WO2020088160A1 - Wavelength conversion device and light source system - Google Patents

Abstract

A wavelength conversion device (100, 200, 300) and a light source system (400). The wavelength conversion device (100, 200, 300) comprises: a substrate (110, 210, 310); a reflective layer (120) disposed on the substrate (110, 210, 310); a heat conduction layer (130) stacked at a side of the reflective layer (120) away from the substrate (110, 210, 310); a wavelength conversion layer (140, 240, 340) stacked at a side of the heat conduction layer (130) away from the reflective layer (120), and used to receive an excitation light and emit an excited light; and an adhesive layer (150, 350) disposed around peripheral walls of the reflective layer (120) and the heat conduction layer (130), located below the wavelength conversion layer (140, 240, 340), and used to bond the wavelength conversion layer (140, 240, 340) and the substrate (110, 210, 310) together. The invention improves the performance of the wavelength conversion device (100, 200, 300) and extends the service life thereof.

Description

Wavelength conversion device and light source system Technical field

The invention relates to the technical field of optics, in particular to a wavelength conversion device and a light source system.

Background technique

In recent years, the technology of laser light source application in the field of display has become more and more mature. The laser light source excites the fluorescent material to generate monochromatic light. The selection and processing technology of fluorescent materials, the selection and technology of reflective coatings have a crucial impact on the light output efficiency of the light source. At present, the commonly used reflective layer processes in the industry are generally divided into two types: one, using inorganic non-metallic materials to combine the reflective layer and the light-emitting layer through a specific molding process; second, using an organic adhesive to directly connect the light-emitting layer and the reflective layer Bonding. Both of the above two methods have certain limitations: Although the former uses inorganic materials, the thermal conductivity of the product itself will be relatively low due to the limitations of the molding process and the thermal conductivity of the inorganic binder. The inorganic binder occupies a considerable volume ratio in the entire material system, and the thermal conductivity of the inorganic binder directly limits the heat dissipation performance of the product. The latter uses organic adhesives. Although the process is simple and easy to operate, the binders of the reflective layer and the light-emitting layer are organic substances. Long-term strong light radiation and thermal shock will accelerate the aging of organic substances. The poor reason limits the application of this process to high-power products. At the same time, most of the adhesives currently on the market are epoxy resins. During the long-term use of equipment, as the epoxy resin ages, the adhesive will form a porous structure, and impurities and moisture in the air will slowly penetrate into the reflective layer The light-emitting layer affects the luminous efficiency of the fluorescent material and the reflectivity of the reflective material.

Summary of the invention

In view of the foregoing, it is necessary to provide a wavelength conversion device that can solve or avoid the problems of the above two processes at the same time.

The invention provides a wavelength conversion device, comprising: a substrate; a reflective layer, which is arranged on the substrate; a heat conduction layer, which is stacked on the side of the reflective layer facing away from the substrate; The side of the thermally conductive layer facing away from the reflective layer is used to receive excitation light and emit laser light; The wavelength conversion layer and the base are bonded.

The present invention also provides a light source system including the wavelength conversion device described above.

According to the wavelength conversion device and the light source system provided by the present invention, the reflection layer is jointly covered by the wavelength conversion layer and the adhesive layer to isolate the contact between the reflection layer and the outside air, thereby protecting the reflection layer To prevent the reflective layer from being oxidized or sulfurized. Furthermore, filling the thermally conductive layer between the wavelength conversion layer and the reflective layer reduces the air content between the wavelength conversion layer and the reflective layer, and the thermally conductive layer can The heat generated by the wavelength conversion layer is quickly transferred to the substrate, which improves the heat dissipation efficiency. In addition, the adhesive layer is bonded to the inner edge area and the outer edge area of the wavelength conversion layer, avoiding the area on the wavelength conversion layer that is irradiated by the excitation light, reducing the lighting and failure of the wavelength conversion device The effect of thermal shock between lighting on the organic binder reduces the risk of aging of the organic binder due to direct light radiation. Therefore, the performance of the wavelength conversion device is improved and the service life of the wavelength conversion device is extended.

BRIEF DESCRIPTION

FIG. 1 is a partial perspective view of a wavelength conversion device according to a first embodiment of the present invention.

2 is a cross-sectional view of the wavelength conversion device shown in FIG. 1 along II-II.

3 is a cross-sectional view of a wavelength conversion device according to a second embodiment of the invention.

4 is a cross-sectional view of a wavelength conversion device according to a third embodiment of the invention.

5 is a schematic diagram of a light source system provided by an embodiment of the present invention.

