WO2020098006A1 - 覆晶薄膜冲切装置及显示装置组装系统 - Google Patents

覆晶薄膜冲切装置及显示装置组装系统 Download PDF

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Publication number
WO2020098006A1
WO2020098006A1 PCT/CN2018/118659 CN2018118659W WO2020098006A1 WO 2020098006 A1 WO2020098006 A1 WO 2020098006A1 CN 2018118659 W CN2018118659 W CN 2018118659W WO 2020098006 A1 WO2020098006 A1 WO 2020098006A1
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WO
WIPO (PCT)
Prior art keywords
chip
film
die
flip
cutting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/118659
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English (en)
French (fr)
Inventor
王亮
张光辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HKC Co Ltd
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HKC Co Ltd
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Filing date
Publication date
Application filed by HKC Co Ltd filed Critical HKC Co Ltd
Priority to US17/041,561 priority Critical patent/US20210129367A1/en
Publication of WO2020098006A1 publication Critical patent/WO2020098006A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/20—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting with interrelated action between the cutting member and work feed
    • B26D5/30—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting with interrelated action between the cutting member and work feed having the cutting member controlled by scanning a record carrier
    • B26D5/32—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting with interrelated action between the cutting member and work feed having the cutting member controlled by scanning a record carrier with the record carrier formed by the work itself
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/27—Means for performing other operations combined with cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/44—Cutters therefor; Dies therefor

Definitions

  • the invention relates to the field of display, in particular to a chip-on-film thin-film punching device and a display device assembling system.
  • the flip chip is formed by encapsulating the chip on a flexible circuit board.
  • a roll of flip chip film contains multiple flip chip films.
  • the flip chip film needs to be punched from the tape Cut it down.
  • the display panel in the display device is generally connected to the driving circuit board through a flip-chip film.
  • a die-cut film strip is punched out by a punching device to obtain a single chip flip-chip film and then assembled with the display panel.
  • the chip type of the chip on film will be input into the system for judgment before the tray with the chip tape wrapped around it is set in the die-cutting device.
  • a new flip chip device and display device assembly system are provided.
  • a die-cutting device for flip chip including:
  • the rotating shaft is set as a material tray wrapped with a chip-on-film material tape, the material tray is provided with a marking structure containing model information of the chip-on-film, and the material tray rotates following the rotation axis;
  • Die-cutting structure which is set to pull and die-cut the flip chip material
  • the identification structure is configured to identify the marking structure to identify the model information of the flip chip.
  • the die-cutting structure pulls out the chip-on-film thin film strip during the rotation of the rotation axis and performs punching to obtain a single chip-on-chip thin film. Because there is a marking structure on the material tray, and the marking structure contains the type information of the corresponding flip-chip film, there is also an identification structure in the punching device.
  • the identification structure can automatically identify the marking structure, thereby identifying the punched
  • the type information of the chip-on-film that is cut that is, the die-cutting device can automatically obtain the type information of the chip-on-chip that is die-cut during the die-cutting process of the chip-on-film.
  • the punching device is communicatively connected with the display panel assembling equipment.
  • the display panel assembling equipment can obtain the flip-chip film automatically recognized by the punching device while acquiring the flip-chip film punched by the die-cutting device And compare the model information of the model to determine whether the model of the flip-chip film being assembled is correct. In this application, before the flip chip film tray is installed, the model comparison is performed, and then the tray is installed in the punching device.
  • the marking structure is provided on the front of the tray, and the identification structure is opposite to the front of the tray.
  • the marking structures all fall within the recognition range of the recognition structure.
  • the chip-on-film thin-cutting device further includes a refill door, which faces the front of the tray when the refill door is closed, and the identification structure is provided on the refill door .
  • the marking structure is a label attached to the tray.
  • the label includes a barcode
  • the barcode includes model information of the flip chip
  • the identification structure includes a barcode reader
  • the barcode reader is configured to read the barcode to identify the barcode Describe the model information of flip chip.
  • the label includes a plurality of barcodes
  • one of the plurality of barcodes includes model information of the flip chip
  • the code reader has a screening function
  • the code reader is set to A bar code containing the model information of the flip chip is selected from the plurality of barcodes and the model information of the flip chip is obtained.
  • the marking structure includes a plurality of barcodes with different lengths, one of the plurality of barcodes includes model information of the flip-chip film, and the code reader is configured to filter by comparison length And read the barcode containing the model information of the flip chip, and identify the model information of the flip chip by the read barcode.
  • the plurality of barcodes also includes barcodes of production dates.
  • the length of the barcode containing the model information of the flip-chip film is the longest.
  • the length of the barcode containing the model information of the flip chip is 30 yards.
  • the identification structure is configured to periodically identify the marking structure.
  • the recognition structure is configured to recognize the marking structure when the marking unit is rotated into the recognition range of the recognition structure.
  • the time interval for the identification structure to be identified by the identification structure is the time for the tray to rotate once.
  • the die-cutting structure includes a tiling structure, an alignment structure and a cutting structure
  • the tiling structure is configured to pull out and lay down the chip-on-film thin film strip
  • the aligning structure is configured In order to obtain the cutting position of the flip chip film tape, the cutting structure is configured to cut the flip chip film tape.
  • the cutting structure is a laser lamp, and the cutting structure cuts the flip-chip film strip by laser.
  • the tray is circular.
  • a chip-on-film punching device including:
  • the rotating shaft is set to cover a material tray wrapped with a chip-on-film material tape, the material tray is provided with a marking structure containing model information of the chip-on-film, and the material tray rotates following the rotation axis, the
  • the marking structure includes multiple barcodes with different lengths, and one of the multiple barcodes includes model information of the flip chip;
  • the die-cut structure is set to pull and die-cut the chip-on-film strip
  • the code reader is set to regularly recognize the mark structure and read and read the barcode containing the chip-on-film type information through the comparison length screening, and is set to identify the model information on the flip-chip on the read barcode.
