube, and a second cavity is formed between the outer tube and the inner tube.
  • the inner tube is provided with a plurality of inner tube air outlets, and when the intake air enters the bronchus through the main air tube, the first cavity is filled, and then passes through the inner tube air outlets on the inner tube Fill the second cavity.
  • the outer tube is provided with a plurality of gas outlets for the outer tube, so as to pass the protective gas into the sealed chamber, so that the photoresist in each area of the substrate surface in the sealed chamber is uniformly dried.
  • an intake pipe is provided on the bronchus, the bronchus passes protective gas into the sealed chamber through the intake pipe, and a butterfly valve for adjusting the size of the airflow is provided on the intake pipe.
  • the reduced-pressure drying equipment further includes:
  • a temperature adjustment module is provided on the carrying platform; the temperature adjustment module includes at least a heating sub-module and a cooling sub-module; wherein, the temperature adjustment module is used for local temperature control of the substrate in the sealed chamber to make the seal
  • the photoresist in each area of the substrate surface in the chamber is uniformly dried.
  • the temperature adjustment module is embedded in the bearing platform, and the heating sub-module of the temperature adjustment module is close to the upper surface of the bearing platform, and the cooling sub-module is attached to the heating sub-module bottom of.
  • the heating sub-module is an infrared heat radiation source
  • the cooling sub-module is a circulating water cooler
  • the embodiment of the present invention provides a reduced-pressure drying device including a sealed chamber, an air pressure adjustment device, and a carrying platform located in the sealed chamber; the carrying platform is used to carry a substrate coated with photoresist; the air pressure adjustment device is disposed in the sealed chamber On the side, the air pressure adjusting device includes a main trachea and a bronchus that feed shielding gas into the sealed chamber, the bronchus is connected to the main trachea, and the main trachea is arranged symmetrically up and down on the side surface of the sealed chamber.
  • the upper and lower symmetrical main trachea design is adopted to shorten the air supply distance of the bronchus and reduce the pressure drop of the airflow, so that the upper and lower air pressures are stable and the product characteristics are stable.
  • Figure 1 is a schematic diagram of the structure of the existing conventional design vacuum drying equipment
  • FIG. 2 is a schematic structural view of an embodiment of a reduced-pressure drying device according to an embodiment of the present invention
  • FIG. 3 is a schematic structural view of an embodiment of a bronchus in a reduced-pressure drying device according to an embodiment of the present invention
  • FIG. 4 is a schematic diagram of a cross-sectional structure of a bronchus in a reduced-pressure drying device provided by an embodiment of the present invention.
  • Active matrix organic light-emitting diode or active matrix organic light-emitting diode (Active-matrix organic light-emitting diode diode, AMOLED) process
  • vacuum drying equipment is an important process for baking organic photoresist.
  • the purpose is to evaporate the organic solvent in the photoresist uniformly, so that the polymer material of the photoresist is better and more uniformly polymerized.
  • the baking process of the vacuum drying equipment mainly uses air circulation to take away the organic substances in the photoresist on the surface of the glass substrate.
  • the photoresist itself is liquid and has a certain fluidity. When the pressure of the air supply of the vacuum drying equipment is unstable, the airflow may cause a small flow of the photoresist when passing through the substrate surface, thereby making the thickness of the photoresist on the glass substrate surface Uneven conditions occur, affecting product characteristics.
  • FIG. 1 it is a schematic diagram of a conventional structure of an existing reduced-pressure drying equipment.
  • a main air pipe 101 and a plurality of bronchial pipes 102 for introducing protective gas into a sealed chamber are provided on the side of the reduced-pressure drying equipment. It can accommodate 10 substrates, and the main air pipe 101 is under the side of the equipment, supplying air from the bottom to the top, which results in a significant pressure drop in the airflow at the bottom and upper of the equipment.
  • the gas flow from the upper substrate is not uniform, so that the thickness of the photoresist on the surface of each glass substrate in the device is uneven, affecting product characteristics.