Symbol description of main components

Wavelength conversion device	100, 200, 300
Matrix	110, 210, 310
Reflective layer	120
Thermal layer	130
Wavelength conversion layer	140, 240, 340
Bonding layer	150, 350
Mounting holes	112
First containment tank	114, 314
Reserved space	121
Drive	170, 270
Cooling fins	280
Cover	390
Second containment tank	319
Step surface	318
Light source system	400

The following specific embodiments will further illustrate the present invention with reference to the above drawings.

detailed description

In the following description, many specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways than those described here, and those skilled in the art can do it without violating the connotation of the present invention Similar applications, so the present invention is not limited by the specific embodiments disclosed below.

Please refer to FIGS. 1 and 2. FIG. 1 is a partial perspective view of the wavelength conversion device 100 according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view of the wavelength conversion device 100 shown in FIG. 1 along II-II. The wavelength conversion device 100 includes a base 110, a reflective layer 120, a thermally conductive layer 130, a wavelength conversion layer 140, and an adhesive layer 150. The base 110 is a heat dissipation base, and the reflective layer 120 is disposed on the base 110. The heat conductive layer 130 is stacked on a side of the reflective layer 120 facing away from the base 110. The wavelength conversion layer 140 is stacked on a side of the heat conductive layer 130 facing away from the reflective layer 120, and is used to receive excitation light and emit laser light. The adhesive layer 150 is disposed around the inner and outer peripheral walls of the reflective layer 120 and the heat conductive layer 130, and is located below the wavelength conversion layer 140 for bonding the wavelength conversion layer 140 and the base 110 . Wherein, the inner peripheral walls of the reflective layer 120 and the heat conductive layer 130 are relatively close to the central position of the base 110, and the outer peripheral walls of the two are relatively close to the edge position of the base 110.

The base 110 provides support and transmission for the entire wavelength conversion device 100, and at the same time provides a dynamic balance adjustment position and is used for heat dissipation. The base 110 is substantially circular and includes an upper surface and a lower surface that are oppositely arranged. A mounting hole 112 is provided in the middle of the base 110. A first receiving groove 114 is formed in the upper surface of the base 110 toward the lower surface. The first accommodating groove 114 extends along the circumferential direction of the base 110 and is substantially circular.

The reflective layer 120 is substantially circular, and is received in the first receiving groove 114. The bottom surface of the reflective layer 120 is in contact with the bottom wall of the first receiving groove 114, and the two side surfaces of the reflective layer 120 are respectively separated from the corresponding side walls of the first receiving groove 114 by a predetermined distance. Each side of the reflective layer 120 is surrounded by a side wall corresponding to the first receiving groove 114 and a bottom wall of the first receiving groove 114 to form a reserved space 121. Specifically, a side surface of the reflective layer 120 near the middle of the base 110 corresponds to the side wall corresponding to the first receiving groove 114 and the bottom wall of the first receiving groove 114 forms a reserved space 121, The opposite side of the reflective layer 120 near the edge of the base 110, the side wall corresponding to the first receiving groove 114, and the bottom wall of the first receiving groove 114 are enclosed to form another reserved space 121. The reflective layer 120 is made of a highly reflective material, such as a metallic material or an inorganic non-metallic material. Preferably, the reflective layer 120 is made of a metal material, such as mirror silver, aluminum, or the like.

The thermal conductive layer 130 is stacked on the top surface of the reflective layer 120 and is received in the first receiving groove 114. The size of the heat conductive layer 130 is substantially the same as the size of the reflective layer 120. The thermally conductive layer 130 is formed by filling a high thermal conductivity transparent powder material, such as flake boron nitride, aluminum oxide, aluminum nitride, or silicon nitride. In this embodiment, the thermal conductivity of the thermal conductive layer 130 is lower than the thermal conductivity of the base 110.

The wavelength conversion layer 140 is stacked on a side of the heat conductive layer 130 facing away from the reflective layer 120, and is received in the first receiving groove 114, and covers the reserved space 121. The wavelength conversion layer 140 is substantially ring-shaped, and the lateral width of the wavelength conversion layer 140 is greater than the lateral widths of the reflective layer 120 and the thermally conductive layer 130. The wavelength conversion layer 140 is made of a wavelength conversion material with high luminous efficiency and high thermal conductivity, such as pure phase fluorescent ceramics or complex phase fluorescent ceramics. The thermal conductivity of the fluorescent ceramic is 12-24w / m · s. The wavelength conversion layer 140 is used to receive excitation light and generate laser light of at least one color in the form of Lambertian under the excitation of the excitation light. For example, the wavelength conversion layer 140 receives blue excitation light and generates red, green, yellow, and other colors of received laser light. The laser light emitted from the wavelength conversion layer 140 passes through the thermally conductive layer 130, then enters the reflective layer 120, is reflected by the reflective layer 120, and then exits through the thermally conductive layer 130 and the wavelength conversion layer 140 in sequence. The heat generated by the excitation light irradiation area on the wavelength conversion layer 140 can be quickly conducted to the base 110 via the heat conductive layer 130.