  • the code reader inside the die-cutting device can automatically recognize the barcode of the marking structure during the die-cutting process, thereby identifying the type information of the die-cut chip on the chip.
  • the die-cutting device can be communicatively connected with the display panel assembly equipment. While the display device assembles the chip-on-film and the display panel, it can also obtain the model information of the chip-on-film recognized by the die-cutting device, and compare the identified chip-on-film type with The pre-stored flip-chip film models are compared to determine whether the flip-chip film model being assembled is correct.
  • the display device assembly equipment compares the model and finds that the model is wrong, it can generate an alarm signal to stop the assembly, so it can avoid overwriting The crystal thin film model is wrong, resulting in the scrapping of mass display devices.
  • the length comparison can quickly and accurately select the barcode containing the chip-on-film type information from multiple barcodes, and through the timing recognition mark structure, the power consumption of the reader can be reduced.
  • a display device assembly system including:
  • a die-cutting device for flip chip includes:
  • the rotating shaft is set to cover a material tray wrapped with a chip-on-film material tape, the material tray is provided with a marking structure containing model information of the chip-on-film, and the material tray rotates following the rotation axis;
  • Die-cutting structure which is set to pull and die-cut the flip chip material
  • An identification structure configured to identify the marking structure to identify model information of the flip chip
  • Display device assembly equipment including:
  • An assembly platform configured to assemble a display panel and a flip-chip film, the flip-chip film is a flip-chip film punched out by the die-cutting device;
  • the control structure is in communication with the server and the chip-on-film die-cutting device, and is configured to acquire and compare the chip-on-film type information pre-stored in the server with the chip-on-film type information identified by the die-cutting device It is also set to generate an alarm signal when the pre-stored chip-on-film type information and the identified chip-on-film type information do not match.
  • the chip-on-film die-cutting device is set to die-cut the chip-on-film strip, which provides the chip-on-film for the display device assembly equipment, and at the same time automatically recognizes the chip-on-film on the process of die cutting
  • the model number is sent to the display device assembly equipment.
  • the display device assembly equipment obtains the model information of the flip-chip film identified by the die-cutting device, and on the other hand, the model information of the required flip-chip film pre-stored in the server.
  • the model information is compared, and once the model is wrong, an alarm message is issued to stop the assembly, to avoid the wrong assembly of a large number of display devices.
  • control structure is in communication with the identification structure.
  • FIG. 1 is a schematic structural view of a die-cutting device for a flip chip in an embodiment
  • FIG. 2 is a diagram showing the relative positional relationship between the marking structure and the identification structure in an embodiment
  • FIG. 3 is a schematic structural view of an assembly device of a display device in an embodiment
  • FIG. 4 is a schematic structural diagram of an assembly system of a display device in an embodiment.
  • the chip-on-chip thin-film cutting device includes a rotating shaft 110, a cutting device 120 and an identification structure 130.
  • the rotating shaft 110 is set to cover the material tray 210, on which a chip-on-film thin film strip 220 is wound, and the material tray is provided with a marking structure 230, which includes a structure corresponding to the film-on-chip thin film wound on the material tray Model information;
  • the die-cutting structure 120 is set to pull the flip-chip film strip 220 on the material tray and die-cut the flip-chip film strip to obtain a single chip flip-chip film;
  • the identification structure 130 is set to an identification mark structure 230 to identify flip chip
  • the identifying structure 130 can identify the content of the marking of the marking structure, thereby identifying the model information of the flip chip.
  • the die-cutting structure pulls out the chip-on-film thin-film strip and performs punching during the rotation of the rotation axis to obtain a single chip chip Film sheet.
  • the identification structure inside the punching device can automatically identify the marking structure, thereby identifying the type information of the die-cut chip on the die, that is, the die-cutting device can automatically obtain the punched in the die cutting process The model information of the cut flip chip.
  • the die-cutting device can be communicatively connected with the display device assembly equipment.
  • the display device assembly equipment while assembling the chip-on-film and the display panel, obtains the model information of the chip-on-film recognized by the die-cutting device, and then recognizes the model Compare with the pre-stored flip-chip type to determine whether the flip-chip type being assembled is correct.
  • the model comparison is performed, and then the tray is installed in the punching device.
  • automatic identification and comparison are performed again, because the punching device is in the punching process Identify the type of flip chip and can directly transfer the model information to the display device assembly equipment.
  • the die-cut structure 120 includes a tile structure 121, an alignment structure and a cutting structure 122.
  • the chip-on-film thin film tape is pulled out through the tile structure 121 and then unfolded and laid out. After obtaining the cutting position through the alignment structure
  • the cutting structure 122 performs precise cutting.
  • the cutting structure 122 may be a laser lamp, which cuts the flip-chip film strip by laser.
  • the marking structure 230 is located on the front surface of the tray 210.
  • the tray has a hollow ring shape.
  • the tray includes an outermost curved surface and an innermost curved surface, and a flat connecting two curved surfaces On the surface, the marking structure 230 is located in the flat surface, the surface on which the marking structure 230 is located is defined as the front side A, and the side opposite to the front side is the back side, then the identification structure 130 is located on the side opposite to the front side A, which is convenient for marking Structure 230 is identified.
  • the recognition structure 130 is directly opposite to the marking unit 230, that is, the recognition range of the recognition structure 130 is directly in front of the recognition structure 130, and the marking structure 230 may all fall within the recognition range D of the recognition structure 130.
  • the chip-on-film die-cutting device further includes a refilling door 140.
