WO2020098019A1 - 显示面板及其加工设备 - Google Patents

显示面板及其加工设备 Download PDF

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Publication number
WO2020098019A1
WO2020098019A1 PCT/CN2018/119456 CN2018119456W WO2020098019A1 WO 2020098019 A1 WO2020098019 A1 WO 2020098019A1 CN 2018119456 W CN2018119456 W CN 2018119456W WO 2020098019 A1 WO2020098019 A1 WO 2020098019A1
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Prior art keywords
pin
terminal
display panel
conductive layer
metal layer
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Ceased
Application number
PCT/CN2018/119456
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English (en)
French (fr)
Inventor
杨春辉
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HKC Co Ltd
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HKC Co Ltd
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Application filed by HKC Co Ltd filed Critical HKC Co Ltd
Priority to US17/042,181 priority Critical patent/US11227526B2/en
Publication of WO2020098019A1 publication Critical patent/WO2020098019A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13458—Terminal pads
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • G06F1/1658—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories related to the mounting of internal components, e.g. disc drive or any other functional module
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/189—Power distribution
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/04—Structural and physical details of display devices
    • G09G2300/0421—Structural details of the set of electrodes
    • G09G2300/0426—Layout of electrodes and connections

Definitions

  • the present application relates to the field of display technology, in particular to a display panel and its processing equipment.
  • Thin film transistor liquid crystal displays (Thin Film Transistor-Liquid Crystal) (TFT-LCD) generally include four major items: array technology, color film technology, box-forming technology, and module technology.
  • the module process is also called assembling engineering, which is the process of crimping the drive circuit on the display screen and installing components such as the backlight.
  • the polarizing film attaching process the driver chip's auto-bonding process (TAB), the printed circuit board (PCB) bonding process, and the driving circuit Loop adjustment and backlight matching.
  • TAB driver chip's auto-bonding process
  • PCB printed circuit board
  • the terminal pins of the display are bound to the output pins of the driver chip, and the output pins of the driver chip may be excessively deep into the display panel In this case, the output pin of the driver chip will be deeply tilted inside the display panel.
  • TAB tape auto-bonding
  • the present application provides a display panel and a processing device for preventing the output pin of the driving chip from penetrating into the interior of the display panel.
  • the present application provides a display panel, including: a display screen and a connection terminal provided at the edge of the display screen; a drive chip provided with a drive chip connected to the connection terminal module; An output pin of the driver chip on the side of the driver chip module close to the connection terminal; a terminal pin provided at the connection terminal and bound to the output pin of the driver chip; provided at the terminal lead
  • the fan-out area of the side of the foot away from the edge of the display screen; the depth of the terminal pin is greater than the length of the overlapping area of the output pin of the driver chip and the terminal pin; the height of the terminal pin is greater than that The height of the fan-out area is high.
  • the driving chip module is one of an automatic bonding tape, a tape carrier package, and a chip on a film; the upper surface of the terminal pin is provided with a conductive layer, and the conductive layer and the automatic bonding tape Or drive the output pin binding connection of the on-load package or the chip on the film.
  • the conductive layer includes a metal wire layer film structure.
  • the terminal pin includes a substrate, a first metal layer, a first insulating layer, a second metal layer, and a second insulating layer formed in sequence; the conductive layer includes an upper surface formed on the second insulating layer Transparent conductive layer; the transparent conductive layer is connected to the first metal layer and the second metal layer through vias.
  • the terminal pin includes a substrate, a first metal layer, a first insulating layer, a second metal layer, and a second insulating layer formed in sequence; the conductive layer includes an upper surface formed on the second insulating layer Transparent conductive layer; the transparent conductive layer is connected to the first metal layer through a via.
  • the terminal pin includes a substrate, a first metal layer, a first insulating layer, a second metal layer, and a second insulating layer formed in sequence; the conductive layer includes an upper surface formed on the second insulating layer Transparent conductive layer; the transparent conductive layer is connected to the second metal layer through a via.
  • the depth of the terminal pin is at least one-fifth longer than the overlapping length of the output pin of the driving chip.
  • the terminal pin is at least twice as long as the overlap length of the output pin of the driving chip.
  • the terminal pin is less than or equal to the length of the output pin of the driving chip.
  • the depth of the terminal pin is greater than the specification binding length plus the error threshold.
  • the error threshold is less than 500 microns and greater than 0.
  • the terminal pin includes a pin area provided on the side close to the output pin of the driving chip, and a padding portion provided on the side far from the output pin of the drive chip;
  • the upper surface of the pin area is provided with a conductive layer, and the upper surface of the pad height portion is not provided with a conductive layer.
  • the terminal pin includes a substrate, a first metal layer, a first insulating layer, a second metal layer, and a second insulating layer formed in sequence;
  • the conductive layer includes an upper surface formed on the second insulating layer Transparent conductive layer;
  • the transparent conductive layer is respectively connected to one or two layers of the first metal layer and the second metal layer through via holes;
  • the pad portion includes a substrate, a first metal layer, a An insulating layer and a second insulating layer; the height of the pad height portion is equivalent to the terminal pin; the height of the pad height portion is higher than the height of the fan-out area.
  • the first metal layer is connected to the scan line in the display panel.
  • the first metal layer is connected to the common electrode line in the display panel.
  • the first metal layer is connected to the data line in the display panel.
  • the present application also discloses a display panel, comprising: a display screen and a connection terminal provided on the edge of the display screen; a drive chip module provided with a drive chip connected to the connection terminal; and a drive chip module provided on the drive chip module A group of drive chip output pins close to the connection terminal; terminal pins provided at the connection terminal and bound to the drive chip output pins; set at the terminal pins away from the A fan-out area on one side of the display screen edge; the terminal pins include a substrate, a first metal layer, a first insulating layer, a second metal layer, and a second insulating layer formed in sequence; the upper surface of the terminal pins A conductive layer is provided; the conductive layer includes a transparent conductive layer formed on the upper surface of the second insulating layer; the transparent conductive layer is connected to the first metal layer and the second metal layer through via holes, respectively.
  • the depth of the terminal pin is greater than the length of the output pin of the driver chip plus the error threshold; the error threshold is less than 500
  • the present application also discloses a processing device for processing the display panel as described above, including: an indenter for pressing the terminal pin and the output pin of the driving chip; the length of the indenter is equivalent to the terminal pin .
  • the output pins of the driver chip when the output pins of the driver chip are bound to the terminal pins, the output pins of the driver chip may be excessively deep into the display panel.