  • An embodiment of the present invention provides a reduced-pressure drying device for performing a reduced-pressure drying process on a photoresist coated on a substrate surface.
  • FIG. 2 it is an implementation of the reduced-pressure drying device in the embodiment of the present invention.
  • a schematic diagram of an example, the reduced-pressure drying equipment includes a sealed chamber, an air pressure adjustment device, and a carrying platform located in the sealed chamber;
  • the carrying platform is used to carry a substrate coated with photoresist, the sealed chamber can be opened, the substrate to be dried can be placed on the carrying platform, or the dried substrate can be taken out of the sealed chamber .
  • the air pressure adjusting device is disposed on the side of the sealed chamber.
  • the air pressure adjusting device includes a main trachea 110 and a bronchus 120 that feed protective gas to the sealed chamber.
  • the bronchus 120 is connected to the main trachea 110.
  • the side surfaces of the sealed chamber are arranged symmetrically up and down.
  • the upper and lower symmetrical main trachea design is adopted to shorten the air supply distance of the bronchus and reduce the airflow pressure drop.
  • the airflow simulation results show that the airflow stability is significantly improved, which makes the upper and lower air pressure stable Stable characteristics.
  • the main trachea 110 includes an upper main trachea 111 and a lower main trachea 112.
  • the upper main trachea 111 and the lower main trachea 112 are on the side of the sealed chamber
  • the surface is arranged symmetrically up and down.
  • the sealed chamber can accommodate 2n substrates.
  • the upper main air pipe 111 supplies the upper n substrates in the sealed chamber.
  • the bronchus is also divided by the middle line on the side of the sealed chamber, and the symmetrical design of the upper and lower sides, that is, a number of bronchial tubes are provided above the side of the sealed chamber As shown in 2, a number of bronchial tubes are arranged side by side), and a number of bronchial tubes are also symmetrically designed at the lower part of the side of the sealed chamber.
  • the bronchus adopts a double sleeve design.
  • the bronchus includes an outer tube 121 and an inner tube 122, a first cavity 123 is formed in the inner tube 122, and a second cavity 124 is formed between the outer tube 121 and the inner tube 122.
  • both the outer tube 121 and the inner tube 122 may have a circular cross-section, that is, the outer tube 121 and the inner tube 122 are both round tubes, and the outer tube 121 has a larger cross-sectional diameter than the inner tube.
  • the inner tube 122 is provided with a plurality of inner tube outlets 125.
  • the intake air enters the bronchus 120 through the main air tube 110, the first cavity 123 is filled and then passes through the inner tube 122 The upper inner tube outlets 125 fill the second cavity 124.
  • the outer tube 121 is also provided with a plurality of outer tube gas outlets 126 to pass protective gas into the sealed chamber, so that the photoresist in each area of the substrate surface in the sealed chamber is uniformly dried.
  • an intake pipe is provided on the bronchus 120, and the bronchus 120 passes protective gas through the intake pipe to the sealed chamber, and a butterfly valve for adjusting the size of the airflow is provided on the intake pipe to make the intake airflow More stable and even.
  • the carrier platform may be disposed at a relatively central position in the sealed chamber, so that there is a first gap between the opposite ends of the carrier platform and the side wall of the sealed chamber, and the surface of the carrier platform and the upper and lower covers of the sealed chamber There is a second gap between the covers, a first gap between the opposite end of the carrier platform and the side wall of the sealed chamber, and a second gap between the surface of the carrier platform and the upper cover of the sealed chamber form an air channel.
  • the reduced-pressure drying device further includes: a temperature adjustment module, which is disposed on the supporting platform; the temperature adjustment module includes at least a heating submodule and a cooling submodule; wherein, the temperature adjustment module is used to Local temperature control is performed on the substrate in the sealed chamber, so that the photoresist in each area on the surface of the substrate in the sealed chamber is evenly dried. Further, the temperature adjustment module is embedded in the supporting platform, and the heating submodule of the temperature adjusting module is close to the upper surface of the supporting platform, and the cooling submodule is attached to the bottom of the heating submodule.