Preferably, the thermal expansion coefficient of the base 110 is 2.81 × 10 ^-6 -23 × 10 ^-6 / ° C, and the thermal expansion coefficient of the wavelength conversion layer 140 is 2.21 × 10 ^-6 7.6 × 10 ^-6 / ° C. Considering that the thermal expansion coefficient of the base body 110 is relatively greater than the thermal expansion coefficient of the wavelength conversion layer 140, there is a gap between the side wall of the wavelength conversion layer 140 and the side wall of the first receiving groove 114. In this embodiment, the gap is 0.05-0.25 mm. During the normal production process, the organic adhesive in the adhesive layer 150 may overflow into the gap.

The adhesive layer 150 is accommodated in the reserved space 121 and bonds the wavelength conversion layer 140 and the base 110. Further, the bonding layer 150 bonds the wavelength conversion layer 140, the reflective layer 120, the thermally conductive layer 130, and the base 110, and the bonding layer 150 is disposed on an inner edge region of the wavelength conversion layer 140 and It is close to the outer edge area and covers the edges of the reflective layer 120 and the heat conductive layer 130. The edge region of the wavelength conversion layer 140 refers to the space formed by the side of the wavelength conversion layer 140 facing the heat conductive layer 130 and the base 110, and the space is located on the peripheral walls of the reflective layer 120 and the heat conductive layer 130. The space is an inner edge region when it is close to the axis of the wavelength conversion device 100, and the outer edge region is when the space is far from the axis of the wavelength conversion device 100. In this embodiment, the inside of the wavelength conversion layer 140 and other components refers to a position near the middle of the base 110, and the outside of the wavelength conversion layer 140 and other components refers to a position near the edge of the base 110. The adhesive layer 150 is made of organic adhesive. Since the adhesive layer 150 is disposed at the inner and outer edges of the wavelength conversion layer 140, the area on the wavelength conversion layer 140 irradiated with the excitation light is avoided, and the light of the wavelength conversion device 100 can be reduced The impact of thermal shock between the and unlit on the organic binder, and reduce the risk of organic binder aging due to direct light radiation. At the same time, the organic binder can well eliminate the stress problem caused by the large-area bonding of the wavelength conversion layer 140 and the reflective layer 120 of different materials in a solid state.

Preferably, the wavelength conversion device 100 further includes a driving member 170. The driving member 170 is connected to the base 110 to drive the base 110 to rotate. Specifically, the driving member 170 is partially received in the mounting hole 112 for driving the base 110 to rotate around its central axis. In this embodiment, the driving member 170 is a motor.

In the wavelength conversion device 100 provided in Embodiment 1 of the present invention, the reflection layer 120 is covered by the wavelength conversion layer 140 and the adhesive layer 150 together to isolate the contact between the reflection layer 120 and the outside air, thereby Protect the reflective layer 120 to prevent the reflective layer 120 from being oxidized or sulfurized. Furthermore, filling the thermally conductive layer 130 between the wavelength conversion layer 140 and the reflective layer 120 reduces the air content between the wavelength conversion layer 140 and the reflective layer 120, and the thermal conductivity The layer 130 can quickly transfer the heat generated by the wavelength conversion layer 140 to the substrate 110, which improves the heat dissipation efficiency. In addition, the adhesive layer 150 is respectively adhered to the inner edge area and the outer edge area of the wavelength conversion layer 140, avoiding the area on the wavelength conversion layer 140 irradiated by the excitation light, reducing the wavelength conversion device The impact of the thermal shock between 100 lit and unlit on the organic binder reduces the risk of aging of the organic binder due to direct light radiation.

Please refer to FIG. 3, which is a schematic cross-sectional view of a wavelength conversion device 200 according to a second embodiment of the present invention. The structure of the wavelength conversion device 200 is basically the same as the wavelength conversion device 100 of the first embodiment, that is to say, the above description of the wavelength conversion device 100 can basically be applied to the wavelength conversion device 200, both The main difference is that the wavelength conversion device 200 further includes heat dissipation fins 280.

Specifically, the heat dissipation fin 280 is provided on the second surface of the base 210. When the base body 210 rotates, a strong convection occurs between the heat dissipation fins 280 and the air, thereby quickly dissipating the heat on the base body 210 and improving the heat dissipation efficiency; at the same time, the surface of the driving member 270 can be reduced And the heat radiation of the wavelength conversion layer 240 prevents thermal quenching of the wavelength conversion material on the wavelength conversion layer 240 and reduces the light extraction efficiency.

Preferably, the heat dissipation fins 280 are formed by removing part of the base body 210, for example, by cutting, etc., to reduce the weight of the base body 210, save the utilization rate of the rated load of the driving member 270, and improve the driving member 270 Use reliability.