  • the specific performance is that the output pin of the driver chip away from the edge of the display exceeds the terminal The side of the pin away from the edge of the display, because the overlapping area is the contact part of the terminal pin and the fan-out area, the height of the fan-out area is generally lower than the height of the terminal pin, the difference in height formed by the two will make
  • the output pins of the driver chip are prone to warp during binding (both up and down are possible), causing the wiring in the output pin of the driver chip to break or the output pin of the driver chip that crosses the boundary to warp and damage the wiring at the display Or other structures; however, the length of the overlapping part of the terminal pin and the output pin of the driver chip in this application is smaller than the terminal pin of the display screen, and the height of the terminal pin is higher than the height of the fan-out area, because the terminal pin
  • FIG. 1 is a schematic diagram of a display panel according to an embodiment of the present application.
  • FIG. 2 is a schematic diagram of a display panel normally bound according to an embodiment of the present application
  • FIG. 3 is a schematic diagram of an output pin of a driving chip after the display panel is bound according to an embodiment of the present application;
  • FIG. 4 is a schematic diagram of an extension area of a terminal pin of a display screen according to an embodiment of the present application.
  • FIG. 5 is a schematic diagram of a pin area of a display screen according to an embodiment of the present application.
  • FIG. 6 is a complete schematic diagram of a display terminal pin according to an embodiment of the present application.
  • FIG. 7 is a schematic diagram of a display terminal pin and an output pin of a driving chip according to an embodiment of the present application.
  • FIG. 8 is a schematic diagram of the formation of various layers of a terminal pin of a display screen according to an embodiment of the present application.
  • FIG. 9 is a schematic diagram of another extended area of a terminal pin of a display screen according to an embodiment of the present application.
  • FIG. 10 is a complete schematic diagram of another display terminal pin according to an embodiment of the present application.
  • connection should be understood in a broad sense, for example, it can be fixed connection or detachable Connected, or connected integrally; either mechanically or electrically; directly connected, or indirectly connected through an intermediary, or internally connected between two components.
  • installation should be understood in a broad sense, for example, it can be fixed connection or detachable Connected, or connected integrally; either mechanically or electrically; directly connected, or indirectly connected through an intermediary, or internally connected between two components.
  • an embodiment of the present application discloses a display panel 100, including: a display screen 100; a connection terminal 120 disposed at an edge of the display screen 110; a driving chip connected to the connection terminal 120
  • the module 150 is provided with a driving chip; the driving chip output pin 170 is provided on the side of the driving chip module 150 close to the connection terminal 120; the fan-out area 130 is provided on the terminal pin 140 away One side of the edge of the display screen 110; the depth of the terminal pin 140 is greater than the length of the overlapping area of the output pin 170 of the driving chip and the terminal pin 140; the height of the terminal pin 140 is higher than that of the fan The height of the exit zone 130 is high.
  • the driver chip output pin 170 when the driver chip output pin 170 is bound to the terminal pin 140, the driver chip output pin 170 may be excessively deep into the display panel 100.
  • the specific performance is that the driver chip output pin 170 is far from the display The side of the edge of the screen 110 exceeds the side of the terminal pin 140 away from the edge of the display 110.
  • the height of the fan-out area 130 is generally lower than the terminal lead
  • the height of the foot 140 and the height difference formed by the two will make the output pin 170 of the driver chip warp easily when bonding (it may be up and down), causing the wiring in the output pin 170 of the driver chip to break or It is the case that the output pin 170 of the out-of-bounds driver chip is lifted to damage the wiring or other structure at the display screen 110; however, the length of the overlapping portion of the terminal pin 140 of the present application and the output pin 170 of the drive chip is shorter than the terminal lead of the display screen Feet 140, and the height of the terminal pin 140 is higher than the height of the fan-out area 130, because the terminal pin 140 is extended, the terminal pin 140 is longer than the preset length, so that under normal circumstances, the The terminal pin 140 may be longer than the length of the overlapping area, and even if there is an operation error or misalignment that causes the driver chip output pin 170
  • the indenter 200 has a flat support surface when it is pressed and bound, reducing or even avoiding the situation that the output pin 170 of the driver chip is lifted during binding, and the output pin 170 of the driver chip that is lifted is easily broken and may be affected.
  • the external force has effects such as loosening of the peeling-off leading to poor contact, etc., which improves the yield.
  • the driving chip module 150 is one of an automatic bonding tape 160, a tape carrier package and a chip on film; the upper surface of the terminal pin 140 is provided with a conductive layer, the conductive layer It is connected to the output pin of the driver chip on the automatic bonding tape 160 or the tape carrier package or the chip on the film.
  • the driving chip module 150 of this solution may be any of the three types of automatic bonding tape 160, tape carrier package and chip on film.
  • a conductive layer is provided on the upper surface of the terminal pin 140, that is, the terminal leads Before the extension design of the pin 140 and the part added by the extension design can be transmitted, or the terminal pin 140 can be considered to include the pin area 147 and the extension portion, and the extension portion and the pin area 147 pass through the same mask process , Has the same function; since the range of the pin area 147 is extended by the extension part, the conductive layer used as a transmission medium after bonding also becomes longer, so that when the output pin of the driver chip In the case of 170 excessive bonding, the effective contact area (conductive area) of the output pin 170 of the driver chip and the terminal pin 140 will not be reduced, but may be increased, effectively improving the transmission of external signals to the display
  • the stability of the panel 100 wherein, the conductive layer may be a transparent conductive layer 146 and the like to connect the signal lines (which may include gate lines, data
  • the terminal pin 140 includes a substrate, a first metal layer 142, a first insulating layer 143, a second metal layer 144, and a second insulating layer 145 formed in sequence; the conductive layer includes The transparent conductive layer 146 on the upper surface of the second insulating layer 145; the transparent conductive layer 146 is respectively connected to one or two of the first metal layer 142 and the second metal layer 144 through via holes.
  • the transparent conductive layer 146 is connected to one or two layers of the first metal layer 142 and the second metal layer 144. According to different lines, the transparent conductive layer 146 is also connected to different metal layers, and then output to the driver chip.
  • Pin 170 is bound to receive the corresponding signal from the driver chip 200, and the extended setting of the terminal pin 140 makes it possible to ensure that the contact area will not decrease or even reduce the output pin 170 of the driver chip when it is deeper than normal Increase to ensure the stability of the connection.
  • the terminal pin 140 of the display screen 110 may be a terminal pin 140 corresponding to a common electrode line, a terminal pin 140 corresponding to a gate line, a terminal pin 140 corresponding to a data line, or other signal lines Terminal pin 140; when the terminal pin 140 corresponds to the common electrode line, the transparent conductive layer 146 may be connected to one or two layers of the first metal layer 142 according to specific conditions, and then pass through the fan-out area 130 Connect or via to the common motor wire.