  • the load-bearing platform includes a casing, and a volume cavity is formed in the shell, and the temperature regulation module is disposed in the volume cavity, the temperature regulation module includes a heating sub-module and a cooling sub-module, wherein the heating sub-module and the cooling The sub-modules are stacked, and the heating sub-module is located above the cooling sub-module, close to the upper surface of the carrier platform, and then close to the substrate on the surface of the carrier platform, so as to exert better heating effect, and the cooling sub-module is attached to the heater The bottom of the module to quickly cool the corresponding heating sub-module.
  • the temperature adjustment module is disposed in the center area of the carrier platform to perform temperature control on the center area of the substrate.
  • the temperature adjustment modules arranged in the central area of the load-bearing platform are distributed in concentric circles, so that the adjacent temperature adjustment modules are tightly connected, and the heat is transferred to each other, which is beneficial to the rapid heating and cooling of the local area.
  • the temperature adjustment modules are dispersedly arranged on the carrier platform; local temperature control is performed on the substrate on the carrier platform, so that the photoresist in each area of the substrate surface is evenly dried .
  • the heating sub-module is an infrared heat radiation source
  • the cooling sub-module is a circulating water cooler.

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Abstract

一种减压干燥设备，其包括密封腔室、气压调节装置以及位于密封腔室内的承载平台；气压调节装置包括主气管（110）和支气管（120），支气管（120）连接主气管（110），主气管（110）在密封腔室的侧边表面上下对称设置。通过采用上下对称主气管（110）设计，缩短支气管（120）供气距离，减少气流压降，使得上下气压稳定，产品特性稳定。

Description

一种减压干燥设备 技术领域
本发明涉及半导体生产设备技术领域，具体涉及一种减压干燥设备。
 背景技术