  • the die-cutting device is provided with a material tray at the refilling door. After the installation of the material tray is completed, the material-changing door 140 is closed.
  • the refill door 140 is facing the front face A of the material tray 210, and the refill door 140 is facing the material tray 210, which is convenient for installing the material tray.
  • the identification structure 130 is located on the refill door 140. Since the refill door 140 is directly opposite to the front face A of the tray, the identification structure 130 is provided on the refill door 140 so that the identification structure 130 and the front face A of the tray Right, it is easy to identify the marking structure 230 on the tray.
  • the marking structure 230 is a label pasted on the tray 210, and the label includes a bar code, the bar code contains the model information of the corresponding flip-chip film, the identification structure 130 is a code reader, and the code reader passes Scan the barcode to identify the model information of flip chip.
  • the marking structure 230 is a label pasted on the tray 210, and the label includes a plurality of barcodes, one of which is a target barcode, the target barcode includes chip-on-film type information, and other barcodes other than the target barcode Can contain other product information, such as production date, etc., the code reader also has a screening function, select the target barcode from multiple barcodes to obtain the chip on film type information.
  • the barcode reader recognizes the target barcode by length comparison, that is, the label contains a plurality of barcodes of different lengths, and one of the barcodes of a specific length contains the model information of the flip-chip film, and sets the barcode reading
  • the reader recognizes the barcode length, the reader scans the label and selects and reads the target barcode by comparing the length of the barcode, and then recognizes the model information of the flip chip by the target barcode.
  • the length of the target barcode in the label is the longest, because when there is a barcode longer than the length of the target barcode, the reader may intercept part of the barcode segments in other barcodes as the target barcode and misrecognize,
  • the length of the target barcode in the label is set to the longest, which can prevent false recognition and improve the recognition accuracy. For example, if the length of the target barcode is 30 codes, the length of the barcode read by the reader is also set It is 30 yards. During the scanning process, the reader will only read the bar code with a length of 30 yards and parse out the chip-on-film type information from the read barcode.
  • the identification structure 130 is configured as a timing identification mark structure 230.
  • the barcode reader scans the label periodically.
  • the material tray keeps rotating, the label rotates with the material tray, and the position of the reader is fixed. Only when the label rotates within the scanning range of the reader, the content on the label is scanned, so , Real-time scanning is not required, only regular scanning is required, which can reduce the power consumption of the reader.
  • the time interval of the identification structure timing identification is the time of one rotation of the tray, that is, the identification structure is identified every time the identification structure rotates within the identification range of the identification structure, which can not only increase the number of identification mark structures, but also Reduce the power consumption of the identification structure.
  • the present application also relates to a die-cutting device for flip chip, which includes a rotating shaft 110, a die-cutting structure 120 and a code reader.
  • the rotating shaft 110 is set as a tray 210 wrapped with a flip chip film tape 220, and the tray 210 is provided with a marking structure 230 containing the type information of the flip chip film, and the tray 210 rotates following the rotating shaft 110
  • the marking structure 230 includes a plurality of barcodes with different lengths, and one of the plurality of barcodes includes the model information of the flip chip;
  • the die cutting structure 120 is configured to pull and die cut the flip chip film tape 220; and the code reader setting
  • the mark structure 230 is identified for timing and the barcode containing the model information of the flip-chip film is read through the comparison length screening, and is set to identify the model information of the flip-chip film by the read barcode.
  • the code reader inside the die-cutting device can automatically recognize the barcode of the marking structure during the die-cutting process, thereby identifying the type information of the die-cut chip on the chip.
  • the display panel assembly equipment can be communicatively connected with the die-cutting device. While the display device is assembling the chip-on-film and the display panel, it can also obtain the model information of the chip-on-film recognized by the die-cutting device, and compare the recognized chip-on-film type with The pre-stored flip chip models are compared to determine whether the flip chip model being assembled is correct.
  • the die-cutting device recognizes the type of flip-chip film during the punching process and can directly transmit the model information to the display device assembly equipment, there is no operation of the staff during the process, so there will be no mistakes for the recognition of the chip-on film, even There is a case of misrecognition before the installation of the tray. Because there is an automatic recognition program during the assembly process, once the display device assembly equipment performs model comparison and finds a model error, it can generate an alarm signal to stop assembly, so it can avoid repeated The crystal thin film model is wrong, resulting in the scrapping of mass display devices. At the same time, the length comparison can quickly and accurately select the barcode containing the chip-on-film type information from multiple barcodes, and through the timing recognition mark structure, the power consumption of the reader can be reduced.
  • the present application also relates to a display device assembly device, as shown in FIG. 3, which includes an assembly platform and a control structure.
  • the assembly platform is used for assembling the display panel and the flip-chip film
  • the flip-chip film is a flip-chip film punched by the die-cutting device of the flip-chip film, wherein the specific structure of the die-cutting device of the flip-chip film has been carried out
  • the control structure is used to communicate with the chip-on-chip thin-film die-cutting device to obtain the chip-on-film thin-film type information recognized by the chip-on-chip thin-film die-cutting device and compare it with the pre-stored chip-on-film type information.
  • the pre-stored chip-on-film type information is the type information of the chip-on-film required for the display panel to be assembled.
  • the control structure is specifically communicated with the identification structure of the die-cutting device to obtain the model information of the flip-chip film identified by the identification structure.
  • the above display device assembly equipment on the one hand, its assembly platform is used to assemble the display panel and the flip-chip film; on the one hand, the device control structure is used to obtain the model information of the flip-chip film that is recognized by the punching device and is stored with the pre-stored The model information of the flip-chip film is compared to determine whether the model of the flip-chip film being assembled is correct. If the model number is wrong, an alarm message will be issued to stop the assembly to avoid erroneous assembly of a large number of display devices.