  • the transparent conductive layer 146 is generally connected to the first metal layer 142, the second metal layer 144 may or may not be provided, and the transparent conductive layer 146 may be connected to the second metal
  • the layer 144 may not be in contact (for example, the second metal layer 144 is not conductive in the plane, so even if there is contact during the via hole, it does not matter), but no matter what, the transparent conductive layer 146 will eventually only Connected to the gate line; when the terminal pin 140 corresponds to the data line, similarly, the transparent conductive layer 146 may be connected to one or both of the first metal layer 142 and the second metal layer 144, but in-plane, Only turn on the corresponding data line.
  • the depth of the terminal pin 140 is at least one-fifth longer than the overlapping length of the output pin 170 of the driving chip.
  • the terminal pin 140 of the display 110 needs to It is longer than the predetermined overlap length of the driver chip output pin 170. Specifically, the terminal pin 140 is at least one-fifth longer than the driver chip output pin 170 to ensure that the driver chip output pin 170 is bound In the case of excessive penetration, the range of the terminal pin 140 will not be exceeded, preventing the excessive output chip 170 of the driver chip from being excessively penetrated into the fan-out area 130.
  • the height difference between the fan-out area 130 and the terminal pin 140 causes the output of the driver chip
  • the pin 170 is lifted during binding, and the output pin 170 of the lifted driver chip is easily broken during the transportation of the display screen 110, and may also be affected by poor contact due to loosening of external force.
  • the terminal pin 140 is at most twice as long as the overlap length to avoid taking too much space, or the terminal pin 140 is less than or equal to the length of the driver chip output pin 170; generally, the driver chip output pin 170 (the area to be bound after the wiring has been closed)
  • the output pin 170 of the driver chip is generally longer than the terminal pin 140 of the display screen 110, if the terminal pin 140 is If the output pin 170 of the driver chip is still long, and the depth of the output pin 170 of the driver chip exceeds the length of the output pin 170 of the driver chip, the binding between the driver chip 200 and the terminal pin 140
  • the connection structure (such as the outer fan-out area 130 of the wiring from the driver chip 200 is condensed), and the connection structure is generally thicker than the terminal pin 140, and the bonding will most likely cause defective products. Therefore, the terminal pin 140 The maximum depth can take the length of the output pin 170 of the driving chip as the reference maximum length.
  • the depth of the terminal pin 140 is greater than the specification binding length plus the error threshold.
  • the binding length of the specification refers to the overlapping length of the terminal pin 140 and the output pin 170 of the driver chip when the binding step is error-free;
  • the error threshold refers to the general binding process , The maximum allowable error range, if it exceeds the error range, it may affect the quality, etc .; in this solution, the terminal pin 140 is longer than the specification binding length plus the error threshold, so as to ensure that the driver chip output pin 170 is When the binding error occurs, the range of the terminal pin 140 will not be exceeded, and to avoid an error, the driver chip output pin 170 is excessively deep and the length of the depth exceeds the error range, the longer length of the terminal pin 140 can also improve a flat supporting platform to improve the situation where the bonding effect is poor due to the height difference during bonding; to prevent the driving chip output pin 170 from being incorrectly bound and excessively deep into the fan-out area 130, due to the fan The height difference between the output area 130 and the terminal pin 140 causes the output pin 170 of the driver chip to be raised during binding.
  • the error threshold is less than 500 microns and greater than zero.
  • the error threshold is controlled within 500 microns, which is greater than 0.
  • the error when the output pin 170 of the driver chip is bound is about 500 microns. If the error threshold is exceeded, the binding yield is extremely low, which is prone to unsuccessful binding Or, driving the output pin 170 of the driving chip excessively deep into the internal direction of the display panel 100 will also reduce the effective contact area of the driving chip output pin 170 and the terminal pin 140, which affects the stability of signal transmission. There is a height difference between the 140 and the fan-out area 130, so that the portion of the driver chip output pin 170 that exceeds the terminal pin 140 is raised during binding.
  • the raised driver chip output pin 170 is easy to lift If it breaks, it may also be affected by the looseness of the external force, which leads to poor contact. In this solution, the error threshold will not be too large to avoid taking up too much space.
  • the display 110 is designed Terminal pin 140, so that even if the operation is wrong, the depth of the output pin 170 of the driver chip is deeper than the error range, and the terminal pin 140 can have a good flatness to complete the binding because of the sufficient length of the terminal pin 140. Operation effectively improves the product yield.
  • the terminal pin 140 includes a pin region 147 disposed on a side close to the output pin 170 of the driving chip, and a side region disposed on the pin region 147 far from the output pin 170 of the driving chip
  • the raised portion 148 of the pin; the upper surface of the pin area 147 is provided with a conductive layer, and the upper surface of the raised portion 148 is not provided with a conductive layer.
  • the terminal pin 140 includes two regions, a part of which is a pin area 147 on the side close to the output pin 170 of the driver chip.
  • the pin area 147 is expected to be bound to the output pin 170 of the driver chip.
  • the other part is the pad portion 148 on the side of the pin area 147 away from the output pin 170 of the driver chip.
  • the pad portion 148 is the product of the fan-out area 130 and is not used as the output of the driver chip.
  • the setting makes the height of the pin area 147 and the height of the pad portion 148 equal, so even if an operation error occurs and the output pin 170 of the driver chip is excessively deep
  • the height difference 148 avoids the height difference and improves a relatively flat binding support to ensure that the output pin 170 of the driver chip will not warp during binding, Therefore, during the transportation of the display screen 110, the output pin 170 of the tilted driver chip is easily broken, and it may also be affected by poor contact due to looseness of external force peeling off.
  • the increased portion can also be changed in the layer structure so that the increased height is the same as the height of the terminal pin, and does not affect signal transmission.
  • the terminal pin 140 includes substrates formed in sequence , A first metal layer 142, a first insulating layer 143, a second metal layer 144, a second insulating layer 145; the conductive layer includes a transparent conductive layer 146 formed on the upper surface of the second insulating layer 145; the transparent The conductive layer 146 is respectively connected to one or two layers of the first metal layer 142 and the second metal layer 144 through via holes; the raised portion 148 includes a substrate, a first metal layer 142, and a first insulating layer formed in this order 143 and the second insulating layer 145; the height of the pad portion 148 is equivalent to the terminal pin 140; the height of the pad portion 148 is higher than the height of the fan-out area 130.
  • the layer structure of the same pad portion 148 is different from that of the pin area 147.