TFT-LCD(Thin Film Transistor-Liquid Crystal Display，简称薄膜晶体管液晶显示器)的基板制作过程中，真空减压干燥(Vacuum Dry，简称VCD)是一道重要的工序。真空减压干燥是对涂布有光致抗蚀剂等膜层的涂覆液的基板进行减压干燥处理，使得膜层固化。
完整的光刻工艺通过光刻胶涂覆制程，曝光制程，显影制程三个主体步骤，完成基板上精密图形的定义。在涂覆制程后的减压干燥工序中，将涂布有光刻胶的基板置于密封腔室内，密封腔室内抽真空，使得光刻胶溶剂达到饱和蒸汽压快速挥发，挥发汽体进而随气流被抽走，达到初步干燥光刻胶的目的。
 技术问题
现有技术的减压干燥设备，主要是采用气流循环的方式带走玻璃基板表面光刻胶中的有机物。光刻胶本身为液态有一定的流动性，当减压干燥设备供气压力不稳定时，气流经过基板表面时有可能使光刻胶产生小范围流动，从而使得玻璃基板表面的光刻胶厚度发生不均匀的状况，影响产品特性。
 技术解决方案
本发明实施例提供一种减压干燥设备，缩短支气管供气距离，减少气流压降，使得上下气压稳定，产品特性稳定。
为解决上述问题，第一方面，本申请提供一种减压干燥设备，用于对涂布于基板表面的光刻胶进行减压干燥处理，其中，所述减压干燥设备包括密封腔室、气压调节装置以及位于所述密封腔室内的承载平台；
所述承载平台用以承载表面涂布有光刻胶的基板；所述气压调节装置设置在所述密封腔室的侧边，所述气压调节装置包括向所述密封腔室通入保护气的主气管和支气管，所述支气管连接所述主气管，所述主气管在所述密封腔室的侧边表面上下对称设置；
所述主气管包括上侧主气管和下侧主气管，所述上侧主气管和所述下侧主气管在所述密封腔室的侧边表面上下对称设置，所述密封腔室内可容纳2n片基板，所述上侧主气管为所述密封腔室内上侧n片基板供气，所述下侧主气管为所述密封腔室内下侧n片基板供气，其中，n为正整数；
所述支气管采用双套管设计。
进一步的，所述支气管包括外管和内管，所述内管内形成第一空腔，所述外管和所述内管之间形成第二空腔。
进一步的，所述内管上设置有若干内管出气口，当进气通过所述主气管进入所述支气管时，填充所述第一空腔，再通过所述内管上若干内管出气口填充所述第二空腔。
进一步的，所述外管上设置有若干外管出气口，以向所述密封腔室通入保护气，使得所述密封腔室内基板表面各区域的光刻胶干燥程度均匀。
进一步的，所述外管和所述内管均为圆管，所述外管截面直径大于内管。
进一步的，在所述支气管上设置有进气管，所述支气管通过所述进气管向所述密封腔室通入保护气，所述进气管上设置用于调节气流大小的蝴蝶阀。
进一步的，所述减压干燥设备还包括：
温度调节模块，设置于所述承载平台上；所述温度调节模块至少包括一加热子模块和一冷却子模块；其中，所述温度调节模块用以对密封腔室内基板进行局部温度调控，使得密封腔室内基板表面各区域的光刻胶干燥程度均匀。
进一步的，所述承载平台设置于密封腔室内相对居中的位置，使得所述承载平台相对的两端部与所述密封腔室的侧壁之间存在第一空隙，并且，所述承载平台表面与所述密封腔室上盖和下盖之间具有第二空隙，所述承载平台相对的端部与密封腔室的侧壁之间的第一空隙以及所述承载平台表面与所述密封腔室上盖的第二空隙形成风道。
第二方面，本申请还提供一种减压干燥设备，用于对涂布于基板表面的光刻胶进行减压干燥处理，所述减压干燥设备包括密封腔室、气压调节装置以及位于所述密封腔室内的承载平台；
所述承载平台用以承载表面涂布有光刻胶的基板；所述气压调节装置设置在所述密封腔室的侧边，所述气压调节装置包括向所述密封腔室通入保护气的主气管和支气管，所述支气管连接所述主气管，所述主气管在所述密封腔室的侧边表面上下对称设置。
进一步的，所述主气管包括上侧主气管和下侧主气管，所述上侧主气管和所述下侧主气管在所述密封腔室的侧边表面上下对称设置，所述密封腔室内可容纳2n片基板，所述上侧主气管为所述密封腔室内上侧n片基板供气，所述下侧主气管为所述密封腔室内下侧n片基板供气，其中，n为正整数。
进一步的，所述支气管采用双套管设计。
进一步的，所述支气管包括外管和内管，所述内管内形成第一空腔，所述外管和所述内管之间形成第二空腔。
进一步的，所述内管上设置有若干内管出气口，当进气通过所述主气管进入所述支气管时，填充所述第一空腔，再通过所述内管上若干内管出气口填充所述第二空腔。
进一步的，所述外管上设置有若干外管出气口，以向所述密封腔室通入保护气，使得所述密封腔室内基板表面各区域的光刻胶干燥程度均匀。