  • the present application also relates to a display device assembly system, as shown in FIG. 4, which includes a server, a chip-on-film die-cutting device, and display device assembly equipment.
  • the server pre-stores the type information of the flip-chip film matching the display panel to be assembled.
  • the chip-on-chip thin-film die-cutting device is the above chip-on-chip thin-film die-cutting device, and its specific structure has been described in detail above, and will not be repeated here.
  • the display device assembly equipment includes an assembly platform and a control structure.
  • the assembly platform is configured to assemble a display panel and a flip-chip film.
  • the flip-chip film is a flip-chip film punched out by the above-mentioned flip-chip film punching device.
  • the control structure and the server are respectively
  • the chip-on-film die-cutting device is communicatively connected. It is set to acquire and compare the chip-on-film type information pre-stored in the server with the chip-on-film information recognized by the die-cutting device. An alarm signal occurs when the model information of the chip on film does not match.
  • the control structure is specifically communicated with the identification structure of the die-cutting device to obtain the model information of the flip-chip film identified by the identification structure.
  • the chip-on-film die-cutting device is set to die-cut the chip-on-film strip, which provides the chip-on-film for the display device assembly equipment, and at the same time automatically recognizes the chip-on-film on the process of die cutting
  • the model number is to be transmitted to the display device assembly equipment.
  • the display device assembly equipment obtains the model information of the flip-chip film identified by the die-cutting device, and on the other hand, the model information of the required flip-chip film pre-stored in the server.
  • the model information is compared, once the model is wrong, an alarm message is issued to stop the assembly, to avoid large-scale display devices from being erroneously assembled.

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  • Forests & Forestry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • General Factory Administration (AREA)

Abstract

一种覆晶薄膜冲切装置，包括：转动轴（110），设置为套设缠绕有覆晶薄膜料带（220）的料盘（210），料盘（210）设有包含覆晶薄膜型号信息的标记结构（230），且料盘（210）跟随转动轴（110）转动；冲切结构（120），设置为拉取并冲切覆晶薄膜料带（220）；识别结构（130），设置为识别标记结构（230）以识别覆晶薄膜的型号信息。还包括一种包含上述覆晶薄膜冲切装置的显示装置组装系统。