  • the upper surface of the pad portion 148 is not provided with a conductive layer for signal connection after binding;
  • the layer structure of the pad portion 148 may include the first metal layer 142, the first insulating layer 143, and the second insulating layer 145 formed in the same layer as the lead region 147, or may include the first metal layer 142, the first insulation
  • the structure of the layer 143, the second metal layer 144, and the second insulating layer 145, as long as the surface of the pad portion 148 is not provided with a conductive layer, and the final height formed is equivalent to the pin area 147, and can pass through the metal layer therein It only needs to be connected to the corresponding signal line in the plane; the pad portion 148 and the fan-out area 130 are conductive, which ensures the normal transmission of data, and at the same time can reduce the lifting of the output pin 170 of the driver chip, etc.
  • the pad height portion 148 is formed by the same process as the fan-out area 130, but one or more of each layer structure is thicker than the fan-out area 130, so as to reach the pad height to the height of the terminal pin 140 Structure; the first metal layer 142 is generally used as a scanning line in the connection plane. Of course, it can also be connected to a common electrode line or a data line. Specifically, it can be connected through cross-layers such as via holes as needed.
  • a display panel 100 including: a display screen 110; a connection terminal 120 provided at an edge of the display screen 110; an automatic bonding tape 160 , A drive chip is provided, connected to the connection terminal 120; a drive chip output pin 170 is provided on the side of the drive chip module 150 close to the connection terminal 120; a terminal pin 140 is provided on the connection At the terminal 120, it is bound and connected to the output pin of the driving chip; the fan-out area 130 is provided on the side of the terminal pin 140 away from the edge of the display screen 110; the terminal pin 140 includes sequentially formed A substrate, a first metal layer 142, a first insulating layer 143, a second metal layer 144, a second insulating layer 145; a conductive layer is provided on the upper surface of the terminal pin 140; the conductive layer includes The transparent conductive layer 146 on the upper surface of the two insulating layers 145; the transparent conductive layer 146 is respectively connected to the first metal
  • the depth of the terminal pin 140 is greater than the total length of the specification binding length and the error threshold.
  • the error threshold is greater than 0 and less than 500 microns.
  • a processing device for processing the display panel 100 as described above including: a pressing head 200, pressing the terminal pins 140 and driving Chip output pin 170; the length of the indenter 200 is equivalent to the terminal pin 140.
  • the indenter 200 when the terminal pin 140 is bound to the driver chip output pin 170, the indenter 200 needs to be pressed together.
  • the length of the indenter 200 is also extended accordingly.