Please also refer to FIG. 4, which is a schematic cross-sectional view of a wavelength conversion device 300 according to a third embodiment of the present invention. The structure of the wavelength conversion device 300 is basically the same as the wavelength conversion device 200 of the second embodiment, that is to say, the above description of the wavelength conversion device 200 can basically be applied to the wavelength conversion device 300, both The main difference is that the wavelength conversion device 300 further includes a cover 390.

Specifically, the cover plate 390 is disposed on the base body 310 and is located above the wavelength conversion layer 340 for sealing and fixing the wavelength conversion layer 340. Preferably, the upper surface of the base 310 is recessed toward the lower surface to form a second receiving groove 319, and the second receiving groove 319 extends along the circumferential direction of the base 310. The first receiving groove 314 is formed by recessing a part of the bottom wall of the second receiving groove 319 toward the lower surface of the base 310. The lateral width of the second accommodating groove 319 is greater than the lateral width of the first accommodating groove 314, so that a stepped surface 318 is formed where the second accommodating groove 319 and the first accommodating groove 314 are connected. In this embodiment, the stepped surface 318 is flat and close to the edge of the base 310. In another embodiment, the stepped surface 318 is located near the middle of the base 310. In yet another embodiment, the number of the stepped surfaces 318 is two, one of which is near the edge of the base 310 and the other is near the middle of the base 310. The cover plate 390 is fixedly received in the second receiving groove 319 and covers the wavelength conversion layer 340 located in the first receiving groove 314 to prevent the wavelength conversion layer 340 from The strong centrifugal force comes off from the adhesive layer 350, and further fixes the wavelength conversion layer 340 on the base 310. In another embodiment, the cover plate 390 covers the wavelength conversion layer 340 and the central position of the base 310 surrounded by the wavelength conversion layer 340.

Preferably, the cover plate 390 is made of a high temperature resistant material with a specific refractive index, which can change the angle of the outgoing light of the wavelength conversion layer 340 so that the outgoing light is more conducive to collection.

Please refer to FIG. 5, which is a schematic diagram of a light source system. The light source system 400 uses the wavelength conversion device 100, 200, or 300 described in the above embodiment to perform illumination light conversion. The light source system 400 can be applied to a projection. In the system.

The above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Various modifications to these embodiments will be obvious to those skilled in the art. The general principles defined in this document can be made without departing from the present invention. In the case of the spirit or scope, it is realized in other embodiments. Therefore, the present invention will not be limited to the embodiments shown in this document, but should conform to the widest scope consistent with the principles and novel features disclosed in this document.

Claims (11)

1. A wavelength conversion device, characterized in that it includes:

   Substrate

   The reflective layer is provided on the substrate;

   A thermally conductive layer stacked on the side of the reflective layer facing away from the substrate;

   A wavelength conversion layer, stacked on the side of the thermally conductive layer facing away from the reflective layer, for receiving excitation light and emitting laser light; and

   An adhesive layer is disposed around the peripheral wall of the reflective layer and the thermally conductive layer, and is located below the wavelength conversion layer, and is used to bond the wavelength conversion layer and the substrate.
2. The wavelength conversion device according to claim 1, wherein the base body is provided with a first receiving groove, and the reflective layer, the thermally conductive layer, and the wavelength conversion layer are sequentially disposed in the first receiving groove in.
3. The wavelength conversion device according to claim 2, wherein there is a gap between the wavelength conversion layer and the side wall of the first receiving groove.
4. The wavelength conversion device according to claim 2, wherein the wavelength conversion device further comprises a cover plate, the cover plate is disposed on the base body and covers the first receiving groove.
5. The wavelength conversion device according to claim 4, wherein a second receiving groove is formed on the base, the first receiving groove is formed by recessing a part of the bottom wall of the second receiving groove, and the cover The board is accommodated in the second accommodation groove.
6. The wavelength conversion device according to claim 1, wherein the base body is provided with heat dissipation fins.
7. The wavelength conversion device according to claim 6, wherein the heat dissipation fin is formed by removing a part of the base body.
8. The wavelength conversion device according to claim 1, wherein the wavelength conversion device further includes a driving member connected to the base body for driving the base body to rotate.
9. The wavelength conversion device according to any one of claims 1 to 8, wherein the wavelength conversion layer is made of pure phase fluorescent ceramics or complex phase fluorescent ceramics, the reflective layer is made of metal, and the bonding The layer is made of organic binder.
10. The wavelength conversion device according to any one of claims 1 to 8, wherein the thermally conductive layer is made of boron nitride, aluminum oxide, aluminum nitride, or silicon nitride.
11. A light source system, characterized by comprising the wavelength conversion device according to any one of claims 1-10.

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