进一步的，在所述支气管上设置有进气管，所述支气管通过所述进气管向所述密封腔室通入保护气，所述进气管上设置用于调节气流大小的蝴蝶阀。
进一步的，所述减压干燥设备还包括：
温度调节模块，设置于所述承载平台上；所述温度调节模块至少包括一加热子模块和一冷却子模块；其中，所述温度调节模块用以对密封腔室内基板进行局部温度调控，使得密封腔室内基板表面各区域的光刻胶干燥程度均匀。
进一步的，所述温度调节模块嵌设于所述承载平台内，并且，所述温度调节模块的加热子模块靠近所述承载平台的上表面，所述冷却子模块贴合于所述加热子模块的底部。
进一步的，所述加热子模块为红外热辐射源，所述冷却子模块为循环水冷器。
 有益效果
本发明实施例减压干燥设备包括密封腔室、气压调节装置以及位于密封腔室内的承载平台；承载平台用以承载表面涂布有光刻胶的基板；气压调节装置设置在所述密封腔室的侧边，气压调节装置包括向密封腔室通入保护气的主气管和支气管，支气管连接主气管，主气管在密封腔室的侧边表面上下对称设置。本发明实施例中采用上下对称主气管设计，缩短支气管供气距离，减少气流压降，使得上下气压稳定，产品特性稳定。
 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为现有常规设计减压干燥设备的结构示意图；
图2是本发明实施例提供一种减压干燥设备的一个实施例结构示意图；
图3是本发明实施例提供的减压干燥设备中支气管的一个实施例结构示意图；
图4是本发明实施例提供的减压干燥设备中支气管的一个横截面结构示意图。
 本发明的实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
有源矩阵有机发光二极体或主动矩阵有机发光二极体（Active-matrix organic light-emitting diode，AMOLED）工艺中，减压干燥设备对有机光刻胶烘烤为一重要制程。目的是将光刻胶中的有机溶剂均匀的挥发出来，使得光刻胶高分子物质更好，更均匀的聚合。减压干燥设备烘烤制程主要是采用气流循环的方式带走玻璃基板表面光刻胶中的有机物。光刻胶本身为液态有一定的流动性，当减压干燥设备供气压力不稳定时，气流经过基板表面时有可能使光刻胶产生小范围流动，从而使得玻璃基板表面的光刻胶厚度发生不均匀的状况，影响产品特性。
如图1所示，为现有的一种减压干燥设备的常规结构示意图，在减压干燥设备侧边设置有向密封腔室通入保护气的总气管101和若干支气管102，密封腔室内可容纳10片基板，总气管101在设备侧边下方，自下向上供气，这样导致设备底部与上部气流压降明显，经过测试，设备底部气压明显高于上部气压，从而使得设备底部的基板与上部基板供气气流不均，从而使得设备内各玻璃基板表面的光刻胶厚度发生不均匀的状况，影响产品特性。
本发明实施例中提供一种减压干燥设备，用于对涂布于基板表面的光刻胶进行减压干燥处理，如图2所示，为本发明实施例中减压干燥设备的一个实施例示意图，该减压干燥设备包括密封腔室、气压调节装置以及位于该密封腔室内的承载平台；
该承载平台用以承载表面涂布有光刻胶的基板，可以打开所述密封腔室，将待干燥处理的基板放置于所述承载平台上，或将干燥处理后的基板从密封腔室内取出。该气压调节装置设置在该密封腔室的侧边，该气压调节装置包括向该密封腔室通入保护气的主气管110和支气管120，该支气管120连接该主气管110，该主气管110在该密封腔室的侧边表面上下对称设置。
本发明实施例中采用上下对称主气管设计，缩短支气管供气距离，减少气流压降，本发明实施例中采用新设计改善后，气流模拟结果显示气流稳定性明显改善，使得上下气压稳定，产品特性稳定。
如图2所示，在本发明一些实施例中，主气管110包括上侧主气管111和下侧主气管112，该上侧主气管111和该下侧主气管112在密封腔室的侧边表面上下对称设置，该密封腔室内可容纳2n片基板，该上侧主气管111为密封腔室内上侧n片基板供气，该下侧主气管112为该密封腔室内下侧n片基板供气，其中，n为正整数，例如n为5，则密封腔室内容纳2*5=10片基板。
本发明实施例中，在主气管采用上下对称设计时，支气管也在密封腔室侧边以中线为分割线，上下对称设计，即在密封腔室侧边上部设置若干支气管（就可以是如图2所示，并排设置若干支气管），在密封腔室侧边下部也对称设计若干支气管。