  • the length of the indenter 200 is equal to the length of the terminal pin 140, so as to prevent the indenter 200 from being changed when the output pin 170 of the driving chip goes deep into the display screen 110, and also to cause the output pin 170 of the driving chip to warp Therefore, the length of the indenter 200 is equal to the length of the terminal pin 140, which can not only prevent the output pin 170 of the driver chip that is tilted from being easily broken, but also avoid the influence of poor contact caused by the looseness of the external force peeling outward.
  • TFT-LCD Thin Film Transistor-Liquid Crystal
  • OLED Organic Light-Emitting Diode

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Abstract

一种显示面板（100）及其加工设备，显示面板（100）包括：显示屏（110）和设置在显示屏（110）边沿的连接端子（120）；与连接端子（120）连接的驱动芯片模组（150）；设置在驱动芯片模组（150）靠近连接端子（120）的一侧的驱动芯片输出引脚（170）；与驱动芯片输出引脚（170）绑定连接的端子引脚（140）；设置在端子引脚（140）远离显示屏（110）边沿的一侧的扇出区（130）；端子引脚（140）的深入长度大于驱动芯片输出引脚（170）与端子引脚（140）重叠区域的长度；端子引脚（140）的高度比扇出区（130）的高度高。

Description

显示面板及其加工设备
本申请要求于2018年11月12日提交中国专利局，申请号为CN201821857717.8，发明名称为“一种显示面板及其加工设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及显示技术领域，尤其涉及一种显示面板及其加工设备。
背景技术
这里的陈述仅提供与本申请有关的背景信息，而不必然地构成现有技术。
随着科技的发展和进步，平板显示器由于具备机身薄、省电和辐射低等热点而成为显示器的主流产品，得到了广泛应用。薄膜晶体管液晶显示器(Thin Film Transistor-Liquid Crystal Display，TFT-LCD)一般包括四大项：阵列工艺、彩膜工艺、成盒工艺、模组工艺。模组工艺也叫组装工程，是在显示屏上压接驱动电路，安装背光源等部件的过程。在模组工艺中，依次经过偏光片贴附工艺、驱动芯片的带载自动绑定工艺(Tape Auto-bonding，TAB)、印制电路板(Printed Circuit board，PCB)绑定工艺、驱动电路的回路调整以及背光源的搭配。
在进行驱动芯片的带载自动绑定工艺(Tape Auto-bonding，TAB)步骤时，显示屏端子引脚与驱动芯片输出引脚进行绑定，可能出现驱动芯片输出引脚向显示面板内部过度深入的情况，从而会使驱动芯片输出引脚深入显示面板内部的部分翘起的情况。
技术解决方案
本申请提供一种防止驱动芯片输出引脚深入显示面板内部的部分翘起的一种显示面板及其加工设备。
为实现上述目的，本申请提供了一种显示面板，包括：显示屏和设置在所述显示屏边沿的连接端子；设置有驱动芯片，与所述连接端子连接的驱动芯片模组；设置在所述驱动芯片模组靠近所述连接端子的一侧的驱动芯片输出引脚；设置在所述连接端子处，与所述驱动芯片输出引脚绑定连接的端子引脚；设置在所述端子引脚远离所述显示屏边沿的一侧的扇出区；所述端子引脚的深入长度大于所述驱动芯片输出引脚与端子引脚重叠区域的长度；所述端子引脚的高度比所述扇出区的高度高。
可选的，所述驱动芯片模组为自动键合带、带载封装和膜上芯片中的一种；所述端子引脚的上表面设置有导电层，所述导电层与自动键合带或带载封装或膜上芯片上的驱动芯片输 出引脚绑定连接。
可选的，所述导电层包括金属线层膜结构。
可选的，所述端子引脚包括依次形成的基板、第一金属层、第一绝缘层、第二金属层、第二绝缘层；所述导电层包括形成在所述第二绝缘层上表面的透明导电层；所述透明导电层通过过孔连接于第一金属层和第二金属层。
可选的，所述端子引脚包括依次形成的基板、第一金属层、第一绝缘层、第二金属层、第二绝缘层；所述导电层包括形成在所述第二绝缘层上表面的透明导电层；所述透明导电层通过过孔连接于第一金属层。
可选的，所述端子引脚包括依次形成的基板、第一金属层、第一绝缘层、第二金属层、第二绝缘层；所述导电层包括形成在所述第二绝缘层上表面的透明导电层；所述透明导电层通过过孔连接于第二金属层。
可选的，所述端子引脚的深入长度至少比所述驱动芯片输出引脚的重叠长度长五分之一。
可选的，所述端子引脚比所述驱动芯片输出引脚的重叠长度最多长一倍。
可选的，所述端子引脚小于等于所述驱动芯片输出引脚的长度。
可选的，所述端子引脚的深入长度，大于规格绑定长度加上误差阈值。
可选的，所述误差阈值，小于500微米，大于0。
可选的，所述端子引脚包括设置在靠近驱动芯片输出引脚一侧的引脚区，和设置在所述引脚区远离所述驱动芯片输出引脚一侧的垫高部；所述引脚区的上表面设置有导电层，所述垫高部的上表面未设置有导电层。
可选的，所述端子引脚包括依次形成的基板、第一金属层、第一绝缘层、第二金属层、第二绝缘层；所述导电层包括形成在所述第二绝缘层上表面的透明导电层；所述透明导电层通过过孔分别连接于第一金属层和第二金属层中的一层或两层；所述垫高部包括依次形成的基板、第一金属层、第一绝缘层和第二绝缘层；所述垫高部的高度与所述端子引脚相当；所述垫高部的高度比所述扇出区的高度高。
可选的，所述第一金属层连接所述显示面板内的扫描线。
可选的，所述第一金属层连接所述显示面板内的公共电极线。
可选的，所述第一金属层连接所述显示面板内的数据线。
本申请还公开了一种显示面板，包括：显示屏和设置在所述显示屏边沿的连接端子；设置有驱动芯片，与所述连接端子连接的驱动芯片模组；设置在所述驱动芯片模组靠近所述连接端子的一侧的驱动芯片输出引脚；设置在所述连接端子处，与所述驱动芯片输出引脚绑定连接的端子引脚；设置在所述端子引脚远离所述显示屏边沿的一侧的扇出区；所述端子引脚 包括依次形成的基板、第一金属层、第一绝缘层、第二金属层、第二绝缘层；所述端子引脚的上表面设置有导电层；所述导电层包括形成在所述第二绝缘层上表面的透明导电层；所述透明导电层通过过孔分别连接于第一金属层和第二金属层。中的一层或两层；所述端子引脚的深入长度，大于驱动芯片输出引脚的长度加上误差阈值；所述误差阈值，小于500微米，大于0。
本申请还公开了一种加工如上所述的显示面板的加工设备，包括：压合所述端子引脚和驱动芯片输出引脚的压头；所述压头的长度与所述端子引脚相当。