Description

覆晶薄膜冲切装置及显示装置组装系统 技术领域
本发明涉及显示领域，尤其涉及一种覆晶薄膜冲切装置及显示装置组装系统。
背景技术
这里的陈述仅提供与本申请有关的背景信息，而不必然地构成现有技术。
覆晶薄膜是将芯片封装于柔性电路板上所形成，通常，一卷覆晶薄膜料带上包含有多个覆晶薄膜，在需要使用覆晶薄膜时需将覆晶薄膜从料带上冲切下来。目前，显示装置中的显示面板一般通过覆晶薄膜与驱动电路板连接，在显示装置组装过程中，通过冲切装置冲切覆晶薄膜料带获得单片覆晶薄膜后与显示面板进行组装。为避免覆晶薄膜型号错误，在将缠绕有覆晶薄膜料带的料盘套设进冲切装置之前，会将覆晶薄膜的型号输入系统进行判断。但是，由于在系统比对后还存在人员装设料盘的动作，还可能存在覆晶薄膜型号比对成功，而工作人员在装设时拿错覆晶薄膜料盘，或者覆晶薄膜型号比对错误而工作人员并没有注意系统判断的情况，从而将错误型号的覆晶薄膜料盘装设在冲切装置内，将错误型号的覆晶薄膜与显示面板进行组装，使大批量的显示装置组装错误，导致生产成本增加，且延误生产周期。
申请内容
根据本申请的各种实施例提供一种新的覆晶薄膜冲切装置及显示装置组装系统。
一种覆晶薄膜冲切装置，包括:
转动轴，设置为套设缠绕有覆晶薄膜料带的料盘，所述料盘设有包含所述覆晶薄膜型号信息的标记结构，且所述料盘跟随所述转动轴转动；
冲切结构，设置为拉取并冲切所述覆晶料带；及
识别结构，设置为识别所述标记结构以识别所述覆晶薄膜的型号信息。
上述覆晶薄膜冲切装置，将料盘装设在其转动轴上后，冲切结构在转动轴转动的过程中拉出覆晶薄膜料带并进行冲切，得到单片覆晶薄膜片。由于料盘上设有标记结构，且标记结构包含对应覆晶薄膜的型号信息，冲切装置内还设有识别结构，在冲切过程中，识别结构可以自动识别标记结构，从而识别出被冲切的覆晶薄膜的型号信息，即冲切装置可以在覆晶薄膜冲切过程中自动获取被冲切的覆晶薄膜的型号信息。将该冲切装置与显示面板组装设备通信连接，显示面板组装设备在获取覆晶薄膜冲切装置冲切下来的覆晶薄膜进行组装的同时，还可获取冲切装置自动识别出的覆晶薄膜的型号信息并进行比对，从而判断出正在组装的覆晶薄膜型号是否正确。在本申请中，在覆晶薄膜料盘装设前进行型号对比后再将料盘装设在冲切装置内，在组装过程中再次进行自动识别与比对，由于冲切装置在冲切过程中识别覆晶薄膜型号并可以将型号信息直接传动给显示装置组装设备，其过程中不存在工作人员的操作，因此不会出现覆晶薄膜型号识别错误的情况，即使料盘装设前存在误识别的情况，由于在组装过程中还设有自动识别程序，一旦显示装置组装设备进行型号比对后发现型号错误，可以产生警报信号，停止组装，因此可以避免因覆晶薄膜型号错误而导致大批量显示装置报废。
在其中一个实施例中，所述标记结构设于所述料盘的正面，所述识别结构与所述料盘的正面相对。
在其中一个实施例中，所述标记结构全部落入所述识别结构的识别范围内。
在其中一个实施例中，所述覆晶薄膜冲切装置还包括换料门，所述换料门在关闭状态时正对于所述料盘正面，所述识别结构设于所述换料门上。
在其中一个实施例中，所述标记结构为贴于所述料盘上的标签。
在其中一个实施例中，所述标签包含条形码，所述条形码包含所述覆晶薄膜的型号信息，所述识别结构包含读码器，所述读码器设置为读取所述条形码以识别所述覆晶薄膜的型号信息。
在其中一个实施例中，所述标签包括多个条形码，所述多个条形码中的其中一个包含所述覆晶薄膜的型号信息，所述读码器具有筛选功能，所述读码器设置为从所述多个条形码中筛选出包含所述覆晶薄膜的型号信息的条形码并获取所述覆晶薄膜的型号信息。
在其中一个实施例中，所述标记结构包含多个长度不同的条形码，所述多个条形码中的其中一个包含所述覆晶薄膜的型号信息，所述读码器设置为通过比对长度筛选并读取包含覆晶薄膜型号信息的条形码，并通过读取的条形码识别所述覆晶薄膜的型号信息。
在其中一个实施例中，所述多个条形码中还包括生产日期的条形码。
在其中一个实施例中，包含所述覆晶薄膜的型号信息的条形码的长度最长。
在其中一个实施例中，包含所述覆晶薄膜的型号信息的条形码的长度为30码。
在其中一个实施例中，所述识别结构设置为定时识别所述标记结构。
在其中一个实施例中，所述识别结构设置为当所述标记单元转动至所述识别结构的识别范围内时对所述标记结构进行识别。
在其中一个实施例中，所述识别结构定时识别的时间间隔为所述料盘转动一周的时间。
在其中一个实施例中，所述冲切结构包括平铺结构、对位结构和切割结构，所述平铺结构设置为拉出并铺平所述覆晶薄膜料带，所述对位结构设置为获取所述覆晶薄膜料带的切割位置，所述切割结构设置为对所述覆晶薄膜 料带进行切割。
在其中一个实施例中，所述切割结构为激光灯，所述切割结构通过激光切割所述覆晶薄膜料带。
在其中一个实施例中，所述料盘呈圆环状。
一种覆晶薄膜冲切装置，包括：
转动轴，设置为套设缠绕有覆晶薄膜料带的料盘，所述料盘设有包含所述覆晶薄膜型号信息的标记结构，且所述料盘跟随所述转动轴转动，所述标记结构包含多个长度不同的条形码，所述多个条形码中的其中一个包含所述覆晶薄膜的型号信息；
冲切结构，设置为拉取并冲切所述覆晶薄膜料带；
读码器，设置为定时识别所述标记结构并通过比对长度筛选读取包含覆晶薄膜型号信息的条形码，以及设置为通过读取的条形码识别所述覆晶薄膜的型号信息。
上述覆晶薄膜冲切装置，在冲切过程中，冲切装置内部的读码器可以自动识别标记结构的条形码，从而识别出被冲切的覆晶薄膜的型号信息。该冲切装置可以与显示面板组装设备通信连接，显示装置在组装覆晶薄膜和显示面板的同时，还可获取冲切装置识别出的覆晶薄膜的型号信息，将识别的覆晶薄膜型号与预存的覆晶薄膜型号进行比对，从而判断出正在组装的覆晶薄膜型号是否正确，一旦显示装置组装设备进行型号比对后发现型号错误，可以产生警报信号，停止组装，因此可以避免因覆晶薄膜型号错误而导致大批量显示装置报废。同时，通过长度比对可以快速准确地从多个条码中筛选出包含覆晶薄膜型号信息的条形码，且通过定时识别标记结构，可以降低读码器的功耗。