进一步的，本发明实施例中支气管采用双套管设计。如图3所示，支气管包括外管121和内管122，该内管122内形成第一空腔123，该外管121和该内管122之间形成第二空腔124。其中，如图4所示，该外管121和内管122均截面均可以为圆形，即外管121和内管122均为圆管，外管121截面直径大于内管。
在本发明一些实施例中，该内管122上设置有若干内管出气口125，当进气通过该主气管110进入该支气管120时，填充该第一空腔123，再通过该内管122上若干内管出气口125填充该第二空腔124。
同样的，该外管121上也设置有若干外管出气口126，以向该密封腔室通入保护气，使得该密封腔室内基板表面各区域的光刻胶干燥程度均匀。
在本发明一些实施例中，在支气管120上设置有进气管，该支气管120通过进气管向密封腔室通入保护气，该进气管上设置用于调节气流大小的蝴蝶阀，使得进气气流更加稳定均匀。
另外，承载平台可以设置于密封腔室内相对居中的位置，使得承载平台相对的两端部与密封腔室的侧壁之间存在第一空隙，并且，承载平台表面与密封腔室上盖和下盖之间具有第二空隙，承载平台相对的端部与密封腔室的侧壁之间的第一空隙以及承载平台表面与密封腔室上盖的第二空隙形成风道。
在本发明另一些实施例中，减压干燥设备还包括：温度调节模块，设置于承载平台上；该温度调节模块至少包括一加热子模块和一冷却子模块；其中，该温度调节模块用以对密封腔室内基板进行局部温度调控，使得密封腔室内基板表面各区域的光刻胶干燥程度均匀。进一步的，该温度调节模块嵌设于承载平台内，并且，该温度调节模块的加热子模块靠近该承载平台的上表面，该冷却子模块贴合于该加热子模块的底部。
具体的，该承载平台包括一壳体，壳体内形成有容腔，容腔内设置有所述温度调节模块，温度调节模块包括一加热子模块与一冷却子模块，其中，加热子模块与冷却子模块层叠设置，并且，加热子模块位于冷却子模块上方，贴近承载平台的上表面，进而靠近位于承载平台表面的基板，以发挥较佳的加热效果，冷却子模块贴设于所述加热子模块的底部，以对相应的加热子模块迅速降温。
该承载平台上设置的温度调节模块至少为一个，当温度调节模块为一个时，该温度调节模块设置于承载平台的中心区域，以对基板的中心区域进行温度调控。设置于承载平台的中心区域的温度调节模块呈同心圆形分布，使得相邻的所述温度调节模块之间连接紧密，热量相互传递，利于对局部区域的快速升温与降温。
当承载平台上设置的温度调节模块为至少两个时，该温度调节模块分散设置于承载平台上；以对承载平台上的基板进行局部温度调控，使得基板表面各区域的光刻胶干燥程度均匀。进一步的，该加热子模块为红外热辐射源，该冷却子模块为循环水冷器。
以上对本发明实施例所提供的一种减压干燥设备进行了详细介绍，本文中应用了具体个例对本发明的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本发明的方法及其核心思想；同时，对于本领域的技术人员，依据本发明的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本发明的限制。

Claims (20)

  1. 一种减压干燥设备，用于对涂布于基板表面的光刻胶进行减压干燥处理，其中，所述减压干燥设备包括密封腔室、气压调节装置以及位于所述密封腔室内的承载平台；
    所述承载平台用以承载表面涂布有光刻胶的基板；所述气压调节装置设置在所述密封腔室的侧边，所述气压调节装置包括向所述密封腔室通入保护气的主气管和支气管，所述支气管连接所述主气管，所述主气管在所述密封腔室的侧边表面上下对称设置；
    所述主气管包括上侧主气管和下侧主气管，所述上侧主气管和所述下侧主气管在所述密封腔室的侧边表面上下对称设置，所述密封腔室内可容纳2n片基板，所述上侧主气管为所述密封腔室内上侧n片基板供气，所述下侧主气管为所述密封腔室内下侧n片基板供气，其中，n为正整数；
    所述支气管采用双套管设计。
  2. 根据权利要求1所述的减压干燥设备，其中，所述支气管包括外管和内管，所述内管内形成第一空腔，所述外管和所述内管之间形成第二空腔。
  3. 根据权利要求2所述的减压干燥设备，其中，所述内管上设置有若干内管出气口，当进气通过所述主气管进入所述支气管时，填充所述第一空腔，再通过所述内管上若干内管出气口填充所述第二空腔。