相对于，驱动芯片输出引脚与端子引脚绑定时，可能出现驱动芯片输出引脚向显示面板内部过度深入的情况，具体的表现为驱动芯片输出引脚远离显示屏边沿的一侧超出端子引脚远离显示屏边沿的一侧，由于重叠区域为端子引脚与扇出区的接触部，一般该扇出区的高度低于该端子引脚的高度，两者形成的高度差，将使得绑定时容易出现驱动芯片输出引脚翘起(上翘下翘都有可能)，造成驱动芯片输出引脚内的走线断裂或者是越界的驱动芯片输出引脚翘起损坏显示屏处走线或其他结构的情况；而，本申请端子引脚与驱动芯片输出引脚重叠部分的长度小于显示屏的端子引脚，并且端子引脚的高度高于扇出区的高度，由于该端子引脚做了延长设置，使得该端子引脚比预设的长度要长，使得正常情况下，该端子引脚可以比重叠区域的长度长，而即使出现操作失误、没有对齐而致使驱动芯片输出引脚过度深入的情况，也可以由延长出来的部分对驱动芯片输出引脚进行支撑，使得压头在压合绑定时，支撑面平整，减少甚至避免绑定时，驱动芯片输出引脚翘起的情况发生，避免翘起的驱动芯片输出引脚易折断，还可能受到外力有向外剥离的松动导致接触性不良等影响，提高良率。
附图说明
所包括的附图用来提供对本申请实施例的进一步的理解，其构成了说明书的一部分，用于例示本申请的实施方式，并与文字描述一起来阐释本申请的原理。显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。在附图中：
图1是本申请实施例一种显示面板的示意图；
图2是本申请实施例一种显示面板正常绑定的示意图；
图3是本申请实施例一种显示面板绑定后驱动芯片输出引脚翘起的示意图；
图4是本申请实施例一种显示面屏端子引脚延长区域的示意图；
图5是本申请实施例一种显示屏的引脚区的示意图；
图6是本申请实施例一种显示屏端子引脚的完整示意图；
图7是本申请实施例一种显示屏端子引脚与驱动芯片输出引脚示意图；
图8是本申请实施例一种显示屏端子引脚各层结构形成示意图；
图9是本申请实施例另一种显示面屏端子引脚延长区域的示意图；
图10是本申请实施例另一种显示屏端子引脚的完整示意图。
具体实施方式
这里所公开的具体结构和功能细节仅仅是代表性的，并且是用于描述本申请的示例性实施例的目的。但是本申请可以通过许多替换形式来具体实现，并且不应当被解释成仅仅受限于这里所阐述的实施例。
在本申请的描述中，需要理解的是，术语“中心”、“横向”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，除非另有说明，“多个”的含义是两个或两个以上。另外，术语“包括”及其任何变形，意图在于覆盖不排他的包含。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义。
这里所使用的术语仅仅是为了描述具体实施例而不意图限制示例性实施例。除非上下文明确地另有所指，否则这里所使用的单数形式“一个”、“一项”还意图包括复数。还应当理解的是，这里所使用的术语“包括”和/或“包含”规定所陈述的特征、整数、步骤、操作、单元和/或组件的存在，而不排除存在或添加一个或更多其他特征、整数、步骤、操作、单元、组件和/或其组合。
下面参考附图和较佳的实施例对本申请作进一步说明。
如图1至图10所示，本申请实施例公布了一种显示面板100，包括：显示屏100；设置在所述显示屏110边沿的连接端子120；与所述连接端子120连接的驱动芯片模组150，且设置有驱动芯片；驱动芯片输出引脚170，设置在所述驱动芯片模组150靠近所述连接端子120的一侧；扇出区130，设置在所述端子引脚140远离所述显示屏110边缘的一侧；所述端子引脚140的深入长度大于所述驱动芯片输出引脚170与端子引脚140重叠区域的长度； 所述端子引脚140的高度比所述扇出区130的高度高。
本方案中，当驱动芯片输出引脚170与端子引脚140绑定时，可能出现驱动芯片输出引脚170向显示面板100内部过度深入的情况，具体的表现为驱动芯片输出引脚170远离显示屏110边缘的一侧超出端子引脚140远离显示屏110边缘的一侧，由于该处为端子引脚140与扇出区130的接触部，一般该扇出区130的高度低于该端子引脚140的高度，两者形成的高度差，将使得绑定时容易出现驱动芯片输出引脚170翘起(上翘下翘都有可能)，造成驱动芯片输出引脚170内的走线断裂或者是越界的驱动芯片输出引脚170翘起损坏显示屏110处走线或其他结构的情况；而，本申请端子引脚140与驱动芯片输出引脚170重叠部分的长度小于显示屏110的端子引脚140，并且端子引脚140的高度高于扇出区130的高度，由于该端子引脚140做了延长设置，使得该端子引脚140比预设的长度要长，使得正常情况下，该端子引脚140可以比重叠区域的长度长，而即使出现操作失误、没有对齐而致使驱动芯片输出引脚170过度深入的情况，也可以由延长出来的部分对驱动芯片输出引脚170进行支撑，使得压头200在压合绑定时，支撑面平整，减少甚至避免绑定时，驱动芯片输出引脚170翘起的情况发生，避免翘起的驱动芯片输出引脚170易折断，还可能受到外力有向外剥离的松动导致接触性不良等影响，提高良率。
在一实施例中，所述驱动芯片模组150为自动键合带160、带载封装和膜上芯片中的一种；所述端子引脚140的上表面设置有导电层，所述导电层与自动键合带160或带载封装或膜上芯片上的驱动芯片输出引脚绑定连接。
本方案的驱动芯片模组150可以为自动键合带160、带载封装和膜上芯片三种中的任意一种，在端子引脚140的上表面均设置一层导电层，即该端子引脚140进行延长设计前和进行延长设计增加的部分，都可以信号的传输，或者可以认为该端子引脚140包括引脚区147和延长部，该延长部和引脚区147通过同一道光罩制程，具有同样的功能；由于该引脚区147的范围通过该延长部进行了延长，因而，在绑定之后作为传输媒介之用的导电层也变长了，如此，当在驱动芯片输出引脚170绑定过度深入的情况时，该驱动芯片输出引脚170与端子引脚140的有效接触面积(导电面积)不仅不会减小，反而可能得到增大，有效的提高了外部讯号传输到显示面板100的稳定性；其中，该导电层可以是透明导电层146等将引脚区147内的信号线(可以包括栅线、数据线和公共电极线等)导通至端子引脚140上表面的层膜结构，也可以是裸露的金属线层膜结构，适用即可。
在一实施例中，所述端子引脚140包括依次形成的基板、第一金属层142、第一绝缘层143、第二金属层144、第二绝缘层145；所述导电层包括形成在所述第二绝缘层145上表面的透明导电层146；所述透明导电层146通过过孔分别连接于第一金属层142和第二金属层144中的一层或两层。
本方案中，透明导电层146连接第一金属层142和第二金属层144中的一层或两层，根据不同的线，透明导电层146也连接不同的金属层，然后与驱动芯片输出引脚170绑定，接收驱动芯片200传来相应的讯号，同时端子引脚140的延长设置，使得即使该驱动芯片输出引脚170在较正常情况下深入时，也能保证接触面积不会减少甚至增大，保证连接的稳定性。
其中，该显示屏110的端子引脚140可以是对应公共电极线的端子引脚140，可以是对应栅线的端子引脚140，也可以是对应数据线的端子引脚140，或者其他信号线的端子引脚140；当该端子引脚140对应公共电极线时，该透明导电层146可以根据具体情况，连接于该第一金属层142的一层或者两层，然后再通过扇出区130连接或者过孔连接到公共电机线。当该端子引脚140对应栅线时，一般盖透明导电层146导通于该第一金属层142，该第二金属层144可以设置也可以不设置，该透明导电层146可以和第二金属层144接触也可以不接触(例如，该第二金属层144于面内不导通，那么即便过孔的时候有接触，也无妨)，但不管是哪种，该透明导电层146将最终只联通于栅线；当该端子引脚140对应数据线时，同理，该透明导电层146可以连接于该第一金属层142和第二金属层144的一个或两个，但是在面内，只导通于对应的数据线。