一种显示装置组装系统，包括：
服务器，所述服务器内预存有与显示面板匹配的覆晶薄膜型号信息；
覆晶薄膜冲切装置，所述覆晶薄膜冲切装置包括：
转动轴，设置为套设缠绕有覆晶薄膜料带的料盘，所述料盘设置有 包含所述覆晶薄膜型号信息的标记结构，且所述料盘跟随所述转动轴转动；
冲切结构，设置为拉取并冲切所述覆晶料带；及
识别结构，设置为识别所述标记结构以识别所述覆晶薄膜的型号信息；
显示装置组装设备，所述显示装置组装设备包括：
组装平台，设置为组装显示面板和覆晶薄膜，所述覆晶薄膜为所述覆晶薄膜冲切装置冲切下来的覆晶薄膜；及
控制结构，与所述服务器和所述覆晶薄膜冲切装置通信连接，设置为获取所述服务器中预存的覆晶薄膜型号信息和所述冲切装置识别的覆晶薄膜型号信息并进行比对，还设置为在所述预存的覆晶薄膜型号信息和所述识别的覆晶薄膜型号信息不匹配时发生警报信号。
上述显示装置组装系统，覆晶薄膜冲切装置设置为冲切覆晶薄膜料带，为显示装置组装设备提供覆晶薄膜，同时在冲切覆晶薄膜料带的过程中自动识别覆晶薄膜的型号并传送给显示装置组装设备，显示装置组装设备一方面获取覆晶薄膜冲切装置识别的覆晶薄膜型号信息，一方面获取服务器中预存的所需覆晶薄膜的型号信息，并对两种型号信息进行比对，一旦型号错误，则发出警报信息，停止组装，避免大批量的显示装置出现误组装。
在其中一个实施例中，所述控制结构与所述识别结构通信连接。
附图说明
为了更好地描述和说明这里公开的那些申请的实施例和/或示例，可以参考一副或多副附图。用于描述附图的附加细节或示例不应当被认为是对所公开的申请、目前描述的实施例和/或示例以及目前理解的这些申请的最佳模式 中的任何一者的范围的限制。
图1为一实施例中覆晶薄膜冲切装置结构示意图；
图2为一实施例中标记结构与识别结构相对位置关系图；
图3为一实施例中显示装置组装设备结构示意图；
图4为一实施例中显示装置组装系统结构示意图。
具体实施方式
为了便于理解本发明，下面将参照相关附图对本发明进行更全面的描述。附图中给出了本发明的首选实施例。但是，本发明可以以许多不同的形式来实现，并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对本发明的公开内容更加透彻全面。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本发明。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。
在本发明的描述中，需要理解的是，术语“上”、“下”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方法或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
结合图1和图2所示，在一实施例中，覆晶薄膜冲切装置包括转动轴110、冲切装置120和识别结构130。其中，转动轴110设置为套设料盘210，料盘210上缠绕有覆晶薄膜料带220，料盘上设有标记结构230，标记结构230包含有对应料盘上缠绕的覆晶薄膜的型号信息；冲切结构120设置为拉取料盘 上的覆晶薄膜料带220并冲切覆晶薄膜料带，得到单片覆晶薄膜；识别结构130设置为识别标记结构230以识别覆晶薄膜230的型号信息，标记结构230处于识别结构130的识别范围内时，识别结构130可识别出标记结构的标记内容，从而识别出覆晶薄膜的型号信息。
在本申请中，将料盘装设在覆晶薄膜冲切装置的转动轴上后，冲切结构在转动轴转动的过程中拉出覆晶薄膜料带并进行冲切，得到单片覆晶薄膜片。在冲切过程中，冲切装置内部的识别结构可以自动识别标记结构，从而识别出被冲切的覆晶薄膜的型号信息，即冲切装置可以在覆晶薄膜冲切过程中自动获取被冲切的覆晶薄膜的型号信息。该冲切装置可与显示装置组装设备通信连接，显示装置组装设备在组装覆晶薄膜和显示面板的同时，通过获取冲切装置识别出的覆晶薄膜的型号信息，将识别的覆晶薄膜型号与预存的覆晶薄膜型号进行比对，从而判断出正在组装的覆晶薄膜型号是否正确。在本申请中，在覆晶薄膜料盘装设前进行型号对比后再将料盘装设在冲切装置内，在组装过程中再次进行自动识别与比对，由于冲切装置在冲切过程中识别覆晶薄膜型号并可以将型号信息直接传动给显示装置组装设备，其过程中不存在工作人员的操作，因此不会出现覆晶薄膜型号识别错误的情况，即使料盘装设前存在误识别的情况，由于在组装过程中还设有自动识别程序，一旦显示装置组装设备进行型号比对后发现型号错误，可以产生警报信号，停止组装，因此可以避免因覆晶薄膜型号错误而导致大批量显示装置报废。
在一实施例中，冲切结构120包含平铺结构121、对位结构和切割结构122，先通过平铺结构121拉出覆晶薄膜料带后展开铺平，通过对位结构获取切割位置后通过切割结构122进行精准切割。在一实施例中，切割结构122可为激光灯，通过激光切割覆晶薄膜料带。
在一实施例中，标记结构230位于料盘210的正面，通常，料盘呈空心圆环状，料盘包含最外侧的弧形曲面和最内侧的弧形曲面以及连接两弧形曲面的平整表面，标记结构230位于该平整表面内，定义标记结构230所处的表面为正面A，与该正面相对的一面为背面，则识别结构130位于与该正面 A相对的一侧，如此便于对标记结构230进行识别。在一实施例中，识别结构130正对标记单元230，即识别结构130的识别范围为识别结构130的正前方,标记结构230可全部落入识别结构130的识别范围D内。