  4. 根据权利要求2所述的减压干燥设备，其中，所述外管上设置有若干外管出气口，以向所述密封腔室通入保护气，使得所述密封腔室内基板表面各区域的光刻胶干燥程度均匀。
  5. 根据权利要求2所述的减压干燥设备，其中，所述外管和所述内管均为圆管，所述外管截面直径大于内管。
  6. 根据权利要求1所述的减压干燥设备，其中，在所述支气管上设置有进气管，所述支气管通过所述进气管向所述密封腔室通入保护气，所述进气管上设置用于调节气流大小的蝴蝶阀。
  7. 根据权利要求1所述的减压干燥设备，其中，所述减压干燥设备还包括：
    温度调节模块，设置于所述承载平台上；所述温度调节模块至少包括一加热子模块和一冷却子模块；其中，所述温度调节模块用以对密封腔室内基板进行局部温度调控，使得密封腔室内基板表面各区域的光刻胶干燥程度均匀。
  8. 根据权利要求1所述的减压干燥设备，其中，所述承载平台设置于密封腔室内相对居中的位置，使得所述承载平台相对的两端部与所述密封腔室的侧壁之间存在第一空隙，并且，所述承载平台表面与所述密封腔室上盖和下盖之间具有第二空隙，所述承载平台相对的端部与密封腔室的侧壁之间的第一空隙以及所述承载平台表面与所述密封腔室上盖的第二空隙形成风道。
  9. 一种减压干燥设备，用于对涂布于基板表面的光刻胶进行减压干燥处理，其中，所述减压干燥设备包括密封腔室、气压调节装置以及位于所述密封腔室内的承载平台；
    所述承载平台用以承载表面涂布有光刻胶的基板；所述气压调节装置设置在所述密封腔室的侧边，所述气压调节装置包括向所述密封腔室通入保护气的主气管和支气管，所述支气管连接所述主气管，所述主气管在所述密封腔室的侧边表面上下对称设置。
  10. 根据权利要求9所述的减压干燥设备，其中，所述主气管包括上侧主气管和下侧主气管，所述上侧主气管和所述下侧主气管在所述密封腔室的侧边表面上下对称设置，所述密封腔室内可容纳2n片基板，所述上侧主气管为所述密封腔室内上侧n片基板供气，所述下侧主气管为所述密封腔室内下侧n片基板供气，其中，n为正整数。
  11. 根据权利要求9所述的减压干燥设备，其中，所述支气管采用双套管设计。
  12. 根据权利要求11所述的减压干燥设备，其中，所述支气管包括外管和内管，所述内管内形成第一空腔，所述外管和所述内管之间形成第二空腔。
  13. 根据权利要求12所述的减压干燥设备，其中，所述内管上设置有若干内管出气口，当进气通过所述主气管进入所述支气管时，填充所述第一空腔，再通过所述内管上若干内管出气口填充所述第二空腔。
  14. 根据权利要求12所述的减压干燥设备，其中，所述外管上设置有若干外管出气口，以向所述密封腔室通入保护气，使得所述密封腔室内基板表面各区域的光刻胶干燥程度均匀。
  15. 根据权利要求12所述的减压干燥设备，其中，所述外管和所述内管均为圆管，所述外管截面直径大于内管。
  16. 根据权利要求9所述的减压干燥设备，其中，在所述支气管上设置有进气管，所述支气管通过所述进气管向所述密封腔室通入保护气，所述进气管上设置用于调节气流大小的蝴蝶阀。
  17. 根据权利要求9所述的减压干燥设备，其中，所述减压干燥设备还包括：
    温度调节模块，设置于所述承载平台上；所述温度调节模块至少包括一加热子模块和一冷却子模块；其中，所述温度调节模块用以对密封腔室内基板进行局部温度调控，使得密封腔室内基板表面各区域的光刻胶干燥程度均匀。
  18. 根据权利要求17所述的减压干燥设备，其中，所述温度调节模块嵌设于所述承载平台内，并且，所述温度调节模块的加热子模块靠近所述承载平台的上表面，所述冷却子模块贴合于所述加热子模块的底部。
  19. 根据权利要求17所述的减压干燥设备，其中，所述加热子模块为红外热辐射源，所述冷却子模块为循环水冷器。
  20. 根据权利要求9所述的减压干燥设备，其中，所述承载平台设置于密封腔室内相对居中的位置，使得所述承载平台相对的两端部与所述密封腔室的侧壁之间存在第一空隙，并且，所述承载平台表面与所述密封腔室上盖和下盖之间具有第二空隙，所述承载平台相对的端部与密封腔室的侧壁之间的第一空隙以及所述承载平台表面与所述密封腔室上盖的第二空隙形成风道。
PCT/CN2018/123127 2018-11-15 2018-12-24 一种减压干燥设备 Ceased WO2020098077A1 (zh)