在一实施例中，所述端子引脚140的深入长度至少比所述驱动芯片输出引脚170的重叠长度长五分之一。
由于驱动芯片输出引脚170在绑定时可能出现过度深入，而致使压合时驱动芯片输出引脚170容易出现翘起和折断等情况；本方案中，该显示屏110的端子引脚140要比该驱动芯片输出引脚170预定的重叠长度要长，具体的，该端子引脚140比驱动芯片输出引脚170增加至少五分之一的长度，才能保证驱动芯片输出引脚170绑定出现过度深入情况时，不会超出端子引脚140的范围，防止超出的驱动芯片输出引脚170过度深入到扇出区130，由于扇出区130与端子引脚140的高度差，导致驱动芯片输出引脚170在绑定时翘起，显示屏110搬运过程中，翘起的驱动芯片输出引脚170易折断，还可能受到外力有向外剥离的松动导致接触性不良的影响。
另外，该端子引脚140比重叠长度最多长一倍，避免太长占用过多空间，或者该端子引脚140小于等于该驱动芯片输出引脚170的长度；一般的，该驱动芯片输出引脚170(走线已经收束之后，绑定的区域)为了避免影响到绑定步骤，该驱动芯片输出引脚170一般比该显示屏110的端子引脚140要长，若是该端子引脚140比该驱动芯片输出引脚170还长，且该驱动芯片输出引脚170深入的距离超出了驱动芯片输出引脚170自身的长度的话，由于绑定到了该驱动芯片200和端子引脚140之间的连接结构(例如收束驱动芯片200过来的走线的外部扇出区130等)，且连接结构一般比端子引脚140厚，绑定将大可能造成不良品，因而，该端子引脚140的最大深入长度可以以驱动芯片输出引脚170的长度作为参考的最大长 度。
在一实施例中，所述端子引脚140的深入长度，大于规格绑定长度加上误差阈值。
本方案中，该规格绑定长度指的是绑定步骤无误差的情况下，该端子引脚140和驱动芯片输出引脚170的重叠长度；该误差阈值指的是在一般的绑定制程中，所允许的最大误差范围，若超出误差范围则可能影响品质等；本方案中，该端子引脚140要比规格绑定长度加上误差阈值要长，这样才能保证驱动芯片输出引脚170在绑定出现误差时不会超出端子引脚140的范围的情况，而且，避免是出现错误，该驱动芯片输出引脚170过度深入且深入的长度超出误差范围时，该长度较长的端子引脚140也可以提高一个平整的支撑平台，改善在绑定时，由于高度差致使绑定效果不佳的情况；防止出现驱动芯片输出引脚170绑定错误而过度深入到扇出区130，由于扇出区130与端子引脚140的高度差，导致驱动芯片输出引脚170在绑定时翘起，显示屏110搬运过程中，翘起的驱动芯片输出引脚170易折断，还可能受到外力有向外剥离的松动导致接触性不良的影响。
在一实施例中，所述误差阈值，小于500微米，大于0。
本方案中，误差阈值控制在500微米以内，大于0，一般驱动芯片输出引脚170绑定时的误差在500微米左右，若超出误差阈值则绑定良率极低，容易出现绑定不成功或者，驱动芯片输出引脚170过度深入到显示面板100的内部方向，也会减小驱动芯片输出引脚170与端子引脚140的有效接触面积，影响讯号传输的稳定性，同时由于端子引脚140与扇出区130之间存在高度差，使驱动芯片输出引脚170超出端子引脚140的部分在绑定时翘起，显示屏110搬运过程中，翘起的驱动芯片输出引脚170易折断，还可能受到外力有向外剥离的松动导致接触性不良的影响；本方案中，该误差阈值不会太大，避免占用空间太多，并以该误差阈值为参考，设计该显示屏110的端子引脚140，使得即便操作错误，出现该驱动芯片输出引脚170深入长度超出误差范围的情况，也可以因为该端子引脚140长度足够的缘故而得到较好的平整度以完成绑定操作，有效的提高了产品良率。
在一实施例中，所述端子引脚140包括设置在靠近驱动芯片输出引脚170一侧的引脚区147，和设置在所述引脚区147远离所述驱动芯片输出引脚170一侧的垫高部148；所述引脚区147的上表面设置有导电层，所述垫高部148的上表面未设置有导电层。
本方案中，端子引脚140包括两个区域，一部分为靠近驱动芯片输出引脚170一侧的引脚区147，该引脚区147便是预计和驱动芯片输出引脚170进行绑定连接的区域；而另一部分则是设置在引脚区147远离驱动芯片输出引脚170一侧的垫高部148，该垫高部148是扇出区130垫高的产物，并不作为跟驱动芯片输出引脚170进行绑定之后信号连接的作用；设置使得该引脚区147的高度和垫高部148的高度相当，如此，即便在出现操作错误而使得该驱动芯片输出引脚170过度深入情况下，只要不是错误太大，由于该垫高部148而避免了高 度差的情况，提高了较为平整的绑定支撑，保证绑定时，该驱动芯片输出引脚170不会出现翘起等情况，从而避免在显示屏110搬运过程中，翘起的驱动芯片输出引脚170易折断，还可能受到外力有向外剥离的松动导致接触性不良的影响的情况。
在一实施例中，还可以将增加的部位改变层膜结构，使增加的高度与端子引脚高度相同，且不影响信号的传输即可，既，所述端子引脚140包括依次形成的基板、第一金属层142、第一绝缘层143、第二金属层144、第二绝缘层145；所述导电层包括形成在所述第二绝缘层145上表面的透明导电层146；所述透明导电层146通过过孔分别连接于第一金属层142和第二金属层144中的一层或两层；所述垫高部148包括依次形成的基板、第一金属层142、第一绝缘层143和第二绝缘层145；所述垫高部148的高度与所述端子引脚140相当；所述垫高部148的高度比所述扇出区130的高度高。
本方案中，相同垫高部148的层膜结构与引脚区147的层膜结构不同，特别是，该垫高部148的上表面不设置有绑定之后信号连接之用的导电层；在垫高部148的层膜结构中可以包括跟引脚区147同层形成的第一金属层142、第一绝缘层143和第二绝缘层145，也可以包括第一金属层142、第一绝缘层143、第二金属层144和第二绝缘层145的结构，只要垫高部148的表面不设置有导电层，且形成的最终高度与该引脚区147相当，且可以通过其中的金属层连接于面内对应的信号线即可；该垫高部148与该扇出区130是导通的，保证了数据的正常传输，同时可以减少驱动芯片输出引脚170翘起等情况，一举两得。
其中，这里的垫高部148是跟扇出区130通过同样制程形成的，但是其中各层结构中的一个或者多个设置比扇出区130厚，从而达到垫高至端子引脚140高度的结构；该第一金属层142一般作为连接面内的扫描线，当然，也可以连接公共电极线或数据线，具体可以根据需要通过过孔等跨层连接。
作为本申请的另一实施例，参考图1至图8所示，公开了一种显示面板100，包括：显示屏110；连接端子120，设置在所述显示屏110边沿；自动键合带160，设置有驱动芯片，与所述连接端子120连接；驱动芯片输出引脚170，设置在所述驱动芯片模组150靠近所述连接端子120的一侧；端子引脚140，设置在所述连接端子120处，与所述驱动芯片输出引脚绑定连接；扇出区130，设置在所述端子引脚140远离所述显示屏110边缘的一侧；所述端子引脚140包括依次形成的基板、第一金属层142、第一绝缘层143、第二金属层144、第二绝缘层145；所述端子引脚140的上表面设置有导电层；所述导电层包括形成在所述第二绝缘层145上表面的透明导电层146；所述透明导电层146通过过孔分别连接于第一金属层142和第二金属层144。中的一层或两层；所述端子引脚140的深入长度，大于驱动芯片输出引脚170的长度加上误差阈值；所述误差阈值，小于500微米，大于0。