在一实施例中，覆晶薄膜冲切装置还包括换料门140，冲切装置在换料门处装设料盘，在料盘装设完成后，关闭换料门140，关闭状态下的换料门140正对料盘210的正面A，换料门140正对料盘210，便于对料盘进行装设。在一实施例中，识别结构130位于换料门140上，由于换料门140与料盘正面A正对，将识别结构130设于换料门140上，使得识别结构130与料盘正面A正对，如此便于识别料盘上的标记结构230。
在一实施例中，标记结构230为粘贴在料盘210上的一标签，该标签上包含条形码，条形码中包含有对应覆晶薄膜的型号信息，识别结构130为读码器，读码器通过扫描条形码识别出覆晶薄膜的型号信息。通过条码记录覆晶薄膜型号信息并通过以扫码方式扫描条码，能够快速准确地获取该覆晶薄膜的型号信息。
在一实施例中，标记结构230为粘贴在料盘210上的一标签，该标签上包含多个条形码，其中的一个为目标条形码，目标条形码包含覆晶薄膜型号信息，目标条形码外的其他条形码可包含其他产品信息，如生产日期等，读码器还具有筛选功能，从多个条形码中筛选出目标条形码后获取覆晶薄膜型号信息。在一实施例中，读码器通过长度比对识别出目标条形码，即该标签上包含有多个长度不同的条形码，其中的一个特定长度的条形码包含有覆晶薄膜的型号信息，设置读码器识别条码长度，读码器扫描该标签并通过比对条形码的长度筛选并读取目标条形码，然后通过目标条形码识别出该覆晶薄膜的型号信息。在一实施例中，标签中的目标条形码的长度最长，由于当存在比目标条形码长度更长的条形码时，读码器可能会截取其他条形码中的部分条形码段作为目标条形码而出现误识别，在本实施例中，将标签中的目标条形码的长度设置为最长，可以防止误识别，提高识别精度，例如，将目标条型码长度为30码，读码器读取的条形码长度也设为30码，读码器在扫描 过程中只会读取长度为30码的条型码并从所读取的条形码中解析出覆晶薄膜型号信息。
在一实施例中，识别结构130设置为定时识别标记结构230。在一实施例中，当标记结构230为条形码标签，识别结构130为读码器时，读码器定时扫描标签。由于在切割过程中料盘不停转动，标签随着料盘转动，而读码器位置是固定不变的，只有当标签转动到读码器的扫描范围内才扫描到标签上的内容，因此，不需要实时扫描，只需定时扫描即可，如此可以降低读码器的功耗。在一实施例中，识别结构定时识别的时间间隔为料盘转动一周的时间，即标记结构每转动到识别结构的识别范围内时才进行识别，如此既能提高识别标记结构的次数，又能降低识别结构的功耗。
本申请还涉及到一种覆晶薄膜冲切装置，包括转动轴110、冲切结构120和读码器。其中，转动轴110设置为套设缠绕有覆晶薄膜料带220的料盘210，料盘210设有包含所述覆晶薄膜型号信息的标记结构230，且料盘210跟随转动轴110转动，标记结构230包含多个长度不同的条形码，多个条形码中的其中一个包含所述覆晶薄膜的型号信息；冲切结构120设置为拉取并冲切覆晶薄膜料带220；读码器设置为定时识别标记结构230并通过比对长度筛选读取包含覆晶薄膜型号信息的条形码，以及设置为通过读取的条形码识别覆晶薄膜的型号信息。
上述覆晶薄膜冲切装置，在冲切过程中，冲切装置内部的读码器可以自动识别标记结构的条形码，从而识别出被冲切的覆晶薄膜的型号信息。显示面板组装设备可以与该冲切装置通信连接，显示装置在组装覆晶薄膜和显示面板的同时，还可获取冲切装置识别出的覆晶薄膜的型号信息，将识别的覆晶薄膜型号与预存的覆晶薄膜型号进行比对，从而判断出正在组装的覆晶薄膜型号是否正确。由于冲切装置在冲切过程中识别覆晶薄膜型号并可以将型号信息直接传动给显示装置组装设备，其过程中不存在工作人员的操作，因此不会出现覆晶薄膜识别错误的情况，即使料盘装设前存在误识别的情况，由于在组装过程中还设有自动识别程序，一旦显示装置组装设备进行型号比 对后发现型号错误，可以产生警报信号，停止组装，因此可以避免因覆晶薄膜型号错误而导致大批量显示装置报废。同时，通过长度比对可以快速准确地从多个条码中筛选出包含覆晶薄膜型号信息的条形码，且通过定时识别标记结构，可以降低读码器的功耗。
本申请还涉及一种显示装置组装设备，如图3所示，包括组装平台和控制结构。其中，组装平台用于组装显示面板和覆晶薄膜，所述覆晶薄膜为覆晶薄膜冲切装置冲切下来的覆晶薄膜，其中，覆晶薄膜冲切装置的具体结构已在上文进行详细介绍，在此不再赘述。控制结构用于与该覆晶薄膜冲切装置通信连接以获取该覆晶薄膜冲切装置识别出的覆晶薄膜型号信息并与预存的覆晶薄膜型号信息进行比对，还用于在预存的覆晶薄膜型号信息和识别的覆晶薄膜型号信息不匹配时发生警报信号，其中，预存的覆晶薄膜型号信息为待组装显示面板所需要的覆晶薄膜的型号信息。在一实施例中，控制结构具体与冲切装置的识别结构通信连接以获取识别结构识别出的覆晶薄膜的型号信息。
上述显示装置组装设备，一方面，其组装平台用于组装显示面板和覆晶薄膜，一方面，器控制结构用于获取冲切装置识别出的正在组装的覆晶薄膜的型号信息并与预存的覆晶薄膜型号信息进行比对，通过进行比对判断出正在进行组装的覆晶薄膜的型号是否正确，一旦型号错误，则发出警报信息，停止组装，避免大批量的显示装置出现误组装。
本申请还涉及一种显示装置组装系统，如图4所示，包括服务器、覆晶薄膜冲切装置和显示装置组装设备。其中，服务器内预存有与待组装显示面板匹配的覆晶薄膜型号信息。覆晶薄膜冲切装置为上述覆晶薄膜冲切装置，其具体结构已在上文中详细结构，在此不再赘述。显示装置组装设备包括组装平台和控制结构，组装平台设置为组装显示面板和覆晶薄膜，该覆晶薄膜为上述覆晶薄膜冲切装置冲切下来的覆晶薄膜，控制结构分别与服务器和该覆晶薄膜冲切装置通信连接，设置为获取服务器中预存的覆晶薄膜型号信息和冲切装置识别的覆晶薄膜信息并进行比对，还设置为在预存的覆晶薄膜型 号信息和识别的覆晶薄膜型号信息不匹配时发生警报信号。在一实施例中，控制结构具体与冲切装置的识别结构通信连接以获取识别结构识别出的覆晶薄膜的型号信息。