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10309722B1 (en) * 2013-03-14 2019-06-04 International Research Institute Inc. Microwave and vacuum drying device, system, and related methods
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07333857A (ja) * 1994-06-02 1995-12-22 Tokyo Electron Ltd 処理方法及び処理装置
KR20080080925A (ko) * 2007-03-02 2008-09-05 도쿄엘렉트론가부시키가이샤 기판 처리 장치
CN102236271A (zh) * 2010-04-29 2011-11-09 北京京东方光电科技有限公司 光刻胶干燥设备和方法
CN107219727A (zh) * 2017-06-22 2017-09-29 武汉华星光电技术有限公司 减压干燥设备
CN107315325A (zh) * 2017-07-18 2017-11-03 武汉华星光电半导体显示技术有限公司 减压干燥设备及减压干燥方法
CN107413603A (zh) * 2017-07-20 2017-12-01 武汉华星光电技术有限公司 真空减压干燥设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3857514A (en) * 1970-09-03 1974-12-31 Armstrong Machine Works Steam dispersion manifold
US5937536A (en) * 1997-10-06 1999-08-17 Pharmacopeia, Inc. Rapid drying oven for providing rapid drying of multiple samples
US6881437B2 (en) * 2003-06-16 2005-04-19 Blue29 Llc Methods and system for processing a microelectronic topography
JP4680030B2 (ja) * 2005-10-31 2011-05-11 東京応化工業株式会社 減圧処理装置
CN106814545B (zh) * 2015-11-30 2018-08-24 上海微电子装备（集团）股份有限公司 气压测量装置及方法、调焦调平装置及光刻机设备
US20170322059A1 (en) * 2016-05-09 2017-11-09 Eric Lowe Low pressure drop and high temperature flow measuring device
KR102764217B1 (ko) * 2017-02-10 2025-02-06 어플라이드 머티어리얼스, 인코포레이티드 딥 트렌치에서의 저온 선택적 에피택시를 위한 방법 및 장치

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07333857A (ja) * 1994-06-02 1995-12-22 Tokyo Electron Ltd 処理方法及び処理装置
KR20080080925A (ko) * 2007-03-02 2008-09-05 도쿄엘렉트론가부시키가이샤 기판 처리 장치
CN102236271A (zh) * 2010-04-29 2011-11-09 北京京东方光电科技有限公司 光刻胶干燥设备和方法
CN107219727A (zh) * 2017-06-22 2017-09-29 武汉华星光电技术有限公司 减压干燥设备
CN107315325A (zh) * 2017-07-18 2017-11-03 武汉华星光电半导体显示技术有限公司 减压干燥设备及减压干燥方法
CN107413603A (zh) * 2017-07-20 2017-12-01 武汉华星光电技术有限公司 真空减压干燥设备

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