本方案中，端子引脚140的深入长度大于规格绑定长度与误差阈值的总长度，误差阈值 大于0，小于500微米，在驱动芯片输出引脚170与端子引脚140进行绑定时，若驱动芯片输出引脚170深入显示屏110的内部方向，那么端子引脚140比驱动芯片输出引脚170长的部分，可以防止驱动芯片输出引脚170深入到扇出区130，在绑定时驱动芯片输出引脚170深入的部分翘起当显示屏110搬运过程中，翘起的驱动芯片输出引脚170易折断，还可能受到外力有向外剥离的松动导致接触性不良的影响。
作为本申请的另一实施例，参考图1至图10所示，公开了一种加工如上所述的显示面板100的加工设备，包括：压头200，压合所述端子引脚140和驱动芯片输出引脚170；所述压头200的长度与所述端子引脚140相当。
本方案中，端子引脚140与驱动芯片输出引脚170绑定时，需要用压头200进行压合，当端子引脚140的深入长度进行延长时压头200的长度也相应的进行延长，使压头200的长度与端子引脚140的长度相当，从而防止在驱动芯片输出引脚170向显示屏110的内部深入时，压头200不做变化，还会使驱动芯片输出引脚170翘起，因此使压头200长度与端子引脚140的长度相当，既可以避免翘起的驱动芯片输出引脚170易折断，还可以避免受到外力有向外剥离的松动导致接触性不良的影响。
本申请的技术方案可以广泛应用于薄膜晶体管液晶显示器(Thin Film Transistor-Liquid Crystal Display，TFT-LCD)和机发光二极管(Organic Light-Emitting Diode，OLED)显示器等平板显示器。
以上内容是结合具体的可选实施方式对本申请所作的进一步详细说明，不能认定本申请的具体实施只局限于这些说明。对于本申请所属技术领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干简单推演或替换，都应当视为属于本申请的保护范围。

Claims (18)

  1. 一种显示面板，包括：
    显示屏；
    连接端子，设置在所述显示屏边沿；
    驱动芯片模组，设置有驱动芯片，与所述连接端子连接；
    驱动芯片输出引脚，设置在所述驱动芯片模组靠近所述连接端子的一侧；
    端子引脚，设置在所述连接端子处，与所述驱动芯片输出引脚绑定连接；以及
    扇出区，设置在所述端子引脚远离所述显示屏边沿的一侧；
    所述端子引脚的深入长度大于所述驱动芯片输出引脚与所述端子引脚重叠区域的长度；所述端子引脚的高度比所述扇出区的高度高。
  2. 如权利要求1所述的一种显示面板，其中，所述驱动芯片模组为自动键合带、带载封装和膜上芯片中的一种；
    所述端子引脚的上表面设置有导电层，所述导电层与自动键合带或带载封装或膜上芯片上的驱动芯片输出引脚绑定连接。
  3. 如权利要求2所述的一种显示面板，其中，所述导电层包括金属线层膜结构。
  4. 如权利要求2所述的一种显示面板，其中，所述端子引脚包括依次形成的基板、第一金属层、第一绝缘层、第二金属层、第二绝缘层；
    所述导电层包括形成在所述第二绝缘层上表面的透明导电层；
    所述透明导电层通过过孔连接于第一金属层和第二金属层。
  5. 如权利要求2所述的一种显示面板，其中，所述端子引脚包括依次形成的基板、第一金属层、第一绝缘层、第二金属层、第二绝缘层；
    所述导电层包括形成在所述第二绝缘层上表面的透明导电层；
    所述透明导电层通过过孔连接于第一金属层。
  6. 如权利要求2所述的一种显示面板，其中，所述端子引脚包括依次形成的基板、第一金属层、第一绝缘层、第二金属层、第二绝缘层；
    所述导电层包括形成在所述第二绝缘层上表面的透明导电层；
    所述透明导电层通过过孔连接于第二金属层。
  7. 如权利要求2所述的一种显示面板，其中，所述端子引脚的深入长度至少比所述驱动芯片输出引脚的重叠长度长五分之一。
  8. 如权利要求2所述的一种显示面板，其中，所述端子引脚比所述驱动芯片输出引脚的重叠长度最多长一倍。
  9. 如权利要求2所述的一种显示面板，其中，所述端子引脚小于等于所述驱动芯片输 出引脚的长度。
  10. 如权利要求2所述的一种显示面板，其中，所述端子引脚的深入长度，大于规格绑定长度加上误差阈值。
  11. 如权利要求10所述的一种显示面板，其中，所述误差阈值，小于500微米，大于0。
  12. 如权利要求2所述的一种显示面板，其中，所述端子引脚包括设置在靠近驱动芯片输出引脚一侧的引脚区，和设置在所述引脚区远离所述驱动芯片输出引脚一侧的垫高部；
    所述引脚区的上表面设置有导电层，所述垫高部的上表面未设置有导电层。
  13. 如权利要求12所述的一种显示面板，其中，所述端子引脚包括依次形成的基板、第一金属层、第一绝缘层、第二金属层、第二绝缘层；
    所述导电层包括形成在所述第二绝缘层上表面的透明导电层；所述透明导电层通过过孔分别连接于第一金属层和第二金属层中的一层或两层；
    所述垫高部包括依次形成的基板、第一金属层、第一绝缘层和第二绝缘层；
    所述垫高部的高度与所述端子引脚相当；所述垫高部的高度比所述扇出区的高度高。
  14. 如权利要求13所述的一种显示面板，其中，所述第一金属层连接所述显示面板内的扫描线。
  15. 如权利要求13所述的一种显示面板，其中，所述第一金属层连接所述显示面板内的公共电极线。
  16. 如权利要求13所述的一种显示面板，其中，所述第一金属层连接所述显示面板内的数据线。
  17. 一种显示面板，包括：
    显示屏；
    连接端子，设置在所述显示屏边沿；
    自动键合带，设置有驱动芯片，与所述连接端子连接；
    驱动芯片输出引脚，设置在所述驱动芯片模组靠近所述连接端子的一侧；
    端子引脚，设置在所述连接端子处，与所述驱动芯片输出引脚绑定连接；以及
    扇出区，设置在所述端子引脚远离所述显示屏边沿的一侧；
    所述端子引脚包括依次形成的基板、第一金属层、第一绝缘层、第二金属层、第二绝缘层；
    所述端子引脚的上表面设置有导电层，所述导电层与所述自动键合带上的驱动芯片输出引脚绑定连接；
    所述导电层包括形成在所述第二绝缘层上表面的透明导电层；
    所述透明导电层通过过孔分别连接于第一金属层和第二金属层。中的一层或两层；
    所述端子引脚的深入长度，大于驱动芯片输出引脚的长度加上误差阈值；
    所述误差阈值，小于500微米，大于0。
  18. 一种加工所述显示面板的加工设备，包括：
    压头，压合所述端子引脚和驱动芯片输出引脚；
    所述压头的长度与所述端子引脚相当。
PCT/CN2018/119456 2018-11-12 2018-12-06 显示面板及其加工设备 Ceased WO2020098019A1 (zh)

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CN110928079B (zh) * 2019-12-18 2022-10-11 京东方科技集团股份有限公司 显示面板的制备方法、显示面板及显示装置
CN111090201B (zh) 2020-03-22 2020-06-23 深圳市华星光电半导体显示技术有限公司 显示面板及电子装置

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