上述显示装置组装系统，覆晶薄膜冲切装置设置为冲切覆晶薄膜料带，为显示装置组装设备提供覆晶薄膜，同时在冲切覆晶薄膜料带的过程中自动识别覆晶薄膜的型号并为传送给显示装置组装设备，显示装置组装设备一方面获取覆晶薄膜冲切装置识别的覆晶薄膜型号信息，一方面获取服务器中预存的所需覆晶薄膜的型号信息，并对两种型号信息进行比对，一旦型号错误，则发出警报信息，停止组装，避免大批量的显示装置出现误组装。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本申请的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对申请专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干变形和改进，这些都属于本申请的保护范围。因此，本申请专利的保护范围应以所附权利要求为准。

Claims (20)

  1. 一种覆晶薄膜冲切装置，包括：
    转动轴，设置为套设缠绕有覆晶薄膜料带的料盘，所述料盘设置有包含所述覆晶薄膜型号信息的标记结构，且所述料盘跟随所述转动轴转动；
    冲切结构，设置为拉取并冲切所述覆晶料带；及
    识别结构，设置为识别所述标记结构以识别所述覆晶薄膜的型号信息。
  2. 如权利要求1所述的覆晶薄膜冲切装置，其中，所述标记结构设于所述料盘的正面，所述识别结构与所述料盘的正面相对。
  3. 如权利要求2所述的覆晶薄膜冲切装置，其中，所述标记结构全部落入所述识别结构的识别范围内。
  4. 如权利要求2所述的覆晶薄膜冲切装置，其中，所述覆晶薄膜冲切装置还包括换料门，所述换料门在关闭状态时正对于所述料盘正面，所述识别结构设于所述换料门上。
  5. 如权利要求1所述的覆晶薄膜冲切装置，其中，所述标记结构为贴于所述料盘上的标签。
  6. 如权利要求5所述的覆晶薄膜冲切装置，其中，所述标签包含条形码，所述条形码包含所述覆晶薄膜的型号信息，所述识别结构包含读码器，所述读码器设置为读取所述条形码以识别所述覆晶薄膜的型号信息。
  7. 如权利要求6所述的覆晶薄膜冲切装置，其中，所述标签包括多个条形码，所述多个条形码中的其中一个包含所述覆晶薄膜的型号信息，所述读码器具有筛选功能，所述读码器设置为从所述多个条形码中筛选出包含所述覆晶薄膜的型号信息的条形码并获取所述覆晶薄膜的型号信息。
  8. 如权利要求7所述的覆晶薄膜冲切装置，其中，所述标记结构包含多个长度不同的条形码，所述多个条形码中的其中一个包含所述覆晶薄膜的型号信息，所述读码器设置为通过比对长度筛选并读取包含覆晶薄膜型号信息的条形码，以及通过读取的条形码识别所述覆晶薄膜的型号信息。
  9. 如权利要求7所述的覆晶薄膜冲切装置，其中，所述多个条形码中还包括生产日期的条形码。
  10. 如权利要求8所述的覆晶薄膜冲切装置，其中，包含所述覆晶薄膜的型号信息的条形码的长度最长。
  11. 如权利要求10所述的覆晶薄膜冲切装置，其中，包含所述覆晶薄膜的型号信息的条形码的长度为30码。
  12. 如权利要求1所述的覆晶薄膜冲切装置，其中，所述识别结构设置为定时识别所述标记结构。
  13. 如权利要求12所述的覆晶薄膜冲切装置，其中，所述识别结构设置为当所述标记单元转动至所述识别结构的识别范围内时对所述标记结构进行识别。
  14. 如权利要求12所述的覆晶薄膜冲切装置，其中，所述识别结构定时识别的时间间隔为所述料盘转动一周的时间。
  15. 如权利要求1所述的覆晶薄膜冲切装置，其中，所述冲切结构包括平铺结构、对位结构和切割结构，所述平铺结构设置为拉出并铺平所述覆晶薄膜料带，所述对位结构设置为获取所述覆晶薄膜料带的切割位置，所述切割结构设置为对所述覆晶薄膜料带进行切割。
  16. 如权利要求15所述的覆晶薄膜冲切装置，其中，所述切割结构为激光灯，所述切割结构通过激光切割所述覆晶薄膜料带。
  17. 如权利要求1所述的覆晶薄膜冲切装置，其中，所述料盘呈圆环状。
  18. 一种覆晶薄膜冲切装置，其中，包括：
    转动轴，设置为套设缠绕有覆晶薄膜料带的料盘，所述料盘设置有包含所述覆晶薄膜型号信息的标记结构，且所述料盘跟随所述转动轴转动，所述标记结构包含多个长度不同的条形码，所述多个条形码中的其中一个包含所述覆晶薄膜的型号信息；
    冲切结构，设置为拉取并冲切所述覆晶薄膜料带；
    读码器，设置为定时识别所述标记结构并通过比对长度筛选读取包含覆 晶薄膜型号信息的条形码，以及设置为通过读取的条形码识别所述覆晶薄膜的型号信息。
  19. 一种显示装置组装系统，包括：
    服务器，所述服务器内预存有与显示面板匹配的覆晶薄膜型号信息；
    覆晶薄膜冲切装置，所述覆晶薄膜冲切装置包括：
    转动轴，设置为套设缠绕有覆晶薄膜料带的料盘，所述料盘设置有包含所述覆晶薄膜型号信息的标记结构，且所述料盘跟随所述转动轴转动；
    冲切结构，设置为拉取并冲切所述覆晶料带；及
    识别结构，设置为识别所述标记结构以识别所述覆晶薄膜的型号信息；
    显示装置组装设备，所述显示装置组装设备包括：
    组装平台，设置为组装显示面板和覆晶薄膜，所述覆晶薄膜为所述覆晶薄膜冲切装置冲切下来的覆晶薄膜；及
    控制结构，与所述服务器和所述覆晶薄膜冲切装置通信连接，设置为获取所述服务器中预存的覆晶薄膜型号信息和所述冲切装置识别的覆晶薄膜型号信息并进行比对，还设置为在所述预存的覆晶薄膜型号信息和所述识别的覆晶薄膜型号信息不匹配时发生警报信号。
  20. 如权利要求19的显示装置组装系统，其中，所述控制结构与所述识别结构通信连接。
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US20210129367A1 (en) 2021-05-06

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